Contour extraction method of SEM image and related product

By extracting coarse and fine contours from multiple images in SEM images and performing two alignments based on the design layout, the problem of insufficient contour extraction accuracy in existing technologies is solved, achieving high-precision contour extraction, meeting the sub-nanometer requirements of OPC models, and supporting accurate modeling of OPC simulation models.

CN122368097APending Publication Date: 2026-07-10ORIENTAL CRYSTAL MICROELECTRONICS TECH (SHANGHAI) CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
ORIENTAL CRYSTAL MICROELECTRONICS TECH (SHANGHAI) CO LTD
Filing Date
2026-04-20
Publication Date
2026-07-10

AI Technical Summary

Technical Problem

In existing technologies, contour extraction methods for SEM images lack the ability to process complex noise and edge features in images, making it difficult to extract high-precision contours that meet the modeling requirements of OPC models. Especially in semiconductor manufacturing processes below 10nm, the subtle features of lithographic patterns have a significant impact on the electrical performance of chips, and existing methods cannot accurately capture nanoscale edge fluctuations and corner rounding effects.

Method used

By acquiring multiple SEM images, coarse and fine contours are extracted separately, and alignment is performed twice based on the design layout. Adaptive binarization and distributed computing are combined to improve the consistency and accuracy of contour extraction. Adaptive threshold binarization algorithms and edge detection algorithms such as Canny and Sobel are used to reduce the impact of electron beam noise and edge blurring.

Benefits of technology

It achieves high-precision extraction of nanometer-level edge fluctuations and corner rounding effects, meeting the OPC model's requirement for sub-nanometer precision, improving the accuracy and consistency of contour extraction, and supporting accurate modeling of OPC simulation models.

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Abstract

This invention provides a method for contour extraction from SEM images and related products. The contour extraction method includes acquiring a design layout of a target graphic and multiple SEM images of a wafer manufactured based on the design layout; extracting coarse contours from the measured images in each SEM image; coarsely aligning each SEM image to the design layout based on the extracted coarse contours; extracting fine contours from the measured images in each SEM image based on the design layout; finely aligning each SEM image to the design layout based on the extracted fine contours; and generating the target SEM contour of the target graphic based on the multiple finely aligned contours. This method can extract high-precision contours of target graphics from SEM images, meeting the accuracy requirements of OPC models.
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