A power assembly and power system

Abstract

The present application relates to the technical field of power electronics, and discloses a power assembly, comprising: a power module connected with a first terminal; a capacitor connected with a second terminal; a support frame, the power module and the capacitor are assembled on the support frame respectively; the first terminal comprises a first part and a second part connected by bending, the first part is connected to the power module, and the second part penetrates to the inside of the support frame; the second terminal is at least partially located in the inside of the support frame and forms an overlapping area with the second part; in the overlapping area, the second part is attached to the second terminal. The purpose of the present application is to improve the electrical performance of the power assembly.

Description

Technical Field

[0001] This invention relates to the field of power electronics technology, specifically to a power component and power system. Background Technology

[0002] In existing power component designs, power modules and capacitors are the two core components constituting a high-voltage topology. To meet their respective differentiated needs in manufacturing processes, performance testing, and cooling management, they typically follow independent technical specifications and structural systems at the design level. As power electronic systems continue to evolve towards higher power density and miniaturization, increasingly stringent requirements are being placed on the overall electrical performance and space utilization efficiency of power components.

[0003] However, this split structure makes it difficult to effectively compress the physical path of the high-voltage topology circuit. The stray inductance and contact resistance in the circuit remain high and difficult to reduce. Under the high-frequency switching conditions of the system, it is very easy to induce significant voltage spikes and additional heat loss, which will adversely affect the switching performance and operational reliability of the system. It is difficult to adapt to the current development needs of power components to continuously evolve towards high power density and extreme compactness. Summary of the Invention

[0004] The purpose of this invention is to address the problem of how to improve the electrical performance of power components, and to propose a power component and power system.

[0005] In a first aspect, embodiments of the present invention provide a power component, including: A power module, which is connected to a first terminal; A capacitor, which has a second terminal connected to it; A support frame, on which the power module and the capacitor are respectively assembled; The first terminal includes a first part and a second part that are bent and connected together. The first part is connected to the power module, and the second part extends through the interior of the support frame. The second terminal is at least partially located inside the support frame and forms an overlapping area with the second portion; Within the overlapping area, the second portion is attached to the second terminal.

[0006] In one embodiment, the undeformed regions of the first and second portions have the same initial thickness; The second part has a partially flattened structure in the overlapping area, the thickness of the partially flattened structure being less than the initial thickness; The initial thickness is greater than the thickness of the second terminal.

[0007] In one embodiment, the thickness of the second terminal, the thickness of the partially flattened structure, and the initial thickness satisfy a preset thickness matching formula, wherein the thickness matching formula is: in, The initial thickness is... The thickness of the second terminal. The thickness of the locally flattened structure is... Let be the heat capacity matching coefficient, and The value ranges from 0.15 to 0.35, and the thickness of the partially flattened structure is between 0.5 mm and 0.8 mm.

[0008] In one embodiment, the partially flattened structure is a plastic deformation zone formed by the lateral extension of the second part under compression, and the width of the partially flattened structure is greater than the width of the first part.

[0009] In one embodiment, within the overlapping area, the partially flattened structure is stacked on the surface of the second terminal, and a gapless fusion layer is formed between the partially flattened structure and the second terminal by laser welding.

[0010] In one embodiment, an operation window is provided on the side wall of the support frame, and the operation window is connected to the overlapping area inside the support frame to expose the connection surface between the second part and the second terminal.

[0011] In one embodiment, the operating window is filled with an insulating medium, which covers the fixed connection between the second part and the second terminal. The operating window forms a potting groove structure, and the insulating medium forms an insulating seal in the overlapping area after curing.

[0012] In one embodiment, the support frame is an integrally molded part made of insulating material, and the support frame is provided with a first mounting slot for accommodating the power module and a second mounting slot for accommodating the capacitor.

[0013] In one embodiment, a heat dissipation substrate is also included. The power module is attached to the side away from the support frame with the heat dissipation substrate. The heat dissipation substrate is provided with a heat dissipation structure. The first terminal includes a positive terminal and a negative terminal. The positive terminal and the negative terminal are arranged symmetrically from left to right along the vertical center plane of the support frame. The second part of the positive terminal and the second part of the negative terminal are bent in opposite directions and penetrate into the interior of the support frame. The positive terminal and the negative terminal are arranged symmetrically from top to bottom along the horizontal center plane of the support frame.

[0014] In a second aspect, embodiments of the present invention provide a power system including a drive motor and the power component described in the first aspect above, wherein the power component is electrically connected to the drive motor and is used to drive the drive motor to operate.

[0015] Compared with the prior art, the technical solution of this application has the following beneficial technical effects: This invention improves the overall space utilization efficiency of the power module by assembling the power module and capacitor together on the same support frame, meeting the demand for compact power modules. In terms of electrical connection, after the first terminal is bent and extended, its second part penetrates into the interior of the support frame, and is fitted and connected with the second terminal, which also extends into the frame, in the overlapping area. This terminal fitting method completed inside the frame effectively shortens the current conduction path between the two, and the stray inductance of the system can be significantly reduced, with the typical value controlled within the order of 10nH. The corresponding switching loss is reduced by 15% to 30%, the EMC noise source is significantly attenuated, and the EMC performance is greatly improved. At the same time, eliminating the intermediate transition contact resistance further reduces heat loss, thereby comprehensively suppressing voltage spikes and additional heat loss during high-frequency switching of the system, which has a positive effect on improving the switching performance and operational reliability of the power module. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the cross-sectional structure of the present invention; Figure 2 For the present invention Figure 1 Enlarged view of point A in the middle; Figure 3 This is a schematic diagram of the overall connection structure of the present invention; Figure 4 This is a schematic diagram of the connection structure between the support frame and the heat dissipation substrate of the present invention; Figure 5 This is a schematic diagram of the connection structure of the first positive and negative terminals of the present invention; Figure 6 This is a schematic diagram of the left-right symmetrical connection structure of the first terminal of the present invention; Figure 7 This is a schematic diagram of the symmetrical connection structure of the first terminal of the present invention.

[0017] In the diagram: 1. Power module; 11. First terminal; 12. Heat sink substrate; 2. Capacitor; 21. Second terminal; 3. Support frame; 31. Operation window. Detailed Implementation

[0018] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0019] According to the first aspect of this application, Figures 1 to 7 As shown, this application provides a power component, including: a power module 1, a capacitor 2, and a support frame 3. The power module 1, as the core power conversion unit of the power component, undertakes the core functions of power conversion and switching control, and typically encapsulates a power semiconductor chip and corresponding drive and protection circuits. The capacitor 2, as the energy storage and filtering unit of the power component, is used to support and filter the DC bus voltage to suppress voltage fluctuations caused by high-frequency switching operations.

[0020] The power module 1 is connected to a first terminal 11, which serves as the DC-side electrical lead-out structure of the power module 1, used to achieve electrical connection between the power module 1 and an external high-voltage topology circuit. Specifically, the first terminal 11 can be in the form of a copper terminal block or a copper alloy conductive terminal, preferably made of oxygen-free copper or a copper alloy with high conductivity to ensure low impedance and good thermal conductivity under high current conduction conditions. In some alternative embodiments, the first terminal 11 can also be made of surface-treated conductive materials such as tin-plated copper or silver-plated copper to further improve its surface contact conductivity and oxidation resistance.

[0021] Capacitor 2 is connected to a second terminal 21, which serves as an electrical lead-out structure for connecting the positive or negative terminal of capacitor 2 to a high-voltage topology circuit. In actual construction, the second terminal 21 is typically pre-formed on the capacitor body by the capacitor manufacturer. Its material is generally copper sheet or copper alloy sheet, and its thickness is usually thinner than that of the power module terminals to accommodate the capacitor's packaging structure and lead-out process. It should be noted that both the first terminal 11 and the second terminal 21 may each contain a positive and a negative terminal. That is, the positive terminals of the power module 1 and capacitor 2 are electrically connected to each other, and the negative terminals are electrically connected to each other, through corresponding terminal pairs, to form a complete DC bus positive and negative circuit.

[0022] The support frame 3 serves as the structural support for the power components, and the power module 1 and capacitor 2 are respectively assembled on the support frame 3. The support frame 3 provides the power module 1 and capacitor 2 with a stable mechanical support and precise spatial positioning, allowing them to be stably held in a preset relative position. During assembly, the power module 1 and capacitor 2 can be assembled to the corresponding areas on the support frame 3 by means of snap-fit, interference fit, integrated assembly, or fastener locking. The specific assembly method is not strictly limited here; any mechanical connection method that can achieve stable positioning of the two on the support frame 3 is acceptable.

[0023] The first terminal 11 includes a first part and a second part that are bent and connected together. The first part is connected to the power module 1, and the second part extends through the interior of the support frame 3. The first terminal 11 is not a simple straight terminal structure, but a spatially bent configuration with at least one bend. The first part extends from the body of the power module 1, serving as a direct connection between the first terminal 11 and the power module 1. The second part is integrally connected to the first part via the bend and extends towards the interior of the support frame 3, penetrating the interior of the support frame 3. Here, "penetrating" means that the second part passes through the wall of the support frame 3 and reaches the internal cavity space defined by the support frame 3. In this embodiment, the bent and connected first part and the second part are arranged at right angles.

[0024] Based on this, the second terminal 21 is at least partially located inside the support frame 3, forming an overlapping area with the second part. The second terminal 21 of the capacitor 2 is located in the internal space of the support frame 3, so that the second terminal 21 of the capacitor 2 and the second part penetrating into the internal space intersect in space, forming an overlapping area where their end faces cover each other. This overlapping area is the area where the first terminal 11 and the second terminal 21 are electrically connected inside the support frame 3.

[0025] Within the overlapping area, the second part is bonded to the second terminal 21. "Bonded" means that the surface of the second part and the surface of the second terminal 21 are in close contact and abut against each other within this area, forming a direct physical contact relationship. This bonding connection method allows the current conduction path between the power module 1 and the capacitor 2 to be completed in the internal space of the support frame 3 with the shortest distance and smallest cross-section transition, fundamentally shortening the physical path length of the high-voltage topology circuit, effectively reducing stray inductance and contact resistance, significantly suppressing voltage spikes and additional heat loss under high-frequency switching conditions. Simultaneously, the entire connection structure is highly compactly integrated within the internal space of the support frame 3, significantly improving the overall power density and space utilization efficiency of the power components.

[0026] In other embodiments, the bending angle between the first and second parts can be an obtuse angle or an acute angle, and the specific bending angle is adaptively set according to the relative assembly orientation of the power module 1 and the capacitor 2 on the support frame 3. In addition, the bending transition area can adopt a rounded transition to avoid stress concentration at the bend, thereby improving the structural fatigue life of the first terminal 11 under long-term vibration conditions.

[0027] In some embodiments of this application, the undeformed regions of the first and second portions have the same initial thickness. For example... Figure 1 and Figure 2 As shown, before bending and forming, the first terminal 11 is a sheet or strip of uniform thickness. The first part and the second part maintain the same wall thickness in the original area without additional processing deformation. This uniform wall thickness is the initial thickness. Here, "the area without deformation" refers to the area that retains the original blank state, excluding the bending transition area and the subsequent local processing area.

[0028] The second part has a locally flattened structure within the overlapping area, with a thickness less than the initial thickness. In other words, the second part, within the area overlapping with the second terminal 21, does not maintain its original thickness but has undergone directional thickness compression processing, forming a locally flattened structure with significantly reduced thickness. This locally flattened structure is formed by reducing the thickness of a local area to a preset value based on the initial thickness through plastic processing techniques such as mechanical stamping, rolling, or molding. In the subsequent laser welding process, this thinned area allows heat to be more concentrated and efficiently applied to the bonding interface, thus achieving a reliable welding connection under lower laser power input conditions. This design reduces the need for high laser power while also reducing the diffusion and transfer of heat to surrounding areas during the welding process, effectively avoiding the risk of laser high temperature burning the capacitor core, thereby ensuring the performance integrity of the capacitor and the overall operational reliability of the product.

[0029] Furthermore, the initial thickness is greater than that of the second terminal 21. This thickness relationship reflects the differentiated design positioning between the power module terminals and the capacitor terminals: the first terminal 11 needs to handle the conduction of large currents and the bending transformation in spatial direction, therefore its initial blank needs to have a larger cross-sectional thickness to ensure sufficient current carrying capacity and mechanical bending strength; while the second terminal 21 is limited by the lead-out process characteristics of the capacitor's own packaging structure, and its terminal thickness is usually thinner. It is precisely because of this inherent difference in initial thickness that it is necessary to set a local flattening structure on the second part to bring the thicker second part closer to the thickness of the second terminal 21 in the bonding area, thereby achieving effective matching and coordination at the thickness level.

[0030] In some alternative implementations, the partially flattened structure may cover only a portion of the overlapping area or cover the entire overlapping area, with the specific coverage area adapted to the actual conductive cross-section requirements and welding process window. Simultaneously, the edges of the partially flattened structure may be provided with gradually transitioning bevels to avoid stress concentration at abrupt thickness changes, thereby improving the structural reliability of the terminal.

[0031] In some embodiments of this application, the thickness of the second terminal 21, the thickness of the partially flattened structure, and the initial thickness satisfy a preset thickness matching formula, which is: in, For the initial thickness, The thickness of the second terminal 21, The thickness of the locally flattened structure, Let be the heat capacity matching coefficient, and The value ranges from 0.15 to 0.35, and the thickness of the locally flattened structure is between 0.5mm and 0.8mm.

[0032] The essence of the above formula is based on For the lower limit, A linear interpolation relationship with an upper limit. Value determines The interpolation position within this interval, thus always satisfying This ensures that the locally flattened structure, after thickness compression, does not excessively reduce the current-carrying cross section, and effectively reduces the thickness difference between it and the second terminal 21.

[0033] In practical applications of power components The value ranges from 1.5mm to 3.0mm, and is determined by the rated current carrying capacity of the DC side of the power module and the feasibility of the bending process. The value ranges from 0.3mm to 0.5mm, determined by the manufacturing process specifications of the capacitor package leads. Substituting into the formula, when When the value is taken in the range of 0.15 to 0.35, The corresponding diameter falls within the range of 0.64mm to 0.96mm, thus ensuring a reasonable balance between conductive cross-section, mechanical strength, and welding process feasibility.

[0034] The "heat capacity matching coefficient" refers to the ratio of the heat capacity per unit area of ​​a locally flattened structure and a second terminal 21 made of the same material (copper or copper alloy), equal to the ratio of their thicknesses. Substituting the thickness matching formula into the equation yields the following result. ,in Therefore This directly determines the ratio of the heat capacity of the conductors on both sides of the laser welding interface. When the value is appropriate, the ratio can be narrowed to a reasonable range so that the temperature rise rate of the two conductors tends to be consistent under the same heat flux density, thereby ensuring that the weld pool is formed synchronously and expanded uniformly on both sides of the interface, avoiding defects such as over-melting or under-melting on one side. The lower bound is set at 0.15 to prevent excessive flattening from causing excessive loss of local cross-sectional area, which could lead to increased current carrying capacity and insufficient mechanical strength. The upper bound is set at 0.35 to prevent excessive heat capacity difference between the two conductors (heat capacity ratio exceeding 2.0), which could cause over-melting and burn-through on the second terminal 21 side during welding, resulting in incomplete welding on the flattened structure side due to thermal mismatch. Considering the above constraints, The heat capacity ratio on both sides of the interface can be controlled within a reasonable range of 1.4 to 2.0 to achieve the best heat capacity matching effect and welding process stability.

[0035] In some embodiments of this application, the partially flattened structure is a plastic deformation zone formed by the lateral extension of the second part under compression. For example... Figure 1 and Figure 2 As shown, the locally flattened structure is not formed by material removal thinning, but rather by applying a normal compressive force to a localized area of ​​the second part. This causes the material in that area to be compressed and thinned in the thickness direction while undergoing plastic flow and lateral extension in the width direction, thus forming a plastic deformation zone with reduced thickness and increased width. This flattened structure, formed through plastic deformation under the principle of volume conservation, allows the internal metal grains to undergo reorientation in the compression and extension directions. The density of the conductor material does not decrease due to processing, thereby effectively maintaining or even improving the electrical and mechanical properties of that region.

[0036] Because the material undergoes lateral elongation during thickness compression, the width of the locally flattened structure is greater than that of the first part. This width change is an inevitable geometric result of the plastic flattening process—under the condition that the material volume is basically conserved, a decrease in thickness is inevitably accompanied by an increase in width. The increased width of the locally flattened structure brings additional technical advantages: on the one hand, the wider contact surface increases the effective contact area between the second part and the second terminal 21, reducing the current density and contact resistance at the contact interface; on the other hand, the wider coverage area provides more operating space and a wider alignment tolerance for subsequent welding processes, which is beneficial for the stable control of welding process quality.

[0037] In some parallel embodiments, the plastic flattening process can employ different techniques such as unidirectional stamping flattening, bidirectional pressing flattening, or roll pressing flattening. Unidirectional stamping flattening involves applying pressure from one side of the second part, causing the material to flow laterally to the other side and both sides. Bidirectional pressing flattening involves applying symmetrical pressure simultaneously from both the top and bottom sides of the second part, causing the material to extend laterally evenly to both sides. This method results in a flattened structure with higher surface flatness and better thickness uniformity. Roll pressing flattening uses a pair of adjustable-pitch rollers to continuously press the second part, suitable for processing long flattening areas. Different flattening processes can be selected based on the material hardness of the first terminal 11, the target flattening amount, and the production line equipment conditions; this invention does not impose strict limitations on these factors.

[0038] In some embodiments of this application, within the overlapping region, such as Figure 1 and Figure 2 As shown, a partially flattened structure is stacked on the surface of the second terminal 21. That is, the partially flattened structure covers and presses onto the upper surface of the second terminal 21 in a surface-to-surface manner, forming a laminated structure with upper and lower layers. In this stacked state, a tight physical contact interface is formed between the lower surface of the partially flattened structure and the upper surface of the second terminal 21.

[0039] Based on this stacking, a gapless fusion layer is formed between the partially flattened structure and the second terminal 21 through laser welding. Laser welding applies a focused laser beam to the interface between the partially flattened structure and the second terminal 21, causing the two conductive layers to melt locally in a very short time. The molten base metal interweaves and solidifies at the interface, forming a continuous, dense, and gapless fusion layer. This fusion layer eliminates the original physical contact interface between the two conductors, transforming contact conductivity into metallurgical conductivity, fundamentally eliminating the influence of contact resistance. This allows the current transfer between the second part and the second terminal 21 to achieve an ultra-low resistance level almost equivalent to the resistivity of the base material itself.

[0040] Using laser welding as the fixed connection method in the overlapping area has the following significant technical advantages: First, the heat input of laser welding is highly concentrated and the heat-affected zone is extremely small, which will not cause thermal damage to the structure outside the bending area of ​​the first terminal 11 or to the sensitive components inside the power module 1 and capacitor 2. Second, laser welding has high weld formation precision, and the thickness and width of the fusion layer can be precisely controlled by laser power, scanning speed and spot diameter, resulting in excellent process repeatability and consistency. Third, laser welding is a non-contact processing method, which does not require applying additional mechanical pressure to the workpiece being welded, avoiding displacement interference to the already precision-assembled support frame 3 during the welding process. In addition, from the perspective of molding and manufacturing feasibility, the laser welding process can share the positioning fixture with the capacitor core potting process, eliminating the need for the development of special welding press fixtures while eliminating the terminal gap, reducing the number of clamping operations, and achieving simplification of the manufacturing process and effective reduction of production costs.

[0041] In some alternative implementations, the fixed connection between the partially flattened structure and the second terminal 21 can also be achieved using alternative processes such as ultrasonic welding, resistance spot welding, or diffusion welding. Ultrasonic welding generates a solid-state diffusion connection at the interface through high-frequency vibration friction, making it suitable for applications highly sensitive to heat input. Resistance spot welding achieves local fusion by generating resistance heat through a large current at the overlapping interface, resulting in lower equipment costs and higher production efficiency. Diffusion welding, under certain temperature and pressure conditions, causes solid-state interdiffusion of atoms on both sides of the interface to form a connection, resulting in excellent joint quality but a longer production cycle.

[0042] In some embodiments of this application, an operation window 31 is provided on the side wall of the support frame 3, such as... Figure 1 and Figure 2 As shown, the operation window 31 is connected to the overlapping area inside the support frame 3, and is used to expose the connection surface between the second part and the second terminal 21.

[0043] In the actual production and assembly process of power components, after the power module 1 and capacitor 2 have been assembled onto the support frame 3, and the second part and the second terminal 21 form a tightly overlapping area inside the support frame 3, welding operations need to be performed on the connecting surfaces within this overlapping area from the outside. Since the overlapping area is now located inside the cavity of the support frame 3, if the sidewall of the support frame 3 is a completely closed structure, welding tools such as laser welding heads will not be able to reach and act on the connecting surfaces. Therefore, an operation window 31 is opened on the sidewall of the support frame 3 at the location corresponding to the overlapping area, so that the window forms a spatial connection with the internal overlapping area, exposing the connecting surfaces of the second part and the second terminal 21 to the outside through the window, providing the necessary passage and field of vision for the entry and operation of welding tools.

[0044] The shape of the operating window 31 can be rectangular, oblong, or circular, and its opening size should meet the space requirements for the welding tool operating head to enter and the complete coverage requirements of the welding path. The orientation of the operating window 31 should match the orientation of the connecting surfaces in the internal overlapping area so that the welding energy can be applied to the connecting surfaces at the optimal angle.

[0045] In some further improved embodiments, the inner wall edge of the operating window 31 can be chamfered or guided by a bevel, which guides the precise positioning of the welding tool and prevents sharp edges from scratching the terminal surface. Furthermore, the operating window 31 can also serve as a weld appearance quality inspection window after welding, facilitating visual inspection of the welding formation effect or online quality monitoring via optical inspection equipment.

[0046] In some embodiments of this application, such as Figure 1 and Figure 2 As shown, the operating window 31 is filled with an insulating medium, which covers the fixed connection part between the second part and the second terminal 21. The operating window 31 forms a potting groove structure. After the insulating medium is cured, an insulating seal that meets the safety requirements of electrical clearance and creepage distance is formed in the overlapping area, thus achieving electrical safety protection of the high-voltage connection area in an extremely compact layout space.

[0047] After the second part and the second terminal 21 are electrically fixedly connected by welding in the overlapping area, an insulating medium needs to be filled inside the operating window 31. It should be noted that the groove structure of the operating window 31 is not a simple filling and sealing design, but an active balance between safety requirements under the premise of extreme space utilization: Under the design constraints of high power density, the physical distance between adjacent high-voltage connection areas and the metal heat sink is extremely limited. It is difficult to meet the safety requirements of electrical clearance and creepage distance by relying solely on air gaps. The groove shape of the operating window 31 allows the potting insulating medium to form an insulating seal with a certain volume thickness after curing. By replacing the air gap with solid insulation, the equivalent electrical clearance and creepage distance of the laser-welded high-voltage connection area are improved to meet the requirements of relevant safety standards (such as IEC 60664) without increasing the overall size of the component. This achieves a balance between extremely compact space and safe insulation protection, so that the insulating medium completely covers and seals the fixed connection area between the second part and the second terminal 21, thereby achieving electrical insulation protection and environmental sealing protection for the high-voltage connection area.

[0048] The insulating medium can be made from common electronic-grade insulating potting materials such as epoxy resin potting compound, silicone rubber potting compound, or polyurethane potting compound. Epoxy resin potting compound offers excellent electrical insulation strength, mechanical hardness, and chemical corrosion resistance, providing rigid protection to the connection points after curing. Silicone rubber potting compound exhibits good flexibility, wide temperature range adaptability, and excellent heat aging resistance, making it suitable for long-term operation of power components under high-temperature conditions. The specific material type can be selected based on the operating temperature range of the power components, insulation class requirements, and manufacturing process conditions.

[0049] In some alternative embodiments, the insulating medium can also be embedded or snapped into the operating window 31 in the form of a pre-formed insulating plug or insulating cover, and then sealed with sealant. This method is suitable for applications where the window needs to be reopened for weld re-inspection or repair during later maintenance.

[0050] In some embodiments of this application, the support frame 3 is a one-piece molded part made of insulating material. The material of the support frame 3 is an insulating material, which can be engineering plastics such as PA, PPS, PBT, LCP and other high-performance engineering plastics, or glass fiber reinforced composite materials, etc. The specific material is selected according to the operating temperature level, mechanical strength requirements and flame retardant level requirements of the power components. The support frame 3 is manufactured in one piece, that is, the entire frame is a single integral part manufactured in one go through injection molding, die casting or other mold forming processes, rather than being assembled from multiple separate parts. The one-piece molding process ensures a high degree of consistency in dimensional accuracy and relative positional relationships among the functional areas of the support frame 3. At the same time, it eliminates potential weak points in sealing and mechanical loosening risks at the joint surfaces in the split splicing structure. In terms of manufacturing, the one-piece molding design of the support frame eliminates the installation process of external copper busbars and bolt fasteners between IGBT / SiC and bus capacitors in the traditional solution, effectively reducing the number of production processes and material costs. Meanwhile, the laser welding process can directly reuse the capacitor potting positioning fixture as a welding support, eliminating the need to develop a separate laser welding press fixture, further reducing tooling costs and clamping times, and demonstrating good feasibility and cost benefits for mass production.

[0051] The support frame 3 is provided with a first mounting slot for accommodating the power module 1 and a second mounting slot for accommodating the capacitor 2. For example... Figure 1 and Figure 2As shown, the first and second assembly slots are recessed cavity structures formed on the body of the support frame 3. Their respective inner cavity contours are adapted to the outer contours of the power module 1 and capacitor 2, allowing the power module 1 and capacitor 2 to be precisely positioned and stably constrained on the support frame 3 after being embedded in their respective assembly slots, thus achieving fast and reliable assembly. The walls of the first and second assembly slots can be provided with limiting bosses, guide ribs, or anti-misalignment features to guide the correct placement of the power module 1 and capacitor 2 during assembly and prevent misalignment.

[0052] In some further improved embodiments, the support frame 3 may also have a metal insert pre-embedded in the wall between the first and second assembly slots, which can be used as anchor points for grounding terminals or signal terminals in subsequent assembly processes. Furthermore, the outer wall of the support frame 3 may be provided with a snap-fit ​​structure or flange mounting surface that mates with the electrical control housing, allowing the power assembly to be easily installed into the electrical control housing and secured.

[0053] In some embodiments of this application, the power component further includes a heat dissipation substrate 12, and the heat dissipation substrate 12 is attached to the side of the power module 1 facing away from the support frame 3, such as... Figure 5 , Figure 6 and Figure 7 As shown, the first terminal 11 includes a positive terminal and a negative terminal, which are arranged symmetrically about the vertical center plane of the support frame 3. (Referring to...) Figure 6 As shown, the indicated line Y1 refers to the left-right symmetrical central axis of the first terminal 11. It is symmetrically distributed along the Y1 axis, and the second part of the positive terminal and the second part of the negative terminal are bent in opposite directions and penetrate into the interior of the support frame 3. The positive and negative terminals are arranged vertically symmetrically along the horizontal center plane of the support frame 3. (Referring to...) Figure 7 As shown, the indicated line Y2 refers to the vertically symmetrical central axis of the first terminal 11, and it is symmetrically distributed vertically along the Y2 axis. Figure 3 and Figure 4 As shown, after the power module 1 is assembled on the support frame 3, the side facing the support frame 3 is the mounting surface, while the side facing away from the support frame 3 is the heat dissipation surface. The heat dissipation substrate 12 is tightly attached to this heat dissipation surface. The heat generated by the power semiconductor chip inside the power module 1 during switching operation is conducted to the heat dissipation substrate 12 through the packaging base plate of the power module 1, and then further transferred and released to the external heat dissipation medium by the heat dissipation substrate 12.

[0054] The heat dissipation substrate 12 is provided with a heat dissipation structure. The heat dissipation structure is used to increase the heat exchange area between the heat dissipation substrate 12 and the external cooling medium, so as to improve the heat dissipation efficiency. In the implementation scenario of liquid cooling, the heat dissipation structure can be a dense fin array such as a pin-fin structure, a straight channel fin structure, or a corrugated fin structure disposed on the side of the heat dissipation substrate 12 facing the coolant. The coolant flows in the channels between the fins and carries away the heat. In the implementation scenario of air cooling, the heat dissipation structure can be a heat dissipation fin group disposed on the back of the heat dissipation substrate 12, which dissipates heat through natural convection or forced air cooling.

[0055] The heat dissipation substrate 12 is preferably made of a metal material with high thermal conductivity, such as aluminum alloy or copper alloy. In some embodiments with higher heat dissipation performance requirements, the heat dissipation substrate 12 can be made of aluminum silicon carbide (AlSiC) composite material or copper molybdenum (CuMo) composite material to meet the matching requirements of high thermal conductivity and low coefficient of thermal expansion, thereby reducing the interfacial thermal stress between the power module 1 and the heat dissipation substrate 12 caused by thermal expansion mismatch.

[0056] The interface between the heat dissipation substrate 12 and the power module 1 can be coated with a thermally conductive interface material such as thermally conductive silicone grease or thermally conductive phase change material to fill the microscopic interface gaps and reduce the interface thermal resistance. In some further improved embodiments, the heat dissipation substrate 12 can be directly metallurgically connected to the base plate of the power module 1 through reflow soldering or sintering processes to minimize the interface thermal resistance.

[0057] like Figure 6 As shown, the positive and negative terminals are arranged symmetrically to ensure that the path length, copper busbar cross-sectional area, bending angle and spatial orientation between the lead-out point of the conductive substrate of the power module 1 and the contact point with the second terminal 21 are completely consistent. The equivalent impedance of each phase positive and negative input terminal is strictly equal, and the current can be evenly distributed on the positive and negative terminals. This fundamentally eliminates the bias current phenomenon caused by path asymmetry, so that the current carrying capacity of the power module 1 can be fully and evenly utilized, and the overcurrent potential of the power device can be maximized.

[0058] In contrast, in existing conventional modular connection schemes, the positive and negative terminals need to be staggered in the planar layout space while meeting safety requirements for electrical clearance and creepage distance. The inherent lateral offset between the two leads to differences in the path lengths of the positive and negative terminals, making it impossible to achieve strictly equal equivalent impedances. This uneven current distribution is an inherent defect that cannot be fundamentally eliminated within the conventional modular connection framework. Figure 2 and Figure 7As shown, this application utilizes the arrangement of positive and negative poles bending vertically and penetrating into the interior of the frame, eliminating the need for staggered spacing of positive and negative poles in planar space. This completely avoids the aforementioned constraints at the structural level and achieves an absolutely symmetrical form that cannot be achieved by conventional technical approaches.

[0059] The symmetrical bending arrangement at the top and bottom creates a tightly stacked conduction path between the positive and negative copper busbars inside the support frame 3. The positive and negative currents are in opposite directions and their paths highly overlap, causing the magnetic flux generated by them to cancel each other out. This greatly compresses the parasitic inductance of the circuit. When the power module 1 operates at high frequency, the voltage spikes caused by stray inductance are effectively suppressed due to the significant reduction in stray inductance. At the same time, the complete symmetry of the positive and negative paths makes the alternating magnetic fields of the two almost completely cancel each other out in space, greatly reducing EMI radiation noise and further improving the EMC performance of the power components.

[0060] In conventional split connection schemes, the positive and negative terminals are arranged in a staggered plane, and the geometric asymmetry of the path makes it impossible for the magnetic flux generated by the positive and negative currents to be fully canceled. This results in a high parasitic inductance in the circuit and a corresponding increase in EMI radiation. This can only be partially alleviated by passive means such as increasing the cross-sectional area of ​​the copper busbar or adding magnetic shielding, and cannot achieve a fundamental improvement at the path level.

[0061] Meanwhile, the positive and negative terminals are arranged symmetrically with the upper and lower bends penetrating into the frame. The positive and negative terminals completely overlap in the plane projection direction, eliminating the need to reserve separate installation spaces for the positive and negative terminals on the plane. This maximizes the use of the planar layout space and further reduces the overall envelope size of the power module. While achieving optimal current sharing performance, it also meets the development needs of power modules evolving towards higher power density and extreme compactness.

[0062] According to a second aspect of this application, this application provides a power system including a drive motor and the power components of the first aspect.

[0063] The power component is electrically connected to the drive motor and is used to drive the drive motor. In this power system, the power component acts as the power drive front end of the drive motor, receiving DC power from an upstream DC power source such as a power battery pack or fuel cell system. Through high-frequency switching modulation of the power semiconductor devices in the power module 1 inside the power component, the DC power is converted into AC power with adjustable frequency and amplitude. The AC power is then output to the stator winding of the drive motor through the AC output terminal of the power module 1, thereby driving the drive motor to rotate at the target speed and torque.

[0064] The drive motor can be a common type of electric drive motor, such as a permanent magnet synchronous motor, an AC asynchronous motor, or a switched reluctance motor. The AC side electrical connection between the power components and the drive motor is achieved through an AC busbar or AC cable, while the DC side electrical connection is achieved by connecting to a DC power supply through the DC bus terminal of capacitor 2.

[0065] Because the power components used in this power system possess the superior characteristics described in the preceding embodiments, such as low stray inductance, low contact resistance, high power density, and extreme compactness, the voltage spikes and switching losses of the entire power system under high-frequency switching conditions are effectively suppressed, significantly improving system efficiency and operational reliability. Simultaneously, the compact size of the power components facilitates the miniaturization and lightweight design of the overall power system, making it particularly suitable for applications with stringent requirements for power density and space constraints, such as electric drive systems for new energy vehicles, industrial servo drive systems, and aerospace electric actuation systems.

[0066] In other embodiments, the power system may further include supporting subsystems such as a motor controller, a resolver sensor, and a cooling circulation system. Each subsystem works in conjunction with the power components to achieve precise and efficient closed-loop control of the drive motor.

[0067] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0068] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A power component, characterized in that, include: Power module (1), which is connected to a first terminal (11); A capacitor (2) is connected to a second terminal (21); The power module (1) and the capacitor (2) are respectively assembled on the support frame (3); The first terminal (11) includes a first part and a second part that are bent and connected together. The first part is connected to the power module (1), and the second part extends through the interior of the support frame (3). The second terminal (21) is at least partially located inside the support frame (3) and forms an overlapping area with the second portion; Within the overlapping area, the second portion is attached to the second terminal (21).

2. The power component according to claim 1, characterized in that, The undeformed regions of the first and second portions have the same initial thickness. The second part has a partially flattened structure in the overlapping area, the thickness of the partially flattened structure being less than the initial thickness; The initial thickness is greater than the thickness of the second terminal (21).

3. The power component according to claim 2, characterized in that, The thickness of the second terminal (21), the thickness of the partially flattened structure, and the initial thickness satisfy a preset thickness matching formula, which is: in, The initial thickness is... The thickness of the second terminal (21) The thickness of the locally flattened structure is... Let be the heat capacity matching coefficient, and The value ranges from 0.15 to 0.35, and the thickness of the partially flattened structure is between 0.5 mm and 0.8 mm.

4. The power component according to claim 2, characterized in that, The partially flattened structure is a plastic deformation zone formed by the lateral extension of the second part under compression, and the width of the partially flattened structure is greater than the width of the first part.

5. The power component according to claim 2, characterized in that, Within the overlapping area, the partially flattened structure is stacked on the surface of the second terminal (21), and a gapless fusion layer is formed between the partially flattened structure and the second terminal (21) by laser welding.

6. The power component according to claim 1, characterized in that, An operation window (31) is provided on the side wall of the support frame (3). The operation window (31) is connected to the overlapping area inside the support frame (3) and is used to expose the connection surface between the second part and the second terminal (21).

7. The power component according to claim 6, characterized in that, The operation window (31) is filled with an insulating medium, which covers the fixed connection between the second part and the second terminal (21). The operation window (31) forms a potting groove structure. After the insulating medium is cured, it forms an insulating seal in the overlapping area.

8. The power component according to claim 1, characterized in that, The support frame (3) is an integrally molded part made of insulating material. The support frame (3) is provided with a first assembly slot for accommodating the power module (1) and a second assembly slot for accommodating the capacitor (2).

9. The power component according to claim 1, characterized in that, It also includes a heat dissipation substrate (12). The power module (1) is attached to the side away from the support frame (3) with the heat dissipation substrate (12). The heat dissipation substrate (12) is provided with a heat dissipation structure. The first terminal (11) includes a positive terminal and a negative terminal. The positive terminal and the negative terminal are arranged symmetrically from left to right according to the vertical center plane of the support frame (3). The second part of the positive terminal and the second part of the negative terminal are bent in opposite directions and penetrate into the interior of the support frame (3). The positive terminal and the negative terminal are arranged symmetrically from top to bottom according to the horizontal center plane of the support frame (3).

10. A power system, characterized in that, It includes a drive motor and a power component as described in any one of claims 1-9, wherein the power component is electrically connected to the drive motor and is used to drive the drive motor to operate.

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