A power conversion device, an assembly process thereof, and a magnetic assembly

Abstract

This invention relates to a power conversion device, comprising a switching element, a magnetic core, a first substrate, and a second substrate. The magnetic core is fastened to the second substrate, and the switching element is disposed on the upper surface of the first substrate. By providing a cutout in the first substrate, the upper magnetic cover of the magnetic core is exposed, thereby reducing the height difference between the switching element and the magnetic core on the top surface of the power conversion device, further reducing the upward thermal resistance of the power conversion device, improving the heat dissipation capacity of the power conversion device, reducing the loss on the magnetic core, and improving the conversion efficiency of the power conversion device. On the other hand, by placing the output capacitor between the lower switch assembly and the upper & middle switch assembly, the power circuit of the power conversion device is further reduced, improving the conversion efficiency of the power conversion device. Furthermore, by optimizing the structure of the power conversion device, the number of times the components undergo reflow soldering during device assembly is reduced, thereby improving the production efficiency and yield of the power conversion device.

Description

Technical Field

[0001] This invention belongs to the field of high-frequency power supply technology, and particularly relates to a power conversion device, its assembly process, and a magnetic component. Background Technology

[0002] With the development of artificial intelligence, the power requirements of intelligent data processing chips, such as GPUs / CPUs / NPUs (collectively referred to as xPUs), are increasing, leading to a significant increase in server power consumption. Server input voltages are gradually shifting from 12V to 48V. Meanwhile, the operating voltage of xPUs is decreasing with advancements in manufacturing processes, moving from 0.8V to 0.65V. Therefore, the ratio of input voltage to output voltage is becoming increasingly larger, making the two-stage buck converter architecture the mainstream. This two-stage buck converter architecture includes a proportional converter in the front stage and a voltage regulator in the back stage.

[0003] This invention proposes a power conversion device for a front-stage proportional converter that converts a 48V input voltage into an intermediate bus voltage. By optimizing the winding method of the transformer windings and the layout of the power devices, the size of the power conversion device is reduced; and by optimizing the structure of the power conversion device, the number of times the devices undergo reflow soldering is reduced, thereby reducing the manufacturing failure rate of the power conversion device. Summary of the Invention

[0004] In view of this, one of the objectives of the present invention is to provide a power conversion device, including a switch, a magnetic core, a first substrate, and a second substrate; the magnetic core includes an upper magnetic cover, a lower magnetic cover, a first magnetic post, and a second magnetic post; the second substrate includes opposing upper and lower surfaces and a hole; the hole penetrates the upper and lower surfaces of the second substrate and allows the first magnetic post and the second magnetic post to pass through, respectively; the upper and lower magnetic covers are respectively fastened to the upper and lower surfaces of the second substrate;

[0005] The first substrate includes a cutout portion, an opposing upper surface, and a lower surface; the lower surface of the first substrate is disposed adjacent to the upper surface of the second substrate; after the first substrate, the magnetic core, and the second substrate are assembled, the upper magnetic cover of the magnetic core is exposed on the upper surface of the first substrate; the switch is disposed on the upper surface of the first substrate.

[0006] Preferably, it further includes an input positive terminal, an output positive terminal, a ground terminal, an input capacitor, and an output capacitor, wherein the input positive terminal, the output positive terminal, the ground terminal, and the input capacitor are all disposed on the lower surface of the second substrate; the positive terminal of the input capacitor is electrically connected to the input positive terminal, and the negative terminal of the input capacitor is electrically connected to the output positive terminal.

[0007] Preferably, the switch includes an upper switch, a middle switch, and a lower switch, which are connected in series and then bridging the input positive terminal and the ground terminal.

[0008] Preferably, the lower switch is also disposed on the lower surface of the second substrate, and the positions of the lower switch disposed on the lower surface of the second substrate and the lower switch disposed on the upper surface of the first substrate correspond one-to-one.

[0009] Preferably, the magnetic core includes opposing first and third sides, opposing second and fourth sides, and the channel between the first and second magnetic posts is a winding channel that penetrates the first and third sides.

[0010] Preferably, the output capacitor is disposed on the upper surface of the first substrate and between the lower switch and the middle switch.

[0011] Preferably, the upper switch, middle switch and lower switch are all disposed on the first side of the magnetic core, and the lower switch is adjacent to the first side of the magnetic core.

[0012] Preferably, the lower switch includes two first lower switches and two second lower switches, the two second lower switches being disposed adjacent to the winding channel, and the second lower switches being disposed between the two first lower switches.

[0013] Preferably, a positive input terminal pad is provided on the lower surface of the first substrate, and the drain of the upper switch is electrically connected to the positive input terminal pad through a via embedded in the first substrate; a positive input terminal pad is also provided on the upper surface of the second substrate, and the positive input terminal pads provided on the upper surface of the second substrate correspond one-to-one with the positive input terminal pads provided on the lower surface of the first substrate.

[0014] Preferably, the upper switch includes a first upper switch and a second upper switch; the middle switch includes a first middle switch and a second middle switch; the lower switch includes a first lower switch and a second lower switch; the first upper switch and the first middle switch are disposed along a first side adjacent to the magnetic core; the second upper switch and the second middle switch are disposed along a third side adjacent to the magnetic core; the first upper switch and the second upper switch are both disposed near a second side of the magnetic core, and the first middle switch and the second middle switch are both disposed near a fourth side of the magnetic core.

[0015] Preferably, a first lower switch and a second lower switch constitute a lower switch combination, the lower switch combination including a first lower switch combination and a second lower switch combination; the first lower switch combination is disposed along a second side adjacent to the magnetic core, and the second lower switch combination is disposed along a fourth side adjacent to the magnetic core; in each lower switch combination, the first lower switch is disposed near a third side adjacent to the magnetic core, and in each lower switch combination, the second lower switch is disposed near a first side adjacent to the magnetic core.

[0016] Preferably, both the first magnetic post and the second magnetic post include an inner side and an outer side; the second side of the magnetic core is adjacent to the outer side of the first magnetic post, and the fourth side of the magnetic core is adjacent to the outer side of the second magnetic post; the first lower switch assembly, the first magnetic post, the second magnetic post, and the second lower switch assembly are arranged in a line and adjacent to each other.

[0017] Preferably, the output capacitors are respectively disposed adjacent to the sources of the first lower switch assembly and the second lower switch assembly; the output capacitors, the first lower switch assembly, the first magnetic post, the second magnetic post, the second lower switch assembly, and the output capacitors are arranged in a line and adjacent to each other in pairs. Preferably, a third lower switch assembly and a fourth lower switch assembly are disposed on the lower surface of the second substrate, and the third lower switch assembly and the fourth lower switch assembly are respectively disposed perpendicularly to the first lower switch assembly and the second lower switch assembly.

[0018] Preferably, the cutout portion is a cutout groove provided on one side adjacent to the first substrate.

[0019] Preferably, the cutout portion is a cutout hole located near the center of the first substrate.

[0020] Preferably, the system further includes a third substrate, which includes an upper surface and a lower surface opposite to each other; the upper surface of the third substrate is disposed adjacent to the lower surface of the second substrate; the upper surface of the third substrate is provided with a pin pad, which is electrically connected to the input positive terminal, the output positive terminal, and the ground terminal; the lower surface of the third substrate is provided with pins, which are used for electrical connection with external components.

[0021] The present invention also provides an assembly process, comprising the following steps:

[0022] Step 1: Weld the components to the lower surface of the second substrate and assemble the magnetic core; simultaneously complete the assembly of the third substrate; and assemble all the components on the upper surface of the first substrate together using SMD assembly.

[0023] Step 2: Assemble the second and third substrates assembled in Step 1 together using SMD;

[0024] Step 3: Solder the components assembled in Step 2 and the first substrate assembly assembled in Step 1 together using SMD soldering.

[0025] The present invention also provides a power conversion device, including input and output terminals, a switch, an output capacitor, and a magnetic component; the input and output terminals include an input positive terminal, an output positive terminal, and a ground terminal; the output terminal includes an output positive terminal and a ground terminal; the output capacitor is connected across the output positive terminal and the ground terminal; the switch includes an upper switch, a middle switch, and a lower switch; the upper switch includes a first upper switch and a second upper switch; the middle switch includes a first middle switch and a second middle switch; the lower switch includes a first lower switch and a second lower switch.

[0026] The first upper switch, the first middle switch, and the first lower switch form a first three-switch bridge arm. The first upper switch and the first middle switch are electrically connected to the first upper node, and the first middle switch and the first lower switch are electrically connected to the first lower node. The second upper switch, the second middle switch, and the second lower switch form a second three-switch bridge arm. The second upper switch and the second middle switch are electrically connected to the second upper node, and the second middle switch and the second lower switch are electrically connected to the second lower node. The magnetic component is electrically connected at least to the first lower node, the second lower node, and the output positive terminal.

[0027] It also includes a first substrate, on which the upper switch, middle switch, lower switch and output capacitor are disposed;

[0028] The output capacitor is positioned between the lower switch and the middle switch.

[0029] Preferably, the magnetic component includes a magnetic core and a winding; the magnetic core includes a first magnetic post and a second magnetic post, the channel between the first magnetic post and the second magnetic post is a winding channel, the winding channel penetrates the opposite sides of the magnetic core; the winding passes through the winding channel, and the lower switch is disposed adjacent to the winding channel.

[0030] Preferably, the magnetic core further includes an upper magnetic cover and a lower magnetic cover; the winding includes a first high-voltage winding, a second high-voltage winding, a first low-voltage winding, and a second low-voltage winding.

[0031] Preferably, each of the windings includes a first end and a second end; the second end of the first low-voltage winding and the second end of the second low-voltage winding are electrically connected.

[0032] Preferably, the second end of the first high-voltage winding is connected to the first end of the second low-voltage winding; the second end of the second high-voltage winding is connected to the first end of the first low-voltage winding.

[0033] Preferably, each of the first high-voltage winding, the second high-voltage winding, the first low-voltage winding, and the second low-voltage winding is wound around the first magnetic post and the second magnetic post, and the winding direction on the first magnetic post is opposite to the winding direction on the second magnetic post; the first high-voltage winding and the second high-voltage winding are wound in opposite directions on the same magnetic post, and the first low-voltage winding and the second low-voltage winding are wound in opposite directions on the same magnetic post.

[0034] Preferably, the switch and the input / output terminals are arranged on different planes; the position of the positive input terminal corresponds one-to-one with the position of the upper switch; and the position of the grounding terminal corresponds one-to-one with the position of the lower switch.

[0035] Preferably, it also includes an input capacitor, the location of which corresponds one-to-one with the location of the upper switch.

[0036] In another aspect, the present invention provides a magnetic assembly, including a magnetic core, a first high-voltage winding, a second high-voltage winding, a first low-voltage winding, and a second low-voltage winding; each of the windings includes a first end and a second end; the second end of the first low-voltage winding and the second end of the second low-voltage winding are electrically connected; the magnetic core includes an upper magnetic cover, a lower magnetic cover, a first magnetic post, and a second magnetic post; each of the first high-voltage winding, the second high-voltage winding, the first low-voltage winding, and the second low-voltage winding is wound around the first magnetic post and the second magnetic post, and the winding direction on the first magnetic post is opposite to the winding direction on the second magnetic post; the first high-voltage winding and the second high-voltage winding have opposite winding directions on the same magnetic post, and the first low-voltage winding and the second low-voltage winding have opposite winding directions on the same magnetic post. Preferably, the magnetic core includes opposing first and third sides, opposing second and fourth sides, and a channel between the first magnetic post and the second magnetic post is a winding channel that penetrates the first and third sides.

[0037] Preferably, the first and second ends of each winding are located adjacent to the same side of the magnetic core.

[0038] Preferably, the winding method of the first low-voltage winding from the first end to the second end is as follows: firstly, it is divided into two paths, which surround the magnetic core from both sides of the magnetic core respectively, from the first side of the magnetic core to the third side of the magnetic core, and then combined and passed through the winding channel from the third side of the magnetic core to the first side of the magnetic core.

[0039] Preferably, the winding method of the second low-voltage winding from the first end to the second end is as follows: first, it passes through the winding channel from the first side of the magnetic core to the third side of the magnetic core, and then it is divided into two paths, which surround the magnetic core from both sides of the magnetic core and reach the first side of the magnetic core.

[0040] Preferably, the high-voltage winding and the low-voltage winding are disposed on the substrate. The winding method of the first high-voltage winding from the first end to the second end is as follows: First, on the first layer of the substrate, the winding passes through the winding channel from the first side of the magnetic core to the third side of the magnetic core, and then splits into two paths, which surround the magnetic core from both sides of the magnetic core respectively, and return to the first side of the magnetic core, and then reach the second layer of the substrate through the via; On the second layer, the winding passes through the winding channel from the first side of the magnetic core to the third side of the magnetic core, and then splits into two paths, which surround the magnetic core from both sides of the magnetic core respectively, and return to the first side of the magnetic core.

[0041] Preferably, the second high-voltage winding is wound from the first end to the second end in the following manner: First, on the third layer of the substrate, it is divided into two paths, which surround the magnetic core from both sides of the magnetic core, from the first side of the magnetic core to the third side of the magnetic core, and then combined and passed through the winding channel from the third side of the magnetic core to the first side of the magnetic core, and then through the via to the fourth layer of the substrate; On the fourth layer, it is divided into two paths, which surround the magnetic core from both sides of the magnetic core, from the first side of the magnetic core to the third side of the magnetic core, and then combined and passed through the winding channel from the third side of the magnetic core to the first side of the magnetic core.

[0042] Preferably, the first end of the first low-voltage winding is located on the second and fourth sides of the magnetic core; the second end of the first low-voltage winding is located on the second and fourth sides of the magnetic core; the first end of the second low-voltage winding is located on the second and fourth sides of the magnetic core; and the second end of the second low-voltage winding is located on the second and fourth sides of the magnetic core.

[0043] Preferably, the first end of the first high-voltage winding is disposed adjacent to the winding channel on the first side of the magnetic core; the first end of the second high-voltage winding is disposed adjacent to the winding channel on the third side of the magnetic core; the second ends of the first high-voltage winding are disposed adjacent to the second and fourth sides of the magnetic core, respectively; and the second ends of the second high-voltage winding are disposed adjacent to the second and fourth sides of the magnetic core, respectively.

[0044] Preferably, the winding method of the first low-voltage winding from the first end to the second end is as follows: from the second and fourth sides of the magnetic core, the windings converge at the third side opening of the winding channel along the third side of the magnetic core, pass through the winding channel to the first side; then, the windings are divided into two paths along the first side of the magnetic core, reaching the second and fourth sides of the magnetic core respectively.

[0045] Preferably, the winding method of the second low-voltage winding from the first end to the second end is as follows: from the second side and the fourth side of the magnetic core, the windings converge at the opening of the first side of the winding channel along the first side of the magnetic core, pass through the winding channel to the third side; then, the windings are divided into two paths along the third side of the magnetic core, reaching the second side and the fourth side of the magnetic core respectively.

[0046] Preferably, the winding method of the first high-voltage winding from the first end to the second end is as follows: first, it passes through the winding channel from bottom to top, and then it is divided into two branches. One branch is wound counterclockwise around the first magnetic post at least one turn to reach the second side adjacent to the magnetic core; the other branch is wound clockwise around the second magnetic post at least one turn to reach the fourth side adjacent to the magnetic core.

[0047] Preferably, the second high-voltage winding is wound from the first end to the second end as follows: first, it passes through the winding channel from top to bottom, and then it is divided into two branches. One branch is wound clockwise around the first magnetic post at least once to reach the second side adjacent to the magnetic core; the other branch is wound counterclockwise around the second magnetic post at least once to reach the fourth side adjacent to the magnetic core.

[0048] Preferably, the second end of the first high-voltage winding is connected to the first end of the second low-voltage winding; the second end of the second high-voltage winding is connected to the first end of the first low-voltage winding.

[0049] The beneficial effects of this invention are:

[0050] This invention relates to a power conversion device, comprising a switching element, a magnetic core, a first substrate, and a second substrate. The magnetic core is fastened to the second substrate, and the switching element is disposed on the upper surface of the first substrate. By providing a hollow portion in the first substrate, the upper magnetic cover of the magnetic core is exposed, thereby reducing the height difference between the switching element and the magnetic core on the top surface of the power conversion device, further reducing the upward thermal resistance of the power conversion device, improving the heat dissipation capacity of the power conversion device, reducing the loss on the magnetic core, and improving the conversion efficiency of the power conversion device.

[0051] By placing the output capacitor between the lower switch combination and the upper & middle switch combination, the power circuit of the power conversion device is further reduced, thereby improving the conversion efficiency of the power conversion device.

[0052] By optimizing the structure of the power conversion device, the number of times the components are reflow soldered during the assembly process is reduced, thereby improving production efficiency and yield. Attached Figure Description

[0053] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0054] Figure 1 This is a schematic diagram of a power conversion circuit;

[0055] Figures 2A to 2C This is a three-dimensional schematic diagram of a power conversion device;

[0056] Figure 3A and Figure 3B This refers to the winding method for high-voltage windings;

[0057] Figure 3C and Figure 3D This refers to the winding method for low-voltage windings;

[0058] Figures 4A to 4C A three-dimensional schematic diagram of the power conversion device for an extended embodiment;

[0059] Figure 5A and Figure 5B This refers to the winding method for high-voltage windings;

[0060] Figure 5C and Figure 5D This is the winding method for low-voltage windings. Detailed Implementation

[0061] One of the core aspects of this invention is to provide a power conversion device, including the structure of the power conversion device and the control / drive method.

[0062] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0063] The power conversion circuit disclosed in this invention is as follows: Figure 1The diagram shows a non-isolated power conversion circuit topology. The non-isolated power conversion circuit includes an input terminal, an output terminal, a first sub-circuit, a second sub-circuit, a magnetic component, and a resonant capacitor. The input terminal includes a positive input terminal Vin+ and a negative input terminal Vin-, and the output terminal includes a positive output terminal Vo+ and a negative output terminal Vo-. In this embodiment, the negative input terminal Vin- and the negative output terminal Vo- are shorted (i.e., grounded at G). Each sub-circuit includes an upper switch, a middle switch, and a lower switch connected in series. The first sub-circuit includes an upper switch Q1, a middle switch Q3, and a lower switch SR1 connected in series; the second sub-circuit includes an upper switch Q2, a middle switch Q4, and a lower switch SR2 connected in series. The upper switch Q1 is connected between the positive input terminal Vin+ and the first upper node SWH1, the middle switch Q3 is connected between the first upper node SWH1 and the first lower node SWL1, and the lower switch SR1 is connected between the first lower node SWL1 and the negative input terminal Vin-. The upper switch Q2 is connected between the positive input terminal Vin+ and the second upper node SWH2. The middle switch Q4 is connected between the second upper node SWH2 and the second lower node SWL2. The lower switch SR2 is connected between the second lower node SWL2 and the negative input terminal Vin-. The magnetic assembly includes a first high-voltage winding TW11, a second high-voltage winding TW14, a first low-voltage winding TW12, and a second low-voltage winding TW13. The first high-voltage winding TW11 and the resonant capacitor C1 are connected in series at connection point SWH1_1, and the first high-voltage winding TW11 and the resonant capacitor C1 form a series branch, which is connected between the first upper node SWH1 and the second lower node SWL2. The second high-voltage winding TW14 and the resonant capacitor C2 are connected in series at connection point SWH2_1, and the second high-voltage winding TW14 and the resonant capacitor C2 form a series branch, which is connected between the second upper node SWH2 and the first lower node SWL1.

[0064] The second terminal of the first low-voltage winding TW12 and the second terminal of the second low-voltage winding TW13 are electrically connected to the positive output terminal Vo+. The first terminal of the first low-voltage winding TW12 is electrically connected to the first lower node SWL1, and the first terminal of the second low-voltage winding TW13 is electrically connected to the second lower node SWL2. The power conversion circuit also includes an input capacitor Cin and an output capacitor Co. The input capacitor Cin is connected between the positive input terminal Vin+ and the positive output terminal Vo+, and the output capacitor Co is connected between the positive output terminal Vo+ and the negative output terminal Vo-. The second terminal of the first high-voltage winding TW11 (i.e., the second lower node SWL2), the first terminal of the second high-voltage winding TW14 (i.e., connection point SWH2_1), the first terminal of the first low-voltage winding TW12 (i.e., the first lower node SWL1), and the second terminal of the second low-voltage winding TW13 (i.e., the positive output terminal Vo+) are terminals of the same name and are labeled as point terminals. The first high-voltage winding TW11, the second high-voltage winding TW12, the first low-voltage winding TW12, and the second low-voltage winding TW13 are all coupled on the same magnetic core, forming the coupling windings of the transformer.

[0065] use Figure 1 The schematic diagram of the power conversion device shown in the diagram is as follows: Figures 2A to 2C As shown, Figure 2A This is a top view of the power conversion device. Figure 2B This is a bottom view of the power conversion device. Figure 2C This is an exploded view of the power conversion device. (Reference) Figures 2A to 2C As shown, the power conversion device includes a first substrate 10, a second substrate 20, and a third substrate 30. Each substrate includes opposing upper and lower surfaces, and the lower surface of the first substrate 10 and the upper surface 201 of the second substrate 20 are adjacent to each other, as are the lower surface of the second substrate 20 and the upper surface 301 of the third substrate 30. The magnetic core 21 includes an upper magnetic cover 21a, a lower magnetic cover 21b, a first magnetic post 22, and a second magnetic post 23. The second substrate 20 includes holes 212 and 213 for the first magnetic post 22 and the second magnetic post 23 to pass through, so that the magnetic core 21 engages with the second substrate 20. After the magnetic core 21 engages with the second substrate 20, the magnetic core 21 includes opposing first sides 211 and third sides 213, and opposing second and fourth sides. The channel between the magnetic posts 22 and 23 is a winding channel 24, which penetrates the first side 211 and the third side 213. The first substrate 10 includes a cutout groove 11, which is disposed on one side adjacent to the first substrate 10. When the first substrate 10 and the second substrate 20 are assembled, the upper magnetic cover 21a of the magnetic core 21 is exposed through the cutout groove 11.

[0066] Upper switches Q1 & Q2, middle switches Q3 & Q4, and lower switches SR1 & SR2 are all disposed on the upper surface 101 of the first substrate 10, and are all disposed on the first side 211 of the magnetic core 21. The upper & middle switch combination includes upper switches Q1 & Q2 and middle switches Q3 & Q4, and the lower switch combination includes lower switches SR1 & SR2. The lower switch combination is disposed adjacent to the first side 211 of the magnetic core 21; the lower switch SR2 is disposed adjacent to the winding channel 24 of the magnetic core 21, and two second lower switches SR2 are disposed between two first lower switches SR1. The output capacitor Co is disposed between the upper & middle switch combination and the lower switch combination, so that the loop formed by the lower switch combination, the first low-voltage winding TW12, the second low-voltage winding TW13, and the output capacitor Co is minimized. (See also...) Figure 3C and Figure 3D The winding method of the first low-voltage winding TW12 and the second low-voltage winding TW13 shown is as follows: the drain of the first lower switch SR1 and the source of the first middle switch Q3 are electrically connected to the first lower node SWL1. The winding method of the first low-voltage winding TW12 from the first end (i.e., the first lower node SWL1) to the second end (i.e. the output positive terminal Vo+) is as follows: firstly, it is divided into two paths, which surround the magnetic core 21 from both sides of the magnetic core 21 respectively, from the first side 211 of the magnetic core to the third side 213 of the magnetic core, and then combined, passing through the winding channel 24 from the third side 213 of the magnetic core to the first side 211 of the magnetic core, thereby reaching the output positive terminal Vo+; the first end and the second end of the first low-voltage winding TW12 are both located adjacent to the first side 211 of the magnetic core. The drain of the second lower switch SR2 is electrically connected to the source of the second middle switch Q4 at the second lower node SWL2. The second low-voltage winding TW13 is wound from the first end (i.e., the second lower node SWL2) to the second end (i.e., the output positive terminal Vo+) as follows: first, it passes through the winding channel 24 from the first side 211 of the magnetic core to the third side 213 of the magnetic core, and then splits into two paths, which surround the magnetic core 21 from both sides of the magnetic core 21 respectively, reaching the first side 211 of the magnetic core. The sources of the first lower switch SR1 and the second lower switch SR2 are both electrically connected to the negative terminal of the output capacitor Co to the ground terminal G; the side of the output capacitor Co adjacent to the lower switch assembly is the ground network, and the ground network is connected to the source of the lower switch nearby, thereby shortening the power loop of the device.

[0067] The drains of the upper switches Q1 and Q2 are electrically connected to the Vin+ pads on the lower surface of the first substrate 10 via vias embedded in the first substrate 10. Correspondingly, the upper surface of the second substrate 20 also has Vin+ pads 221, which correspond one-to-one with the Vin+ pads on the lower surface of the first substrate 10. An input capacitor Cin is disposed on the lower surface of the second substrate 20. The positive terminal of the input capacitor Cin is electrically connected to the Vin+ pads 221, and the negative terminal of the input capacitor Cin is electrically connected to the output positive terminal Vo+. The source of the first upper switch Q1 and the drain of the first middle switch Q3 are electrically connected to the first upper node SWH1. The first upper node SWH1 is electrically connected to the first upper node pads on the lower surface of the first substrate 10 via vias embedded in the first substrate 10. Correspondingly, the upper surface of the second substrate 20 also has first upper node pads 222, which correspond one-to-one with the first upper node pads on the lower surface of the first substrate 10. A resonant capacitor C1 is disposed on the lower surface of the second substrate. One end of the resonant capacitor C1 is electrically connected to the first upper node pad 222, and the other end of the resonant capacitor C1 is electrically connected to the first terminal of the first high-voltage winding TW11. The source of the second upper switch Q2 and the drain of the second middle switch Q4 are electrically connected to the second upper node SWH2. The second upper node SWH2 is electrically connected to the second upper node pad disposed on the lower surface of the first substrate 10 through a via in the first substrate 10. Correspondingly, a second upper node pad 223 is also disposed on the upper surface of the second substrate 20, and the second upper node pad 223 corresponds one-to-one with the second upper node pad disposed on the lower surface of the first substrate 10. A resonant capacitor C2 is disposed on the lower surface of the second substrate. One end of the resonant capacitor C2 is electrically connected to the second upper node pad 223, and the other end of the resonant capacitor C2 is electrically connected to the first terminal of the second high-voltage winding TW14. (See also...) Figure 3A The winding method of the first high-voltage winding TW11 shown, and Figure 3BThe winding method of the second high-voltage winding TW14 shown is as follows: The winding method of the first high-voltage winding TW11 from the first end (i.e., connection point SWH1_1) to the second end (i.e., the second lower node SWL2) is as follows: First, on the first layer of the second substrate 20, the winding passes through the winding channel 24 from the first side 211 of the magnetic core to the third side 213 of the magnetic core, and then splits into two paths, which surround the magnetic core 21 from both sides of the magnetic core 21 respectively, return to the first side 211 of the magnetic core, and then reach the second layer of the second substrate 20 through the via 231; On the second layer, the winding passes through the winding channel 24 from the first side 211 of the magnetic core to the third side 213 of the magnetic core, and then splits into two paths, which surround the magnetic core 21 from both sides of the magnetic core 21 respectively, return to the first side 211 of the magnetic core, and reach the second lower node SWL2. The winding method of the second high voltage winding TW14 from the first end (i.e., connection point SWH2_1) to the second end (i.e., the first lower node SWL1) is as follows: First, on the third layer of the second substrate 20, it is divided into two paths, which surround the magnetic core 21 from both sides of the magnetic core 21 respectively, from the first side 211 of the magnetic core to the third side 213 of the magnetic core. Then, after being combined, it passes through the winding channel 24 from the third side 213 of the magnetic core to the first side 211 of the magnetic core. Then, it passes through the via 232 to the fourth layer of the second substrate 20. On the fourth layer, it is divided into two paths, which surround the magnetic core 21 from both sides of the magnetic core 21 respectively, from the first side 211 of the magnetic core to the third side 213 of the magnetic core. Then, after being combined, it passes through the winding channel 24 from the third side 213 of the magnetic core to the first side 211 of the magnetic core and reaches the first lower node SWL1.

[0068] In this embodiment, the first high-voltage winding TW11 and the second high-voltage winding TW14 are wound in opposite directions around the same U-shaped magnetic core, and the first low-voltage winding TW12 and the second low-voltage winding TW13 are wound in opposite directions around the same U-shaped magnetic core. This reduces the size and loss of the magnetic core, further improving the conversion efficiency of the power conversion device. The first, second, third, and fourth layers here are only used to describe different layers on the second substrate 20 and do not represent a specific layer arrangement order. Furthermore, the number of turns in the high-voltage winding is not limited to two turns; at least two turns can be wound using the same winding method. The low-voltage winding can also be disposed on multiple wiring layers of the second substrate 20 and connected in parallel vias to reduce parasitic resistance losses caused by current flowing through the low-voltage winding, further improving the conversion efficiency of the power conversion device.

[0069] The lower surface of the second substrate 20 is also provided with an input capacitor Cin, an input positive terminal Vin+, a ground terminal G, an output positive terminal Vo+, a first lower switch SR1, and a second lower switch SR2. A portion of the input capacitor Cin is positioned one-to-one with the position of the first upper switch Q1. Here, "one-to-one correspondence" means that the projections of the first upper switch Q1 and this portion of the input capacitor Cin onto the lower surface of the second substrate 20 at least partially overlap; the following definition of "one-to-one correspondence" applies to this. Another portion of the input capacitor Cin is positioned one-to-one with the position of the second upper switch Q2. The resonant capacitor C1 is positioned one-to-one with the position of the first middle switch Q3; the resonant capacitor C2 is positioned one-to-one with the position of the second middle switch Q4. The two input positive terminals Vin+ are positioned one-to-one with the positions of the first upper switch Q1 and the second upper switch Q2, respectively. The two output positive terminals Vo+ are respectively located on the second and third sides of the magnetic core and are symmetrically placed along the magnetic core. The positions of the first lower switch SR1 located on the lower surface of the second substrate 20 and the first lower switch SR1 located on the upper surface of the first substrate 10 correspond one-to-one; similarly, the positions of the second lower switch SR2 located on the lower surface of the second substrate 20 and the second lower switch SR2 located on the upper surface of the first substrate 10 correspond one-to-one. Furthermore, the grounding terminal G is alternately arranged with either the first or second lower switch, in the following order: first lower switch SR2, grounding terminal G, second lower switch SR1, grounding terminal G, and first lower switch SR2. The input positive terminal, output positive terminal, and grounding terminal disclosed in this embodiment can be metal pillars, preferably copper pillars, but are not limited to this.

[0070] The third substrate 30 includes an upper surface and a lower surface opposite to each other. The upper surface 301 is provided with pin pads, controllers, drivers and other auxiliary circuits. The pin pads are used to fix and electrically connect to the input positive terminal, the output positive terminal and the ground terminal. The lower surface of the third substrate 30 is provided with pins for electrical connection to external components.

[0071] The power conversion device structure disclosed in this embodiment can be assembled according to the following steps:

[0072] Step 1: Weld components to the lower surface of the second substrate and complete the magnetic core assembly; and perform SMD assembly on the upper surface of the first substrate for all components.

[0073] Step 2: Assemble the second and third substrates assembled in Step 1 together using SMD;

[0074] Step 3: Solder the components assembled in Step 2 and the first substrate assembly assembled in Step 1 together using SMD soldering.

[0075] The device structure and assembly steps disclosed in this invention reduce the number of times components undergo SMD processing (SMD) to a maximum of three, minimizing the impact on device reliability caused by repeated high-temperature reflow soldering during assembly and improving the production yield of the power conversion device. In the device structure disclosed in this invention, pads are provided on the lower surface of the first substrate 10 and the upper surface of the second substrate 20, with a one-to-one correspondence between the pads on the lower surface of the first substrate 10 and the upper surface of the second substrate 20, and the electrical networks also correspond one-to-one. The hollowed-out grooves on the first substrate 10 expose the upper magnetic cover of the magnetic core, reducing the height difference on the top surface of the power conversion device, primarily the height difference between the switching elements and the magnetic core. This further reduces the upward thermal resistance of the power conversion device, improves its heat dissipation capacity, reduces losses on the magnetic core, and improves the conversion efficiency of the power conversion device.

[0076] The present invention also discloses another embodiment of the power conversion device, such as Figures 4A to 5D As shown. Among them. Figures 4A to 4C The structure of the power conversion device, Figures 5A to 5D This refers to the winding method of the winding. (See reference) Figures 4A to 4C As shown, the power conversion device includes a first substrate 10, a second substrate 20, and a third substrate 30. Each substrate includes an upper surface and a lower surface, and the lower surface of the first substrate 10 and the upper surface 201 of the second substrate 20 are disposed adjacent to each other. Pads are provided on the lower surface of the first substrate 10 and the upper surface of the second substrate 20, and the electrical networks of the pads on the lower surface of the first substrate and the pads on the upper surface of the second substrate correspond one-to-one. The first substrate 10 and the second substrate 20 are fixed and electrically connected by these pads. The lower surface of the second substrate 20 and the upper surface 301 of the third substrate 30 are disposed adjacent to each other. The magnetic core 21 includes an upper magnetic cover 21a, a lower magnetic cover 21b, a first magnetic post 22, and a second magnetic post 23. The second substrate 20 includes holes 212 and 213 for the first magnetic post 22 and the second magnetic post 23 to pass through, respectively, so that the magnetic core 21 engages with the second substrate 20. After the magnetic core 21 is fastened to the second substrate 20, the magnetic core 21 includes opposing first sides 201 and third sides 203, and opposing second sides 202 and fourth sides 204, the positions of these four sides being clockwise. Furthermore, the second side 202 of the magnetic core 21 is adjacent to the outer side of the magnetic post 22, and the fourth side 204 of the magnetic core 21 is adjacent to the outer side of the magnetic post 23. The channel between the magnetic posts 22 and 23 is a winding channel 24, which penetrates the first side 201 and the third side 203. The first substrate 10 includes a perforation 11, which is located near the center of the first substrate 10. When the first substrate 10 and the second substrate 20 are assembled, the upper magnetic cover 21a of the magnetic core 21 is exposed through the perforation 11. This minimizes the height difference between the top surface of the upper magnetic cover 21a and the top surface of the switch, thereby reducing the upward thermal resistance of the power conversion device, lowering the operating temperature of the magnetic core, and reducing losses on the magnetic core.

[0077] Upper switches Q1 and Q2, middle switches Q3 and Q4, and lower switches SR1 and SR2 are all disposed on the upper surface 101 of the first substrate 10. Upper switches Q1 and middle switches Q3 are disposed along the first side 201 adjacent to the magnetic core, and upper switches Q2 and middle switches Q4 are disposed along the third side 203 adjacent to the magnetic core. Both upper switches Q1 and Q2 are disposed near the second side 202 of the magnetic core, and both middle switches Q3 and Q4 are disposed near the fourth side 204 of the magnetic core. Two sets of lower switch combinations are disposed along the second side 202 and the fourth side 204 adjacent to the magnetic core, respectively. Specifically, in the first lower switch combination, the first lower switch SR1 and the second lower switch SR2 are disposed along the second side 202 adjacent to the magnetic core, and in the second lower switch combination, the first lower switch SR1 and the second lower switch SR2 are disposed along the fourth side 204 adjacent to the magnetic core. In each lower switch combination, the first lower switch SR1 is disposed near the third side 203, and in each lower switch combination, the second lower switch SR2 is disposed near the first side 201. The output capacitor Co is arranged adjacent to the source of the first lower switch combination and the second lower switch combination, so that the output capacitor Co, the first lower switch combination, the magnetic column 22 of the magnetic core 21, the magnetic column 23 of the magnetic core 21, the second lower switch combination, and the output capacitor are arranged in a row and adjacent to each other. In this embodiment, the first lower switch combination and the second lower switch combination are both arranged between the output capacitor and the magnetic column of the magnetic core, but this is not a limitation.

[0078] On the lower surface of the second substrate 20, a third lower switch assembly is disposed on the second side 202 adjacent to the magnetic core, and is perpendicularly aligned with the first lower switch assembly. Specifically, the lower switch SR1 in the third lower switch assembly is perpendicularly aligned with the lower switch SR1 in the first lower switch assembly, and the lower switch SR2 in the third lower switch assembly is perpendicularly aligned with the lower switch SR2 in the first lower switch assembly. A fourth lower switch assembly is disposed on the fourth side 204 adjacent to the magnetic core, and is perpendicularly aligned with the second lower switch assembly. The lower switches SR1 and SR2 in the fourth lower switch assembly are perpendicularly aligned with the lower switch SR1 in the second lower switch assembly, and the lower switch SR2 in the fourth lower switch assembly is perpendicularly aligned with the lower switch SR2 in the second lower switch assembly. The output positive connection portion (i.e., the output positive terminal Vo+) and the ground connection portion (i.e., the ground terminal G) are disposed adjacent to the positive and negative terminals of the output capacitor Co, respectively, and are electrically connected to the positive and negative terminals of the output capacitor Co, respectively. In this embodiment, the ground connection, the negative terminal of the output capacitor Co, and the source of the lower switch are located close to each other and electrically connected. Furthermore, the ground connection is also located adjacent to both the source of the lower switch and the negative terminal of the output capacitor. The positive output connection and the positive terminal of the output capacitor Co are located close to each other and electrically connected. This shortens the length of the power circuit and reduces parasitic parameters and losses.

[0079] The drains of upper switches Q1 and Q2 are connected to the pads of the input positive network on the lower surface of the first substrate 10 through vias in the first substrate 10, and are fixed and electrically connected to the corresponding pads of the input positive network on the upper surface of the second substrate 20. They are also connected to the positive terminal of the input capacitor Cin on the lower surface of the second substrate through vias in the second substrate 20. The negative terminals of these input capacitors Cin are electrically connected to the output positive terminal Vo+. The source of upper switch Q1 and the drain of middle switch Q3 are electrically connected to the first upper node SWH1, and are connected to the first upper node pads on the lower surface of the first substrate 10 through vias in the first substrate 10. They are fixed and electrically connected to the corresponding first upper node pads on the upper surface of the second substrate 20, and are connected to one end of the resonant capacitor C1 on the lower surface of the second substrate through vias in the second substrate 20. The resonant capacitor C1 is located adjacent to the first side 201 of the magnetic core, and the other end of the resonant capacitor C1 is electrically connected to the first end of the first high-voltage winding TW11. The source of the upper switch Q2 and the drain of the middle switch Q4 are electrically connected to the second upper node SWH2, and are electrically connected to the second upper node pad on the lower surface of the first substrate through a via provided on the first substrate 10. They are fixed and electrically connected to the corresponding second upper node pad provided on the upper surface of the second substrate 20, and are connected to one end of the resonant capacitor C2 on the lower surface of the second substrate through a via provided in the second substrate 20. The resonant capacitor C2 is located near the third side 203 of the magnetic core, and the other end of the resonant capacitor C2 is electrically connected to the first end of the second high voltage winding TW14.

[0080] On the lower surface of the second substrate 20, the input capacitor Cin is perpendicularly corresponding to the upper switches Q1 and Q2, meaning that the projections of the input capacitor Cin and the upper switch Q1 on the upper surface of the second substrate 20 at least partially overlap, with the overlapping area accounting for at least 30% of the projected area of ​​the upper switch Q1; the projections of the input capacitor Cin and the upper switch Q2 on the upper surface of the second substrate 20 at least partially overlap, with the overlapping area accounting for at least 30% of the projected area of ​​the upper switch Q2; the following perpendicularly corresponding arrangements all satisfy the aforementioned definition. Resonant capacitors C1 and C2 are perpendicularly corresponding to the middle switches Q3 and Q4, respectively. The output positive connection portions are respectively located at the four corners of the lower surface of the second substrate 20 and symmetrically arranged on opposite sides of the lower switch assembly; the output positive connection portion can be a metal pillar, with copper pillars being preferred; it can also be a multi-pin connector. In this embodiment, a 4-pin connector is used as an example, and both 4-pin connectors and copper pillars are employed; in other embodiments, only metal pillars or only multi-pin connectors may be used. A grounding connection portion is provided on the lower surface of the second substrate 20, and is respectively provided on both sides opposite to the lower switch assembly, that is, arranged along the second or fourth side of the magnetic core 21 in the order of grounding connection portion, first lower switch, second lower switch and grounding connection portion. Further, it is provided along the second or fourth side of the magnetic core 21 in the order of output positive connection portion, grounding connection portion, first lower switch, second lower switch, grounding connection portion and output positive connection portion.

[0081] Reference Figures 5A to 5D The winding method, Figure 5A and Figure 5B The winding method of the first high-voltage winding TW11 and the second high-voltage winding TW14. Figure 5C and Figure 5DThe winding method for the first low-voltage winding TW12 and the second low-voltage winding TW13 is as follows. The first end of the first high-voltage winding TW11 (i.e., connection point SWH1_1) is located adjacent to the winding channel on the first side 201 of the magnetic core, and the first end of the second high-voltage winding TW14 (i.e., connection point SWH2_1) is located adjacent to the winding channel on the third side 203 of the magnetic core. The winding method of the first high-voltage winding TW11 from the first end to the second end (SWL2) is as follows: first, it passes through the winding channel 24 from bottom to top, and then splits into two branches. One branch winds counterclockwise around the magnetic post 22 at least one turn, reaching the second lower node SWL2 adjacent to the second side 202 of the magnetic core 21; the other branch winds clockwise around the magnetic post 23 at least one turn, reaching the second lower node SWL2 adjacent to the fourth side 204 of the magnetic core 21. The second high-voltage winding TW12 is wound from the first end to the second end (SWL1) as follows: First, it passes through the winding channel 24 from top to bottom, and then splits into two branches. One branch is wound clockwise around the magnetic post 22 at least once, reaching the first lower node SWL1 adjacent to the second side 202 of the magnetic core 21; the other branch is wound counterclockwise around the magnetic post 23 at least once, reaching the first lower node SWL1 adjacent to the fourth side 204 of the magnetic core 21.

[0082] The drain of the first lower switch SR1 and the source of the first middle switch Q3 are electrically connected to the first lower node SWL1. Since the two first lower switches SR1 are respectively located on the second side 202 and the fourth side 204 opposite to each other on the magnetic core, the first lower node SWL1 flows from the second side 202 and the fourth side 204 of the magnetic core along the third side 203 of the magnetic core to the third side opening of the winding channel 24 (i.e. the first end of the first low voltage winding TW13), passes through the winding channel 24 to the second end of the first low voltage winding on the first side; and then flows along the first side 201 of the magnetic core to the second side 202 and the fourth side 204 of the magnetic core to the output positive terminal Vo+. The drain of the second lower switch SR2 and the source of the second middle switch Q4 are electrically connected to the second lower node SWL2. Since the two second lower switches SR2 are respectively located on the second side 202 and the fourth side 204 of the magnetic core, the second lower node SWL2 originates from the second side 202 and the fourth side 204 of the magnetic core, converges along the first side 201 of the magnetic core at the first opening of the winding channel 24 (i.e., the first end of the second low-voltage winding TW12), passes through the winding channel 24 to the second end of the second low-voltage winding on the third side; then it travels along the third side 203 of the magnetic core towards the second side 202 and the fourth side 204 to reach the output positive terminal Vo+. This switch layout, combined with the winding method, allows the switches to be placed 360 degrees around the magnetic core 21, resulting in low parasitic resistance of the windings and the advantages of a large number of lower switches and low on-resistance.

[0083] The power conversion device disclosed in this embodiment can also adopt the assembly process shown in the previous embodiment to achieve the same technical effect.

[0084] The switching transistor disclosed in this invention can be a Si MOSFET, SiC MOSFET, GaN device, or IGBT, etc., all of which can realize the switching function disclosed in this invention.

[0085] The power conversion device described in the above embodiments can also be part of an electronic device, as long as it meets the technical features and benefits disclosed in this invention.

[0086] The terms "equal to," "identical to," or "equal to" disclosed in this invention must take into account the parameter distribution of the engineering process, with an error distribution within ±30%. "Parallel" is defined as the angle between two line segments or lines being less than or equal to 45 degrees. "Perpendicular" is defined as the angle between two line segments or lines being within the range of [60, 120] degrees. The definition of "phase misalignment" also needs to consider the parameter distribution of the engineering process, with an error distribution of the phase misalignment degree within ±30%.

[0087] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0088] The above description of the disclosed embodiments enables those skilled in the art to make or use the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A power conversion device, characterized in that, The system includes a switch, a magnetic core, a first substrate, and a second substrate. The magnetic core includes an upper magnetic cover, a lower magnetic cover, a first magnetic post, and a second magnetic post. The second substrate includes an upper surface and a lower surface opposite to each other, and a hole. The hole penetrates the upper surface and the lower surface of the second substrate and allows the first magnetic post and the second magnetic post to pass through, respectively. The upper magnetic cover and the lower magnetic cover are fastened to the upper surface and the lower surface of the second substrate, respectively. The first substrate includes a cutout portion, an opposing upper surface, and a lower surface; the lower surface of the first substrate is disposed adjacent to the upper surface of the second substrate; after the first substrate, the magnetic core, and the second substrate are assembled, the upper magnetic cover of the magnetic core is exposed on the upper surface of the first substrate. The switch is disposed on the upper surface of the first substrate.

2. The power conversion device according to claim 1, characterized in that, It also includes an input positive terminal, an output positive terminal, a ground terminal, an input capacitor, and an output capacitor, wherein the input positive terminal, the output positive terminal, the ground terminal, and the input capacitor are all disposed on the lower surface of the second substrate; the positive terminal of the input capacitor is electrically connected to the input positive terminal, and the negative terminal of the input capacitor is electrically connected to the output positive terminal.

3. The power conversion device according to claim 2, characterized in that, The switch includes an upper switch, a middle switch, and a lower switch, which are connected in series and then bridging the input positive terminal and the ground terminal.

4. The power conversion device according to claim 3, wherein the lower switch is further disposed on the lower surface of the second substrate, and the positions of the lower switch disposed on the lower surface of the second substrate and the lower switch disposed on the upper surface of the first substrate correspond one-to-one.

5. The power conversion device according to claim 4, characterized in that, The magnetic core includes opposing first and third sides, opposing second and fourth sides, and the channel between the first and second magnetic pillars is a winding channel that penetrates the first and third sides.

6. The power conversion device according to claim 3, characterized in that, The output capacitor is disposed on the upper surface of the first substrate and between the lower switch and the middle switch.

7. The power conversion device according to claim 5, characterized in that, The upper switch, middle switch, and lower switch are all located on the first side of the magnetic core, with the lower switch being adjacent to the first side of the magnetic core.

8. The power conversion device according to claim 7, characterized in that, The down switch includes two first down switches and two second down switches, the two second down switches being disposed adjacent to the winding channel and the second down switches being disposed between the two first down switches.

9. The power conversion device according to any one of claims 3, characterized in that, The lower surface of the first substrate is provided with an input positive terminal pad, and the drain of the upper switch is electrically connected to the input positive terminal pad through a via embedded in the first substrate; the upper surface of the second substrate is also provided with an input positive terminal pad, and the input positive terminal pads provided on the upper surface of the second substrate correspond one-to-one with the input positive terminal pads provided on the lower surface of the first substrate.

10. The power conversion device according to claim 5, characterized in that, The upper switch includes a first upper switch and a second upper switch; the middle switch includes a first middle switch and a second middle switch; the lower switch includes a first lower switch and a second lower switch; the first upper switch and the first middle switch are arranged along a first side adjacent to the magnetic core; the second upper switch and the second middle switch are arranged along a third side adjacent to the magnetic core; the first upper switch and the second upper switch are both arranged near a second side of the magnetic core, and the first middle switch and the second middle switch are both arranged near a fourth side of the magnetic core.

11. The power conversion device according to claim 10, characterized in that, A first lower switch and a second lower switch constitute a lower switch combination, the lower switch combination including a first lower switch combination and a second lower switch combination; the first lower switch combination is disposed along a second side adjacent to the magnetic core, and the second lower switch combination is disposed along a fourth side adjacent to the magnetic core; the first lower switch in each lower switch combination is disposed adjacent to a third side of the magnetic core, and the second lower switch in each lower switch combination is disposed adjacent to a first side of the magnetic core.

12. The power conversion device according to claim 11, characterized in that, The first and second magnetic pillars each include an inner side and an outer side; the second side of the magnetic core is adjacent to the outer side of the first magnetic pillar, and the fourth side of the magnetic core is adjacent to the outer side of the second magnetic pillar; the first lower switch assembly, the first magnetic pillar, the second magnetic pillar, and the second lower switch assembly are arranged in a line and are adjacent to each other in pairs.

13. The power conversion device according to claim 12, characterized in that, The output capacitors are respectively arranged adjacent to the sources of the first and second lower switch combinations; the output capacitors, the first lower switch combination, the first magnetic post, the second magnetic post, the second lower switch combination, and the output capacitors are arranged in a line and adjacent to each other.

14. The power conversion device according to claim 13, characterized in that, The lower surface of the second substrate is provided with a third lower switch assembly and a fourth lower switch assembly, which are respectively arranged perpendicularly to the first lower switch assembly and the second lower switch assembly.

15. The power conversion device according to claim 1 or 8, characterized in that, The cutout portion is a cutout groove provided on one side adjacent to the first substrate.

16. The power conversion device according to claim 1 or 14, characterized in that, The hollow portion is a hollow hole located near the center of the first substrate.

17. The power conversion device according to claim 2, characterized in that, It also includes a third substrate, which has an upper surface and a lower surface opposite to each other; the upper surface of the third substrate is disposed adjacent to the lower surface of the second substrate; the upper surface of the third substrate is provided with a pin pad, which is electrically connected to the input positive terminal, the output positive terminal and the ground terminal; the lower surface of the third substrate is provided with pins, which are used for electrical connection with external components.

18. An assembly process flow for a power conversion device according to claim 17, characterized in that, Includes the following steps: Step 1: Weld the components to the lower surface of the second substrate and assemble the magnetic core; simultaneously complete the assembly of the third substrate; and assemble all the components on the upper surface of the first substrate together using SMD assembly. Step 2: Assemble the second and third substrates assembled in Step 1 together using SMD; Step 3: Solder the components assembled in Step 2 and the first substrate assembly assembled in Step 1 together using SMD soldering.

19. A power conversion device, characterized in that, It includes input / output terminals, switches, output capacitors, and magnetic components; the input / output terminals include a positive input terminal, a positive output terminal, and a ground terminal, and the output capacitor is connected between the positive output terminal and the ground terminal; the switches include an upper switch, a middle switch, and a lower switch; the upper switch includes a first upper switch and a second upper switch; the middle switch includes a first middle switch and a second middle switch; the lower switch includes a first lower switch and a second lower switch; The first upper switch, the first middle switch, and the first lower switch form a first three-switch bridge arm. The first upper switch and the first middle switch are electrically connected to the first upper node, and the first middle switch and the first lower switch are electrically connected to the first lower node. The second upper switch, the second middle switch, and the second lower switch form a second three-switch bridge arm. The second upper switch and the second middle switch are electrically connected to the second upper node, and the second middle switch and the second lower switch are electrically connected to the second lower node. The magnetic component is electrically connected at least to the first lower node, the second lower node, and the output positive terminal. It also includes a first substrate, on which the upper switch, middle switch, lower switch and output capacitor are disposed; the output capacitor is disposed between the lower switch and the middle switch.

20. The power conversion device according to claim 19, characterized in that, The magnetic component includes a magnetic core and a winding; the magnetic core includes a first magnetic post and a second magnetic post, the channel between the first magnetic post and the second magnetic post is a winding channel, the winding channel penetrates the opposite sides of the magnetic core; the winding passes through the winding channel, and the lower switch is disposed adjacent to the winding channel.

21. The power conversion device according to claim 20, characterized in that, The magnetic core further includes an upper magnetic cover and a lower magnetic cover; the winding includes a first high-voltage winding, a second high-voltage winding, a first low-voltage winding, and a second low-voltage winding; each winding includes a first end and a second end; the second end of the first low-voltage winding and the second end of the second low-voltage winding are electrically connected.

22. The power conversion device according to claim 21, characterized in that, The second end of the first high-voltage winding is electrically connected to the first end of the second low-voltage winding; the second end of the second high-voltage winding is electrically connected to the first end of the first low-voltage winding.

23. The power conversion device according to claim 22, characterized in that, Each of the first high-voltage winding, the second high-voltage winding, the first low-voltage winding, and the second low-voltage winding is wound around the first magnetic post and the second magnetic post, and the winding direction on the first magnetic post is opposite to the winding direction on the second magnetic post; the first high-voltage winding and the second high-voltage winding are wound in opposite directions on the same magnetic post, and the first low-voltage winding and the second low-voltage winding are wound in opposite directions on the same magnetic post.

24. The power conversion device according to claim 19, characterized in that, The switch and the input / output terminals are located on different planes; the location of the positive input terminal corresponds one-to-one with the location of the upper switch; the location of the grounding terminal corresponds one-to-one with the location of the lower switch.

25. The power conversion device according to claim 19, characterized in that, It also includes an input capacitor, the location of which corresponds one-to-one with the location of the upper switch.

26. A magnetic component, characterized in that, The device includes a magnetic core, a first high-voltage winding, a second high-voltage winding, a first low-voltage winding, and a second low-voltage winding. Each winding includes a first end and a second end. The second end of the first low-voltage winding and the second end of the second low-voltage winding are electrically connected. The magnetic core includes an upper magnetic cover, a lower magnetic cover, a first magnetic post, and a second magnetic post. Each of the first high-voltage winding, the second high-voltage winding, the first low-voltage winding, and the second low-voltage winding is wound around the first magnetic post and the second magnetic post, and the winding direction on the first magnetic post is opposite to the winding direction on the second magnetic post. The first high-voltage winding and the second high-voltage winding are wound in opposite directions on the same magnetic post, and the first low-voltage winding and the second low-voltage winding are wound in opposite directions on the same magnetic post.

27. The magnetic component according to claim 26, characterized in that, The magnetic core includes opposing first and third sides, opposing second and fourth sides, and the channel between the first and second magnetic pillars is a winding channel that penetrates the first and third sides.

28. The magnetic component according to claim 27, characterized in that, The first and second ends of each winding are located adjacent to the same side of the magnetic core.

29. The magnetic component according to claim 28, characterized in that, The winding method of the first low-voltage winding from the first end to the second end is as follows: First, it is divided into two paths, which surround the magnetic core from both sides of the magnetic core respectively, from the first side of the magnetic core to the third side of the magnetic core, and then combined and passed through the winding channel from the third side of the magnetic core to the first side of the magnetic core.

30. The magnetic component according to claim 29, characterized in that, The second low-voltage winding is wound from the first end to the second end as follows: First, it passes through the winding channel from the first side of the magnetic core to the third side of the magnetic core, and then it is divided into two paths, which surround the magnetic core from both sides of the magnetic core and reach the first side of the magnetic core.

31. The magnetic component according to claim 30, characterized in that, The high-voltage winding and the low-voltage winding are disposed on the substrate. The winding method of the first high-voltage winding from the first end to the second end is as follows: First, on the first layer of the substrate, the winding passes through the winding channel from the first side of the magnetic core to the third side of the magnetic core, and then splits into two paths, which surround the magnetic core from both sides of the magnetic core respectively, and return to the first side of the magnetic core, and then reach the second layer of the substrate through the via; On the second layer, the winding passes through the winding channel from the first side of the magnetic core to the third side of the magnetic core, and then splits into two paths, which surround the magnetic core from both sides of the magnetic core respectively, and return to the first side of the magnetic core.

32. The magnetic component according to claim 31, characterized in that, The second high-voltage winding is wound from the first end to the second end as follows: First, on the third layer of the substrate, it is divided into two paths, which surround the magnetic core from both sides, from the first side of the magnetic core to the third side of the magnetic core, and then combined and passed through the winding channel from the third side of the magnetic core to the first side of the magnetic core, and then through the via to the fourth layer of the substrate; On the fourth layer, it is divided into two paths, which surround the magnetic core from both sides, from the first side of the magnetic core to the third side of the magnetic core, and then combined and passed through the winding channel from the third side of the magnetic core to the first side of the magnetic core.

33. The magnetic component according to claim 27, characterized in that, The first end of the first low-voltage winding is located on the second and fourth sides of the magnetic core; the second end of the first low-voltage winding is located on the second and fourth sides of the magnetic core; the first end of the second low-voltage winding is located on the second and fourth sides of the magnetic core; the second end of the second low-voltage winding is located on the second and fourth sides of the magnetic core.

34. The magnetic component according to claim 33, characterized in that, The first end of the first high-voltage winding is disposed adjacent to the winding channel on the first side of the magnetic core; the first end of the second high-voltage winding is disposed adjacent to the winding channel on the third side of the magnetic core; the second ends of the first high-voltage winding are disposed on the second and fourth sides adjacent to the magnetic core, respectively; the second ends of the second high-voltage winding are disposed on the second and fourth sides adjacent to the magnetic core, respectively.

35. The magnetic component according to claim 34, characterized in that, The winding method of the first low-voltage winding from the first end to the second end is as follows: from the second and fourth sides of the magnetic core, the windings converge at the third side opening of the winding channel along the third side of the magnetic core, pass through the winding channel to the first side; then they split into two paths along the first side of the magnetic core, reaching the second and fourth sides of the magnetic core respectively.

36. The magnetic component according to claim 35, characterized in that, The second low-voltage winding is wound from the first end to the second end as follows: from the second and fourth sides of the magnetic core, the windings converge at the opening of the first side of the winding channel along the first side of the magnetic core, pass through the winding channel to the third side; then, the windings split into two paths along the third side of the magnetic core, reaching the second and fourth sides of the magnetic core respectively.

37. The magnetic component according to claim 36, characterized in that, The winding method of the first high voltage winding from the first end to the second end is as follows: first, it passes through the winding channel from bottom to top, and then it is divided into two branches. One branch is wound counterclockwise around the first magnetic post at least once to reach the second side adjacent to the magnetic core; the other branch is wound clockwise around the second magnetic post at least once to reach the fourth side adjacent to the magnetic core.

38. The magnetic component according to claim 37, characterized in that, The second high-voltage winding is wound from the first end to the second end as follows: first, it passes through the winding channel from top to bottom, and then it is divided into two branches. One branch is wound clockwise around the first magnetic post at least once to reach the second side adjacent to the magnetic core; the other branch is wound counterclockwise around the second magnetic post at least once to reach the fourth side adjacent to the magnetic core.

39. The magnetic component according to claim 26, characterized in that, The second end of the first high-voltage winding is connected to the first end of the second low-voltage winding; the second end of the second high-voltage winding is connected to the first end of the first low-voltage winding.

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