Capacitor redundancy heat dissipation structure
By using a heat spreader and rotating plate in the capacitor, effective heat dissipation and automatic pressure relief are achieved, solving the problem of heat accumulation in the capacitor and improving heat dissipation performance and safety.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN QIANHAI YIYI TECHNOLOGY CO LTD
- Filing Date
- 2025-07-17
- Publication Date
- 2026-06-23
AI Technical Summary
During operation, the temperature rises due to heat accumulation in capacitors, leading to aging of the dielectric material, capacity decay, and potential explosion risk. Existing structures have insufficient heat dissipation performance.
The heat is evenly distributed using a first heat exchanger and a second heat exchanger. The heat is cooled by natural airflow through the rotation of the rotating plate. At the same time, the pressure is automatically released at high temperatures, forming a pressure relief channel.
It effectively dissipates heat, preventing capacitors from aging and bursting due to heat buildup, improving heat dissipation efficiency and ensuring safety.
Smart Images
Figure CN224400223U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to a redundant heat dissipation structure for capacitors, belonging to the field of capacitor technology. Background Technology
[0002] During operation, capacitors generate Joule heat due to dielectric loss and equivalent series resistance (ESR). If the heat accumulates, the temperature will rise sharply, which will lead to accelerated aging of the dielectric material (such as electrolyte drying and film carbonization), capacity decay, decreased insulation performance, and even explosion or fire due to thermal runaway.
[0003] Because the capacitor body adopts a closed-loop structure, its heat dissipation performance is significantly restricted: on the one hand, the heat exchange efficiency of the external heat dissipation mechanism is greatly reduced; on the other hand, its own structural characteristics also seriously hinder the effective dissipation of internal heat. This dual heat dissipation obstacle makes it very easy for the capacitor to accumulate heat during operation.
[0004] Therefore, it is urgent to improve the heat dissipation structure of the capacitor to solve the above-mentioned problems. Utility Model Content
[0005] The purpose of this invention is to provide a redundant heat dissipation structure for a capacitor. The first and second heat dissipation plates perform heat equalization treatment on the heat generated by the thin film capacitor, thereby absorbing and dissipating the heat generated by the thin film capacitor. At the same time, the rotating plates can be turned and opened, and then natural wind is used to cool the thin film capacitor.
[0006] To achieve the above objectives, the main technical solution adopted by this utility model includes: a capacitor redundant heat dissipation structure, including an upper top frame and a lower top frame, and a plurality of connecting frames fixedly disposed between the upper top frame and the lower top frame. The upper top frame, the lower top frame and the connecting frames form an outer frame, and a thin film capacitor is detachably connected to the inner side of the outer frame.
[0007] Each of the connecting frames is provided with a rotating plate that is rotatably connected to the upper top frame and the lower top frame. A second heat dissipation plate and a first heat dissipation plate are respectively provided on the inner side of the rotating plate and the inner side of the connecting frame. Both the second heat dissipation plate and the first heat dissipation plate are used for heat dissipation of the thin film capacitor.
[0008] Preferably, the upper and lower top covers, which are in contact with the inner side of the outer frame, are fixedly connected to the upper and lower ends of the thin film capacitor, respectively.
[0009] Preferably, the lower top cover is provided with a rotary locking mechanism on opposite sides, which is connected to the lower top frame.
[0010] Preferably, the rotary locking mechanism includes a connecting rod slidably connected to the lower top cover, a limiting top plate fixedly disposed at one end of the connecting rod, and a spring.
[0011] Preferably, the lower top cover has recycling cavities on both sides to allow the limiting top plate and the connecting rod to slide together, and the two ends of the spring are fixedly connected to the connecting rod and the inner wall of the recycling cavity, respectively.
[0012] Preferably, the inner wall of the lower top frame has two limiting grooves on opposite sides to allow the limiting top plate to slide and limit.
[0013] Preferably, the thickness of the limiting groove gradually increases from the outside to the inside, and the thickness of the limiting top plate at the end away from the connecting rod is greater than that at the other end.
[0014] Preferably, a support base is fixedly provided on the lower half of the inner side of the lower top frame. The support base is located below the limiting slide groove. The upper side of the support base is in contact with the bottom surface of the lower top cover, and the lower side of the support base is flush with the lower side of the lower top frame.
[0015] Preferably, a connecting shaft is fixedly provided on the lower side of the upper top frame and the upper side of the lower top frame, and connecting holes for rotatable connection with the connecting shaft are provided at both the upper and lower ends of the rotating plate.
[0016] Preferably, each of the connecting frames has a rotating cavity to allow the rotating plate to rotate.
[0017] This utility model has at least the following beneficial effects:
[0018] After connecting the film capacitor to the outer frame, the heat generated by the film capacitor can be uniformly heated by the first and second heat dissipation plates, thereby absorbing and dissipating the heat generated by the film capacitor. At the same time, the rotating plates can be turned and opened, and then the film capacitor can be cooled by natural wind.
[0019] Meanwhile, when the internal pressure of the film capacitor increases due to the rise in temperature, under normal operating conditions, the preset gap between the rotating plate and the connecting frame can slowly release the internal air pressure. When the pressure exceeds the safety threshold, the air pressure will directly act on the rotating plate, causing it to automatically open and form a pressure relief channel. Attached Figure Description
[0020] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings:
[0021] Figure 1This is a schematic diagram of the overall three-dimensional structure of a capacitor redundancy heat dissipation structure in an embodiment of the present utility model;
[0022] Figure 2 This is a schematic diagram showing the disassembled outer frame and rotating plate of a capacitor redundant heat dissipation structure according to an embodiment of this utility model.
[0023] Figure 3 This is a three-dimensional schematic diagram of the lower top frame of a capacitor redundant heat dissipation structure according to an embodiment of the present invention;
[0024] Figure 4 This is a schematic diagram showing the connection between the rotary lock mechanism and the lower top cover of a capacitor redundant heat dissipation structure in an embodiment of this utility model.
[0025] In the diagram, 1. Upper top frame; 2. Lower top frame; 3. Connecting frame; 4. Rotating plate; 5. Upper top cover; 6. Lower top cover; 7. Rotating cavity; 8. Connecting shaft; 9. First heat spreader; 10. Second heat spreader; 11. Connecting rotating hole; 12. Limiting slide groove; 13. Support base; 14. Thin film capacitor; 15. Recycling cavity; 16. Limiting top plate; 17. Connecting rod; 18. Spring. Detailed Implementation
[0026] The following will describe in detail the implementation of this application with reference to the accompanying drawings and embodiments, so that the implementation process of how this application uses technical means to solve technical problems and achieve technical effects can be fully understood and implemented accordingly.
[0027] Examples, such as Figures 1-4 As shown, a redundant heat dissipation structure for a capacitor includes an upper top frame 1, a lower top frame 2, and several connecting frames 3 fixedly disposed between the upper top frame 1 and the lower top frame 2. The upper top frame 1, the lower top frame 2, and the connecting frames 3 form an outer frame. A thin film capacitor 13 is detachably connected to the inner side of the outer frame. A rotating plate 4 is provided between each connecting frame 3 and is rotatably connected to the upper top frame 1 and the lower top frame 2. A second heat dissipation plate 9 and a first heat dissipation plate 8 are respectively provided on the inner side of the rotating plate 4 and the inner side of the connecting frame 3. The second heat dissipation plate 9 and the first heat dissipation plate 8 are both used for heat dissipation of the thin film capacitor 13. After the thin film capacitor 13 is connected to the outer frame, the heat generated by the thin film capacitor 13 can be uniformly heated by the first heat dissipation plate 8 and the second heat dissipation plate 9, thereby absorbing and dissipating the heat generated by the thin film capacitor 13. At the same time, the rotating plates 4 can be turned to open, and then the thin film capacitor 13 can be cooled by natural wind.
[0028] Meanwhile, when the internal pressure of the film capacitor 13 increases due to the rise in temperature, under normal operating conditions, the preset gap between the rotating plate 4 and the connecting frame 3 can slowly release the internal air pressure. When the pressure exceeds the safety threshold, the air pressure will directly act on the rotating plate 4, causing it to automatically open and form a pressure relief channel.
[0029] Furthermore, the upper and lower top covers 5 and 501, which are in contact with the inner side of the outer frame, are fixedly connected to the upper and lower ends of the film capacitor 13, respectively. The lower top cover 501 is provided with a rotary locking mechanism connected to the lower top frame 2 on both sides. The lower top cover 501 can be limited by the connection between the rotary locking mechanism and the lower top frame 2 to prevent the film capacitor 13 from separating from the outer frame during use.
[0030] Furthermore, the rotary locking mechanism includes a connecting rod 16 slidably connected to the lower top cover 501, a limiting top plate 15 fixedly installed at one end of the connecting rod 16, and a spring 17. The lower top cover 501 has a recovery cavity 14 on both sides to accommodate the limiting top plate 15 and the connecting rod 16 to slide. The two ends of the spring 17 are fixedly connected to the connecting rod 16 and the inner wall of the recovery cavity 14, respectively. The inner wall of the lower top frame 2 has two limiting grooves 11 on both sides to accommodate the sliding of the limiting top plate 15. When the film capacitor 13 is connected to the outer frame first, the operator can press the limiting top plate 15 so that the limiting top plate 15 can be retracted to the inner wall of the recovery cavity 14. During the sliding process of the film capacitor 13 and the outer frame, the two connecting frames 3 can continuously push the limiting top plate 15 to prevent the limiting top plate 15 from being pushed out during the sliding process, causing the sliding to jam.
[0031] After the top cover 501 is connected to the lower top frame 2, the operator can rotate the film capacitor 13 so that the limiting top plate 15 can slide into the limiting slide groove 11. Then, the spring 17 is used to make the limiting top plate 15 abut against the inner wall of the limiting slide groove 11. Due to the pushing action of the spring 17 on the limiting top plate 15, the stability of the connection between the film capacitor 13 and the outer frame can be guaranteed without human intervention.
[0032] Furthermore, the thickness of the limiting slide groove 11 gradually increases from the outside to the inside, and the thickness of the limiting top plate 15 at the end away from the connecting rod 16 is greater than that at the other end. Since the thickness of the limiting slide groove 11 gradually increases from the outside to the inside, one side of the limiting slide groove 11 has a slope for movement, which can prevent the film capacitor 13 from still sliding vertically with the outer frame after the limiting top plate 15 is slidably connected with the limiting slide groove 11. The thickness change of the limiting top plate 15 is the same as that of the limiting slide groove 11, so it can be used in conjunction with the limiting slide groove 11.
[0033] It should be noted that the two limiting grooves 11 have opposite slopes, so they can slide with the two limiting top plates 15 facing opposite directions.
[0034] Furthermore, a support base 12 is fixedly installed on the lower half of the inner side of the lower top frame 2. The support base 12 is located below the limiting slide groove 11. The upper side of the support base 12 contacts the bottom surface of the lower top cover 501, and the lower side of the support base 12 is flush with the lower side of the lower top frame 2. When the film capacitor 13 is slidably connected to the outer frame, the support base 12 can support the lower top cover 501 to prevent the film capacitor 13 from sliding excessively. During this process, the upper side of the upper top cover 5 is flush with the upper side of the upper top frame 1.
[0035] A connecting shaft 7 is fixedly installed on the lower side of the upper top frame 1 and the upper side of the lower top frame 2. The upper and lower ends of the rotating plate 4 are provided with connecting rotating holes 10 that are rotatably connected to the connecting shaft 7. A rotating cavity 6 is provided between each connecting frame 3 to allow the rotating plate 4 to rotate. The rotating plate 4 can rotate with the upper top frame 1 and the lower top frame 2 through the connecting shaft 7, thereby achieving the above-mentioned explosion-proof and heat dissipation effects. At the same time, it can increase the damping force between the rotating plate 4 and the connecting shaft 7, and prevent the rotating plate 4 from rotating randomly in the rotating cavity 6.
[0036] In this embodiment, as Figures 1-4 As shown, the principle of a capacitor redundancy heat dissipation structure provided in this embodiment is as follows:
[0037] After the film capacitor 13 is connected to the outer frame, the heat generated by the film capacitor 13 can be uniformly heated by the first heat dissipation plate 8 and the second heat dissipation plate 9, so that the heat generated by the film capacitor 13 can be absorbed and then dissipated. At the same time, the rotating plate 4 can be turned so that multiple rotating plates 4 can be rotated and opened, and then the film capacitor 13 can be cooled by natural wind.
[0038] Meanwhile, when the internal pressure of the film capacitor 13 increases due to the rise in temperature, under normal operating conditions, the preset gap between the rotating plate 4 and the connecting frame 3 can slowly release the internal air pressure. When the pressure exceeds the safety threshold, the air pressure will directly act on the rotating plate 4, causing it to automatically open and form a pressure relief channel.
[0039] If certain terms are used in the specification and claims to refer to specific components, those skilled in the art will understand that hardware manufacturers may use different names to refer to the same component. This specification and claims do not distinguish components based on differences in name, but rather on differences in function. The term "comprising" as used throughout the specification and claims is an open-ended term and should be interpreted as "comprising but not limited to." "Approximately" means that within an acceptable margin of error, those skilled in the art can solve the technical problem and substantially achieve the technical effect within a certain margin of error.
[0040] It should be noted that the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a product or system comprising a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a product or system. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the product or system that includes that element.
[0041] The foregoing description illustrates and describes several preferred embodiments of the present invention. However, as previously stated, it should be understood that the present invention is not limited to the forms disclosed herein and should not be construed as excluding other embodiments. It can be used in various other combinations, modifications, and environments, and can be altered within the scope of the inventive concept described herein through the foregoing teachings or techniques or knowledge in related fields. Any modifications and variations made by those skilled in the art that do not depart from the spirit and scope of the present invention should be within the protection scope of the appended claims.
Claims
1. A capacitor redundant heat dissipation structure, comprising an upper top frame (1) and a lower top frame (2) and a plurality of connecting frames (3) fixedly disposed between the upper top frame (1) and the lower top frame (2), wherein the upper top frame (1), the lower top frame (2) and the connecting frames (3) constitute an outer frame, characterized in that: A thin film capacitor (13) is detachably connected to the inner side of the outer frame. Each of the connecting frames (3) is provided with a rotating plate (4) that is rotatably connected to the upper top frame (1) and the lower top frame (2). The inner side of the rotating plate (4) and the inner side of the connecting frame (3) are respectively provided with a second heat dissipation plate (9) and a first heat dissipation plate (8). The second heat dissipation plate (9) and the first heat dissipation plate (8) are both used for heat dissipation of the thin film capacitor (13).
2. The capacitor redundancy heat dissipation structure according to claim 1, characterized in that: The upper and lower caps (501) of the thin film capacitor (13) are fixedly connected to the upper and lower ends, respectively, and are in contact with the inner side of the outer frame.
3. The capacitor redundancy heat dissipation structure according to claim 2, characterized in that: The lower top cover (501) is provided with a rotary locking mechanism on both sides of the lower top frame (2) for connection.
4. The capacitor redundancy heat dissipation structure according to claim 3, characterized in that: The rotary locking mechanism includes a connecting rod (16) that is slidably connected to the lower top cover (501), a limiting top plate (15) fixedly disposed at one end of the connecting rod (16), and a spring (17).
5. The capacitor redundancy heat dissipation structure according to claim 4, characterized in that: The lower top cover (501) has a recycling cavity (14) on each of its opposite sides, which accommodates the limiting top plate (15) and the connecting rod (16) to slide together. The two ends of the spring (17) are fixedly connected to the connecting rod (16) and the inner wall of the recycling cavity (14), respectively.
6. The capacitor redundant heat dissipation structure according to claim 5, characterized in that: The inner wall of the lower top frame (2) has two limiting grooves (11) on opposite sides to allow the limiting top plate (15) to slide and limit.
7. A capacitor redundant heat dissipation structure according to claim 6, characterized in that: The thickness of the limiting groove (11) gradually increases from the outside to the inside, and the thickness of the limiting top plate (15) at the end away from the connecting rod (16) is greater than that at the other end.
8. A capacitor redundancy heat dissipation structure according to claim 7, characterized in that: The lower half of the inner side of the lower top frame (2) is fixedly provided with a support base (12). The support base (12) is located below the limiting slide groove (11). The upper side of the support base (12) is in contact with the bottom surface of the lower top cover (501). The lower side of the support base (12) is flush with the lower side of the lower top frame (2).
9. A capacitor redundancy heat dissipation structure according to claim 1, characterized in that: The lower side of the upper top frame (1) and the upper side of the lower top frame (2) are both fixedly provided with connecting shafts (7), and the upper and lower ends of the rotating plate (4) are provided with connecting holes (10) that are rotatably connected to the connecting shafts (7).
10. A capacitor redundancy heat dissipation structure according to claim 1, characterized in that: Each of the connecting frames (3) has a rotating cavity (6) for the rotating plate (4) to rotate.