Waste disposal process and processing equipment of flexible die-cutting circuit board integrated with IC

Abstract

This invention discloses a waste removal process and processing equipment for FDC flexible die-cut circuit boards with integrated circuits (ICs), relating to the field of flexible circuit board processing technology. The waste removal process for FDC flexible die-cut circuit boards with integrated circuits includes the following steps: pressing and die-cutting the non-release surfaces of the bottom protective film and release film, forming a masking area on the bottom protective film; pressing a conductive layer onto one side of the release surface of the release film; die-cutting the pressed conductive layer, forming filaments with and without starting points at the corresponding masking area; pressing a waste removal film onto the surface of the conductive layer, causing the waste removal film to adhere to the waste material after die-cutting the conductive layer; separating and discharging the waste removal film from the conductive layer, with waste material adhering to the film, wherein the waste material includes waste sheets and filaments without starting points, and the waste sheets in the masking area will carry away the filaments without starting points in the reverse direction. This invention's waste removal process for FDC flexible die-cut circuit boards with integrated circuits can expand the die-cutting process and adapt to integrated IC chips.

Description

Technical Field

[0001] This invention relates to the field of flexible circuit board processing technology, and in particular to a waste removal process and processing equipment for an integrated IC FDC flexible die-cut circuit board. Background Technology

[0002] Flexible die-cut circuit boards (FDC) are widely used in consumer electronics, new energy vehicles, and smart wearable devices due to their advantages such as thinness, flexibility, and spatial adaptability. Die-cutting is one of the core processes in the manufacturing of FDC flexible die-cut circuit boards. In this process, the conductive layer needs to be die-cut into preset functional circuits, and waste material from non-functional areas needs to be removed to ensure the insulation performance between circuits and the reliability of the product.

[0003] Traditional FDC flexible die-cut circuit board waste removal processes typically involve directly adhering a waste removal film to the edge of the waste material, and then removing the waste by peeling off the film. The effectiveness of this process heavily relies on the waste area having a starting point (i.e., a free edge) for the waste film to adhere to. However, as the graphic structures of FDC flexible die-cut circuit boards become increasingly complex, waste filaments without starting points often form after die-cutting. These filaments are either completely surrounded by functional circuitry, form long, closed loops, or are embedded within the circuit pattern, all connected to the substrate or functional circuitry on all sides, lacking any free edge that can serve as an initial peeling point.

[0004] Regarding the removal of the aforementioned waste filaments without a starting point, if a waste removal film is directly used for adhesion and peeling, the lack of a stable starting point of tension makes it difficult for the waste removal film to form a uniform adhesion force on the waste filaments without a starting point. This easily leads to the waste filaments breaking and remaining on the product surface. The residual waste can cause short circuits and seriously reduce product yield. If manual waste removal is used, it will not only significantly increase labor costs and reduce production efficiency, but it is also easy to damage the surrounding functional circuits during the operation. The existing solutions cannot meet the mass production requirements of FDC flexible die-cut circuit boards with high-precision integrated ICs.

[0005] Therefore, how to provide a waste removal process for FDC flexible die-cut circuit boards of integrated ICs that can efficiently and thoroughly remove waste filaments from areas without starting points has become a technical problem that urgently needs to be solved in this field. Summary of the Invention

[0006] The main objective of this invention is to propose a waste removal process for FDC flexible die-cut circuit boards with integrated ICs and a processing equipment for FDC flexible die-cut circuit boards with integrated ICs, aiming to solve at least one technical problem mentioned in the background art.

[0007] To achieve the above objectives, the present invention proposes a waste removal process for FDC flexible die-cut circuit boards with integrated ICs. The waste removal process for FDC flexible die-cut circuit boards with integrated ICs includes the following steps: The non-release surfaces of the bottom protective film and the release film are pressed and die-cut, and an adhesive masking area is formed on the bottom protective film; The conductive layer is laminated onto one side of the release surface of the release film; The conductive layer after lamination is die-cut, and the die-cut conductive layer forms a waste sheet at the corresponding masking area. The waste sheet is connected with a waste wire without a starting end. The waste discharge membrane is pressed onto the surface of the conductive layer, so that the waste discharge membrane adheres to the waste material after die-cutting the conductive layer. The waste discharge membrane is made of a stretchable material. The waste discharge membrane is separated from the conductive layer and discharged. Waste material is adhered to the waste discharge membrane, including the waste sheet and the unstarted waste filament. The waste sheet in the masking area will carry away the unstarted waste filament in the opposite direction. During the process of separating and discharging the waste discharge membrane from the conductive layer, the angle between the waste discharge membrane and the bottom protective film is in the range of 34.2°-36.1°.

[0008] In one embodiment, the step of "pressing and die-cutting the non-release surfaces of the bottom protective film and the release film, and forming an adhesive masking area on the bottom protective film" includes the following steps: The non-release surfaces of the bottom protective film and the release film are pressed and die-cut, and the pressed release film is then die-cut. Waste is removed from the die-cut release film, and the adhesive masking area is formed on the bottom protective film after waste removal.

[0009] In one embodiment, the masking area is formed by the release film pressed onto the bottom protective film.

[0010] In one embodiment, the adhesion between the waste discharge membrane and the conductive layer is less than the adhesion between the bottom protective membrane and the conductive layer.

[0011] In one embodiment, the unidirectional length of the unstarted waste filament is less than 20 mm.

[0012] In one embodiment, the length of the waste sheet is greater than 25 mm, and the width of the waste sheet is more than three times the width of the unstarted waste filament.

[0013] In one embodiment, the waste material further includes forward waste filaments, which are connected to opposite sides of the waste sheet, respectively, along with the non-starting waste filaments.

[0014] In one embodiment, waste discharge through the waste discharge membrane includes forward waste discharge and reverse waste discharge, wherein the direction of forward waste discharge is opposite to the direction of travel of the waste discharge membrane.

[0015] In one embodiment, the adhesiveness of the bottom protective film is in the range of 650g / 25mm to 750g / 25mm.

[0016] In one embodiment, the thickness of the bottom protective film is 60 μm-120 μm; and / or, The thickness of the release film is 20μm-50μm; and / or, The thickness of the waste discharge membrane is 50μm-100μm.

[0017] This invention also proposes a processing equipment for an integrated IC FDC flexible die-cut circuit board, the processing equipment including a waste removal process for the integrated IC FDC flexible die-cut circuit board. The waste removal process for the integrated IC FDC flexible die-cut circuit board includes the following steps: The non-release surfaces of the bottom protective film and the release film are pressed and die-cut, and an adhesive masking area is formed on the bottom protective film; The conductive layer is laminated onto one side of the release surface of the release film; The conductive layer after lamination is die-cut, and the die-cut conductive layer forms a waste sheet at the corresponding masking area. The waste sheet is connected with a waste wire without a starting end. The waste discharge membrane is pressed onto the surface of the conductive layer, so that the waste discharge membrane adheres to the waste material after die-cutting the conductive layer. The waste discharge membrane is made of a stretchable material. The waste discharge membrane is separated from the conductive layer and discharged. Waste material is adhered to the waste discharge membrane, including the waste sheet and the unstarted waste filament. The waste sheet in the masking area will carry away the unstarted waste filament in the opposite direction. During the process of separating and discharging the waste discharge membrane from the conductive layer, the angle between the waste discharge membrane and the bottom protective film is in the range of 34.2°-36.1°.

[0018] The technical solution of this invention employs a masking area formed on the bottom protective film. This masking area defines the forming position of subsequent waste sheets, preventing excessive adhesion between the waste sheets and the bottom protective film. This ensures that during waste removal, because the waste removal film is tightly adhered to the waste sheets, the waste sheets are first peeled off when the film is pulled. The tension generated by the waste sheets then pulls the connected, unstarted waste filaments in the opposite direction. Ultimately, both the waste sheets and the unstarted waste filaments are discharged with the waste removal film, while the effective circuitry remains on the bottom protective film. Compared to traditional waste removal processes, this further improves product yield and waste removal efficiency. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0020] Figure 1 A flowchart of an embodiment of the waste removal process for the FDC flexible die-cut circuit board of integrated IC provided by the present invention; Figure 2 for Figure 1 Further flowchart of the process; Figure 3 A schematic diagram of the waste removal process for the FDC flexible die-cut circuit board of integrated IC provided by the present invention; Figure 4 for Figure 3 A magnified view of a section at point A in the middle; Figure 5 for Figure 4 A color-coded structural diagram corresponding to the middle structure; Figure 6 This is a schematic diagram of the conductive layer side after the waste discharge membrane is separated from the conductive layer. Figure 7 A schematic diagram of the colored structure on the waste discharge membrane side after separation from the conductive layer; Figure 8 These are the adhesion test data for the bottom protective film in this invention.

[0021] Explanation of icon numbers: 1. Bottom protective film; 2. Release film; 21. Masking area; 3. Conductive layer; 31. Molding material; 32. Waste material; 321. Waste sheet; 322. No-start waste filament; 323. Forward waste filament; 4. Waste discharge film.

[0022] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0023] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0024] It should be noted that if the embodiments of the present invention involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indicators will also change accordingly.

[0025] Furthermore, if the embodiments of this invention involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the use of "and / or" or "and / or" throughout the text includes three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this invention.

[0026] Flexible die-cut circuit boards (FDC) are widely used in consumer electronics, new energy vehicles, and smart wearable devices due to their advantages such as thinness, flexibility, and spatial adaptability. Die-cutting is one of the core processes in the manufacturing of FDC flexible die-cut circuit boards. In this process, the conductive layer needs to be die-cut into preset functional circuits, and waste material from non-functional areas needs to be removed to ensure the insulation performance between circuits and the reliability of the product.

[0027] Traditional FDC flexible die-cut circuit board waste removal processes typically involve directly adhering a waste removal film to the edge of the waste material, and then removing the waste by peeling off the film. The effectiveness of this process heavily relies on the waste area having a starting point (i.e., a free edge) for the waste film to adhere to. However, as the graphic structures of FDC flexible die-cut circuit boards become increasingly complex, waste filaments without starting points often form after die-cutting. These filaments are either completely surrounded by functional circuitry, form long, closed loops, or are embedded within the circuit pattern, all connected to the substrate or functional circuitry on all sides, lacking any free edge that can serve as an initial peeling point.

[0028] Regarding the removal of the aforementioned waste filaments without a starting point, if a waste removal film is directly used for adhesion and peeling, the lack of a stable starting point of tension makes it difficult for the waste removal film to form a uniform adhesion force on the waste filaments without a starting point. This easily leads to the waste filaments breaking and remaining on the product surface. The residual waste can cause short circuits and seriously reduce product yield. If manual waste removal is used, it will not only significantly increase labor costs and reduce production efficiency, but it is also easy to damage the surrounding functional circuits during the operation. The existing solutions cannot meet the mass production requirements of FDC flexible die-cut circuit boards with high-precision integrated ICs.

[0029] Therefore, how to provide a waste removal process for FDC flexible die-cut circuit boards of integrated ICs that can efficiently and thoroughly remove waste filaments from areas without starting points has become a technical problem that urgently needs to be solved in this field.

[0030] This invention proposes a waste removal process for FDC flexible die-cut circuit boards with integrated ICs, which can solve at least one of the aforementioned technical problems.

[0031] Please see Figure 1 , Figure 5 and Figure 7 In one embodiment of the present invention, the waste removal process of the FDC flexible die-cut circuit board of the integrated IC includes the following steps: S1. Press and die-cut the non-release surfaces of the bottom protective film 1 and the release film 2, and form a masking area 21 on the bottom protective film 1.

[0032] Specifically, a bottom protective film 1 made of PET material with a thickness of 80μm and a PET release film 2 with a thickness of 30μm can be selected. Both are placed in a pressing device and pressed under a pressing pressure of 0.4MPa and a pressing speed of 2.5m~4.5m / min. Alternatively, hot pressing can be used for pressing. Next, by die-cutting or coating masking, a masking area 21 matching the subsequent waste sheet 321 is formed on the surface of the bottom protective film 1. The function of the masking area 21 is to limit the forming position of the subsequent waste sheet 321 and prevent the waste sheet 321 from being excessively adhered to the bottom protective film 1.

[0033] S2. Press the conductive layer 3 onto the release surface of the release film 2.

[0034] Specifically, a conductive layer 3 with a thickness of 18μm to 75μm can be selected and pressed onto one side of the release surface of the release film 2. The pressing parameters are the same as in step S1 to ensure that the conductive layer 3 and the release film 2 are tightly bonded and free of air bubbles. At this time, the conductive layer 3 covers the masking area 21 and the surrounding effective circuit area. The conductive layer 3 can be a copper layer, an aluminum layer, or other materials, and there is no specific limitation on this.

[0035] S3. The conductive layer 3 after pressing is die-cut. The die-cut conductive layer 3 forms a waste sheet 321 at the corresponding masking area 21. The waste sheet 321 is connected with a waste wire 322 without a starting end.

[0036] Specifically, a rotary die-cutting machine is used to die-cut the pressed conductive layer 3. The die-cutting depth is controlled to completely cut off the conductive layer 3 while avoiding the adhesive-masking area 21 of the release film 2. After die-cutting, the conductive layer 3 corresponding to the adhesive-masking area 21 forms a waste sheet 321. This waste sheet 321 is integrally connected with several unstarted waste wires 322 surrounded by effective circuits. It should be noted that after the conductive layer 3 is die-cut with a rotary die, the die-cut conductive layer 3 includes a molded material 31 and waste material 32. The molded material 31 is the actual product after die-cutting, and the waste material 32 includes the connected waste sheet 321, the unstarted waste wires 322, and the forward waste wires 323 (details can be found below). Waste 32 refers to the part that is not needed in the actual product, that is, the waste 32 needs to be discharged through the waste discharge membrane 4. Among them, the waste filament 322 without starting head refers to the filament-like waste 32 that is completely surrounded by effective lines, embedded in the pattern, or in the form of a thin closed loop, and is connected to the substrate or other structures on all sides, without any free edges for the waste discharge membrane 4 to start adhering to.

[0037] S4. Press the waste discharge membrane 4 onto the surface of the conductive layer 3, so that the waste discharge membrane 4 adheres to the waste material 32 after die-cutting of the conductive layer 3. The waste discharge membrane 4 is made of a stretchable material, and the stretch rate of the waste discharge membrane 4 is 220%~360%.

[0038] Specifically, the waste discharge membrane 4 can be made of stretchable PE material or other stretchable materials, without any specific limitation. It is pressed onto the surface of the conductive layer 3 to ensure that the waste discharge membrane 4 is tightly bonded to the waste sheet 321 and the unstarted waste filament 322.

[0039] Furthermore, a waste removal membrane 4 with an elongation rate in the range of 220% to 360% can be selected. The waste removal membrane 4 has good flexibility and elongation. In step S5, "separating and discharging the waste removal membrane 4 from the conductive layer 3, with waste material 32 adhering to the waste removal membrane 4, wherein the waste material 32 includes waste sheet 321 and unstarted waste filament 322, and the waste sheet 321 in the masking area 21 will carry away the unstarted waste filament 322 in the opposite direction", the waste removal membrane 4 can adaptively deform with the peeling angle during peeling. The stretchable waste removal membrane 4 can evenly distribute the tensile force during peeling, avoiding local stress concentration that could cause the unstarted waste filament 32 to break. At the same time, if the waste removal membrane 4 is made of PE material, PE material has good weather resistance and is not prone to aging in continuous production, making it suitable for high-speed production lines.

[0040] The aforementioned waste removal membrane 4, with a stretching rate ranging from 220% to 360%, was selected. To comprehensively quantify the impact of the stretching rate of the waste removal membrane 4 on the waste removal efficiency of the die-cut waste 32, this embodiment systematically tested the complete fluctuation range of the stretching rate from 180% to 400%, generating a total of 23 sets of experimental data. During the experiment, other process parameters were strictly kept constant to ensure that the independent influence of the stretching rate could be accurately evaluated. Based on data trend analysis, 220%–360% was determined to be the optimal range for waste removal efficiency (waste removal success rate ≥80%, waste residue rate ≤20%), with 300% being the optimal stretching rate (waste removal success rate 99%, waste residue rate 1%). The following is the complete experimental data table and key analysis:

[0041] As can be seen from the table above, when the stretch ratio of the waste removal membrane is too low (below 220%), the membrane surface tension is severely insufficient, and the waste material accumulates at the die-cutting edge and cannot be removed (e.g., a residual rate of 25% at 180%), resulting in a waste removal success rate of only 75%–78%. When the stretch ratio of the waste removal membrane is too high (above 360%), the membrane is overstretched, leading to elasticity failure, waste material rebounds, or the waste removal membrane tears (e.g., a residual rate of 15% at 400%), causing the waste removal success rate to drop to 85%–92%.

[0042] When the stretching ratio of the waste discharge membrane is within the range of 220% to 360%, the membrane tension and waste separation path are dynamically matched, significantly improving waste discharge efficiency. Specifically, when the stretching ratio of the waste discharge membrane is within the range of 220% to 290%, the success rate steadily increases from 80% to 94%, and the waste residue rate decreases from 20% to 6%. When the stretching ratio of the waste discharge membrane is 300%, the peak success rate is 99%, and the lowest residue rate is 1%. At this point, the membrane tension ensures that the force direction of the waste is aligned with the tangent of the membrane surface, completely eliminating adhesion. When the stretching ratio of the waste discharge membrane is within the range of 310% to 360%, the success rate slightly decreases from 98% to 93%, and the residue rate increases from 2% to 7%, but it is still within the optimal range.

[0043] Therefore, when the stretching of the waste discharge membrane is in the range of 220% to 360%, the waste discharge efficiency is ≥80% and the waste residue rate is ≤20%. Among them, the preferred stretching range of the waste discharge membrane is 290% to 350%, in which the waste discharge efficiency is ≥94% and the waste residue rate is ≤6%.

[0044] S5. The waste discharge membrane 4 is separated from the conductive layer 3 and discharged. Waste material 32 is adhered to the waste discharge membrane 4. The waste material 32 includes waste sheet 321 and unstarted waste filament 322. The waste sheet 321 in the masking area 21 will carry away the unstarted waste filament 322 in the opposite direction. During the process of separating the waste discharge membrane 4 from the conductive layer 3 and discharging it, the angle between the waste discharge membrane 4 and the bottom protective film 1 is in the range of 34.2°-36.1°.

[0045] Specifically, since the waste discharge membrane 4 is tightly bonded to the waste sheet 321, when the waste discharge membrane 4 is pulled, the waste sheet 321 is first peeled off. The pulling force generated by the waste sheet 321 will reverse and drive the startless waste filament 322 connected to it. Finally, the waste sheet 321 and the startless waste filament 322 are discharged with the waste discharge membrane 4, while the effective circuit remains on the bottom protective membrane 1.

[0046] To determine the effect of the waste discharge angle on waste discharge efficiency and waste residue, this embodiment designed multiple sets of comparative experiments, selecting 9 different waste discharge angles (32.8° - 37.3°) for testing, and recording the waste discharge success rate and waste residue rate at each angle. The specific results are shown in the table below.

[0047]

[0048] In the experiment, the waste discharge angles were set sequentially to 32.8° (number 1), 33.4° (number 2), 34.2° (number 3), 34.8° (number 4), 35.0° (number 5), 35.5° (number 6), 36.1° (number 7), 36.8° (number 8), and 37.3° (number 9), covering the target angle range (34.2° - 36.1°) and its adjacent intervals, to compare and analyze the impact of waste discharge angles on performance.

[0049] The experimental results in the table above show that within the waste discharge angle range of 34.2°-36.1° (corresponding to numbers 3, 4, 5, 6, and 7), the waste discharge success rate is higher than 98.5%, and the waste residue rate is no higher than 0.7%, demonstrating significantly better overall performance than other angle groups. Specifically, 35.0° is the optimal angle, achieving the best balance between waste discharge success rate and waste residue rate. The range of 34.2°-36.1° balances the tolerance space for parameter adjustment with the stability of the waste discharge effect, verifying the preferred scheme of controlling the waste discharge angle within the range of 34.2°-36.1° in this application, which can effectively improve waste discharge efficiency and reduce waste residue. Furthermore, when the angle is lower than 34.2° or higher than 36.1°, the waste discharge efficiency decreases significantly, and the waste residue rate increases.

[0050] In summary, a waste removal angle within the range of 34.2° - 36.1° ensures both a high waste removal success rate and minimizes waste residue. At this angle, the angle between the pulling direction of the waste removal membrane 4 on the waste sheet 321 and the extension direction of the unstarted waste filaments 32 is optimal. Furthermore, at a peeling angle of 34.2°-36.1°, the vertical component of the pulling force effectively overcomes the adhesion between the waste filaments 32 and the release film 2, while the horizontal component does not cause lateral pulling on the effective lines, minimizing the probability of breakage of the unstarted waste filaments 32 and further improving the waste removal success rate. Compared to angles that are too large or too small, this effectively reduces the probability of breakage of the unstarted waste filaments 32. Exemplary peeling angles can also be 34.3°, 34.5°, 35°, 35.5°, and 35.6°. A preferred angle is 35°.

[0051] The above steps fundamentally solve the industry pain point that the lead-free waste filaments 322 cannot be directly adhered to by the waste removal membrane 4. It eliminates the need for manual assistance in removing the lead-free waste filaments 32, increasing the automation rate of the waste removal process to 100% and significantly improving the production efficiency of a single production line. Simultaneously, the pulling force of the waste sheet 321 reverses the process to peel off the lead-free waste filaments 32, avoiding the breakage and residue problems caused by directly pulling the lead-free waste filaments 322 in traditional processes. This effectively prevents short circuits caused by residual waste filaments 32, further improving product yield. Furthermore, this process does not require additional complex equipment such as laser ablation; it can be achieved simply by adjusting the die-cutting and pressing steps. It has strong compatibility with existing FDC flexible die-cut circuit board production lines for integrated ICs, reducing equipment modification costs. During the waste removal process, this process will not cause scratching or pulling damage to the effective circuitry, further ensuring the integrity and conductivity of the circuitry, and is suitable for the production needs of high-density, miniaturized FDC circuit boards.

[0052] The technical solution of this invention employs a masking area 21 formed on the bottom protective film 1. This masking area 21 defines the forming position of the subsequent waste sheet 321, preventing excessive adhesion between the waste sheet 321 and the bottom protective film 1. This ensures that during waste removal, because the waste removal film 4 is tightly adhered to the waste sheet 321, the waste sheet 321 is first peeled off when the waste removal film 4 is pulled. The pulling force generated by the waste sheet 321 will then reversely drive the connected lead-free waste filament 322. Ultimately, both the waste sheet 321 and the lead-free waste filament 322 are discharged along with the waste removal film 4, while the effective circuit remains on the bottom protective film 1. Compared to traditional waste removal processes, this further improves product yield and waste removal efficiency.

[0053] Please see Figure 2 and Figure 6 In one embodiment, step S1, "pressing and die-cutting the non-release surfaces of the bottom protective film 1 and the release film 2, and forming an adhesive masking area 21 on the bottom protective film 1," includes the following steps: S11. Press and die-cut the non-release surfaces of the bottom protective film 1 and the release film 2, and then die-cut the pressed release film 2.

[0054] Specifically, after pressing the bottom protective film 1 and the release film 2 together, a circular cutter can be used to die-cut the release film 2. The die-cutting depth is such that the release film 2 is cut off without damaging the bottom protective film 1, and the die-cutting trajectory is consistent with the contour of the preset masking area 21.

[0055] S12. Remove waste from the die-cut release film 2. After waste removal, an adhesive masking area 21 is formed on the bottom protective film 1.

[0056] Specifically, excess release film 2 after die-cutting can be peeled off and discharged using waste removal tape. The area of ​​release film 2 remaining on the bottom protective film 1 at this time is the masking area 21. By precisely die-cutting the release film 2 to form the masking area 21, compared with the coating masking method, the contour accuracy of the masking area 21 is higher, and the error can be controlled within ±0.1mm, ensuring the accurate forming position of the subsequent waste sheet 321 and avoiding interference with the effective circuit. Furthermore, the size and shape of the masking area 21 can be flexibly adjusted by changing the die, adapting to the waste removal requirements of FDC circuit boards with different structures, significantly improving the flexibility and versatility of the process.

[0057] Please see Figure 6 In one embodiment, the masking area 21 is formed by a release film 2 pressed onto the bottom protective film 1.

[0058] Specifically, in step S12, "waste removal is performed on the die-cut release film 2, and an adhesive masking area 21 is formed on the bottom protective film 1 after waste removal," the unpeeled release film 2 remains on the surface of the bottom protective film 1, and this retained release film 2 constitutes the adhesive masking area 21; in the subsequent step S2, "the conductive layer 3 is pressed onto the release surface side of the release film 2," the conductive layer 3 is pressed onto the surface of the release film 2 (adhesive masking area 21). The release film 2 itself is not adhesive, which can significantly reduce the isolation adhesion between the conductive layer 3 and the bottom protective film 1. The release film 2 in the adhesive masking area 21 can reduce the direct adhesion between the conductive layer 3 and the bottom protective film 1, providing assistance for the subsequent peeling of the waste sheet 321, and preventing the waste sheet 321 from being unable to be pulled by the waste removal film 4 due to excessive adhesion to the bottom protective film 1.

[0059] In one embodiment, the adhesion between the conductive layer 3 and the bottom protective film 1 is greater than the adhesion between the conductive layer 3 and the release film 2.

[0060] Specifically, a bottom protective film 1 with an adhesion of 200g / inch and a release film 2 with a basis weight of 5g-8g / 25mm can be selected and pressed together. After die-cutting, the conductive layer 3 of the effective circuit area is directly bonded to the bottom protective film 1, and the waste sheet 321 is bonded to the release film 2. Since the conductive layer 3 has a stronger adhesion to the bottom protective film 1, in step S5, "the waste discharge film 4 is separated from the conductive layer 3 and discharged, and the waste discharge film 4 is adhered to the waste 32, wherein the waste 32 includes waste sheet 321 and no-start waste filament 322, and the waste sheet 321 in the masking area 21 will carry away the no-start waste filament 322 in the reverse direction", the effective circuit will be firmly attached to the bottom protective film 1, and only the waste sheet 321 and the no-start waste filament 322 will be peeled off with the waste discharge film 4, avoiding the effective circuit being mistakenly carried away and improving the product yield.

[0061] In one embodiment, the adhesion between the waste discharge membrane 4 and the conductive layer 3 is less than the adhesion between the bottom protective membrane 1 and the conductive layer 3.

[0062] Specifically, a waste removal membrane 4 with an adhesion strength of 400g-500g / 25mm can be selected, and the adhesion between the bottom protective film 1 and the conductive layer 3 can be 650g-750g / 25mm. In step S5, "the waste removal membrane 4 is separated from the conductive layer 3 and discharged. Waste material 32 is adhered to the waste removal membrane 4, wherein the waste material 32 includes waste sheet 321 and unstarted waste filament 322. The waste sheet 321 in the masking area 21 will carry away the unstarted waste filament 322 in the reverse direction," the waste removal membrane 4 can only carry away the waste material 32 structure that is adhered to the release film 2, but cannot carry away the effective circuit that is adhered to the bottom protective film 1. This further ensures that the effective circuit is not accidentally peeled off from the adhesion level. Even if the waste removal membrane 4 is slightly adhered to the edge of the effective circuit, it will automatically detach due to insufficient adhesion, ensuring the integrity of the product structure.

[0063] Please see Figure 5 and Figure 7 In one embodiment, the unidirectional length of the non-starting waste filament 322 is less than 20 mm.

[0064] Specifically, in step S3, "the conductive layer 3 after pressing is die-cut, and a waste sheet 321 is formed at the corresponding masking area 21 after die-cutting of the conductive layer 3, and the waste sheet 321 is connected with a no-start waste wire 322," the designed length of the no-start waste wire 322 is less than 20mm. For example, it can be 5mm, 10mm, or 15mm, all less than 20mm. The width of the no-start waste wire 322 can be 0.5mm, completely surrounded by the effective circuit. Of course, the length of the no-start waste wire 322 is not limited to the aforementioned example length. When the unidirectional length of the no-start waste wire 322 is less than 20mm, its tensile strength is sufficient to support the reverse tension of the waste sheet 321, and it will not break due to stress concentration caused by excessive length. If the unidirectional length exceeds 20mm, the no-start waste wire 322 is prone to breakage and residue during the waste discharge process. It should be noted that the unidirectional length refers to the length of the no-start waste filament 322 in the overall length direction of the waste discharge membrane. If the ends of two adjacent no-start waste filaments 322 that are furthest from the waste sheet 321 are connected together, then the unidirectional length refers to the length of one of the two no-start waste filaments 322.

[0065] Please see Figure 5 and Figure 7 In one embodiment, the length of the waste sheet 321 is greater than 25 mm, and the width of the waste sheet 321 is more than three times the width of the unstarted waste wire 322.

[0066] Specifically, the waste sheet 321 is designed with an exemplary length of 30mm and an exemplary width of 1.5mm; the width of the unstarted waste filaments 322 is exemplary 0.5mm, and the width of the waste sheet 321 is exemplary three times that of the unstarted waste filaments 322. During waste removal in step S5, the larger adhesion area between the waste sheet 321 and the waste removal membrane 4 provides stronger and more uniform tensile force. The large size design of the waste sheet 321 gives it sufficient tensile strength and adhesion area, enabling it to stably pull the unstarted waste filaments 322 off, preventing the waste sheet 321 from detaching from the waste removal membrane 4 and ensuring the stability of the waste removal process. Furthermore, the size design of the waste sheet 321 can be flexibly adjusted according to the number and length of the unstarted waste filaments 322; a single waste sheet 321 can simultaneously pull 2-10 unstarted waste filaments 322, improving waste removal efficiency. Please see Figures 4 to 7 In one embodiment, the waste material 32 further includes a forward waste material filament 323, and the forward waste material filament 323 and the non-starting waste material filament 322 are respectively connected to the opposite sides of the waste material sheet 321.

[0067] Specifically, in step S3, "the conductive layer 3 after pressing is die-cut, and the die-cut conductive layer 3 forms a waste sheet 321 at the corresponding masking area 21, and the waste sheet 321 is connected to a non-starting waste filament 322," the waste sheet 321 is designed with a forward waste filament 323 (a conventional non-starting waste filament 32 with free edges) connected to the left side and a non-starting waste filament 322 connected to the right side. During waste removal, the forward waste filament 323 is first pulled by the waste removal film 4, assisting the waste sheet 321 in generating tension, which in turn drives the non-starting waste filament 322 on the right side to peel off. The auxiliary tension of the forward waste filament 323 further improves the stability of waste removal. Even if the non-starting waste filament 322 has slight adhesion to the release film 2, it can be successfully peeled off under the action of bidirectional tension, further improving the thoroughness of waste removal.

[0068] Please see Figure 3 , Figure 6 and Figure 7 In one embodiment, the discharge of waste 32 through the waste discharge membrane 4 includes forward waste discharge and reverse waste discharge, wherein the direction of forward waste discharge is opposite to the direction of travel of the waste discharge membrane 4.

[0069] Specifically, during the waste removal process, the waste removal membrane 4, for example, travels to the right, while the forward waste removal direction is to the left. First, one end of the waste sheet 321 is pulled up by the forward waste removal, causing the waste sheet 321 to initially separate from the release film 2. Then, the waste is removed in the reverse direction (to the right), completely peeling off and discharging the waste sheet 321 and the unstarted waste filaments 322. The combination of forward and reverse waste removal achieves the step-by-step peeling of the waste filament 32 structure, reduces the tensile force required for a single peel, avoids breakage of the unstarted waste filaments 32 due to excessive tensile force, and can accommodate the removal of finer unstarted waste filaments 322.

[0070] In one embodiment, the adhesive strength of the bottom protective film 1 ranges from 650g / 25mm to 750g / 25mm. For details, please refer to the reference. Figure 8 , Figure 8 The table shown is a test data table of the adhesion of the bottom protective film 1 in this invention. From... Figure 8 The adhesion test data of the carrier film with an adhesion range of 700g / 25mm±50g / 25mm and a thickness of 94um~95um further demonstrates that the adhesion of the carrier film is normal for both adhesion and stringing when the adhesion range is 700g / 25mm±50g / 25mm. Within this range, it can avoid the problem of waste material 32 being difficult to peel off due to excessive adhesion, or the problem of effective circuit detachment due to excessive adhesion, thus ensuring the consistency and stability of mass production.

[0071] In one embodiment, the thickness of the bottom protective film 1 is 60 μm-120 μm; and / or, The thickness of release film 2 is 20μm-50μm; and / or, The thickness of waste discharge membrane 4 is 50μm-100μm.

[0072] Specifically, the thickness of the bottom protective film 1 is 60μm-120μm, and for example, three specifications of 60μm, 90μm, and 120μm can be selected. The greater the thickness, the stronger the support of the bottom protective film 1, which is suitable for large-size FDC circuit boards. The thickness of the release film 2 is 20μm-50μm, and for example, three specifications of 20μm, 35μm, and 50μm can be selected. The thin release film 2 is easier to die-cut and does not affect the flexibility of the FDC circuit board. The thickness of the waste removal film 4 is 50μm-100μm, and for example, five specifications of 50μm, 60μm, 75μm, 90μm, and 100μm can be selected. The waste removal film 4 with moderate thickness has both strength and flexibility and is not easily damaged.

[0073] The thickness parameters of each of the above film layers are adapted to the production of FDC flexible die-cut circuit boards with integrated ICs of different specifications. They can be flexibly selected according to the flexibility requirements and size of the product, thereby improving the adaptability of the process.

[0074] This invention also proposes a processing equipment for FDC flexible die-cut circuit boards with integrated ICs. This equipment utilizes the aforementioned waste removal process for FDC flexible die-cut circuit boards with integrated ICs. The specific process flow of this waste removal process is as described in the above embodiments. Since this processing equipment for FDC flexible die-cut circuit boards with integrated ICs adopts all the technical solutions of all the above embodiments, it possesses at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be elaborated further here. Integrating the waste removal process for FDC flexible die-cut circuit boards with integrated ICs into the processing equipment replaces manual waste removal, significantly improving production efficiency and reducing labor costs. Simultaneously, the precise control of this equipment ensures the consistency of process parameters, further improving product yield.

[0075] The above description is merely an exemplary embodiment of the present invention and does not limit the scope of protection of the present invention. Any equivalent structural transformations made based on the technical concept of the present invention and the contents of the specification and drawings of the present invention, or direct / indirect applications in other related technical fields, are included within the scope of protection of the present invention.

Claims

1. A waste removal process for an integrated IC FDC flexible die-cut circuit board, characterized in that, Includes the following steps: The non-release surfaces of the bottom protective film and the release film are pressed and die-cut, and an adhesive masking area is formed on the bottom protective film; The conductive layer is laminated onto one side of the release surface of the release film; The conductive layer after lamination is die-cut, and the die-cut conductive layer forms a waste sheet at the corresponding masking area. The waste sheet is connected with a waste wire without a starting end. The waste discharge membrane is pressed onto the surface of the conductive layer, so that the waste discharge membrane adheres to the waste material after die-cutting of the conductive layer. The waste discharge membrane is made of a stretchable material with a stretch rate of 220%~360%. The waste discharge membrane is separated from the conductive layer and discharged. Waste material is adhered to the waste discharge membrane, including the waste sheet and the unstarted waste filament. The waste sheet in the masking area will carry away the unstarted waste filament in the opposite direction. During the process of separating and discharging the waste discharge membrane from the conductive layer, the angle between the waste discharge membrane and the bottom protective film is in the range of 34.2°-36.1°.

2. The waste removal process for the FDC flexible die-cut circuit board of integrated IC as described in claim 1, characterized in that, The step of "pressing and die-cutting the non-release surfaces of the bottom protective film and the release film, and forming an adhesive masking area on the bottom protective film" includes the following steps: The bottom protective film and the release film are pressed together, and the pressed release film is then die-cut. Waste is removed from the die-cut release film, and the adhesive masking area is formed on the bottom protective film after waste removal.

3. The waste removal process for the FDC flexible die-cut circuit board of integrated IC as described in claim 2, characterized in that, The masking area is formed by the release film pressed onto the bottom protective film.

4. The waste removal process for the FDC flexible die-cut circuit board of integrated IC as described in claim 3, characterized in that, The adhesion between the waste discharge membrane and the conductive layer is less than the adhesion between the bottom protective membrane and the conductive layer.

5. The waste removal process for the FDC flexible die-cut circuit board of integrated IC as described in any one of claims 1 to 4, characterized in that, The unidirectional length of the waste filaments without a starting point is less than 20 mm.

6. The waste removal process for the FDC flexible die-cut circuit board of integrated IC as described in any one of claims 1 to 4, characterized in that, The length of the waste sheet is greater than 25mm, and the width of the waste sheet is more than three times the width of the unstarted waste wire.

7. The waste removal process of the FDC flexible die-cut circuit board of integrated IC as described in any one of claims 1 to 4, wherein the waste material further includes forward waste wire, and the forward waste wire and the non-starting waste wire are respectively connected to the opposite sides of the waste sheet.

8. The waste removal process for the FDC flexible die-cut circuit board of integrated IC as described in any one of claims 1 to 4, characterized in that, Waste discharge through the waste discharge membrane includes forward waste discharge and reverse waste discharge, wherein the direction of forward waste discharge is opposite to the direction of travel of the waste discharge membrane.

9. The waste removal process for the FDC flexible die-cut circuit board of integrated IC as described in any one of claims 1 to 4, characterized in that, The adhesiveness of the bottom protective film ranges from 650g / 25mm to 750g / 25mm.

10. The waste removal process for the FDC flexible die-cut circuit board of integrated IC as described in any one of claims 1 to 4, characterized in that, The thickness of the bottom protective film is 60μm-120μm; and / or, The thickness of the release film is 20μm-50μm; and / or, The thickness of the waste discharge membrane is 50μm-100μm.

11. A processing equipment for FDC flexible die-cut circuit boards with integrated ICs, characterized in that, The processing equipment for the FDC flexible die-cut circuit board of the integrated IC uses the waste removal process of the FDC flexible die-cut circuit board of the integrated IC as described in any one of claims 1 to 10.

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