Liquid cooling heat dissipation plate structure and processing method

Abstract

The application discloses a liquid cooling heat dissipation plate structure and a processing method, which comprise a base, a water inlet and a water outlet are arranged on the side wall of the base, the base is composed of an upper base plate and a lower base plate, a plurality of groups of serpentine pipeline grooves are formed in the lower surface of the upper base plate, each group of serpentine pipeline grooves is communicated with the water inlet and the water outlet respectively, and the lower surface of the upper base plate is sealingly connected with the upper surface of the lower base plate.

Description

Technical Field

[0001] This invention relates to the field of radiator technology, specifically to a liquid-cooled heat sink structure and its processing method. Background Technology

[0002] As the capacity and power density of power electronic devices continue to increase, the heat consumption of these devices is also growing. Traditional air-cooling can no longer meet the needs of high-power electronic components, and liquid cooling technology is gradually replacing air-cooling. Liquid cooling technology removes heat through circulating coolant, reducing energy consumption, but the equipment is complex and there is a risk of leakage. Currently, pedestal-type liquid cooling technology is the most mature and widely used method. This involves using a pedestal made of highly thermally conductive metals such as copper or aluminum, which is tightly fitted to the surface of the heat-generating components. Heat is then transferred to the cooling liquid enclosed in the circulation pipes through heat conduction.

[0003] Traditional bases typically employ a straight-slot structure, resulting in lower heat dissipation performance and difficulty in meeting high power density cooling requirements. Furthermore, traditional liquid-cooled heat sinks are sealed using gaskets, posing a risk of leakage and impacting the reliability and lifespan of the radiator. Additionally, the base involves deep drilling, welding, and tubing pressing processes, leading to high barriers to entry and assembly costs. Summary of the Invention

[0004] To solve the above-mentioned technical problems, the present invention provides a liquid-cooled heat sink structure and processing method.

[0005] The present invention is achieved through the following technical solutions.

[0006] The technical solution of the present invention is as follows: a liquid cooling heat dissipation plate structure, including a base, an inlet and an outlet are provided on the side wall of the base, the base is composed of an upper base plate and a lower base plate, the lower surface of the upper base plate is provided with multiple sets of serpentine pipe grooves, each set of serpentine pipe grooves is connected to the inlet and the outlet respectively, and the lower surface of the upper base plate is fitted and sealed to the upper surface of the lower base plate.

[0007] Preferably, the upper surface of the upper substrate is provided with a plurality of mounting threaded holes.

[0008] Preferably, the upper substrate has mounting through holes on all four sides, and the lower substrate has assembly through holes on all four sides, with each mounting through hole corresponding to and communicating with the other assembly through holes.

[0009] Preferably, the base is made of copper.

[0010] Preferably, the water inlet and the water outlet are located on both sides of the base, with multiple water inlets connected to multiple sets of serpentine pipe channels, and multiple water outlets connected to multiple sets of serpentine pipe channels.

[0011] In another aspect, the present invention also provides a method for processing a liquid-cooled heat sink structure, comprising the following steps: S1: Upper substrate processing, multiple mounting threaded holes are opened on the upper surface of the upper substrate, and multiple sets of serpentine pipe grooves are opened on the lower surface of the upper substrate. S2: Processing of the upper and lower substrates. The lower surface of the upper substrate and the upper surface of the upper substrate are bonded together by a brazing process to form a base. After the welding is completed, argon gas protection treatment is performed. S3: Multiple water inlets are opened on one side wall of the base, and the multiple water inlets are connected to multiple sets of serpentine pipe grooves. The water inlets are provided with threads and are threadedly connected to the water inlet pipes. Multiple water outlets are opened on the other side of the base, and the multiple water outlets are connected to multiple sets of serpentine pipe grooves. The water outlets are provided with threads and are threadedly connected to the water outlet pipes. S4: Install through holes are made around the upper surface of the base, and assembly through holes are made around the lower surface of the base. The multiple install through holes correspond one-to-one with the multiple assembly through holes and are connected. The diameter of the assembly through holes is larger than the diameter of the install through holes.

[0012] Preferably, in step S2, resistance seamless welding technology is used during the welding process, the welding temperature is controlled within the range of 450-550℃, the welding time is 3-5 seconds, and the welding pressure is 0.3-0.5MPa.

[0013] The beneficial effects of this invention are: 1. By adopting a flow structure with multiple sets of serpentine pipe grooves, the flow distance and flow time of the coolant are increased, and the cooling area on the base is also increased, which significantly improves the heat dissipation efficiency and can better meet the heat dissipation requirements of high-power electronic components. 2. By seamlessly bonding the upper and lower substrates, the risk of water leakage is avoided, greatly improving the reliability and service life of the liquid cooling heat sink. 3. The structure is simple in design and does not require complex deep drilling, welding, or pipe pressing processes, which reduces the threshold and cost of manufacturing and assembly, while improving production efficiency. 4. The liquid cooling heat sink has a flexible and adaptable structure, which can be adjusted according to the heat dissipation performance requirements of different application environments. It is highly adaptable and meets the diverse layout requirements of circuit board components in the chassis. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the structure of the upper surface of the present invention; Figure 2 This is a schematic diagram of the structure of the lower surface of the present invention; Figure 3 This is a side view of the structure of the present invention; Figure 4 This is a schematic cross-sectional view of the serpentine pipe channel, which is the main feature of this invention. Figure 5 This is a cross-sectional view of the side of the present invention; Figure 6 This invention is mainly used to illustrate the structural diagram of the upper substrate; Figure 7 This invention is mainly used to demonstrate the structural diagram of the substrate.

[0015] Reference numerals: 1-Base; 101-Upper substrate; 102-Lower substrate; 2-Serpentine pipe groove; 3-Inlet; 4-Outlet; 5-Mounting threaded hole; 6-Mounting through hole; 7-Assembly through hole. Detailed Implementation

[0016] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0017] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present invention are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indication will also change accordingly.

[0018] In this embodiment, refer to Figure 5 , Figure 6 and Figure 7 It includes a base 1, which is made of copper. The base 1 is composed of an upper substrate 101 and a lower substrate 102. The lower surface of the upper substrate 101 is bonded and sealed to the upper surface of the lower substrate 102, so that the upper substrate 101 and the lower substrate 102 are integrated into a whole.

[0019] In this embodiment, refer to Figure 4 and Figure 5The lower surface of the upper substrate 101 has multiple sets of serpentine pipe grooves 2. Each set of serpentine pipe grooves 2 is connected to an inlet 3 and an outlet 4. Multiple inlets 3 are provided on one side wall of the base 1, and multiple outlets 4 are provided on the other side. The inlets 3 and outlets 4 are located on both sides of the base 1. Multiple inlets 3 are connected to multiple sets of serpentine pipe grooves 2, and multiple outlets 4 are connected to multiple sets of serpentine pipe grooves 2. The inlets 3 are connected to the water inlet pipe by a threaded connection, and the outlets 4 are connected to the water outlet pipe by a threaded connection. Coolant is selectively injected into the multiple sets of serpentine pipe grooves 2 according to actual needs.

[0020] In this embodiment, refer to Figure 1 The upper surface of the upper substrate 101 is provided with a plurality of mounting threaded holes 5, which are used to install functional modules to achieve heat dissipation of the functional modules.

[0021] In this embodiment, refer to Figure 2 , Figure 3 and Figure 5 The upper substrate 101 has mounting through holes 6 around its perimeter, and the lower substrate 102 has assembly through holes 7 around its perimeter. The mounting through holes 6 correspond one-to-one with the assembly through holes 7 and are connected. The mounting through holes 6 are used to mount screws, and the assembly through holes 7 are used to mount nuts, so that the base 1 can be installed in the required environment.

[0022] The working principle of this invention is as follows: By bonding the upper substrate 101 and the lower substrate 102 together, multiple sets of serpentine pipe grooves 2 are sealed together to prevent water leakage from the base 1. At the same time, the multiple sets of serpentine pipe grooves 2 increase the flow distance and flow time of the coolant and increase the cooling area on the base 1, which significantly improves the heat dissipation efficiency and can better meet the heat dissipation requirements of high-power electronic components. Furthermore, the mounting through holes 6 and assembly through holes 7 work together to install screws and nuts, allowing the base 1 to be installed in the required environment. The structure is simple, highly adaptable, and meets the diverse layout requirements of circuit board components in the chassis.

[0023] A preferred embodiment of the present invention also provides a method for processing a liquid-cooled heat sink structure, comprising the following steps: S1: The upper substrate 101 is processed. Multiple mounting threaded holes 5 are formed on the upper surface of the upper substrate 101, and multiple sets of serpentine pipe grooves 2 are formed on the lower surface of the upper substrate 101. The mounting threaded holes 5 are used to install power modules, and the multiple sets of serpentine pipe grooves 2 are used to circulate coolant.

[0024] S2: The upper substrate 101 and the lower substrate 102 are processed. The lower surface and the upper surface of the upper substrate 101 are bonded together by a brazing process to form the base 1. During the welding process, resistance seamless welding technology is used, the welding temperature is controlled within the range of 450-550℃, the welding time is 3-5 seconds, and the welding pressure is 0.3-0.5MPa. After welding, argon gas protection treatment is performed to avoid defects in the welding process and to ensure that the upper substrate 101 and the lower substrate 102 form an integrated structure to prevent the coolant inside the base 1 from leaking.

[0025] S3: Multiple water inlets 3 are opened on one side wall of the base 1. The multiple water inlets 3 are connected to multiple sets of serpentine pipe grooves 2. The water inlets 3 are provided with threads and are threadedly connected to the water inlet pipe. Multiple water outlets 4 are opened on the other side of the base 1. The multiple water outlets 4 are connected to multiple sets of serpentine pipe grooves 2. The water outlets 4 are provided with threads and are threadedly connected to the water outlet pipe. Coolant is introduced into the water inlet 3 through the water inlet pipe. The coolant flows into the serpentine pipe and then flows into the water outlet pipe through the water outlet 4, forming a sealed circulating water pipe.

[0026] S4: Mounting through holes 6 are opened around the upper surface of the base 1, and assembly through holes 7 are opened around the lower surface of the base 1. The mounting through holes 6 correspond one-to-one with the assembly through holes 7 and are connected. The diameter of the assembly through holes 7 is larger than the diameter of the mounting through holes 6. The mounting through holes 6 and the assembly through holes 7 work together to install screws into the mounting through holes 6 and nuts into the assembly through holes 7. The substrate is then installed in the required environment to complete the installation of the base 1.

[0027] The above are merely preferred embodiments of the present invention and do not limit the patent scope of the present invention. Any equivalent structural transformations made under the concept of the present invention using the description and drawings of the present invention, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present invention.

Claims

1. A liquid-cooled heat dissipation plate structure, characterized in that: The base (1) includes a base (1), and an inlet (3) and an outlet (4) are provided on the side wall of the base (1). The base (1) is composed of an upper base plate (101) and a lower base plate (102). Multiple sets of serpentine pipe grooves (2) are opened on the lower surface of the upper base plate (101). Each set of serpentine pipe grooves (2) is connected to the inlet (3) and the outlet (4) respectively. The lower surface of the upper base plate (101) is fitted and sealed to the upper surface of the lower base plate (102).

2. The liquid-cooled heat sink structure according to claim 1, characterized in that: The upper surface of the upper substrate (101) is provided with a plurality of mounting threaded holes (5).

3. The liquid-cooled heat sink structure according to claim 1, characterized in that: The upper substrate (101) has mounting through holes (6) on all four sides, and the lower substrate (102) has assembly through holes (7) on all four sides. The mounting through holes (6) correspond one-to-one with the assembly through holes (7) and are connected.

4. The liquid-cooled heat sink structure according to claim 3, characterized in that: The base (1) is made of copper.

5. The liquid-cooled heat sink structure according to claim 1, characterized in that: The inlet (3) and outlet (4) are located on both sides of the base (1). There are multiple inlets (3), and each inlet (3) is connected to multiple sets of serpentine pipe channels (2). There are multiple outlets (4), and each outlet (4) is connected to multiple sets of serpentine pipe channels (2).

6. A method for processing the liquid-cooled heat sink structure according to any one of claims 1-5, characterized in that, Includes the following steps: S1: The upper substrate (101) is processed. Multiple mounting threaded holes (5) are opened on the upper surface of the upper substrate (101), and multiple sets of serpentine pipe grooves (2) are opened on the lower surface of the upper substrate (101). S2: The upper substrate (101) and the lower substrate (102) are processed. The lower surface of the upper substrate (101) and the upper surface of the upper substrate (101) are bonded together by brazing process to form a base (1). After the welding is completed, argon gas protection treatment is performed. S3: Multiple water inlets (3) are opened on one side wall of the base (1). The multiple water inlets (3) are connected to multiple sets of serpentine pipe grooves (2). The water inlets (3) are provided with threads and are threadedly connected to the water inlet pipe. Multiple water outlets (4) are opened on the other side of the base (1). The multiple water outlets (4) are connected to multiple sets of serpentine pipe grooves (2). The water outlets (4) are provided with threads and are threadedly connected to the water outlet pipe. S4: Install through holes (6) are opened around the upper surface of the base (1), and assembly through holes (7) are opened around the lower surface of the base (1). Multiple install through holes (6) correspond one-to-one with multiple assembly through holes (7) and are connected. The diameter of the assembly through hole (7) is larger than the diameter of the install through hole (6).

7. The processing method of the liquid-cooled heat sink structure according to claim 6, characterized in that: In S2, resistance seamless welding technology is used during the welding process, the welding temperature is controlled within the range of 450-550℃, the welding time is 3-5 seconds, and the welding pressure is 0.3-0.5MPa.

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