Semiconductor device
By designing irregularly shaped contact plug structures in semiconductor devices, the problems of positional misalignment and poor connection during chip bonding are solved, thereby improving yield and reliability.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- KIOXIA CORP
- Filing Date
- 2025-06-12
- Publication Date
- 2026-07-10
AI Technical Summary
Existing semiconductor devices have low yield rates, especially during the bonding process of multiple chips, where issues such as misalignment and poor connection are prone to occur.
A semiconductor device was designed in which the upper surface of the first contact plug is longer in the first direction than in the second direction, and the upper surface of the second contact plug is longer in the second direction than in the first direction. This irregular structure improves the alignment accuracy during chip bonding and enhances connection reliability.
By improving the alignment accuracy during chip bonding, the yield of semiconductor devices is increased, the occurrence of positional misalignment and poor connection is reduced, and the reliability of the products is improved.
Smart Images

Figure CN122373355A_ABST