Flexible high-precision wafer rearrangement machine and control method thereof

Abstract

This invention relates to a flexible, high-precision wafer repositioning machine and its control method, comprising a machine base, a feeding vibration assembly, a wafer worktable, a vision inspection assembly, a swing arm die bonding assembly, a blue film hopper lifting assembly, a blue film pushing assembly, a blue film changing assembly, and an automatic film expansion assembly. The feeding vibration assembly has a flexible guide groove at its outlet end. The vision inspection assembly simultaneously detects the wafer's pose and quality, and feeds back the detection results to the motion module, the swing arm die bonding assembly, and the automatic film expansion assembly. The film expansion structure adjusts according to the tension changes of the blue film in the expansion structure to maintain a set tension state. This invention provides a flexible guide groove at the outlet end of the feeding vibration assembly, causing elastic deformation of the sidewalls of the wafer as it passes through the flexible guide groove, thus adaptively limiting the wafer and improving inspection and mounting accuracy. By setting a tension detection structure and detecting tension changes in real time during the film expansion process, the film expansion structure can adjust the expansion depth according to tension feedback.

Description

Technical Field

[0001] This invention relates to the field of semiconductor packaging equipment technology, and more specifically, to a flexible high-precision wafer rearrangement machine and its control method. Background Technology

[0002] Currently, with the development of semiconductor packaging technology, wafers usually exist in the form of loose particles after dicing. Before wafer packaging, they usually need to be rearranged, that is, the loose wafers are arranged on a blue film according to a predetermined rule by a wafer rearrangement device. The blue film can firmly adhere the wafers so that subsequent packaging processes can be carried out.

[0003] However, existing wafer alignment equipment is prone to damage during transport due to the fixed vibration parameters of the vibratory feeder and the use of rigid guide grooves. Furthermore, the wafers output from the vibratory feeder are usually randomly distributed, which can easily lead to disordered or overlapping wafers when they enter the wafer worktable. This increases the difficulty of visual recognition and correction, resulting in lower subsequent mounting accuracy.

[0004] Furthermore, most existing film expansion structures rely on fixed stroke control, making it difficult to reflect changes in blue film tension in real time. This can easily lead to the blue film being too loose or too tight, thus affecting the consistency of wafer mounting accuracy. Current mounting processes typically adjust position and angle based solely on visual inspection results, without incorporating the blue film tension state into the control system. This results in uneven stress on the wafer during mounting, affecting mounting quality. Summary of the Invention

[0005] The technical problem to be solved by the present invention is that existing wafer rearrangement equipment is prone to damage when handling fragile wafers, has low mounting accuracy, and cannot dynamically adjust mounting parameters according to the tension of the blue film. In view of the above-mentioned defects of the prior art, a flexible high-precision wafer rearrangement machine and its control method are provided.

[0006] The technical solution adopted by this invention to solve its technical problem is: A flexible, high-precision wafer rearrangement machine is constructed, comprising a machine base; the machine base is equipped with a feeding vibration assembly, a wafer worktable, a vision inspection assembly, a swing arm die bonding assembly, a blue film hopper lifting assembly, a blue film pushing assembly, a blue film changing assembly, and an automatic film expanding assembly; the feeding vibration assembly is located on one side of the wafer worktable and is used to vibrate and diffuse loose wafers; the discharge end of the feeding vibration assembly is provided with a flexible guide groove for guiding loose wafers into the wafer worktable; the sidewalls of the flexible guide groove are arranged opposite to each other and are made of an elastic polymer material; the width of the flexible guide groove is greater than the width of the wafer and smaller than the diagonal of the wafer. The wafer stage has a porous adsorption structure on its surface for adsorbing wafers, and a motion module at its bottom. The motion module performs position correction based on the detection results of the vision inspection component. The die bonding assembly includes a pick-up arm and a placement arm. The pick-up arm is located between the vision inspection component and the wafer stage and is used to transfer the wafer from the wafer stage to the vision inspection position. The placement arm is movably located between the vision inspection component and the automatic film expansion component and is used to attach the inspected wafer to the blue film. The vision inspection component is used to simultaneously inspect the wafer's pose and quality. The system measures and feeds back the results to the motion module, the swing arm die-bonding assembly, and the automatic film expansion assembly, respectively. The vision inspection assembly includes a first inspection group and a second inspection group. The first inspection group is positioned above the wafer stage and the automatic film expansion assembly. The second inspection group is used to photograph and calibrate the wafers picked up by the pick-up swing arm and the placement swing arm, and is positioned between the wafer stage and the automatic film expansion assembly. The end of the placement swing arm is equipped with a rotatable adsorption structure for real-time angle compensation based on the orientation. The automatic film expansion assembly is located at the working end of the placement swing arm and includes an expansion structure and... A tension detection structure is included; this structure detects the tension change of the blue film during the expansion process. The expansion structure is adjusted according to the tension change of the blue film to maintain a set tension state. The mounting arm applies the film under this tension state. The blue film hopper lifting assembly is movably disposed between the blue film pushing assembly and the blue film changing assembly. The blue film changing assembly includes an automatic blue film changing robot, which is located on one side of the blue film hopper lifting assembly and is used to push empty blue film to the automatic expansion assembly and push fully loaded blue film back to the blue film hopper lifting assembly.

[0007] Furthermore, the feeding vibration assembly includes a vibratory disk and multiple driving components; the driving components are respectively disposed below the vibratory disk and drive the vibratory disk to vibrate at different frequencies to diffuse the wafer.

[0008] Furthermore, the motion module includes a first axis transmission assembly and a second axis transmission assembly for translating and correcting the wafer stage according to the pose; the first axis transmission assembly and the second axis transmission assembly are respectively provided with a track and a moving part; the track of the first axis transmission assembly is fixedly mounted on the machine base; the moving part of the first axis transmission assembly is fixedly connected to the track of the second axis transmission assembly, and the second axis transmission assembly moves along the track of the first axis transmission assembly; the wafer stage is disposed on the moving part of the second axis transmission assembly and moves along the track of the second axis transmission assembly.

[0009] Furthermore, the pick-up swing arm and the placement swing arm are arranged along different motion paths and work alternately; the end of the placement swing arm is equipped with a pressure sensor to detect the contact pressure between the wafer and the blue film during placement.

[0010] Furthermore, the first detection group includes a first downward-looking camera and a second downward-looking camera. The first downward-looking camera is positioned above the wafer stage, and the second downward-looking camera is positioned above the automatic film expansion assembly. The first downward-looking camera feeds back the wafer detection results to the pick-up arm and the motion module. The second downward-looking camera feeds back the detection results to the automatic film expansion assembly so that the placement arm can accurately attach the wafer to the blue film. The second detection group includes a first upward-looking camera and a second upward-looking camera. The first upward-looking camera is positioned between the wafer stage and the automatic film expansion assembly and is located on the outside. The second upward-looking camera is positioned between the wafer stage and the automatic film expansion assembly and is positioned opposite to the first upward-looking camera. The first upward-looking camera is used to perform secondary calibration on the wafer picked up by the pick-up arm, and the second upward-looking camera is used to perform photographic calibration on the wafer picked up by the placement arm and obtain the wafer posture.

[0011] Furthermore, the film expansion structure includes an expansion ring, a lifting structure, a moving platform, a frustum, a first servo motor, and a second servo motor; the expansion ring is located within the lifting structure; the lifting structure is drivenly connected to the frustum; the frustum has a blue film placement slot for placing the blue film; the lifting structure is located on the frustum; the moving platform includes an X-axis module, a Y-axis module, and a rotation module; the Y-axis module is fixedly mounted on the machine base, the X-axis module is located on the Y-axis module, the frustum is located on the X-axis module, and the blue film placement slot is located on the worktable; the X-axis module, the Y-axis module translate, and the rotation module rotates to cooperate with the placement arm to attach the wafer; the first servo motor drives the lifting structure to descend, so that the blue film expands in the expansion ring; the tension detection structure is located on one side of the expansion ring; the first servo motor is drivenly connected to the lifting structure, and the second servo motor is drivenly connected to the rotation module; the first servo motor rotates according to the feedback signal from the tension detection structure. The lifting structure is equipped with a first transmission belt and multiple first rollers, each first roller being driven by the first transmission belt. The lifting structure also includes a pressing component; each first roller has a threaded interior, and the pressing component has a threaded post corresponding to the first roller, with the threaded interior connected to the threaded post. The output shaft of the first servo motor has a gear, and the first roller adjacent to the gear has teeth that mesh with it, and is driven by it. The rotation of the first servo motor drives the first rollers and the first transmission belt to move, and also drives the pressing component to rise and fall. The rotating module is located below the frustum and includes a second roller and a second transmission belt. The second roller and the second transmission belt each have transmission teeth, and the second roller is driven by the second transmission belt. The output end of the second servo motor has a gear or the second roller; the rotation of the second servo motor drives the second roller, the second transmission belt, and the frustum to rotate, thereby adjusting the bonding angle of the wafer.

[0012] Furthermore, the blue film replacement assembly includes a frame; the frame is mounted on the machine platform and is provided with a slide rail; the automatic blue film replacement robot is movably mounted on the slide rail for picking up and pushing the blue film.

[0013] Furthermore, the blue film hopper lifting assembly includes a lifting ladder and a multi-layer hopper; the lifting ladder moves the hopper to the pushing position of the blue film pushing assembly.

[0014] Furthermore, the blue film pushing assembly includes a pushing component and a drive motor. The drive motor drives and moves the pushing component back and forth to push the empty blue film out of the hopper. The pushing component is angled to push out the blue film.

[0015] This invention also provides a control method for a high-precision rearrangement machine from a flexible vibratory feeder to a blue film, comprising the following steps: S1, Loading: The elevator moves the empty blue film to the pushing position and pushes the empty blue film out of the hopper through the blue film pushing component; S2, Transfer: The automatic blue film changing robot transfers the empty blue film to the film expansion station; S3, film expansion: The automatic film expansion component expands the empty blue film according to the feedback result of the tension detection structure and maintains it at the set tension state; S4, Feeding: The feeding vibration assembly vibrates and diffuses the loose wafers, and then conveys them to the wafer stage via a flexible guide structure; S5, Inspection: Control the chip stage to perform position correction based on the pose parameters of the vision inspection component, and dynamically adjust the mounting angle and mounting pressure according to the tension changes of the blue film. S6, Placement: The chip is placed onto the blue film using the placement swing arm; S7: Repeat S3-S6 until the blue film is fully loaded, and then use the automatic blue film replacement robot to transfer the fully loaded blue film back to the hopper.

[0016] The beneficial effects of this invention are as follows: This invention incorporates a flexible guide groove at the discharge end of a feeding vibration assembly. The sidewalls of the guide groove are made of an elastic polymer material, and the width of the guide groove is limited to between the wafer width and its diagonal length. As the wafer passes through the guide groove, the sidewalls undergo elastic deformation to adaptively limit the wafer's position, effectively suppressing wafer flipping and jumping. This significantly reduces the randomness of the wafer's posture, improves the accuracy of subsequent inspection and mounting, and allows the wafer to complete initial posture regularization before entering the worktable. Compared to methods that rely entirely on visual inspection and correction, this invention reduces the computational burden on the vision system, improves overall cycle efficiency, and enhances posture recognition accuracy.

[0017] By setting up a tension detection structure and detecting the tension changes during the blue film expansion process in real time, the expansion structure can adjust the expansion depth according to the tension feedback, thereby avoiding the blue film being too loose or too tight, improving the surface flatness of the blue film, and facilitating subsequent wafer mounting.

[0018] During the placement process, the placement arm places the chip under a set tension on the blue film and performs angle compensation based on visual inspection results. This makes the chip placement force more uniform, reduces placement deviation caused by blue film deformation, and improves chip placement position accuracy and consistency. Attached Figure Description

[0019] Figure 1 This is an overall structural diagram of a flexible high-precision wafer rearrangement machine according to one embodiment of the present invention; Figure 2This is a top view schematic diagram of a flexible high-precision wafer rearrangement machine according to an embodiment of the present invention; Figure 3 This is a schematic diagram of the rotatable adsorption structure in one embodiment of the present invention; Figure 4 This is a three-dimensional schematic diagram of a flexible high-precision wafer rearrangement machine from another angle in one embodiment of the present invention; Figure 5 This is a schematic diagram of the structure of an automatic film expansion assembly in one embodiment of the present invention; Figure 6 This is the present invention. Figure 2 A magnified view of a portion of point I in the middle; Figure 7 This is a schematic diagram of the structure of a mobile platform in one embodiment of the present invention; Figure 8 This is a schematic diagram of the method steps of a high-precision rearrangement machine from a flexible vibratory plate to a blue film according to the present invention.

[0020] Labeling Explanation: 1. Machine Base; 2. Feeding Vibration Component; 3. Wafer Worktable; 4. Vision Inspection Component; 5. Swing Arm Die Bonding Component; 6. Blue Film Hopper Lifting Component; 7. Blue Film Pushing Component; 8. Blue Film Changing Component; 9. Automatic Film Expanding Component; 10. Discharge End; 201. Flexible Guide Groove; 202. Porous Adsorption Structure; 301. Motion Module; 302. Picking Swing Arm; 501. Placement Swing Arm; 502. Rotatable Adsorption Structure; 503. Film Expanding Structure; 901. Automatic Blue Film Changing Robot; 801. Frame; 802. Slide Rail; 803. Vibratory Feeder; 203. Drive Component; 204. First Axis Transmission Component; 303. Second Axis Transmission Component; 304. Track; 30 5. Moving component 306, first downward-viewing camera 401, second downward-viewing camera 402, first detection group 403, second detection group 404, first upward-viewing camera 405, second upward-viewing camera 406, film expansion ring 903, lifting structure 904, moving platform 905, frustum 906, first servo motor 907, X-axis module 908, Y-axis module 909, rotating module 910, first roller 911, first transmission belt 912, second servo motor 913, pressing component 914, second roller 915, second transmission belt 916, lifting ladder 601, hopper 602, pushing component 701, drive motor 702. Detailed Implementation

[0021] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0022] Please refer to Figure 1This invention proposes a flexible high-precision wafer rearrangement machine, comprising a machine base 1; the machine base 1 is equipped with a feeding vibration assembly 2, a wafer worktable 3, a vision inspection assembly 4, a swing arm die bonding assembly 5, a blue film hopper lifting assembly 6, a blue film pushing assembly 7, a blue film changing assembly 8, and an automatic film expanding assembly 9; the feeding vibration assembly 2 is located on one side of the wafer worktable 3 and is used to vibrate and diffuse loose wafers; the discharge end 201 of the feeding vibration assembly 2 is provided with a flexible guide groove 202 for guiding loose wafers into the wafer worktable 3; the sidewalls of the flexible guide groove 202 are arranged opposite to each other and are made of elastic polymer material; the width of the flexible guide groove 202 is greater than the width of the wafer, and The length of the wafer is less than its diagonal length; the surface of the wafer stage 3 is provided with a porous adsorption structure 301 for adsorbing wafers, and a motion module 302 is provided at the bottom. The motion module 302 performs position correction according to the detection result of the vision inspection component 4; the swing arm die bonding component 5 includes a pick-up swing arm 501 and a placement swing arm 502. The pick-up swing arm 501 is located between the vision inspection component 4 and the wafer stage 3 and is used to transfer the wafer from the wafer stage 3 to the vision inspection position; the placement swing arm 502 is movably located between the vision inspection component 4 and the automatic film expansion component 9 and is used to attach the inspected wafer to the blue film; the vision inspection component 4 is used to simultaneously inspect the wafer... The device performs position and quality checks, and feeds the results back to the motion module 302, the swing arm die bonding assembly 5, and the automatic film expansion assembly 9, respectively. The vision inspection assembly 4 includes a first inspection group 403 and a second inspection group 404. The first inspection group 403 is located above the wafer stage 3 and the automatic film expansion assembly 9. The second inspection group 404 is used to photograph and calibrate the wafers picked up by the pick-up swing arm 501 and the placement swing arm 502, and is located between the wafer stage 3 and the automatic film expansion assembly 9. The end of the placement swing arm 502 is provided with a rotatable adsorption structure 503 for real-time angle compensation based on position. The automatic film expansion assembly 9 is located at the end of the placement swing arm 502. The assembly includes an expansion structure 901 and a tension detection structure. The tension detection structure detects the tension change of the blue film during the expansion process. The expansion structure 901 adjusts according to the tension change of the blue film in the expansion structure 901 to maintain the blue film in a set tension state. The mounting arm 502 mounts the film under tension. The blue film hopper lifting assembly 6 is movably disposed between the blue film pushing assembly 7 and the blue film changing assembly 8. The blue film changing assembly 8 includes an automatic blue film changing robot 801, which is disposed on one side of the blue film hopper lifting assembly 6 and is used to push empty blue film to the automatic expansion assembly 9 and push fully loaded blue film back to the blue film hopper lifting assembly 6.

[0023] In this embodiment, the machine 1 is equipped with a feeding vibration assembly 2, a wafer worktable 3, a vision inspection assembly 4, a swing arm die bonding assembly 5, a blue film hopper lifting assembly 6, a blue film pushing assembly 7, a blue film changing assembly 8, and an automatic film expanding assembly 9. The components work together to achieve an automated process from loose wafers to precisely arranged wafers on the blue film.

[0024] Specifically, the feed vibration assembly 2 is located on one side of the wafer stage 3 and is used to vibrate and diffuse the loose wafers. Traditional feed vibration assemblies 2 often result in wafers sticking or stacking, random wafer orientation, and a high pick-up failure rate. For example... Figure 2 As shown, the discharge end 201 of the feeding vibration assembly 2 is provided with a flexible guide groove 202 for guiding loose wafers into the wafer stage 3 and eliminating attitude disturbances caused by wafer edge collisions. The sidewalls of the flexible guide groove 202 are arranged opposite each other and are made of elastic polymer material. In a specific embodiment, the flexible guide groove 202 can be made of silicone or polyurethane, and the groove width of the flexible guide groove 202 is designed to be slightly larger than the wafer width but smaller than the diagonal length of the wafer. This structure can not only limit the wafer position but also ensure that the wafer is not affected by the initial attitude. It can be gently straightened by the sidewalls during passage, forming an orderly arrangement, and can avoid edge damage caused by collisions in traditional rigid guide grooves, thus improving the suction efficiency. Furthermore, the discharge end 201 of the vibratory feeder 203 can be provided with multiple pluggable slot structures. The size of the flexible guide groove 202 can be adjusted by plugging and unplugging the slots to accommodate wafers of different sizes.

[0025] More specifically, the wafer stage 3 is used to temporarily receive wafers from the flexible guide groove 202, and its surface is provided with a porous adsorption structure 301. In one specific embodiment, the wafer stage 3 is equipped with a vacuum pump, and the negative pressure generated by the vacuum pump firmly adsorbs the wafer, preventing it from shifting during subsequent operations.

[0026] A motion module 302 is provided at the bottom of the wafer stage 3. The motion module 302 performs position correction based on the detection results of the vision inspection component 4. The motion module 302 can perform multiple directional and rotational movements to adjust the wafer to the optimal position for picking up the wafer.

[0027] Furthermore, such as Figure 1As shown, the swing arm die bonding assembly 5 includes a pick-up swing arm 501 and a placement swing arm 502. The pick-up swing arm 501 is located between the vision inspection assembly 4 and the wafer stage 3, and is used to transfer the wafer from the wafer stage 3 to the vision inspection position. The placement swing arm 502 is movably located between the vision inspection assembly 4 and the automatic film expansion assembly 9, and is used to attach the inspected wafer to the blue film. The vision inspection assembly 4 can simultaneously inspect the wafer's pose and quality, and feed the inspection results back to the motion module 302, the swing arm die bonding assembly 5, and the automatic film expansion assembly 9, respectively. The vision inspection assembly 4 includes a first inspection group 403 and a second inspection group 404. The first inspection group 403 is located above the wafer stage 3 and the automatic film expansion assembly 9. The second inspection group 404 is used to photograph and calibrate the wafers picked up by the pick-up swing arm 501 and the placement swing arm 502, and is located between the wafer stage 3 and the automatic film expansion assembly 9.

[0028] Specifically, the end of the mounting arm 502 is provided with a rotatable adsorption structure 503 for real-time angle compensation based on the orientation. In one specific embodiment, such as Figure 3 As shown, the rotatable adsorption structure 503 includes a nozzle and a rotating shaft. The nozzle is integrally formed with a mounting position, and a circular hole is provided on the mounting position. The rotating shaft passes through the circular hole, allowing the nozzle to be rotatably connected to the rotating shaft. An external motor is connected to the rotating shaft, and the rotation angle of the nozzle is adjusted in real time by controlling the rotation of the motor to achieve angle compensation. In addition, a turntable can be provided on the top of the nozzle. By driving the turntable to rotate, the angle of the nozzle in another direction can be adjusted. Through real-time rotation compensation during movement, it is ensured that the wafer reaches the mounting position at the set angle.

[0029] Specifically, the automatic film expansion assembly 9 is located at the working end of the mounting swing arm 502, including a film expansion structure 901 and a tension detection structure. In one specific embodiment, the tension detection structure is a tension sensor, which can detect the tension change of the blue film in real time during the film expansion process. Then, the film expansion structure 901 adjusts according to the tension change of the blue film to keep the blue film in a set tension state. The mounting swing arm 502 places the chip under the set tension state, thereby avoiding the blue film being too loose or too tight, improving the surface flatness of the blue film, and facilitating subsequent chip mounting.

[0030] Specifically, the blue film hopper lifting assembly 6 is movably positioned between the blue film pushing assembly 7 and the blue film changing assembly 8. The blue film changing assembly 8 includes an automatic blue film changing robot 801, which is located on one side of the blue film hopper lifting assembly 6 and is used to push empty blue film to the automatic film expanding assembly 9 and push fully loaded blue film back to the blue film hopper lifting assembly 6. Furthermore, the front end of the automatic blue film changing robot 801 is equipped with a vacuum suction device, which can grip and release the blue film.

[0031] Furthermore, the bottom of machine base 1 is equipped with a height-adjustable support. The adjustment mechanism is a threaded nut adjustment, meaning that the base of the support has a nut, and the other part has threads. The height of the support is adjusted by rotating the nut. In addition, the bottom of machine base 1 is also equipped with multiple rollers. When the height of the support is lower than the height of the rollers, it can be moved by the rollers.

[0032] This invention, through the combination of a flexible guiding structure and a tension control structure, makes the wafer's posture more stable and the mounting environment more controllable during the process from feeding, guiding, testing to mounting, significantly improving the wafer rearrangement accuracy and product yield.

[0033] In one embodiment, the feeding vibration assembly 2 includes a vibratory disk 203 and a plurality of driving members 204; the driving members 204 are respectively disposed below the vibratory disk 203 and drive the vibratory disk 203 to vibrate at different frequencies to diffuse the wafer.

[0034] Specifically, such as Figure 4 As shown, to accommodate ultra-thin, miniature, or fragile wafers, the feeding vibration assembly 2 includes a vibratory disk 203 and multiple drive components 204. In one specific embodiment, the multiple drive components 204 are respectively located at the bottom of the vibratory disk 203. The drive components 204 are variable frequency motors or motors, capable of driving the vibratory disk 203 to vibrate at different frequencies and amplitudes, allowing the loose wafers inside to diffuse smoothly and uniformly. In use, the vibration frequency can be adjusted according to the size and weight of the wafer, making it suitable for wafers of various specifications without the need to replace components such as the vibratory disk 203, thus saving process steps.

[0035] In one embodiment, the motion module 302 includes a first axis transmission assembly 303 and a second axis transmission assembly 304, used to perform translational correction on the wafer stage 3 according to its pose; the first axis transmission assembly 303 and the second axis transmission assembly 304 are respectively provided with a track 305 and a moving part 306; the track 305 of the first axis transmission assembly 303 is fixedly mounted on the machine base 1; the moving part 306 of the first axis transmission assembly 303 is fixedly connected to the track 305 of the second axis transmission assembly 304, and the second axis transmission assembly 304 moves along the track 305 of the first axis transmission assembly 303; the wafer stage 3 is mounted on the moving part 306 of the second axis transmission assembly 304 and moves along the track 305 of the second axis transmission assembly 304.

[0036] In practical implementation: such as Figures 1-4As shown, a motion module 302 is connected to the bottom of the wafer stage 3. The motion module 302 consists of an orthogonal first axis transmission assembly 303 and a second axis transmission assembly 304. The track 305 of the first axis transmission assembly 303 is fixed on the machine base 1, and its moving part 306 is fixedly connected to the track 305 of the second axis transmission assembly 304. The wafer stage 3 is mounted on the moving part 306 of the second axis transmission assembly 304. The motion module 302 performs precise translation correction on the wafer stage 3 based on the feedback results of the vision detection assembly 4, that is, adjusts the wafer to the optimal position for picking up. In addition, the bottom of the wafer stage 3 may be provided with a rotating structure, such as gear transmission to drive the wafer stage 3 to rotate, so that the wafer can be corrected to the optimal orientation for the picking arm 501 to pick up.

[0037] Please refer to Figure 1 The pick-up swing arm 501 and the placement swing arm 502 are arranged along different motion paths and work alternately at high speed. A pressure sensor is provided at the end of the placement swing arm 502 to detect the contact pressure between the wafer and the blue film during placement, preventing wafer crushing or improper attachment. The vision inspection component 4 includes a first detection group 403 and a second detection group 404. The first detection group 403 includes a first downward-looking camera 401 and a second downward-looking camera 402. The first downward-looking camera 401 is located above the wafer worktable 3, and the second downward-looking camera 402 is located above the automatic film expansion component 9. The first downward-looking camera 401 feeds back the wafer inspection results to the pick-up swing arm 501 and the motion module 302; the second downward-looking camera 402 feeds back the inspection results to the automatic film expansion component 9 so that the placement swing arm 502 can accurately attach the wafer to the blue film. The second detection group 404 includes a first upward-viewing camera 405 and a second upward-viewing camera 406. The first upward-viewing camera 405 is located between the wafer stage 3 and the automatic film expansion assembly 9 and is located on the outside. The second upward-viewing camera 406 is located between the wafer stage 3 and the automatic film expansion assembly 9 and is positioned opposite to the first upward-viewing camera 405. The first upward-viewing camera 405 is used to perform secondary calibration on the wafer picked up by the pick-up arm 501. The second upward-viewing camera 406 is used to perform photographic calibration on the wafer picked up by the mounting arm 502 and to obtain the wafer posture.

[0038] In specific implementation: the movement path of the pick-up arm 501 is to pick up the wafer from the wafer stage 3 and place it below the first downward-facing camera 401 for inspection, and feed the inspection result back to the motion module 302 provided on the wafer stage 3 to adjust the wafer position for the pick-up arm 501 to pick up; then the pick-up arm 501 places the wafer on the first upward-facing camera 405 for photographing and secondary correction, and then the placement arm 502 picks up the wafer and places it above the second upward-facing camera 406 for photographing and calibration. Finally, the moving platform 905 is driven to move under the second downward-facing camera 402 to cooperate with the placement arm 502 for film application. This application sets a second detection group 404 between the wafer stage 3 and the automatic film expansion assembly 9, which can obtain accurate wafer position information and improve wafer placement accuracy. In addition, during the wafer inspection process, the second detection group 404 acts as a buffer structure between the wafer stage 3 and the placement station, which can avoid equipment waiting or a decrease in cycle time caused by the inconsistency between the inspection cycle and the placement cycle time, thereby improving overall production efficiency.

[0039] Furthermore, the detection results of the first upward-viewing camera 405 and the second upward-viewing camera 406 can be displayed on the screens provided on the machine for easy viewing by the user.

[0040] Please refer to Figures 2-7The film expansion structure 901 includes a film expansion ring 903, a lifting structure 904, a moving platform 905, a frustum 906, a first servo motor 907, and a second servo motor 913. The film expansion ring 903 is located inside the lifting structure 904. The lifting structure 904 is connected to the frustum 906 via a transmission connection. The frustum 906 is provided with a blue film placement slot for placing the blue film. The lifting structure 904 is mounted on the frustum 906. The moving platform 905 includes an X-axis module 908, a Y-axis module 909, and a rotating module 910. The Y-axis module 909 is fixedly mounted on the machine base 1, and the X-axis module 907 is mounted on the Y-axis module 908. On the X-axis module 909, a frustum 906 is mounted on the X-axis module 908, and a blue film placement slot is located on the worktable; the X-axis module 908, the Y-axis module translation, and the rotation module 910 rotate to cooperate with the placement swing arm 502 to attach the wafer; the first servo motor 907 drives the lifting structure 904 to descend, so that the blue film expands in the film expansion ring 903; a tension detection structure is located on one side of the film expansion ring 903; the first servo motor 907 is driven by the lifting structure 904, and the second servo motor 913 is driven by the rotation module; the first servo motor 907 adjusts the pressure according to the feedback from the tension detection structure. The rotation of the expansion ring 903 controls the pressing depth of the film expanding ring; the lifting structure 904 is provided with a first transmission belt 912 and multiple first rollers 911, which are respectively connected to the first transmission belt 912; the lifting structure 904 is provided with a pressing member 914, the first rollers 911 are provided with threads, and the pressing member 914 is provided with threaded posts corresponding to the first rollers 911, with the threads connected to the threaded posts; the output shaft of the first servo motor 907 is provided with a gear, and the first rollers 911 adjacent to the gear are provided with teeth that mesh with it and are connected to it; the first servo motor 907 rotates The first roller 911 and the first transmission belt 912 are driven to move, and the lower pressing component 914 is driven to rise and fall. The rotating module is located below the frustum 906 and includes a second roller 915 and a second transmission belt 916. The second roller 915 and the second transmission belt 916 are respectively provided with transmission teeth, and the second roller 915 and the second transmission belt 916 are connected in transmission. The output end of the second servo motor 913 is provided with a gear or the second roller 915. The rotation of the second servo motor 913 drives the second roller 915, the second transmission belt 916 and the frustum 906 to rotate, which is used to adjust the bonding angle of the wafer.

[0041] In practical implementation: such as Figure 5As shown, the expanding ring 903 is located inside the lifting structure 904, which is positioned above the frustum 906. The first servo motor 907 is connected to the lifting structure 904. When the first servo motor 907 is driven to rotate, it drives the first roller 911 and the first transmission belt 912 to move, which in turn drives the pressing member 914 to move vertically. After the automatic blue film changing robot 801 pushes the blue film into the blue film placement slot, the first servo motor 907 rotates, driving the first roller 911 and the first transmission belt 912 to move. The pressing member 914, which is threadedly connected to the first roller 911, moves downward and expands the blue film. During this process, the first servo motor 907 rotates to control the pressing depth of the expanding ring 903 based on the feedback signal from the tension detection structure to maintain a constant expanding tension.

[0042] Furthermore, the rotary table 906 is mounted on the moving platform 905, which includes an X-axis module 908, a Y-axis module 909, and a rotation module 910. When the mounting arm 502 attaches the chip, the position of the moving platform 905 is dynamically adjusted according to the detection results of the second downward-looking camera 402, including the horizontal direction and the rotation angle, to cooperate with the mounting arm 502 to attach the chip.

[0043] like Figure 2 and Figure 7 As shown, the Y-axis module 909 is fixed on the machine tool 1, the X-axis module 908 is mounted on the Y-axis module 909, the frustum 906 is mounted on the X-axis module 908, and the blue film placement slot is located on the worktable; the X-axis module 908 and the Y-axis module drive the blue film to move horizontally to adjust the wafer attachment position.

[0044] like Figure 6 As shown, when the wafer attachment angle needs to be adjusted, the drive module rotates, causing the frustum 906 and the lifting structure 904 to rotate together. Specifically, the rotating module is located below the frustum 906 and includes a second roller 915 and a second transmission belt 916; the second roller 915 and the second transmission belt 916 are respectively provided with transmission teeth, and the second roller 915 and the second transmission belt 916 are connected to each other to form a belt drive. The output end of the second servo motor 913 is provided with a gear or the second roller 915. By driving the second servo motor 913 to rotate, the second roller 915, the second transmission belt 916, and the frustum 906 are rotated, thereby realizing the adjustment of multiple attachment angles.

[0045] Please refer to Figure 1 The blue film replacement assembly 8 includes a frame 802; the frame 802 is mounted on the machine base 1 and is provided with a slide rail 803; the blue film automatic replacement robot 801 is movably mounted on the slide rail 803 for picking up and pushing the blue film.

[0046] In practical implementation: The automatic blue film changing robot 801 is equipped with a vacuum suction system. The robot 801 adsorbs and replaces the blue film. When placing empty blue film, the robot 801 adsorbs the empty film from the hopper 602, moves it along the slide rail 803, places the empty blue film in the blue film placement slot, and then pushes it in. When the hopper is full, the robot 801 adsorbs the blue film again, moves it along the slide rail 803, places the blue film back into the hopper 602, and then pushes it in. This achieves automated blue film replacement, improving the equipment's intelligence level.

[0047] Please refer to Figure 2 The blue film hopper lifting assembly 6 includes a second transmission belt 916 and a multi-layer hopper 602; the second transmission belt 916 drives the hopper 602 to move to the pushing position of the blue film pushing assembly 7.

[0048] In a specific implementation: the hopper 602 has a multi-layer structure for holding multiple blue films. In one specific embodiment, the second transmission belt 916 is driven by a cylinder, and by driving the second transmission belt 916 to move up and down, the blue films in the hopper 602 can all be located at the pushing position.

[0049] Please refer to Figure 1 The blue film pushing assembly 7 includes a pushing component 701 and a drive motor 702. The drive motor 702 drives and moves the pushing component 701 back and forth to push the empty blue film out of the hopper 602. The pushing component 701 is angled to push out the blue film.

[0050] In a specific implementation: the pusher 701 is connected to the drive motor 702 via a transmission connection. In one specific embodiment, the pusher 701 is provided with a threaded hole, and the output shaft of the drive motor 702 is fixedly provided with a threaded wheel. The rotation of the drive motor 702 drives the pusher 701 to move in the back-and-forth direction. Alternatively, the pusher 701 and the drive motor 702 can be connected by other structures that convert a rotary joint into a sliding joint, such as a lead screw structure.

[0051] Specifically, when the second transmission belt 916 moves to the pushing position, the pushing component 701 is driven to move to push the blue film out of the hopper 602.

[0052] It is worth mentioning that, in order to achieve high precision, the X-axis module 908, Y-axis module 909, first axis transmission assembly 303 and second axis transmission assembly 304 in this application all adopt magnetic levitation. The track 305 and the moving part 306 are placed in a magnetic levitation manner. By controlling the electromagnetic force, contactless levitation and driving are achieved, eliminating the friction and wear caused by traditional mechanical guide rails and improving the displacement adjustment accuracy.

[0053] Please refer to Figure 8This invention proposes a control method for a high-precision rearrangement machine that uses a flexible vibratory feeder 203 to move to a blue film, comprising the following steps: S1, feeding: The second transmission belt 916 moves the empty blue film to the pushing position, and pushes the empty blue film out of the hopper 602 through the blue film pushing component 7; S2, Transfer: The automatic blue film changing robot 801 transfers the empty blue film to the film expansion station; S3, film expansion: The automatic film expansion component 9 expands the empty blue film according to the feedback result of the tension detection structure and maintains it at the set tension state; S4, Feeding: The feeding vibration assembly 2 vibrates and diffuses the loose wafers, and then conveys them to the wafer stage 3 through a flexible guide structure; S5, Inspection: Based on the pose parameters of the vision inspection component 4, the chip stage 3 is controlled to perform position correction and dynamically adjust the mounting angle and mounting pressure according to the tension change of the blue film. S6, Placement: The chip is placed onto the blue film using the placement arm 502; S7: Repeat S3-S6 until the blue film is fully loaded, and transfer the fully loaded blue film to the return hopper 602 by the blue film automatic replacement robot 801.

[0054] In this embodiment, the first step is the loading process. The second transmission belt 916 moves the empty blue film to the pushing position, and the empty blue film is pushed out of the material bin 602 by the blue film pushing component 7. Then, the empty blue film is transferred to the film expansion station by the automatic blue film changing robot 801. Then, the automatic film expansion component 9 expands the empty blue film according to the feedback result of the tension detection structure and maintains it at the set tension state. During the film expansion, the tension change of the blue film is detected in real time, so that the film expansion structure 901 can adjust the film expansion depth according to the tension feedback, thereby avoiding the blue film being too loose or too tight, improving the surface flatness of the blue film, and facilitating subsequent wafer mounting. Next, the feeding vibration assembly 2 vibrates and diffuses the loose wafers, which are then conveyed to the wafer worktable 3 via a flexible guide structure. The pick-up arm 501 then places the wafers under the vision inspection assembly 4 for inspection, acquiring precise pose and quality information. Based on the pose parameters, the wafer worktable 3 is controlled to perform position correction, and the mounting angle and mounting pressure are dynamically adjusted according to the tension changes of the blue film. Simultaneously, the second downward-facing camera 402 confirms the mounting points on the blue film or the final posture of the wafers. The mounting arm 502 then attaches the wafers to the blue film. During the mounting process, the mounting arm 502 performs the mounting under the set tension of the blue film, and angle compensation is performed based on the vision inspection results. This ensures more uniform force on the wafers, reduces mounting deviations caused by blue film deformation, and improves the accuracy and consistency of wafer mounting positions. Finally, the film expansion, feeding, inspection, and mounting processes are repeated until the blue film is filled with a predetermined number of wafers. The fully loaded blue film is then transferred back to the material hopper 602 by the automatic blue film changing robot 801. Finally, repeat S1 to start a new cycle.

[0055] It should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, apparatus, article, or method that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, apparatus, article, or method. Unless otherwise specified, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, apparatus, article, or method that includes that element.

[0056] The above description is only a preferred embodiment of this application and does not limit the patent scope of this application. Any equivalent structural or procedural changes made based on the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. A flexible, high-precision wafer rearrangement machine, characterized in that, The machine includes a feeding vibration assembly, a wafer worktable, a vision inspection assembly, a swing arm die bonding assembly, a blue film hopper lifting assembly, a blue film pushing assembly, a blue film replacement assembly, and an automatic film expansion assembly. The feeding vibration assembly is located on one side of the wafer stage and is used to vibrate and diffuse the loose wafers; the discharge end of the feeding vibration assembly is provided with a flexible guide groove for guiding the loose wafers into the wafer stage. The sidewalls of the flexible guide groove are arranged opposite to each other and are made of elastic polymer material; the width of the flexible guide groove is greater than the width of the wafer and less than the diagonal length of the wafer. The surface of the wafer stage is provided with a porous adsorption structure for adsorbing wafers, and a motion module is provided at the bottom. The motion module performs position correction according to the detection results of the vision inspection component. The die bonding assembly includes a pick-up arm and a mounting arm. The pick-up arm is located between the vision inspection assembly and the wafer stage and is used to transfer the wafer from the wafer stage to the vision inspection position. The mounting arm is movably located between the vision inspection assembly and the automatic film expansion assembly and is used to attach the inspected wafer to the blue film. The vision inspection component is used to simultaneously inspect the position and quality of the wafer, and feeds back the inspection results to the motion module, the swing arm die bonding component, and the automatic film expansion component respectively; the vision inspection component includes a first inspection group and a second inspection group. The first inspection group is located above the wafer stage and the automatic film expansion component, and the second inspection group is used to take pictures and calibrate the wafers picked up by the pick-up swing arm and the placement swing arm respectively, and is located between the wafer stage and the automatic film expansion component; The end of the mounting arm is provided with a rotatable adsorption structure for real-time angle compensation based on the posture. The automatic film expansion assembly is located at the working end of the mounting swing arm and includes a film expansion structure and a tension detection structure. The tension detection structure is used to detect the tension change of the blue film during the film expansion process. The film expansion structure is adjusted according to the tension change of the blue film in the film expansion structure so that the blue film maintains a set tension state. The mounting arm applies the patch under tension. The blue film hopper lifting assembly is movably disposed between the blue film pushing assembly and the blue film changing assembly; The blue film replacement assembly includes an automatic blue film replacement robot, which is located on one side of the blue film hopper lifting assembly and is used to push empty blue film to the automatic film expansion assembly and push fully loaded blue film back to the blue film hopper lifting assembly.

2. The flexible high-precision wafer rearrangement machine according to claim 1, characterized in that, The feeding vibration assembly includes a vibratory disk and multiple driving components; the driving components are respectively located below the vibratory disk and drive the vibratory disk to vibrate at different frequencies to diffuse the wafer.

3. The flexible high-precision wafer rearrangement machine according to claim 1, characterized in that, The motion module includes a first axis transmission assembly and a second axis transmission assembly, used to perform translational correction on the wafer stage according to the pose. The first shaft drive assembly and the second shaft drive assembly are respectively provided with a track and a moving part; The track of the first shaft drive assembly is fixed on the machine base; the movable part of the first shaft drive assembly is fixedly connected to the track of the second shaft drive assembly, and the second shaft drive assembly moves along the track of the first shaft drive assembly. The wafer stage is mounted on the movable part of the second axis drive assembly and moves along the track of the second axis drive assembly.

4. The flexible high-precision wafer rearrangement machine according to claim 1, characterized in that, The material picking arm and the mounting arm are arranged along different motion paths and work alternately. The end of the mounting arm is equipped with a pressure sensor to detect the contact pressure between the chip and the blue film during chip mounting.

5. The flexible high-precision wafer rearrangement machine according to claim 4, characterized in that, The first detection group includes a first downward-looking camera and a second downward-looking camera. The first downward-looking camera is located above the wafer stage, and the second downward-looking camera is located above the automatic film expansion assembly. The first downward-facing camera feeds back the detection results of the wafer to the pick-up arm and the motion module; The second downward-facing camera feeds back the detection results to the automatic film expansion assembly so that the mounting arm can accurately attach the wafer to the blue film; The second detection group includes a first upward-viewing camera and a second upward-viewing camera. The first upward-viewing camera is located between the wafer stage and the automatic film expansion assembly and is located on the outside. The second upward-viewing camera is located between the wafer stage and the automatic film expansion assembly and is positioned opposite to the first upward-viewing camera. The first upward-viewing camera is used to perform secondary calibration on the wafer picked up by the pick-up arm, and the second upward-viewing camera is used to take pictures and calibrate the wafer picked up by the mounting arm, and to obtain the wafer posture.

6. The flexible high-precision wafer rearrangement machine according to claim 4, characterized in that, The film expansion structure includes a film expansion ring, a lifting structure, a moving platform, a frustum, a first servo motor, and a second servo motor. The expanding ring is located inside the lifting structure; the lifting structure is connected to the frustum transmission. The truncated cone is provided with a blue film placement slot for placing the blue film; the lifting structure is located on the truncated cone. The mobile platform includes an X-axis module, a Y-axis module, and a rotation module; The Y-axis module is fixedly mounted on the machine base, the X-axis module is mounted on the Y-axis module, the frustum is mounted on the X-axis module, and the blue film placement slot is located on the worktable; the X-axis module, the Y-axis module translate, and the rotating module rotates to cooperate with the mounting swing arm to attach the wafer; The first servo motor drives the lifting structure to descend, so that the blue film expands in the film expansion ring; The tension detection structure is located on one side of the film expansion ring; The first servo motor is connected to the lifting structure, and the second servo motor is connected to the rotating module; the first servo motor rotates to control the pressing depth of the expanding ring according to the feedback signal of the tension detection structure. The lifting structure is provided with a first transmission belt and a plurality of first rollers, and the first rollers are respectively connected to the first transmission belt for transmission. The lifting structure is provided with a pressing component, the first roller is provided with a thread, the pressing component is provided with a threaded post corresponding to the first roller, and the thread is threadedly connected to the threaded post. The output shaft of the first servo motor is equipped with a gear, and a first roller adjacent to the gear is equipped with teeth that mesh with it and is connected to it for transmission. The rotation of the first servo motor drives the first roller and the first transmission belt to move, and in turn drives the lower pressing component to rise and fall; The rotating module is located below the frustum and includes a second roller and a second transmission belt; The second roller and the second transmission belt are respectively provided with transmission teeth, and the second roller is connected to the second transmission belt in a transmission connection. The output end of the second servo motor is equipped with a gear or the second roller. The rotation of the second servo motor drives the second roller, the second transmission belt and the frustum to rotate, thereby adjusting the attachment angle of the wafer.

7. The flexible high-precision wafer rearrangement machine according to claim 1, characterized in that, The blue film replacement assembly includes a frame; the frame is mounted on the machine platform and is provided with a slide rail; the automatic blue film replacement robot is movably mounted on the slide rail for picking up and pushing the blue film.

8. The flexible high-precision wafer rearrangement machine according to claim 1, characterized in that, The blue film silo lifting assembly includes a lifting ladder and a multi-layer silo; The elevator moves the hopper to the pushing position of the blue film pushing component.

9. The flexible high-precision wafer rearrangement machine according to claim 1, characterized in that, The blue film pushing assembly includes a pushing component and a drive motor. The drive motor drives and moves the pushing component back and forth to push the empty blue film out of the hopper. The pusher is angled and used to push out the blue film.

10. A control method for a high-precision rearrangement machine from a flexible vibratory feeder to a blue film according to any one of claims 1-9, characterized in that, Includes the following steps: S1, Loading: The elevator moves the empty blue film to the pushing position and pushes the empty blue film out of the hopper through the blue film pushing component; S2, Transfer: The automatic blue film changing robot transfers the empty blue film to the film expansion station; S3, film expansion: The automatic film expansion component expands the empty blue film according to the feedback result of the tension detection structure and maintains it at the set tension state; S4, Feeding: The feeding vibration assembly vibrates and diffuses the loose wafers, and then conveys them to the wafer stage via a flexible guide structure; S5, Inspection: Control the chip stage to perform position correction based on the pose parameters of the vision inspection component, and dynamically adjust the mounting angle and mounting pressure according to the tension changes of the blue film. S6, Placement: The chip is placed onto the blue film using the placement swing arm; S7: Repeat S3-S6 until the blue film is fully loaded, and then use the automatic blue film replacement robot to transfer the fully loaded blue film back to the hopper.

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