Clamp device and wire bonding apparatus

By designing the pressing and moving components of the clamping device, bidirectional clamping and fixing of the lead frame is achieved, solving the problems of low positioning accuracy and easy deformation of the traditional clamp, improving bonding efficiency and reliability, and meeting the production requirements of high-power devices.

CN122373752APending Publication Date: 2026-07-10RADIUM GOD TECH (XIAN) CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
RADIUM GOD TECH (XIAN) CO LTD
Filing Date
2026-03-25
Publication Date
2026-07-10

AI Technical Summary

Technical Problem

Traditional fixtures suffer from low positioning accuracy, easy frame deformation, and low bonding efficiency, failing to meet the high requirements of high-power devices for bonding reliability and production efficiency.

Method used

A clamping device is provided, including a pressing component and a moving component. The device achieves bidirectional clamping and fixing of the lead frame through the coordinated movement of the pressing component and the mating component. It adopts a smooth pressing surface and a multi-point support structure to avoid frame warping and deformation, and absorbs impact loads through flexible components to improve clamping stability and bonding accuracy.

Benefits of technology

It effectively solves the frame warping problem, improves the positioning accuracy and efficiency of the bonding process, ensures the flatness of the lead frame and the bonding quality, and meets the reliable production requirements of high-power devices.

✦ Generated by Eureka AI based on patent content.

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Abstract

This application relates to a clamping device and a wire bonding apparatus. The clamping device includes a pressing assembly and a moving assembly. The pressing assembly includes a pressing member and a mating member. The pressing member is used to press against the chip pads of a leadframe. The moving assembly includes a first moving member, a second moving member, and a driving member. The pressing member and the mating member are respectively mated to the first moving member and the second moving member, and are spaced apart from each other along a first direction to form a pressing space for placing the leadframe. The driving member is driven mated to the first moving member and the second moving member, and is configured to drive the first moving member and the second moving member to reciprocate along the first direction. The clamping device controls the movement of the pressing member and the mating member through the moving assembly to achieve bidirectional clamping and fixing of the chip pad area of ​​the leadframe, thereby effectively solving the technical problem of warping of traditional clamping frames.
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