A method and system for optimizing wire bonding time based on dynamic deformation monitoring

Abstract

This application discloses a wire bonding time optimization method and system based on dynamic deformation monitoring, belonging to the field of semiconductor packaging technology. The method includes: dividing the soldering process of the solder joint into several continuous stages, executing them in the following order: outputting the signal set for the current stage, executing the action, entering the real-time monitoring stage, determining whether the deformation process has ended, and executing the next stage; configuring a corresponding parameter set for each stage; controlling the bonding head to apply force according to the output signal and continuously outputting the signal for a specified time; simultaneously, when the signal starts outputting, performing a delay timer for the monitoring stage; after the timer reaches the monitoring delay duration, entering the monitoring state; calculating the real-time speed parameter; and comparing the real-time speed parameter with a deformation speed threshold to avoid over-soldering or under-soldering caused by a fixed time. This wire bonding time optimization method and system improves bonding quality consistency, reduces soldering time, and adapts to solder joints with different deformation characteristics.

Description

Technical Field

[0001] This application belongs to the field of semiconductor packaging technology, specifically relating to a method and system for optimizing wire bonding time based on dynamic deformation monitoring. Background Technology

[0002] In current mainstream chip packaging processes, wire bonding, as an important bonding process, employs thermo-ultrasonic welding. This mainly includes ball bonding of the first solder joint at the circuit chip's lead-out end and wedge bonding of the second solder joint at the lead frame's access end, as well as the different arc shapes formed by the bonding wires during the welding process. With the development of AI technology, the market demand for memory packaging chips is increasingly strong. To increase the storage capacity of a single packaged device, a stacking process involving multiple semiconductor chips is typically used to achieve high integration density packaging.

[0003] The suspended structure process typically creates a suspended configuration, causing the solder joints of the chip material to be suspended. After the first solder joint is soldered, the material undergoes elastic deformation. After soldering is completed and the welding force is removed, the material needs a certain amount of time to elastically recover to a stable state. If an arc-drawing action (i.e., moving from the first solder joint to the second solder joint) is performed before the material has fully recovered, the initial height of the arc will deviate from the target value, resulting in abnormal arc shape, inconsistent arc height, or even wire breakage.

[0004] Traditional solutions mainly fall into two categories: Firstly, after the first weld point is completed, the welding head is not outputting welding force. After waiting for a period of time, the arc trajectory movement is then initiated. The drawback of this approach is that the fixed waiting time must be set according to the weld point with the slowest deformation recovery, causing most weld points to suffer unnecessary waiting, resulting in low efficiency. At the same time, different weld points have significantly different elastic recovery times due to their different suspension positions, making it difficult to ensure that the fixed time is compatible with all weld points and cannot guarantee the consistency of the arc starting height.

[0005] Secondly, by pre-measuring the deformation of the material under different contact forces, a "force-displacement" mapping model is established, and position compensation is performed during the bonding process. Although this approach can theoretically eliminate deformation differences, it requires selecting a reference point with almost no deformation as the calibration reference, which places stringent requirements on the material itself and the measurement environment. Furthermore, it requires extensive data collection and modeling beforehand, resulting in less than ideal versatility. Recalibration is necessary after changing products, leading to high process conversion costs. Summary of the Invention

[0006] To address the inefficiency caused by setting excessively long fixed waiting times for material elastic recovery in existing technologies, and the lack of versatility due to the reliance on reference points and pre-calibration in traditional compensation schemes, this invention proposes a method and system for optimizing wire bonding time based on dynamic deformation monitoring. This method eliminates the need for preset fixed waiting times, pre-measurement of deformation, and selection of reference points. Instead, it monitors the rate of material deformation at different stages of the welding process in real time, and determines the end of the deformation process based on the difference between the rate of change and the actual set threshold obtained by the algorithm. This precisely controls the arc trajectory of the bonding head, eliminates the influence of material elastic deformation, and improves production efficiency and process versatility.

[0007] The technical solution is as follows: Firstly, a method for optimizing wire bonding time based on dynamic deformation monitoring is provided, including: The welding process of the weld joint is divided into several continuous stages, and a corresponding parameter set is configured for each stage. The parameter set includes: output signal, signal continuous output time, delay time for entering the monitoring stage, and deformation rate threshold. When executing the current stage, the control head applies force according to the output signal and continues to output the signal for a continuous time. At the same time, when the signal starts to output, a delay timer is set for the monitoring stage. After the timer reaches the monitoring delay duration, the monitoring state is entered. In monitoring mode, the displacement parameters of the solder joint are collected in real time, the real-time velocity parameters are calculated based on the displacement parameters of the solder joint, and the real-time velocity parameters are compared with the deformation velocity threshold. The motion state of the solder joint is fed back in real time through the displacement sensor, and the motion control card automatically compares and coordinates with the host computer to form a closed-loop control system, which can adapt to individual differences of the solder joint without manual intervention.

[0008] When the real-time speed parameter (deformation parameter) is less than or equal to the deformation speed threshold, the deformation process is determined to be over, and this stage is completed. After completing each stage in sequence, the welding of the weld joint is completed, and the arc pulling action is performed.

[0009] It supports independent configuration of output signals, signal duration, monitoring delay, and deformation rate thresholds for each stage, which can flexibly adapt to the needs of different materials and bonding parameters, facilitating process development and rapid production conversion.

[0010] A further technical solution involves multiple continuous stages, including a contact stage, a welding stage, a post-weld stage, and a stop stage. During the stop stage, no signals are output; only data is monitored, and it is determined whether the welding of the joint is complete.

[0011] A further technical solution involves calculating the real-time speed parameter as follows: calculating the speed of the bridge at the current time point, and then filtering it using a moving average algorithm to obtain the filtered real-time speed parameter.

[0012] A further technical solution is that the calculation formula for the moving average algorithm is as follows: The calculation formula for the moving average algorithm is as follows: ; in, for t The speed of the moment, Indicates the radius of the sliding window; Indicates the number of sampling points; This represents the real-time velocity parameter after filtering. A moving average algorithm is used to filter the deformation velocity, effectively suppressing noise interference and making deformation determination more accurate and reliable, avoiding false triggers or missed detections.

[0013] Further technical solutions include: continuously calculating real-time speed parameters; if the signal output time of the current stage has reached the set signal time, ending the current stage and entering the next stage.

[0014] A further technical solution is that the method is applied to the packaging of memory chips with a stacked suspended structure, wherein different solder joints have different elastic deformation characteristics due to their different suspended positions.

[0015] Secondly, a wire bonding time optimization system based on dynamic deformation monitoring is provided to implement the aforementioned wire bonding time optimization method based on dynamic deformation monitoring, comprising the following steps: The host computer is used to configure the parameter sets for each stage and issue control commands. The motion control card is connected to the host computer and is used to receive control commands, control the head to move along a preset trajectory, and collect the displacement data of the head in real time to calculate the real-time speed parameters, compare them with the deformation speed threshold, and output a stage switching signal based on the comparison result. The bonding head is communicatively connected to the motion control card and is used to perform search motion, contact, welding and arc pulling actions; the bonding head is equipped with a displacement sensor to collect the displacement data of the bonding head in real time during the bonding process and feed it back to the motion control card.

[0016] In a further technical solution, the displacement sensor is a high-resolution displacement sensor.

[0017] The technical solution includes at least the following technical effects: Improve bonding quality consistency: By monitoring the deformation parameters (speed) of the bonding head in real time and comparing them with the threshold, the end point of each welding stage can be accurately determined, avoiding over-welding or under-welding caused by fixed time control. It is especially suitable for scenarios where the elastic deformation characteristics of different weld points in stacked suspended structures are greatly different.

[0018] Shorten the welding cycle and improve production efficiency: Abandon the traditional fixed-time waiting method, and switch to the next stage immediately after the deformation is completed in each stage, reducing unnecessary waiting time and thus optimizing the overall wire bonding time. Attached Figure Description

[0019] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0020] Figure 1 A flowchart of a wire bonding time optimization method based on dynamic deformation monitoring is provided for a preferred embodiment of this application; Figure 2 The flowchart illustrates the steps of a preferred embodiment of this application, which includes a contact stage, a welding stage, and a post-weld stage. Detailed Implementation

[0021] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0022] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0023] like Figure 1 As shown, in one practical embodiment, a wire bonding time optimization method based on dynamic deformation monitoring is provided, including the following steps: The soldering process is divided into four stages: contact, soldering, post-soldering, and stopping. The complete soldering process is as follows: At each stage, a set signal is output, the soldering head performs an action, and the system enters real-time monitoring logic. Simultaneously, it determines whether the deformation process has ended. If the signal output duration has not reached the set duration, the current stage can be terminated early to proceed to the next stage; otherwise, it waits for the signal output duration of the current stage to reach the set duration before proceeding to the next stage. Once all stages have been executed according to this process, the soldering process is complete.

[0024] The welding process of the weld joint is divided into multiple continuous stages, and a corresponding parameter set is configured for each stage. The parameter set includes: output signal, signal duration, monitoring delay, and deformation rate threshold. The output signal represents the magnitude of the welding force output by the weld head, and the signal duration represents the time the welding force is output. The delay before entering the monitoring stage indicates the time after which deformation is detected after the signal starts outputting; the minimum set value is no less than 2ms to avoid false alarms, and the maximum set value does not exceed the signal duration. The deformation rate threshold represents the threshold for the change in weld head speed. When the real-time speed of the weld head is not greater than this threshold (i.e., the real-time speed parameter ≤ deformation rate threshold), the material deformation is considered complete.

[0025] When executing the current stage, the control head applies force according to the output signal and continues to output the signal for a continuous time. At the same time, when the signal starts to output, a delay timer is set for the monitoring stage. After the timer reaches the monitoring delay duration, the monitoring state is entered. In monitoring mode, the displacement parameters of the bearing head are collected in real time, the real-time velocity parameters are calculated based on the displacement parameters of the bearing head, and the real-time velocity parameters are compared with the deformation velocity threshold. When the real-time speed parameter is less than or equal to the deformation speed threshold, the deformation process is determined to be over, and this stage is completed. After completing each stage in sequence, the welding of the weld joint is completed, and the arc pulling action is performed.

[0026] The real-time speed parameter is calculated as follows: the measured speed value of the bridge head at the current time point is calculated, and the moving average algorithm is used for filtering to obtain the filtered real-time speed parameter.

[0027] The calculation formula for the moving average algorithm is as follows: in, for t The speed of the moment, Indicates the radius of the sliding window; Indicates the number of sampling points; This represents the real-time velocity parameters after filtering.

[0028] The method also includes: continuously calculating real-time speed parameters; if the real-time speed parameters are less than or equal to the deformation speed threshold, or if the output time of the current stage has reached the signal set time, the current stage can be ended and the next stage can be entered.

[0029] The method is particularly suitable for scenarios where different solder joints in a stacked, suspended structure exhibit significantly different elastic deformation characteristics. These different solder joints have varying elastic deformation characteristics due to their different suspended positions.

[0030] In another embodiment, a method system for optimizing wire bonding time based on dynamic deformation monitoring is provided. This system comprises a host computer, a motion control card, a bonding head, and displacement sensors. Deeply integrated into the wire bonding machine, this system achieves precise monitoring and determination of material deformation during the bonding process through the collaborative work of its modules.

[0031] The specific components are as follows: The host computer is used to configure parameters for each welding stage and issue control commands.

[0032] The motion control card, communicating with the host computer, issues control commands based on the host computer's control instructions to control the bonding head to move along a preset trajectory. The motion control card is a dedicated motion control card based on a high-performance multi-core digital signal processor. It is responsible for receiving calibration program commands from the host computer and converting them into high-precision control signals that can be recognized by the actuator. Its function is to precisely control the motor of the bonding head module to complete simulated wire welding actions such as pressing, contacting, and welding at a predetermined speed, acceleration, and trajectory. This ensures that the relevant commands given during the welding mode are consistent with the actual welding, and accurately corresponds the applied welding force with the displacement measurement of the bonding head, thereby obtaining a series of discrete data points.

[0033] The bonding head, communicating with the motion control card, is used to execute wire bonding operations according to the position commands. The bonding head module is a highly integrated mechanical actuator and force-bearing carrier. It typically consists of a high-precision linear motor, a guide rail, and the bonding head. During the measurement process, as an actuator, it accurately completes mechanical actions such as contact leveling and welding under the drive of the motion control card.

[0034] A displacement sensor, mounted on the bonding head, measures the displacement data (displacement position) of the bonding head during the bonding process and feeds the displacement data back to the host computer. A high-resolution displacement sensor is preferred; this is a precision measuring device such as a grating ruler, which can detect micron-level displacement changes at the end of the bonding head in real time, continuously, and with high precision when welding force is applied. The collected displacement data is a crucial basis for calculating material deformation and forms the foundation for all subsequent calculations.

[0035] The entire welding process is executed in the following order: “output the signal of the current stage, execute the action, enter the real-time monitoring stage, determine whether the deformation has ended, and execute the next stage.”

[0036] The deformation process refers to the deformation of the material under the influence of welding forces. In the specific implementation, after the welding head contacts the material, its initial velocity is 0. After the welding head force is output, the material begins to deform under stress. In mechanical theory, to maintain the force balance on the welding head, it will move along with the material's deformation direction. At this time, the feedback velocity of the welding head, calculated and collected by a displacement sensor, will gradually increase from 0. After the deformation stabilizes, i.e., after the output welding head force and the material's deformation rebound force are balanced, the feedback velocity of the welding head will slowly decrease to 0. Through this design method, the deformation process of the material can be reflected by the change in real-time velocity parameters. That is, the deformation of the material can be characterized by the real-time velocity parameters fed back by the welding head. Therefore, by monitoring the real-time velocity parameters of the welding head, the deformation state of the material can be monitored. Furthermore, by determining the magnitude of the real-time velocity parameters, it can be determined whether the deformation has ended.

[0037] The application of the first weld point is illustrated using four welding stages as an example; in practical applications, more welding stages can be set. The entire process can be divided into four stages: contact stage, welding stage, post-weld stage, and stop stage. The contact stage, welding stage, and post-weld stage each have independent output settings, meaning different forces need to be output. The stop stage does not output any signals; it only monitors data and determines whether the welding of the first weld point is complete.

[0038] The output signals (indicating the magnitude of the welding force output by the welding head) for the contact phase, welding phase, post-weld phase, and stop phase are respectively the contact signal. Welding signals , post-weld signal and stop signal The signal output duration (output time represents the duration of welding force output) is the contact signal output duration. Welding signal duration Post-welding signal duration and the duration of the stop signal output Among them, contact signals Welding signals and post-weld signals The parameters that can remain unchanged can be set independently, and the stop signal can be activated. Fixed to 0; contact signal continuous output time Welding signal duration Post-welding signal duration and the duration of the stop signal output This is a time setting that can be done independently. Simultaneously, the monitoring delay for these four stages can be set: Contact Stage Monitoring Delay Time Welding stage monitoring delay time Post-welding stage monitoring delay time and the monitoring delay time during the stop phase And deformation rate threshold: deformation rate threshold during the contact stage Deformation rate threshold during welding stage Post-welding stage deformation rate threshold and the deformation rate threshold during the stopping phase These parameters can also be set independently. This creates four parameter sets: contact phase parameter set. Welding stage parameter set Post-welding stage parameter set Stopping phase parameter set : ; ; ; ; Each of the four stages has four sets of corresponding parameters. Taking the first stage, the contact stage, as an example, given a contact signal... After the output, the contact signal should theoretically be continuously output for a certain duration. Start outputting contact signal Simultaneously, as an initial delay, the monitoring delay time is initiated during the contact phase. Then it enters monitoring mode, where the underlying system continuously calculates the actual real-time speed parameters using algorithms. If real-time speed parameters are detected Not greater than the deformation rate threshold When the criteria are met, the deformation process is essentially complete. Specifically, the contact phase ends and the next phase begins when the real-time speed parameter is less than or equal to the deformation speed threshold, or when the signal output duration during the contact phase reaches the set duration. The parameters for the subsequent three phases can be determined according to the welding phase parameter set. Post-welding stage parameter set and stopping phase parameter set Given that the execution flow is the same as the first phase contact phase.

[0039] Specifically, in real-time monitoring mode, real-time speed parameters will be acquired during the monitoring period. This real-time speed parameter is obtained and calculated in real time through sampling by a high-resolution displacement sensor and a motion control card. The collected dataset is as follows: ; ; ; in, Indicates the number of samples. ... Indicates the first... The time point of each sampled data point ... Indicates the first... The real-time speed parameters of the header of each sampled data point.

[0040] Based on these datasets, the underlying system can dynamically calculate the real-time velocity parameters at the current point in time. In actual calculations, the moving average algorithm will be introduced: exist At time 1, the data obtained at adjacent time points are summed and then averaged. in, for t The measured value of the speed at the moment of the incident. This represents the radius of the sliding window, which is the actual number of sampling points used to calculate the average velocity. It typically ranges from 3 to 5. This indicates the number of sampling points. This represents the real-time velocity parameter after filtering, which can be compared with the deformation velocity threshold. Comparisons are made to achieve dynamic determination.

[0041] like Figure 2 The following are the specific process steps, taking the three stages of "contact stage, welding stage, and post-weld stage" as an example: The motion control card first executes a search motion based on the set welding parameters, controlling the welding head to descend to the material surface. Upon entering the contact phase, the system outputs the set output signal for that phase. After the timeout period, it checks in real-time whether the threshold conditions for that phase are met. If the real-time speed parameter is not greater than the set threshold, or if the preset signal output time for the current phase is reached, the contact phase can be terminated early or on time, and the system can transition to the welding phase, outputting the welding phase signal.

[0042] During the welding stage, the set output signal for the welding stage is output. After the timer reaches the monitoring delay, it is checked in real time whether the threshold judgment condition for this stage is met. If the real-time speed parameter is not greater than the set parameter threshold, or if the preset signal continuous output time for the current stage is reached, the welding stage can be terminated early or on time and the process can switch to the post-weld stage, outputting the post-weld stage output signal.

[0043] In the post-welding stage, the set output signal for the post-welding stage is output. After the timer reaches the monitoring delay time, it is monitored in real time to see if the threshold judgment condition for this stage is met. If the real-time speed parameter is not greater than the set parameter threshold, or if the preset signal continuous output time for the current stage is reached, the welding stage can be terminated early or on time, the first weld point is determined to be completed, and then the arc pulling action is executed to start moving to the second weld point.

[0044] Throughout the process, the motion control card is responsible for acquiring the bonding speed of the bond head caused by real-time material deformation, calculating the real-time speed, and comparing the real-time speed parameter with the set speed threshold parameter to dynamically determine whether the material deformation process has ended. It does not need to wait for the fixed preset time to be completely exhausted, thereby minimizing the bonding period of a single wire while ensuring deformation stability.

[0045] In actual verification, using data from a 25-line product, it was observed that without the dynamic judgment and monitoring function enabled, multiple lines exhibited wire breakage due to arcing. After enabling this function, the arcing consistency of the 25 lines was good, with a maximum arc height difference of <6µm, and no wire breaks occurred, demonstrating excellent performance.

[0046] The core of this invention lies in the real-time monitoring of the material deformation rate at different welding stages. Based on an algorithm, the difference between the deformation rate and a pre-set threshold is calculated to dynamically determine whether the material deformation process at the current stage has ended. This deformation process includes both the deformation caused by stress and the recovery process after stress is released. The key to this method lies in the reasonable control of the monitoring start time and the setting of the threshold. Accurate determination of both the occurrence and recovery of deformation is crucial.

[0047] This invention addresses two main issues. First, it solves the problem of long welding times and low efficiency caused by waiting for material deformation to recover before arcing. Second, it allows for automatic software determination of deformation completion, precisely controlling the arcing trajectory of the bonding head and eliminating the effects of material elastic deformation. This significantly improves the stability and consistency of bonding quality.

[0048] Applying the method of this invention can not only improve production efficiency, but also enhance the quality of the arc, including but not limited to arc height consistency and stability, providing important technical support for enhancing advanced packaging capabilities.

[0049] Those skilled in the art will understand that embodiments of this application can be provided as methods, systems, or computer program products. Therefore, this application can take the form of a completely hardware embodiment, a completely software embodiment, or an embodiment combining software and hardware aspects. Furthermore, this application can take the form of a computer program product embodied on one or more computer-usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) containing computer-usable program code.

[0050] This application is described with reference to flowchart illustrations and / or block diagrams of methods, apparatus (systems), and computer program products according to embodiments of this application. It will be understood that each block of the flowchart illustrations and / or block diagrams, and combinations of blocks in the flowchart illustrations and / or block diagrams, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, special-purpose computer, embedded processor, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, generate instructions for implementing the flowchart... Figure 1 One or more processes and / or boxes Figure 1 A system that specifies functions in one or more boxes.

[0051] These computer program instructions may also be stored in a computer-readable storage medium that can direct a computer or other programmable data processing device to function in a particular manner, such that the instructions stored in the computer-readable storage medium produce an article of manufacture including an instruction set implemented in a process. Figure 1 One or more processes and / or boxes Figure 1 The function specified in one or more boxes.

[0052] These computer program instructions may also be loaded onto a computer or other programmable data processing equipment to cause a series of operational steps to be performed on the computer or other programmable equipment to produce a computer-implemented process, thereby providing instructions that execute on the computer or other programmable equipment for implementing the process. Figure 1One or more processes and / or boxes Figure 1 The steps of the function specified in one or more boxes.

[0053] Although preferred embodiments of this application have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments as well as all changes and modifications falling within the scope of this application.

Claims

1. A method for optimizing wire bonding time based on dynamic deformation monitoring, characterized in that, include: The welding process of the weld joint is divided into multiple continuous stages, and a corresponding parameter set is configured for each stage. The parameter set includes: output signal, signal continuous output time, delay time for entering the monitoring stage, and deformation rate threshold. When executing the current stage, the control head applies force according to the output signal and continues to output the signal for a continuous time. At the same time, when the signal starts to output, a delay timer is set for the monitoring stage. After the timer reaches the monitoring delay duration, the monitoring state is entered. In monitoring mode, the displacement parameters of the bearing head are collected in real time by displacement sensors, the real-time velocity parameters are calculated based on the displacement parameters of the bearing head, and the real-time velocity parameters are compared with the deformation velocity threshold. When the real-time speed parameter is less than or equal to the deformation speed threshold, the deformation process is determined to be over, and this stage is completed. After completing each stage in sequence, the welding of the weld joint is completed, and the arc pulling action is performed.

2. The wire bonding time optimization method based on dynamic deformation monitoring according to claim 1, characterized in that, The process consists of multiple continuous phases, including the contact phase, welding phase, post-weld phase, and stop phase. During the stop phase, no signals are output; only data is monitored, and the welding of the joint is determined.

3. The wire bonding time optimization method based on dynamic deformation monitoring according to claim 1, characterized in that, The method for calculating the real-time speed parameters is as follows: calculate the speed of the bridge head at the current time point, and use the moving average algorithm for filtering to obtain the filtered real-time speed parameters.

4. The wire bonding time optimization method based on dynamic deformation monitoring according to claim 3, characterized in that, The calculation formula for the moving average algorithm is as follows: in, for t The speed of the moment, Indicates the radius of the sliding window; Indicates the number of collections One data point, This represents the real-time velocity parameters after filtering.

5. The wire bonding time optimization method based on dynamic deformation monitoring according to claim 1, characterized in that, Also includes: The system continuously calculates real-time speed parameters. If the signal output time of the current stage has reached the set signal duration, the current stage ends and the system enters the next stage.

6. The wire bonding time optimization method based on dynamic deformation monitoring according to claim 1, characterized in that, The method is applied to memory chip packaging with a stacked suspended structure, wherein different solder joints have different elastic deformation characteristics due to their different suspended positions.

7. A wire bonding time optimization system based on dynamic deformation monitoring, used to implement the wire bonding time optimization method based on dynamic deformation monitoring as described in any one of claims 1 to 6, characterized in that, include: The host computer is used to configure the parameter sets for each stage and issue control commands. The motion control card is connected to the host computer and is used to receive control commands, control the head to move along a preset trajectory, and collect the displacement data of the head in real time to calculate the real-time speed parameters, compare them with the deformation speed threshold, and output a stage switching signal based on the comparison result. The bonding head is communicatively connected to the motion control card and is used to perform search motion, contact, welding and arc pulling actions; the bonding head is equipped with a displacement sensor to collect the displacement data of the bonding head in real time during the bonding process and feed it back to the motion control card.

8. The wire bonding time optimization system based on dynamic deformation monitoring according to claim 7, characterized in that, The displacement sensor is a high-resolution displacement sensor.

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