Water circulating device, cutting device, and method for manufacturing cut product

Abstract

The water circulation device (30) cools the main shaft (6) with first water (W1) or second water (W2), which drives the blade (8) that cuts the object (Sb) to rotate. The water circulation device (30) includes: a tank (31) for storing first water (W1); a pump (32) connected to the tank (31) for pumping the first water (W1) toward the main shaft (6); a circulation path (F) configured to allow the first water (W1) flowing out of the tank (31) to flow back into the tank (31) via the pump (32) and the main shaft (6); a switching valve (34) for switching the first water (W1) flowing in the circulation path (F) to second water (W2); and a control unit (50) for controlling the operation of the pump (32) and the switching valve (34). When the control unit (50) senses an abnormality in the circulation of the first water (W1), it controls the switching valve (34) to allow the second water (W2) to circulate in the circulation path (F).

Description

Technical Field

[0001] This disclosure relates to a water circulation device, a cutting device, and a method for manufacturing a cut-off item. Background Technology

[0002] Generally, a substrate with a semiconductor chip or the like fixed on it is sealed in resin and then cut into a single piece by a cutting device, thereby being used as an electronic component. Cutting devices for cutting resin-sealed substrates are known. When cutting the substrate by the cutting device, water (cutting fluid) is used to cool the cutting blade and the substrate and to remove machining chips. Furthermore, water different from the cutting fluid (cooling water) is used to cool the spindle that rotates the blade. From a water-saving perspective, this water is sometimes recycled.

[0003] Patent Document 1 discloses a water circulation device for recycling water (processing water) used in cooling the blade and removing processing debris during the cutting of a resin-sealed substrate by a cutting device (processing device in Patent Document 1). The water after cutting the substrate contains impurities such as processing debris and cannot be directly reused. In the water circulation device disclosed in Patent Document 1, the water after substrate cutting is filtered, irradiated with ultraviolet light, and has impurity ion removed to regenerate water suitable for substrate cutting, thereby enabling reuse.

[0004] Existing technical documents Patent documents Patent Document 1: Japanese Patent Application Publication No. 2021-122794 Summary of the Invention

[0005] The problem that the invention aims to solve To recycle the water (waste liquid in Patent Document 1) after substrate cutting, water is pumped using pumps (a waste liquid supply pump and a clean water supply pump in Patent Document 1). The pumped water is then filtered, irradiated with ultraviolet light, and has impurity ion removed to regenerate water suitable for substrate cutting. However, in cases where water circulation malfunctions due to pump failure or other reasons, pumping of water becomes impossible. In such situations, water circulation ceases, and therefore water for cutting cannot be supplied to the substrate, making it impossible to cut the substrate using the cutting device.

[0006] Furthermore, although not mentioned in Patent Document 1, the water used to cool the spindle that rotates the blade is sometimes circulated and reused using a pump. However, in this case, if a circulation abnormality occurs due to pump failure or other reasons, water circulation ceases, and therefore the spindle can no longer be properly cooled.

[0007] Therefore, a water circulation device, a cutting device, and a method for manufacturing a cutting product are desired to ensure a continuous water supply even in the event of a circulation malfunction.

[0008] Solution for solving the problem One embodiment of the water circulation device disclosed herein is a water circulation device that cools a spindle section by means of a first water or a second water, the spindle section driving a blade that cuts an object to be cut to rotate. The water circulation device includes: a tank for storing the first water; a pump connected to the tank for pressurizing the first water stored in the tank toward the spindle section; a circulation path configured to allow the first water flowing out of the tank to flow back into the tank via the pump and the spindle section; a switching valve capable of switching the flow of the first water in the circulation path to the second water; and a control unit for controlling the operation of the pump and the switching valve, the control unit controlling the switching valve to allow the second water to flow in the circulation path when it senses an abnormality in the circulation of the first water.

[0009] One embodiment of the cutting device disclosed herein includes: the water circulation device described above; and a cutting mechanism including a platform for holding the object to be cut, a blade for cutting the object placed on the platform, and a spindle for rotating the blade.

[0010] One embodiment of the method for manufacturing a cut-off item disclosed herein is a method for manufacturing a cut-off item using the cutting device described above, comprising: a cooling step in which the first water is circulated in the circulation path through the water circulation device to cool the spindle portion; a fixing step in which, after the object to be cut is placed on the mounting table, a water-sealed vacuum pump is operated to fix the object to be cut on the mounting table; and a cutting step in which the object to be cut is cut by the cutting mechanism to obtain a cut-off item.

[0011] Invention Effects According to embodiments of this disclosure, a water circulation device, a cutting device, and a method for manufacturing a cutting product are provided that can continuously supply water even in the event of a circulation malfunction. Attached Figure Description

[0012] Figure 1 It is a three-dimensional view showing the completed substrate and electronic components.

[0013] Figure 2 This is a top view showing the cutting device.

[0014] Figure 3 This is a diagram showing the structure of a water circulation device. Detailed Implementation

[0015] Hereinafter, embodiments of the water circulation device, cutting device, and method for manufacturing the cut-off article of this disclosure will be described in detail with reference to the accompanying drawings. It should be noted that the embodiments described below are examples for illustrating the manufacturing method of the water circulation device, cutting device, and cut-off article, and the manufacturing method of the water circulation device, cutting device, and cut-off article is not limited to these embodiments. Therefore, the manufacturing method of the water circulation device, cutting device, and cut-off article of this disclosure can be implemented in various ways without departing from its spirit.

[0016] A substrate containing semiconductor chips and other components is sealed with resin and then cut into single-piece pieces for use as electronic components. A specialized cutting device is used to cut the resin-sealed substrate.

[0017] Resin sealing of a substrate is performed by placing the substrate in a molding die (not shown) of a resin molding apparatus and supplying liquid molten resin into the die. The molten resin can be either a thermoplastic resin or a thermosetting resin. Thermosetting resins decrease in viscosity upon heating and polymerize and solidify upon further heating, becoming cured resins. Ideally, thermosetting resins should be used when resin sealing substrates to which components such as semiconductor chips are attached. The sealed resin protects the components attached to the substrate.

[0018] [The structure of the completed substrate] like Figure 1 As shown, the cutting device 1 in this embodiment (refer to...) Figure 2 The molded substrate Sb (an example of the object to be cut) is a substrate on which a resin package 65 is formed on the side of the element 61 by sealing a substrate 63 to which multiple elements 61 are fixed with resin. The element 61 is, for example, an integrated circuit (semiconductor chip). Electrodes 61a are part of the element 61 and are exposed on the side opposite to the resin package 65 relative to the substrate 63. In this embodiment, multiple elements 61 are fixed on a substrate 63, and each element 61 has multiple electrodes 61a. Figure 1 In the example, the number of elements 61 fixed to a substrate 63 is 21, and the number of electrodes 61a of each element 61 is four. However, the number of elements 61 fixed to a substrate 63 is not limited to 21, and the number of electrodes 61a of each element 61 is not limited to four. Figure 1 The dashed lines in the diagram indicate the portions cut by the cutting device 1, which will be described later. It should be noted that... Figure 1In the upper right corner, three electronic components Sc (an example of cut products) are shown after being cut from the molded substrate Sb by the cutting device 1 of this embodiment. Each electronic component Sc has one element 61. Examples of electronic components Sc include BGA (Ball Grid Array) substrates, LGA (Land Grid Array) substrates, CSP (Chip Size Package) substrates, LED (Light Emitting Diode) substrates, and QFN (Quad Flat No-leaded) substrates. Furthermore, the molded substrate Sb of this embodiment is not limited to the substrate 63 with the element 61 fixed and sealed with resin. The molded substrate Sb may also be a wiring substrate with single or multiple layers of wiring implemented without the element 61 fixed.

[0019] [Composition of the cutting device] Figure 2 This is a schematic top view of the cutting device 1 according to this embodiment. The cutting device 1 is configured to cut the molded substrate Sb into multiple electronic components Sc (see reference). Figure 1 The following section will show the resin-sealed side (the side with the resin encapsulation 65) of the two sides of the molded substrate Sb. Figure 1 The lower side of the face is called the surface, and the face opposite to the surface is called the lower side of the face. Figure 1 The upper side of the middle part is called the back side.

[0020] The cutting device 1 comprises a cutting module A1 (an example of a cutting mechanism) and an inspection and storage module B1. The cutting module A1 manufactures multiple electronic components Sc by cutting the formed substrate Sb. The inspection and storage module B1 inspects each manufactured electronic component Sc and then stores the electronic components Sc in either a qualified product tray 15a or a non-qualified product tray 15b. In the cutting device 1, both the cutting module A1 and the inspection and storage module B1 are detachable and replaceable.

[0021] The control unit 50 of the cutting device 1 includes a processor such as a CPU (Central Processing Unit) and a storage device such as RAM (Random Access Memory) or ROM (Read Only Memory). The control unit 50 controls the operation of each part of the cutting module A1 and the inspection and storage module B1 of the cutting device 1 by executing a control program stored in the storage device via the processor. Unless otherwise specified, the operation of the cutting device 1 described below is based on the operating instructions of the control unit 50. In the following description, the operating instructions of the control unit 50 will generally be omitted, but will be described as needed.

[0022] The cutting module A1 mainly includes a substrate supply unit 3, a positioning unit 4, a cutting worktable 5 (an example of a mounting stage), a spindle unit 6, a conveying unit 7, and a water circulation device 30. In addition, the cutting module A1 includes a portion of a first vacuum pump D1 and a second vacuum pump D2 (an example of a water-sealed vacuum pump).

[0023] The substrate supply unit 3 pushes out the molded substrates Sb one by one from the hopper M1 that contains multiple molded substrates Sb, thereby supplying the molded substrates Sb one by one to the positioning unit 4.

[0024] The positioning unit 4 positions the molded substrate Sb by placing it onto the guide rail 4a after it has been pushed out from the substrate supply unit 3. Then, the positioning unit 4 transports the positioned molded substrate Sb to the cutting table 5.

[0025] The cutting stage 5 holds the molded substrate Sb to be cut. In this embodiment, the cutting module A1 has two cutting stages 5. A second vacuum pump D2 is connected to each of the two cutting stages 5 via a second suction path VR2. That is, the cutting module A1 is equipped with two second suction paths VR2 and two second vacuum pumps D2. The second vacuum pump D2 is a water-sealed vacuum pump. The configuration of a water-sealed vacuum pump is well known, therefore detailed description is omitted.

[0026] Each cutting worktable 5 includes a holding member 5a, a rotating mechanism 5b, and a moving mechanism 5c. The holding member 5a holds the molded substrate Sb, which is conveyed to the positioning section 4, and uses a second vacuum pump D2 to draw air from below to adsorb it, thereby holding the molded substrate Sb. Thus, the molded substrate Sb is fixed to the cutting worktable 5. The detailed structure of the cutting worktable 5 and the structure by which the molded substrate Sb is fixed to the holding member 5a by adsorption will be described later.

[0027] Rotating mechanism 5b can cause retaining member 5a to move towards Figure 2 The moving mechanism 5c can rotate the holding member 5a along the θ1 direction. Figure 2 The Y-axis movement. It should be noted that... Figure 2 The Z direction shown is the vertical direction. The arrangement direction of the cutting module A1 and the inspection and storage module B1 is the X direction. The direction perpendicular to the X and Z directions (the depth direction of each module) is the Y direction. The θ1 direction is the rotation direction around the Z axis.

[0028] The spindle section 6 includes a motor 6a and a rotating shaft 6b that outputs the rotational driving force of the motor 6a. A blade 8 is disposed at the top end of the rotating shaft 6b. The spindle section 6 rotates the rotating shaft 6b by the rotational driving force, and the blade 8 rotates by the rotation of the rotating shaft 6b. The blade 8 cuts the molded substrate Sb by high-speed rotation, and monolithically converts the molded substrate Sb into multiple electronic components Sc.

[0029] In this embodiment, the cutting module A1 has two main shaft sections 6. The main shaft sections 6 can move along... Figure 2 The X and Z axes can move. It should be noted that the cutting module A1 can also be configured to have a main spindle section 6.

[0030] The spindle section 6 is equipped with nozzles for cutting fluid, cooling water, and cleaning water (none shown). The cutting fluid nozzles spray cutting fluid onto the high-speed rotating blade 8. The cooling water nozzles spray cooling water onto the blade 8, which is heated during cutting, and the formed substrate Sb. The cleaning water nozzles spray cleaning water to clean the chips and other debris. The sprayed cutting fluid, cooling water, and cleaning water are discharged to the outside of the cutting module A1.

[0031] The motor 6a of the main spindle 6 generates heat during operation, and is therefore cooled by water such as industrial water. The cutting device 1 includes a water circulation device 30 that circulates the water, allowing the first cooling water W1 (an example of first water) used to cool the motor 6a to be recycled (see reference). Figure 3 The detailed structure of the water circulation device 30 will be described later.

[0032] The conveying unit 7 adsorbs the electronic component Sc, which is being cut and held on the cutting table 5, from above and transports it to the inspection table 11 of the inspection and storage module B1. A first vacuum pump D1 is connected to the conveying unit 7 via a first suction path VR1. The first vacuum pump D1 is a water-sealed vacuum pump. The conveying unit 7 uses the first vacuum pump D1 to evacuate air to adsorb the electronic component Sc.

[0033] The inspection and storage module B1 mainly comprises an inspection workbench 11, a first optical inspection camera 12, a second optical inspection camera 13, a placement unit 14, and an extraction unit 15. It should be noted that the first optical inspection camera 12 may also be located in the cutting module A1. Furthermore, the inspection and storage module B1 includes a portion of the first vacuum pump D1. That is, the first vacuum pump D1 exists across both the cutting module A1 and the inspection and storage module B1.

[0034] The inspection table 11 holds the electronic component Sc so that optical inspection of the electronic component Sc can be performed by the first optical inspection camera 12 and the second optical inspection camera 13. The inspection table 11 can move along... Figure 2 The X-axis movement. The inspection worktable 11 is equipped with a holding member (not shown) that is used to adsorb and hold the electronic component Sc by suction from the first vacuum pump D1.

[0035] The first optical inspection camera 12 and the second optical inspection camera 13 capture images of both sides (surface and back) of the electronic component Sc. Various inspections of the electronic component Sc are performed based on the image data captured by the first optical inspection camera 12 and the second optical inspection camera 13. The first optical inspection camera 12 and the second optical inspection camera 13 are respectively configured to capture images from above near the inspection workbench 11.

[0036] The inspected electronic components Sc (see reference) are placed in the configuration section 14 via the inspection workbench 11. Figure 1 The first vacuum pump D1 is connected to the configuration unit 14 via the first suction path VR1.

[0037] Extraction unit 15 transfers the electronic component Sc, which is disposed in configuration unit 14, to the tray. Electronic component Sc (refer to...) Figure 1 The extraction unit 15 classifies products into "qualified" or "unqualified" products based on the inspection results obtained using the first optical inspection camera 12 and the second optical inspection camera 13.

[0038] The cutting device 1 also includes a monitor 20 and a sound output unit 25. The monitor 20 is configured to display images. The monitor 20 is, for example, a display device such as a liquid crystal monitor or an organic EL (Electro Luminescence) monitor. The sound output unit 25 is configured to output sound. The sound output unit 25 is, for example, a sound output device such as a speaker, a buzzer, or a bell.

[0039] [Composition of the water circulation device] Next, use Figure 3The water circulation device 30 will be described. As described above, the water circulation device 30 has the function of circulating and reusing the first cooling water W1 that cools the main shaft section 6 (particularly the motor 6a). The water circulation device 30 includes a tank 31, a water pump 32 (an example of a pump), a cooler 33, a switching valve 34, a sensor group 35, a first vacuum pump D1, a second vacuum pump D2, a separator 37, a filter 38, and a circulation path F through which the first cooling water W1 flows. The water circulation device 30 has one first vacuum pump D1 and two second vacuum pumps D2, but since all three vacuum pumps have the same configuration including the flow path, therefore... Figure 3 The diagram only shows a second vacuum pump D2 to illustrate this.

[0040] The circulating flow path F is configured to include a first flow path F1, a second flow path F2, a third flow path F3, a fourth flow path F4, and a fifth flow path F5. The first flow path F1 is located between the water pump 32 and the motor 6a. The second flow path F2 is located between the motor 6a and the tank 31. The third flow path F3 is located between the first flow path F1 and the second vacuum pump D2. The fourth flow path F4 is located between the second vacuum pump D2 and the separator 37. The fifth flow path F5 is located between the separator 37 and the tank 31. The third flow path F3 branches off from the first flow path F1, and the fifth flow path F5 merges with the second flow path F2 before reaching the tank 31.

[0041] Tank 31 stores circulating water, namely first cooling water W1. The first cooling water W1 is, for example, industrial water, tap water, or pure water. A water pump 32 is located downstream of tank 31 in the first flow path F1. The water pump 32 draws in and pressurizes the first cooling water W1 stored in tank 31, causing it to flow and circulate in the circulation path F. A cooler 33 is located downstream of the water pump 32 in the first flow path F1, cooling the first cooling water W1 flowing in from the water pump 32 and causing it to flow out through heat exchange with the refrigerant. The first cooling water W1 is, for example, water at a temperature lower than room temperature. The configurations of the water pump 32 and the cooler 33 are well-known, therefore detailed descriptions are omitted.

[0042] A sensor group 35 is disposed downstream of the cooler 33 in the first flow path F1 to detect the flow rate, water pressure, and water temperature of the first cooling water W1. The sensor group 35 consists of, for example, a flow sensor, a water pressure sensor, and a water temperature sensor. The sensor group 35 continuously detects the state of the first cooling water W1 flowing in the first flow path F1 and sends the detection results to the control unit 50.

[0043] A sixth flow path F6, which merges with the first flow path F1, is arranged between the cooler 33 and the sensor group 35 in the first flow path F1. Unlike the first cooling water W1 stored in the tank 31, a second cooling water W2 (an example of a second water) supplied from outside the water circulation device 30 flows in the sixth flow path F6. The second cooling water W2 is, for example, industrial water, tap water, or pure water, preferably the same type of water as the first cooling water W1. The second cooling water W2 cools the main shaft 6 in the same way as the first cooling water W1. The cooler 33 is not connected to the sixth flow path F6, and it merges with the first flow path F1 downstream of the cooler 33, so the second cooling water W2 is not cooled by the cooler 33. The second cooling water W2 is, for example, water at room temperature. A switching valve 34, consisting of a solenoid valve or the like, is arranged in the sixth flow path F6 to switch the opening and closing of the sixth flow path F6. When the switching valve 34 is closed, the second cooling water W2 does not merge with the first flow path F1. When the switching valve 34 is open, the second cooling water W2 merges with the first flow path F1. The opening and closing of the switching valve 34 is controlled by the control unit 50. When the shut-off device 1 is operating normally, the switching valve 34 is closed.

[0044] Although Figure 3 Although not shown in the diagram, the water circulation device 30 may also have a flow path that branches off from the sixth flow path F6 and supplies the second cooling water W2 to the tank 31. In this case, the second cooling water W2 stored in the tank 31 becomes the first cooling water W1.

[0045] The downstream end of the first flow path F1 is connected to a flow path for cooling the motor 6a of the main shaft section 6. The first cooling water W1 flowing in the first flow path F1 cools the motor 6a, for example, by flowing through an outer peripheral flow path (not shown) formed on the outer periphery of the motor 6a, or an inner flow path (not shown) formed inside the motor 6a and near the stator. The first cooling water W1 flowing in the outer and / or inner flow paths of the motor 6a flows back to the tank 31 through the second flow path F2. A filter 38 is disposed near the tank 31 in the second flow path F2, and the filter 38 removes foreign matter or the like contained in the flowing first cooling water W1.

[0046] As described above, the spindle 6 rotates the blade 8 by the rotational drive of the motor 6a, cutting the molded substrate Sb to monolithically form multiple electronic components Sc. The molded substrate Sb is adsorbed onto the holding member 5a of the cutting table 5. The holding member 5a is made of an elastic material such as rubber, and has an adsorption hole 5a1 as a through hole and a blade clearance groove 5a2 with a bottom groove.

[0047] Adsorption holes 5a1 are formed on the holding member 5a at the locations opposite each electronic component Sc, to adsorb the multiple electronic components Sc obtained by cutting the molded substrate Sb. By drawing air through the adsorption holes 5a1, the molded substrate Sb can be adsorbed and fixed to the holding member 5a. Blade clearance grooves 5a2 are clearance grooves used to prevent the blade 8 from cutting through the holding member 5a when cutting the molded substrate Sb. Therefore, blade clearance grooves 5a2 are formed between adjacent electronic components Sc on the molded substrate Sb.

[0048] The retaining member 5a is placed on the mesh member 5f and the base 5g. A first airflow path 5f1 communicating with the adsorption hole 5a1 is formed on the mesh member 5f. A second airflow path 5g1 communicating with the first airflow path 5f1 is formed on the base 5g. An exhaust hole 5g2 is formed on the bottom wall of the base 5g to exhaust air drawn from the adsorption hole 5a1 to the outside of the base 5g. Figure 3 In the middle, it appears that only the central second air flow path 5g1 is connected to the exhaust port 5g2 among the five second air flow paths 5g1, but in fact all five second air flow paths 5g1 are connected to the exhaust port 5g2.

[0049] The exhaust port 5g2 is connected to the third air flow path 5h. That is, the air drawn from the adsorption port 5a1 flows through the first air flow path 5f1 and the second air flow path 5g1 and is discharged from the exhaust port 5g2, thereby flowing through the third air flow path 5h. The downstream end of the third air flow path 5h (the end opposite to the exhaust port 5g2) is connected to the second vacuum pump D2. By operating the second vacuum pump D2, air is drawn from the adsorption port 5a1, thereby adsorbing and fixing the molded substrate Sb to the holding member 5a (cutting table 5).

[0050] Returning to the explanation of the circulating flow path F, a third flow path F3 branches off from the sensor group 35 and the motor 6a in the first flow path F1. That is, the first cooling water W1, which flows into the motor 6a, also flows in the third flow path F3. The downstream end of the third flow path F3 is connected to the second vacuum pump D2. The second vacuum pump D2 is a water-sealed vacuum pump that uses the driving force of a cycloidal pump or the like to circulate the first cooling water W1 and generate negative pressure to draw in air.

[0051] As described above, the second vacuum pump D2 draws air from the adsorption hole 5a1 of the holding member 5a, thereby adsorbing the molded substrate Sb onto the holding member 5a. The first cooling water W1 flowing into the second vacuum pump D2 acts as sealing water. The air drawn from the adsorption hole 5a1 of the holding member 5a by the second vacuum pump D2, together with the first cooling water W1, is discharged into the fourth flow path F4 and flows into the separator 37. That is, water-containing air, including the first cooling water W1 as sealing water and the air drawn from the adsorption hole 5a1, flows through the fourth flow path F4. In this embodiment, since the first cooling water W1 is supplied to the second vacuum pump D2 as sealing water, the drive source (not shown) of the second vacuum pump D2 can be cooled by the first cooling water W1. Alternatively, the flow path can be configured such that the first cooling water W1 flowing in the third flow path F3 cools the drive source of the second vacuum pump D2 before flowing into the second vacuum pump D2.

[0052] In separator 37, the water-containing air that has flowed through the fourth flow path F4 is separated into first cooling water W1 and air. The first cooling water W1 is stored at the bottom of separator 37, and the air is stored at the top of separator 37. The first cooling water W1 stored in separator 37 flows out and flows through the fifth flow path F5, merges with the second flow path F2, is filtered by filter 38, and flows back to tank 31.

[0053] The air stored in the separator 37 flows into the tank 31 through the fourth air flow path 39. The fourth air flow path 39 is arranged across the vertical above the separator 37 and the tank 31 to prevent the first cooling water W1 from flowing into it by mistake.

[0054] When the first cooling water W1 flows and circulates in the circulation path F, the flow path between the separator 37 and the tank 31 (the fifth flow path F5 and the merged second flow path F2) is filled with the first cooling water W1. Furthermore, since the internal air pressure of the tank 31 and the separator 37 are equal to atmospheric pressure, the water level of the first cooling water W1 stored in the tank 31 is the same as the water level of the first cooling water W1 stored in the separator 37. In addition, the separator 37 needs space to store the air separated from the water-containing air. If the water level of the first cooling water W1 rises to the highest position in the vertical direction of the separator 37, i.e., the upper wall 37a, the space for storing air will disappear, and it may no longer be possible for the second vacuum pump D2 to adequately adsorb the molded substrate Sb.

[0055] Therefore, in tank 31, a drain outlet 31a is provided at a position lower than the upper wall 37a of separator 37 to discharge the remaining first cooling water W1 to the outside of tank 31 (see reference). Figure 3(The dotted line). By configuring a drain outlet 31a in tank 31, the water level of the first cooling water W1 in tank 31 and separator 37 will not be higher than the drain outlet 31a. Therefore, since the water level of the first cooling water W1 will not reach the upper wall 37a of separator 37, sufficient space is ensured in separator 37 to store the air separated from the first cooling water W1.

[0056] An exhaust port 31b is positioned vertically higher than the drain outlet 31a of the tank 31. Air flowing from the separator 37 into the tank 31 through the fourth air flow path 39 and stored in the tank 31 is discharged to the outside through the exhaust port 31b. Thus, by connecting the fourth air flow path 39 to the tank 31, even if the first cooling water W1 is accidentally mixed with air separated by the separator 37 and flows out into the fourth air flow path 39, the mixed first cooling water W1 can be stored in the tank 31.

[0057] As described above, when the cutting device 1 is operating normally, by circulating the first cooling water W1 stored in the tank 31 in the circulation path F, the motor 6a of the spindle section 6 can be properly cooled, and the formed substrate Sb can be adsorbed onto the holding member 5a of the cutting table 5. However, if a circulation abnormality occurs in the circulation path F due to a malfunction of the water pump 32 or other reasons, causing the first cooling water W1 to stop circulating, the motor 6a of the spindle section 6 may no longer be properly cooled, and the formed substrate Sb may no longer be adsorbed onto the holding member 5a of the cutting table 5.

[0058] Based on the detection results from the sensor group 35, the control unit 50 determines whether the circulation is proceeding normally or an abnormality has occurred. Examples of detections from the sensor group 35 that the control unit 50 determines as indicating a circulation abnormality include: the flow rate of the first cooling water W1 deviating from the normal range as determined by the flow sensor; the water pressure of the first cooling water W1 deviating from the normal range as determined by the water pressure sensor; and the water temperature of the first cooling water W1 deviating from the normal range as determined by the water temperature sensor. The flow sensor and water pressure sensor indirectly detect a malfunction in the water pump 32 based on deviations from the normal range. The water temperature sensor indirectly detects a malfunction in the cooler 33 based on deviations from the normal range.

[0059] If the control unit 50 determines that a circulation abnormality is occurring based on the detection results of the sensor group 35, it controls the system as follows: It opens the switching valve 34, allowing the second cooling water W2 to flow instead of the first cooling water W1 into the first flow path F1 of the circulation flow path F. As a result, the second cooling water W2 circulates through the first flow path F1 to the fifth flow path F5, appropriately cooling the motor 6a of the spindle unit 6 and causing the molded substrate Sb to adhere to the holding member 5a of the cutting table 5. Therefore, even in the event of a circulation abnormality, the supply of the second cooling water W2 can be switched from the first cooling water W1, allowing the cutting of the molded substrate Sb to continue without stopping the operation of the cutting device 1. However, the second cooling water W2 cannot circulate in the circulation flow path F; therefore, after flowing into the tank 31 from the fifth flow path F5, it is discharged to the outside from the drain outlet 31a.

[0060] [Manufacturing methods for electronic components] Next, use Figure 2 and Figure 3 A method for manufacturing electronic component Sc by cutting the molded substrate Sb using a cutting device 1 will be described. The method for manufacturing electronic component Sc includes: a cooling process in which first cooling water W1 is circulated in circulation path F by a water circulation device 30 to cool the spindle section 6; a fixing process in which the molded substrate Sb is fixed to the cutting table 5 by activating a second vacuum pump D2 after being placed on the cutting table 5; and a cutting process in which the molded substrate Sb is cut by a cutting module A1 to obtain electronic component Sc.

[0061] exist Figure 2 In the cutting module A1 shown, the substrate supply unit 3 pushes out the molded substrates Sb one by one from the material box M1 that contains multiple molded substrates Sb, and supplies the molded substrates Sb one by one to the positioning unit 4. At this time, the back side of the molded substrates Sb is arranged facing upward.

[0062] The positioning unit 4 positions the molded substrate Sb by placing it on the guide rail 4a after it has been pushed out from the substrate supply unit 3. Then, the positioning unit 4 transports the positioned molded substrate Sb to the cutting table 5.

[0063] After the molded substrate Sb is transported to the cutting worktable 5, or before transport, the water pump 32 and cooler 33 of the water circulation device 30 are activated to circulate the first cooling water W1 stored in the tank 31 through the circulation path F. This initiates the cooling process (cooling procedure) of the motor 6a and rotating shaft 6b of the spindle unit 6. It should be noted that the first cooling water W1 is pre-stored in the tank 31 in the amount required for circulation in the circulation path F.

[0064] In addition, the second vacuum pump D2 is activated. When the second vacuum pump D2 is activated, air is drawn from the suction hole 5a1 of the holding member 5a of the cutting stage 5. As a result, the formed substrate Sb is attracted by the holding member 5a and fixed to the cutting stage 5 (fixing process).

[0065] When the molded substrate Sb is adsorbed and fixed on the cutting table 5, the first position confirmation camera 5d captures an image of the molded substrate Sb to confirm its position. Then, the cutting table 5 moves along... Figure 2 The Y-axis moves towards the spindle section 6. After the cutting table 5 moves below the spindle section 6, the cutting table 5 and the spindle section 6 move relative to each other, thereby cutting the molded substrate Sb to obtain multiple monolithic electronic components Sc (cutting process). The molded substrate Sb remains in a fixed state even during the movement of the cutting table 5 and its monolithic formation by the blade 8. The spindle section 6 is provided with a cutting fluid nozzle, a cooling water nozzle, and a cleaning water nozzle (not shown). Therefore, when cutting the molded substrate Sb, cutting fluid is sprayed from the cutting fluid nozzle onto the high-speed rotating blade 8, cooling water is sprayed from the cooling water nozzle onto the blade 8 and the molded substrate Sb, which are heated by the cutting, and cleaning water for cleaning chips is sprayed from the cleaning water nozzle. Then, as needed, the multiple electronic components Sc are photographed by the second position confirmation camera 6c to confirm the position of each of the multiple electronic components Sc.

[0066] After the substrate Sb is cut and shaped, the cutting stage 5, while holding multiple monolithically formed electronic components Sc, moves along... Figure 2 The Y-axis moves away from the main shaft 6. During this movement, the upper surface (back side) of the electronic component Sc is cleaned and dried by the first cleaner 5e.

[0067] Next, the conveying unit 7 adsorbs the electronic component Sc held on the cutting worktable 5 from above. The conveying unit 7 adsorbs the electronic component Sc and conveys it to the inspection worktable 11 of the inspection and storage module B1. During this conveying process, the lower surface (surface) of the electronic component Sc is cleaned and dried by the second cleaner 7a.

[0068] The inspection table 11 holds the electronic component Sc so that optical inspection of the electronic component Sc can be performed by the first optical inspection camera 12 and the second optical inspection camera 13. The inspection table 11 can move along... Figure 2 The X-axis movement is possible. Furthermore, the inspection table 11 can be reversed vertically.

[0069] The first optical inspection camera 12 images the surface of the electronic component Sc, which is conveyed to the inspection table 11 via the conveyor 7. Then, the conveyor 7 places the electronic component Sc onto the holding member of the inspection table 11. After the holding member holds the electronic component Sc, the inspection table 11 is reversed vertically. After the reversed inspection table 11 moves above the second optical inspection camera 13, the second optical inspection camera 13 images the back of the electronic component Sc.

[0070] The inspected electronic component Sc is placed in the placement unit 14. The placement unit 14 uses the suction of the first vacuum pump D1 to adsorb the inspected electronic component Sc. The placement unit 14 can move along... Figure 2 The Y-axis movement. The inspection worktable 11 places the inspected electronic components Sc into the configuration section 14.

[0071] The extraction unit 15 transfers the electronic components Sc disposed in the placement unit 14 to the tray. Based on the inspection results using the first optical inspection camera 12 and the second optical inspection camera 13, the electronic components Sc are classified as "qualified" or "unqualified". Based on the classification results, the extraction unit 15 transfers each electronic component Sc to the qualified product tray 15a or the unqualified product tray 15b. That is, the qualified electronic components Sc are stored in the qualified product tray 15a, and the unqualified electronic components Sc are stored in the unqualified product tray 15b.

[0072] [Other Implementation Methods] Hereinafter, other embodiments of the above-described embodiments will be described. It should be noted that, for ease of understanding, the same terms and reference numerals are used to describe components that are the same as those in the above embodiments.

[0073] In the above embodiment, a separator 37 is arranged downstream of the second vacuum pump D2 to separate water-containing air into first cooling water W1 and air. However, as long as the separation can be achieved in the tank 31, the separator 37 may not be required.

[0074] In the above embodiment, the sensor group 35 consists of a flow sensor, a water pressure sensor, and a water temperature sensor, but the flow sensor, water pressure sensor, and water temperature sensor may also be configured individually. Furthermore, it may be configured to include only at least one of the flow sensor, water pressure sensor, and water temperature sensor.>

[0075] <c> In the above embodiment, the parameters for the control unit 50 to determine the circulation abnormality are the flow rate, water pressure, and water temperature of the first cooling water W1, but are not limited to these. For example, it could also be an abnormality in the drive circuit or drive current of the water pump 32, an abnormality in the flow rate, pressure, or temperature of the cooling fluid supplied to the cooler 33 for cooling the first cooling water W1, or an abnormality in the amount of the first cooling water W1 stored in the tank 31. Any abnormality that prevents the motor 6a of the spindle section 6 from cooling properly and / or prevents the molded substrate Sb from being fixed to the cutting table 5 can be included in the circulation abnormality.

[0076] <d> In the above embodiment, the sixth flow path F6 is configured to merge with the first flow path F1 between the cooler 33 and the sensor group 35, but this is not a limitation. For example, the sixth flow path F6 may also be configured to merge with the first flow path F1 between the water pump 32 and the cooler 33. With such a configuration, even if the water pump 32 fails and the second cooling water W2 flows in the first flow path F1, the second cooling water W2 can be cooled to a low temperature by the cooler 33 and then supplied to the spindle section 6. Therefore, the motor 6a of the spindle section 6 can be cooled in the same way as the first cooling water W1.

[0077] [Summary of the above embodiments] Hereinafter, a summary of the manufacturing method of the water circulation device (30), the cutting device (1), and the cut product (Sc) described in the above embodiments will be given.

[0078] <1> One embodiment of the water circulation device (30) is a water circulation device (30) that cools the spindle section (6) with a first water (W1) or a second water (W2), the spindle section (6) driving the blade (8) that cuts the object (Sb) including the substrate (63) to rotate. The water circulation device (30) includes: a tank (31) for storing the first water (W1); and a pump (32) connected to the tank (31) for pumping the first water (W1) stored in the tank (31) toward the spindle section (6). The circulation path (F) is configured to allow the first water (W1) flowing out of the tank (31) to flow back into the tank (31) via the pump (32) and the main shaft (6); the switching valve (34) can switch the first water (W1) flowing in the circulation path (F) to the second water (W2); and the control unit (50) controls the operation of the pump (32) and the switching valve (34). When the control unit (50) senses an abnormality in the circulation of the first water (W1), it controls the switching valve (34) to allow the second water (W2) to flow in the circulation path (F).

[0079] In the water circulation device (30) of this solution, when the control unit (50) senses an abnormality in the circulation of the first water (W1), it controls the switching valve (34) from the closed state to the open state so that the second water (W2) can flow in the circulation path (F). Therefore, the first water (W1) can be changed to continue supplying the second water (W2) to the circulation path (F), so the cooling of the main shaft (6) can continue.

[0080] <2> In the water circulation device (30) described in <1> above, it is preferable that the second water (W2) is industrial water.

[0081] Therefore, the second water (W2) can be supplied to the circulating flow path (F) simply by connecting it to the industrial water pipeline, thus eliminating the need for special equipment to generate the second water (W2). As a result, a water circulation device (30) can be constructed at a low cost.

[0082] <3> In the water circulation device (30) described in <1> or <2> above, it is preferable to further include: a water-sealed vacuum pump (D2) disposed in the middle of the circulation path (F) to draw air to adsorb the object to be cut (Sb) onto the platform (5), and the water-sealed vacuum pump (D2) uses the first water (W1) or the second water (W2) as sealing water.

[0083] When cutting the object (Sb) by adsorbing it onto the mounting platform (5), cutting fluid, cooling water, or cleaning water is sprayed. In this solution, since the object (Sb) is adsorbed onto the mounting platform (5) by a water-sealed vacuum pump (D2), even if cutting fluid or the like is immersed in the suction hole for adsorbing the object (Sb), the adsorption of the object (Sb) onto the mounting platform (5) can be stably and continuously carried out without affecting the operation of the water-sealed vacuum pump (D2). Furthermore, as the sealing water for the water-sealed vacuum pump (D2), first water (W1) or second water (W2) used for cooling the spindle section (6) is used, so there is no need for an additional water source to supply sealing water to the water-sealed vacuum pump (D2), which makes the water circulation device (30) simple and inexpensive to construct.

[0084] <4> In the water circulation device (30) described in <3> above, it is preferable to further include: a separator (37) for water-containing air containing sealing water (W1, W2) and air discharged from the water-sealed vacuum pump (D2) to flow in, so that the water-containing air is separated into air and sealing water (W1, W2) and flows out separately, the separator (37) is disposed between the water-sealed vacuum pump (D2) and the tank (31) in the circulation flow path (F), the tank (31) has a drain outlet (31a) for discharging the remaining first water (W1) or second water (W2) to the outside, the vertical position of the drain outlet (31a) is located at a position lower than the upper wall (37a) of the separator (37) which is the highest position in the vertical direction.

[0085] Therefore, the water level of the first water (W1) or the second water (W2) in the tank (31) and the separator (37) will not be higher than the drain outlet (31a). Therefore, the water level of the first water (W1) or the second water (W2) will not reach the upper wall (37a) of the separator (37), thus ensuring sufficient space in the separator (37) to store the air separated from the first water (W1) or the second water (W2).

[0086] <5> In the water circulation device (30) described in <4> above, it is preferable that the tank (31) has an exhaust port (31b) which allows air separated by the separator (37) to be discharged from the tank (31) to the outside after flowing into the tank (31), and the vertical position of the exhaust port (31b) is higher than that of the drain port (31a).

[0087] Therefore, the air separated by the separator (37) can be discharged to the outside of the tank (31) without being affected by the first water (W1) or the second water (W2) stored in the tank (31). Furthermore, according to this configuration, even if the first water (W1) or the second water (W2) is accidentally mixed with the air separated by the separator (37) and flows out from the separator (37), the first water (W1) or the second water (W2) can still be stored in the tank 31.

[0088] <6> In any of the above <1> to <5> water circulation device (30), it is preferable that the circulation abnormality is a malfunction of the pump (32).

[0089] The pump (32) is an essential component for pressurizing the first water (W1) to circulate in the circulation path (F). Therefore, if the pump (32) fails, the first water (W1) will no longer circulate, and the main shaft (6) cannot be properly cooled. However, according to this solution, since the failure of the pump (32) is set as a circulation abnormality, even if the first water (W1) is no longer pressurized, the second water (W2) can still circulate to properly cool the main shaft (6).

[0090] <7> In any one of <1> to <5> above, the water circulation device (30) preferably also includes: a cooler (33) for cooling the first water (W1) stored in the tank (31), and the circulation abnormality is a malfunction of the cooler (33).

[0091] The cooler (33) is an essential component for cooling the spindle section (6) by lowering the temperature of the first water (W1). Therefore, when the cooler (33) malfunctions, even if the first water (W1) circulates, the spindle section (6) cannot be properly cooled because the water temperature remains high. However, according to this solution, since the malfunction of the cooler (33) is set as a circulation abnormality, the second water (W2) can circulate to properly cool the spindle section (6) even if the first water (W1) is no longer cooled.

[0092] <8> One embodiment of the cutting device (1) includes: a water circulation device (30) as described in any one of <1> to <7> above; and a cutting mechanism (A1) including a platform (5) for placing the object to be cut (Sb), a blade (8) for cutting the object to be cut (Sb) placed on the platform (5), and a spindle (6) for rotating the blade (8).

[0093] In the cutting device (1) of this solution, since the water circulation device (30) described above is provided, even in the event of a circulation abnormality, the supply of the second water (W2) can be switched from the first water (W1). Thus, a cutting device (1) can be provided that can continuously cut the object (Sb) while properly cooling the spindle section (6).

[0094] <9> One embodiment of the method for manufacturing a cut-off item (Sc) using the cutting device (1) described in <8> above includes: a cooling step in which first water (W1) is circulated in a circulation path (F) via a water circulation device (30) to cool the spindle section (6); a fixing step in which a water-sealed vacuum pump (D2) is operated to fix the cut-off item (Sb) to the placement stage (5) after the cut-off item (Sb) is placed on the placement stage (5); and a cutting step in which the cut-off item (Sb) is cut by a cutting mechanism (A1) to obtain the cut-off item (Sc).

[0095] The manufacturing method of the cut-off item (Sc) in this scheme includes: a cooling process in which the first water (W1) is circulated in the circulation path (F) by the water circulation device (30) to cool the spindle section (6); a fixing process in which the cut-off item (Sb) is placed on the mounting table (5) and then the water-sealed vacuum pump (D2) is operated to fix the cut-off item (Sb) on the mounting table (5); and a cutting process in which the cut-off item (Sb) is cut by the cutting mechanism (A1) to obtain the cut-off item (Sc). Therefore, even in the event of a circulation abnormality, the supply of the second water (W2) can be changed from the first water (W1). As a result, the cutting of the cut-off item (Sb) can be continuously performed while the spindle section (6) is properly cooled, and thus the manufacturing of the cut-off item (Sc) can be continuously carried out.

[0096] Industrial availability This disclosure can be used in the manufacture of water circulation devices, cutting devices, and cutting products.

[0097] Explanation of reference numerals in the attached figures 1: Cutting device; 5: Cutting worktable (placement table); 6: Main spindle section; 8: Blade; 30: Water circulation device; 31: Jar; 31a: Drainage outlet; 31b: Exhaust port; 32: Water pump (pump); 33: Cooler; 34: Switching valve; 37: Separator; 37a: Upper wall; 50: Control Department; 61: Component; 63: Substrate; A1: Cut-off module (cut-off mechanism); D2: Second vacuum pump (water-sealed vacuum pump); F: Circulation path; Sb: The finished substrate (the object to be cut); Sc: Electronic components (cut-off parts); W1: First cooling water (first water); W2: Second cooling water (second water).

Claims

1. A water circulation device, wherein a main shaft is cooled by a first water or a second water, the main shaft driving a blade that cuts an object to be cut to rotate, wherein... The water circulation device includes: The tank is used to store the first water. A pump, connected to the tank, pressurizes the first water stored in the tank toward the main shaft. The circulation path is configured such that the first water flowing out of the tank flows back into the tank via the pump and the main shaft; A switching valve is configured to switch the first water flowing in the circulation path to the second water; and The control unit controls the operation of the pump and the switching valve. When the control unit senses an abnormality in the circulation of the first water, it controls the switching valve to allow the second water to circulate in the circulation path.

2. The water circulation device according to claim 1, wherein, The second type of water is industrial water.

3. The water circulation device according to claim 1 or 2, further comprising: A water-sealed vacuum pump, positioned midway through the circulation path, draws in air to cause the object to be cut to adhere to the mounting platform. The water-sealed vacuum pump uses either the first water or the second water as sealing water.

4. The water circulation device according to claim 3, further comprising: A separator is used to allow water-containing air, including the sealing water and the air, to flow in from the water-sealed vacuum pump, causing the water-containing air to separate into air and sealing water, which then flow out separately. The separator is positioned between the water-sealed vacuum pump and the tank in the circulation path. The tank has a drain outlet that allows any remaining first or second water to be discharged to the outside. The vertical position of the drain outlet is lower than the upper wall of the separator, which is the highest point in the vertical direction.

5. The water circulation device according to claim 4, wherein, The tank has an exhaust port that allows the air separated by the separator to flow into the tank and then exit to the outside. The vertical position of the vent is higher than that of the drain outlet.

6. The water circulation device according to any one of claims 1 to 5, wherein, The circulation anomaly is a malfunction of the pump.

7. The water circulation device according to any one of claims 1 to 5, further comprising: A cooler is used to cool the first water stored in the tank. The circulation anomaly is a malfunction of the cooler.

8. A cutting device, comprising: The water circulation device as described in any one of claims 1 to 7; and The cutting mechanism includes a stage on which the object to be cut is placed, a blade for cutting the object placed on the stage, and a spindle for rotating the blade.

9. A method for manufacturing a cut article, comprising using the cutting device as described in claim 8, comprising: The cooling process involves using the water circulation device to circulate the first water in the circulation path to cool the main shaft section. In the fixing process, after the object to be cut is placed on the mounting platform, a water-sealed vacuum pump is activated to fix the object to be cut on the mounting platform. as well as The cutting process involves cutting the object to be cut using the cutting mechanism to obtain a cut product.

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