Modular and scalable quantum computer with ladder unit cells

Abstract

Systems and techniques for facilitating scalable cryostats and cryogenic systems are provided. In one embodiment, the cryogenic system (300) may include a plurality of unit cells (304) coupled together, wherein each unit cell includes a trapezoidal frame (704) wherein the frames from adjacent unit cells are vacuum-sealed to form a continuous global vacuum enclosure, and wherein the unit cells are horizontally removable from or inserted into the plurality of coupled unit cells. Furthermore, each unit cell may include at least one temperature housing (508, 510, 512) wherein temperature housings from adjacent unit cells are coupled to form a continuous global temperature housing. Moreover, each unit cell may include at least one cryogenic payload (514) located within at least one temperature housing, which is cooled by at least one modified version of a standard dilution refrigeration unit.

Description

Background Technology

[0001] This invention relates to cryostats, and more particularly, to modular cryostats for realizing scalable quantum computers. Summary of the Invention

[0002] The following summary is provided to offer a basic understanding of one or more embodiments of the invention. This summary is not intended to identify key or essential elements, nor is it intended to limit the scope of any particular embodiment or any claim. Its sole purpose is to present concepts in a simplified form as a prelude to the more detailed description that follows. In one or more embodiments described herein, systems, devices, and / or methods for facilitating modular cryostats for scalable quantum computers are described.

[0003] According to one embodiment, the cryogenic system may include multiple trapezoidal unit cells connected together, wherein each unit cell includes a frame, wherein frames from adjacent trapezoidal unit cells are vacuum-sealed at the abutting surfaces of adjacent trapezoidal unit cells. An advantage of this system is that multiple trapezoidal unit cells allow for greater scalability of the cryogenic system, as more unit cells can be connected together to create a larger cryogenic system without requiring the construction of entirely new, larger cryostats. Another advantage of trapezoidal unit cells is that any unit cell can be replaced through a horizontal extraction and insertion process that does not require excessive ceiling height.

[0004] According to another embodiment, the cryogenic system may include multiple unit cells connected together, wherein each unit cell includes: a frame; multiple nested temperature shells located at multiple temperature levels; at least one modified version of a standard dilution refrigerator; and at least one cryogenic payload located at at least one of different temperature levels, cooled by at least one modified version of the standard dilution refrigerator; wherein the frames from adjacent unit cells are vacuum-sealed at the abutment surfaces of adjacent unit cells, and at each temperature level, the temperature shells from adjacent unit cells are connected to form a continuous global temperature shell. An advantage of this system is that multiple unit cells allow for greater scalability of the cryogenic system, as more unit cells can be connected together to create a larger cryogenic system without requiring the construction of entirely new, larger cryostats. Another advantage of this system is that the refrigerator design is decoupled from application-specific mechanical requirements, so that the mechanical needs of evolving applications are not affected by mechanical constraints otherwise imposed by the refrigerator.

[0005] According to another embodiment, the cryogenic system may include multiple trapezoidal unit cells connected together, wherein each unit cell includes: a frame assembly including at least one door that forms a vacuum-sealed seal when closed; at least one temperature housing suspended from a set of flanges; at least one modified version of a standard dilution refrigerator; and at least one cryogenic payload located within the at least one temperature housing, cooled by the at least one modified version of the standard dilution refrigerator, wherein the frames from adjacent trapezoidal unit cells are vacuum-sealed at the abutting surfaces of adjacent trapezoidal unit cells, and the temperature housings from adjacent trapezoidal unit cells are connected to form a continuous global temperature housing. An advantage of this system is that multiple unit cells allow for greater scalability of the cryogenic system, as more unit cells can be connected together to create a larger cryogenic system without requiring the construction of entirely new, larger cryostats. Another advantage of trapezoidal unit cells is that any unit cell can be replaced by a horizontal extraction and insertion process that does not require excessive ceiling height. Another advantage of this system is that the refrigerator design is decoupled from application-specific mechanical requirements, so that the mechanical needs of evolving applications are not affected by mechanical constraints that would otherwise be imposed by the refrigerator. Attached Figure Description

[0006] Figure 1 A cross-sectional view of an existing dilution refrigeration unit is shown.

[0007] Figure 2 A cross-sectional view of two existing dilution chillers placed side by side is shown.

[0008] Figure 3 An array of trapezoidal unit cells according to one or more embodiments described herein is shown.

[0009] Figure 4 A top front view of a trapezoidal unit cell array according to one or more embodiments described herein is shown.

[0010] Figure 5 A cross-sectional view of a trapezoidal unit cell array according to one or more embodiments described herein is shown.

[0011] Figure 6 A cross-sectional view of a trapezoidal unit cell array according to one or more embodiments described herein is shown.

[0012] Figure 7 An artificial exploded view of a trapezoidal unit cell with a closed door, according to one or more embodiments described herein, is shown.

[0013] Figure 8 An artificial exploded view of a trapezoidal unit cell with an open door, according to one or more embodiments described herein, is shown.

[0014] Figure 9 An exploded view of a trapezoidal unit cell without end shields or bridge shields according to one or more embodiments described herein is shown.

[0015] Figure 10 An artificial exploded view of a trapezoidal unit cell without a default shield, according to one or more embodiments described herein, is shown.

[0016] Figure 11 A filled trapezoidal unit cell according to one or more embodiments described herein is shown.

[0017] Figure 12 A frame assembly of filled trapezoidal unit cells according to one or more embodiments described herein is shown.

[0018] Figure 13 A right front view of the frame assembly of a trapezoidal unit cell according to one or more embodiments described herein is shown.

[0019] Figure 14A and 14B The left front view and rear view of the frame assembly of the trapezoidal unit cell according to one or more embodiments described herein are shown.

[0020] Figure 15 A top view of a frame assembly of a trapezoidal unit cell according to one or more embodiments described herein is shown.

[0021] Figure 16 A first perspective view of the insertion component according to one or more embodiments described herein is shown.

[0022] Figure 17 A second perspective view of the insertion component according to one or more embodiments described herein is shown.

[0023] Figure 18 A front view of the insertion component according to one or more embodiments described herein is shown.

[0024] Figure 19 A front view of the insertion component according to one or more embodiments described herein is shown.

[0025] Figure 20 An exploded view of the thermal casing according to one or more embodiments described herein is shown.

[0026] Figure 21 A thermal housing is shown after a first assembly step according to one or more embodiments described herein.

[0027] Figure 22A thermal housing is shown after a second assembly step according to one or more embodiments described herein.

[0028] Figure 23 A thermal housing following a third assembly step is shown according to one or more embodiments described herein.

[0029] Figure 24 A fully assembled thermal housing according to one or more embodiments described herein is shown.

[0030] Figure 25 A shield fixed to a flange in a thermal housing according to one or more embodiments described herein is shown.

[0031] Figure 26 A fixed opposing shielding element in a thermal housing according to one or more embodiments described herein is shown.

[0032] Figure 27 The overlap of the center shield and bridge shield in the thermal housing according to one or more embodiments described herein on the lateral shield is shown.

[0033] Figure 28 A central shield and a bridge shield fixed to a lateral shield are shown in a thermal housing according to one or more embodiments described herein.

[0034] Figure 29 A fixed-opposite side bridge shield in a thermal housing according to one or more embodiments described herein is shown.

[0035] Figure 30 The overlap of the top bridge shield on the flange and side bridge shield in a thermal housing according to one or more embodiments described herein is shown.

[0036] Figure 31 A refrigerator insert for retrofitting an off-the-shelf dilution refrigerator is shown according to one or more embodiments described herein.

[0037] Figure 32 A refrigerator insert for retrofitting an off-the-shelf dilution refrigerator is shown according to one or more embodiments described herein.

[0038] Figure 33 A fixed custom thermal flange for retrofitting an off-the-shelf dilution refrigeration unit is shown according to one or more embodiments described herein.

[0039] Figure 34 A fixed custom thermal flange for retrofitting an off-the-shelf dilution refrigeration unit is shown according to one or more embodiments described herein.

[0040] Figure 35A fixed custom thermal flange for retrofitting an off-the-shelf dilution refrigeration unit is shown according to one or more embodiments described herein.

[0041] Figure 36 A fixed custom thermal flange for retrofitting an off-the-shelf dilution refrigeration unit is shown according to one or more embodiments described herein.

[0042] Figure 37 A fixed custom thermal flange for retrofitting an off-the-shelf dilution refrigeration unit is shown according to one or more embodiments described herein.

[0043] Figure 38 A first field-replaceable unit strategy according to one or more embodiments described herein is illustrated.

[0044] Figure 39 A second field-replaceable unit strategy according to one or more embodiments described herein is illustrated.

[0045] Figure 40 A third field-replaceable cell strategy with horizontal extraction of unit cells according to one or more embodiments described herein is illustrated.

[0046] Figure 41 A first position of the extraction process for a replacement unit cell according to one or more embodiments described herein is shown.

[0047] Figure 42 A second position of the extraction process for a replacement unit cell according to one or more embodiments described herein is shown.

[0048] Figure 43 A third position is shown in the extraction process for a replacement unit cell according to one or more embodiments described herein.

[0049] Figure 44 The fourth position of the extraction process for the replacement unit cell according to one or more embodiments described herein is shown.

[0050] Figure 45 A top view of a first position of the extraction process according to one or more embodiments described herein is shown.

[0051] Figure 46 A rear view of a first position of the extraction process according to one or more embodiments described herein is shown.

[0052] Figure 47 A front view of the first position of the extraction process according to one or more embodiments described herein is shown.

[0053] Figure 48A frame O-ring is shown in which the unit cell is fully compressed during extraction, according to one or more embodiments described herein.

[0054] Figure 49 A top view is shown illustrating the transformation from a fully compressed frame O-ring to an uncompressed frame O-ring according to one or more embodiments described herein.

[0055] Figure 50 A frame O-ring that is not compressed during extraction of a unit cell is shown according to one or more embodiments described herein.

[0056] Figure 51 A frame O-ring that is not compressed during extraction of a unit cell is shown according to one or more embodiments described herein.

[0057] Figure 52 The insertion of a unit cell according to one or more embodiments described herein is illustrated.

[0058] Figure 53 The insertion of a unit cell according to one or more embodiments described herein is illustrated.

[0059] Figure 54 The insertion of a unit cell according to one or more embodiments described herein is illustrated.

[0060] Figure 55 The insertion of a unit cell according to one or more embodiments described herein is illustrated.

[0061] Figure 56 A transparent view showing the insertion of unit cells according to one or more embodiments described herein.

[0062] Figure 57 A top view, free-body diagram, showing the forces on the unit during O-ring compression during insertion according to one or more embodiments described herein.

[0063] Figure 58 The x-direction force on a unit cell is shown according to one or more embodiments described herein.

[0064] Figure 59 An array of trapezoidal unit cells according to one or more embodiments described herein is shown.

[0065] Figure 60 An array of rectangular unit cells according to one or more embodiments described herein is shown.

[0066] Figure 61 An array of unfilled unit cells according to one or more embodiments described herein is shown. Detailed Implementation

[0067] The following detailed description is merely illustrative and is not intended to limit the embodiments and / or their application or use. Furthermore, there is no intention to be bound by any express or implied information presented in the foregoing Background or Summary of the Invention or the Detailed Description sections.

[0068] To solve computational problems that classical computers cannot, quantum computers consist of a large number of N physical qubits. Historically, quantum computers, including superconducting qubits, were small enough that all N qubits and supporting devices could be housed in a single existing cryostat. However, as N continues to grow with advancements in quantum technology, the number of qubits is now so large that a single monolithic cryostat can no longer contain them all. As N continues to grow, building increasingly larger dilute cryostats using existing designs becomes increasingly expensive, leading to ultimately impractical, bulky, and difficult-to-manage hardware sizes. Therefore, when N exceeds the number of qubits that can be packaged together (which depends on the engineering limits of the infrastructure supporting the qubits, such as chips, circuit boards, connectors, cables, and cooling devices), the N qubits are divided into multiple groups called payloads. However, for a quantum computer to be effective, the payloads must be able to send electromagnetic signals to their neighbors over the shortest possible quantum link cable, and this cable must remain superconducting along its entire length to minimize losses.

[0069] However, simply constructing such a multi-payload quantum computer by juxtaposing multiple conventional dilution refrigerators, each containing a payload, and connecting them with quantum link cables is difficult because, in order to move between these refrigerators, a portion of each cable must be at room temperature and would therefore be too wear-prone, since no superconducting materials are currently known to exist at ambient temperatures and pressures. Furthermore, the cables between existing refrigerators would be excessively long, which is also a source of loss.

[0070] In one or more embodiments described herein, systems, apparatuses, and / or methods for modular cryostats to facilitate scalable quantum computers are described, addressing problems associated with existing dilution refrigerators and cryostats. In one or more embodiments described herein, the cryogenic system may include a plurality of unit cells connected together, wherein each unit cell includes: a frame; and at least one temperature shell; wherein frames from adjacent unit cells are vacuum-sealed to form a continuous monolithic vacuum shell, and temperature shells from adjacent unit cells are connected to form a continuous monolithic temperature shell. Therefore, the unit cell structure of the cryogenic system makes the system scalable, as more unit cells can be added to or removed from the system to achieve scalability to the desired cryostat size. Furthermore, in one or more embodiments described herein, the cryogenic system may also include end frames at each end of the plurality of unit cells, such that the plurality of frames and end frames together form a vacuum-sealed container; and end caps at each end of the plurality of unit cells for the monolithic temperature shell, such that the monolithic temperature shell and end caps form a substantially closed, radiation-resistant thermal shell. As used herein, the term "thermal shell" may be used interchangeably with "temperature shell."

[0071] For example, in one or more embodiments herein, a modular, scalable quantum computer may comprise an array of n+4 unit cells arranged along an imaginary x-axis of an imaginary Cartesian xyz coordinate system, where +z is vertically upward, and where n is an integer greater than or equal to zero. Various unit types are represented by letters, and the array may comprise units {ABDE}, or {AB C1C2D E}, or {AB C1C2C3D E}, or more generally {AB C1C2...C ... n DE}, where C1, C2, ..., C nLet C be an instance of type C, and n units be type C. In this nomenclature, A is an unfilled left-end unit; B is a filled unit with a left-end thermal shield; C is a default filled unit; D is a filled unit with a right-end thermal shield; and E is an unfilled right-end unit. Each unit, whether of type A, B, C, D, or E, may include a frame assembly that may include a frame, two hinged vacuum-sealed door assemblies abutting the +y and -y faces of the frame, and a skylight assembly abutting the +z face of the frame. In one or more “rectangular embodiments,” the frame has a rectangular planar shape, and the frame assembly may be the same for all unit types. In one or more “trapezoidal embodiments,” the frame has a trapezoidal planar shape, and the frame assembly may be of two types, labeled L and R, alternating along the array. For example, in the array {AB C1C2C3D E}, units A, C1, C3, and E may include frame assembly type L, while units B, C2, and D may include frame assembly type R. The frames of adjacent units can be vacuum-sealed. Unit A may include a left endwall assembly vacuum-sealed to the -x plane of its frame; similarly, unit E may include a right endwall assembly vacuum-sealed to the +x plane of its frame. Thus, the array of frame assemblies and endwall assemblies together can form a vacuum-sealed shell. Each of unit types B, C, and D may include a dilution refrigerator assembly that can be fixed to the skylight assembly, allowing for the accommodation of various refrigeration equipment and other infrastructure by redesigning only the skylight assembly without redesigning the frame and door assemblies. Each of unit types B, C, and D may also include a quantum payload assembly comprising N... Q Each quantum bit and the electronic infrastructure required to support it, along with the payload components, are fixed to the base temperature flange of the dilution refrigerator.

[0072] Each of units B, C, and D may include an array of thermally shielded elements on its +y and -y planes. Additionally, the dilution refrigerator assembly in unit B may include an array of left-end thermally shielded elements on its -x plane, and the dilution refrigerator assembly in unit D may include an array of right-end thermally shielded elements on its +x plane. Therefore, the entire refrigerator array can be surrounded by a continuous set of thermally shielded elements on all sides, thus providing a large evacuated thermally shielded space. nAll payloads of D reside within it, with no barriers between payloads. Therefore, superconducting quantum link cables (and other devices if needed) can be connected between payloads without encountering barriers and without leaving the innermost base temperature housing of the aggregated dilution refrigerator, thus ensuring the quantum link cables remain superconducting. Furthermore, the link cables can be relatively short, thereby reducing both the material and manufacturing costs of the link cables and improving performance.

[0073] Furthermore, due to its modularity, the unit can be designed to be physically manageable; for example, one of its dimensions can be relatively small, allowing the unit to pass through typical doorways. Moreover, in one or more embodiments, the unit can be designed to be flexible, allowing various types of cooling equipment, payloads, and signal transmissions to be accommodated without redesigning any part of the frame assembly (except for the skylight assembly). Additionally, the modularity of the unit further simplifies maintenance and repair, as the dilution cooling unit and payload of any unit can be vertically removed from the frame for repair or replacement thanks to the skylight assembly. Moreover, for installations where vertical removal of equipment via the skylight is not possible due to ceiling height limitations, the trapezoidal embodiment provides an alternative means of repair; namely, horizontal removal of the entire defective unit and horizontal replacement with a non-defective unit, thus avoiding the need for high ceilings at the location where the quantum computer is installed. The modularity of the unit also reduces the need to scale the quantum computer to accommodate increasing numbers. N The design work and cost required for each qubit are reduced because it is only necessary to add more unit cells C to the array.

[0074] Variations of one or more embodiments are also envisioned. For example, if the left-end heat shield and the right-end heat shield do not exceed the ranges of units B and D respectively, then units A and E can be omitted, leaving {B C1C2...C} n In this case, the left end wall assembly can be fixed to the -x plane of unit B, and the right end wall assembly can be fixed to the +x plane of unit D. As another example, if the aforementioned flexibility in the arrangement of cooling equipment and payload wiring infrastructure is not required, and if the aforementioned option of removing the dilution chiller and payload from the frame for maintenance and replacement is not needed, the skylight assembly can be eliminated, and the cooling equipment and other infrastructure can be directly connected to the +z surface of the frame instead.

[0075] like Figure 1As shown, the existing dilution refrigerator 100 includes multiple nested housings 102 (e.g., 102.1, 102.2, ..., 102.7) connected to each other by standoffs 104, each housing including a flange 106 and a tank 108. The standoffs 104 must be long enough to prevent excessive heat conduction between the housings and to accommodate a refrigeration device (not shown). The refrigeration device maintains the individual housings 102 at different temperatures: the outermost housing 102.7 is maintained at room temperature, e.g., T7 = 300 K; the innermost housing 102.1 is maintained at a base temperature, e.g., T1 = 20 mK; and the intermediate housings 102.2, ..., 102.6 are maintained at intermediate temperatures T2, ..., T6, e.g., 100 mK, 800 mK, 4 K, 10 K, and 50 K, respectively. Inner canisters 108.1, 108.2, ..., 108.6 are radiation shielding elements, preventing higher-temperature radiation from falling onto the lower-temperature casing and thus overloading the cooling equipment with excessive heat. The outermost canister 108.7 is a vacuum enclosure, as the cryogenic cooling equipment must be in a vacuum to prevent frozen water and air. For proper operation, the payload 110, including the superconducting qubits, must be maintained at temperature T1 and protected from radiation from higher temperatures; therefore, the payload 110 must reside within the innermost casing 102.1, as shown. For servicing access to the payload 110, all canisters 108 are removed one by one, starting with the vacuum canister 108.7. Similarly, after servicing and before restarting the quantum computer 100, all canisters 108 are replaced, starting with the innermost canister 108.1.

[0076] refer to Figure 2Consider a juxtaposition 200 of two existing dilution refrigerators 100A and 100B, each housing quantum payloads 110A and 110B, respectively. Due to the topology of conventional refrigerators, the quantum link cable 202 cannot travel directly between payloads 110A and 110B, as the cans 108 are impenetrable barriers, and as mentioned above, they must also be removable, ruling out the idea of ​​passing the cable through a small hole in the can. Therefore, the cable 202 comprises three sections, as shown: a first section extending from payload 110A to corner 204, having a Manhattan length L1; a second section extending from corner 204 to corner 206, having a Manhattan length L2; and a third section extending from corner 206 to payload 110B, having a Manhattan length L1. Unfortunately, for a considerable portion of the cable 202's length, although composed of a superconducting material, its conductive elements are not superconducting because this portion is at a temperature higher than the superconducting transition temperature of materials known to be suitable for cables. Specifically, the second part is at room temperature, where no known materials are superconducting. Therefore, cable 202 is unsuitable for carrying quantum signals from payload to payload due to excessive loss of quantum information. Furthermore, cable 202 is quite long, with a length L = 2L1 + L2, which further contributes to the loss. For example, in existing dilution refrigerators, L1 ≥ 1100 mm and L2 ≥ 865 mm, resulting in L ≥ 3065 mm, which is far longer than the desired length for low-loss, quantum link cables, thus degrading performance.

[0077] Therefore, to realize a quantum computer where N is so large that qubits must be grouped into physically separate payloads connected by quantum link cables, it is desirable to repackage conventional dilution refrigerators in a way that eliminates the aforementioned problems. Specifically, because operation at non-superconducting temperatures and the increase in cable length increase losses, it is desirable to eliminate the barriers between payloads so that the payload-to-payload quantum link cables remain superconducting along their entire length and that their length can be relatively short (e.g., about one meter). It is also desirable that the repackaged refrigerators be physically manageable to facilitate moving, navigating through doorways, and installing them—a manageability lacking in large conventional refrigerators, which are typically large in all three dimensions. It should also be understood that repackaging existing refrigerators, as described herein, has two advantages compared to designing and building new refrigerators from scratch: first, it saves development costs and time; second, it saves capital costs because already purchased refrigerators can be recycled in the modular, scalable devices described herein.

[0078] Therefore, the first embodiment 300 is composed of Figure 3 The illustration shows a perspective view relative to an imaginary Cartesian xyz coordinate system 302. Embodiment 300 is also provided by... Figure 4 , Figure 5 , Figure 6 and Figure 7-10 illustrate, Figure 4 It is a top front view of the xy plane parallel to coordinate system 302; Figure 5 It is a cross-sectional perspective view of the xz plane parallel to coordinate system 302; Figure 6 It is a sectional perspective view of the xy plane parallel to coordinate system 302; Figure 7-10 These are various perspective views that are artificially decomposed along the x-axis of coordinate system 302. (Reference) Figure 3 and Figure 4 Embodiment 300 may include an array of unit cells 304A, 304B, 304C, 304D, and 304E, arranged at a spacing p along the x-direction of coordinate system 302. For typical applications, the spacing p may be approximately 1000 mm. Unit 304A is an unfilled left-end unit cell; 304B is a filled left heat shield unit cell; 304C is a filled default unit cell; 304D is a filled right heat shield unit cell; and 304E is an unfilled right-end unit cell. For simplicity, these different unit cell variations 304 may be referred to simply by letter suffixes; that is, 304A may be referred to as "A", 304B as "B", 304C as "C", 304D as "D", and 304E as "E". Each pair of adjacent units {ABCDE} may be abutted by an O-ring 702 to form a vacuum seal between them, as shown below. Figure 7 As shown.

[0079] Figures 3 to 10 The unit cell array {ABCDE} shown is merely exemplary. Other possible arrangements may include {ABDE}, {AB C1C2D E}, {AB C1C2C3D E}, and more generally, {AB C1C2...C ... n DE}, where C1, C2, ..., C n Let n be an instance of C, and n be any integer greater than or equal to zero. That is, an array of unit cells can contain n+2 filled unit cells {B C1C2...C}. n D} and two unfilled unit cells {AE}.

[0080] refer to Figure 4 Each unit cell 304 is trapezoidal when viewed in a direction perpendicular to the xy plane, with an interior angle of 2θ (i.e., half-angle θ). As shown, the trapezoidal shapes alternate: the wide ends of unit cells A, C, and E are located at... Figure 4 At the bottom, while the wide ends of unit cells B and D are located at... Figure 4The top of the unit. The "front" of the unit is defined as the wide end of the trapezoid, such that the "right" side of unit unit A, C, or E is the +x side, while the "right" side of unit unit B or D is the -x side.

[0081] refer to Figure 8 Each unit may contain a front door 802, which rotates about an axis parallel to the z-direction via a plurality of front hinges 804. Similarly, each unit may contain a rear door 806, which rotates about an axis parallel to the z-direction via a plurality of rear hinges 808. Figures 3 to 7 In the middle, all doors are displayed in the closed position, while... Figure 8-10 In the image, all doors are shown in partially open positions, thus revealing the equipment within the unit.

[0082] refer to Figure 7 Each unit A, C, or E may include a right-hand frame assembly 704R, in which an O-ring 702 is embedded in a right-hand O-ring groove 706R machined into the right flange of 704R. Similarly, each unit B or D may include a left-hand frame assembly 704L, in which an O-ring 702 is embedded in a left-hand O-ring groove 706L machined into the left flange of 704L. These two versions of the frame assembly 704R and 704L may be identical in all other respects; the only difference between them may be the position of the O-ring groove.

[0083] The various units contain additional components, many of which will be described in detail later. In short, refer to... Figure 3 The unfilled left-end unit A (i.e., 304A) may include a left-end wall assembly 306L, which may include a left-end wall 308L; similarly, the unfilled right-end unit E (i.e., 304E) may include a right-end wall assembly 306R, which may include a right-end wall 308R. (See reference) Figure 5 Each filled cell B, C, or D can contain a standard off-the-shelf dilution refrigerator assembly 502. As shown here, the refrigerator 502 is a BlueForsXLD-1000 manufactured by BlueFors Oy in Helsinki, Finland; however, other standard refrigerators may also be used. Using the refrigerator shown, the unit-to-unit-cell pitch p can be 1000 mm. Still referring to... Figure 5Each filled unit B, C, and D may also include (only for unit B) an array of custom thermal flanges 504 for each of the aforementioned low-temperature temperatures T1, T2, T3, T4, and T5, respectively. These custom thermal flanges may be fixed to a set of standard thermal flanges 506 of the refrigerator 502. Each filled unit B, C, and D may also include an array of default thermal shields 508 removably fixed to the flanges 504. Unit B may also include a first set of end thermal shields 510 on its right (-x) side and a first set of bridging shields 512 on its left (+x) side, the first set of bridging shields 512 bridging between unit units B and C. Unit C may also include a second set of bridging shields 512 on its +x side, the second set of bridging shields 512 bridging between unit units C and D. Unit unit D may also include a second set of end thermal shields 510 on its +x side.

[0084] The array of flanges 504, together with heat shields 508, 510, and 512, creates a structure as follows: Figure 6 The diagram shows a set of essentially enclosed nested thermal shells, which is necessary for the successful operation of the dilution refrigerator to prevent radiation from the higher-temperature shells from overwhelming the cooling capacity of the lower-temperature stages. Figure 6 It also explains that the abutment frames 704L and 704R, together with the doors 802 and 806 and the end walls 306L and 306R, form a tight vacuum-sealed shell, because as Figure 6 As shown, the abutment frame 704 and the right end wall 308R are sealed to each other by a frame O-ring 702; each front door 802 is sealed to the frame 704 by a front door O-ring 602; each rear door 804 is sealed to the frame 704 by a rear door O-ring 604, and the left end wall 308L is sealed to the abutment frame 704 by an end wall O-ring 606.

[0085] The structure of Example 300 is determined by its decomposition. Figures 7 to 10 Additional views in the document are provided for clarification: Figure 7 Doors 802 and 806 are closed. Figure 8 and Figure 7 They are the same, except that the door is open; Figure 9 and Figure 8 The same, except that the end shield 510 and the bridging shield 510 are concealed; Figure 10 and Figure 9 Similarly, except that the default shield 506 is also hidden. For convenience, the designation 704 will be used to describe either the right-hand frame 704R or the left-hand frame 704L.

[0086] refer to Figure 5Each filled cell B, C, D may also contain at least one quantum payload 514. To allow the payload 514 to communicate electrically with devices outside the unit cell array, each filled cell B, C, D may also contain a vertical wiring device (not shown) that moves vertically through multiple cable cuts 516, as indicated by arrow 518, and passes through frame 704 in a vacuum-sealed manner. Figure 7 Multiple cable through-holes 402 at the top Figure 4 Leaving the unit cells. To allow the payloads 514 to communicate electrically with each other, embodiment 300 may also include a horizontal cabling device 520, such as the aforementioned L-coupler cable, which travels between the payloads. An advantage of one or more embodiments is that the unit cell-to-unit cell spacing p can be relatively small (e.g., 1000 mm), thus allowing for relatively short L-coupler cables extending between adjacent unit cells. Details of the cabling devices 518 and 520 are not described herein to emphasize that embodiment 300 is flexible in terms of electrical cabling details: the payloads 514 and shields 508 and 512 can be modified as needed to accommodate various arrangements of the horizontal cabling 520, and the custom thermal flange 504 can be modified as needed to accommodate various arrangements of the vertical cabling 518. Therefore, embodiment 300 is suitable for a wide variety of quantum computing needs, as well as applications unrelated to quantum computing.

[0087] To further describe the details of the filled cells (B, C, or D), we will use unit cell C as an example. It is as follows: Figure 9 As shown in Figure 11 The assembly is in progress, with the bridging shield 512 concealed. For example... Figure 12 As further shown, unit cell C may contain frame component 704R (previously combined) Figure 7 (Discussed) and insert component 1202. For example... Figure 12 As shown, the insertion component 1202 can be vertically inserted through the skylight cutout 1204 at the top of the frame component 704R and vertically removed from the frame component 704R. Insertion and removal can be achieved by a gantry crane (not shown), which can be attached to multiple lifting points 1206.

[0088] Figure 13 , 14A Frame component 704R is shown in 14B and 15. Figure 13 It is a right front perspective view. Figure 14A It is a left front perspective view. Figure 14B It is a rear perspective view, and Figure 15 This is a top view. (Reference) Figure 13Frame assembly 704R may include frame 1302, which may be a shell-like structure including side cutouts 1304 through its +x and -x faces, a front cutout 1306 through its -y face, a rear cutout 1308 through its +y face, and a skylight cutout 1204 through its +z face. Therefore, frame 1302 may include a front wall 1310 of the cutout, a rear wall 1312 of the cutout, a left wall 1314L of the cutout, a right wall 1314R of the cutout, a solid bottom wall 1316, and a top wall 1318 of the cutout. (Reference) Figure 15 The frame 1302 can be trapezoidal in shape, allowing an angle 2θ to be oriented between the left wall 1314L and the right wall 1314R. The left wall 1314L may include a left projecting flange 1502L, and the right wall 1314R may include a right projecting flange 1502R. (Reference) Figure 13 The right wall 1314R may include a frame O-ring groove 1320 to accommodate a frame O-ring 702.

[0089] refer to Figures 13 to 15 The frame assembly 704R may also include a front door assembly 1322, a rear door assembly 1324, a frame O-ring 702 received by a frame O-ring groove 1320, a plurality of left guide pins 1326L pressed into holes in the rear surface of the left wall 1314L, a plurality of right guide pins 1326R pressed into holes in the rear surface of the right wall 1314R, a plurality of left tension screws 1328L received by clearance holes in the left protruding flange 1502L, a plurality of right tension screws 1328R received by clearance holes in the right protruding flange 1502R, and a plurality of wheels 1330 that allow the unit assembly C to roll easily on the floor.

[0090] refer to Figure 13 and Figure 14A The frame 1302 may also include a plurality of left guide pin clearance holes 1332L and a plurality of left jack screw tapping holes 1334L in the left projecting flange 1502L. Similarly, see reference... Figure 13 The frame 1302 may include multiple right guide pin clearance holes 1332R and multiple right jack screw tapping holes 1334R in the right projecting flange 1502R. (Reference) Figure 14B The frame 1302 may also include a plurality of left tension screw tapping holes 1406L and a plurality of left jack screw support areas 1408L at the rear of the left wall 1314L. Similarly, the frame 1302 may also include a plurality of right tension screw tapping holes 1406R and a plurality of right jack screw support areas 1408R at the rear of the right wall 1314R.

[0091] refer to Figure 13 The front door assembly 1322 may include a front door 802 and a front door O-ring 602. (See reference) Figure 14AThe front door assembly 1322 may also include a plurality of front hinges 804 that allow the front door 802 to rotate about an axis parallel to the z-direction; a front handle 1402 for assisting in opening the front door 802; and at least one front latch 1404 for assisting in sealing the front door 802 when closing it.

[0092] Similarly, refer to Figure 14A The rear door assembly 1324 may include a rear door 804 and a rear door O-ring 604. (See reference) Figure 13 The rear door assembly 1324 may also include a plurality of rear hinges 808 that allow the rear door 806 to rotate about an axis parallel to the z-direction; a rear handle 1336 for assisting in opening the rear door 1408; and at least one rear latch 1338 for assisting in sealing the rear door 1408 when closing it.

[0093] Figures 16 to 19 The insertion component 1202 is shown in the figure: Figure 16 This is the first perspective view. Figure 17 This is the second perspective view. Figure 18 It is a front view of the yz plane parallel to coordinate system 302; and Figure 19 This is a front view of the xz plane, parallel to coordinate system 302. (Reference) Figures 16 to 18 The insertion assembly 1202 may include a commercial dilution refrigerator 502, which includes a room temperature flange 1602 and the aforementioned low-temperature thermal flange 506. The insertion assembly 1202 may also include a sunroof assembly 1604. The sunroof assembly 1604 may include a sunroof panel 1606 that supports the room temperature flange 1602, but allows the flange 506 to pass through when the refrigerator 502 is inserted through the sunroof panel 1606 in the +z direction. (Reference) Figure 17 The sunroof assembly 1604 may also include a sunroof O-ring 1702 and a plurality of sunroof screws 1704, which cause the sunroof 1606 to be vacuum-sealed to the top wall 1320 of the frame 1302. The sunroof assembly 1604 may also include a plurality of lift points 1206 fixed to the sunroof panel 1604.

[0094] Insertion component 1202 may also include previously... Figure 5The customized flange array 504 shown in; the array may include a first customized flange 504.1 fixed to the first temperature flange 506.1 of the dilution refrigerator 502, a second customized flange 504.2 fixed to the second temperature flange 506.2 of the dilution refrigerator 502, a third customized flange 504.3 fixed to the third temperature flange 506.3 of the dilution refrigerator 502, a fourth customized flange 504.4 fixed to the fourth temperature flange 506.4 of the dilution refrigerator 502, and a fifth customized flange 504.5 fixed to the fifth temperature flange 506.5 of the dilution refrigerator 502. During the operation of the embodiment 300, the refrigerator 502 maintains the temperature flanges 506.1, 506.2, 506.3, 506.4 and 506.5 at temperatures T1, T2, T3, T4 and T5, where T1 < T2 < T3 < T4 < T5. Typical values of these temperatures are as follows: T1 = 20 mK, T2 = 100 mK, T3 = 700 mK, T4 = 4 K, T5 = 50 K. An advantage of one or more embodiments such as embodiment 300 is that in its long-term deployment, as requirements change, the customized flange 504 can be removed and replaced with a different version thereof without replacing or disturbing the refrigerator 502 itself.

[0095] Reference Figure 18 , the insertion component 1202 may further include a cryogenic payload 514, which may be fixed to the customized flange 504.1, and the nested default thermal shield array 508 previously shown in Figure 5 . The thermal shield array 508 may include a first set of thermal shields 508.1 removably fixed to the flange 504.1, a second set of thermal shields 508.2 removably fixed to the flange 504.2, a third set of thermal shields 508.3 removably fixed to the flange 504.2, a fourth set of thermal shields 508.4 removably fixed to the flange 504.4, and a fifth set of thermal shields 508.5 removably fixed to the flange 504.5.

[0096] To further illustrate the construction of the nested default thermal shield array 508 and the similar bridging thermal shield array 512 and end shield array 510 (both previously described in association with Figure 5 and Figure 6 ), it is useful to focus on a single nested layer, each layer forming a substantially enclosed "thermal shell" that includes all flanges and shields at one of the temperatures T1 to T6.

[0097] For example, Figure 20-28 the innermost thermal shell 2002 corresponding to the lowest cryogenic temperature T1 is shown for embodiment 300. The thermal shells at the other cryogenic temperatures T2, T, T4, T5 are similar. Figure 20-23 Various exploded views of the thermal shell 2002 are shown; Figure 24 Its assembled view is shown; and Figure 25-29 Various methods for connecting its components are shown. (Reference) Figure 20 For each of the three filled units B, C, and D in embodiment 300, the thermal housing 2002 may include a thermal flange 2004 (denoted as 2004.1 for unit B, 2004.2 for unit C, and 2004.3 for unit D, each of which is previously in Figure 5 Examples of the above are referred to as 504.1); four examples of the lateral shielding 2006 (denoted as 2006.1, 2006.2, 2006.3 and 2006.4 for element B; 2006.5, 2006.6, 2006.7 and 2006.8 for element C; and 2006.9, 2006.10, 2006.11 and 2006.12 for element C); and two examples of the central shielding 2008 (denoted as 2008.1 and 2008.2 for element B, 2008.3 and 2008.4 for element C, and 2008.5 and 2008.6 for element D). The thermal housing 2002 may further include a first pair of side bridge shields 2010.1 and 2010.2 spanning the gap between units B and C, and a first example 2012.1 of the top bridge shield 2012. The thermal housing 2002 may also include a second pair of side bridge shields 2010.3 and 2010.4 spanning the gap between units C and D, and a second example 2012.2 of the top bridge shield 2012. The thermal housing 2002 may also include two examples of end shields 2014, including a first example 2014.1 to complete the housing at its -x end, and a second example 2014.2 to complete the housing at its +x end.

[0098] Figure 20-24 The step-by-step assembly of the thermal casing 2002 is shown: Figure 20 It showed that it had completely decomposed. Figure 21 It was shown after the first assembly step. Figure 22 It was shown after the second assembly step. Figure 23 It is shown after the third assembly step, and Figure 24 This indicates that it is fully assembled.

[0099] Figure 21 The first assembly step of the thermal housing 2002 is shown, wherein the lateral shield 2006 is mounted on the thermal flange 2004. (See diagram) Figure 25 As shown, the shield 2006 can be secured to the flange 2004: a fastener 2502 threaded into the flange 2004 can engage a keyhole groove 2504 in the shield 2006. Figure 26As shown, opposing shields 2006 (such as shields 2006.3 and 2006.4) can be fixed to each other at the bottom: the flange 2602.3 of shield 2006.3 can abut against the flange 2602.4 of shield 2006.4, and can be fixed with screws 2604 and crimp nuts 2606.

[0100] Figure 22 The second assembly step of the thermal housing 2002 is shown, wherein the central shield 2008 and the bridge shield 2010 are mounted on the lateral shield 2006. (See diagram) Figure 27 As shown, the central shield 2008 and bridge shield 2010 can overlap the lateral shield 2006 to enhance radiation blocking. Specifically, the inwardly projecting central shield flanges 2702 and 2704 can overlap the outwardly projecting lateral shield flanges 2706 and 2708, respectively. Similarly, the inwardly projecting bridge shield flanges 2710 and 2712 can overlap the outwardly projecting lateral shield flanges 2714 and 2716, respectively. Figure 28 As shown, the center shield 2008 and the bridge shield 2010 can be fixed to the side shield 2006. That is, for example, the inwardly projecting flange 2802 of the center shield 2008.1 can overlap the outwardly projecting flanges 2804.1 and 2804.3 of the side shields 2006.1 and 2006.3, respectively, and the flange 2802 can be fixed to them by fasteners 2806. Similarly, the inwardly projecting flange 2808 of the side bridge shield 2010.1 can overlap the outwardly projecting flanges 2804.3 and 2804.5 of the side shields 2006.3 and 2006.5, respectively, and the flange 2808 can be fixed to them by fasteners 2810. Figure 29 As shown, the opposing side bridge shields 2010 (such as 2010.1 and 2010.2) can be fixed to each other at the bottom: the flange 2902.1 of shield 2010.1 can abut against the flange 2902.2 of shield 2010.2, and can be fixed with screws 2904 and crimp nuts 2906.

[0101] Figure 23 The third assembly step of the thermal housing 2002 is shown, wherein the top bridge shield 2010 is mounted on the flange 2004. (See diagram) Figure 30 As shown, the top bridge shield 2012 can overlap the flange 2004 and the side bridge shield 2010 to enhance radiation blocking. Specifically, for example, flanges 3002 and 3004 of the top bridge shield 2012.1 can overlap flanges 2004.1 and 2004.2 respectively, and can be secured to them using fasteners 3006. Furthermore, flanges 3008 and 3010 of the top bridge shield 2012.1 can overlap side bridge shields 2010.1 and 2010.2 respectively.

[0102] Figure 24 The fully assembled thermal housing 2002 is shown. As shown, the housing is essentially enclosed and therefore resistant to heat radiation, except for the multiple cutouts 516 for vertical wiring, as with... Figure 5 As previously mentioned in connection with this, the wiring, which is not described here, can be packaged in a manner that conceals the cutout 516, thereby completing the substantial closure of the thermal housing 2002.

[0103] Figures 31-37 This illustrates how an existing dilution refrigerator 502 can be modified for use in Example 300. First, as... Figure 31 and 32 As shown, the refrigerator 502 can be inserted into the large hole 3102 in the sunroof panel 1606, so that the -z surface of the room temperature flange 1602 can abut against the +z surface of the sunroof panel 1606, and can be fixed to the sunroof panel 1606 using fasteners 3202.

[0104] Secondly, such as Figure 33 As shown, the custom-designed thermal flange 504.5 can be fixed to the fifth refrigeration flange 506.5 of the refrigeration unit (in... Figure 32 The flange 504.5 is visible at the top and supported by a fifth flange support 3302. The flange 504.5 may include a left portion 3304 that can be inserted from the -y direction and may be slotted to avoid interference with refrigeration components (such as the first plurality of left-side refrigeration supports 3306). The flange 504.5 may also include a right portion 3308 that can be inserted from the +y direction and may be slotted to avoid interference with refrigeration components (such as the first plurality of right-side refrigeration supports 3310).

[0105] Third, such as Figure 34 As shown, the custom thermal flange 504.4 can be fixed to the fourth refrigeration flange 506.4 of the refrigeration unit (in... Figure 32 The flange 504.4 is visible at the top and supported by a fourth flange support 3402. The flange 504.4 may include a left portion 3404 that can be inserted from the -y direction and may be slotted to avoid interference with refrigeration components (such as a second plurality of left-side refrigeration supports 3406). The flange 504.4 may also include a right portion 3408 that can be inserted from the +y direction and may be slotted to avoid interference with refrigeration components (such as a second plurality of right-side refrigeration supports 3410).

[0106] Fourth, such as Figure 35 As shown, the custom thermal flange 504.3 can be fixed to the third refrigeration flange 506.3 of the refrigeration unit (see below). Figure 32The flange 504.3 is located at the top of the refrigeration unit and is supported by a third flange support 3502. The flange 504.3 may include a left portion 3504, which can be inserted from the -y direction and may be slotted to avoid interference with refrigeration components such as a third plurality of left-side refrigeration supports 3506. The flange 504.3 may also include a right portion 3508, which can be inserted from the +y direction and may be slotted to avoid interference with refrigeration components such as a third plurality of right-side refrigeration supports 3510.

[0107] Fifth, such as Figure 36 As shown, the custom thermal flange 504.2 can be fixed to the second refrigeration flange 506.2 of the refrigeration unit (see below). Figure 32 The flange 504.2 is located at the top of the refrigeration unit and is supported by a second flange support 3602. The flange 504.2 may include a left portion 3604, which can be inserted from the -y direction and may be slotted to avoid interference with refrigeration components such as a fourth plurality of left-side refrigeration supports 3606. The flange 504.2 may also include a right portion 3608, which can be inserted from the +y direction and may be slotted to avoid interference with refrigeration components such as a fourth plurality of right-side refrigeration supports 3610.

[0108] Sixth, such as Figure 37 As shown, the custom thermal flange 504.1 can be fixed to the first refrigeration flange 506.1 of the refrigeration unit (see below). Figure 32 Below it, and supported by the first flange support 3702.

[0109] The above-described embodiment 300, which comprises only five unit cells {ABCDE}, is a relatively small example of a contemplated type of modular scalable quantum computer, such as {AB C1C2…C…}. n DE}, where n can be very large. Such large modular systems inevitably suffer from periodic failures of fault-prone components. The preferred approach is to recover from failures quickly and efficiently, thereby minimizing system downtime. It is well known that such rapid recovery is typically achieved by replacing the entire faulty module rather than debugging low-level hardware in the field. Such replaceable modules are commonly referred to as field-replaceable units, or FRUs.

[0110] For embodiment 300 and other embodiments, such as {AB C1C2…C n In the DE} FRU, one option is to insert component 1202, as it contains all the faulty components of the unit cell, including refrigerator 502, payload 514, and other payload support electronics. For example, according to Figure 38The first FRU strategy shown allows for the removal of the insertion component 1202 if a single unit C fails, by pulling it out through the skylight cutout 1204 in frame 1302 and replacing it with a new instance. However, this first FRU strategy may result in an excessively large initial ceiling height H1, as it is incompatible with installations in many data centers with relatively low ceilings. Specifically, the required ceiling height is:

[0111] H1=h0+h 1A +h2+h3 (1)

[0112] like Figure 38 As shown, h0 is the frame height; that is, the vertical distance from the floor where embodiment 300 is located to the top of frame 1302. Figure 38 As shown, h 1A This is the first FRU extraction height; that is, the vertical distance from the top of frame 1302 to the top of the extracted FRU 1202. Height h2 (not in...) Figure 38 (As shown above) is the additional height required by the refrigeration equipment (not shown) on top of component 1202. Height h3 (also not shown) Figure 38 (Shown above) is the height used to lift equipment, such as a gantry crane that needs to pull out component 1202. For example, a typical value could be h0 ≈ 2.3m, h 1A h1 ≈ 1.7m, h2 ≈ 1.0m, and h3 ≈ 1.0m, therefore

[0113] H1≈2.3+1.7+1.0+1.0=6.0m (1A)

[0114] Many data centers have approximately H ≈4.3m clear ceiling height H .therefore, Figure 38 The first FRU strategy shown is not feasible for a typical data center.

[0115] pass Figure 39 The second FRU strategy shown requires a slightly lower ceiling height. In this strategy, all thermal shields 2006 and 2008 are removed before pulling out component 1202, resulting in an unshielded FRU 3902. This second FRU strategy may require a second required ceiling height.

[0116] H2=h0+h 1B +h2+h3 (2)

[0117] Where h 1B H2 is the distance from the top of frame 1302 to the top of the extracted FRU 3902. H2 is slightly smaller than H1 because FRU3902 has no shielding, therefore h 1B Less than h1A For example, a typical value could be h. 1B ≈1.4m, therefore

[0118] H2≈2.3+1.4+1.0+1.0=5.7m (2A)

[0119] Unfortunately, H2 is still significantly larger than the typical data center ceiling height H. ≈4.3m. Therefore, Figure 39 The second FRU strategy shown is not feasible for typical data centers.

[0120] To address this issue, embodiment 300 includes a third FRU strategy, by Figures 40-49 Note that in this third FRU strategy, trapezoidal unit cells {ABCDE} are used (regarding...). Figure 4 and Figure 15 (As previously mentioned), to allow the entire unit (including frame assembly 704) to be horizontally removed from embodiment 300, thereby eliminating the need for vertical removal of the FRU via the skylight panel. This third strategy produces a third required ceiling height H3, which is significantly smaller than H1 or H2 because...

[0121] H3=h0+h2 (3)

[0122] In other words, compared to equations (1) or (2) above, the right side of (3) does not correspond to h. 1A or h 1B The term is omitted because the horizontal FRU extraction used in the third FRU strategy does not require additional FRU extraction height. Furthermore, there is no term corresponding to h3 on the right-hand side of (3) because the third FRU strategy does not require lifting equipment. Therefore, using the previously assumed typical values, the typical ceiling height H3 of the third FRU strategy is...

[0123] H 3 ≈ 2.3 + 1.0 = 3.3m (3A)

[0124] This is far less than the ceiling height of a typical data center. H ≈4.3m. In other words, unlike the first and second FRU strategies, the third FRU strategy is suitable for typical data centers.

[0125] Figures 40 to 44 Example 300 is shown in which various stages of the extraction process in which unit cell C is removed for replacement are illustrated. Figure 40 The fully assembled configuration of Example 300 is shown; Figures 41 to 44The first, second, third, and fourth extraction positions of unit C are shown respectively. Extraction can be achieved by applying extraction force 4102, which is due to the low rolling resistance coefficient of the mechanical pulley 1330. C rr And it can be very small. Typically, for high-quality mechanical pulleys, C rr =0.02. If an even lower coefficient is desired, a well-known pneumatic pulley (typically with...) can be used. C rr =0.002) to assist the mechanical pulley. In Figure 44 In the fourth extraction position, element C is completely removed from the rest of the array {ABDE}; element C can be transported to a remote location for repair, and replacement element C can undergo the same process as... Figures 40-44 The insertion process is the reverse of the sequence shown, with force 4102 reversed.

[0126] Figures 45 to 51 Further details of the extraction and removal process just described are shown. In these figures, it is useful to add the suffixes “.B,” “.C,” or “.D” to the previously defined reference numerals to specify which unit cell (B, C, or D) is being referenced. For example, the number 1502 was previously defined as the left projecting flange of frame 1302; in Figure 45 In this context, "1502L.B" refers to "the left protruding flange of frame 1302 of unit B", "1502L.C" refers to "the left protruding flange of frame 1302 of unit C", "1502R.C" refers to "the right protruding flange of frame 1302 of unit C", and "1502R.D" refers to "the right protruding flange of frame 1302 of unit D".

[0127] Figure 45 It corresponds to the first extraction position ( Figure 41 A top view of ). In contrast, Figure 46 and Figure 47 The configurations corresponding to the fully assembled configurations are shown respectively. Figure 40 The rear and front perspective views of the unit C show that four guide pins (two at the front and two at the rear) can be fully engaged in four guide pin clearance holes 1332. At the rear of the unit C ( Figure 46 As shown in the diagram, the left guide pin 1326L.C of unit C can engage in the left clearance hole 1332L.B of unit B, and the right guide pin 1326R.C of unit C can engage in the right clearance hole 1332R.D of unit D. At the front of unit C ( Figure 47As shown in the diagram, the right guide pin 1326L.B of unit B can be engaged in the right clearance hole 1332R.C of unit C, and the left guide pin 1326L.D of unit D can be engaged in the left clearance hole 1332L.C of unit C.

[0128] Still referencing Figures 46-47 In the fully assembled configuration, four or more tension screws 1328 can be screwed into four or more tension screw tap holes 1406. Following embodiment 300 ( Figure 46 As shown in the diagram, the left tensioning screw 1328L.B of unit B can be screwed into the left tapping hole 1406L.C of unit C, and the right tensioning screw 1328R.D of unit D can be screwed into the right tapping hole 1406R.C of unit C. In the preceding part of embodiment 300 (… Figure 47 As shown in the diagram, the left tension screw 1328L.C of unit C can be screwed into the left tap hole 1406L.B of unit B, and the right tension screw 1328R.C of unit C can be screwed into the right tap hole 1406R.D of unit D. As explained later, the tension screw 1328 can be used to compress the frame O-ring 702 to form a vacuum seal between the frames 704.

[0129] Figures 48-51 A top view is shown of a key initial portion of the extraction process, during which the frame O-ring 702 is released from its fully compressed state. Figure 48 ) transforms into its uncompressed state ( Figure 50 and Figure 51 ). Figures 48-51 Concentrated at the rear of unit C and its abutment against adjacent units B and D. In these four figures, all the tensioning screws (including 1328L.C, 1328R.C, 1328L.B, and 1328R.D) that bind unit C to units B and D have been removed in preparation for the extraction process. Figure 48 The initial fully assembled position is shown, in which the left side wall 1314L.C of unit C can abut against the left protruding flange 1502L.B of unit B at the abutment portion 4802L, and similarly, the right side wall 1314R.C of unit C can abut against the right protruding flange 1502R.D of unit D at the abutment portion 4802R.

[0130] like Figures 49-51 As shown, an extraction force can be applied to unit C. F e , so that it follows - y Directional translation, as previously mentioned, can be achieved through a low rolling resistance coefficient. C rr (usually for mechanical pulleys) C rr≈0.02; for pneumatic pulleys C rr The mechanical pulley 1330 (≈0.002) is used to facilitate, thereby allowing F e Relatively small. If it is necessary to force the initial separation of unit C from units B and D, the jack screw (not shown) can be screwed in. Figure 46 In the holes 1334R.D and 1334L.B shown, and Figure 47 The holes 1334L.C and 1334R.C are shown, and these screws can be tightened and pressed against them. Figure 14B The jack screw support areas 1408L and 1408R shown force the frame 704 of unit C to separate from the adjacent frame.

[0131] During the extraction process, the separation distance between the protruding flange 1502L.B of unit B and the rear surface 4902 of the left side wall 1314L.C of the frame 704 of unit C can be used. s To measure progress. Figures 48-51 In s The values ​​are 0 and 0 respectively. s 1. s 2 and s 3, where 0 < s 1< s 2< s 3. When s =0( Figure 48 When ), the O-ring 704 of the frame is fully compressed; when s = s 1( Figure 48 When ), the frame O-ring 702 is partially compressed; and when s ≥ s 2( Figure 48 and Figure 49 At that time, the O-ring 704 of the frame was completely uncompressed. Therefore, for s ≥ s 2 (This is the majority of the extraction process), unit C is completely separated from its neighbors B and D. This is the result of the trapezoidal shape of frame 704, where sidewalls 1314L.C and 1314R.C face each other at an angle of 2θ, as previously stated in Figure 15 As shown in the diagram. Therefore, the trapezoidal shape (θ>0) enables the extraction process. This can be understood by considering an alternative with a rectangular frame (θ=0), for which the extraction process would be nearly impossible because element C would be tightly bonded to elements B and D by friction throughout the process. This not only requires... F EThe value is large and it is very likely to damage the O-ring 702. Therefore, for a modular scalable cryogenic system such as the quantum computer illustrated by Example 300, the trapezoidal shape of the frame 704 solves an important problem: it enables modular repair at the unit cell level without a high ceiling, as described with respect to Figures 38-44 as previously explained.

[0132] Figures 52-55 illustrates the insertion process of a new instance of unit C. Such an insertion process can occur when initially assembling multiple unit cells of Example 300, or during a repair operation when a new instance of unit C is inserted to replace the defective unit C that has just been removed as described above.

[0133] In Figures 52-55 , an insertion force F is applied to unit C i , causing it to translate in the +y direction, and this translation can be facilitated by the pulleys used for the extraction process as described above. During the insertion process, the progress can be measured by the separation distance g between the protruding flange 1502L.B of unit B and the rear surface 4902 of the left wall 1314L.C of the frame 704 of unit C. Figures 52-55 The values of g in Figure 54 are g3, g2, g1, and 0 respectively, where 0 < g1 < g2 < g3. When g ≥ g2, the frame O-ring 702 is not compressed; when g = g1 ( Figure 54 ), the frame O-ring 702 is partially compressed; when g = g1 ( Figure 55 ), the frame O-ring 704 is partially compressed, and when g = 0 ( Figures 52-55 ), the frame O-ring 702 is fully compressed. Therefore, for g ≥ g2 (which is most of the insertion process), unit C is completely separated from its neighbors B and D. However, in the final O-ring compression part of the insertion process, where g < g2, a relatively large force may be required to compress the O-ring 702. This force can be provided by the Figure 46 shown and previously shown in Figure 56 tightening screws 1328L.B and 1328R.D. As shown in Figure 53 (which is a transparent version of

[0134] ), before the start of the final O-ring compression part of the insertion process, the tightening screws 1328L.B and 1328R.D engage the threaded holes 1406L.C and 1406R.C respectively, so that the tightening force of the screws 1328L.B and 1328R.D is always available. Figure 57A top view free-body diagram showing the forces acting on element C during the O-ring compression portion of the insertion process is shown. Because frame 704 is substantially symmetrical about the central plane 5702, it is sufficient to consider only half of unit element C (+x), as... Figure 57 As shown in the figure. Referring to this figure, define...

[0135] F s The force applied by one of the tension screws 1328

[0136] n s Quantity of 1328R.C tension screws

[0137] Quantity of 1328L.C tension screws

[0138] F n Normal force required to compress O-ring 702

[0139] F f Frictional force resisting the motion of unit C in the +y direction.

[0140] Let's recall, for example Figure 57 As shown, θ Half angle of the trapezoidal shape of frame 704.

[0141] Force F n and F f Decompose into Cartesian components, and only consider the y-components of these forces, by examining... Figure 57 It can be seen that in order to increase the tension of the screw F s Overcoming normal force F n and frictional force F f The following relationships must be maintained:

[0142] n s F s ≥ F n sinθ+F f cosθ (4)

[0143] In other words, each tensioning screw must be able to provide an axial force F of at least the following magnitude. s :

[0144] F s =(F n sinθ+F f cosθ) / n s (5)

[0145] definition

[0146] λn The required normal compressive force per unit length for O-ring 702

[0147] λ f Friction per unit length of the O-ring 702 sliding on the frame 704

[0148] L O-ring length

[0149] Then equation (5) can be written as

[0150] F s =L(λ) n sinθ+λ f cosθ) / n s (6)

[0151] For example, a typical O-ring can have a Shore A hardness of 70, a typical O-ring compression can be 20% of its diameter, and the typical O-ring diameter for this application can be approximately 10 mm. Under these conditions, λ n and λ f A typical value could be λ n ≈7000[N / m] and λ f ≈1000 [N / m]. For applications of interest, a typical O-ring length can be approximately L≈7.5 [m], a typical trapezoidal half-angle can be θ=5°, and a typical number of tightening screws can be n. s =9. Under these conditions,

[0152] F s =(7.5[m]){(7000[N / m])(sin5°)+(1000[N / m])(cos5°)} / 9

[0153] =(7.5[m]){610[N / m]+996[N / m]} / 9

[0154] =1338[N] (7)

[0155] The tension screws 1328 in this application can be, for example, M16, each capable of supplying (for strength grade 8.8) 100,000 [N] of axial force, which is 75 times more than required in the example given in equation (7). Therefore, the tension screws 1328 can readily supply the force required to compress the O-ring 702.

[0156] Analysis of x-forces in Figure 58As shown in the diagram, in most cases, a unit cell such as C experiences balanced x-forces: its -x neighbor B pushes it towards +x, while its +x neighbor D pushes it towards -x with an equal force. However, each end cell A and E experiences unbalanced forces because it has only one neighbor. Moreover, after the extraction process, until the missing unit cell is replaced using the insertion process just described, the unit cell that comes into contact with the extracted unit cell also experiences unbalanced forces. Therefore, it is worthwhile to analyze these unbalanced forces.

[0157] refer to Figure 58 ,definition

[0158] n g Quantity of 1326L.C pilot pins Quantity of pilot pin 1326R.D

[0159] P x-force on each guide pin

[0160] The guide pin 1326 must resist the force of the O-ring. F n of x -to component F n sin θ The number of pins resisting this force is 2. n g ,include n g Individual sales of 1326L.C and n g Individual sales: 1326 R.D. Therefore...

[0161] 2 n g P = F n cos θ (8)

[0162] thus

[0163] P =( F n cos θ ) / 2 n g =(λ n L cos θ ) / 2 n g (9)

[0164] The latter equation uses the previously given λ.n and L The definition of . Substituting typical values ​​of the previously given parameters, the force acting on each guide pin can be

[0165] P =(7000[N / m])(7.5[m])(cos5°) / (2)(9)=2905[N] (10)

[0166] For this application, a typical guide pin diameter can be 20 mm, and the lateral force given by (10) is quite small. Therefore, the guide pin can easily handle the lateral force associated with O-ring compression.

[0167] A special embodiment 6000 with θ = 0 is shown in Figure 60 In order to facilitate comparison, it is relative to Figure 59 Example 300 is arranged side by side. Figure 60 As shown, since θ = 0, embodiment 6000 comprises multiple unit cells {6004A, 6002B, 6004C, 6004D, 6004E}, each having a rectangular planar shape, while the unit cells {304A, 304B, 304C, 304D, 304E} of embodiment 300 each have a trapezoidal planar shape. The rectangular unit cell 6004 lacks the protruding flange 1502, guide pin 1326, and tensioning screw 1328 previously described for the trapezoidal unit cell 304. Instead, each rectangular unit cell 6004 may comprise multiple conventional flange bolts 6006, and embodiment 6000 may be conventionally assembled in a left-to-right order (6000A, then 6000B, then 6000C, then 6000D, then 6000E) or a right-to-left order (or vice versa), by means of... x Each subsequent unit is translated directionally to achieve abutment, and is secured to its abutting neighbor using flange bolts 6006. In contrast, assembly of Embodiment 300 occurs via the previously explained insertion process, through… y Each inserted unit is translated directionally to achieve contact, and subsequent fastening occurs by using tension screws 1328 to secure it to its contacting neighbor or multiple neighbors. Therefore, for all practical purposes, the trapezoidal frame 304 has the advantage (i.e., by using...) with... Figures 48-51The extraction and insertion process discussed therein (the ability to remove and reinsert unit cells anywhere in the array) does not apply to rectangular frame 6002 for the same reasons discussed with regard to those figures. That is, once embodiment 6000 is assembled, it is very difficult to remove and replace defunct, filled unit cells. Therefore, for all practical purposes, FRU removal and replacement of embodiment 6000 cannot use the third FRU strategy (i.e., horizontal FRU extraction) previously described in relation to equation (3). Instead, embodiment 6000 can use the first or second FRU strategy (i.e., vertical FRU extraction) previously described in relation to equations (1) and (2). However, as previously explained, vertical FRU extraction, and therefore embodiment 6000, is not suitable for conventional data centers with relatively low ceilings. Nevertheless, embodiment 6000 can be useful for buildings with high ceilings suitable for vertical FRU extraction or for applications where FRU removal and replacement are not an issue.

[0168] Figure 61 A general embodiment 6100 is shown, in which all units (e.g., 6100A, 6100B, 6100C, 6100D, and 6100E) are unfilled, like units 300A and 300E of embodiment 300. Embodiment 6100 can be applied to applications other than quantum computing that require devices other than dilution refrigerators, but can still benefit from trapezoidal unit cells that allow for horizontal extraction and insertion of unit cells.

[0169] Embodiments of the present invention may be systems, methods, and / or apparatuses in integration at any possible level of technical detail. The above description includes only examples of systems, methods, and apparatuses. It is certainly not possible to describe all conceivable combinations of components or computer-implemented methods for the purposes of describing this disclosure, but those skilled in the art will recognize that many further combinations and substitutions of this disclosure are possible. Furthermore, for the terms “comprising,” “having,” “possessing,” etc., to be used in the detailed description, claims, appendices, and drawings, these terms are intended to be inclusive in a manner similar to how the term “comprising” is interpreted when used as a transitional word in a claim.

[0170] Furthermore, the term "or" is intended to mean an inclusive "or," not an exclusive "or." That is, unless otherwise specified or clear from the context, "X adopts A or B" is intended to mean either of the natural inclusive permutations. In other words, "X adopts A or B" is satisfied in any of the foregoing cases if X adopts A; X adopts B; or X adopts both A and B. Additionally, when the articles "a" and "an" are used in this subject matter specification and accompanying drawings, they should generally be understood to mean "one or more," unless otherwise specified or clearly indicated from the context to the singular form. The terms "example" and / or "exemplary" as used herein mean used as an example, instance, or illustration. For the avoidance of doubt, the subject matter disclosed herein is not limited to such examples. Furthermore, any aspect or design described herein is not necessarily intended to be construed as superior to or better than other aspects or designs, nor is it intended to exclude equivalent exemplary structures and techniques known to one of ordinary skill in the art.

[0171] Various embodiments have been described for illustrative purposes, but are not intended to be exhaustive or to limit the embodiments to those disclosed. Many modifications and variations will be apparent to those skilled in the art without departing from the scope and spirit of the described embodiments. The terminology used herein is for the purpose of best explaining the principles of the embodiments, their practical application, or technical improvements to the technology on the market, or to enable those skilled in the art to understand the embodiments disclosed herein.

[0172] While certain exemplary embodiments have been described, these embodiments are presented by way of example only and are not intended to limit the scope of the disclosure herein. Therefore, the foregoing description herein is not intended to imply that any particular feature, characteristic, step, module, or block is necessary or indispensable. Indeed, the novel methods and systems described herein may be embodied in other forms; furthermore, various omissions, substitutions, and changes may be made to the form of the methods and systems described herein without departing from the spirit of the disclosure herein. The appended claims and their equivalents are intended to cover such forms or modifications that fall within the scope and spirit of certain disclosures herein.

Claims

1. A cryogenic system, comprising: Multiple trapezoidal unit cells connected together, wherein each trapezoidal unit cell includes: A frame in which frames from adjacent trapezoidal unit cells are connected in a vacuum-sealed manner at the abutting surfaces of the adjacent trapezoidal unit cells.

2. The system of claim 1, wherein each frame includes an O-ring placed in an O-ring groove cut into the left or right side of the frame, and wherein the frames from the adjacent trapezoidal unit are vacuum-sealed by compressing the O-ring between the abutting surfaces.

3. The system according to any one of the preceding claims, wherein the trapezoidal unit cell is capable of being horizontally removed from or inserted into the plurality of connected trapezoidal unit cells.

4. The system according to any one of the preceding claims, further comprising at each end of the plurality of trapezoidal unit cells: End frames, wherein the plurality of frames and the end frames together form a vacuum-sealed container.

5. The system of claim 2, wherein the plurality of trapezoidal unit units are connected together by interleaving the trapezoidal unit unit containing an O-ring on the left side with the trapezoidal unit unit containing an O-ring on the right side.

6. The system according to claim 2, further comprising, on each frame of the plurality of trapezoidal unit cells: A set of front flanges, wherein the O-ring is compressed by threaded fasteners on the set of front flanges.

7. The system of claim 6, wherein the set of front flanges is used for guide pin engagement of the trapezoidal unit cell.

8. The system according to any one of the preceding claims, wherein the plurality of trapezoidal unit cells comprise unit cell to unit cell spacing between 500 mm and 1500 mm.

9. A cryogenic system, comprising: Multiple interconnected unit units, each unit unit comprising: frame; Multiple nested temperature shells, where subsets of the shells are at different temperature levels; At least one modified version of a standard dilution refrigeration unit; and At least one cryogenic payload located within at least one of the temperature levels, cooled by at least one modified version of the standard dilution refrigeration unit, wherein frames from adjacent unit cells are vacuum-sealed at the abutment surfaces of the adjacent unit cells, and at each temperature level, temperature housings from the adjacent unit cells are connected to form a continuous global temperature housing.

10. The system of claim 9, wherein each frame includes an O-ring placed in an O-ring groove cut into the left or right side of the frame, and wherein the frames from the adjacent unit are vacuum-sealed by compressing the O-ring between the abutting surfaces.

11. The system according to any one of claims 9-10, wherein a unit cell is capable of being horizontally removed from or inserted into a plurality of connected unit cells.

12. The system according to any one of claims 9-11, further comprising at each end of the plurality of unit cells: End frames, wherein the plurality of frames and the end frames together form a vacuum-sealed container; as well as An end cap for the global temperature housing at each end of the plurality of unit cells, wherein the global temperature housing and the end cap form a substantially enclosed, radiation-resistant thermal shell.

13. The system of claim 10, wherein the plurality of unit units are connected together by interleaving the unit unit containing an O-ring on the left side with the unit unit containing an O-ring on the right side.

14. The system according to any one of claims 9-13, further comprising, on each frame of the plurality of unit cells: A set of front flanges, wherein the O-ring is compressed by threaded fasteners on the set of front flanges.

15. A cryogenic system, comprising: Multiple trapezoidal unit cells connected together, wherein each trapezoidal unit cell includes: The frame assembly includes at least one door that forms a vacuum-sealed seal when closed; At least one temperature housing suspended from a set of refrigeration unit flanges; At least one modified version of a standard dilution refrigeration unit; and At least one cryogenic payload located within the at least one temperature housing, cooled by at least one modified version of the standard dilution refrigeration unit, wherein frames from adjacent trapezoidal unit cells are vacuum-sealed at the abutting surfaces of the adjacent trapezoidal unit cells, and temperature housings from the adjacent trapezoidal unit cells are connected to form a continuous global temperature housing.

16. The system of claim 15, wherein each frame includes an O-ring placed in an O-ring groove cut into the left or right side of the frame, and wherein the frames from the adjacent trapezoidal unit are vacuum-sealed by compressing the O-ring between the abutting surfaces.

17. The system according to any one of claims 15-16, wherein the trapezoidal unit cell is capable of being horizontally removed from or inserted into the plurality of connected trapezoidal unit cells.

18. The system according to any one of claims 15-17, further comprising at each end of the plurality of trapezoidal unit cells: End frames, wherein the plurality of frames and the end frames together form a vacuum-sealed container; as well as An end cap for the global temperature housing at each end of the plurality of trapezoidal unit cells, wherein the global temperature housing and the end cap form a substantially enclosed, radiation-resistant thermal shell.

19. The system of claim 16, wherein the plurality of trapezoidal unit cells are connected together by interleaving the trapezoidal unit cells based on the position of the O-ring, such that the wide end of the trapezoidal unit cell is placed next to the narrow end of the adjacent trapezoidal unit cell.

20. The system according to any one of claims 15-19, further comprising, on each frame of the plurality of trapezoidal unit cells: A set of front flanges, wherein the O-ring is compressed by threaded fasteners on the set of front flanges.

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