Cartridge opening / closing device

Abstract

A cassette opening / closing device is provided for connection to a substrate transfer chamber, wherein the cassette opening / closing device has a configuration capable of controlling the height dimension of the substrate transfer chamber. The cassette opening / closing device 4 includes: a placement portion 44 on which an SMIF cassette 100 having a base plate 101 and a cover 102 can be placed; a base 41; an opening 92 formed in the base 41; a baffle 42 disposed on the opposite side of the placement portion 44 across the base 41 and capable of closing and opening the opening 92; a cover moving mechanism 81; and a baffle opening / closing mechanism 82. The cover moving mechanism 81 is capable of moving the cover 102 between a lower position for covering the cassette C placed on the base plate 101 and an upper position higher than the lower position and exposing the cassette C. The baffle opening / closing mechanism 82 is capable of moving the baffle 42 between a closed position where the opening 92 is closed and an open position where the opening 92 is open, the open position being below the closed position and located inside the substrate transfer chamber 2 connected to the cassette opening / closing device 4.

Description

Technical Field

[0001] This invention relates to a cassette opening / closing device for opening and closing a cassette for storing wafers. Background Technology

[0002] Semiconductor devices are manufactured by performing various processes (cleaning, film deposition, photoresist coating, etc.) on wafers using processing equipment. During the semiconductor device manufacturing process, the adhesion of particles, moisture, and other contaminants to the wafer surface can lead to quality degradation of the semiconductor device. Therefore, maintaining a high level of cleanliness around the wafer is essential.

[0003] Therefore, the wafers are stored in a container called a Standard Mechanical Interface (SMIF) cassette, which is kept clean internally, and are conveyed to the processing equipment while maintaining the cleanliness of the wafers. The SMIF cassette includes a base plate on which a cassette containing the wafers can be placed, and a cover that covers the cassette placed on the base plate (see, for example, Patent Document 1). Figure 29 In this SMIF box, the cassette can be exposed from the SMIF box by raising the cover from the base plate, and the wafer can be removed.

[0004] Patent Document 1 discloses a substrate transfer module (wafer transfer device in Patent Document 1) for transferring wafers stored in SMIF cassettes to a processing device. The substrate transfer module includes a cassette opening / closing device (opener in Patent Document 1) for raising and lowering the cover of the SMIF cassette, and a substrate transfer chamber (loader in Patent Document 1) connected to the cassette opening / closing device and the processing device, the interior of which is kept clean. The cassette opening / closing device is provided with a stage on which the SMIF cassette is placed. Inside the substrate transfer chamber, a transfer mechanism (loading mechanism in Patent Document 1) is installed for transferring wafers from the SMIF cassette placed on the stage to the processing device.

[0005] Furthermore, a partition wall is provided between the stage of the box opening / closing device and the substrate transfer chamber to isolate the substrate transfer chamber from the external space. The partition wall has an opening through which the wafer can pass. This opening is closed by a vertically movable baffle (a tongue in Patent Document 1). The opening is opened by raising the baffle.

[0006] The cassette opening / closing device disclosed in Patent Document 1 is configured to raise and lower the cover and baffle of the SMIF cassette placed on the stage as a single unit. When a wafer is transferred to the processing equipment, the cassette opening / closing device first raises the cover and baffle as a single unit. This exposes the cassette from the SMIF cassette and opens the opening. As a result, the transfer mechanism can access the cassette from the opened opening and transfer the wafer to the processing equipment. Although the transfer mechanism in Patent Document 1 transfers the wafer along with the cassette, transfer mechanisms that remove individual wafers from the cassette and transfer individual wafers are also known as prior art.

[0007] [Existing Technical Documents]

[0008] Patent documents

[0009] Patent Document 1: Japanese Patent No. 4552362

[0010] In Patent Document 1, when other components are positioned in the space near the baffle raised by the box opening / closing device (i.e., above the opening formed in the partition wall) (hereinafter referred to as the upper space), the baffle and other components may interfere with each other. These other components include, for example, fans (purification fans in Patent Document 1) positioned inside and above the substrate transfer chamber, and cover components covering the exterior of the substrate transfer chamber to improve its appearance. Therefore, components such as fans and cover components of the substrate transfer chamber need to be positioned even higher than the upper space to avoid interfering with the baffle. Consequently, the upper space becomes a so-called dead space in which no components can be positioned. As a result, the height of the substrate transfer chamber increases the amount of the upper space that becomes a dead space.

[0011] This disclosure provides some embodiments of a box opening / closing device connected to a substrate transfer chamber and configured to suppress the height dimension of the substrate transfer chamber. Summary of the Invention

[0012] The cassette opening / closing device according to this disclosure is connected to a substrate transfer chamber for transferring substrates to a processing apparatus, comprising: a stage configured to place a cassette on the stage, the cassette including a base plate and a cover, a cassette containing the substrate being placed on the base plate, the cover being configured to cover the cassette placed on the base plate; a base forming part of a partition wall disposed between the substrate transfer chamber and the stage and configured to isolate the substrate transfer chamber from an external space; an opening formed in the base; and a baffle disposed via the base on the opposite side of the stage and configured to... The device includes a cover mechanism for closing and opening the opening; a cover movement mechanism configured to move the cover between a lower position and an upper position, in which the cover covers the cassette placed on the base plate, and in the upper position, the cover exposes the cassette, the upper position being above the lower position; and a baffle opening / closing mechanism configured to move the baffle between a closed position where the baffle closes the opening and an open position where the baffle opens the opening, the open position being below the closed position and located inside the substrate transfer chamber connected to the cassette opening / closing device.

[0013] According to this disclosure, when a substrate is transferred to a processing device, the opening can be opened by moving the baffle downwards, while the cover can be moved upwards to expose the cassette. Therefore, even when the components of the substrate transfer chamber are located in the space above the opening (hereinafter referred to as the upper space), these components will not interfere with the baffle. In other words, the upper space will not become a dead space, thus suppressing the height dimension of the substrate transfer chamber above the opening. Furthermore, the inventors have noted that in related technologies, the space where a baffle can be provided while avoiding interference between the baffle and the substrate transfer device typically exists inside the substrate transfer chamber and below the opening. Therefore, even when the baffle is moved to the open position below the closed position, interference between the baffle and other components can be avoided, and an increase in the height dimension of the substrate transfer chamber below the opening can also be prevented. As described above, the cassette opening / closing device according to this disclosure can suppress the height dimension of the substrate transfer chamber to which the cassette opening / closing device is connected.

[0014] The box opening / closing device according to this disclosure may further include a gas replacement mechanism configured to replace the interior of the box with a cleaning gas, wherein the gas replacement mechanism may have a first supply port configured to supply the cleaning gas into the box, and wherein the first supply port may be formed in a baffle and configured to open toward the stage.

[0015] According to this disclosure, the interior of the cartridge can be replaced with a cleaning gas by employing the following procedure. Specifically, the cover is moved to the upper position to expose the cartridge, and the baffle is held in the closed position. In this state, the cleaning gas is supplied to the cartridge from a first supply port formed in the baffle. Therefore, the interior of the cartridge can be replaced with a cleaning gas, and oxygen, moisture, etc., can be removed from the area surrounding the wafer contained in the cartridge. As a result, wafer oxidation and moisture adhesion to the wafer can be suppressed. The cleaning gas is, for example, nitrogen or dry air.

[0016] The box opening / closing device according to this disclosure may further include a second supply port configured to supply clean air to the box, wherein the second supply port may be configured to open toward the stage when the baffle is in the open position.

[0017] According to this disclosure, when the cover moves to the upper position to expose the cassette and the baffle moves to the open position to open the opening, cleaning gas can be supplied to the cassette from the second supply port. Therefore, when the wafer is removed from the cassette and loaded into the substrate transfer chamber, cleaning gas can be continuously supplied around the wafer. As a result, the concentration of cleaning gas around the wafer increases, thereby reducing the concentration of oxygen, moisture, etc., around the wafer. Consequently, wafer oxidation and moisture adhesion to the wafer can be suppressed.

[0018] In the box opening / closing device according to the present disclosure, the pressure in the substrate transfer chamber may be higher than the pressure in the external space. The cover moving mechanism may include a lifting device configured to raise and lower the cover relative to the base plate and configured to form a receiving space for receiving the box together with the cover when the cover is spaced apart from the base plate. The baffle may have a communicating device configured to communicate the substrate transfer chamber and the receiving space with each other, and a shield may be provided, which is configured to open and close the communicating device by being driven to move by a drive source different from the cover moving mechanism.

[0019] According to this disclosure, when the cover and the base plate are separated by the lifting mechanism, the cassette is exposed to the receiving space. Furthermore, according to this disclosure, the substrate transfer chamber and the receiving space can be connected by a shielding member. Therefore, even when the baffle is in the closed position, gas can be supplied from the higher-pressure substrate transfer chamber to the receiving space. Thus, in a substrate transfer device that provides a drive source (baffle opening / closing mechanism) for raising and lowering the baffle and a drive source for raising and lowering the lifting mechanism, gas inflow from the external space into the cassette can be prevented.

[0020] In addition to the above disclosure, Japanese Patent Application Publication No. 2002-520831 discloses a box opening / closing device (hereinafter referred to as "box opening / closing device") configured to open and close an SMIF box (hereinafter referred to as "box") containing a substrate and connected to a processing tool (hereinafter referred to as "substrate transfer chamber"). More specifically, the box opening / closing device includes a front wall (base), a box opening / closing device opening (hereinafter referred to as "channel opening") formed in the front wall, and a panel (hereinafter referred to as "baffle") capable of opening and closing the channel opening. The baffle is configured to be movable between a closed position where the baffle closes the channel opening and an open position where the baffle opens the channel opening, the open position being above the closed position. The baffle is disposed outside the housing forming the substrate transfer chamber. In recent years, there has been a need to further improve the cleanliness of the atmosphere inside the substrate transfer chamber. In the above configuration, external air can enter the substrate transfer chamber through the gap between the baffle and the base, potentially generating particles. Therefore, it is conceivable to provide a box opening / closing device that can suppress the generation of particles in the substrate transfer chamber.

[0021] The box opening / closing device according to the first embodiment is configured to open and close a box containing a substrate and connected to a substrate transfer chamber for transferring the substrate, and is characterized by comprising: a base forming part of a partition wall for isolating the substrate transfer chamber from an external space and having a channel opening through which the substrate can pass; a baffle configured to move between a closed position and an open position and disposed outside the substrate transfer chamber, wherein the channel opening is closed in the closed position and the channel opening is open in the open position, the open position being above the closed position; and a baffle cover configured to cover at least a portion of the vertical direction of the entrance to a gap, the gap being the space sandwiched between the baffle and the base.

[0022] "Gap inlet" refers to the end of the gap. In a configuration where the baffle is located outside the substrate transfer chamber, there is a concern that external air entering the gap between the baffle and the base may enter the substrate transfer chamber through the channel opening. According to this method, since at least a portion of the gap inlet in the vertical direction is covered by the baffle, the intrusion of external air into the gap can be suppressed. This suppresses the intrusion of external air into the substrate transfer chamber. Therefore, the generation of particles in the substrate transfer chamber can be suppressed.

[0023] The box opening / closing device according to the second method is characterized in that, in the first method, when the baffle is in the open position, the upper end of the baffle cover is positioned at the same position as the upper end of the baffle in the vertical direction, or above the upper end of the baffle.

[0024] Even when the baffle is configured to be located below the upper end of the baffle, it can still suppress the intrusion of external air into the gap to some extent. However, with this configuration, the path from the inlet of the gap between the baffle and the base to the channel opening becomes longer. As the path becomes longer, the possibility of external air entering the substrate transfer chamber can be reduced. Therefore, the generation of particles in the substrate transfer chamber can be further suppressed.

[0025] The characteristic of the third-party box opening / closing device is that, in the second method, the baffle cover only opens on its lower side.

[0026] In this way, the upper end of the baffle is sealed. Therefore, it is more effective to prevent outside air from entering the gap from the space above the baffle.

[0027] The box opening / closing device according to the fourth method is characterized in that, in any of the first to third methods, the baffle cover is a component separate from the base and is configured to be detachably attached to the upper end of the base.

[0028] The baffle can be attached to the base without being removed (e.g., the baffle can be fixed to the base in a non-removable manner, or the baffle can be formed from the same component as the base). On the other hand, typically, when shipping a box opening / closing device, the device is disassembled into multiple components and packaged in a predetermined packaging component. Furthermore, typically, among these multiple components, the base is the longest in the vertical direction. In other words, the length of the packaging component is primarily determined by the vertical length of the base. Therefore, when the baffle cannot be removed from the base, the packaging component needs to be large enough to accommodate a component with a length equal to the combined length of the base and the baffle. Thus, a larger packaging component than in related technologies is required. In this respect, according to this method, the baffle can be separated from the base during shipment. Therefore, it is not necessary to change the packaging component from one of the prior art.

[0029] In addition to this disclosure and the methods described above, the box opening / closing device described in Patent Document 1 includes a partition wall (hereinafter referred to as the base), a tongue (hereinafter referred to as the baffle), and a lifting device. The base has an opening and separates the substrate transfer chamber from the external space. The baffle is configured to open and close the opening. The lifting device is configured to raise and lower the cover and move up and down integrally with the baffle. More specifically, the lifting device is configured to raise and lower the cover while the box is separated from the external space. When the baffle and the lifting device are raised, the opening opens and the cover is spaced apart from the base plate. This exposes the box to the substrate transfer chamber side, so that the substrate stored in the box can be moved between the box and the substrate transfer chamber. When the box is exposed to the substrate transfer chamber side, cleaning gas is supplied from the substrate transfer chamber to the box. The inventors have investigated the development of a box opening / closing device in which a drive source for driving the baffle up and down and a drive source for driving the lifting device up and down are respectively provided as described above. With this configuration, the baffle can be moved vertically in a direction different from the lifting device and the cover. In this configuration, to keep the substrate transfer chamber as far away from the external space as possible, it is conceivable to first fully raise the lifting device and then move the baffle. However, in the above procedure, the baffle keeps the opening closed for a considerable period. Therefore, time is required before clean gas can be supplied from the substrate transfer chamber to the cassette. Consequently, low-cleanliness gas may flow from the external space into the space where the cassette is located, potentially contaminating the substrate stored in the cassette. Therefore, in a substrate transfer device that provides drive sources for raising and lowering the baffle and drive sources for raising and lowering the lifting device, the following methods can be considered to suppress gas from flowing into the cassette from the external space.

[0030] According to the fifth aspect, the substrate conveying device includes: a housing, wherein a substrate conveying chamber for conveying substrates is formed; and a cassette opening / closing device connected to the substrate conveying chamber and configured to open and close the cassette, the cassette including a base plate and a cover, wherein a cassette containing substrates is placed on the base plate, the cover being configured to cover the cassette placed on the base plate, wherein the pressure in the substrate conveying chamber is higher than the pressure in an external space, the external space being the space outside the housing, wherein the cassette opening / closing device includes: a base forming part of a partition wall separating the substrate conveying chamber from the external space; an opening formed in the base such that a substrate can pass through the opening; and a baffle configured to allow the substrate to pass through the baffle. The baffle moves between a closed position of the opening and an open position of the opening; a first drive source configured to drive the baffle; a lifting device configured to raise and lower the cover relative to the base plate, and configured to form a receiving space for receiving a box together with the cover when the cover is spaced apart from the base plate; a second drive source separately from the first drive source and configured to drive the lifting device, wherein the baffle has a connecting device configured to communicate the substrate transfer chamber and the receiving space with each other, and wherein a shield is provided, the shield being configured to open and close the connecting device by being driven to move by a drive source different from the first drive source.

[0031] In this manner, when the cover and base plate are separated by the lifting device, the cassette is exposed to the receiving space. Furthermore, in this manner, the substrate transfer chamber and the receiving space can be communicated with each other via a shield. Therefore, even when the baffle is in the closed position, gas can be supplied from the higher-pressure substrate transfer chamber to the receiving space. Thus, in a substrate transfer device that provides drive sources for raising and lowering the baffle and drive sources for raising and lowering the lifting device, gas inflow from the external space into the cassette can be prevented.

[0032] The substrate transfer device according to the sixth method is characterized in that, in the fifth method, the different driving sources used to drive the shield to move are the second driving sources.

[0033] In this way, the structure of the box opening / closing device can be simplified compared to the case where the shielding is driven by a drive source different from both the first and second drive sources.

[0034] The substrate transfer device according to the seventh method is characterized in that, in the fifth or sixth method, the shield is configured not to protrude above the upper end of the base when the connecting device is opened.

[0035] When the shielding protrudes above the upper end of the base, the vertical dimension of the box opening / closing device will increase due to the shielding. In this respect, the increase in the vertical dimension of the box opening / closing device can be suppressed, which would otherwise cause an increase in size due to the shielding.

[0036] The substrate conveying device according to the eighth embodiment is characterized in that, in any one of the fifth to seventh embodiments, it includes a pressure regulator configured to adjust the pressure in the substrate conveying chamber and a controller, wherein the controller controls the pressure regulator based on information about the movement of the shielding member.

[0037] When the substrate transfer chamber and the receiving space are connected to each other by the movement of the shielding member, the pressure in the substrate transfer chamber may fluctuate due to the movement of gas. In this way, the pressure regulator can be controlled while taking into account the movement of the shielding member. Therefore, pressure fluctuations in the substrate transfer chamber can be effectively suppressed.

[0038] A cassette opening / closing device according to a ninth aspect is connected to a substrate transfer chamber in which substrates are transferred, and is configured to open and close a cassette for receiving a cassette containing substrates, wherein the cassette includes a base plate and a cover, the base plate being configured to place the cassette on the base plate, and the cover being configured to cover the cassette placed on the base plate, wherein the cassette opening / closing device includes: a base configured to form part of a partition wall isolating the substrate transfer chamber from an external space; an opening formed in the base such that a substrate can pass through the opening; and a baffle configured to be in a closed position (baffle closing the opening) and an open position (baffle opening the opening). The device comprises: a first drive source configured to drive a moving baffle; a lifting device configured to raise and lower the cover relative to the base plate, and configured to form a receiving space for receiving a box together with the cover when the cover is spaced apart from the base plate; and a second drive source separately disposed from the first drive source and configured to drive the lifting device to move the baffle, wherein the baffle has a connecting device configured to communicate the substrate transfer chamber and the receiving space with each other, and wherein a shield is provided, the shield being configured to open and close the connecting device by being driven to move by a drive source other than the first drive source.

[0039] Similarly, by appropriately setting the pressure in the substrate transfer chamber, gas can be supplied from the substrate transfer chamber to the receiving space even when the baffle is in the closed position. Therefore, in a substrate transfer device that provides drive sources for raising and lowering the baffle and drive sources for raising and lowering the lifting mechanism, gas can be prevented from flowing into the cassette from the external space. Attached Figure Description

[0040] Figure 1This is a schematic plan view of the EFEM and processing equipment according to the first embodiment.

[0041] Figure 2 This is a side view showing the EFEM with its sidewalls removed.

[0042] Figure 3 This is a diagram showing the electrical configuration of the EFEM.

[0043] Figure 4 This is a three-dimensional view of the box opening / closing device.

[0044] Figure 5 This is a front view of the box opening / closing device.

[0045] Figure 6 This is a rear view of the box opening / closing device.

[0046] Figure 7 It is along Figure 5 The side cross-sectional view of the box opening / closing device taken from lines VI to VII.

[0047] Figure 8 Is it when the cover comes from Figure 7 The diagram shows a side view section when the state has been moved to the upper position.

[0048] Figure 9 When the baffle is from Figure 7 The diagram shows a side cross-sectional view when the state is moved to the open position.

[0049] Figure 10 It is a side cross-sectional view of the box opening / closing device according to the first modified example.

[0050] Figure 11 This is a plan view of the base plate placed on the platform according to the first modified example, viewed from above.

[0051] Figure 12 It is a side cross-sectional view of the box opening / closing device according to the second variation.

[0052] Figure 13 This is a schematic plan view of a substrate conveying device equipped with a box opening / closing device according to the second embodiment and the surrounding area of ​​the substrate conveying device.

[0053] Figure 14 This is a block diagram showing the electrical configuration of the substrate transfer device.

[0054] Figure 15 It is along Figure 13 The cross-sectional view taken from line III-III in the diagram.

[0055] Figure 16 It is along Figure 13 The cross-sectional view taken from line IV-IV in the diagram.

[0056] Figure 17 It is a perspective view of the box opening / closing device and the area surrounding the box opening / closing device.

[0057] Figure 18 (a) and (b) are schematic front views showing the base and baffle.

[0058] Figure 19 It corresponds to Figure 15 The diagram shows the baffle in the open position.

[0059] Figure 20 It corresponds to Figure 16 The diagram shows the baffle in the open position.

[0060] Figure 21 (a) and (b) are diagrams showing the baffle and the configuration around the baffle.

[0061] Figure 22 (a) and (b) are diagrams showing the configuration of the baffle cover and the area around the baffle cover.

[0062] Figure 23 (a) and (b) are diagrams showing the configuration of the baffle cover and the surrounding area of ​​the baffle cover according to the modified example.

[0063] Figure 24 This is a schematic plan view of the EFEM and processing equipment according to the third embodiment.

[0064] Figure 25 This is a side view of EFEM.

[0065] Figure 26 This is a diagram showing the electrical configuration of the EFEM.

[0066] Figure 27 This is a three-dimensional view of the box opening / closing device.

[0067] Figure 28 This is a front view of the box opening / closing device.

[0068] Figure 29 This is a rear view of the box opening / closing device.

[0069] Figure 30 It is along Figure 28 The cross-sectional view taken from line VII-VII in the diagram.

[0070] Figure 31 This is a diagram showing the state of the cover between the lower and upper positions.

[0071] Figure 32 This is a diagram showing the state of the cover in the upper position.

[0072] Figure 33 This is a diagram showing the baffle in the open position. Detailed Implementation

[0073] Embodiments of this disclosure will now be described with reference to the accompanying drawings.

[0074] Figure 1 This is a schematic plan view of the device front-end module (EFEM) 1 and the processing device 6 connected to the EFEM 1. The device front-end module (EFEM) 1 is a substrate transfer module according to the first embodiment. Figure 1 In this process, the top plate 32 of the substrate transfer chamber 2 (described later) is removed, making the interior of the substrate transfer chamber 2 visible. Figure 2 This is a side view of EFEM 1. The side wall (right side wall 36) of EFEM 1 has been removed, making the interior of EFEM 1 visible. For ease of explanation, Figure 1 The directions shown are defined as front-back and left-right. That is, the direction in which EFEM 1 and processing device 6 are arranged is defined as the front-back direction. In the front-back direction, the EFEM 1 side is defined as the front side, and the processing device 6 side is defined as the rear side. The direction in which multiple box opening / closing devices 4 are arranged and perpendicular to the front-back direction is defined as the left-right direction. The direction perpendicular to both the front-back and left-right directions is defined as the up-down direction (see [reference]). Figure 2 ).

[0075] (Outline configuration of EFEM and its surroundings)

[0076] First, refer to Figures 1 to 3 Describe the overview configuration of EFEM 1 and its surroundings. Figure 3 This is a diagram showing the electrical configuration of EFEM 1. (As shown) Figure 1 As shown, EFEM 1 includes a substrate transfer chamber 2, multiple box opening / closing devices 4, and a control device 5 (see [reference]). Figure 3 ).like Figure 1 As shown, the processing device 6 is located behind EFEM 1. The processing device 6 is a device for performing a predetermined process on the wafer W (the substrate of this disclosure), which serves as a semiconductor substrate. The predetermined process can be, for example, a process performed in a vacuum chamber (sputtering, dry etching, etc.), or any other process. EFEM 1 transfers the wafer W between the SMIF cassette 100 (the cassette of this disclosure) placed on the cassette opening / closing device 4 and the processing device 6 using a transfer mechanism 3 located in the substrate transfer chamber 2.

[0077] like Figure 2As shown, the SMIF cassette 100 includes a base plate 101 and a cover 102. A cassette C, which holds a plurality of wafers W, is placed on the base plate 101, and the cover 102 covers the cassette C placed on the base plate 101. The cassette C is configured to hold a plurality of wafers W arranged in a substantially horizontal position in the vertical direction. The cassette C opens at its rear side and is configured to allow the wafers W to be removed from its rear side. The cover 102 is configured to cover the cassette C and the base plate 101 from above. The cover 102 opens at its lower side. The lower end of the cover 102 is positioned horizontally outside the base plate 101. The cover 102 includes a locking mechanism (not shown). The locking mechanism allows the cover 102 to be secured to the base plate 101 and released from the base plate 101.

[0078] The substrate transfer chamber 2 is used to connect multiple box opening / closing devices 4 and processing equipment 6. The substrate transfer chamber 2 has an overall rectangular parallelepiped shape. For example... Figure 1 and Figure 2 As shown, the substrate transfer chamber 2 includes support columns 37a to 37d extending in the vertical direction and multiple partition walls (bottom plate 31, top plate 32, front wall 33, rear wall 34, left side wall 35, and right side wall 36). The partition walls are attached to the support columns 37a to 37d. Support column 37a is located at the right end of the front portion of the substrate transfer chamber 2. Support column 37b is located at the left end of the front portion of the substrate transfer chamber 2. Support column 37c is located at the left end of the rear portion of the substrate transfer chamber 2. Support column 37d is located at the right end of the rear portion of the substrate transfer chamber 2. Additionally, a bottom plate 31 is located at the bottom of the substrate transfer chamber 2 (see [reference]). Figure 2 The top plate 32 is disposed on top of the substrate transfer chamber 2 (see...). Figure 2 The front wall 33 is located at the front end of the substrate transfer chamber 2 (see reference). Figure 2 The rear wall 34 is located at the rear end of the substrate transfer chamber 2 (see [reference]). Figure 2 The left side wall 35 is located at the left end of the substrate transfer chamber 2 (see reference). Figure 1 The right side wall 36 is located at the right end of the substrate transfer chamber 2 (see reference). Figure 1 In the first embodiment, the front wall 33 is composed of a partition wall disposed at the front end of the substrate transfer chamber 2 and the base 41 of the box opening / closing device 4 (described later). In other words, the base 41 of the box opening / closing device 4 forms part of the front wall 33. The space surrounded by the plurality of partition walls is substantially sealed and isolated from the external space of the substrate transfer chamber 2 (hereinafter referred to as the external space 9). The components of each partition wall are formed, for example, typical metal plates (rolled metal plates with a thickness of 6 mm or less).

[0079] Inside the substrate transfer chamber 2, a fan filter unit 13 (FFU 13) including a fan 13a and a filter 13b is arranged. The FFU 13 is supported by a support member 18 extending in the horizontal direction (see...). Figure 2Supported from below. Support member 18 connects to the rear side of the front wall 33, the front side of the rear wall 34, the right side of the left side wall 35, and the left side of the right side wall 36 in a vertical direction closer to the top plate 32 than the bottom plate 31. (Example) Figure 2 As shown, the space below the support member 18 in the interior space of the substrate transfer chamber 2 serves as a transfer space 30 for transferring the wafer W. The support member 18 has an opening 18a extending in the vertical direction. The fan 13a is configured to blow clean air (such as nitrogen or dry air) downwards. The clean air blown downwards from the fan 13a passes through a filter 13b and flows into the transfer space 30 through the opening 18a. Therefore, the transfer space 30 is filled with clean air, and the cleanliness of the transfer space 30 is maintained.

[0080] The box opening / closing device 4 is attached to the front end of the substrate transfer chamber 2. The loading locking chamber 7 of the processing device 6 (see...) Figure 1 The wafer W is connected to an opening 34a located in the rear wall 34 of the substrate transfer chamber 2. The opening 34a can be opened and closed by a door 1a, which is commonly referred to as a gate valve. The wafer W is transferred between the transfer space 30 and the loading locking chamber 7 via the door 1a.

[0081] The transport mechanism 3 is configured to transport the wafer W within the transport space 30. For example... Figure 2 As shown, the transfer mechanism 3 includes, for example, an arm 3a having a picker for placing and transferring wafers W and a base 3b supporting the arm 3a from below. The base 3b is supported by the front wall 33 of the substrate transfer chamber 2 via a support member 21 and a guide rail 22. The transfer mechanism 3 is configured to move within the substrate transfer chamber 2 along the guide rail 22 extending in the left-right direction. The control device 5 controls the operation of the transfer mechanism 3 such that wafers W housed in SMIF cassettes 100 placed on various cassette opening / closing devices 4 arranged in the left-right direction can be transferred to the loading locking chamber 7, and wafers W processed in the processing chamber 8 (described later) can be transferred back to the SMIF cassette 100.

[0082] Each of the plurality of box opening / closing devices 4 is configured to hold an SMIF box 100. The plurality of box opening / closing devices 4 are arranged side by side in the left-right direction. The rear end of each box opening / closing device 4 is disposed along the front wall 33 of the substrate transfer chamber 2. Details of the box opening / closing devices 4 will be described later.

[0083] like Figure 1As shown, the processing apparatus 6 includes, for example, a loading and locking chamber 7 and a processing chamber 8. The loading and locking chamber 7 is a chamber for temporarily placing the wafer W. The pressure inside the loading and locking chamber 7 is maintained, for example, near-vacuum pressure (a pressure much lower than the pressure in the substrate transfer chamber 2). The loading and locking chamber 7 is connected to the substrate transfer chamber 2 via the aforementioned door 1a and to the processing chamber 8 via door 6a. Like door 1a, door 6a is, for example, a gate valve. In the processing chamber 8, a predetermined process is performed on the wafer by a processing mechanism (not shown).

[0084] like Figure 3 As shown, the control device 5 is electrically connected to the hood moving mechanism 81, the baffle opening / closing mechanism 82, the gas replacement mechanism 83, the conveying mechanism 3, the FFU 13, and the processing chamber controller 85. The control device 5 controls the operation of the hood moving mechanism 81, the baffle opening / closing mechanism 82, the gas replacement mechanism 83, the conveying mechanism 3, and the FFU 13. Additionally, the control device 5 controls the processing chamber controller 85 to control the opening and closing of doors 1a and 6a, as well as the operation of the processing mechanisms (not shown) in the processing chamber 8.

[0085] (Box opening / closing device 4)

[0086] Next, the following will refer to Figures 4 to 9 The box opening / closing device 4 according to the first embodiment is described. Figure 4 This is a perspective view of the box opening / closing device 4. Figure 5 This is a front view of the box opening / closing device 4. Figure 6 This is a rear view of the box opening / closing device 4. Figure 7 It is along Figure 5 The side cross-sectional view of the box opening / closing device 4, taken from lines VI to VII. Figures 4 to 6 This shows the box opening / closing device 4 in the state where the SMIF box 100 is not placed on it. Conversely, Figure 7 The diagram shows the box opening / closing device 4 in the state where the SMIF box 100 is placed on it. Figure 5 The baffle opening / closing mechanism 82, which is located on the rear side of the cover moving mechanism 81, is not shown. Furthermore, in... Figure 6 The cover moving mechanism 81, which is located on the front side of the baffle opening / closing mechanism 82, is not shown. Figure 4 As shown, the box opening / closing device 4 includes a base 41, a horizontal base 43, a housing 46, a support leg 45, a baffle 42, and a cover moving mechanism 81 (see...). Figure 7 ), baffle opening / closing mechanism 82 (see Figure 7 ) and gas replacement mechanism 83 (see Figure 7 ).

[0087] The base 41 is a plate-like member extending in both the vertical and horizontal directions. The base 41 forms part of the front wall 33 that isolates the transfer space 30 from the external space 9. In other words, the base 41 forms part of the front wall that isolates the substrate transfer chamber 2 from the external space 9 at the location between the substrate transfer chamber 2 and the stage 44. Figure 4 As shown, a window frame 91 is formed in the base 41. The window frame 91 has a frame shape with a generally rectangular opening 92 formed on its inner side. In other words, the base 41 has an opening 92 formed therein.

[0088] The horizontal base 43 extends forward from the base 41. For example, the horizontal base 43 extends forward from a height position approximately at the center in the vertical direction slightly above the base 41 (see [link]). Figure 4 A stage 44 is formed in the upper surface of the horizontal base 43, on which the SMIF box 100 can be placed. The stage 44 is, for example, a generally flat plate-like member. The stage 44 can pass through a through hole 56 formed in the upper surface portion 51d of the box cover 51, which will be described later. The stage 44 is supported by, for example, a generally columnar support (not shown). The support is fixed to, for example, the housing 46. Figure 4 As shown, in the first embodiment, the height of the stage 44 is located slightly below the height of the lowest part of the opening 92. Figure 4 As shown, the stage 44 is provided with three positioning pins 44a for positioning the SMIF box 100.

[0089] The housing 46 extends downward from directly below the horizontal base 43 on the front side of the base 41. Inside the housing 46, there is a cover moving mechanism 81 (described later), a part of a baffle opening / closing mechanism 82 (described later), a part of a gas replacement mechanism 83 (described later), etc.

[0090] The outrigger 45 supports the housing 46 from below. The outrigger 45 is located on the front side of the lower part of the base 41 and below the housing 46. For example, casters are attached to the outrigger 45.

[0091] The baffle 42 is a plate-shaped member that can close and open / close the opening 92 by moving in the vertical direction. For example... Figure 7 As shown, the baffle 42 is disposed on the rear side of the base 41. In other words, the baffle 42 is disposed on the opposite side of the stage 44, and the base 41 is located between the baffle 42 and the stage 44.

[0092] (Cover-up movement mechanism)

[0093] The cover moving mechanism 81 is configured to move the cover 102 of the SMIF box 100 between a lower position and an upper position. The lower position is the position of the cover 102 when it covers the box C placed on the base plate 101 of the SMIF box 100. Figure 7 The position of the cover 102. When the cover 102 is in the lower position, the lower end of the cover 102 is in contact with the base plate 101. The upper position is the position above the lower position, and is the position of the cover 102 when the box C placed on the base plate 101 protrudes from the cover 102. The upper position is Figure 9 The position of cover 102 in the middle.

[0094] like Figure 5 and Figure 7 As shown, the cover moving mechanism 81 includes a case cover 51 (the lifting device in this disclosure), a case cover support 52, a ball screw 53, bearings 54a and 54b, and a bearing support 55. The case cover 51 is a component that can contact the lower end of the cover 102 of the SMIF case 100 placed on the stage 44, and is a component for pushing the cover 102, which is located in the lower position, upward to the upper position. A detailed description will be given below.

[0095] The case cover 51 is housed within the housing 46 (see Figure 7 The case cover 51 is a box-shaped component having a generally rectangular parallelepiped shape. The case cover 51 includes a front surface portion 51a extending in the left-right and up-down directions (see...). Figure 5 and Figures 7 to 9 ), left surface portion 51b extending rearward from the left end of front surface portion 51a (see Figures 7 to 9 ), and the right surface portion 51c extending rearward from the right end of the front surface portion 51a (see Figure 5 ), and an upper surface portion 51d that connects to the upper ends of the front surface portion 51a, the left surface portion 51b, and the right surface portion 51c and extends in a generally horizontal direction (see Figure 4 and Figure 7 The left surface portion 51b and the right surface portion 51c are configured to face each other in the left-right direction.

[0096] The upper surface portion 51d is configured to contact the lower surface of the cover 102 of the SMIF box 100. Due to this configuration, when the box cover 51 housed within the housing 46 moves upward, the upper surface portion 51d pushes the box cover 51 upward. Furthermore, as... Figure 4 As shown, a through hole 56 extending in the vertical direction is formed in the upper surface portion 51d. For example, the through hole 56 is approximately rectangular when viewed from the vertical direction. The through hole 56 is large enough to allow the stage 44 to pass through. Due to this configuration, when the case cover 51 moves in the vertical direction, the stage 44 passes through the through hole 56 formed in the upper surface portion 51d. Therefore, the case cover 51 can be moved in the vertical direction without interference between the case cover 51 and the stage 44. The case cover 51 is configured to be able to move upward until the cover 102 is in the upper position (see...). Figure 9 ).

[0097] Furthermore, the case cover 51 raises and lowers the cover 102 relative to the base plate 101, thereby forming a receiving space for the case C together with the cover 102 when the cover 102 is separated from the base plate 101. In other words, when the cover 102 is moved to a height corresponding to the upper position, the case cover 51 functions to cover the front, left, and right sides of the case C. Specifically, the front surface portion 51a of the case cover 51 covers the front side of the case C, the left surface portion 51b covers the left side of the case C, and the right surface portion 51c covers the right side of the case C. As a result, even when the cover 102 is moved to the upper position and the case C is exposed from the cover 102, the exposure of the case C to the external space 9 can be suppressed, and the decrease in cleanliness around the case C can be suppressed. When the cover 102 is in the upper position, the case cover 51 does not cover the rear side of the case C.

[0098] The case cover support 52 is a component that supports the case cover 51 from below. For example... Figure 5 and Figure 7 As shown, the case cover support 52 is connected to the upper end of the ball screw 53 via a bearing 54a. The lower end of the ball screw 53 is connected to a bearing 54b. The bearing 54b is supported by a bearing support 55. The bearing support 55 is attached, for example, to the lower surface of the housing 46. The ball screw 53 is driven to rotate by a motor (not shown). The case cover moving mechanism 81 moves the case cover support 52 and the case cover 51 in the vertical direction by rotating the ball screw 53. As a result, the case cover moving mechanism 81 moves the case cover 102, which is in contact with the case cover 51, between a lower position and an upper position. In the first embodiment, the case cover support 52 is, for example, a generally rectangular plate-shaped member with a notch provided near the center in the left-right direction at its rear. By providing a notch in the case cover support 52, interference between the case cover support 52 and the movable block 63 (described later) can be avoided when the case cover support 52 is moved in the vertical direction.

[0099] (Baffle opening / closing mechanism)

[0100] The baffle opening / closing mechanism 82 is configured to move the baffle 42 between a closed position and an open position. The closed position is the position of the baffle 42 when its opening 92 is closed. Figure 7 The position of the baffle 42 shown. The open position is the position below the closed position. The open position is the position inside the substrate transfer chamber 2 connected to the box opening / closing device 4. Additionally, the open position is the position of the baffle 42 when its open opening 92 is open. Figure 9 The position of the baffle 42 shown.

[0101] like Figure 6 and Figure 7As shown, the baffle opening / closing mechanism 82 includes a baffle retainer 61, a support frame 62, a movable block 63, and a slide rail 64. Figure 7 As shown, the baffle retainer 61 is a component that holds the baffle 42 from the rear. The support frame 62 is a component that supports the baffle retainer 61 from below. Figure 7 As shown, the support frame 62 is typically crank-shaped. More specifically, the upper part of the support frame 62 extends in the vertical direction (for ease of explanation, the upper part is referred to as the extension). The lower part of the support frame 62 protrudes forward from the lower end of the extension. The lower part passes through a slit-shaped insertion hole 93 provided in the base 41 (see...). Figure 6 In other words, the upper portion of the support frame 62 is disposed on the rear side of the base 41, and the remaining portion of the support frame 62, including the lower end, is disposed on the front side of the base 41.

[0102] like Figure 7 As shown, the movable block 63 is a component that supports the lower end of the support frame 62. The movable block 63 is disposed on the front side of the base 41. The slide rail 64 consists of two track components located on the front side of the base 41 and extending in the vertical direction (see...). Figure 6 Two slide rails 64 are arranged parallel to each other. A movable block 63 is configured to move vertically along the slide rails 64. The vertical movement of the movable block 63 is driven by a motor (not shown). A baffle opening / closing mechanism 82 moves the baffle 42 to the closed position by moving the movable block 63 along the slide rails 64 (see [link]). Figure 7 ) and opening location (see Figure 9 Move between ).

[0103] (Gas replacement mechanism)

[0104] The gas replacement mechanism 83 is used to replace the interior of the cartridge C with clean gas. For example... Figure 7 As shown, the gas replacement mechanism 83 includes a first supply nozzle 71 and a second supply nozzle 72.

[0105] The first supply nozzle 71 is a nozzle used to supply clean gas into the housing C. A first supply port 71a is formed at one end of the first supply nozzle 71, and a first supply valve 71b is provided at the other end. Figure 7 As shown, a portion of the first supply nozzle 71 having a first supply port 71a is attached to the baffle 42. The first supply port 71a is configured to open toward the stage 44. Specifically, when the baffle 42 is in the closed position, the first supply port 71a is open toward the stage 44 (see [reference]). Figure 7The first supply valve 71b is located on the front side of the base 41 and inside the housing 46. In summary, the first supply nozzle 71 is configured as follows: The first supply nozzle 71 extends rearward from the end where the first supply port 71a is formed to pass through the baffle 42 and the baffle holder 61. Then, the first supply nozzle 71 extending rearward from that end bends and extends downward on the rear side of the base 41. Additionally, the downwardly extending first supply nozzle 71 bends and extends forward to penetrate the base 41.

[0106] When the first supply valve 71b is open, cleaning gas flows through the first supply nozzle 71. The cleaning gas flowing through the first supply nozzle 71 is then injected from the first supply port 71a toward the stage 44. When the first supply valve 71b is closed, cleaning gas does not flow through the first supply nozzle 71. Therefore, when the first supply valve 71b is closed, cleaning gas is not injected from the first supply port 71a toward the stage 44.

[0107] The second supply nozzle 72 is a nozzle for supplying cleaning gas to the cartridge C. More specifically, the second supply nozzle 72 is configured to supply cleaning gas to the cartridge C even when the baffle 42 is in the open position (i.e., when cleaning gas cannot be supplied to the cartridge C via the first supply nozzle 71). Specifically, a second supply port 72a is formed at one end of the second supply nozzle 72, and a second supply valve 72b is provided at the other end. In the first embodiment, the second supply nozzle 72 is attached to the upper part of the base 41 via a nozzle support 73. The second supply port 72a is configured to open toward the stage 44 when the baffle 42 is in the open position. Specifically, in the first embodiment, the second supply port 72a opens toward the opening 92 on the rear side of the baffle 42. When the baffle 42 is in the open position (see...), Figure 9 The second supply port 72a, configured as described above, opens toward the stage 44.

[0108] When the second supply valve 72b is open, cleaning gas flows through the second supply nozzle 72. The cleaning gas flowing through the second supply nozzle 72 is then injected from the second supply port 72a toward the stage 44. When the second supply valve 72b is closed, cleaning gas does not flow through the second supply nozzle 72. Therefore, when the second supply valve 72b is closed, cleaning gas is not injected from the second supply port 72a toward the stage 44.

[0109] (Operating procedure for the box opening / closing device)

[0110] Next, the following will refer to Figures 7 to 9 The procedure for moving the cover 102 of the SMIF box 100 to the upper position and the baffle 42 to the open position using the box opening / closing device 4 of the first embodiment is described. In the initial state, each valve is closed and the baffle 42 is in the closed position.

[0111] First, such as Figure 7 As shown, the SMIF box 100 is placed on the stage 44. At this time, the cover 102 is in the lower position. Next, the control device 5 controls the drive of the cover moving mechanism 81 to move the cover 102 from the lower position to the upper position (see...). Figure 8 As a result, the case C is exposed from the cover 102, and the front, left, and right sides of the case C are covered by the case cover 51. At this time, the upper side of the case C is covered by the upper surface portion 51d of the case cover 51 and the cover 102 (see reference). Figure 8 ).

[0112] Subsequently, the control device 5 controls the actuation of the gas replacement mechanism 83 to open the first supply valve 71b. Clean gas is then injected from the first supply port 71a attached to the baffle 42 in the closed position toward the stage 44. Thus, clean gas is supplied to the cassette C mounted on the stage 44. A small gap exists between the cassette cover 51 and the base 41. Therefore, the gas inside the cassette C is discharged into the external space 9 through this gap. As described above, the interior of the cassette C is replaced with clean gas.

[0113] At a predetermined time for gas replacement within cartridge C, control device 5 controls the actuation of gas replacement mechanism 83 to close the first supply valve 71b. The predetermined time is, for example, a pre-set time. Then, control device 5 controls the actuation of baffle opening / closing mechanism 82 to move baffle 42 from the closed position to the open position (see...). Figure 9 As a result, opening 92 opens, allowing the transfer mechanism 3 to remove the wafer W from inside the box C and load the wafer W into the transfer space 30.

[0114] In the first embodiment, immediately after the baffle 42 begins to move from the closed position to the open position, the control device 5 controls the actuation of the gas replacement mechanism 83 to open the second supply valve 72b. Therefore, cleaning gas is injected from the second supply port 72a toward the stage 44. Thus, a high concentration of cleaning gas around the wafer W contained in the cassette C can be maintained, and a decrease in the cleanliness around the wafer W can be suppressed. For example, the injection of cleaning gas from the second supply port 72a can continue throughout the entire time the wafer W is removed by the transfer mechanism 3 and transferred to the processing equipment 6.

[0115] (Effect)

[0116] As described above, the cassette opening / closing device 4 of the first embodiment is connected to the substrate transfer chamber 2 for transferring the wafer W to the processing apparatus 6. The cassette opening / closing device 4 includes: a stage 44 on which the SMIF cassette 100 having a base plate 101 and a cover 102 can be placed; a base 41 configured to form part of a front wall 33 for isolating the substrate transfer chamber 2 from the external space 9 between the substrate transfer chamber 2 and the stage 44; an opening 92 formed in the base 41; a baffle 42 disposed on the opposite side of the stage 44, with the base 41 between the stage 44 and the baffle 42, and the baffle being capable of closing and opening the opening 92; a cover moving mechanism 81; and a baffle opening / closing mechanism 82. The cover moving mechanism 81 is capable of moving the cover 102 between a lower position and an upper position above the lower position. In the lower position, the cover 102 covers the box C placed on the base plate 101, and in the upper position, the cover 102 exposes the box C. The baffle opening / closing mechanism 82 can move the baffle 42 between a closed position and an open position. The closed position is where the baffle 42 closes the opening 92, and the open position is located below the closed position and inside the substrate transfer chamber 2 connected to the box opening / closing device 4. In the open position, the baffle 42 opens the opening 92.

[0117] According to the first embodiment, when the wafer W is transferred to the processing device 6, the cover 102 can be moved upward to expose the cassette C, and the baffle 42 can be moved downward to open the opening 92. Therefore, even when the constituent components of the substrate transfer chamber 2 are disposed in the space above the opening 92 (hereinafter referred to as the upper space), these components and the baffle 42 will not interfere with each other. The upper space referred to herein is... Figure 2 The space directly above the opening 92. In the first embodiment, the front end of the support member 18 constituting the substrate transfer chamber 2 is disposed in the upper space. With the above configuration, since the upper space does not become a dead space, the height dimension of the substrate transfer chamber 2 above the opening 92 can be reduced. In addition, the inventors have noted that in related technologies, a space (hereinafter referred to as the lower space) exists below the opening 92 inside the substrate transfer chamber 2 where a baffle 42 can be provided and interference between the device for transferring the wafer W and the baffle 42 can be avoided. The lower space referred to herein is Figure 2 The space directly below the opening 92. In other words, the lower space is the space on the front side of the base 3b of the conveying mechanism 3 and above the support 21 (see...). Figure 2 Therefore, even when the baffle 42 moves to the open position below the closed position, interference between the baffle 42 and other components can be avoided, and an increase in the height of the substrate transfer chamber 2 below the opening 92 can also be avoided. As described above, the box opening / closing device 4 of the first embodiment can reduce the height of the substrate transfer chamber 2 to which the box opening / closing device 4 is connected.

[0118] Furthermore, the cassette opening / closing device 4 of the first embodiment includes a gas replacement mechanism 83 for replacing the interior of the cassette C with a cleaning gas. The gas replacement mechanism 83 has a first supply port 71a for supplying cleaning gas into the cassette C. The first supply port 71a is formed in a baffle 42 and is configured to open toward the stage 44. Using this configuration, the interior of the cassette C can be replaced with cleaning gas through the following procedure: the cover 102 is moved to the upper position to expose the cassette C, and the baffle 42 is held in the closed position. In this state, cleaning gas is supplied to the cassette C from the first supply port 71a formed in the baffle 42. Therefore, the interior of the cassette C can be replaced with cleaning gas, and oxygen, moisture, etc., surrounding the wafer W contained in the cassette C can be removed. Therefore, oxidation of the wafer W and adhesion of moisture to the wafer W can be suppressed. The cleaning gas is, for example, nitrogen or dry air.

[0119] Furthermore, the cassette opening / closing device 4 of the first embodiment includes a second supply port 72a for supplying cleaning gas to the cassette C. The second supply port 72a is configured to open toward the stage 44 when the baffle 42 is in the open position. With this configuration, cleaning gas can be supplied to the cassette C from the second supply port 72a when the cover 102 moves to the upper position to expose the cassette C and the baffle 42 moves to the open position to open the opening 92. Therefore, when the wafer W is removed from the SMIF cassette 100 and transferred to the substrate transfer chamber 2, cleaning gas can be continuously supplied around the wafer W. Consequently, the concentration of cleaning gas around the wafer W increases, and therefore the concentration of oxygen, moisture, etc., around the wafer W decreases. As a result, oxidation of the wafer W and the adhesion of moisture to the wafer W can be suppressed.

[0120] (Variation example)

[0121] The following describes variations of the above embodiments. Components having the same configuration as those in the above embodiments are indicated by the same reference numerals, and their descriptions will be omitted as appropriate.

[0122] (First variation)

[0123] In the above embodiment, a through-hole 56 is formed in the upper surface portion 51d of the case cover 51, and the through-hole 56 is configured to allow the stage 44 to pass through it. However, the stage 44 and the case cover 51 are not limited to these configurations. For example, the case cover 151 according to the first variation does not have an upper surface portion. That is, the case cover 151 is a cover with a generally U-shaped form when viewed from above (see above). Figure 11The front surface portion 151a, left surface portion 151b, and right surface portion 151c of the case cover 151 have the same configuration as the front surface portion 51a, left surface portion 51b, and right surface portion 51c of the embodiment described above. Therefore, their description will be omitted.

[0124] Furthermore, a through hole 144a is formed in the stage 144 according to the first modified example (see Figure 10 The front surface portion 151a, left surface portion 151b, and right surface portion 151c of the case cover 151 can pass through the through hole 144a. Additionally, in the first modified example, a through hole 201a is formed in the base plate 201 of the SMIF case 200 (see...). Figure 10 and Figure 11 The front surface portion 151a, left surface portion 151b, and right surface portion 151c of the case cover 151 can pass through the through hole 201a. Specifically, the stage 144 has a through hole 144a, which has a generally U-shaped shape when viewed from above. Furthermore, as... Figure 11 As shown, the base plate 201 has a through hole 201a, which has a generally U-shaped shape when viewed from above. Through holes 144a and 201a have approximately the same size and shape. In other words, a through hole 144a, having approximately the same size and shape as through hole 201a, exists. Figure 11 Directly below the through hole 201a. Furthermore, in the first modified example, the cover 202 is placed on the base plate 201. The lower end of the cover 202, placed on the base plate 201, is configured to cover at least a portion of the through hole 201a from above.

[0125] Due to the above configuration, when the case cover 151 housed within the housing 46 moves upward, the upper end of the case cover 151 (i.e., the upper ends of the front surface portion 151a, the left surface portion 151b, and the right surface portion 151c) passes through the through holes 144a and 201a and contacts the lower end of the cover 202. In this state, by further moving the case cover 151 upward, the cover 202, which is in contact with the upper end of the case cover 151, is pushed upward.

[0126] (Second variation)

[0127] In the above embodiment, the gas replacement mechanism 83 includes a first supply nozzle 71 and a second supply nozzle 72. In this regard, the gas replacement mechanism 183 may also include a discharge nozzle 74 for discharging gas from inside the casing C. Figure 12 As shown, a discharge port 74a is formed at one end of the discharge nozzle 74, and a discharge valve 74b is provided at the other end. Figure 12As shown, the portion of the discharge nozzle 74 including the discharge port 74a is attached to the baffle 42. The discharge port 74a is configured to open toward the stage 44. Specifically, when the baffle 42 is in the closed position, the discharge port 74a opens toward the stage 44 (see [reference]). Figure 12 In the second variation, the discharge port 74a is located above the first supply port 71a. The discharge valve 74b is located on the front side of the base 41 and inside the housing 46. In summary, the discharge nozzle 74 is configured as follows. In other words, the discharge nozzle 74 extends rearward from the end where the discharge port 74a is formed to pass through the baffle 42 and the baffle retainer 61. The discharge nozzle 74 extending rearward from this end bends and extends downward on the rear side of the base 41. In addition, the downwardly extending discharge nozzle 74 bends and extends forward to pass through the base 41.

[0128] When the discharge valve 74b is open, the gas in the space in front of the baffle 42 is discharged from the discharge port 74a to the discharge nozzle 74. When the discharge valve 74b is closed, the gas in the space in front of the baffle 42 is not discharged from the discharge port 74a to the discharge nozzle 74.

[0129] By providing the exhaust nozzle 74, it is easier to exhaust the gas inside the cartridge C, and the interior of the cartridge C can be effectively replaced with clean gas.

[0130] (Other variations)

[0131] In the above embodiment, the gas replacement mechanism 83 includes a first supply nozzle 71 and a second supply nozzle 72. However, the gas replacement mechanism 83 may be configured to exclude the second supply nozzle 72. Alternatively, the gas replacement mechanism 83 may be configured to exclude the first supply nozzle 71.

[0132] In the above embodiment, a first supply nozzle 71 is provided. However, two or more first supply nozzles 71 may be provided. For example, in the provision of a second variant discharge nozzle 74 (see...) Figure 12 At the location of the first supply nozzle 71, a first supply nozzle 71 can be provided instead of the exhaust nozzle 74. This configuration can improve the efficiency of supplying clean air.

[0133] The box opening / closing device 4 according to the above embodiment includes a gas replacement mechanism 83. However, the box opening / closing device 4 of this disclosure may also be configured not to include the gas replacement mechanism 83.

[0134] In the above embodiment, the first supply port 71a can be covered with a cap. In this case, for example, when the first supply valve 71b is opened, the cap of the first supply port 71a is opened. Similarly, the second supply port 72a can also be covered with a cap. Similarly, the discharge port 74a of the second variation can also be covered with a cap.

[0135] In the above embodiment, the second supply nozzle 72 is attached to the upper part of the base 41 via the nozzle support 73. However, the second supply nozzle 72 is not limited to this configuration. For example, the second supply nozzle 72 may be attached to the right or left part of the base 41 via the nozzle support 73.

[0136] Furthermore, the second supply nozzle 72 can be configured to extend and retract along its extension direction. In this case, when the second supply nozzle 72 extends, the second supply port 72a formed at one end of the second supply nozzle 72 opens toward the stage 44. In this configuration, the control device 5 controls the drive of the gas replacement mechanism 83, for example, to retract the second supply nozzle 72 when the baffle 42 is in the closed position and to extend the second supply nozzle 72 when the baffle 42 is in the open position.

[0137] In the above embodiment, the cover moving mechanism 81 is configured to include a ball screw 53, bearings 54a and 54b, and a bearing support 55. However, the cover moving mechanism 81 is not limited to this configuration. The cover moving mechanism 81 only needs to be able to move the cover 102 up and down, and can be a linear actuator of the pneumatic, hydraulic, or magnetic type.

[0138] The box opening / closing device 4 according to the above embodiment includes a box cover 51, which covers the front, left, and right sides of the box C when the cover 102 is in the upper position. However, the box opening / closing device 4 need not include a box cover 51. In this case, the cover 102 is pushed upward from the lower position to the upper position by a component different from the box cover 51. The component different from the box cover 51 mentioned here is a component that does not have the function of covering the front, left, and right sides of the box C when the cover 102 is in the upper position.

[0139] In the above embodiments, the location of the control device 5 is not particularly limited. For example, the control device 5 can be built into the box opening / closing device 4, built into the substrate transfer chamber 2, or an external PC. Alternatively, the control device 5 can be located in each of the box opening / closing device 4, the substrate transfer chamber 2, and the processing device 6.

[0140] In the above embodiment, the first supply port 71a and the front surface of the baffle 42 are located at the same position in the front-rear direction. However, the first supply port 71a may be located on the front side of the front surface of the baffle 42. Similarly, according to the second variation, the discharge port 74a may be located on the front side of the front surface of the baffle 42.

[0141] In the above embodiment, the box placed on the stage 44 is an SMIF box 100. However, the box placed on the stage 44 is not limited to an SMIF box, but can be any configuration with a cover that can move in the vertical direction to cover and expose the box C.

[0142] In the box opening / closing device 4 according to the above embodiment, the baffle 42 may include a communication device that connects the substrate transfer chamber 2 to the receiving space (see the receiving space 571 according to the third embodiment described in detail later). Additionally, a shield may be provided, configured to open and close the communication device by being driven to move by a drive source different from the cover moving mechanism 81. For details of the communication device and the shield, refer to the third embodiment described later and... Figures 28 to 31 Through hole 547a and shielding plate 570.

[0143] <Second Implementation Method>

[0144] Another embodiment of this disclosure (the second embodiment) will now be described. For ease of explanation, Figure 13 The directions shown are defined as front-back and left-right directions. More specifically, the orientation of the substrate conveying device 301 (described later) and the processing device 306 (described later) is defined as the front-back direction. In the front-back direction, the substrate conveying device 301 side is defined as the front side. In the front-back direction, the processing device 306 side is defined as the rear side. The direction in which the plurality of box opening / closing devices 304 are arranged and perpendicular to the front-back direction is defined as the left-right direction. The direction perpendicular to both the front-back and left-right directions is defined as the up-down direction. The up-down direction is the direction parallel to the vertical direction of gravity.

[0145] (Overview of the box opening / closing mechanism and its surrounding configuration)

[0146] Reference Figure 13 Describes the outline configuration of the box opening / closing device 304 and its surroundings according to the second embodiment. Figure 13 This is a schematic diagram of a substrate transfer device 301 equipped with multiple box opening / closing devices 304 and its surroundings. The substrate transfer device 301 is a means for transferring wafers W2 (substrates) between boxes 400 (containers) placed on the respective box opening / closing devices 304 and processing equipment 306. The substrate transfer device 301 can be, for example, a so-called device front-end module (EFEM). The wafer W2 is a known semiconductor substrate. For example, semiconductor circuits (not shown) are formed on the wafer W2. The wafer W2, for example, has a generally disk-shaped shape.

[0147] like Figure 13As shown, the substrate conveying device 301 includes a housing 302, a conveying robot 303, multiple box opening / closing devices 304, and a control device 305. The processing equipment 306 is located at the rear of the substrate conveying device 301.

[0148] A substrate transfer device 301 is installed, for example, at a predetermined location within a semiconductor factory. The substrate transfer device 301 uses a transfer robot 303 located inside a housing 302 to transfer wafers W2 between a cassette C2 placed on a cassette opening / closing device 304 and a processing device 306. The cassette 400 is, for example, a known SMIF cassette. The cassette C2 is housed within the internal space of the cassette 400. Multiple wafers W2 are housed in the cassette C2. The cassette 400 is transferred, for example, via a cassette transfer device (not shown). The cassette 400 is exchanged between the cassette transfer device and the cassette opening / closing device 304.

[0149] Housing 302 is a box-shaped component having a substrate transfer chamber 309 into which wafers W2 are transferred. The substrate transfer chamber 309 is separated from the external space (external space 310) of housing 302. A plurality of box opening / closing devices 304 are connected to the front end of housing 302. A loading locking chamber 307 of processing equipment 306 is connected to the rear end of housing 302. A transfer robot 303 transfers wafers W2 between the box C2 and the loading locking chamber 307.

[0150] Multiple box opening / closing devices 304 are arranged side-by-side, for example, in a left-right direction. The multiple box opening / closing devices 304 are attached to the front end of the housing 302. Each box opening / closing device 304 is configured to hold a box 400. The configuration of the box opening / closing devices 304 will be described later.

[0151] Control device 305 is electrically connected to controller 303a of conveyor robot 303, controller 327 (described later) of box opening / closing device 304, and controller (not shown) of processing device 306 (see See Figure 14 The control unit 305 is configured to communicate with these controllers. The control unit 305 can also be electrically connected to a higher-level host computer (not shown).

[0152] Processing apparatus 306 is an apparatus for performing predetermined processes on wafer W2, such as sputtering or dry etching. Processing apparatus 306 includes, for example, a loading lock chamber 307 for temporarily suspending wafer W2 and a processing chamber 308 for performing predetermined processes on wafer W2.

[0153] (The box opening / closing device and its surroundings)

[0154] Reference Figures 14 to 18 (b) Describe the box opening / closing device 304 and its surrounding configuration. Figure 14 This is a block diagram showing the electrical structure of the substrate transfer device 301. Figure 15It is along Figure 13 The cross-sectional view taken from line III-III in the diagram. Figure 16 It is along Figure 13 The cross-sectional view taken from line IV-IV in the diagram. Figure 17 This is a perspective view of the box opening / closing device 304 and its surroundings. Figure 18 (a) and Figure 18 (b) is a schematic front view showing the base 321 (described later) and the baffle 325. First, the overall configuration of the housing 302 and the box 400 will be described.

[0155] The housing 302 forms the substrate transfer chamber 309. The housing 302 has, for example, a generally rectangular parallelepiped shape. Figure 15 and Figure 16 As shown, the housing 302 has, for example, a front surface wall 302F, an upper surface wall 302U, and a lower surface wall 302D. The front surface wall 302F is located at the front end of the housing 302. The front surface wall 302F extends in both the vertical and horizontal directions. An opening 302Fa is formed in the middle portion of the front surface wall 302F in the vertical direction, the size of which allows the wafer W2 to pass through in the front-back direction. The upper surface wall 302U is located, for example, at approximately the same position as the upper end of the front surface wall 302F in the vertical direction. The lower surface wall 302D is located, for example, at approximately the same position as the lower end of the front surface wall 302F in the vertical direction. The pressure inside the substrate transfer chamber 309 may be slightly higher than, for example, the pressure inside the external space 310 (i.e., the substrate transfer chamber 309 is under positive pressure relative to the external space 310).

[0156] Box 400 is configured to accommodate, for example, a cassette C2 that accommodates multiple wafers W2. Figure 15 and Figure 16 As shown, the cassette 400 includes a base plate 401 and a cover 402. The base plate 401 is a flat plate member on which the cassette C2 is placed. The cassette C2 is configured to accommodate a plurality of wafers W2 arranged in a substantially horizontal position in the vertical direction. The cover 402 is configured to cover the cassette C2 and the base plate 401 from above. The cover 402 has an opening on its lower side. The lower end of the cover 402 is positioned horizontally outside the base plate 401. The cover 402 includes a locking mechanism (not shown). The locking mechanism allows the cover 402 to be secured to the base plate 401 and released from the base plate 401.

[0157] The box opening / closing device 304 is configured to detachably attach the box cover 402 to the base plate 401. The box opening / closing device 304 is also configured to open and close the opening 302Fa. Figures 14 to 17 As shown, the box opening / closing device includes a base 321, a box body 322, a lifting box 323, a platform 324, a baffle 325, and a lifting mechanism 326 (see [reference]). Figure 14 ) and controller 327 (see Figure 14 ).

[0158] The base 321 is a plate-like member extending elongated in the vertical direction. The base 321 is part of a partition wall that separates the substrate transfer chamber 309 from the external space 310. Figures 15 to 17 As shown, for example, the base 321 is fixed to the front end of the front surface wall 302F. Figure 15 As shown, the base 321 extends, for example, in the vertical direction from a position near the lower end of the front surface wall 302F to a position near the upper end of the front surface wall 302F. The base 321 is configured to close the opening 302Fa of the front surface wall 302F. Figure 16 As shown, a channel opening 321a is formed in the middle portion of the base 321 in the vertical direction. The channel opening 321a extends through the base 321 in the front-rear direction. When viewed from the front-rear direction, the channel opening 321a is approximately rectangular (see [reference]). Figure 18 (a) and Figure 18 (b) The channel opening 321a is sized to allow wafer W2 to pass through the channel opening in the front-to-back direction. The channel opening 321a is opened and closed by a baffle 325.

[0159] like Figure 16 As shown, for example, the portion of base 321 surrounding channel opening 321a and the portion of base 321 directly above this portion are thinner than the rest of base 321 (normal portion 321b). For ease of explanation, these portions having a relatively small thickness (i.e., length in the front-rear direction) are referred to as thin plate portions 321c (see [reference]). Figure 16 , Figure 18 (a) and Figure 18 (b)). The space immediately in front of the thin plate portion 321c is the space in which the baffle 325 can move in the vertical direction.

[0160] The housing 322 is, for example, a box-shaped component having a generally rectangular parallelepiped shape. The housing 322 separates the substrate transfer chamber 309 from the external space 310. The top of the housing 322 is open. The front end of the housing 322 is fixed to, for example, the front surface wall 302F of the housing 302. The height of the housing 322 is, for example, approximately half the height of the base 321. The housing 322 houses the lifting box 323, allowing the lifting box 323 to move vertically.

[0161] The lifting box 323 is a box-shaped component having a generally rectangular box shape. The lifting box 323 and the box body 322 separate the substrate transfer chamber 309 from the external space 310. For example, the lifting box 323 has openings on its bottom and front sides. The lifting box 323 is configured to move vertically relative to the base 321 and the box body 322. The lifting box 323 is housed within the box body 322 to enable vertical movement. The upper surface 323b of the lifting box 323 is configured to contact the lower surface of the cover 402 of the box 400. The lifting box 323 is driven to move vertically by a lifting mechanism 326. The lifting box 323 is configured to move vertically integrally with the baffle 325. The lifting box 323 may be provided with, for example, a clamp (not shown) configured to hold the cover 402.

[0162] like Figure 16 As shown, a through hole 323a extending in the vertical direction is formed in the upper surface of the lifting box 323. For example, when viewed from the vertical direction, the through hole 323a has a generally rectangular shape. The through hole 323a is large enough to allow the stage 324 to pass through it. Figure 17 As shown, the upper surface 323b of the lifting box 323 is provided with, for example, four positioners 331 and two unlocking elements 332. When viewed from above, each positioner 331 and each unlocking element 332 is located outside the through hole 323a. The four positioners 331 are configured to restrict the horizontal movement of the box 400. The four positioners 331 are located near the four corners of the upper surface 323b. The two unlocking elements 332 are configured to lock and unlock the locking mechanism (not shown) of the box cover 402. Each unlocking element 332 is located between, for example, two positioners arranged side by side in the front-rear direction among the four positioners 331.

[0163] The platform 324 is a component on which the base plate 401 of the box 400 is placed. The platform 324 is, for example, a generally flat plate-like component. The platform 324 can pass through the through hole 323a of the lifting box 323. The platform 324 is supported by, for example, a substantially columnar support member 333. The support member 333 is fixed to, for example, the box body 322. Unlike the lifting box 323, the platform 324 is configured to be, for example, immovable.

[0164] A baffle 325 is configured to open and close the channel opening 321a. The baffle 325 is, for example, a generally flat plate-like member extending in the vertical direction. The baffle 325 is directly disposed on the front side of the thin plate portion 321c of the base 321. In other words, the baffle 325 is disposed outside the housing 302 (outside the substrate transfer chamber 309). In other words, the baffle 325 is spaced apart by the base 321 and disposed on the opposite side of the housing 302 (and the substrate transfer chamber 309) in the front-rear direction. The baffle 325 is fixed to, for example, a lifting box 323. More specifically, for example, the lower end of the baffle 325 is fixed to the front end of the upper end of the lifting box 323 by fasteners such as bolts (not shown). Therefore, the baffle 325 can move vertically integrally with the lifting box 323. In other words, the baffle 325 is driven by a lifting mechanism 326 to move vertically together with the lifting box 323. The baffle 325 can be in a closed position (see...) Figures 15 to 18 (a) and the opening position (see Figure 18 (b) The position is where the baffle 325 closes the channel opening 321a. The position is where the baffle 325 opens the channel opening 321a.

[0165] Lifting mechanism 326 (see) Figure 14 The lifting mechanism 326 is configured to drive the lifting box 323 and the baffle 325 up and down (i.e., move them in the vertical direction). The lifting mechanism 326 is housed, for example, within a housing 322 (not shown). The lifting mechanism 326 includes a ball screw mechanism (not shown) driven by, for example, a motor (not shown). Alternatively, the lifting mechanism 326 may include, for example, a cylinder (not shown) as its drive source.

[0166] Controller 327 (see Figure 14 The device includes a CPU, ROM, and RAM (not shown). The controller 327 controls each mechanism of the box opening / closing device 304 via the CPU according to a program stored in the ROM. The controller 327 is electrically connected to, for example, the lifting mechanism 326, the indicator 350 (described later), and the gas supply mechanism 360 (described later). The controller 327 also communicates with the control device 305 of the substrate transfer device 301.

[0167] Additionally, the box opening / closing device 304 may include an exhaust device (not shown) configured to vent gas from the interior space of the box 400. Detailed description of the exhaust device is omitted.

[0168] Additionally, the cassette opening / closing device 304 may also include a mapping device (not shown) for determining the state of the wafer W2 housed in the cassette C2. A description of the mapping device will be omitted.

[0169] (Basic operation of the box opening / closing device)

[0170] Reference Figure 15 , Figure 16 and Figure 18 (a) to Figure 20 The basic operation of the box opening / closing device 304 with the above configuration is described. Figure 19 It corresponds to Figure 15 A diagram showing the baffle 325 in the open position is also provided. Figure 20 It corresponds to Figure 16 A diagram showing the baffle 325 in the open position is also provided.

[0171] First, place the box 400 on the box opening / closing device 304 (see...). Figure 15 and Figure 16 More specifically, the base plate 401 is placed on the stage 324, and the box cover 402 is placed on the lifting box 323. Then, for example, the aforementioned clamp (not shown) can hold the box cover 402. Then, for example, the aforementioned venting device (not shown) can expel gas from the internal space of the box 400. Then, the unlocking member 332 operates the locking mechanism (not shown), allowing the box cover 402 to be spaced apart from the base plate 401.

[0172] Subsequently, controller 327 (see Figure 14 ) Control lifting mechanism 326 (see Figure 14 This causes the lifting box 323 and the baffle 325 to move up and down as a single unit, driven by the lifting mechanism 326. As a result, the lifting box 323 is driven to the receiving position (see...). Figure 15 and Figure 16 ) and non-accommodation locations (see Figure 19 and Figure 20 The lifting box 323 moves between the boxes. The receiving position is the vertical position of the lifting box 323 when the box cover 402 and the base plate 401 house the box C2 within the box 400. The non-receiving position is the vertical position of the lifting box 323 when the box cover 402 is spaced apart from the base plate 401 and the state of the box cover 402 covering the box C2 is released. When the lifting box 323 is in the non-receiving position, the box C2 is exposed on the rear side (the side with the opening 302Fa and the passage opening 321a). Furthermore, at this time, the spaces on the front, left, and right sides of the box C2 are isolated from the external space 310 by the lifting box 323. The space above the box C2 is isolated from the external space 310 by the lifting box 323 and the box cover 402. The space below the box C2 is isolated from the external space 310 by the box body 322.

[0173] In addition, the baffle 325 is driven by the lifting mechanism 326 to be in the closed position (see Figure 15 , Figure 16 and Figure 18 (a) and the opening position (see Figure 18 (a) Figure 19 and Figure 20 The baffle 325 can move between the following positions: the closed position is the vertical position of the baffle 325 when the channel opening 321a is closed; the open position is the vertical position of the baffle 325 when the channel opening 321a is open. The upper end of the baffle 325 in the open position protrudes upward from, for example, the upper end of the base 321.

[0174] With the lifting box 323 and baffle 325 raised as described above, wafer W2 can be transported by transfer robot 303 (see...). Figure 13 Load into and unload from box C2.

[0175] In recent years, there has been a need to further improve the cleanliness of the atmosphere within the substrate transfer chamber 309. (Refer to...) Figure 18 (a) Figure 18 (b) Figure 21 (a) and Figure 21 (b) Describe the problems expected in the above configuration. Figure 21 (a) and Figure 21 (b) shows the configuration of the baffle 325 and its surroundings. Figure 21 (a) and Figure 21 In (b), a detailed description of the baffle cover 340, which will be described later, is omitted, and the baffle cover 340 is indicated by a double-dotted line.

[0176] In the box opening / closing device 304, there is a concern that gas (outside air) in the external space 310 may enter through the gap G between the base 321 and the baffle 325 (see [link]). Figure 18 (a) and Figure 18 (b) The shaded area enters the substrate transfer chamber 309 (and the space around the cassette C2). Gap G is the space sandwiched between the base 321 and the baffle 325. Gap G is the gap in the front-to-back direction between the thin plate portion 321c of the base 321 and the baffle 325. There is concern that external air may enter the substrate transfer chamber 309 through the inlet E and the channel opening 321a of gap G. Inlet E is Figure 18 (a) and Figure 18 The shaded area in (b) is at its end (outer edge), not its lower end (see the thick dashed line). That is, the entrance E is the outer end of the gap G. In other words, the entrance E is located at the boundary between the space sandwiched between the base 321 and the baffle 325 and the outer space 310. The entrance E is located, for example, at the upper end, as well as the left and right ends of the gap G.

[0177] More specifically, when the baffle 325 is in the closed position (see...) Figure 18 (a) and Figure 21(a) When external air enters gap G1 through inlet E1, inlet E1 is formed at the upper end of baffle 325 in the vertical direction and on both side surfaces of baffle 325 in the horizontal direction. External air may enter gap G2 from the upper side and from the lateral side (left and right sides) through inlet E1. However, when substrate transfer chamber 309 is under a slightly positive pressure relative to external space 310, external air is pushed outward by the gas inside substrate transfer chamber 309. Therefore, external air hardly reaches substrate transfer chamber 309.

[0178] When the baffle 325 is in the open position (see Figure 18 (b) and Figure 21 (b) When external air enters the gap G2 via inlet E2, inlet E2 is formed at the upper end of the base 321 in the vertical direction and on both side surfaces of the baffle 325 in the horizontal direction. In particular, when the baffle 325 is lowered from the open position to the closed position, a negative pressure is generated in the gap G2, and a large amount of external air may be drawn into the gap G2 via inlet E2. External air may enter the substrate transfer chamber 309 from the upper and lateral sides (left and right sides) via the gap G2. In this case, particles may be generated in the substrate transfer chamber 309 (and the space around the cassette C2). Therefore, in order to suppress the generation of particles in the substrate transfer chamber 309 (and the space around the cassette C2), the cassette opening / closing device 304 has the following configuration.

[0179] (Detailed configuration of the box opening / closing device)

[0180] Reference Figure 22 (a) and Figure 22 (b) Describe the detailed configuration of the box opening / closing device 304. Figure 22 (a) and Figure 22 (b) shows the configuration of the baffle cover 340 and its surroundings, which will be described later. More specifically, Figure 22 (a) shows the configuration of the baffle cover 340 and its surroundings when the baffle 325 is in the closed position. Figure 22 (b) shows the configuration of the baffle cover 340 and its surroundings when the baffle 325 is in the closed position.

[0181] The box opening / closing device 304 includes a baffle cover 340, such as Figure 22 (a) and Figure 22 As shown in (b), the baffle cover 340 is configured to cover at least a portion of the inlet E of the gap G in the vertical direction. More specifically, the baffle cover 340 is configured to cover the portion of the inlet E of the gap G located above the upper end of the channel opening 321a.

[0182] The baffle cover 340 is a component separate from the base 321. The baffle cover 340 is configured to be detachably attached to the upper end of the base 321 (see [link]). Figure 21 (a) and Figure 21 (b)). For example Figure 22 (a) and Figure 22 As shown in (b), the baffle cover 340 includes a first cover 341 and a second cover 342. The first cover 341 is located on the front side of the portion (upper part 321d) of the thin plate portion 321c of the base 321 that is above the channel opening 321a. The second cover 342 is located above both the upper end of the base 321 and the upper end of the first cover 341.

[0183] For example, when viewed from above, the first cover 341 is a generally C-shaped component with an opening on its rear side. Figure 22 As shown in (a), the first cover 341 includes a front surface member 341F and a pair of side surface members 341S. Figure 22 In (a), only one of the pair of side surface members 341S is shown (more specifically, the side surface member located on the left side (i.e., the back side of the drawing face)).

[0184] The front surface member 341F is a plate-shaped member that is approximately rectangular when viewed from the front-rear direction. The front surface member 341F is located directly in front of the baffle 325. The two ends of the front surface member 341F in the left-right direction are fixed to a pair of side members 341S by fasteners such as bolts (not shown).

[0185] A pair of side surface members 341S are disposed on the two outer sides of the baffle 325 in the left-right direction. Each of the pair of side surface members 341S is, for example, a generally rectangular plate-shaped member extending in the up-down direction. The pair of side surface members 341S are detachably fixed to the thin plate portion 321c of the base 321 by fasteners such as bolts (not shown).

[0186] With this configuration, the first cover 341 covers at least a portion of the vertical direction of the entrance E of the gap G. More specifically, the first cover 341 is configured to cover a portion of the vertical direction at both ends of the entrance E in the horizontal direction.

[0187] The second cover 342 is, for example, a box-shaped member that opens only on its lower side and is thinner in the front-rear direction. The second cover 342 is detachably secured to the first cover 341 and the base 321 by fasteners such as bolts (not shown). The lower end surface of the second cover 342 is configured to be in close contact with, for example, the upper end surface of the first cover 341 and the upper end surface of the base 321. Therefore, the gaps between the second cover 342 and the first cover 341, and between the second cover 342 and the base 321, are closed. Figure 22 As shown in (a), the second cover 342 includes a front surface member 342F, a pair of side surface members 342S, a rear surface member 342R, and an upper surface member 342U. Figure 22In (a), only one of a pair of side surface members 342S is shown (more specifically, the side surface member 342S located on the left side (i.e. the back side of the drawing face).

[0188] The front surface member 342F is a plate-shaped member with a generally rectangular shape when viewed from the front-rear direction. The front surface member 342F is positioned on the front side of the baffle 325 and above the front surface member 341F. The two ends of the front surface member 342F in the left-right direction are fixed to a pair of side surface members 342S by fasteners such as bolts (not shown). The lower end of the front surface member 342F is fixed to the base 321 by fasteners such as bolts (not shown).

[0189] A pair of side surface members 342S are disposed on the two outer sides of the baffle 325 in the left-right direction. Each of the pair of side surface members 342S is, for example, a generally rectangular plate-shaped member extending in the vertical direction. The pair of side surface members 342S are fixed to the two ends of the rear surface member 342R in the left-right direction, for example, by fasteners such as bolts (not shown).

[0190] The rear surface member 342R is a plate-like member with a generally rectangular shape when viewed from the front-rear direction, and has approximately the same dimensions as the front surface member 342F. The rear surface member 342R is positioned behind the baffle 325 and above the base 321. The lower end of the rear surface member 342R is secured to the base 321 by fasteners such as bolts (not shown).

[0191] The upper surface member 342U is, for example, a generally rectangular plate-shaped member extending in the left-right direction. The thickness direction of the upper surface member 342U is, for example, substantially parallel to the vertical direction. The upper surface member 342U is fixed to, for example, the upper end of the front surface member 342F and the upper end of the rear surface member 342R by fasteners such as bolts (not shown).

[0192] With this configuration, the second cover 342 and the first cover 341 are integrally formed with the base 321. The second cover 342 and the first cover 341 cover at least a portion of the vertical direction of the inlet E of the gap G. More specifically, when the baffle 325 is in the closed position, the second cover 342 covers the upper end of the inlet E1 (see...). Figure 18 (a) and Figure 21 (a)). When the baffle 325 is in the open position, the second cover 342 covers the upper end of the inlet E2 (see Figure 18 (b) and Figure 21 (b) and a portion of the upper side of the left and right ends of the entrance E2 in the up and down directions.

[0193] The baffle cover 340, with the above-described configuration, covers the upper end of the inlet E1 of the gap G1 and a portion of the vertical direction at both ends of the inlet E1 in the left-right direction. Furthermore, the baffle cover 340 covers the upper end of the inlet E2 of the gap G2 and both ends of the inlet E2 in the left-right direction. In other words, the baffle cover 340 only opens on its lower side. Additionally, when the baffle 325 is in the open position, the upper end of the baffle cover 340 is positioned above the upper end of the baffle 325.

[0194] Using this arrangement, the entrance to the gap between the baffle cover 340 and the baffle 325 ( Figure 22 (a) The inlet E3 shown is formed only between the lower end of the baffle cover 340 and the baffle 325. Therefore, a path 343 is formed between the baffle cover 340 and the baffle 325 (see Figure 22 (a) and Figure 22 (b) (thick line), outside air needs to pass through this path before entering the substrate transfer chamber 309. When the baffle 325 is in the closed position, a path 343A with a predetermined length is formed (see [reference]). Figure 22 (The thick line in (a)). When the baffle 325 is in the open position, a path 343B is formed that is longer than path 343A (see Figure 22 (b) (thick lines). Both paths 343A and 343B pass near the front, upper, and rear surfaces of the baffle 325. When the baffle 325 is in the open position, the lifting box 323 is in the non-accommodating position, and the box C2 is exposed. However, even when the box C2 is exposed as described above, the long path 343B can effectively suppress the intrusion of external air.

[0195] (Summary of the assembly of the box opening / closing device)

[0196] The procedure for assembling the box opening / closing device 304 to the housing 302 will be briefly described. First, the operator transports a box (not shown) containing, for example, the disassembled box opening / closing device 304 to the vicinity of the housing 302. Then, the operator opens the box and removes the components of the box opening / closing device 304. Next, the operator secures the base 321 to the front surface wall 302F of the housing 302. Subsequently, the operator attaches, for example, a baffle 325, a lifting box 323, a lifting mechanism 326, and a housing 322 to the base 321. Finally, the operator attaches, for example, a baffle cover 340 to the base 321. Alternatively, the operator may attach the baffle cover 340 to the base 321 at any time after securing the base 321 to the front surface wall 302F of the housing 302. The largest of the components constituting the box opening / closing device 304 is the base 321. Since the base 321 and the baffle cover 340 are separate components, a box of approximately the same size as a box used for packaging conventional box opening / closing devices (not shown) can be used as the aforementioned box. In other words, it is not necessary to manufacture a box that is longer than a conventional box in the direction of extension of the base.

[0197] (Other components)

[0198] Another example of a configuration of the box opening / closing device 304 will be described. For example... Figure 17 As shown, an indicator 350 (status display) can be provided on the front surface portion of the baffle cover 340. The indicator 350 is a device for displaying the operating status of the box opening / closing device 304. The indicator 350 includes, for example, a known liquid crystal display, organic EL display, or lamp. The indicator 350 is electrically connected to the controller 327 (see...). Figure 14 The indicator 350 may be fixed to the front surface of the baffle cover 340. Alternatively, the indicator 350 may be configured to be embedded in a front surface portion of the baffle cover 340 (e.g., front surface member 341F).

[0199] like Figure 15 and Figure 16 As shown, for example, a gas supply mechanism 360 may be attached to the upper end of the base 321. The gas supply mechanism 360 is used to supply a predetermined type of gas (e.g., an inert gas such as nitrogen or a cleaning gas such as dry air) into the substrate transfer chamber 309. The gas supply mechanism 360 is disposed, for example, inside the substrate transfer chamber 309. The gas supply mechanism 360 includes, for example, a supply nozzle 361, a valve 362, and a support 363. The supply nozzle 361 is connected to a gas source via a conduit (not shown). The valve 362 is configured to open and close the conduit. The valve 362 may be configured to change the amount of gas supplied. More specifically, the valve 362 may be, for example, a known solenoid valve or electro-pneumatic regulator. The support 363 is configured to support the supply nozzle 361. For example, the support 363 may be configured such that it protrudes rearward from the rear end of the upper end of the base 321 and passes through the opening 302Fa. Gas supply mechanism 360 (more specifically, valve 362) is electrically connected to controller 327 (see Figure 14 The controller 327 can, for example, control the gas supply mechanism 360 to continue supplying gas to the space provided with the substrate transfer chamber 309 and the cassette C2 when the baffle 325 is in the open position.

[0200] By covering at least a portion of the vertical direction of the inlet E of the gap G with a baffle cover 340 as described above, the intrusion of external air into the gap G can be suppressed. This prevents external air from entering the substrate transfer chamber 309. Therefore, the generation of particles within the substrate transfer chamber 309 (and in the space surrounding the cassette C2) can be suppressed.

[0201] Furthermore, the baffle 325, located in the open position, is positioned below the upper end of the baffle cover 340. With this configuration, the length of the path (path 343B) from the inlet of the gap G between the baffle 325 and the base 321 to the channel opening 321a becomes longer. As the path 343B becomes longer, the possibility of external air entering the substrate transfer chamber 309 can be reduced. Therefore, the generation of particles within the substrate transfer chamber 309 (and in the space surrounding the cassette C2) can be further suppressed.

[0202] Furthermore, the baffle cover 340 only opens on its bottom side. In other words, the upper end of the baffle cover 340 is closed. This further effectively prevents external air from entering the gap G from the space above the baffle 325.

[0203] Furthermore, the baffle cover 340 is a component separate from the base 321 and can be detached from the base 321. Therefore, the length of the base 321 in the vertical direction can be approximately equal to the length of a conventional base (not shown) in the vertical direction. Therefore, it is not necessary to change the packaging material used for the box opening / closing device 304 from conventional packaging materials.

[0204] Next, variations of the second embodiment will be described. Components having the same configuration as in the second embodiment are indicated by the same reference numerals, and their descriptions will be omitted as appropriate.

[0205] (1) In the second embodiment, the second cover 342 includes an upper surface member 342U. However, this disclosure is not limited thereto. Figure 23 (a) and Figure 23 As shown in (b), the second cover 342 need not include the upper surface member 342U. Even with this configuration, the baffle cover 340 can cover at least a portion of the inlet E in the vertical direction. That is, the baffle cover 340 can form a path 343 from the inlet E to the channel opening 321a. More specifically, when the baffle 325 is in the closed position, an inlet E4 is formed between the upper end of the baffle 325 and the base 321 (see...). Figure 23 (a)). Path 343C (see Figure 23 (a) The thick line is the path that passes only near the rear surface of baffle 325, and therefore is shorter than path 343A (see Figure 22 (a) The thick line is short. When the baffle 325 is in the open position, an inlet E5 is formed between the upper end of the baffle 325 and the rear surface member 342R (see Figure 23 (b) ). Path 343D (see Figure 23 (b) The thicker line is more than path 343B (see Figure 22The thick line in (b) is short because it only passes near the rear surface of the baffle 325. In this variation, when the baffle 325 is in the open position, the upper end of the baffle cover 340 can be positioned at the same height as the upper end of the baffle 325 in the vertical direction.

[0206] (2) In the second embodiment, the baffle cover 340 includes a first cover 341 and a second cover 342. However, this disclosure is not limited thereto. For example, the baffle cover 340 may include only the first cover 341. Even with this configuration, a portion of the vertical direction of the entrance E of the gap G can be covered. In this case, when the baffle 325 is in the open position, the upper end of the base 321 and the upper end of the baffle cover 340 are located below the upper end of the baffle 325.

[0207] (3) In the second embodiment, the baffle cover 340 can be detached from the base 321. However, this disclosure is not limited thereto. When the baffle cover 340 is fixed to the base 321, the baffle cover 340 can be fixed non-removably by welding or the like. Such a configuration is also limited to a configuration in which the baffle cover 340 is integrally provided with the base 321.

[0208] (4) In the second embodiment, the baffle cover 340 is separated from the base 321 until the box opening / closing device 304 is assembled to the housing 302. However, this disclosure is not limited thereto. For example, the baffle cover 340 may be non-removably fixed to the base 321 before the disassembled box opening / closing device 304 is packaged for transport. Such a configuration is also limited to a configuration in which the baffle cover 340 is integrally formed with the base 321.

[0209] (5) In the second embodiment, the baffle cover 340 is a component separate from the base 321. However, this disclosure is not limited thereto. For example, the base 321 and the baffle cover 340 may be formed from a single component. Such a configuration is also limited to a configuration in which the baffle cover 340 is integrally disposed with the base 321.

[0210] (6) The box opening / closing device 304 can be placed on the substrate transfer device 301 other than the EFEM.

[0211] <Third Implementation Method>

[0212] Another embodiment of this disclosure (the third embodiment) will now be described. Figure 24 This is a schematic plan view of a device front-end module (EFEM) 501 and a processing device 506 connected to the EFEM 501. The device front-end module (EFEM) 501 is a substrate transfer module according to a third embodiment. The EFEM 501 corresponds to a substrate transfer device. Figure 24 The top plate 532 of the housing 502 (described later) is omitted from the illustration. Figure 25This is a side view of EFEM 501. Figure 25 The illustration of the side wall (right side wall 536) is omitted in the text. This is for ease of explanation. Figure 24 The directions shown are defined as front-back and left-right. That is, the orientation of the EFEM 501 and processing device 506 is defined as the front-back direction. In the front-back direction, the EFEM 501 side is defined as the front side, and the processing device 506 side is defined as the rear side. The direction in which multiple box opening / closing devices 504 are arranged and perpendicular to the front-back direction is defined as the left-right direction. Furthermore, the direction perpendicular to both the front-back and left-right directions is defined as the up-down direction (see reference). Figure 25 ).

[0213] (Outline configuration of EFEM and its surroundings)

[0214] First, refer to Figures 24 to 26 Describe the general configuration of EFEM 501 and its surroundings. Figure 26 This is a diagram showing the electrical configuration of the EFEM501. (As shown...) Figure 24 As shown, EFEM 501 includes a housing 502, multiple box opening / closing devices 504, and a control device 505 (controller) (see [link]). Figure 26 The processing device 506 is located at the rear of the EFEM 501. The processing device 506 is a device for performing a predetermined process on a wafer W3 (substrate), such as a semiconductor substrate. The predetermined process can be, for example, a process performed in a vacuum chamber (film deposition, etching, etc.), or any other process. The EFEM 501 transfers the wafer W3 between the SMIF cassette (cassette) 600, which is placed on the cassette opening / closing device 504, and the processing device 506 using a transfer mechanism 503 disposed inside the housing 502.

[0215] like Figure 25 As shown, the SMIF cassette 600 includes a base plate 601 and a cover 602. The base plate 601 is a generally flat component on which a cassette C3 accommodating multiple wafers W3 is placed. The cover 602 is a component that covers the cassette C3 placed on the base plate 601. The cassette C3 is configured to accommodate multiple wafers W3 arranged in a substantially horizontal position in the vertical direction. The cassette C3 opens at its rear side and is configured to allow loading and unloading of the wafers W3 from the rear. The cover 602 is configured to cover the cassette C3 and the base plate 601 from above. The cover 602 opens at its lower side. The lower end of the cover 602 is positioned horizontally outside the base plate 601. The cover 602 includes a locking mechanism (not shown). The locking mechanism allows the cover 602 to be secured to the base plate 601 and released from the base plate 601.

[0216] Housing 502 is used to connect multiple box opening / closing devices 504 and processing equipment 506. Housing 502 generally has a rectangular parallelepiped shape. Figure 24 and Figure 25 As shown, the housing 502 includes support columns 537a to 537d extending in the vertical direction and multiple partition walls (bottom plate 531, top plate 532, front wall 533, rear wall 534, left side wall 535, and right side wall 536). The partition walls are attached to the support columns 537a to 537d. Support column 537a is located at the right end of the front portion of the housing 502. Support column 537b is located at the left end of the front portion of the housing 502. Support column 537c is located at the left end of the rear portion of the housing 502. Support column 537d is located at the right end of the rear portion of the housing 502. The bottom plate 531 is located at the bottom of the housing 502 (see...). Figure 25 Top plate 532 is disposed on top of housing 502 (see...). Figure 25 The front wall 533 is located at the front end of the housing 502 (see...). Figure 25 The rear wall 534 is located at the rear end of the housing 502 (see...). Figure 25 The left side wall 535 is located at the left end of the housing 502 (see...). Figure 24 The right side wall 536 is located at the right end of the housing 502 (see...). Figure 24 In the third embodiment, the front wall 533 is composed of a partition wall located at the front end of the housing 502 and the base 541 of the box opening / closing device 504 (described later). In other words, the base 541 of the box opening / closing device 504 forms part of the front wall 533. The space surrounded by the plurality of partition walls is substantially sealed and isolated from the external space of the housing 502 (hereinafter referred to as the external space 509). The components of each partition wall are formed, for example, a typical metal plate.

[0217] like Figure 25 As shown, a fan filter unit (hereinafter referred to as FFU 513) is disposed inside the housing 502. FFU 513 includes a fan 513a and a filter 513b. FFU 513 is supported by a horizontally extending support member 518 (see [reference]). Figure 25 Support. Support member 518 divides the internal space of housing 502 vertically into a space where FFU 513 is provided and a substrate transfer chamber 530 for transferring wafer W3 (see...). Figure 25 The component 518 has an opening 518a extending through it in the vertical direction. A fan 513a is configured to blow clean gas (nitrogen, dry air, etc.) downwards. The fan 513a is driven to rotate by an FFU motor 513c (pressure regulator) (see [link]). Figure 26 The FFU motor 513c is, for example, a known DC motor. The FFU motor 513c is configured to change the rotational speed of the fan 513a. Clean gas blown downward from the fan 513a passes through the filter 513b and is delivered to the substrate transfer chamber 530 via the opening 518a. Therefore, the substrate transfer chamber 530 is filled with clean gas.

[0218] A pressure gauge 514 is installed inside the housing 502 (see Figure 26 A pressure gauge 514 is arranged, for example, in the substrate transfer chamber 530. The pressure gauge 514 is configured to measure the pressure in the substrate transfer chamber 530.

[0219] The box opening / closing device 504 is attached to the front end of the housing 502. The loading locking chamber 507 of the processing device 506 (see...) Figure 24 It is connected to an opening 534a provided in the rear wall 534 of the housing 502. The opening 534a is opened and closed by a door 501a. The wafer W3 is transferred between the substrate transfer chamber 530 and the loading locking chamber 507 through the opening 534a.

[0220] The transfer mechanism 503 is configured to transfer wafer W3 within the substrate transfer chamber 530. For example... Figure 25 As shown, the transfer mechanism 503 includes an arm 503a and a base 503b. The arm 503a holds the wafer W3. The base 503b supports the arm 503a. The base 503b is configured to move in the left-right direction along the guide rail 522. The transfer mechanism 503 can transfer the wafer W3 between the cassette C3 placed on each cassette opening / closing device 504 and the loading locking chamber 507.

[0221] Each of the plurality of box opening / closing devices 504 is configured to hold an SMIF box 600. The plurality of box opening / closing devices 504 are arranged side by side in the left-right direction. The rear end of each box opening / closing device 504 is disposed along the front wall 533 of the housing 502. Details of the box opening / closing devices 504 will be described later.

[0222] like Figure 24 As shown, the processing apparatus 506 includes, for example, a loading lock chamber 507 and a processing chamber 508. The loading lock chamber 507 is a chamber for temporarily suspending the wafer W3. The loading lock chamber 507 is connected to the housing 502 via the aforementioned door 501a. The loading lock chamber 507 is connected to the processing chamber 508 via a door 506a. In the processing chamber 508, the wafer W3 undergoes predetermined processing by a processing mechanism (not shown).

[0223] Control device 505 is configured to control the various components of EFEM 501. For example... Figure 26 As shown, the control device 505 is electrically connected to the cover moving mechanism 550 (described later), the baffle opening / closing mechanism 560 (described later), the pressure gauge 514, the FFU motor 513c, etc.

[0224] (Box opening / closing device)

[0225] The following will refer to Figures 27 to 30 The box opening / closing device 504 according to the third embodiment is described. Figure 27 This is a perspective view of the box opening / closing device 504. Figure 28 This is a front view of the box opening / closing device 504. Figure 29 This is a rear view of the box opening / closing device 504. Figure 30 It is along Figure 28 The sectional view taken from line VII-VII in the diagram. Figures 27 to 29 This shows the box opening / closing device 504 in a state where the SMIF box 600 is not placed on the box opening / closing device 504. Figure 30 This illustrates the state where the SMIF box 600 is placed on the box opening / closing device 504. Figure 28 The diagram of the baffle opening / closing mechanism 560 is omitted. Figure 29 The illustration of the cover moving mechanism 550 is omitted in the text. (See example...) Figure 27 As shown, the box opening / closing device 504 includes a base 541, a horizontal base 543, a stage 544, a housing 546, a baffle 547, and a cover moving mechanism 550 (see [reference]). Figure 30 ) and baffle opening / closing mechanism 560 (see Figure 30 ).

[0226] The base 541 is a plate-like member extending in both the vertical and horizontal directions. The base 541 forms part of the front wall 533 that isolates the substrate transfer chamber 530 from the external space 509. In other words, the base 541 forms part of the front wall 533 that isolates the housing 502 from the external space 509 between the housing 502 and the stage 544. Figure 27 As shown, a frame-shaped window frame 541a is formed in the base 541. A generally rectangular opening 541b is formed within the window frame 541a. In other words, the opening 541b is formed in the base 541.

[0227] Horizontal base 543 is a member extending forward from base 541 (see...) Figure 27 A horizontal base 543 is provided, for example, in a portion slightly above the base 541 in the vertical direction, approximately at its center. A stage 544 is provided at the upper end of the horizontal base 543. The stage 544 is a component on which the SMIF box 600 is placed. The stage 544 is, for example, a generally flat plate-like component. When viewed from the vertical direction, the stage 544 is disposed within a through-hole 556 formed in the upper surface portion 551d of the box cover 551, which will be described later. The stage 544 is supported, for example, by a generally columnar support (not shown) fixed to the housing 546. Figure 27 As shown, in the third embodiment, the height of the stage 544 is slightly lower than the height of the lowest part of the opening 541b. Figure 27 As shown, the upper surface of the stage 544 is provided with a plurality of positioning pins 544a for positioning the SMIF box 600.

[0228] The housing 546 is disposed on the front side of the base 541 and below the horizontal base 543. The housing 546 extends in the vertical direction. Inside the housing 546, a portion of the cover moving mechanism 550 (described later) and the baffle opening / closing mechanism 560 (described later) are provided.

[0229] The baffle 547 is a plate-shaped member that can open and close the opening 541b. The baffle 547 is configured to move in the vertical direction. The baffle 547 is located on the rear side of the base 541 (see [reference]). Figure 30 In other words, the baffle 547 is located on the opposite side of the stage 544, and the base 541 is located between the baffle 547 and the stage 544.

[0230] (Cover-up movement mechanism)

[0231] Cover moving mechanism 550 (see Figure 30 The cover 602 of the SMIF box 600 is configured to move between a lower position and an upper position. The lower position is the position where the cover 602 covers the box C3 placed on the base plate 601 of the SMIF box 600 (see [link]). Figure 30 The upper position is the position above the lower position. The upper position is the position where the box C3, placed on the base plate 601, protrudes from the cover 602 (see...). Figure 32 ).

[0232] like Figure 28 and Figure 30 As shown, the cover moving mechanism 550 includes a case cover (lifting device) 551, a case cover support 552, and a ball screw mechanism 553. The case cover 551 is a component that can contact the lower end of the cover 602 of the SMIF case 600 placed on the stage 544. The case cover 551 is a component used to push the cover 602, which is located in the lower position, upward to the upper position. A detailed description will be given below.

[0233] With the cover 602 in the lower position, the case cover 551 is housed inside the horizontal base 543 and the housing 546 (see...). Figure 30 The case cover 551 is a box-shaped component having a generally rectangular parallelepiped shape. The case cover 551 includes a front surface portion 551a (see...). Figure 28 and Figure 30 ), left surface portion 551b (see Figure 30 ), right surface portion 551c (see Figure 28 ) and the upper surface portion 551d (see Figure 27 and Figure 30The front surface portion 551a extends in the left-right direction and also in the up-down direction. The left surface portion 551b extends rearward from the left end of the front surface portion 551a. The right surface portion 551c extends rearward from the right end of the front surface portion 551a. The upper surface portion 551d connects to the upper ends of the front surface portion 551a, the left surface portion 551b, and the right surface portion 551c, and extends in a generally horizontal direction. The left surface portion 551b and the right surface portion 551c are arranged to face each other in the left-right direction.

[0234] The upper surface portion 551d is configured to contact the lower surface of the cover 602 of the SMIF box 600. As a result, when the box cover 551 moves upward, the upper surface portion 551d pushes the box cover 551 upward. Furthermore, as... Figure 27 As shown, a through hole 556 extending in the vertical direction is formed in the upper surface portion 551d. For example, when viewed from the vertical direction, the through hole 556 has a generally rectangular shape. The dimensions of the through hole 556 are designed to allow the stage 544 to pass through it. As a result, when the case cover 551 moves in the vertical direction, the stage 544 passes through the through hole 556. Therefore, the case cover 551 can move in the vertical direction without interference between the case cover 551 and the stage 544. The case cover 551 is configured to move upward until the cover 602 is in the upper position (see...). Figure 32 ).

[0235] The case cover 551 has the function of covering the front, left, and right sides of the case C3 when the cover 602 is moved to the upper position. Specifically, the front surface portion 551a of the case cover 551 covers the front side of the case C3, the left surface portion 551b covers the left side of the case C3, and the right surface portion 551c covers the right side of the case C3. Even when the cover 602 is in the upper position and the case C3 is exposed from the cover 602, this also prevents the case C3 from being exposed to the external space 509. When the cover 602 is in the upper position, the case cover 551 does not cover the rear side of the case C3.

[0236] The case cover support 552 is a component that supports the case cover 551 from below. For example... Figure 28 and Figure 30 As shown, a case cover support 552 is connected to a ball screw mechanism 553. The ball screw mechanism 553 is configured to move the case cover 551 vertically via the case cover support 552. The ball screw mechanism 553 is disposed, for example, below a stage 544. The ball screw mechanism 553 is driven by a case movement motor 553a (a second drive source and another drive source). Although not shown in the figure, the case movement motor 553a is also disposed, for example, below a stage 544. Using the above configuration, the case movement mechanism 550 moves the case 602, which is in contact with the case cover 551, between a lower position and an upper position.

[0237] (Baffle opening / closing mechanism)

[0238] The baffle opening / closing mechanism 560 is a mechanism for moving the baffle 547 between a closed position and an open position. The closed position is when the baffle 547 closes the opening 541b (see...). Figure 30 The position of the baffle 547 when it is open. The open position is when the baffle 547 opens into opening 541b (see...). Figure 33 The position of the baffle 547 when it is open. The open position is the position inside the housing 502 connected to the box opening / closing device 504. The open position is, for example, a position lower than the closed position, but is not limited to this.

[0239] like Figure 29 and Figure 30 As shown, the baffle opening / closing mechanism 560 includes a support frame 562, a movable block 563, and a slide rail 564. The support frame 562 is a member that supports the baffle 547. The movable block 563 is a member that supports the lower end of the support frame 562. The movable block 563 is disposed on the front side of the base 541. The slide rail 564 is a member that guides the movable block 563 in the vertical direction. The movable block 563 is driven by a baffle moving motor 565 (first drive source) to move in the vertical direction. The baffle moving motor 565 is a different motor from the cover moving motor 553a. The baffle opening / closing mechanism 560 moves the baffle 547 to the closed position (see [reference]) by moving the movable block 563 along the slide rail 564. Figure 30 ) and opening location (see Figure 33 Move between ).

[0240] In the above configuration, to keep the substrate transfer chamber 530 as isolated from the external space 509 as possible, it is conceivable to fully raise the cassette cover 551 before moving the baffle 547. However, during this process, the baffle 547 keeps the opening 541b closed for a relatively long time. As a result, time is required before the clean gas begins to be supplied from the substrate transfer chamber 530 to the cassette C3. Therefore, there is a concern that low-cleanliness gas may flow from the external space 509 into the space containing the cassette C3 (the containing space 571 described later), potentially contaminating the wafer W3 stored in the cassette C3. For example, when the cassette cover 551 is raised, a negative pressure is generated in the containing space 571. Therefore, in particular, gas can easily flow from the external space 509 into the containing space 571. In addition, when the cassette cover 551 is raised, an upward airflow is generated in the internal space of the cassette opening / closing device 504. Therefore, in addition to gas flowing from the external space 509 into the containing space 571, there is also a concern that particles generated in the cover moving mechanism 550 may flow into the containing space 571.

[0241] Therefore, in order to suppress the flow of gas from the external space 509 and the like into the box C3 in the EFEM 501 of the third embodiment, the EFEM 501 is configured as follows.

[0242] (Detailed configuration of EFEM)

[0243] Reference Figures 27 to 30 Describe the configuration details of EFEM 501. For example... Figures 28 to 30 As shown, the baffle 547 has a plurality of through holes 547a (connecting portions) extending in the front-rear direction. For example, the plurality of through holes 547a are provided only below the center in the vertical direction of the baffle 547. The plurality of through holes 547a may be arranged in a zigzag pattern in the left-right direction. This arrangement is similar to the arrangement of holes formed in, for example, known stamped metals (not shown).

[0244] Furthermore, the control device 505 controls the operation of the FFU motor 513c based on the detection results obtained by the pressure gauge 514. More specifically, the control device 505 controls the rotational speed of the fan 513a so that the pressure in the substrate transfer chamber 530 is slightly higher than the pressure in the external space 509 (i.e., maintaining a slightly positive pressure). By appropriately controlling the rotational speed of the fan 513a, the flow rate of the cleaning gas blown into the substrate transfer chamber 530 by the FFU 513 is appropriately controlled. This effectively prevents gas in the external space 509 from flowing into the substrate transfer chamber 530 through the multiple through-holes 547a.

[0245] In addition, such as Figure 27 , Figure 28 and Figure 30 As shown, the box opening / closing device 504 includes a shielding plate 570 (shielding member) for opening and closing the through-hole 547a. The shielding plate 570 is, for example, a generally flat plate-shaped member extending in the vertical and horizontal directions. The shielding plate 570 may be made of, for example, a sheet of metal. The thickness direction of the shielding plate 570 is substantially parallel to the front-rear direction. The shielding plate 570 is fixed to the upper end surface of the front end of the box cover 551, for example, by a fixing device (not shown). Alternatively, the shielding plate 570 may be integrally formed with the box cover 551 by welding or other means. The shielding plate 570 is movable integrally with the box cover 551 in the vertical direction. In other words, the shielding plate 570 is driven to move by a cover movement motor 553a. When the cover 602 of the SMIF box 600 is in the lower position and the baffle 547 is in the closed position, the shielding plate 570 is positioned facing the baffle 547. For ease of explanation, the position of the shielding plate 570 when the cover 602 of the SMIF box 600 is in the lower position will be referred to as the lower plate position.

[0246] The shielding plate 570 is configured to close multiple through-holes 547a when it is in the lower position of the plate. As used herein, the term "closed" means as follows: Figure 28 As shown, multiple through holes 547a are configured such that they overlap with the shielding plate 570 when viewed from the front-rear direction. Figure 30 As shown, a small gap exists between the shielding plate 570 and the baffle 547 in the front-to-back direction. However, compared to a configuration without the shielding plate 570, the configuration with the shielding plate 570 has the following advantages. That is, when the shielding plate 570 closes the multiple through holes 547a, the gas flow path from the substrate transfer chamber 530 to the external space 509 becomes relatively narrow and long. Therefore, the flow path resistance is relatively high, thereby suppressing gas leakage from the substrate transfer chamber 530 to the external space 509. The shielding plate 570 may have a length in the left-to-right direction that is approximately the same as the length of the baffle 547. When located in the lower position of the plate, the shielding plate 570 is configured to cover, for example, the lower half of the opening 541b of the base 541 in the vertical direction.

[0247] (Operating procedure for the box opening / closing device)

[0248] Next, we will refer to Figures 30 to 33 The operation of the box opening / closing device 504 is described. In the initial state, the cover 602 of the SMIF box 600 is in the lower position. That is, the shielding plate 570 is in the lower position. In addition, the baffle 547 is in the closed position.

[0249] First, such as Figure 30 As shown, the SMIF box 600 is placed on the stage 544. At this time, the cover 602 is in the lower position. Next, the control device 505 controls the cover movement motor 553a to start raising the box cover 551. As a result, the cover 602 begins to rise from the lower position to the upper position, and the shielding plate 570 begins to rise from the lower position along with the box cover 551.

[0250] Assuming, such as Figure 31As shown, cover 602 has moved upward to some extent from its lower position. At this time, cover 602 is spaced apart from bottom plate 601. Case C3 protrudes from cover 602, and the front, left, and right sides of case C3 are covered by case cover 551. At this time, the upper side of case C3 is covered by the upper surface portion 551d of case cover 551 and cover 602. In other words, case cover 551 and cover 602 form a receiving space 571 for receiving case C3. The pressure in receiving space 571 is approximately equal to the pressure in external space 509 and lower than the pressure in substrate transfer chamber 530. Furthermore, at this time, shielding plate 570 is positioned above the lower part of the plate. More specifically, shielding plate 570 is positioned above the plurality of through holes 547a, thereby keeping the plurality of through holes 547a open. As a result, substrate transfer chamber 530 and receiving space 571 are connected to each other via the plurality of through holes 547a. In this state, cleaning gas is supplied from the substrate transfer chamber 530 to the receiving space 571 through multiple through-holes 547a (see...). Figure 31 (See the arrow shown). In other words, when the baffle 547 is in the closed position, cleaning gas is supplied to the containment space 571.

[0251] The control device 505 can control the FFU motor 513c based on information about the movement of the shielding plate 570. This information could be, for example, an indication that a predetermined time has elapsed since the self-cover movement motor 553a was controlled to begin raising the casing cover 551. More specifically, when a predetermined time has elapsed since the self-cover 551 began to rise, the control device 505 can, for example, control the FFU motor 513c to increase the rotational speed of the fan 513a to above normal levels.

[0252] Subsequently, as Figure 32 As shown, the cover 602 reaches the upper position. At this time, cleaning gas continues to be supplied from the substrate transfer chamber 530 to the receiving space 571 through multiple through holes 547a. For ease of explanation, the position of the shielding plate 570 when the cover 602 is in the upper position will be referred to as the upper plate position. When in the upper plate position, the shielding plate 570 is configured not to protrude above the upper end of the base 541 (below the upper end of the base 541 or flush with the upper end of the base 541). More precisely, even when the shielding plate 570 is between the lower plate position and the upper plate position, the upper end of the shielding plate 570 is also configured not to protrude above the upper end of the base 541.

[0253] In addition, the control device 505 controls the baffle moving motor 565 to move the baffle 547 from the closed position to the open position (see...). Figure 33 Therefore, opening 541b is opened, and wafer W3 can be loaded and unloaded between the cassette C3 and the substrate transfer chamber 530. At this time, the substrate transfer chamber 530 and the receiving space 571 are connected to each other via opening 541b.

[0254] As described above, when the cover 602 is spaced apart from the base plate 601 by the case cover 551, the case C3 is exposed to the receiving space 571. Furthermore, the shielding plate 570 allows communication between the substrate transfer chamber 530 and the receiving space 571. Therefore, even when the baffle 547 is in the closed position, gas can be supplied from the higher-pressure substrate transfer chamber 530 to the receiving space 571. Thus, in the EFEM 501, which is equipped with a drive source (baffle moving motor 565) for raising and lowering the baffle 547 and a drive source (cover moving motor 553a) for raising and lowering the case cover 551, gas inflow from the external space 509 into the case C3 can be prevented.

[0255] Furthermore, in the case opening / closing device 504 of the third embodiment, cleaning gas is supplied from the substrate transfer chamber 530 to the receiving space 571. Therefore, when the case cover 551 is raised, negative pressure can be suppressed from being generated in the receiving space 571. Therefore, gas can be prevented from flowing into the receiving space 571 from the external space 509. In addition, when the case cover 551 is raised, upward airflow can be suppressed from being generated in the internal space of the case opening / closing device 504. Therefore, particles generated in the cover moving mechanism 550 can be prevented from flowing into the receiving space 571.

[0256] Furthermore, the drive source for moving the shielding plate 570 is the cover moving motor 553a. This simplifies the structure of the box opening / closing device 504 compared to a case where the shielding plate 570 is driven by a different drive source than the baffle moving motor 565 and the cover moving motor 553a.

[0257] Furthermore, the shielding plate 570 is configured not to protrude above the upper end of the base 541 when the substrate transfer chamber 530 and the receiving space 571 are connected to each other via the through hole 547a. Therefore, the increase in the vertical dimension of the box opening / closing device 504 can be suppressed, which would otherwise be caused by the shielding plate 570.

[0258] Furthermore, the control device 505 controls the FFU motor 513c based on information regarding the movement of the shielding plate 570. When the substrate transfer chamber 530 and the receiving space 571 are connected to each other by the movement of the shielding plate 570, the pressure in the substrate transfer chamber 530 may fluctuate due to the movement of gas. In this regard, according to the third embodiment, the FFU motor 513c can be controlled by taking into account the movement of the shielding plate 570. Therefore, pressure fluctuations in the substrate transfer chamber 530 can be effectively suppressed.

[0259] Next, variations of the third embodiment will be described. Components having the same configuration as in the third embodiment will be indicated by the same reference numerals, and their descriptions will be omitted as appropriate.

[0260] (1) In the third embodiment, the drive source for moving the shielding plate 570 is the cover moving motor 553a. However, this disclosure is not limited thereto. The shielding plate 570 may be driven to move by a drive source (not shown) other than the baffle moving motor 565 or the cover moving motor 553a.

[0261] (2) In the third embodiment, with the substrate transfer chamber 530 and the receiving space 571 connected to each other via the through hole 547a, the shielding plate 570 does not protrude above the upper end of the base 541. However, this disclosure is not limited thereto. The shielding plate 570 may protrude above the upper end of the base 541.

[0262] (3) In the third embodiment, the control device 505 uses information about the predetermined time as information about the movement of the shielding plate 570. However, this disclosure is not limited thereto. For example, the control device 505 may increase the rotational speed of the fan 513a at approximately the same time as the start of the movement of the shielding plate 570. Alternatively, a sensor (not shown) may be provided for detecting the movement of the shielding plate 570. The control device 505 may use the detection result from the sensor as information about the movement of the shielding plate 570.

[0263] (4) In the third embodiment, the FFU motor 513c corresponds to a pressure regulator. However, this disclosure is not limited thereto. For example, an exhaust device (not shown) for discharging gas from the substrate transfer chamber 530 and an exhaust valve (not shown) configured to regulate the flow rate of the gas discharged by the exhaust device may be provided. As a supplement to or alternative to controlling the FFU motor 513c, the control device 505 may control the exhaust valve based on information about the movement of the shield plate 570. In this case, the exhaust valve is included in the pressure regulator.

[0264] (5) In the third embodiment, the control device 505 controls the pressure regulator based on information regarding the movement of the shielding plate 570. However, this disclosure is not limited thereto. The control device 505 may, for example, control the pressure regulator based solely on the detection results obtained by the pressure gauge 514.

[0265] (6) In the third embodiment, the shielding plate 570 corresponds to the shielding member. However, this disclosure is not limited thereto. The shielding member need not be substantially flat, as long as it can open and close the communication device.

[0266] (7) In the third embodiment, the plurality of through holes 547a correspond to a communicating device. However, this disclosure is not limited thereto. The communicating device can be configured as follows. For example, the plurality of through holes 547a can be arranged in a single row in the left-right direction. Alternatively, the plurality of through holes 547a can be arranged in three or more rows. Alternatively, instead of the plurality of through holes 547a, only one through hole (not shown) can be formed in the baffle 547. The opening area of ​​a single through hole can be less than the sum of the opening areas of the plurality of through holes 547a. Alternatively, the opening area of ​​a single through hole can be greater than or equal to the sum of the opening areas of the plurality of through holes 547a. For example, a single through hole can be formed in approximately the entire portion of the baffle 547 below its center in the up-down direction.

[0267] Alternatively, the connecting device may have a shape other than a through hole. For example, the connecting device may include a slit (not shown) extending vertically from the lower end of the baffle 547 to its intermediate portion. Alternatively, the connecting device may include gaps (not shown) formed at the lateral ends of the baffle 547. Alternatively, the connecting device may be a tubular member passing through the interior of the baffle 547. The connecting device may have any configuration as long as it communicates the substrate transfer chamber 530 and the receiving space 571 with each other and is opened and closed by the shield.

[0268] (8) The structure and shape of the case cover (lifting device) 551 are not limited to those described above. Other components may be provided that have a structure and / or shape that raises and lowers the cover 602 and together with the cover 602 form the receiving space 571.

[0269] (9) The first drive source, the second drive source, and other drive sources are not limited to the drive sources described above. For example, a cylinder (not shown) may be provided as a drive source instead of any of the motors described above.

[0270] (10) In the third embodiment, the box placed on the stage 544 is an SMIF box 600. However, this disclosure is not limited thereto. The box (not shown) placed on the stage 544 can be a cover (not shown) that can be moved in the vertical direction to cover and expose the box C3 or any other type of box.

[0271] (11) The method according to the third embodiment can also be applied to substrate transport apparatus (not shown) that is different from EFEM 501 and configured to transport substrates (not shown). In the substrate transport apparatus, substrates other than wafer W3 can also be transported. There are no particular limitations on the type and / or shape of the substrate.

[0272] Explanation of reference numerals in the attached figures

[0273] 1: EFEM, 2: Substrate transfer chamber, 3: Transfer mechanism, 4: Box opening / closing device, 5: Control device, 6: Processing equipment, 41: Base, 42: Baffle, 44: Stage, 71a: First supply port, 72a: Second supply port, 81: Cover moving mechanism, 82: Baffle opening / closing mechanism, 83: Gas replacement mechanism, 92: Opening, 100: SMIF box, 101: Base plate, 102: Cover, C: Box, W: Wafer.

Claims

1. A cassette opening / closing device connected to a substrate transfer chamber for transferring a substrate to a processing apparatus, the cassette opening / closing device comprising: A stage configured to place a box on the stage, the box including a base plate and a cover, a cassette containing the substrate being placed on the base plate, the cover being configured to cover the cassette placed on the base plate; The base, which forms part of a partition wall, is disposed between the substrate transfer chamber and the stage and is configured to isolate the substrate transfer chamber from the external space. An opening is formed in the base; A baffle, which is disposed on the opposite side of the stage via the base and is configured to close and open the opening; A cover moving mechanism is configured to move the cover between a lower position and an upper position, wherein in the lower position the cover covers the box placed on the base plate, and in the upper position the cover exposes the box, the upper position being above the lower position; as well as A baffle opening / closing mechanism is configured to move the baffle between a closed position where the baffle closes the opening and an open position where the baffle opens the opening, the open position being below the closed position and located inside the substrate transfer chamber connected to the box opening / closing device.

2. The box opening / closing device according to claim 1, further comprising a gas replacement mechanism configured to replace the interior of the box with a clean gas. The gas replacement mechanism has a first supply port configured to supply the cleaning gas into the cartridge, and The first supply port is formed in the baffle and is configured to open toward the stage.

3. The cartridge opening / closing device according to claim 1 or 2, further comprising a second supply port configured to supply cleaning gas to the cartridge. The second supply port is configured to open toward the stage when the baffle is in the open position.

4. The box opening / closing device according to any one of claims 1 to 3, wherein the pressure in the substrate transfer chamber is higher than the pressure in the external space. The cover moving mechanism includes a lifting device configured to raise and lower the cover relative to the base plate, and configured to form a receiving space together with the cover for accommodating the case when the cover is spaced apart from the base plate. The baffle has a communication device configured to communicate the substrate transfer chamber and the receiving space with each other. The device includes a shielding element configured to open and close the communication device by being driven to move by a drive source different from the shielding moving mechanism.

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