Electronic device

Abstract

An electronic device is provided, including: a display layer; and a sensor layer above the display layer and including: a plurality of first electrodes arranged along a first direction; a plurality of second electrodes crossing the plurality of first electrodes and arranged along a second direction crossing the first direction; a first auxiliary electrode group including a plurality of first auxiliary electrodes arranged along the second direction and a first auxiliary trace electrically connected to the plurality of first auxiliary electrodes; and a second auxiliary electrode group having an impedance substantially equal to an impedance of the first auxiliary electrode group and including a plurality of second auxiliary electrodes arranged along the second direction and a second auxiliary trace electrically connected to the plurality of second auxiliary electrodes.

Description

[0001] This application claims priority and benefit to Korean Patent Application No. 10-2025-0005557, filed on January 14, 2025, the entire contents of which are incorporated herein by reference. Technical Field

[0002] This disclosure relates to an electronic device with improved touch reliability. Background Technology

[0003] Multimedia electronic devices such as televisions, mobile phones, tablet computers, laptop computers, navigation devices, and game consoles include display devices for displaying images. In addition to traditional input methods such as buttons, keyboards, and mice, such electronic devices may also include a sensor layer (or input sensor) capable of providing touch-based input methods that allow users to appropriately, intuitively, and conveniently input information or commands. The sensor layer can sense the user's touch or pressure. In recent years, among users accustomed to using styluses to input information, the demand for precise touch input using a pen or for corresponding applications such as sketching or drawing applications has been increasing. Summary of the Invention

[0004] This disclosure provides an electronic device with improved touch reliability.

[0005] One or more embodiments of this disclosure provide an electronic device including a display layer; and a sensor layer above the display layer and including: a plurality of first electrodes arranged along a first direction; a plurality of second electrodes intersecting the plurality of first electrodes and arranged along a second direction intersecting the first direction; a first auxiliary electrode group including a plurality of first auxiliary electrodes arranged along the second direction and first auxiliary traces electrically connected to the plurality of first auxiliary electrodes; and a second auxiliary electrode group having an impedance substantially equal to that of the first auxiliary electrode group, and including a plurality of second auxiliary electrodes arranged along the second direction and second auxiliary traces electrically connected to the plurality of second auxiliary electrodes.

[0006] The sensor layer may also include a first pad connected to a first auxiliary trace and a second pad connected to a second auxiliary trace, wherein a plurality of second auxiliary electrodes are located between a plurality of first auxiliary electrodes and a pad region where the first and second pads are positioned.

[0007] The plurality of first auxiliary electrodes may include a first auxiliary electrode, wherein the plurality of second auxiliary electrodes include a second auxiliary electrode, wherein the plurality of first electrodes include a first electrode that intersects with the first auxiliary electrode and the second auxiliary electrode, and wherein the plurality of second electrodes include a second-1 electrode superimposed with the first auxiliary electrode and a second-2 electrode superimposed with the second auxiliary electrode.

[0008] The resistance of the first auxiliary electrode can be approximately equal to the resistance of the second auxiliary electrode, wherein the resistance of the first auxiliary trace is approximately equal to the resistance of the second auxiliary trace.

[0009] The capacitance between the first auxiliary electrode and the first electrode can be approximately equal to the capacitance between the second auxiliary electrode and the first electrode.

[0010] The capacitance between the first auxiliary electrode and the 2-1 electrode can be approximately equal to the capacitance between the second auxiliary electrode and the 2-2 electrode.

[0011] The first substrate capacitance between the first auxiliary electrode and the common electrode of the light-emitting element in the display layer can be approximately equal to the second substrate capacitance between the second auxiliary electrode and the common electrode.

[0012] The first auxiliary trace may have a larger resistance than the second auxiliary trace, wherein the first auxiliary electrode has a smaller resistance than the second auxiliary electrode.

[0013] The resistance of the first auxiliary trace can be greater than the resistance of the second auxiliary trace, wherein the capacitance corresponding to the first auxiliary electrode is less than the capacitance corresponding to the second auxiliary electrode.

[0014] The capacitance between the first auxiliary electrode and the first electrode can be smaller than the capacitance between the second auxiliary electrode and the first electrode.

[0015] The capacitance between the first auxiliary electrode and the 2-1 electrode can be smaller than the capacitance between the second auxiliary electrode and the 2-2 electrode.

[0016] The first substrate capacitance between the first auxiliary electrode and the common electrode of the light-emitting element in the display layer can be smaller than the second substrate capacitance between the second auxiliary electrode and the common electrode.

[0017] The first auxiliary electrode may have a first grid structure, wherein the second auxiliary electrode has a second grid structure, wherein, within a region, the surface area occupied by the first grid structure is greater than the surface area occupied by the second grid structure.

[0018] The first auxiliary electrode may include: a first auxiliary pattern; and an additional auxiliary pattern, on a different layer from the layer where the first auxiliary pattern is positioned, and electrically connected to the first auxiliary pattern.

[0019] The sensor layer may further include an insulating layer, wherein the first electrode includes a first sensing pattern above the insulating layer and a first bridging pattern between the insulating layer and the display layer and connected to the first sensing pattern, wherein the second auxiliary electrode includes a second-first auxiliary electrode and a second-second auxiliary electrode above the second-first auxiliary electrode, the second-first auxiliary electrode being between the insulating layer and the display layer, and wherein the capacitance between the first auxiliary electrode and the first electrode is less than the capacitance between the second auxiliary electrode and the first electrode.

[0020] The insulating layer may include an organic layer.

[0021] The portion of the second auxiliary electrode between the display layer and the insulating layer may have a larger surface area than the portion of the first auxiliary electrode between the display layer and the insulating layer.

[0022] The electronic device may also include a sensor driver configured to drive a sensor layer, wherein the sensor layer further includes: a plurality of third electrodes arranged along a first direction to overlap with a plurality of first electrodes, and wherein the sensor driver is further configured to selectively operate in a first mode for sensing touch input and a second mode for sensing pen input, the second mode including: a charging drive mode in which the sensor driver is configured to provide a first signal to at least one of the plurality of third electrodes and a second signal to at least another of the plurality of third electrodes; and a pen sensing drive mode in which the sensor driver is configured to receive a first receiving signal from the plurality of first electrodes and a second receiving signal from the plurality of second electrodes.

[0023] In one or more embodiments of this disclosure, the electronic device includes: a plurality of first electrodes; a plurality of second electrodes intersecting the plurality of first electrodes; a first auxiliary electrode group including a plurality of first auxiliary electrodes and a first auxiliary trace electrically connected to the plurality of first auxiliary electrodes; and a second auxiliary electrode group having an impedance substantially equal to that of the first auxiliary electrode group, and including a plurality of second auxiliary electrodes and a second auxiliary trace electrically connected to the plurality of second auxiliary electrodes.

[0024] The resistance of the first auxiliary electrode group can be approximately equal to the resistance of the second auxiliary electrode group, and the capacitive reactance of the first auxiliary electrode group can be approximately equal to the capacitive reactance of the second auxiliary electrode group. Alternatively, the first auxiliary electrode group can have a resistance greater than that of the second auxiliary electrode group, and a capacitive reactance smaller than that of the second auxiliary electrode group. Attached Figure Description

[0025] The accompanying drawings are included to provide a further understanding of this disclosure, and are incorporated in and form a part of this specification. The drawings illustrate embodiments of the present disclosure and, together with the description, serve to explain aspects of the disclosure. In the drawings: Figure 1 It is a block diagram of an electronic device according to one or more embodiments; Figure 2A This is a perspective view of an electronic device according to one or more embodiments of the present disclosure; Figure 2B This is a rear perspective view of an electronic device according to one or more embodiments of the present disclosure; Figure 3 This is a perspective view of an electronic device according to one or more embodiments of the present disclosure; Figure 4 This is a perspective view of an electronic device according to one or more embodiments of the present disclosure; Figure 5 This is a schematic cross-sectional view of a display panel according to one or more embodiments of the present disclosure; Figure 6 This is a diagram used to explain the operation of an electronic device according to one or more embodiments of the present disclosure; Figure 7A This is a cross-sectional view of a display panel according to one or more embodiments of the present disclosure; Figure 7B This is a cross-sectional view showing a portion of the components of a sensor layer according to one or more embodiments of the present disclosure; Figure 8 This is a plan view of a sensor layer according to one or more embodiments of the present disclosure; Figure 9A This is a plan view illustrating the first conductive layer of a sensing unit according to one or more embodiments of the present disclosure; Figure 9B yes Figure 9A The enlarged plan view of region XX' shown in the figure; Figure 10A This is a plan view illustrating the second conductive layer of a sensing unit according to one or more embodiments of the present disclosure; Figure 10B yes Figure 10A A magnified view of region YY'; Figure 11 This is a plan view illustrating a portion of the components of a sensing unit according to one or more embodiments of the present disclosure; Figure 12 This is a diagram of capacitors located on the sensor layer according to one or more embodiments of the present disclosure; Figure 13This is a plan view illustrating a portion of the components of a sensor layer according to one or more embodiments of the present disclosure; Figure 14 This is a plan view illustrating a portion of the components of a sensor layer according to one or more embodiments of the present disclosure; Figure 15 This is a plan view illustrating a portion of the components of a sensor layer according to one or more embodiments of the present disclosure; Figure 16A This is a plan view illustrating a portion of the components of a sensor layer according to one or more embodiments of the present disclosure; Figure 16B This is a plan view illustrating a portion of the components of a sensor layer according to one or more embodiments of the present disclosure; Figure 16C This is a cross-sectional view showing a portion of the components of a sensor layer according to one or more embodiments of the present disclosure; Figure 17A This is a plan view illustrating a portion of the components of a sensor layer according to one or more embodiments of the present disclosure; Figure 17B This is a plan view illustrating a portion of the components of a sensor layer according to one or more embodiments of the present disclosure; Figure 17C This is a plan view illustrating a portion of the components of a sensor layer according to one or more embodiments of the present disclosure; Figure 18A This is a plan view illustrating a portion of the components of a sensor layer according to one or more embodiments of the present disclosure; Figure 18B This is a plan view illustrating a portion of the components of a sensor layer according to one or more embodiments of the present disclosure; Figure 19 This is a cross-sectional view showing a portion of the components of a sensor layer and a second electrode according to one or more embodiments of the present disclosure; Figure 20 This is a diagram used to explain the operation of a sensor driver according to one or more embodiments of the present disclosure; Figure 21 This is a diagram used to explain the operation of a sensor driver according to one or more embodiments of the present disclosure; Figure 22 This is a diagram used to explain a first mode according to one or more embodiments of the present disclosure; Figure 23 This is a diagram used to explain a second mode according to one or more embodiments of the present disclosure; Figure 24A It is a graph showing the waveform of a first signal according to one or more embodiments of the present disclosure; Figure 24B It is a graph showing the waveform of a second signal according to one or more embodiments of the present disclosure; Figure 25A A diagram is provided to explain a second mode according to one or more embodiments of the present disclosure; and Figure 25B This is a diagram used to explain a second mode based on a single sensing unit according to one or more embodiments of the present disclosure. Detailed Implementation

[0026] Aspects of some embodiments of this disclosure and methods of implementing them can be more readily understood by referring to the detailed description and accompanying drawings of the embodiments. The described embodiments are provided as examples so that this disclosure will be thorough and complete, and will fully convey aspects of this disclosure to those skilled in the art. Therefore, redundant processes, elements, and techniques that are irrelevant or unrelated to the description of the embodiments or are not essential for a full understanding of aspects of this disclosure by those skilled in the art may be omitted. Unless otherwise stated, the same reference numerals, symbols, or combinations thereof denote the same elements throughout the drawings and written description, and therefore, their repeated description may be omitted.

[0027] The described embodiments may have various modifications and may be implemented in different forms, and should not be construed as being limited to the embodiments shown herein. In describing embodiments, the use of “may,” “can,” or “may not” corresponds to one or more embodiments of this disclosure.

[0028] Those skilled in the art will understand that, in view of the whole of this disclosure, each suitable feature of the various embodiments of this disclosure may be combined in part or in whole, or combined with each other, and may be technically interlocked and operated in a variety of suitable ways, and unless otherwise stated or implied, each embodiment may be implemented independently of each other or in any suitable combination with each other.

[0029] In the accompanying drawings, the relative dimensions of elements, layers, and regions may be exaggerated for clarity and / or descriptive purposes. In other words, the disclosure is not limited thereto because the dimensions and thicknesses of the elements in the drawings are arbitrarily shown for ease of description. Furthermore, crosshairs and / or shading are typically provided in the drawings to clarify the boundaries between adjacent elements. Thus, unless otherwise stated, the presence or absence of crosshairs or shading does not convey or indicate any preference or requirement for the specific material, material properties, dimensions, scale, commonalities and / or any other characteristics, properties, etc., of the elements shown.

[0030] Various embodiments are described herein with reference to sectional views that serve as schematic illustrations of examples and / or intermediate structures. Thus, variations in the shapes shown in the illustrations will be expected due to factors such as manufacturing techniques and / or tolerances. Furthermore, the specific structural or functional descriptions disclosed herein are merely illustrative for the purpose of describing embodiments according to the concept of this disclosure. Therefore, the embodiments disclosed herein should not be construed as limited to the shapes shown for elements, layers, or regions, but will include deviations in shape due to factors such as manufacturing processes.

[0031] For example, an injection region shown as rectangular will typically have circular or curved features at its edges and / or a gradient of injection concentration, rather than a binary variation from the injection region to the non-injection region. Similarly, the buried region formed by injection may result in some injection in the region between the buried region and the surface through which the injection occurs.

[0032] For ease of explanation, spatial relative terms such as “below,” “under,” “lower,” “lower side,” “below,” “above,” “above,” “higher,” “upper side,” “side” (e.g., as in “sidewall”) may be used herein to describe the relationship of one element or feature as shown in the accompanying drawings to another element (or other) element or feature. It will be understood that, in addition to the orientations depicted in the accompanying drawings, the spatial relative terms are intended to cover different orientations of the device in use or operation. For example, if the device in the accompanying drawings is flipped, an element described as “below,” “under,” or “below” other elements or features will subsequently be oriented “above” said other elements or features. Thus, the example terms “below” and “below” can cover both the upper and lower orientations. The device may be oriented in other ways (e.g., rotated 90 degrees or in other orientations), and the spatial relative descriptive terms used herein should be interpreted accordingly. Similarly, when the first part is described as being arranged "on" the second part, this means that the first part is arranged on the upper or lower side of the second part, and is not limited to the upper side of the second part based on the direction of gravity.

[0033] Furthermore, the phrase "in a plan view" means when viewing a portion of the object from above, and the phrase "in a schematic sectional view" means when viewing a schematic section taken by vertically cutting the portion of the object from the side. The term "overlay" or variations thereof means that the first object may be above, below, or to the side of the second object, or vice versa. Furthermore, the term "overlay" can include stacking, facing or oriented, extending over, covering or partially covering, or any other suitable term as will be understood and appreciated by one of ordinary skill in the art. The expression "not overlay" can include meanings such as "spaced apart from," "offset from," or "offset from," and any other suitable equivalent as will be understood and appreciated by one of ordinary skill in the art. The terms "facing" and "oriented" can mean that the first object may be directly or indirectly opposite the second object. In cases where a third object is placed between the first and second objects, the first and second objects, although still facing each other, can be understood as being indirectly opposite each other.

[0034] It will be understood that when an element, layer, region, or component (e.g., device, apparatus, circuit, wiring, electrode, terminal, conductive film, etc.) is referred to as being "formed on," "on," "connected to," or "(operably, functionally, or communicatively) incorporated into" another element, layer, region, or component, the element, layer, region, or component may be directly formed on, directly on, directly connected to, or directly incorporated into the other element, layer, region, or component, or indirectly formed on, indirectly on, indirectly connected to, or indirectly incorporated into the other element, layer, region, or component, such that one or more intermediary elements, layers, regions, or components may exist. Furthermore, this can collectively mean both direct (or indirect) incorporation (or connection) and integral (or non-integral) incorporation (or connection). For example, when a layer, region, or component is referred to as "electrically connected" or "electrically bonded" to another layer, region, or component, the layer, region, or component may be directly electrically connected or directly bonded to the other layer, region, and / or component, or one or more intermediary layers, regions, or components may be present. One or more intermediary components may include switches, transistors, resistors, inductors, capacitors, and / or diodes, etc. Therefore, the connection is not limited to the connections shown in the accompanying drawings or detailed description, and may also include other types of connections. In describing embodiments, unless explicitly described as a direct connection, the expression for connection indicates an electrical connection, and "directly connected / directly bonded" or "directly on..." means that one component is directly connected to or directly bonded to another component, or directly on another component without any intermediate components.

[0035] Furthermore, in this specification, when a portion of a layer, film, region, or plate is formed on another portion, the formation direction is not limited to the upward direction, but includes forming the portion on a side surface or in the downward direction. Conversely, when a portion of a layer, film, region, or plate is formed "below" another portion, this includes not only the case where the portion is "directly below" the other portion, but also the case where there is another portion between the portion and the other portion. Similarly, other expressions describing relationships between components, such as "between," "immediately between," "adjacent to," and "directly adjacent to," can be interpreted similarly. It will be understood that when an element or layer is referred to as "between" two elements or layers, the element or layer may be the only element or layer between the two elements or layers, or there may be one or more intervening elements or layers.

[0036] For the purposes of this disclosure, expressions such as “at least one of…” or “any one of…” or “one or more of…” modify the entire list of elements when following a list of elements, without modifying any individual element in that list. For example, “at least one of X, Y, and Z” and “at least one of the groups consisting of X, Y, and Z” can be interpreted as any combination of only X, only Y, only Z, two or more of X, Y, and Z (e.g., XYZ, XY, YZ, and XZ) or any variation thereof. Similarly, the expression “at least one of A and B” can include A, B, or A and B. As used herein, “or” generally means “and / or”, and the term “and / or” includes any and all combinations of one or more of the associated listed items. For example, the expression “A and / or B” can include A, B, or A and B. Similarly, when expressions such as “at least one of…”, “multiple…”, “one of…”, and other prepositional phrases precede (or follow) a list of elements, they modify the entire list of elements, not individual elements within that list. When stating “C to D”, unless otherwise specified, it means that C is or greater and D is or less.

[0037] It will be understood that although the terms “first,” “second,” “third,” etc., may be used herein to describe various elements, components, regions, layers, and / or parts, these elements, components, regions, layers, and / or parts should not be limited by these terms. These terms do not correspond to a particular order, position, or priority, and are used only to distinguish one element, component, assembly, region, area, layer, segment, or part from another. Therefore, without departing from the spirit and scope of this disclosure, the first element, component, region, layer, or segment described below may be referred to as a second element, component, region, layer, or segment. Describing an element as a “first” element does not require or imply the existence of a second element or other elements. The terms “first,” “second,” etc., may also be used herein to distinguish different categories or sets of elements. For the sake of brevity, the terms “first,” “second,” etc., may respectively represent “first category (or first set),” “second category (or second set),” etc.

[0038] In this example, the x-axis, y-axis, and / or z-axis are not limited to the three axes of a Cartesian coordinate system and can be interpreted in a broader sense. For example, the x-axis, y-axis, and z-axis can be perpendicular to each other, or they can represent different directions that are not perpendicular to each other. The same applies to the first direction DR1, the second direction DR2, and / or the third direction DR3 described below.

[0039] The terminology used herein is for the purpose of describing embodiments only and is not intended to limit this disclosure. As used herein, unless the context clearly indicates otherwise, the singular forms “a” and “an” are intended to include the plural forms as well, and the plural forms are intended to include the singular forms as well. It will also be understood that when the terms “comprising,” “having,” and “including,” and “featuring,” are used in this specification, it indicates the presence of the stated features, integrals, steps, operations, elements, and / or components, but does not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components, and / or groups thereof.

[0040] When one or more embodiments can be implemented differently, a particular process sequence can be performed differently than the described sequence. For example, two consecutively described processes can be performed substantially simultaneously or in the reverse order of their description.

[0041] As used herein, the terms “basically,” “about,” “approximately,” and similar terms are used as approximate terms rather than as terms of degree and are intended to account for inherent deviations in measured or calculated values ​​that would be recognized by those skilled in the art. For example, “basically” can include a range of + / - 5% of the corresponding value. As used herein, “about” or “approximately” includes the stated value and means: within an acceptable deviation range of the specific value as determined by those skilled in the art, taking into account the measurement under discussion and the errors associated with the measurement of the specific quantity (i.e., limitations of the measurement system). For example, “about” can mean within one or more standard deviations, or within ±30%, ±20%, ±10%, ±5% of the stated value. Furthermore, when describing embodiments of this disclosure, the use of “may” refers to “one or more embodiments of this disclosure.” Additionally, the expression “identical” can mean “substantially identical.” In other words, the expression “identical” can include a range that is tolerable by those skilled in the art. Other expressions may also be those from which “basically” has been omitted.

[0042] In some embodiments, well-known structures and arrangements may be described in conjunction with one or more functional blocks (e.g., block diagrams), units, and / or modules in the accompanying drawings to avoid unnecessarily obscuring various embodiments. Those skilled in the art will understand that such blocks, units, and / or modules are physically implemented by logic circuits, discrete components, microprocessors, hardwired circuits, memory elements, wiring connections, and other electronic circuits. This can be formed using semiconductor-based manufacturing techniques or other manufacturing techniques. Blocks, units, and / or modules implemented by microprocessors or other similar hardware can be programmed and controlled using software to perform the various functions discussed herein, optionally driven by firmware and / or software. Additionally, each block, unit, and / or module may be implemented by dedicated hardware or a combination of dedicated hardware performing some functions and processors performing functions different from those of the dedicated hardware (e.g., one or more programmed microprocessors and associated circuitry). Furthermore, in some embodiments, blocks, units, and / or modules may be physically separated into two or more interacting individual blocks, units, and / or modules without departing from the scope of this disclosure. In addition, in some embodiments, blocks, units and / or modules may be physically combined into more complex blocks, units and / or modules without departing from the scope of this disclosure.

[0043] Unless otherwise defined, all terms used herein (including technical and scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. It will also be understood that terms (such as those defined in common dictionaries) shall be interpreted as having the same meaning as they have in the context of the relevant field and / or in this specification, and shall not be interpreted in an idealized or overly formal sense unless expressly defined herein.

[0044] In the following description, embodiments of the present disclosure are illustrated with reference to the accompanying drawings.

[0045] Figure 1 This is a block diagram of an electronic device 1000 according to one or more embodiments.

[0046] Reference Figure 1 The electronic device 1000 may include a display module 11, a processor 12, a memory 13, and a power module 14.

[0047] Display module 11 can display images. Images may include both moving images and still images. Processor 12 may include at least one of a central processing unit (CPU), application processor (AP), graphics processing unit (GPU), communication processor (CP), image signal processor (ISP), and controller. Processor 12 can be configured to control the operation of display module 11.

[0048] The memory 13 can store the data information required for the operation of the processor 12 or the display module 11. When the processor 12 executes the application stored in the memory 13, image data signals and / or input control signals can be transmitted to the display module 11, and the display module 11 can process the received signals to output image information through the display screen.

[0049] The power module 14 may include a power module (such as a power adapter or battery device) and a power conversion module that converts the power supplied by the power module to generate the power required for the operation of the electronic device 1000.

[0050] Figure 2A This is a perspective view of an electronic device 1000 according to one or more embodiments of the present disclosure. Figure 2B This is a rear perspective view of an electronic device 1000 according to one or more embodiments of the present disclosure.

[0051] Reference Figure 2A and Figure 2B The electronic device 1000 can be a device activated in response to an electrical signal. For example, the electronic device 1000 can display an image and sense input applied from an external source. The external input can be user input. User input can include various types of external input (such as a part of the user's body, a pen, light, heat, or pressure).

[0052] The electronic device 1000 may include a first display panel DP1 and a second display panel DP2. The first display panel DP1 and the second display panel DP2 may be separate and independent panels. The first display panel DP1 may be referred to as the main display panel, and the second display panel DP2 may be referred to as the auxiliary display panel or the external display panel.

[0053] The first display panel DP1 may include a first display area DA1-F, and the second display panel DP2 may include a second display area DA2-F. The second display panel DP2 may have a smaller surface area than the first display panel DP1. The first display area DA1-F may have a larger surface area than the second display area DA2-F, corresponding to the dimensions of the first display panel DP1 and the second display panel DP2.

[0054] When the electronic device 1000 is in the unfolded state, the first display area DA1-F may have a plane substantially parallel to the first direction DR1 and the second direction DR2. The thickness direction of the electronic device 1000 may be parallel to a third direction DR3 that intersects the first direction DR1 and the second direction DR2. Therefore, the front surface (or top surface) and rear surface (or bottom surface) of the components constituting the electronic device 1000 may be defined by the third direction DR3.

[0055] The first display panel DP1 or the first display area DA1-F may include a foldable area FA that can be folded and unfolded, and a plurality of non-foldable areas NFA1 and NFA2 spaced apart from each other with the foldable area FA located therebetween. The second display panel DP2 may be stacked with any one of the plurality of non-foldable areas NFA1 and NFA2. For example, the second display panel DP2 may be stacked with the first non-foldable area NFA1.

[0056] The display orientation of the first image IM1a displayed in a portion of the first display panel DP1 (e.g., in the second non-folded region NFA2) and the display orientation of the second image IM2a displayed in the second display panel DP2 can be opposite. For example, the first image IM1a can be displayed on a third direction DR3, and the second image IM2a can be displayed on a fourth direction DR4, which is opposite to the third direction DR3.

[0057] In one or more embodiments of this disclosure, the folding region FA may be bent about a folding axis extending in a direction parallel to the long side of the electronic device 1000 (e.g., in a direction parallel to the second direction DR2). When the electronic device 1000 is in a folded state, the folding region FA may have a corresponding curvature and radius of curvature. The first non-folding region NFA1 and the second non-folding region NFA2 may face each other, and the electronic device 1000 may fold inward so that the first display region DA1-F is not exposed to the outside.

[0058] In one or more embodiments of this disclosure, the electronic device 1000 may be folded outwards, exposing the first display area DA1-F to the outside. In one or more embodiments of this disclosure, the electronic device 1000 may be capable of both folding inwards and outwards in an unfolded state; however, it is not limited thereto.

[0059] Figure 2A An example is shown in which a single folding region FA is defined (set or included) in the electronic device 1000, but it is not limited thereto. For example, multiple folding axes and multiple folding regions corresponding to the multiple folding axes may be defined in the electronic device 1000, and the electronic device 1000 may fold inward or outward in each of the multiple folding regions in an unfolded state.

[0060] According to one or more embodiments of this disclosure, at least one of the first display panel DP1 and the second display panel DP2 can sense the input of the pen PN even without a digitizer. Therefore, since the digitizer for sensing the pen PN can be omitted, there is no increase in the thickness and weight of the electronic device 1000 or a decrease in its flexibility due to the addition of a digitizer. Therefore, both the first display panel DP1 and the second display panel DP2 can be designed to sense the pen PN.

[0061] Figure 3 This is a perspective view of an electronic device 1000-1 according to one or more embodiments of the present disclosure. Figure 4 This is a perspective view of an electronic device 1000-2 according to one or more embodiments of the present disclosure.

[0062] For example, Figure 3 An example is shown in which electronic device 1000-1 is a candybar mobile phone, and electronic device 1000-1 may include a display panel DP. Figure 4 An example of an electronic device 1000-2 being a laptop computer is illustrated, and the electronic device 1000-2 may include a display panel DP. Figure 4 This is a perspective view of electronic device 1000-2; however, it includes... Figure 4 The coordinate axes are based on the DP indication of the display panel within the electronic device 1000-2.

[0063] In one or more embodiments of this disclosure, the display panel DP can sense input applied from an external source. External input can be user input. User input can include various types of external input (such as a part of the user's body, a pen PN, etc.). Figure 2A (light, heat, or pressure).

[0064] According to one or more embodiments of this disclosure, the display panel DP can sense the input of the pen PN even without a digitizer. Therefore, since the digitizer for sensing the pen PN can be omitted, there is no increase in the thickness and weight of the electronic device 1000-1 or 1000-2 due to the addition of a digitizer.

[0065] For example, Figure 2A A foldable electronic device 1000 is shown, and Figure 3 A flat-panel electronic device 1000-1 is shown, but the present disclosure described below is not limited thereto. For example, the following description can be applied to various electronic devices (such as rollable electronic devices, sliding electronic devices, or retractable electronic devices).

[0066] Figure 5 This is a schematic cross-sectional view of a display panel DP according to one or more embodiments of the present disclosure.

[0067] Reference Figure 5 The display panel DP may include a display layer 100 and a sensor layer 200. Upper functional components may be further positioned on the sensor layer 200. For example, the upper functional components may include at least one of an anti-reflective layer, a window, and a protective film.

[0068] Display layer 100 may be a substantial component for generating an image. Display layer 100 may include a light-emitting display layer. For example, display layer 100 may include an organic light-emitting display layer, an inorganic light-emitting display layer, an organic-inorganic light-emitting display layer, a quantum dot display layer, a micro-LED display layer, and a nano-LED display layer. Display layer 100 may include a substrate layer 110, a circuit layer 120, a light-emitting element layer 130, and an encapsulation layer 140.

[0069] The substrate layer 110 may be a component providing a substrate surface on which the circuit layer 120 is positioned. The substrate layer 110 may have a multilayer structure or a single-layer structure. The substrate layer 110 may be a glass substrate, a metal substrate, a silicon substrate, or a polymer substrate, but is not particularly limited thereto.

[0070] The circuit layer 120 may be located on the substrate layer 110. The circuit layer 120 may include insulating layers, semiconductor patterns, conductive patterns, and signal lines, etc. The insulating layer, semiconductor layer, and conductive layer may be disposed on the substrate layer 110 by coating or deposition methods, and subsequently, the insulating layer, semiconductor layer, and conductive layer may be selectively patterned by multiple photolithography processes.

[0071] The light-emitting element layer 130 may be located on the circuit layer 120. The light-emitting element layer 130 may include light-emitting elements. For example, the light-emitting element layer 130 may include organic light-emitting materials, inorganic light-emitting materials, organic-inorganic light-emitting materials, quantum dots, quantum rods, micro LEDs, or nano LEDs, etc.

[0072] The encapsulation layer 140 may be located on the light-emitting element layer 130. The encapsulation layer 140 can protect the light-emitting element layer 130 from foreign matter such as moisture, oxygen and dust particles.

[0073] Sensor layer 200 may be located on display layer 100. Sensor layer 200 can sense external input applied from an external source. Sensor layer 200 may be an integrated sensor continuously disposed during the manufacturing process of display layer 100, or an external sensor attached to display layer 100. Sensor layer 200 may be referred to as a sensor, input sensing layer, input sensing panel, or electronics for input coordinate sensing.

[0074] According to one or more embodiments of this disclosure, sensor layer 200 can sense both input from a passive input device (such as a user's body) and input from an input device that generates a magnetic field with a corresponding resonant frequency. The input device may be referred to as a pen, input pen, magnetic pen, stylus, or electromagnetic resonant pen.

[0075] Figure 6 This is a diagram used to explain the operation of an electronic device 1000 according to one or more embodiments of the present disclosure.

[0076] Reference Figure 6 The electronic device 1000 may include a display layer 100, a sensor layer 200, a display driver 100C, a sensor driver 200C, a main driver 1000C, and a power circuit 1000P.

[0077] Sensor layer 200 can sense a first input 2000 or a second input 3000 applied from an external source. Both the first input 2000 and the second input 3000 can be input devices capable of providing capacitance changes to sensor layer 200 or input devices capable of sensing eddy currents in sensor layer 200. For example, the first input 2000 can be an input from a passive input device (such as a user's body). The second input 3000 can be an input from a pen PN or an RFIC (Radio Frequency Integrated Circuit) tag. For example, the pen PN can be a passive pen or an active pen.

[0078] In one or more embodiments of this disclosure, the pen PN can be a device that generates a magnetic field corresponding to a resonant frequency. The pen PN can be configured to transmit an output signal based on an electromagnetic resonance method. The pen PN can be referred to as an input device, an input pen, a magnetic pen, a stylus, or an electromagnetic resonant pen.

[0079] The PN can include an RLC resonant circuit, which can include an inductor L and a capacitor C. In one or more embodiments of this disclosure, the RLC resonant circuit can be a variable resonant circuit that changes the resonant frequency. In this case, the inductor L can be a variable inductor and / or the capacitor C can be a variable capacitor, but is not particularly limited thereto.

[0080] Inductor L can generate current due to a magnetic field produced in electronic device 1000 (e.g., in sensor layer 200). However, it is not particularly limited to this. For example, when pen PN operates in an active mode, pen PN can generate current even without receiving a magnetic field from an external source. The generated current can be supplied to capacitor C. Capacitor C can be charged with the current input from inductor L and discharge the charged current back to inductor L. Subsequently, inductor L can emit a magnetic field at a resonant frequency. The magnetic field emitted by pen PN can induce current in sensor layer 200, and the induced current can be transmitted as a received signal (or sensing signal or signal) to sensor driver 200C.

[0081] The main driver 1000C can control the overall operation of the electronic device 1000. For example, the main driver 1000C can control the operation of the display driver 100C and the sensor driver 200C. The main driver 1000C may include at least one microprocessor and may also include a graphics controller. The main driver 1000C may be referred to as an application processor, a central processing unit, or a main processor.

[0082] Display driver 100C can drive display layer 100. Display driver 100C can receive image data and control signals from main driver 1000C. Control signals can include various signals. For example, control signals can include input vertical sync signal, input horizontal sync signal, master clock signal, and data enable signal.

[0083] Sensor driver 200C can drive sensor layer 200. Sensor driver 200C can receive image data and control signals from main driver 1000C. Control signals may include clock signals for sensor driver 200C. In addition, control signals may also include mode determination signals that determine the driving mode of sensor driver 200C and sensor layer 200.

[0084] The sensor driver 200C can be implemented as an integrated circuit (IC) and can be electrically connected to the sensor layer 200. For example, the sensor driver 200C can be directly mounted on the display panel DP (see...). Figure 5 On the corresponding area of ​​the sensor, or mounted on a separate printed circuit board using the chip-on-film (COF) method to be electrically connected to the sensor layer 200.

[0085] The sensor driver 200C and the sensor layer 200 can selectively operate in either a first mode or a second mode. For example, the first mode can be a mode for sensing touch input (such as a first input 2000). The second mode can be a mode for sensing pen PN input (such as a second input 3000). The first mode can be referred to as a touch sensing mode, and the second mode can be referred to as a pen sensing mode.

[0086] The transition between the first mode and the second mode can be performed in various ways. For example, the sensor driver 200C and the sensor layer 200 can be time-division driven in both the first and second modes to sense the first input 2000 and the second input 3000. Optionally, the transition between the first mode and the second mode can occur based on a user's selection or corresponding action (or input), or it can be activated, deactivated, or switched from one mode to another based on the activation state of the corresponding application. Optionally, when the sensor driver 200C and the sensor layer 200 operate alternately in the first and second modes, the first mode can be maintained when the first input 2000 is sensed, or the second mode can be maintained when the second input 3000 is sensed.

[0087] The sensor driver 200C can calculate the input coordinate information based on the signal received from the sensor layer 200, and can provide the coordinate signal containing the coordinate information to the main driver 1000C. The main driver 1000C can perform an operation corresponding to the user input based on the coordinate signal. For example, the main driver 1000C can operate the display driver 100C to display a new application image on the display layer 100.

[0088] The power circuit 1000P may include a power management integrated circuit (PMIC). The power circuit 1000P may generate multiple driving voltages for driving the display layer 100, the sensor layer 200, the display driver 100C, and the sensor driver 200C. For example, the multiple driving voltages may include a gate high voltage, a gate low voltage, a first driving voltage, a second driving voltage, and an initialization voltage, but are not particularly limited thereto.

[0089] Figure 7A This is a cross-sectional view of a display panel DP according to one or more embodiments of the present disclosure.

[0090] Reference Figure 7AAt least one buffer layer BFL may be located on the top surface of the substrate layer 110. The buffer layer BFL can enhance the adhesion between the substrate layer 110 and the semiconductor pattern. The buffer layer BFL can be configured as a multilayer structure. Optionally, the display layer 100 may also include a barrier layer. The buffer layer BFL may include at least one of silicon oxide, silicon nitride, and silicon oxynitride. For example, the buffer layer BFL may include a structure in which silicon oxide layers and silicon nitride layers are alternately stacked.

[0091] Semiconductor patterns SC, AL, DR, and SCL can be located on the buffer layer BFL. Semiconductor patterns SC, AL, DR, and SCL can include polycrystalline silicon. However, they are not limited to this; semiconductor patterns SC, AL, DR, and SCL can also include amorphous silicon, low-temperature polycrystalline silicon, or oxide semiconductors.

[0092] Figure 7A Only a portion of the semiconductor patterns SC, AL, DR, and SCL are shown, and additional semiconductor patterns may be located in other regions. The semiconductor patterns SC, AL, DR, and SCL may be distributed throughout the pixels in a corresponding pattern arrangement. The electrical properties of the semiconductor patterns SC, AL, DR, and SCL may vary depending on whether doping is applied. The semiconductor patterns SC, AL, DR, and SCL may include a first region SC, DR, and SCL with high conductivity and a second region AL with low conductivity. The first regions SC, DR, and SCL may be doped with N-type or P-type dopant. A P-type transistor may include a doped region doped with P-type dopant, and an N-type transistor may include a doped region doped with N-type dopant. The second region AL may be an undoped region or a region doped at a lower concentration compared to the first regions SC, DR, and SCL.

[0093] The conductivity of the first regions SC, DR, and SCL can be greater than that of the second region AL, and can be used as electrodes or signal lines. The second region AL can substantially correspond to the active region AL (or channel) of transistor 100PC. In other words, a portion of AL in the semiconductor patterns SC, AL, DR, and SCL can be used as the active region AL of transistor 100PC, another portion of SC and DR can be used as the source region SC and drain region DR of transistor 100PC, and yet another portion of SCL can be used as a connection electrode or a connection signal line SCL.

[0094] Each pixel can have an equivalent circuit including multiple transistors, at least one capacitor, and at least one light-emitting element, and the equivalent circuit of a pixel can be modified into various shapes. For example, Figure 7A The image shows a transistor 100PC and a light-emitting element 100PE included in a pixel.

[0095] The source region SC, active region AL, and drain region DR of transistor 100PC can be formed by semiconductor patterns SC, AL, DR, and SCL. The source region SC and drain region DR can extend from the active region AL in opposite directions in the cross-section. Figure 7A A portion of the connection signal line SCL, arranged by semiconductor patterns SC, AL, DR, and SCL, is shown. In one or more embodiments, in a plan view, the connection signal line SCL may be connected to the drain region DR of transistor 100PC.

[0096] The first insulating layer 10 may be located on the buffer layer BFL (as used herein, "located on" can mean "above"). The first insulating layer 10 may be stacked across multiple pixels and may cover semiconductor patterns SC, AL, DR, and SCL. The first insulating layer 10 may be an inorganic layer and / or an organic layer and may have a single-layer or multi-layer structure. The first insulating layer 10 may include at least one of aluminum oxide, titanium oxide, silicon oxide, silicon nitride, silicon oxynitride, zirconium oxide, and hafnium oxide. The first insulating layer 10 may be a single-layer silicon oxide layer. In addition to the first insulating layer 10, the insulating layers of the circuit layer 120, which will be described later, may be inorganic layers and / or organic layers and may have a single-layer or multi-layer structure. Inorganic layers may include at least one of the materials described above, and this disclosure is not limited thereto.

[0097] The gate GT of transistor 100PC may be located on the first insulating layer 10. The gate GT may be part of a metal pattern. The gate GT may be stacked with the active region AL. During processes used to dope or reduce semiconductor patterns SC, AL, DR, and SCL, the gate GT may be used as a mask.

[0098] The second insulating layer 20 may be located on the first insulating layer 10 and may cover the gate GT. The second insulating layer 20 may be stacked commonly with multiple pixels. The second insulating layer 20 may be an inorganic layer and / or an organic layer, and may have a single-layer structure or a multilayer structure. The second insulating layer 20 may include at least one of silicon oxide, silicon nitride, and silicon oxynitride. The second insulating layer 20 may have a multilayer structure including a silicon oxide layer and a silicon nitride layer.

[0099] The third insulating layer 30 may be located on the second insulating layer 20. The third insulating layer 30 may have a single-layer structure or a multi-layer structure. For example, the third insulating layer 30 may have a multi-layer structure including a silicon oxide layer and a silicon nitride layer.

[0100] The first connection electrode CNE1 can be located on the third insulating layer 30. The first connection electrode CNE1 can be connected to the connection signal line SCL through the contact hole CNT-1 that penetrates the first insulating layer 10, the second insulating layer 20 and the third insulating layer 30.

[0101] The fourth insulating layer 40 may be located on the third insulating layer 30. The fourth insulating layer 40 may be a single layer of silicon oxide. The fifth insulating layer 50 may be located on the fourth insulating layer 40. The fifth insulating layer 50 may be an organic layer.

[0102] The second connecting electrode CNE2 can be located on the fifth insulating layer 50. The second connecting electrode CNE2 can be connected to the first connecting electrode CNE1 through the contact hole CNT-2 passing through the fourth insulating layer 40 and the fifth insulating layer 50.

[0103] The sixth insulating layer 60 may be located on the fifth insulating layer 50 and cover the second connecting electrode CNE2. The sixth insulating layer 60 may be an organic layer.

[0104] The light-emitting element layer 130 may be located on the circuit layer 120. The light-emitting element layer 130 may include a light-emitting element 100PE. For example, the light-emitting element layer 130 may include organic light-emitting materials, inorganic light-emitting materials, organic-inorganic light-emitting materials, quantum dots, quantum rods, micro-LEDs, or nano-LEDs, etc. In the following description, by way of example, the light-emitting element 100PE is described as an organic light-emitting element, but is not particularly limited thereto.

[0105] The light-emitting element 100PE may include a first electrode AE, an emitting layer EL, and a second electrode CE.

[0106] The first electrode AE ​​can be located on the sixth insulating layer 60. The first electrode AE ​​can be connected to the second connecting electrode CNE2 through the contact hole CNT-3 that penetrates the sixth insulating layer 60.

[0107] The pixel defining layer 70 may be located on the sixth insulating layer 60 and may cover a portion of the first electrode AE. An opening 70-OP may be defined in the pixel defining layer 70. The opening 70-OP of the pixel defining layer 70 exposes at least a portion of the first electrode AE.

[0108] First display area DA1-F (see...) Figure 2A The electrode may include an emitting region PXA and a non-emitting region NPXA adjacent to the emitting region PXA. The non-emitting region NPXA may surround the emitting region PXA. The emitting region PXA is defined to correspond to the portion of the first electrode AE ​​exposed through the opening 70-OP.

[0109] The emitter layer EL can be located on the first electrode AE. The emitter layer EL can be located in the region corresponding to the opening 70-OP. For example, Figure 7AAn example in which the emission layer EL is located in the opening 70-OP is illustrated, but is not particularly limited thereto. For example, the emission layer EL may extend to cover a portion of the side surface of the defining opening 70-OP of the pixel defining layer 70 and a portion of the top surface of the pixel defining layer 70.

[0110] In one or more embodiments of this disclosure, the emission layer EL can be individually included in each pixel. When the emission layer EL is individually disposed within each pixel, each emission layer EL can emit light of at least one color selected from blue, red, and green. However, the emission layer EL is not limited to this, and the emission layer EL can have a monolithic shape and can be commonly included in multiple pixels. In this case, the emission layer EL can provide blue light or white light.

[0111] The second electrode CE can be located on the emitter layer EL. The second electrode CE can have a monolithic shape and can be commonly included in multiple pixels.

[0112] In one or more embodiments of this disclosure, a hole control layer may be located between the first electrode AE ​​and the emitter layer EL. The hole control layer may be commonly located in the emitter region PXA and the non-emitter region NPXA. The hole control layer may include a hole transport layer and may also include a hole injection layer. An electron control layer may be located between the emitter layer EL and the second electrode CE. The electron control layer may include an electron transport layer and may also include an electron injection layer. The hole control layer and the electron control layer may be co-located on multiple pixels using an aperture mask or inkjet printing process.

[0113] Encapsulation layer 140 may be located on light-emitting element layer 130. Encapsulation layer 140 may include inorganic layers, organic layers, and inorganic layers stacked in the order of inorganic layer, organic layer, and inorganic layer, but the layers constituting encapsulation layer 140 are not limited thereto. The inorganic layer may protect light-emitting element layer 130 from moisture and oxygen, and the organic layer may protect light-emitting element layer 130 from foreign matter such as dust particles. The inorganic layer may include a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer. The organic layer may include an acrylic organic layer, but this disclosure is not limited thereto.

[0114] The sensor layer 200 may include a substrate insulating layer 201, a first conductive layer 202, an intermediate insulating layer 203, a second conductive layer 204, and a cover insulating layer 205.

[0115] The substrate insulating layer 201 may be an inorganic layer comprising at least one of silicon nitride, silicon oxynitride, and silicon oxide. Optionally, the substrate insulating layer 201 may be an organic layer comprising epoxy resin, acrylic resin, or imide resin. The substrate insulating layer 201 may have a single-layer structure or a multilayer structure stacked along the third direction DR3. In one or more embodiments of this disclosure, the sensor layer 200 may not include the substrate insulating layer 201.

[0116] Each of the first conductive layer 202 and the second conductive layer 204 may have a single-layer structure or a multi-layer structure in which the layers are stacked on a third-direction DR3.

[0117] Each of the first conductive layer 202 and the second conductive layer 204 in the monolayer structure may include a metal layer or a transparent conductive layer. The metal layer may include molybdenum, silver, titanium, copper, aluminum, or alloys thereof. The transparent conductive layer may include a transparent conductive oxide (such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), or indium zinc tin oxide (IZTO)). Alternatively, the transparent conductive layer may include a conductive polymer (such as poly(3,4-ethylenedioxythiophene)PEDOT), metal nanowires, or graphene.

[0118] Each of the first conductive layer 202 and the second conductive layer 204 in the multilayer structure may include a metal layer. The metal layer may have a three-layer structure, such as titanium / aluminum / titanium. The conductive layer having a multilayer structure may include at least one metal layer and at least one transparent conductive layer.

[0119] In one or more embodiments of this disclosure, the first conductive layer 202 may have a thickness greater than that of the second conductive layer 204. When the thickness of the first conductive layer 202 is greater than that of the second conductive layer 204, the resistance of components (such as electrodes, patterns, or bridging patterns) included in the first conductive layer 202 can be reduced. Furthermore, because the first conductive layer 202 is located below the second conductive layer 204, even if the thickness of the first conductive layer 202 is increased, the probability of visually recognizing components included in the first conductive layer 202 due to external light reflection is likely lower than the probability of visually recognizing components in the second conductive layer 204 due to external light reflection.

[0120] At least one of the intermediate insulating layer 203 and the covering insulating layer 205 may include an inorganic film. The inorganic film may include at least one of alumina, titanium oxide, silicon oxide, silicon nitride, silicon oxynitride, zirconium oxide, and hafnium oxide.

[0121] At least one of the intermediate insulating layer 203 and the cover insulating layer 205 may include an organic film. The organic film may include at least one of acrylic resin, methacrylic resin, polyisoprene, vinyl resin, epoxy resin, urethane resin, cellulose resin, silicone resin, polyimide resin, polyamide resin, and perylene resin.

[0122] Previously, as an example, sensor layer 200 was described as including a first conductive layer 202 and a second conductive layer 204 (meaning a total of two conductive layers), but it is not particularly limited thereto. For example, sensor layer 200 may include three or more conductive layers.

[0123] Figure 7B This illustrates a sensor layer 200 according to one or more embodiments of the present disclosure (see...). Figure 7A A sectional view of a portion of ( ).

[0124] Reference Figure 7A and Figure 7B The second width 204wt of the second grid line MS2 included in the second conductive layer 204 can be equal to or greater than the first width 202wt of the first grid line MS1 included in the first conductive layer 202. When the user USR views the first grid line MS1 and the second grid line MS2 from the side, because the first grid line MS1 has a smaller first width 202wt than the second grid line MS2, the probability of the first grid line MS1 being visually recognized by the user USR can be reduced.

[0125] Each of the first grid line MS1 and the second grid line MS2 may include a first metal layer M1 and a second metal layer M2 located between the first metal layers M1. For example, the first metal layer M1 may include titanium (Ti), and the second metal layer M2 may include aluminum (Al). However, this is merely an example and is not particularly limited thereto.

[0126] In one or more embodiments of this disclosure, the first thickness TK1 of the second metal layer M2 of the first grid line MS1 and the second thickness TK2 of the second metal layer M2 of the second grid line MS2 may be substantially the same, but are not particularly limited thereto. For example, the first thickness TK1 may be greater than the second thickness TK2. Optionally, the second thickness TK2 may be greater than the first thickness TK1. In one or more embodiments of this disclosure, each of the first thickness TK1 and the second thickness TK2 may be about 1000 Å or greater, for example, it may be about 6000 Å or greater.

[0127] Figure 8 This is a plan view of sensor layer 200 according to one or more embodiments of the present disclosure.

[0128] Reference Figure 8A sensing region 200A and an adjacent peripheral region 200NA can be defined in the sensor layer 200.

[0129] The sensor layer 200 may include a plurality of first electrodes 210, a plurality of second electrodes 220, a plurality of third electrodes 230, a first auxiliary electrode group 240G1, and a second auxiliary electrode group 240G2. In one or more embodiments of this disclosure, the sensor layer 200 may not include the third electrodes 230.

[0130] Each of the first electrodes 210 may intersect with a second electrode 220. Each of the first electrodes 210 may extend along a second direction DR2, and the first electrodes 210 may be arranged spaced apart from each other in a first direction DR1. Each of the second electrodes 220 may extend along the first direction DR1, and the second electrodes 220 may be arranged spaced apart from each other in the second direction DR2. The sensing unit SU of the sensor layer 200 may be a region in which a first electrode 210 and a second electrode 220 intersect.

[0131] Figure 8 Six first electrodes 210, ten second electrodes 220 and sixty sensing units SU are shown, but the number of first electrodes 210 and second electrodes 220 is not limited to this.

[0132] Each of the third electrodes 230 may extend along the second direction DR2, and the third electrodes 230 may be arranged spaced apart from each other in the first direction DR1. A third electrode 230 may at least partially overlap with a first electrode 210. According to one or more embodiments of the present disclosure, the capacitance (or coupling capacitance) between the first electrode 210 and the third electrode 230 can be controlled by adjusting the overlapping surface area between the first electrode 210 and the third electrode 230.

[0133] In one or more embodiments of this disclosure, at least a portion of the third electrode 230 may be connected in parallel. For example, in Figure 8 In this example, two third electrodes 230 are connected in parallel to provide a first electrode group 230pc, and three first electrode groups 230pc can be arranged along a first direction DR1. However, the number of third electrodes 230 constituting a first electrode group 230pc is not limited thereto. For example, a first electrode group 230pc may include only one third electrode 230 or may include three or more third electrodes 230.

[0134] As the number of third electrodes 230 included in and connected in parallel with the first electrode group 230pc increases, the resistance of the first electrode group 230pc can be reduced, thereby improving power efficiency and enhancing sensing sensitivity. Conversely, as the number of third electrodes 230 included in the first electrode group 230pc decreases, the toroidal coil pattern made using the first electrode group 230pc can be implemented in a more diverse manner.

[0135] The first auxiliary electrode group 240G1 may include a plurality of first auxiliary electrodes 240-1 arranged along the second direction DR2 and a first auxiliary trace 240-1t electrically connected to the plurality of first auxiliary electrodes 240-1. The second auxiliary electrode group 240G2 may include a plurality of second auxiliary electrodes 240-2 arranged along the second direction DR2 and a second auxiliary trace 240-2t electrically connected to the plurality of second auxiliary electrodes 240-2.

[0136] The first auxiliary electrode 240-1 and the second auxiliary electrode 240-2 may be stacked at least partially with the second electrode 220 in a one-to-one correspondence. According to one or more embodiments of the present disclosure, the capacitance (or coupling capacitance) between the second electrode 220 and the auxiliary electrode 240-1 or 240-2 can be controlled by adjusting the stacked surface area between the second electrode 220 and the auxiliary electrode 240-1 or 240-2.

[0137] The sensor layer 200 may further include multiple first traces 210t arranged in the peripheral region 200NA, multiple first pads (or "soldering pads") PD1 connected to the first traces 210t in a one-to-one correspondence, multiple second traces 220t, and multiple second pads PD2 connected to the second traces 220t in a one-to-one correspondence. The first traces 210t may be electrically connected to the first electrode 210 in a one-to-one correspondence. The second traces 220t may be electrically connected to the second electrode 220 in a one-to-one correspondence.

[0138] The sensor layer 200 may also include a first annular trace 230rt1 arranged in the peripheral region 200NA, a plurality of third pads PD3 connected to the ends of the first annular trace 230rt1 (e.g., one end and the other end, or the first end and the second end), a fourth-1 pad PD4-1 connected to the first auxiliary trace 240-1t, a fourth-2 pad PD4-2 connected to the second auxiliary trace 240-2t, a second annular trace 230rt2, and a fifth pad PD5 connected to the second annular trace 230rt2 in a one-to-one correspondence.

[0139] The first annular trace 230rt1 may be electrically connected to the third electrode 230. In one or more embodiments of this disclosure, the first annular trace 230rt1 may be electrically connected to all of the third electrodes 230. The first annular trace 230rt1 may extend along a first direction DR1 and may include a first line portion 231t electrically connected to the third electrode 230, a second line portion 232t extending from a first end of the first line portion 231t along a second direction DR2, and a third line portion 233t extending from a second end of the first line portion 231t along the second direction DR2.

[0140] In one or more embodiments of this disclosure, each of the second wire portion 232t and the third wire portion 233t may have substantially the same resistance as one of the third electrodes 230. Therefore, the second wire portion 232t and the third wire portion 233t can be used as the third electrode 230, achieving the same effect as if the third electrode 230 were also arranged in the peripheral region 200NA. For example, the second wire portion 232t or the third wire portion 233t together with one of the third electrodes 230 can form a coil. Therefore, the pen PN (see [reference]) located in the region adjacent to the peripheral region 200NA... Figure 6 It can be fully charged through a circuit including the second line portion 232t or the third line portion 233t.

[0141] In one or more embodiments of this disclosure, the widths of the second line portion 232t and the third line portion 233t in the first direction DR1 can be adjusted to control the resistance of the second line portion 232t and the third line portion 233t. However, this is merely an example, and the first line portion 231t, the second line portion 232t, and the third line portion 233t may have substantially the same width.

[0142] The second annular trace 230rt2 can be connected to the first electrode group 230pc in a one-to-one correspondence. That is, the number of second annular traces 230rt2 can correspond to the number of first electrode groups 230pc. Figure 8 The image shows three second annular traces 230rt2 and three first electrode groups 230pc.

[0143] In one or more embodiments of this disclosure, the second annular trace 230rt2 and the fifth pad PD5 may be omitted, as may the charging operation mode for charging the pen PN. In this case, the sensor layer 200 can sense the input of an active pen capable of emitting a magnetic field even if the sensor layer 200 does not provide a magnetic field.

[0144] The first auxiliary trace 240-1t and the second auxiliary trace 240-2t can be arranged in the peripheral region 200NA and can be spaced apart from each other, with the sensing region 200A located between the first auxiliary trace 240-1t and the second auxiliary trace 240-2t. Within the peripheral region 200NA, a pad region PDA can be defined, in which the first pad PD1, the second pad PD2, the third pad PD3, the fourth-1st pad PD4-1, the fourth-2nd pad PD4-2, and the fifth pad PD5 are arranged. The second auxiliary electrode 240-2 can (e.g., along the second direction DR2) be located between the first auxiliary electrode 240-1 and the pad region PDA.

[0145] The mutual capacitance between the first electrode 210 and the second electrode 220 can vary due to the first auxiliary electrode group 240G1 and the second auxiliary electrode group 240G2. For example, the mutual capacitance can vary due to the coupling between the first auxiliary electrode group 240G1 and the first electrode 210, and also due to the coupling between the second auxiliary electrode group 240G2 and the first electrode 210. The deviation in the amount of change in mutual capacitance can increase as the difference in resistance between the first auxiliary electrode group 240G1 and the second auxiliary electrode group 240G2 increases. Furthermore, the deviation in the amount of change in mutual capacitance may be further exacerbated by rapid temperature changes, which could lead to touch malfunction.

[0146] According to one or more embodiments of this disclosure, the first auxiliary electrode group 240G1 may have the same impedance as the second auxiliary electrode group 240G2. In this case, the deviation in the amount of mutual capacitance change caused by the first auxiliary electrode group 240G1 and the second auxiliary electrode group 240G2 can be reduced or minimized. As the deviation decreases, the probability of touch failure can be reduced or eliminated. As a result, the touch reliability of the sensor layer 200 can be improved.

[0147] Figure 9A This illustrates a sensing unit SU according to one or more embodiments of the present disclosure (see...). Figure 8 A plan view of the first conductive layer SU202. Figure 9B yes Figure 9A The enlarged plan view of region XX' shown. Figure 10A This illustrates a sensing unit SU according to one or more embodiments of the present disclosure (see...). Figure 8 A plan view of the second conductive layer SU204. Figure 10B yes Figure 10A A magnified view of region YY'.

[0148] exist Figure 9A and Figure 10A In the diagram, the shape of the grid structure is not shown, and the boundaries of each component are simply indicated by lines. That is to say, Figure 9A and Figure 10AThe lines shown can correspond to those cut by... Figure 9B and Figure 10B The cutting lines are obtained by the mesh structure shown, and in Figure 9B and Figure 10B In the diagram, the cutting line is shown as a dashed line.

[0149] Figure 8 , Figure 9A , Figure 9B , Figure 10A and Figure 10B The shape of the sensing unit SU shown is merely an example, and this disclosure is not limited thereto. The shape of the sensing unit SU can be modified in various ways.

[0150] Reference Figure 8 , Figure 9A , Figure 9B , Figure 10A and Figure 10B The first electrode 210 may include a plurality of first separator electrodes 210-dp spaced apart from each other in the first direction DR1. The first separator electrodes 210-dp may be connected to a single first trace 210t. Each of the first separator electrodes 210-dp may include a plurality of first patterns 211 (or first sensing patterns) and a plurality of first bridging patterns 212 electrically connected to the first patterns 211. The first patterns 211, spaced apart from each other and arranged in the second direction DR2, may be electrically connected via the first bridging patterns 212. Therefore, each of the first separator electrodes 210-dp may extend in the second direction DR2, and the first separator electrodes 210-dp may be spaced apart in the first direction DR1.

[0151] The third electrode 230 may include a plurality of second separator electrodes 230-dp spaced apart from each other in the first direction DR1. Each of the second separator electrodes 230-dp may extend in the second direction DR2. The second separator electrodes 230-dp may be spaced apart from each other in the first direction DR1.

[0152] When viewed from a third party to DR3, the second separator electrode 230-dp can be superimposed on the first separator electrode 210-dp in a one-to-one correspondence. Here, the term "superimposed" may also include cases where, for example, at least a portion of a first separator electrode 210-dp and at least a portion of a second separator electrode 230-dp are superimposed.

[0153] exist Figure 9A and Figure 10AThe diagram illustrates an example where one sensing unit SU includes three first separator electrodes 210-dp and three second separator electrodes 230-dp, but is not particularly limited thereto. For example, the number of first separator electrodes 210-dp and second separator electrodes 230-dp included in a single sensing unit SU can be one, two, four, or more. Each of the first separator electrodes 210-dp and second separator electrodes 230-dp can correspond to a signal transmission path or a resistance path through which a signal is transmitted.

[0154] Reference Figure 8 and Figure 9A A second annular trace 230rt2 can be electrically connected to a first electrode group 230pc. A first electrode group 230pc may include two third electrodes 230. In this case, a second annular trace 230rt2 can be electrically connected to six second separator electrodes 230-dp. As a result, the extent to which the number of pads in the sensor layer 200 increases can be reduced.

[0155] Compared to the case where the first electrode 210 in one of the sensing units SU is not divided and has a monolithic shape, when the first electrode 210 in one of the sensing units SU includes a first dividing electrode 210-dp, the first dividing electrode 210-dp can be relatively uniformly distributed within one sensing unit SU. In this case, a signal can be uniformly provided or detected within one sensing unit SU.

[0156] Furthermore, compared to the case where the first electrode 210 in a sensing unit SU is not divided, when the first electrode 210 in a sensing unit SU includes a first separating electrode 210-dp, the number of first bridging patterns 212 in a sensing unit SU can be increased. Figure 9A In this context, when two first bridging patterns 212 connected to the same two first patterns 211 are considered a pair, for example, nine pairs of first bridging patterns 212 are shown. That is, a total of eighteen first bridging patterns 212 are shown.

[0157] For example, increasing the number of first bridging patterns 212 arranged on a first direction DR1 intersecting the second direction DR2, which is the extending direction of the first electrode 210, can correspond to an increase in signal paths. Therefore, as the number of signal paths increases, the resistance of the first electrode 210 can decrease. As a result, the sensing sensitivity of the sensor layer 200 can be improved.

[0158] Furthermore, as the shape of each first separator electrode 210-dp becomes closer to that of a rod extending in the second direction DR2, the resistance path can be shortened. Therefore, as the resistance path shortens and the number of resistance paths connected in parallel within a single first electrode 210 increases, the resistance of the first electrode 210 can be reduced. As a result, the sensing sensitivity of the sensor layer 200 can be improved.

[0159] Furthermore, as the shape of each first separating electrode 210-dp becomes closer to a rod extending in the second direction DR2, the ratio of the surface area available for pattern design to the total surface area of ​​a sensing unit SU can be increased. Therefore, the degree of freedom in pattern design can be improved.

[0160] According to one or more embodiments of this disclosure, the degree of freedom in the pattern design of the sensing unit SU can be increased, and the resistance of the electrodes included in the sensing unit SU can be reduced. In this case, it is more advantageous to ensure the applicable frequency range (e.g., bandwidth) of the signal provided to the sensor layer 200. Therefore, the degree of freedom in frequency selection can be increased.

[0161] According to one or more embodiments of this disclosure, each first pattern 211 may have an annular shape, and the portion of each second separator electrode 230-dp overlapping with the first pattern 211 may be approximately rod-shaped. In this case, the overlapping surface area between the first electrode 210 and the third electrode 230 can be appropriately adjusted by controlling the inner diameter of each first pattern 211 or the width of each second separator electrode 230-dp.

[0162] According to one or more embodiments of this disclosure, the first separating electrode 210-dp may include a first pattern 211 and a first bridging pattern 212 located on different corresponding layers, and the first pattern 211 and the first bridging pattern 212 may be electrically connected by contacts. In this case, the resistance may be relatively increased compared to when the first pattern 211 and the first bridging pattern 212 are integrally disposed on the same layer.

[0163] In one or more embodiments of this disclosure, the portion of the second separator electrode 230-dp that overlaps with the first pattern 211 may have a lower resistance than the first pattern 211. However, this is merely an example, and the resistance relationship may vary depending on the width of the loop of the first pattern 211 or the size of the portion of the second separator electrode 230-dp.

[0164] The second separator electrode 230-dp can extend in the same layer along the second direction DR2. Therefore, the second separator electrode 230-dp can have little or no increase in resistance due to the layer change. The second separator electrode 230-dp can be an electrode to which a signal is applied in the charging drive mode described later. Therefore, the lower resistance of the second separator electrode 230-dp can lead to better performance for the pen PN (see...). Figure 6 The resonant circuit is charged with a stronger current and magnetic field strength.

[0165] According to one or more embodiments of this disclosure, because the portion of the second separator electrode 230-dp overlapping with the first pattern 211 is close to a rod shape, the second separator electrode 230-dp can have a relatively narrower shape compared to the first separator electrode 210-dp. In this case, the parasitic capacitance caused by each second separator electrode 230-dp can be reduced. Therefore, the performance of the sensor layer 200 can be improved.

[0166] Reference Figure 9B The second separator electrode 230-dp may include a first portion having a first width WT1 in the first direction DR1 and a second portion having a second width WT2 in the first direction DR1. The first width WT1 may be greater than the second width WT2. For example, the first portion having the first width WT1 may be closer to the first bridging pattern 212 than the second portion having the second width WT2.

[0167] In the plan view, a first portion with a first width WT1 can be superimposed on a first pattern 211 to generate capacitance. Additionally, a second portion with a second width WT2 can be superimposed on a dummy pattern surrounded by the first pattern 211. By adjusting the second width WT2, the superimposed surface area between the first electrode 210 and the third electrode 230 can be appropriately controlled.

[0168] The opening 230op can be defined within the second separating electrode 230-dp, and the two first bridging patterns 212 can be located within the opening 230op. When the first bridging patterns 212 are surrounded by the second separating electrode 230-dp, the temperature-dependent capacitance of the capacitance generated in the first electrode 210 can be reduced. Therefore, the temperature characteristics of the sensor layer 200 can be improved.

[0169] Reference Figure 10AThe second electrode 220 may include a plurality of first branch portions 220b1 extending along a first direction DR1, a plurality of second branch portions 220b2 extending along a second direction DR2 intersecting the first direction DR1, and a connecting portion 220b3 located between the first patterns 211. The first branch portions 220b1 may be spaced apart from each other in the second direction DR2, and the second branch portions 220b2 may be spaced apart from each other in the first direction DR1. The first branch portions 220b1, the second branch portions 220b2, and the connecting portion 220b3 may be connected to each other to have an integral shape.

[0170] The auxiliary electrode 240 may correspond to one of the first auxiliary electrode 240-1 and the second auxiliary electrode 240-2. In the following text, the auxiliary electrode 240 is referred to as the fourth electrode 240.

[0171] The fourth electrode 240 may include a plurality of third separator electrodes 240-dp spaced apart from each other in the second direction DR2. Each of the third separator electrodes 240-dp may extend along the first direction DR1. Each of the third separator electrodes 240-dp may include a plurality of second patterns 241 and a plurality of second bridging patterns 242 electrically connected to the second patterns 241. Each of the second patterns 241 may have an annular shape. For example, an opening 240op may be defined in each of the second patterns 241. The second patterns 241 and the second bridging patterns 242 may be defined in an intermediate insulating layer 203 (see...). Figure 7A The contact holes in the pattern are electrically connected to each other. Two adjacent second patterns 241 may be spaced apart from each other, and there is a second separator electrode 230-dp and two first bridging patterns 212 between the two adjacent second patterns 241.

[0172] In one or more embodiments of this disclosure, such as Figure 10B As shown, the third width WT3 of the first branch portion 220b1 in the second direction DR2 can be greater than the fourth width WT4 of the second branch portion 220b2 in the first direction DR1. For example, the first branch portion 220b1 can be superimposed with the second pattern 241 and the dummy pattern surrounded by the second pattern 241. By adjusting the third width WT3, the superimposed surface area between the second electrode 220 and the fourth electrode 240 can be appropriately controlled. Alternatively, the superimposed surface area between the second electrode 220 and the fourth electrode 240 can be appropriately controlled by adjusting the inner diameter of the annular shape surrounding the dummy pattern of each second pattern 241.

[0173] In one or more embodiments of this disclosure, each of the third separator electrodes 240-dp may include a second pattern 241 and a second bridging pattern 242 located on different corresponding layers, and the second pattern 241 and the second bridging pattern 242 may be electrically connected by contacts. In this case, the resistance may be relatively increased compared to a structure in which the second pattern 241 and the second bridging pattern 242 are integrally disposed on the same layer.

[0174] In one or more embodiments of this disclosure, the third electrode 230 corresponds to a structure that transmits signals during touch sensing and pen sensing, and the fourth electrode 240 corresponds to a structure that generates capacitance with the third electrode 230 during pen sensing. Therefore, it is suitable to reduce the resistance of the third electrode 230 rather than reducing the resistance of the fourth electrode 240. Thus, the third electrode 230 can be implemented in the same layer (e.g., a single layer), while the fourth electrode 240 can be implemented in two different layers.

[0175] Reference Figure 9B and Figure 10B The first bridging pattern 212 may include only one line extending in the first crossing direction CDR1 or the second crossing direction CDR2 in the corresponding portion. The second bridging pattern 242 may also include only one line extending in the first crossing direction CDR1 or the second crossing direction CDR2 in the corresponding portion. The corresponding portion may be the part where the second bridging pattern 242 overlaps with the first bridging pattern 212. In this case, the first bridging pattern 212 may intersect the second bridging pattern 242 in an insulating manner in the corresponding portion. As a result, the capacitance between the first bridging pattern 212 and the second bridging pattern 242 can be reduced or minimized.

[0176] Reference Figure 9B and Figure 10B The second separator electrode 230-dp, the second pattern 241, the first pattern 211, the second electrode 220, and the second bridging pattern 242 may each have a grid structure. Each grid structure may include multiple grid lines. Each of the multiple grid lines may have a shape extending in a corresponding direction and may be connected to each other. The shape of the grid lines may vary, including straight lines, lines with protrusions, or non-uniform lines. In each grid structure, an opening may be defined (set or created) by the grid lines partially surrounding it. The opening may be connected to the emission region PXA (see...). Figure 7A ) overlay, and the grid lines can be interleaved with the non-emitting region NPXA (see Figure 7A (They can be stacked. However, there are no particular restrictions.)

[0177] exist Figure 9B and Figure 10BIn the diagram, the mesh structure is shown as including mesh lines extending along a first intersecting direction CDR1 that intersects a first direction DR1 and a second direction DR2, and mesh lines extending along a second intersecting direction CDR2 that intersects the first intersecting direction CDR1. However, the extension directions of the mesh lines constituting the mesh structure are not limited to... Figure 9B and Figure 10B The illustration is shown below. For example, the mesh structure may include mesh lines extending only in the first direction DR1 and the second direction DR2, or the mesh structure may include mesh lines extending in the first direction DR1, the second direction DR2, and the first intersecting direction CDR1 and the second intersecting direction CDR2. That is to say, the mesh structure can be modified into various shapes.

[0178] In one or more embodiments of this disclosure, a first capacitor may be defined between a first electrode 210 and a third electrode 230, and a second capacitor may be defined between a second electrode 220 and a fourth electrode 240. The first capacitance of the first capacitor and the second capacitance of the second capacitor can be adjusted by the overlapping surface area between the first electrode 210 and the third electrode 230 and the overlapping surface area between the second electrode 220 and the fourth electrode 240.

[0179] As the first and second capacitors increase in size, the amount of induced current transmitted from the third electrode 230 to the first electrode 210 can increase, and the amount of induced current transmitted from the fourth electrode 240 to the second electrode 220 can also increase. Therefore, increasing the first and second capacitors improves the pen sensing performance of the sensor layer 200. Furthermore, during touch sensing, the first and second capacitors can act as a load. Therefore, decreasing the first and second capacitors improves touch sensing performance.

[0180] According to this disclosure, the overlapping surface area between the first electrode 210 and the third electrode 230, and the overlapping surface area between the second electrode 220 and the fourth electrode 240, can be appropriately controlled. Therefore, considering both touch sensitivity and pen sensing sensitivity, a sensor layer 200 with an appropriate level of capacitance can be provided. As a result, an electronic device 1000 with improved pen sensing sensitivity and touch sensitivity (see [link to disclosure]) can be provided. Figure 2A ).

[0181] In one or more embodiments of this disclosure, the surface area occupied by components included in the first electrode 210 and the second electrode 220 within the second conductive layer SU204 of a sensing unit SU can be greater than the surface area occupied by components included in the third electrode 230 and the fourth electrode 240. When the distance is closer, the first input 2000 (see...) Figure 6 The capacitance change caused by this can be larger. Therefore, the capacitance change used to sense the first input 2000 (see...) Figure 6The components can be located in a relatively large area with the electronic device 1000 (see...). Figure 2A The surface of the adjacent layers is used. As a result, touch performance can be improved.

[0182] Figure 11 This illustrates a sensing unit SU according to one or more embodiments of the present disclosure (see...). Figure 8 A floor plan of a component of ).

[0183] Reference Figure 11 For example, a second bridging pattern 242 and two first bridging patterns 212 superimposed on the second bridging pattern 242 are shown.

[0184] Each of the first bridging patterns 212 may include a first main line 212m1 extending in a first intersecting direction CDR1 and a second main line 212m2 extending in a second intersecting direction CDR2. One end of the first main line 212m1 and one end of the second main line 212m2 may intersect each other. The first bridging pattern 212 may also include a plurality of first protruding lines 212p1 intersecting the first main line 212m1 and a plurality of second protruding lines 212p2 intersecting the second main line 212m2. Each of the first protruding lines 212p1 may be spaced apart from each other in the first intersecting direction CDR1, and each of the second protruding lines 212p2 may be spaced apart from each other in the second intersecting direction CDR2. In one or more other embodiments of this disclosure, the first protruding lines 212p1 and the second protruding lines 212p2 may be omitted.

[0185] The second bridging pattern 242 may include a first line 242m1 extending along a first intersection direction CDR1 and a second line 242m2 extending along a second intersection direction CDR2. According to one or more embodiments of this disclosure, the second bridging pattern 242 may include a first portion B-CA1 where two or more first lines 242m1 intersect with two or more second lines 242m2, and a second portion B-CA2 where one first line 242m1 intersects with one or more second lines 242m2 or one or more first lines 242m1 intersects with one second line 242m2. The second portion B-CA2 may intersect with the first bridging pattern 212.

[0186] In one or more embodiments, each of the first portions B-CA1 may include at least two lines extending in the same direction, and each of the second portions B-CA2 may include only one line extending in the same direction. Therefore, the minimum width WTB1 of the first portion B-CA1 may be greater than the minimum width WTB2 of the second portion B-CA2.

[0187] In the second part B-CA2, the first bridging pattern 212 can intersect the second bridging pattern 242 in an insulating manner. In this case, the capacitance between the first bridging pattern 212 and the second bridging pattern 242 can be reduced. In addition, because the remaining portion of the second bridging pattern 242 that does not overlap with the first bridging pattern 212 is arranged such that two or more first lines 242m1 intersect with two or more second lines 242m2, the probability of visually recognizing the second bridging pattern 242 due to differences in external light reflectivity can be reduced.

[0188] Figure 12 This is a diagram illustrating capacitors located in sensor layer 200 according to one or more embodiments of the present disclosure.

[0189] Reference Figure 12 The diagram shows a first electrode 210, a second electrode 220, a third electrode 230, a fourth electrode 240, and a second electrode CE. The second electrode CE is included in the light-emitting element 100PE (see...). Figure 7A The component in ) is referred to below as the common electrode CE.

[0190] The first base capacitor Cb1 can be defined between the first electrode 210 and the common electrode CE, the second base capacitor Cb2 can be defined between the second electrode 220 and the common electrode CE, the third base capacitor Cb3 can be defined between the third electrode 230 and the common electrode CE, and the fourth base capacitor Cb4 can be defined between the fourth electrode 240 and the common electrode CE.

[0191] The mutual capacitor Cm can be defined between the first electrode 210 and the second electrode 220. Sensor driver 200C (see...) Figure 6 The first input 2000 can be calculated based on the capacitance change of the mutual capacitor Cm (see...). Figure 6 The coordinates of ).

[0192] The first coupling capacitor CC1 can be defined between the first electrode 210 and the third electrode 230, and the second coupling capacitor CC2 can be defined between the second electrode 220 and the fourth electrode 240. From the second input 3000 (see...) Figure 6 The induced current generated can be transmitted from the third electrode 230 to the first electrode 210 through the first coupling capacitor CC1, and can be transmitted from the fourth electrode 240 to the second electrode 220 through the second coupling capacitor CC2.

[0193] Furthermore, the third coupling capacitor CCR can be defined between the first electrode 210 and the fourth electrode 240. The charge introduced from the fourth electrode 240 to the first electrode 210 through the third coupling capacitor CCR can affect the capacitance change of the mutual capacitor Cm between the first electrode 210 and the second electrode 220. For example, the charge introduced from the fourth electrode 240 to the first electrode 210 through the third coupling capacitor CCR can increase the capacitance of the mutual capacitor Cm.

[0194] According to one or more embodiments of this disclosure, because the impedances of the first auxiliary electrode group 240G1 and the second auxiliary electrode group 240G2 can be designed to be substantially the same, the impedance of the first auxiliary electrode group 240G1 (see...) can be reduced or minimized. Figure 8 ) and the second auxiliary electrode group 240G2 (see Figure 8 The difference in capacitance change of the mutual capacitor Cm caused by touch errors can be reduced or eliminated as this difference decreases. As a result, the touch reliability of sensor layer 200 can be improved.

[0195] Figure 13 This illustrates a sensor layer 200 according to one or more embodiments of the present disclosure (see...). Figure 8 A floor plan of a component of ).

[0196] Reference Figure 13 For example, a first auxiliary electrode group 240G1, a second auxiliary electrode group 240G2, a first auxiliary trace 240-1t, a second auxiliary trace 240-2t, a fourth-1 pad PD4-1 connected to the first auxiliary electrode group 240G1 and the first auxiliary trace 240-1t, and a fourth-2 pad PD4-2 connected to the second auxiliary electrode group 240G2 and the second auxiliary trace 240-2t are shown.

[0197] The first impedance IMP1 of the first auxiliary electrode group 240G1 and the 4-1 pad PD4-1, and the second impedance IMP2 of the second auxiliary electrode group 240G2 and the 4-2 pad PD4-2, can be substantially the same / substantially equal. Here, "substantially the same" can mean that the first impedance IMP1 and the second impedance IMP2 are the same within a corresponding error range that can be less than about 5%.

[0198] Various designs can be applied to ensure that the first impedance IMP1 and the second impedance IMP2 are substantially the same or substantially equal, and refer to Figures 15 to 19 Provide a corresponding description.

[0199] Figure 14 This illustrates a sensor layer 200 according to one or more embodiments of the present disclosure (see...). Figure 8 A floor plan of a component of ).

[0200] Reference Figure 14 The diagram illustrates a fourth pad PD4-c connected to the first auxiliary electrode group 240G1 and the second auxiliary electrode group 240G2. That is, in one or more embodiments of this disclosure, the first auxiliary electrode group 240G1 and the second auxiliary electrode group 240G2 may be connected to the same pad, for example, to the fourth pad PD4-c.

[0201] Based on the branch point at the fourth pad PD4-c, the first impedance IMP1a of the first auxiliary electrode group 240G1 and the second impedance IMP2a of the second auxiliary electrode group 240G2 can be substantially the same or substantially equal.

[0202] like Figure 13 and Figure 14 As described above, the first impedance IMP1 / IMP1a of the first auxiliary electrode group 240G1 and the second impedance IMP2 / IMP2a of the second auxiliary electrode group 240G2 are matched to be substantially the same. In this case, the deviation of mutual capacitance caused by the first auxiliary electrode group 240G1 and the second auxiliary electrode group 240G2 can be reduced or minimized. As the deviation decreases, the probability of touch failure can be reduced or eliminated. As a result, the sensor layer 200 (see...) can be improved. Figure 8 Touch reliability.

[0203] Figure 15 This illustrates a sensor layer 200 according to one or more embodiments of the present disclosure (see...). Figure 8 A floor plan of a component of ).

[0204] Reference Figure 8 and Figure 15 The first electrode 210 may include a first electrode 210a. The second electrode 220 may include a second-1 electrode 220a and a second-2 electrode 220b. The first electrode 210a may intersect with both the first auxiliary electrode 240-1 and the second auxiliary electrode 240-2. The second-1 electrode 220a may be superimposed on one of the first auxiliary electrodes 240-1, and the second-2 electrode 220b may be superimposed on one of the second auxiliary electrodes 240-2.

[0205] Figure 15 The diagram schematically illustrates variables that can be determined (or set or designed) to match the impedance of the first auxiliary electrode group 240G1 and the second auxiliary electrode group 240G2. These variables may include resistance and capacitance.

[0206] For example, the resistors may include a first resistor 241R for each first auxiliary electrode 240-1, a second resistor 242R for each second auxiliary electrode 240-2, a first trace resistance 241tR for the first auxiliary trace 240-1t, and a second trace resistance 242tR for the second auxiliary trace 240-2t. The first trace resistance 241tR may correspond to the resistance from the contact point connected to the first auxiliary electrode 240-1 to the first auxiliary trace 240-1t of the 4-1 pad PD4-1. Similarly, the second trace resistance 242tR may correspond to the resistance from the contact point connected to the second auxiliary electrode 240-2 to the second auxiliary trace 240-2t of the 4-2 pad PD4-2.

[0207] For example, the capacitor may include a first coupling capacitor CCRa between a first auxiliary electrode 240-1 and a first electrode 210a, a second coupling capacitor CCRb between a second auxiliary electrode 240-2 and a first electrode 210a, a third coupling capacitor CC2a between a first auxiliary electrode 240-1 and a second-1 electrode 220a, a fourth coupling capacitor CC2b between a second auxiliary electrode 240-2 and a second-2 electrode 220b, a first base capacitor Cb4a between a first auxiliary electrode 240-1 and a common electrode CE, and a second base capacitor Cb4b between a second auxiliary electrode 240-2 and a common electrode CE.

[0208] In one or more embodiments of this disclosure, the first impedance IMP1 of the first auxiliary electrode group 240G1 and the second impedance IMP2 of the second auxiliary electrode group 240G2 may be substantially the same. For example, in one or more embodiments of this disclosure, the first auxiliary electrode group 240G1 may have the same resistance as the second auxiliary electrode group 240G2, and the first auxiliary electrode group 240G1 may have the same capacitive reactance as the second auxiliary electrode group 240G2. Optionally, in one or more other embodiments of this disclosure, the first auxiliary electrode group 240G1 may have a larger resistance than the second auxiliary electrode group 240G2, and the first auxiliary electrode group 240G1 may have a smaller capacitive reactance than the second auxiliary electrode group 240G2.

[0209] Figure 16A This illustrates a sensor layer 200 according to one or more embodiments of the present disclosure (see...). Figure 8 A floor plan of a component of ).

[0210] Reference Figure 15 and Figure 16AThe first impedance IMP1 of the first auxiliary electrode group 240G1a and the second impedance IMP2 of the second auxiliary electrode group 240G2a can be substantially the same. For example, the first auxiliary electrode group 240G1a can have the same resistance as the second auxiliary electrode group 240G2a, and the first auxiliary electrode group 240G1a can have the same capacitive reactance as the second auxiliary electrode group 240G2a.

[0211] In one or more embodiments of this disclosure, the first auxiliary electrode group 240G1a may include a first auxiliary electrode 240-1 and a first auxiliary trace 240-1ta electrically connected to the first auxiliary electrode 240-1. The second auxiliary electrode group 240G2a may include a second auxiliary electrode 240-2 and a second auxiliary trace 240-2ta electrically connected to the second auxiliary electrode 240-2.

[0212] In one or more embodiments, the first resistance 241R of each of the first auxiliary electrodes 240-1 and the second resistance 242R of each of the second auxiliary electrodes 240-2 may be substantially the same or substantially equal. Additionally, the first trace resistance 241tR of the first auxiliary trace 240-1ta and the second trace resistance 242tR of the second auxiliary trace 240-2ta may be substantially the same or substantially equal.

[0213] The spacing between the first auxiliary electrode 240-1 and the 4-1 pad PD4-1 and the 4-2 pad PD4-2 can be larger or farther than the spacing between the second auxiliary electrode 240-2 and the 4-1 pad PD4-1 and the 4-2 pad PD4-2. Therefore, the second auxiliary trace 240-2ta may also include a curved portion 240tR. The curved portion 240tR can have a wavy shape. Therefore, the second trace resistance 242tR of the second auxiliary trace 240-2ta can be designed to be the same as the first trace resistance 241tR of the first auxiliary trace 240-1ta.

[0214] The capacitance of the first coupling capacitor CCRa between the first auxiliary electrode 240-1 and the first electrode 210a, and the capacitance of the second coupling capacitor CCRb between the second auxiliary electrode 240-2 and the first electrode 210a, can be substantially the same or substantially equal. Furthermore, the capacitance of the third coupling capacitor CC2a between the first auxiliary electrode 240-1 and the second-1 electrode 220a, and the capacitance of the fourth coupling capacitor CC2b between the second auxiliary electrode 240-2 and the second-2 electrode 220b, can be substantially the same or substantially equal. Additionally, the capacitance of the first base capacitor Cb4a between the first auxiliary electrode 240-1 and the common electrode CE, and the capacitance of the second base capacitor Cb4b between the second auxiliary electrode 240-2 and the common electrode CE, can be substantially the same or substantially equal.

[0215] Figure 16B This illustrates a sensor layer 200 according to one or more embodiments of the present disclosure (see...). Figure 8 A floor plan of a component of ). Figure 16B In the description, the use of and Figure 16A The same reference numerals are used in the accompanying drawings, and detailed descriptions are omitted.

[0216] Reference Figure 15 and Figure 16B The first impedance IMP1 of the first auxiliary electrode group 240G1b and the second impedance IMP2 of the second auxiliary electrode group 240G2b can be substantially the same. For example, the first auxiliary electrode group 240G1b can have the same resistance as the second auxiliary electrode group 240G2b, and can have the same capacitive reactance as the second auxiliary electrode group 240G2b.

[0217] In one or more embodiments of this disclosure, the first auxiliary electrode group 240G1b may include a first auxiliary electrode 240-1 and a first auxiliary trace 240-1tb electrically connected to the first auxiliary electrode 240-1. The second auxiliary electrode group 240G2b may include a second auxiliary electrode 240-2 and a second auxiliary trace 240-2tb electrically connected to the second auxiliary electrode 240-2.

[0218] In one or more embodiments, the first trace resistance 241tR of the first auxiliary trace 240-1tb and the second trace resistance 242tR of the second auxiliary trace 240-2tb may be substantially the same or substantially equal.

[0219] The spacing between the first auxiliary electrode 240-1 and the 4-1 pad PD4-1 and the 4-2 pad PD4-2 can be larger or farther than the spacing between the second auxiliary electrode 240-2 and the 4-1 pad PD4-1 and the 4-2 pad PD4-2. Therefore, a portion of the first auxiliary trace 240-1tb can have a width greater than the width of the second auxiliary trace 240-2tb. Consequently, the first trace resistance 241tR of the relatively long first auxiliary trace 240-1tb can be reduced to the same level as the second trace resistance 242tR of the second auxiliary trace 240-2tb.

[0220] Figure 16C This illustrates a sensor layer 200 according to one or more embodiments of the present disclosure (see...). Figure 8 A cross-sectional view of a portion of a component. (In the description) Figure 16C At that time, provided for use Figure 16A The components described herein use the same reference numerals, and their detailed descriptions are omitted.

[0221] Reference Figure 15 and Figure 16C A portion of the first auxiliary trace 240-1tc may have a thickness TTK1 greater than the thickness TTK2 of the second auxiliary trace 240-2tc. Therefore, the first trace resistance 241tR of the first auxiliary trace 240-1tc, which has a relatively long length, can be reduced to the same level as the second trace resistance 242tR of the second auxiliary trace 240-2tc.

[0222] Figure 17A This illustrates a sensor layer 200 according to one or more embodiments of the present disclosure (see...). Figure 8 A floor plan of a component of ). Figure 17B This illustrates a sensor layer 200 according to one or more embodiments of the present disclosure (see...). Figure 8 A floor plan of a component of ). Figure 17C This illustrates a sensor layer 200 according to one or more embodiments of the present disclosure (see...). Figure 8 A floor plan of a component of ).

[0223] Reference Figure 15 , Figure 17A , Figure 17B and Figure 17C The first trace resistance 241tR of the first auxiliary trace 240-1t, which has a relatively long length, can be greater than the second trace resistance 242tR of the second auxiliary trace 240-2t. In this case, in order to match the first impedance IMP1 of the first auxiliary electrode group 240G1 with the second impedance IMP2 of the second auxiliary electrode group 240G2, the first resistance 241R of each first auxiliary electrode 240-1 can be adjusted to be lower than the second resistance 242R of each second auxiliary electrode 240-2.

[0224] Figure 17A , Figure 17B and Figure 17C An embodiment is shown in which the first resistance 241R of each first auxiliary electrode 240-1 is designed to be smaller than the second resistance 242R of each second auxiliary electrode 240-2.

[0225] Reference Figure 15 and Figure 17A For example, a second pattern 241-1 (hereinafter referred to as the first auxiliary pattern) included in the first auxiliary electrode 240-1 and a second pattern 241-2 (hereinafter referred to as the second auxiliary pattern) included in the second auxiliary electrode 240-2 are shown.

[0226] The first auxiliary pattern 241-1 may have a first grid structure MSS1, and the second auxiliary pattern 241-2 may have a second grid structure MSS2. The surface area occupied by the first grid structure MSS1 (e.g., the percentage of area occupied by the first grid structure MSS1 per unit area) can be greater than the surface area occupied by the second grid structure MSS2. That is, the resistance of the first auxiliary pattern 241-1, which has a relatively larger surface area, can be less than the resistance of the second auxiliary pattern 241-2. Therefore, the total resistance of the first auxiliary electrode group 240G1 and the total resistance of the second auxiliary electrode group 240G2 can be substantially the same.

[0227] The first grid structure MSS1 of the first auxiliary pattern 241-1 can have a first width MWT1, and the second grid structure MSS2 of the second auxiliary pattern 241-2 can have a second width MWT2. The first width MWT1 can be greater than the second width MWT2. Therefore, the first resistance 241R of each first auxiliary electrode 240-1 can be less than the second resistance 242R of each second auxiliary electrode 240-2.

[0228] Reference Figure 15 and Figure 17B The diagram shows, for example, a second pattern 241-1a (hereinafter referred to as the first auxiliary pattern) included in the first auxiliary electrode 240-1 and a second pattern 241-2a (hereinafter referred to as the second auxiliary pattern) included in the second auxiliary electrode 240-2.

[0229] The first auxiliary pattern 241-1a may have a first grid structure MSS1a, and the second auxiliary pattern 241-2a may have a second grid structure MSS2a. According to one or more embodiments of this disclosure, at least a portion of the second grid structure MSS2a of the second auxiliary pattern 241-2a may be omitted. For example, a cutting line MCL is shown within the second grid structure MSS2a. A portion of the second grid structure MSS2a corresponding to the region where the cutting line MCL is indicated may be omitted. A pattern with relatively more cutting lines MCL can have a higher resistance. Therefore, the second auxiliary pattern 241-2a can have a larger resistance than the first auxiliary pattern 241-1a, and the first resistance 241R of each first auxiliary electrode 240-1 can be smaller than the second resistance 242R of each second auxiliary electrode 240-2.

[0230] Reference Figure 15 and Figure 17CFor example, a second pattern 241-1b (hereinafter referred to as the first auxiliary pattern) included in the first auxiliary electrode 240-1, an additional auxiliary pattern 241-1ad electrically connected to the first auxiliary pattern 241-1b, and a second pattern 241-2b (hereinafter referred to as the second auxiliary pattern) included in the second auxiliary electrode 240-2 are shown.

[0231] The additional auxiliary pattern 241-1ad can be located on a different layer from the first auxiliary pattern 241-1b and can be electrically connected to the first auxiliary pattern 241-1b via contact CNT. For example, when the first auxiliary pattern 241-1b is included in the first conductive layer 202 (see... Figure 7A When used in the second conductive layer 204, the additional auxiliary pattern 241-1ad may be included. Figure 7A Therefore, the contact CNT can be disposed in the intermediate insulating layer 203 (see...). Figure 7A In the addition of the auxiliary pattern 241-1ad, the first resistance 241R of each first auxiliary electrode 240-1 can be less than the second resistance 242R of each second auxiliary electrode 240-2.

[0232] Already referred to Figure 17A , Figure 17B and Figure 17C An example is described in which the first resistance 241R of each first auxiliary electrode 240-1 is designed to be smaller than the second resistance 242R of each second auxiliary electrode 240-2. However, in addition to the example described above, various structures can be applied to generate resistance differences. For example, such as Figure 11 As shown, the second bridging pattern 242 included in the first auxiliary electrode 240-1 may have a different shape than the second bridging pattern 242 included in the second auxiliary electrode 240-2. Optionally, as Figure 8 The number of contacts connecting the second pattern 241 of the first auxiliary electrode 240-1 shown to the second bridging pattern 242 can be greater than that shown. Figure 8 The number of contacts of the second pattern 241 of the second auxiliary electrode 240-2 shown connected to the second bridging pattern 242.

[0233] Figure 18A This illustrates a sensor layer 200 according to one or more embodiments of the present disclosure (see...). Figure 8 A floor plan of a component of ).

[0234] Figure 18B This illustrates a sensor layer 200 according to one or more embodiments of the present disclosure (see...). Figure 8 A floor plan of a component of ).

[0235] Figure 18AA sensing unit SU is shown (see Figure 8 The first conductive layer SU202-U, which is stacked with the first auxiliary electrode 240-1, and a sensing unit SU (see Figure 8 The first conductive layer SU202-B is stacked with the second auxiliary electrode 240-2a. Figure 18B A sensing unit SU is shown (see Figure 8 The second conductive layer SU204-U, which is stacked with the first auxiliary electrode 240-1, and a sensing unit SU (see Figure 8 The second conductive layer SU204-B is stacked with the second auxiliary electrode 240-2a. The first conductive layers SU202-U and SU202-B may be included in the second conductive layer SU204-B. Figure 7A The first conductive layer 202 shown, and the second conductive layers SU204-U and SU204-B may be included in it. Figure 7A In the second conductive layer 204 shown.

[0236] Reference Figure 15 , Figure 18A and Figure 18B The first trace resistance 241tR of the first auxiliary trace 240-1t, which has a relatively long length, can be greater than the second trace resistance 242tR of the second auxiliary trace 240-2t. In this case, in order to match the first impedance IMP1 of the first auxiliary electrode group 240G1 with the second impedance IMP2 of the second auxiliary electrode group 240G2, the capacitive reactance of the first auxiliary electrode group 240G1 can be designed to be smaller than that of the second auxiliary electrode group 240G2.

[0237] In one or more embodiments of this disclosure, the capacitor defined by the first auxiliary electrode 240-1 may have a smaller capacitance than the capacitor defined by the second auxiliary electrode 240-2a. For example, the capacitance of a first coupling capacitor CCRa between the first auxiliary electrode 240-1 and a first electrode 210a may be smaller than the capacitance of a second coupling capacitor CCRb between the second auxiliary electrode 240-2a and a first electrode 210a. Additionally, the capacitance of a third coupling capacitor CC2a between the first auxiliary electrode 240-1 and the second-1 electrode 220a may be smaller than the capacitance of a fourth coupling capacitor CC2b between the second auxiliary electrode 240-2a and the second-2 electrode 220b.

[0238] The first auxiliary electrode 240-1 may include a plurality of second patterns 241-1 and a plurality of second bridging patterns 242-1 electrically connected to the second patterns 241-1. The second auxiliary electrode 240-2a may include a plurality of second patterns 241-2, a plurality of second bridging patterns 242-2 electrically connected to the second patterns 241-2, and a plurality of additional auxiliary patterns 241-2ad electrically connected to the second patterns 241-2. The additional auxiliary patterns 241-2ad may be electrically connected to the second patterns 241-2 via a plurality of contacts CNTa. The additional auxiliary patterns 241-2ad may be referred to as the second-1st layer auxiliary electrode, and the second pattern 241-2 may be referred to as the second-2nd layer auxiliary electrode.

[0239] Each additional auxiliary pattern 241-2ad can be located between the second-second electrode 220b and a first electrode 210a. Due to the additional auxiliary pattern 241-2ad, the capacitance of the second coupling capacitor CCRb between the second auxiliary electrode 240-2a and a first electrode 210a can be greater than the capacitance of the first coupling capacitor CCRa between the first auxiliary electrode 240-1 and a first electrode 210a. Furthermore, due to the additional auxiliary pattern 241-2ad, the capacitance of the fourth coupling capacitor CC2b between the second auxiliary electrode 240-2a and the second-second electrode 220b can be greater than the capacitance of the third coupling capacitor CC2a between the first auxiliary electrode 240-1 and the second-first electrode 220a. In other words, the capacitance of the capacitor defined by the second auxiliary electrode 240-2a can be greater than the capacitance of the capacitor defined by the first auxiliary electrode 240-1.

[0240] Figure 19 This illustrates a sensor layer 200 according to one or more embodiments of the present disclosure (see...). Figure 8 A cross-sectional view of a component of the second electrode CE.

[0241] Reference Figure 15 and Figure 19 The first trace resistance 241tR of the first auxiliary trace 240-1t, which has a relatively long length, can be greater than the second trace resistance 242tR of the second auxiliary trace 240-2t. In this case, in order to match the first impedance IMP1 of the first auxiliary electrode group 240G1 with the second impedance IMP2 of the second auxiliary electrode group 240G2, the capacitive reactance of the first auxiliary electrode group 240G1 can be designed to be smaller than the capacitive reactance of the second auxiliary electrode group 240G2.

[0242] In one or more embodiments of this disclosure, the capacitor defined by the first auxiliary electrode 240-1a may have a smaller capacitance than the capacitor defined by the second auxiliary electrode 240-2b. For example, the capacitance of the first base capacitor Cb4a1 between the first auxiliary electrode 240-1a and the common electrode CE may be smaller than the capacitance of the second base capacitor Cb4b1 between the second auxiliary electrode 240-2b and the common electrode CE.

[0243] In one or more embodiments of this disclosure, the intermediate insulating layer 203 may be an organic layer. Therefore, the capacitance of the substrate capacitor can be controlled by adjusting the surface areas of the electrodes located above and below the intermediate insulating layer 203.

[0244] The first auxiliary electrode 240-1a may include a first-1 layer auxiliary electrode 240-1L1 located above the display layer 100 and a first-2 layer auxiliary electrode 240-1L2 located above the first-1 layer auxiliary electrode 240-1L1. The second auxiliary electrode 240-2b may include a second-1 layer auxiliary electrode 240-2L1 located above the display layer 100 and a second-2 layer auxiliary electrode 240-2L2 located above the second-1 layer auxiliary electrode 240-2L1. The first-1 auxiliary electrode 240-1L1 and the second-1 auxiliary electrode 240-2L1 can be located between the display layer 100 and the intermediate insulating layer 203, and the first-2 auxiliary electrode 240-1L2 and the second-2 auxiliary electrode 240-2L2 can be spaced apart from the display layer 100, with the intermediate insulating layer 203 between the first-2 auxiliary electrode 240-1L2 and the second-2 auxiliary electrode 240-2L2 and the display layer 100.

[0245] In one or more embodiments of this disclosure, the portion of the second auxiliary electrode 240-2b located between the display layer 100 and the intermediate insulating layer 203 (such as the second-1st layer auxiliary electrode 240-2L1) may have a larger surface area than the portion of the first auxiliary electrode 240-1a located between the display layer 100 and the intermediate insulating layer 203 (such as the first-1st layer auxiliary electrode 240-1L1). Therefore, the capacitance of the first base capacitor Cb4a1 between the first auxiliary electrode 240-1a and the common electrode CE may be smaller than the capacitance of the second base capacitor Cb4b1 between the second auxiliary electrode 240-2b and the common electrode CE.

[0246] Figure 20 This illustrates a sensor driver 200C according to one or more embodiments of the present disclosure (see...). Figure 6 The diagram shows the operation of ).

[0247] Reference Figure 6 and Figure 20The sensor driver 200C can be configured to be selectively driven in one of the first operating mode DMD1, the second operating mode DMD2, and the third operating mode DMD3.

[0248] The first operation mode DMD1 can be referred to as touch and pen standby mode, the second operation mode DMD2 can be referred to as touch active and pen standby mode, and the third operation mode DMD3 can be referred to as pen active mode. The first operation mode DMD1 can be a mode in which the first input 2000 and the second input 3000 are in standby mode. The second operation mode DMD2 can be a mode in which the first input 2000 is sensed and the second input 3000 is in standby mode. The third operation mode DMD3 can be a mode in which the second input 3000 is sensed.

[0249] In one or more embodiments of this disclosure, the sensor driver 200C may initially operate in a first operating mode DMD1. When the first input 2000 is sensed in the first operating mode DMD1, the sensor driver 200C may switch (or change) to a second operating mode DMD2. Optionally, when the second input 3000 is sensed in the first operating mode DMD1, the sensor driver 200C may switch (or change) to a third operating mode DMD3.

[0250] In one or more embodiments of this disclosure, when the second input 3000 is sensed in the second operating mode DMD2, the sensor driver 200C can switch to the third operating mode DMD3. When the first input 2000 is deactivated (or not detected) in the second operating mode DMD2, the sensor driver 200C can switch to the first operating mode DMD1. When the second input 3000 is deactivated (or not detected) in the third operating mode DMD3, the sensor driver 200C can switch to the first operating mode DMD1.

[0251] Figure 21 This illustrates a sensor driver 200C according to one or more embodiments of the present disclosure (see...). Figure 6 The diagram shows the operation of ).

[0252] Reference Figure 6 , Figure 20 and Figure 21 For example, the operations under the first operating mode DMD1, the second operating mode DMD2, and the third operating mode DMD3 are shown in time (t) order.

[0253] In the first operating mode DMD1, the sensor driver 200C can be repeatedly driven in the order of the second mode MD2-d and the first mode MD1-d. During the second mode MD2-d, the sensor layer 200 can be scanned to detect the second input 3000. During the first mode MD1-d, the sensor layer 200 can be scanned to detect the first input 2000. For example, Figure 21 The sensor driver 200C is shown to operate in the first mode MD1-d after operating in the second mode MD2-d, but the order is not limited to this.

[0254] In the second operating mode DMD2, the sensor driver 200C can be repeatedly driven in the order of the second mode MD2-d and the first mode MD1. During the second mode MD2-d, the sensor layer 200 can be scanned to detect the second input 3000. During the first mode MD1, the sensor layer 200 can be scanned to detect the coordinates of the first input 2000.

[0255] In the third operating mode DMD3, the sensor driver 200C can be driven in the second mode MD2. During the second mode MD2, the sensor layer 200 can be scanned to detect the coordinates of the second input 3000. In the third operating mode DMD3, the sensor driver 200C may not operate in the first mode MD1-d or MD1 until the second input 3000 is deactivated (or the second input 3000 is not detected).

[0256] Reference Figure 8 In the first modes MD1-d and MD1, the third electrode 230, the first auxiliary electrode 240-1, and the second auxiliary electrode 240-2 can all be grounded or have an applied constant voltage. Optionally, in the first modes MD1-d and MD1, the third electrode 230, the first auxiliary electrode 240-1, and the second auxiliary electrode 240-2 can all be floating (or electrically floating). Optionally, in the first modes MD1-d and MD1, the third electrode 230, the first auxiliary electrode 240-1, and the second auxiliary electrode 240-2 can have an applied in-phase signal provided from the first electrode 210. In this case, touch noise can be reduced or prevented from entering through the third electrode 230, the first auxiliary electrode 240-1, and the second auxiliary electrode 240-2.

[0257] In both the second mode MD2-d and the second mode MD2, one end of each of the third electrode 230, the first auxiliary electrode 240-1, and the second auxiliary electrode 240-2 can be entirely floating. Furthermore, in both the second modes MD2-d and MD2, the other end of each of the third electrode 230, the first auxiliary electrode 240-1, and the second auxiliary electrode 240-2 can be either entirely grounded or entirely floating. Therefore, the compensation of the sensing signal through the coupling between the first electrode 210 and the third electrode 230, and between the second electrode 220 and the first auxiliary electrode 240-1 and the second auxiliary electrode 240-2, can be improved or maximized.

[0258] Figure 22 This is used to explain the first modes MD1-d and MD1 (see) according to one or more embodiments of this disclosure. Figure 21 (The image is shown.)

[0259] Reference Figure 6 , Figure 21 and Figure 22 The first mode MD1-d of the first operating mode DMD1 and the first mode MD1 of the second operating mode DMD2 may include a mutual capacitance detection mode. Figure 22 This is a diagram used to explain the mutual capacitance detection modes under the first mode MD1-d of the first operating mode DMD1 and the first mode MD1 of the second operating mode DMD2.

[0260] In mutual capacitance detection mode, the sensor driver 200C can sequentially provide a transmission signal TX through the first electrode 210 and use the received signal RX detected through the second electrode 220 to detect the coordinates of the first input 2000. For example, the sensor driver 200C can be configured to sense changes in the mutual capacitance between the first electrode 210 and the second electrode 220 to calculate the input coordinates.

[0261] exist Figure 22 In, for example, one of the first electrodes 210 is shown to provide a transmission signal TX, and a receive signal RX is output from the second electrode 220. To clarify the signal representation, in Figure 22 One of the first electrodes 210 that provides the transmission signal TX is highlighted in the image. The sensor driver 200C can sense the change in capacitance between the first electrode 210 and each of the second electrodes 220 to detect the input coordinates of the first input 2000.

[0262] In one or more other embodiments of this disclosure, at least one of the first mode MD1-d of the first operating mode DMD1 and the first mode MD1 of the second operating mode DMD2 may further include a self-capacitance detection mode. In the self-capacitance detection mode, the sensor driver 200C can output a drive signal to the first electrode 210 and the second electrode 220, and can be configured to sense changes in the capacitance of each of the first electrode 210 and the second electrode 220 to calculate input coordinates.

[0263] Figure 23 This is used to explain the second modes MD2-d and MD2 of this disclosure (particularly the charging drive mode, see...). Figure 21 (The image is shown.) Figure 24A The figure shows a graph illustrating the waveform of a first signal SG1 according to one or more embodiments of the present disclosure. Figure 24B This is a graph showing the waveform of the second signal SG2 according to one or more embodiments of the present disclosure.

[0264] Reference Figure 6 , Figure 21 , Figure 23 , Figure 24A and Figure 24B The second mode, MD2-d, and MD2 can include charging drive modes. Charging drive modes can include search charging drive modes and track charging drive modes.

[0265] The search-to-charge drive mode can be a drive mode prior to sensing the position of the pen PN. Therefore, the first signal SG1 or the second signal SG2 can be sequentially provided through all channels included in the sensor layer 200. That is, in the search-to-charge drive mode, the entire area of ​​the sensor layer 200 can be scanned sequentially. When the pen PN is sensed in the search-to-charge drive mode, the sensor layer 200 can be charged in the tracking-to-charge drive mode. For example, in the tracking-to-charge drive mode, the sensor driver 200C can sequentially output the first signal SG1 and the second signal SG2 to the area superimposed on the point where the pen PN is sensed, instead of the entire sensor layer 200.

[0266] In charging drive mode, sensor driver 200C can apply a first signal SG1 to one of the third pad PD3 and the fifth pad PD5, and apply a second signal SG2 to the other pad of the third pad PD3 and the fifth pad PD5. That is, in charging drive mode, the first signal SG1 is provided to at least one of the third electrodes 230, and the second signal SG2 is provided to at least another of the third electrodes 230. The second signal SG2 can be an inverted signal of the first signal SG1. For example, the first signal SG1 can be a sine wave signal.

[0267] Because the first signal SG1 and the second signal SG2 are applied to at least two pads, the current RFS can have a current path flowing from one pad to the other. Furthermore, because the first signal SG1 and the second signal SG2 are anti-phase sinusoidal signals, the direction of the current RFS can change periodically. In one or more other embodiments of this disclosure, the first signal SG1 and the second signal SG2 can be square wave signals that are anti-phase with each other.

[0268] When the first signal SG1 and the second signal SG2 are out of phase, the first signal SG1 is displayed on the display layer 100 (see...). Figure 5 The noise caused by the second signal SG2 can be canceled out. Therefore, no flickering occurs on the display layer 100, and the display quality of the display layer 100 can be improved.

[0269] In one or more other embodiments of this disclosure, the first signal SG1 may be a sinusoidal signal. However, it is not limited thereto; the first signal SG1 may be a square wave signal, and the second signal SG2 may have a corresponding constant voltage. For example, the second signal SG2 may be a ground voltage. That is, the pad to which the second signal SG2 is applied can be considered grounded. Even in this case, the current RFS may flow from one pad to another. Furthermore, even when the other pad is grounded, the direction of the current RFS may change periodically because the first signal SG1 is a sinusoidal or square wave signal.

[0270] Reference Figure 23 The second signal SG2 is provided to one of the third pads PD3 connected to the first ring trace 230rt1, and the first signal SG1 is provided to one of the fifth pads PD5 connected to the third electrode 230. Current RFS can flow through the current path defined by the fifth pad PD5, the second ring trace 230rt2 connected to the fifth pad PD5, the third electrode 230, a portion of the first ring trace 230rt1 connected to the third pad PD3, and the third pad PD3. The current path can have a coil shape. Therefore, in the charging drive modes of the second modes MD2-d and MD2, the resonant circuit of the pen PN can be charged through the current path.

[0271] According to this disclosure, the current path of the loop coil pattern can be implemented by components included in the sensor layer 200. Therefore, the electronic device 1000 (see...) Figure 2A The pen PN can be charged using the sensor layer 200. Therefore, since there is no need to add a separate component including a coil for charging the pen PN, there is no increase in the thickness, weight, or reduction in the flexibility of the electronic device 1000.

[0272] In charging drive mode, the first electrode 210, the second electrode 220, the first auxiliary electrode 240-1, and the second auxiliary electrode 240-2 can be grounded, have an applied constant voltage, or be electrically floating. For example, the first electrode 210, the second electrode 220, the first auxiliary electrode 240-1, and the second auxiliary electrode 240-2 can be floating. In this case, the current RFS may not flow through the first electrode 210, the second electrode 220, the first auxiliary electrode 240-1, and the second auxiliary electrode 240-2.

[0273] Figure 25A This is used to explain the second modes MD2-d and MD2 (see) according to one or more embodiments of this disclosure. Figure 21 (The image is shown.) Figure 25B This is a diagram used to explain a second mode based on a single sensing unit SU according to one or more embodiments of the present disclosure.

[0274] Reference Figure 25A and Figure 25B The second mode, MD2-d, and MD2 (see...) Figure 21 It can include a charging drive mode and a pen sensing drive mode. Figure 25A and Figure 25B This is a diagram used to explain the pen sensing drive mode.

[0275] Reference Figure 25A In pen sensing drive mode, a first receiving signal PRX1 can be output from the first electrode 210, and a second receiving signal PRX2 can be output from the second electrode 220. Figure 25B This shows the pen PN (see Figure 6 A single sensing unit SU in which the first induced current Ia, the second induced current Ib, the third induced current Ic, and the fourth induced current Id generated flow.

[0276] Reference Figure 25A and Figure 25B In one or more embodiments of this disclosure, the wiring directions of one electrode and another electrode stacked on top of each other in the sensor layer 200 may be different. For example, the wiring directions of the first electrode 210x and the third electrode 230x may be different. Additionally, the wiring directions of the second electrode 220x and the fourth electrode 240x may be different. For example, in... Figure 25BIn this design, the first electrode 210x and the first trace 210t can be connected to each other at the lower part of the sensing unit SU, and the third electrode 230x and the first annular trace 230rt1 can be connected to each other at the upper part of the sensing unit SU. The second electrode 220x and the second trace 220t can be connected to each other at the right side of the sensing unit SU, and the fourth electrode 240x and the fourth trace 240t can be connected to each other at the left side of the sensing unit SU. The fourth trace 240t can be... Figure 8 The first auxiliary trace 240-1t is described in the text.

[0277] The RLC resonant circuit of the pen PN can emit a magnetic field at its resonant frequency while releasing the charged charge. A first induced current Ia can be generated in the first electrode 210x by the magnetic field provided by the pen PN, and a second induced current Ib can be generated in the second electrode 220x. In addition, a third induced current Ic can be generated in the third electrode 230x, and a fourth induced current Id can be generated in the fourth electrode 240x.

[0278] The first coupling capacitor Ccp1 can be located between the third electrode 230x and the first electrode 210x, and the second coupling capacitor Ccp2 can be located between the fourth electrode 240x and the second electrode 220x. The third induced current Ic can be transmitted to the first electrode 210x through the first coupling capacitor Ccp1, and the fourth induced current Id can be transmitted to the second electrode 220x through the second coupling capacitor Ccp2.

[0279] The sensor driver 200C can receive a first received signal PRX1a based on a first induced current Ia and a third induced current Ic from the first electrode 210x, and can receive a second received signal PRX2a based on a second induced current Ib and a fourth induced current Id from the second electrode 220x. The sensor driver 200C can detect the input coordinates of the pen PN based on the first received signal PRX1a and the second received signal PRX2a.

[0280] The sensor driver 200C can receive a first received signal PRX1a from the first electrode 210x and a second received signal PRX2a from the second electrode 220x. At this time, one end of the third electrode 230x and one end of the fourth electrode 240x can be floating. Therefore, the compensation of the sensing signal can be improved or maximized through coupling between the first electrode 210x and the third electrode 230x, and between the second electrode 220x and the fourth electrode 240x.

[0281] Furthermore, the other ends of the third electrode 230x and the fourth electrode 240x can be grounded or floating. Therefore, the third induced current Ic and the fourth induced current Id can be sufficiently transmitted to the first electrode 210x and the second electrode 220x through the coupling between the first electrode 210x and the third electrode 230x, and the coupling between the second electrode 220x and the fourth electrode 240x.

[0282] According to the present disclosure described above, the first impedance of the first auxiliary electrode group and the second impedance of the second auxiliary electrode group can be matched to be substantially the same. In this case, the deviation in the amount of change in mutual capacitance between the first and second electrodes caused by the first and second auxiliary electrode groups can be reduced or minimized. As the deviation decreases, the probability of touch failure can be reduced or eliminated. As a result, the touch reliability of the sensor layer can be improved.

[0283] Although this disclosure has been described with reference to embodiments, it will be understood that various changes and modifications can be made to this disclosure by those skilled in the art or those with general knowledge of the art without departing from the spirit and technical field of the disclosure as claimed herein.

[0284] Therefore, the actual scope of protection of this disclosure should be determined by the technical scope of the appended claims and their functional equivalents included therein.

Claims

1. An electronic device, the electronic device comprising: Display layer; as well as A sensor layer, above the display layer, includes: a plurality of first electrodes arranged along a first direction; a plurality of second electrodes intersecting the plurality of first electrodes and arranged along a second direction intersecting the first direction; a first auxiliary electrode group including a plurality of first auxiliary electrodes arranged along the second direction and a first auxiliary trace electrically connected to the plurality of first auxiliary electrodes; and a second auxiliary electrode group having an impedance equal to that of the first auxiliary electrode group, and including a plurality of second auxiliary electrodes arranged along the second direction and a second auxiliary trace electrically connected to the plurality of second auxiliary electrodes.

2. The electronic device according to claim 1, wherein, The sensor layer further includes a first pad connected to the first auxiliary trace and a second pad connected to the second auxiliary trace, and The plurality of second auxiliary electrodes are located between the plurality of first auxiliary electrodes and a pad region in which the first pad and the second pad are positioned.

3. The electronic device according to claim 1, wherein, The plurality of first auxiliary electrodes includes first auxiliary electrodes. The plurality of second auxiliary electrodes include second auxiliary electrodes. Wherein, the plurality of first electrodes includes a first electrode that intersects with the first auxiliary electrode and the second auxiliary electrode, and The plurality of second electrodes include a second-1 electrode superimposed on the first auxiliary electrode and a second-2 electrode superimposed on the second auxiliary electrode.

4. The electronic device according to claim 3, wherein, The resistance of the first auxiliary electrode is equal to the resistance of the second auxiliary electrode, and Wherein, the resistance of the first auxiliary trace is equal to the resistance of the second auxiliary trace.

5. The electronic device according to claim 3, wherein, The capacitance between the first auxiliary electrode and the first electrode is equal to the capacitance between the second auxiliary electrode and the first electrode.

6. The electronic device according to claim 3, wherein, The capacitance between the first auxiliary electrode and the second-1 electrode is equal to the capacitance between the second auxiliary electrode and the second-2 electrode.

7. The electronic device according to claim 3, wherein, The first substrate capacitance between the first auxiliary electrode and the common electrode of the light-emitting element in the display layer is equal to the second substrate capacitance between the second auxiliary electrode and the common electrode.

8. The electronic device according to claim 3, wherein, The first auxiliary trace has a larger resistance than the second auxiliary trace, and The first auxiliary electrode has a lower resistance than the second auxiliary electrode.

9. The electronic device according to claim 3, wherein, The resistance of the first auxiliary trace is greater than the resistance of the second auxiliary trace, and The capacitance corresponding to the first auxiliary electrode is smaller than the capacitance corresponding to the second auxiliary electrode.

10. The electronic device according to claim 9, wherein, The capacitance between the first auxiliary electrode and the first electrode is less than the capacitance between the second auxiliary electrode and the first electrode.

11. The electronic device according to claim 9, wherein, The capacitance between the first auxiliary electrode and the second-1 electrode is less than the capacitance between the second auxiliary electrode and the second-2 electrode.

12. The electronic device according to claim 9, wherein, The first substrate capacitance between the first auxiliary electrode and the common electrode of the light-emitting element in the display layer is less than the second substrate capacitance between the second auxiliary electrode and the common electrode.

13. The electronic device according to claim 3, wherein, The first auxiliary electrode has a first grid structure. The second auxiliary electrode has a second mesh structure. Within a certain region, the surface area occupied by the first grid structure is greater than the surface area occupied by the second grid structure.

14. The electronic device according to claim 3, wherein, The first auxiliary electrode includes: First auxiliary pattern; and An additional auxiliary pattern is placed on a different layer than the layer where the first auxiliary pattern is located, and is electrically connected to the first auxiliary pattern.

15. The electronic device according to claim 3, wherein, The sensor layer also includes an insulating layer. The first electrode includes a first sensing pattern above the insulating layer and a first bridging pattern between the insulating layer and the display layer and connected to the first sensing pattern. The second auxiliary electrode includes a second-first auxiliary electrode and a second-second auxiliary electrode above the second-first auxiliary electrode. The second-first auxiliary electrode is located between the insulating layer and the display layer. Wherein, the capacitance between the first auxiliary electrode and the first electrode is less than the capacitance between the second auxiliary electrode and the first electrode.

16. The electronic device according to claim 15, wherein, The insulating layer includes an organic layer.

17. The electronic device according to claim 15, wherein, The portion of the second auxiliary electrode between the display layer and the insulating layer has a larger surface area than the portion of the first auxiliary electrode between the display layer and the insulating layer.

18. The electronic device of claim 1, further comprising a sensor driver configured to drive the sensor layer. in, The sensor layer further includes: a plurality of third electrodes, arranged along the first direction to overlap with the plurality of first electrodes, and The sensor driver is further configured to selectively operate in a first mode for sensing touch input and a second mode for sensing pen input, the second mode including: a charging drive mode in which the sensor driver is configured to provide a first signal to at least one of the plurality of third electrodes and a second signal to at least another of the plurality of third electrodes; and a pen sensing drive mode in which the sensor driver is configured to receive a first receiving signal from the plurality of first electrodes and a second receiving signal from the plurality of second electrodes.

19. An electronic device, the electronic device comprising: Multiple first electrodes; Multiple second electrodes intersect with the multiple first electrodes; The first auxiliary electrode group includes a plurality of first auxiliary electrodes and a first auxiliary trace electrically connected to the plurality of first auxiliary electrodes; as well as The second auxiliary electrode group has an impedance equal to that of the first auxiliary electrode group, and includes a plurality of second auxiliary electrodes and a second auxiliary trace electrically connected to the plurality of second auxiliary electrodes.

20. The electronic device according to claim 19, wherein, The resistance of the first auxiliary electrode group is equal to the resistance of the second auxiliary electrode group, and the capacitive reactance of the first auxiliary electrode group is equal to the capacitive reactance of the second auxiliary electrode group, or The first auxiliary electrode group has a resistance greater than that of the second auxiliary electrode group, and the first auxiliary electrode group has a capacitive reactance smaller than that of the second auxiliary electrode group.

Images