A cabinet power supply based on independent liquid cooling plate heat dissipation and a mounting method

Abstract

The application relates to a cabinet power supply based on independent liquid cooling plate heat dissipation and a mounting method, which comprises a power supply module, a PCBA and a shell for accommodating the PCBA, the shell being provided with a connecting port for electrically connecting the power supply module with external equipment; an independent liquid cooling plate, the independent liquid cooling plate being internally provided with a cooling water channel for cooling liquid flow and a water nozzle for connecting the cooling water channel with an external liquid cooling pipeline to form a cooling liquid circulation loop; and the independent liquid cooling plate abuts against a heat dissipation bottom plate of the shell. The application completely separates the electrical link of the cabinet power supply from the liquid cooling link, realizes maintenance of the power supply module without disassembly of the liquid pipeline, avoids the risk of liquid leakage, does not affect the heat dissipation of the whole machine, is convenient to assemble and maintain, simplifies the processing technology, reduces the cost and has better heat dissipation performance.

Description

Technical Field

[0001] This invention relates to the field of power supply technology, and more specifically, to a cabinet power supply and installation method based on independent liquid cooling plate heat dissipation. Background Technology

[0002] As the global energy landscape accelerates its shift from fossil fuels to electric power, the power demands on power modules (AC-DC, DC-DC, DC-AC) in power electronics applications such as new energy vehicle powertrains, charging pile cabinets, energy storage cabinets, and data center power supply cabinets continue to rise, making heat dissipation a common technical challenge in the industry.

[0003] Currently, the main heat dissipation methods for power modules are air cooling and liquid cooling. Air cooling directly cools heat-generating components in the power module, such as inductors, transformers, and high-frequency power devices, using fans. Air cooling achieves this by directly contacting the heat source with the cooling airflow, and its simple airflow design allows for rapid heat dissipation. However, high fan speeds result in loud noise and a limited lifespan; the equipment has a low protection rating, making it prone to dust accumulation that hinders heat dissipation; it is also susceptible to failure in humid or high-salt-spray environments, leading to a short overall product lifespan and frequent maintenance and replacements.

[0004] Liquid cooling effectively solves the noise, protection, lifespan, and maintenance issues associated with air cooling. It is mainly divided into internal water channel liquid cooling and immersion liquid cooling. However, internal water channel liquid cooling has a complex manufacturing process, and the coolant interface has a high coupling degree with the heat-generating components inside the power module (e.g., power semiconductors, high-frequency inductors, and transformers), making installation and maintenance complex and costly. Immersion liquid cooling requires immersing the power module's PCBA in a special non-conductive liquid medium. While it offers good heat dissipation efficiency, the coolant is a special medium, resulting in high costs. Furthermore, to avoid chemical reactions with numerous components within the module, upstream and downstream manufacturers need to collaborate on compatibility. Large-scale industrialization still requires technological breakthroughs. Summary of the Invention

[0005] The technical problem to be solved by this invention is that the installation and maintenance of existing cabinet power supplies with liquid cooling are complex and costly, making large-scale industrialization impossible. In view of the above-mentioned defects of the existing technology, a cabinet power supply based on independent liquid cooling plate heat dissipation and its installation method are proposed.

[0006] The technical solution adopted by the present invention to solve its technical problem is: to propose a cabinet power supply based on independent liquid cooling plate heat dissipation, including: a power module, the power module including one or more PCBAs, and a housing for accommodating the PCBAs, the housing being provided with a connection port for the power module to electrically connect with external devices; An independent liquid cooling plate, wherein the independent liquid cooling plate is provided with cooling water channels for coolant flow and water nozzles for connecting the cooling water channels to external liquid cooling pipes to form a circulating coolant circuit. The independent liquid cooling plate is in direct contact with the heat dissipation base plate of the casing or through a heat-conducting medium.

[0007] In some embodiments, the connection port includes an input connection port and an output connection port.

[0008] In some embodiments, at least one of the PCBAs includes a power semiconductor based on a top thermal package.

[0009] In some embodiments, the power module further includes an insulating thermally conductive material, and the top-packaged power semiconductor abuts against the inner surface of the heat sink base plate through the insulating thermally conductive material.

[0010] In some embodiments, the power module further includes a contoured heat sink disposed on the inner surface of the heat sink base plate, the contoured heat sink abutting against the heat-generating components on the PCBA.

[0011] In some embodiments, the contoured heat sink includes a contoured groove and a contoured boss.

[0012] In some embodiments, the outer surfaces of the heat dissipation base plate and the independent liquid cooling plate are smooth surfaces.

[0013] In some embodiments, the power module further includes a pressure component disposed on the housing or cabinet.

[0014] In some embodiments, one of the independent liquid cooling plates may abut against at least one of the heat dissipation base plates of the housing.

[0015] This invention also proposes a cabinet power supply installation method based on independent liquid cooling plate heat dissipation, comprising: S1, Fix the independent liquid cooling plate on the rack; S2, Install the power module above the independent liquid cooling plate; S3, connect the independent liquid cooling plate to the water channel loop and make electrical connections to the power module; Alternatively, in step S2, the independent liquid cooling plate is connected to a water channel loop. S3, Install the electrical module above the liquid cooling plate and make electrical connections.

[0016] The rack power supply based on independent liquid cooling plate heat dissipation of the present invention has the following beneficial effects: When the power module fails and needs to be replaced, repaired, or upgraded, there is no need to disassemble or unplug the already installed coolant pipeline, realizing maintenance of the power module without disassembling the liquid circuit; it avoids repeated plugging and unplugging of the liquid cooling interface, reducing the risk of interface sealing failure and pipeline leakage from the source, and avoiding leakage risks; it does not require modification of the rack series liquid cooling circuit, will not interfere with the normal liquid cooling heat dissipation of other equipment in the same circuit, and does not affect the overall heat dissipation; the power module is a modular independent structure, which is simple to install and align, quick to disassemble, convenient for future expansion and model upgrades, and easy to assemble and maintain; the power module and the independent liquid cooling plate are manufactured separately, which simplifies the structure, reduces the difficulty of production and manufacturing process, and reduces mass production costs, reflecting the advantages of process and cost; the PCBA conducts heat through a large-area bonding between the power module heat dissipation base plate and the liquid cooling plate, with low thermal resistance and high heat exchange efficiency, adapting to the high heat flux density heat dissipation requirements of high-power rack power supplies, and has better heat dissipation performance. Attached Figure Description

[0017] The present invention will be further described below with reference to the accompanying drawings and embodiments. In the accompanying drawings: Figure 1 This is a schematic diagram of the cabinet power supply structure based on independent liquid cooling plate heat dissipation according to the present invention; Figure 2 yes Figure 1 The diagram shows the structure of the power module and the independent liquid cooling plate. Figure 3 This is a schematic diagram of the power module of the present invention; Figure 4 yes Figure 3 The exploded view of the power module shown. Figure 5 This is a schematic diagram of the heat dissipation base plate of the present invention; Figure 6 This is a schematic diagram of the heat conduction path of the cabinet power supply of the present invention; Figure 7 This is a flowchart illustrating the cabinet power supply installation method of the present invention. Figure 1 ; Figure 8 This is a flowchart illustrating the cabinet power supply installation method of the present invention. Figure 2 .

[0018] Label Explanation: Power module 1, PCBA 11, chassis 12, heat dissipation base plate 121, contoured heat sink 122, contoured groove 1221, contoured boss 1222, top cover 123, side plate 124, front panel 125, rear panel 126, connection port 1261. Independent liquid cooling plate 2, water nozzle 21; Rack 3. Detailed Implementation

[0019] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0020] Please refer to Figures 1-4 This invention proposes a cabinet power supply based on independent liquid cooling plate heat dissipation, comprising: a power module 1, which includes one or more PCBAs 11 and a housing 12 for accommodating the PCBAs 11 boards, the housing 12 having a connection port 1261 for electrical connection between the power module 1 and external devices; an independent liquid cooling plate 2, which has cooling water channels for coolant flow and water nozzles 21 for connecting the cooling water channels to external liquid cooling pipes to form a circulating coolant circuit; the independent liquid cooling plate 2 directly abuts against the heat dissipation base plate 121 of the housing 12 or abuts against it through a heat-conducting medium.

[0021] Specifically, the rack power supply can be equipped with one or more power modules 1. Each power module 1 includes a housing 12, and the housing 12 contains an independent cavity. Several PCBA 11 boards can be installed within the independent cavity. Depending on the actual needs of the rack power supply, several independent liquid cooling plates 2 can be installed. Each independent liquid cooling plate 2 can be connected to one or more power modules 1, so that a single independent liquid cooling plate 2 can dissipate heat for multiple power modules 1 connected in series and parallel, thereby achieving the power level required for the actual application scenario.

[0022] Please refer to Figure 4 The independent liquid cooling plate 2 contains cooling water channels, which are connected to external liquid cooling pipes via water nozzles 21 to form a circulating coolant circuit. The bottom of the power module 1's housing 12 is a heat dissipation base plate 121, whose outer surface is in close contact with the surface of the independent liquid cooling plate 2, achieving surface contact heat conduction. Please refer to... Figure 6When coolant flows through the cooling channels, the heat inside the power module 1 is first transferred to the outer bottom surface of the housing 12 (i.e., the outer surface of the cooling base plate 121) via the heat dissipation base plate 121, and then to the independent liquid cooling plate 2. Finally, it is carried away by the coolant passing through the independent liquid cooling plate 2, achieving efficient liquid cooling. The rack power supply of this invention separates the built-in water channels of the existing liquid-cooled power module 1 from the inside of the power module 1. That is, it physically decouples all PCBA11 boards (including all electronic components) from the cooling channels in the power module 1. The electrical links and liquid cooling links are completely separated and uncoupled, and installation, disassembly, and maintenance operations do not affect each other. At the same time, the separately established power module 1 reduces the volume of the power module 1, increasing the power density of a single power module 1, thereby increasing the power density of the rack power supply. The PCBA11 and cooling channels of the power module 1 are respectively set in two independent cavities, without any nesting relationship, achieving an independent layout in terms of physical structure. When the power module 1 malfunctions and needs to be replaced or repaired, there is no need to disassemble the already installed cooling water channel, thus avoiding affecting the heat dissipation of other devices connected in series in the coolant channel circuit. At the same time, it avoids the risk of leakage that may be caused by unnecessary plugging and unplugging. As a result, the cabinet power supply of the present invention is not only easy to install and disassemble, but also easy to maintain and upgrade. In addition, the manufacturing process is simple, the cost is low, and the heat dissipation effect is good.

[0023] In some embodiments, a thermally conductive medium is applied between the outer surface of the heat dissipation base plate 121 and the upper surface of the independent liquid cooling plate 2, and the independent liquid cooling plate 2 and the heat dissipation base plate 121 of the housing 12 abut against each other through the thermally conductive medium. The thermally conductive medium fully fills the air gap between the heat dissipation base plate 121 and the independent liquid cooling plate 2, increasing the effective contact area between the heat dissipation base plate 121 and the independent liquid cooling plate 2, thereby achieving a better heat dissipation effect. At the same time, the thermally conductive medium also serves a lubricating function, reducing the resistance caused by friction during insertion and removal. The thermally conductive medium includes, but is not limited to, non-volatile thermally conductive materials such as thermal grease or thermal oil. It can be understood that the independent liquid cooling plate 2 and the heat dissipation base plate 121 of the housing 12 can abut directly or through a thermally conductive medium. The thermally conductive medium can be installed and filled according to the actual needs in the implementation process to achieve a better heat dissipation effect.

[0024] Further, refer to Figure 4 The housing 12 also includes a top cover 123, left and right side panels 124, a front panel 125, and a rear panel 126. A connection port 1261 is located on the rear panel 126, through which the PCBA 11 of the power module 1 is electrically connected to external devices. The number of connection ports 1261 is at least one; during implementation, several input and output connection ports can be provided as needed. The housing 12 is made of a metal thermally conductive medium, allowing for better heat conduction between the power module 1 and the independent liquid cooling plate 2.

[0025] Understandably, the electrical connection between the power module 1 and external devices includes, but is not limited to, connector harnesses.

[0026] Furthermore, the water nozzle 21 includes an inlet and an outlet. The cooling water channel, inlet and outlet are connected to other external equipment via a liquid connector or liquid delivery pipe to form a coolant circuit. Alternatively, multiple independent liquid cooling plates 2 can be connected to external equipment via inlets and outlets to form a circulating coolant circuit.

[0027] Furthermore, the power module 1 includes one or more PCBA11, at least one PCBA11 including a power semiconductor based on a top thermal package.

[0028] Power semiconductors include IGBTs, GaN, SiC, and Coolmos. Top-heat-packed power semiconductors can be either conventional discrete semiconductors or top-heat-packed semiconductor power modules (a semiconductor power module is a power module that integrates multiple semiconductor dies at the semiconductor wafer level or semiconductor package level to achieve greater current carrying capacity). For example, conventional discrete semiconductor types for top-heat-packed systems include, but are not limited to, QDPAK, HU3PAK, TCOP10, SSOT10, DFN5X6, and TOLT; common top-heat-packed semiconductor power modules include, but are not limited to, T2PAK / STPAK and DBPAK.

[0029] Furthermore, the power module 1 also includes an insulating and thermally conductive material. The top-packaged power semiconductor abuts against the inner surface of the heat sink 121 through the insulating and thermally conductive material. The insulating and thermally conductive material is a two-component sealant. By filling the air gap between the power semiconductor and the inner surface of the heat sink 121, the heat generated by the power semiconductor during actual operation is quickly transferred to the heat sink 121, and then effectively dissipated through the independent liquid cooling plate 2.

[0030] Furthermore, the power module 1 also includes a contoured heat sink 122 disposed on the inner surface of the heat sink base plate 121. The contoured heat sink 122 abuts against the heat-generating components on the PCBA 11 through an insulating and thermally conductive material. In specific implementations, the specific shapes and heights of the heat-generating components in the PCBA 11 of the power module 1 vary, for example, core heat-generating components such as inductors, transformers, capacitors, and power semiconductors. To ensure sufficient contact between the heat-generating components and the inner surface of the heat sink base plate 121 of the housing 12, the present invention provides a contoured heat sink 122 corresponding to the heat-generating components on the inner surface of the heat sink base plate 121. The contoured heat sink 122 includes, but is not limited to, contoured grooves 1221 and contoured protrusions 1222. The contoured heat sink 122 ensures sufficient contact between the heat-generating components and the inner surface of the heat sink base plate 121, allowing the heat generated by the power module 1 during actual operation to be quickly transferred to the heat sink base plate 121, and then effectively dissipated through the independent liquid cooling plate 2.

[0031] Among them, heat-generating components include, but are not limited to, power semiconductors, inductors, power devices, transformers, etc., based on top heat dissipation packages.

[0032] Furthermore, the outer surfaces of the heat dissipation base plate 121 and the independent liquid cooling plate 2 are smooth surfaces, reducing the air gap between them and allowing the heat dissipation base plate 121 and the independent liquid cooling plate 2 to make full contact, increasing the effective contact degree between the heat dissipation base plate 121 and the independent liquid cooling plate 2, increasing the effective contact area, and making the heat dissipation effect of the power module 1 better.

[0033] Furthermore, the power module 1 also includes a pressure component, which is located on the housing 12 or the cabinet 3, including but not limited to the inner surface of the heat dissipation base plate 121, the upper surface of the housing 12, and other locations within the cabinet 3. The power module 1 is positioned above the cold plate of the independent liquid cooling plate 2. The power module 1's own gravitational potential energy allows it to contact the upper surface of the cold plate of the independent liquid cooling plate 2, achieving heat transfer. The pressure component adds downward pressure to the power module 1, preventing air gaps between the heat dissipation base plate 121 and the independent liquid cooling plate 2 due to incomplete contact points or areas, increasing the effective contact area between the heat dissipation base plate 121 and the independent liquid cooling plate 2, thereby achieving better heat dissipation. It should be noted that in specific implementations, if the power module 1 achieves good heat transfer by relying solely on its own gravitational potential energy to contact the upper surface of the cold plate of the independent liquid cooling plate 2, and meets the system's heat dissipation requirements, the pressure component may not be necessary to achieve cost reduction and efficiency improvement.

[0034] As can be seen from the above, the cabinet power supply based on independent liquid cooling plate heat dissipation of the present invention has the following beneficial effects: When the power module 1 fails, needs to be replaced, repaired, or upgraded, there is no need to disassemble or unplug the already laid coolant pipeline, realizing maintenance of the power module 1 without disassembling the liquid circuit; it avoids repeated plugging and unplugging of the liquid cooling interface, reducing the risk of interface sealing failure and pipeline leakage from the root, and avoiding leakage risks; it does not require modification of the cabinet series liquid cooling circuit, will not interfere with the normal liquid cooling heat dissipation of other equipment in the same circuit, and will not affect the overall heat dissipation; the power module 1 is a modular independent structure, which is simple to install and align, quick to disassemble, convenient for future expansion and model upgrades, and easy to assemble and maintain; the power module 1 and the independent liquid cooling plate 2 are manufactured separately, which simplifies the structure, reduces the difficulty of production and manufacturing process, and reduces mass production costs, reflecting the advantages of process and cost; the PCBA11 conducts heat through the large-area bonding between the heat dissipation base plate 121 of the power module 1 and the liquid cooling plate, with low thermal resistance and high heat exchange efficiency, adapting to the high heat flux density heat dissipation requirements of high-power cabinet power supplies, and has better heat dissipation performance.

[0035] Please refer to Figures 7-8 The present invention also proposes a cabinet power supply installation method based on independent liquid cooling plate heat dissipation, including the following steps: Step 1: Securely install the independent liquid cooling plate onto the rack; Step 2: Install the power module above the independent liquid cooling plate; Step 3: Connect the independent liquid cooling plate to the water channel loop and make electrical connections to the power module; Alternatively, in step two, connect the independent liquid cooling plate to the water channel loop; Step 3: Install the electrical module above the independent liquid cooling plate and make electrical connections.

[0036] The contents not described in detail in this specification are existing technologies known to those skilled in the art.

[0037] The above embodiments are only for illustrating the technical concept and features of the present invention, and are intended to enable those skilled in the art to understand the content of the present invention and implement it accordingly. They do not limit the scope of protection of the present invention. All equivalent changes and modifications made within the scope of the claims of the present invention should fall within the scope of the claims of the present invention.

[0038] It should be understood that those skilled in the art can make improvements or modifications based on the above description, and all such improvements and modifications should fall within the protection scope of the appended claims.

Claims

1. A rack power supply based on independent liquid cooling plate heat dissipation, characterized in that, include: A power module, comprising one or more PCBAs and a housing for accommodating the PCBAs, the housing having a connection port for electrically connecting the power module to an external device; An independent liquid cooling plate, wherein the independent liquid cooling plate is provided with cooling water channels for coolant flow and water nozzles for connecting the cooling water channels to external liquid cooling pipes to form a circulating coolant circuit. The independent liquid cooling plate is in direct contact with the heat dissipation base plate of the casing or through a heat-conducting medium.

2. The rack power supply based on independent liquid cooling plate heat dissipation according to claim 1, characterized in that, The connection ports include input connection ports and output connection ports.

3. The rack power supply based on independent liquid cooling plate heat dissipation according to claim 1, characterized in that, At least one of the PCBAs includes a power semiconductor based on a top heatsink package.

4. The rack power supply based on independent liquid cooling plate heat dissipation according to claim 3, characterized in that, The power module also includes an insulating and thermally conductive material, and the top-packaged power semiconductor abuts against the inner surface of the heat sink base plate through the insulating and thermally conductive material.

5. The rack power supply based on independent liquid cooling plate heat dissipation according to claim 4, characterized in that, The power module also includes a contoured heat sink disposed on the inner surface of the heat sink base plate, the contoured heat sink abutting against the heat-generating components on the PCBA.

6. The rack power supply based on independent liquid cooling plate heat dissipation according to claim 5, characterized in that, The contoured heat sink includes a contoured groove and a contoured boss.

7. The rack power supply based on independent liquid cooling plate heat dissipation according to claim 1, characterized in that, The outer surfaces of the heat dissipation base plate and the independent liquid cooling plate are smooth surfaces.

8. The rack power supply based on independent liquid cooling plate heat dissipation according to claim 1, characterized in that, The power module also includes a pressure component, which is located on the housing or cabinet.

9. The rack power supply based on independent liquid cooling plate heat dissipation according to claim 1, characterized in that, One of the independent liquid cooling plates may abut against at least one of the heat dissipation base plates of the housing.

10. A cabinet power supply installation method based on independent liquid cooling plate heat dissipation, characterized in that: include: Step 1: Securely install the independent liquid cooling plate onto the rack; Step 2: Install the power module above the independent liquid cooling plate; Step 3: Connect the independent liquid cooling plate to the water channel loop and make electrical connections to the power module; Alternatively, in step two, the independent liquid cooling plate is connected to a water channel loop. Step 3: Install the electrical module above the liquid cooling plate and make electrical connections.

Images