Industrial silicon purification device and method

Abstract

The application discloses an industrial silicon fine selection and purification device and method, which comprises a heating heat conduction mechanism, a segmented temperature control mold mechanism and a nut cap body. The heating heat conduction mechanism comprises a bearing table, the top of the bearing table is provided with a diffusion groove, and the inner side of the diffusion groove is provided with a round water frame. The application relates to the technical field of industrial silicon purification. The industrial silicon fine selection and purification device and method are characterized in that the bottom of the bearing table is provided with the segmented temperature control mold mechanism, and the segmented temperature control mold mechanism comprises a bottom temperature mold, a medium temperature mold and a top temperature mold. The three structures can form a stable segmented gradient temperature control environment when the silicon melt is cooled by operating the three different molds. Compared with a traditional heat preservation layer, the electromagnetic heating plate arranged on the surface of the medium temperature mold can be adjusted in time according to the temperature state of the bottom temperature mold and the top temperature mold, so that the correction of the upper and lower heat rates is ensured.

Description

Technical Field

[0001] This invention relates to the field of industrial silicon purification technology, specifically to an industrial silicon refining and purification apparatus and method. Background Technology

[0002] With the rapid development of the photovoltaic and semiconductor industries, the market demand for high-purity industrial silicon continues to rise. The metallurgical method has become the mainstream technical route for preparing solar-grade high-purity industrial silicon due to its advantages such as low process cost, low pollution, and large-scale production. Its core step is directional solidification, which guides the silicon melt to solidify from bottom to top by constructing a unidirectional temperature field. By utilizing the difference in solubility of impurities in silicon melt and solid silicon, the impurities are separated from pure silicon, and finally high-purity silicon ingots are obtained.

[0003] The effectiveness of directional solidification directly depends on the precise control of the temperature field. As the core carrier for constructing the temperature field, the mold's structural design has a decisive impact on purification efficiency, ingot quality, and production benefits. Currently, most directional solidification molds widely used in the industry are integral structures with a single bottom cooling or top heat dissipation mechanism. While they can achieve basic directional solidification functions, they reveal many insurmountable defects in actual industrial production, such as:

[0004] 1. Insufficient temperature field control precision and low impurity separation efficiency. Existing integral molds cannot achieve segmented temperature control. The cooling rate at the bottom and the heat preservation rate in the middle are difficult to match, resulting in uneven axial temperature gradient distribution. Furthermore, heat loss easily occurs in the radial direction, forming a transverse temperature gradient. This disrupts the planar advancement state of the unidirectional solidification front, making it difficult for impurities to be stably squeezed into the unsolidified melt at the top, which easily leads to problems such as impurity dispersion and incomplete segregation.

[0005] 2. Poor synergy between thermal conductivity and insulation leads to unstable ingot quality. Traditional mold bottom heat conduction structures are mostly single-channel water-cooling designs, with small heat conduction contact area and low heat conduction efficiency, making it impossible to quickly build a stable solidification initiation surface. Furthermore, the lack of efficient insulation structure in the middle of the mold allows heat to easily dissipate from the side walls, further exacerbating temperature field disorder. This not only reduces the impurity separation effect but also causes significant thermal stress inside the ingot, leading to cracking.

[0006] 3. Fixed structure, high maintenance cost and poor adaptability. Most existing molds are integrated and non-separable structures. If the bottom heat conduction layer is worn, the middle insulation layer ages or the top structure is damaged, the entire mold needs to be replaced, resulting in short mold life and increased maintenance costs.

[0007] 4. Traditional molds often use simple flange seals, which are prone to argon gas leakage, causing oxidation of the silicon melt during solidification and introducing oxygen impurities.

[0008] To address the shortcomings of the existing technology, a directional solidification mold structure is designed that can regulate the temperature field, improve impurity separation efficiency, ensure ingot quality, and is easy to maintain. Summary of the Invention

[0009] To address the shortcomings of existing technologies, this invention provides an industrial silicon refining and purification apparatus and method, which solves the problem of instability in existing industrial silicon directional solidification purification processes.

[0010] To achieve the above objectives, the present invention provides the following technical solution: an industrial silicon refining and purification device, comprising a heating and heat conduction mechanism, a segmented temperature control mold mechanism, and a nut cap body. The heating and heat conduction mechanism includes a support platform. A diffusion groove is formed on the top of the support platform. A circular water frame is provided on the inner side of the diffusion groove. An arc water frame is fixedly connected to the surface of the circular water frame through an opening. Both the circular and arc water frames are in contact with the inner wall of the diffusion groove. A threaded pipe is fixedly connected to the bottom of the circular water frame through an opening. The bottom end of the threaded pipe passes through the support platform and extends to the bottom of the support platform. A water injection pipe is threadedly connected to the inner side of the threaded pipe. A water pump is fixedly connected to the bottom of the support platform. The bottom end of the water injection pipe is rotatably connected to the outlet of the water pump through a bearing. A drain pipe is fixedly connected to the bottom of the arc water frame through an opening. The bottom end of the drain pipe passes through the support platform and extends to the bottom of the support platform. The segmented temperature control mold mechanism is installed on the top of the support platform.

[0011] Preferably, protective frames are fixedly installed on both sides, front and rear of the top of the support platform by brackets. A guide rod is fixedly connected to the top of the protective frame. A sliding sleeve plate is slidably installed on the surface of the guide rod. A first spring is sleeved on the surface of the guide rod. An arc-shaped pressure plate is fixedly connected to one side of the sliding sleeve plate. A pressing port for cooperating with the arc-shaped pressure plate is opened on the top of the protective frame.

[0012] Preferably, a rebound rod is slidably installed on one side of the protective frame through an opening. An electromagnetic heating plate is fixedly connected to one end of the rebound rod located in the inner cavity of the protective frame, and a retaining plate is fixedly connected to the other end of the rebound rod. A second spring is sleeved on the surface of the rebound rod between the protective frame and the retaining plate. A curved pressure frame that cooperates with the arc-shaped pressure plate is fixedly connected to one side of the electromagnetic heating plate.

[0013] Preferably, side sliding grooves are provided on both sides of the load-bearing platform, and a threaded cylinder is fixedly installed on the surface of the load-bearing platform through an opening. A side sliding column is slidably installed on the inner side of the side sliding groove. A push-pull plate is fixedly connected between the front ends of the two side sliding columns. A threaded column that cooperates with the threaded cylinder is rotatably connected to the surface of the push-pull plate through an opening. A lower pressure plate is fixedly installed on the top between the two side sliding columns through a bracket. A cylinder is fixedly installed on the top of the lower pressure plate through an opening. A sealing cover is fixedly installed on the bottom end of the cylinder.

[0014] Preferably, solenoid valve tubes are fixedly installed on both sides of the top of the sealing cover through openings. A motor is fixedly installed on the surface of the sealing cover by a bracket. The output shaft of the motor is fixedly connected to a reciprocating screw through a coupling. The rear end of the reciprocating screw passes through the sealing cover and is rotatably connected to the rear part of the inner cavity of the sealing cover through a bearing. Horizontal guide rods are fixedly connected on both sides between the front and rear parts of the inner cavity of the sealing cover. Threaded sleeves are slidably installed on the two horizontal guide rod brackets and are threadedly connected to the reciprocating screw. A main air pipe is fixedly connected to the bottom of the threaded sleeve. An air jet head is fixedly connected to the bottom of the main air pipe through an opening. Air delivery pipes are fixedly installed on both sides of the surface of the main air pipe through openings, and the top end of the air delivery pipe passes through the sealing cover and extends to the outside of the sealing cover.

[0015] Preferably, the sealing cover has side pressure heads that cooperate with the sliding sleeve plate fixedly connected to both sides, front and rear of the sealing cover by fixing plates, a strip block fixedly connected to the bottom of the sealing cover, and limit posts fixedly installed on both sides of the protective frame by brackets.

[0016] Preferably, a first bolt post is installed on the top of the support platform, and an exhaust hole is provided on the top of the sealing cover.

[0017] Preferably, the segmented temperature control mold mechanism includes a bottom temperature mold, a medium temperature mold, and a top temperature mold, and the bottom temperature mold, the medium temperature mold, and the top temperature mold are stacked vertically in sequence. The medium temperature mold, the bottom temperature mold, and the top temperature mold are all provided with sealing grooves on opposite sides. A sealing gasket is provided on the inner side of the sealing groove. The bottom of the bottom temperature mold is fixedly installed with a heat-conducting base plate that cooperates with the circular water frame and the arc water frame through an opening.

[0018] Preferably, a collar plate is fixedly connected to the bottom of the surface of the bottom temperature mold, and the collar plate is sleeved on the surface of the first bolt post. A second bolt post is fixedly installed on the top edge side of the bottom of the bottom temperature mold and the middle temperature mold. A mating insertion hole for use with the second bolt post is opened on the bottom edge side of the middle temperature mold and the top temperature mold. The nut cap body is threadedly connected to the first bolt post and the second bolt post. Fins are fixedly installed on both sides, as well as the front and rear of the top temperature mold. A rectangular slot is opened at the bottom of the top temperature mold. Heating grooves are opened on both sides, as well as the front and rear of the middle temperature mold.

[0019] This invention also provides a method for the refining and purification of industrial silicon, specifically including the following steps:

[0020] S1. Mold installation: Install the bottom temperature mold, medium temperature mold and top temperature mold on the top of the support platform using the nut and cap body, and then align the sealing cover with the top of the top temperature mold.

[0021] S2, Ingot Refining: By rapidly conducting heat to the bottom temperature mold, keeping the medium temperature mold warm, and dissipating heat to the top temperature mold, impurities accumulate on the top of the industrial silicon.

[0022] S3. Impurity Removal: Remove the cooled industrial silicon along with the segmented temperature control mold mechanism from the top of the support platform. Then, open the segmented temperature control mold mechanism to remove the industrial silicon and cut and polish it according to the concentrated area of ​​impurities on the top.

[0023] This invention provides an apparatus and method for the refining and purification of industrial silicon. Compared with existing technologies, it has the following advantages:

[0024] (1) The industrial silicon refining and purification device and method are equipped with a segmented temperature control mold mechanism at the bottom of the support platform. The segmented temperature control mold mechanism includes a bottom temperature mold, a medium temperature mold and a top temperature mold. The configuration of these structures can form a stable segmented gradient temperature control environment by operating the three different molds when the silicon melt is cooled. The electromagnetic heating plate on the surface of the medium temperature mold can be adjusted in time according to the temperature status of the bottom temperature mold and the top temperature mold, so as to ensure the correction of the heating rate of the upper and lower parts. This allows the impurities in the silicon melt to be stably concentrated upward, which is convenient for subsequent cutting and improves the purity of industrial silicon.

[0025] (2) The industrial silicon refining and purification device and method are equipped with a sealing cover on the top of the top temperature mold and a main gas pipe on the inner side of the sealing cover, which is used in conjunction with the exhaust hole. These structural settings enable the reciprocating main gas pipe and the jet nozzle to uniformly and continuously inject argon gas into the top of the silicon melt during directional solidification, thereby expelling the air at the top through the exhaust hole, preventing the silicon melt from contacting the air and generating impurities. Furthermore, the injection of argon gas promotes the discharge of internal hot gas, which, combined with the heat dissipation of the fins, can accelerate the solidification speed at the top, thereby quickly solidifying the impurities and preventing them from sinking.

[0026] (3) The industrial silicon refining and purification device and method divides the mold into three types: bottom temperature mold, medium temperature mold and top temperature mold, and each corresponds to a different temperature end. Sealing gaskets are set between them. The structure can replace the damaged part in time during use, thereby ensuring the safe use of the remaining temperature molds and improving the overall service life of the segmented temperature control mold mechanism. Compared with the traditional one-piece mold, which is damaged and replaced as a whole, it is undoubtedly more cost-effective. Dividing the mold into three temperature segments makes it easier to adjust and match the temperature, and improves the stability of directional cooling. At the same time, the pressing cooperation between the sealing cover and the sliding plate when it is raised and lowered can connect the electromagnetic heating plate with the heating tank for heating during operation and separate it from the medium temperature mold when the operation is completed, turning the heating equipment and the mold into two parts, which facilitates the overall disassembly of the segmented temperature control mold mechanism.

[0027] (4) The industrial silicon refining and purification device and method have a diffusion groove on the top of the support platform and a circular water frame and a drain pipe inside the diffusion groove. These structural settings can improve the flow range and speed of the internal cooling water by using the diffusion design of several arc water frames. Compared with the traditional plate-shaped water frame and single water pipe cooling, the heat conduction efficiency is undoubtedly higher. Moreover, the circular water frame and arc water frame can be connected by threaded pipes and water injection pipes, which can facilitate the disassembly of the diffusion groove, thereby facilitating subsequent maintenance and use. Attached Figure Description

[0028] Figure 1 This is a schematic diagram of the structure of the present invention;

[0029] Figure 2 This is a bottom view of the load-bearing platform structure of the present invention;

[0030] Figure 3 This is a cross-sectional view of the heating and heat conduction mechanism and the segmented temperature control mold mechanism of the present invention;

[0031] Figure 4 This is a schematic diagram of the heating and heat conduction mechanism structure of the present invention;

[0032] Figure 5 This is a rear view of the internal structure of the protective frame of the present invention;

[0033] Figure 6 This is a schematic diagram of the spring rod, electromagnetic heating plate, and bent pressure frame structure of the present invention;

[0034] Figure 7 This is a schematic diagram of the side sliding groove, threaded cylinder, and first bolt column structure of the present invention;

[0035] Figure 8 This is a schematic diagram of the circular water frame, arc water frame, and drainage pipe structure of the present invention;

[0036] Figure 9 This is a schematic diagram of the load-bearing platform and the diffused groove structure of the present invention;

[0037] Figure 10 This is a schematic diagram of the sealing cover, air supply pipe, and motor structure of the present invention;

[0038] Figure 11 This is a cross-sectional view of the sealing cover structure of the present invention;

[0039] Figure 12 This is a schematic diagram of the threaded sleeve, main air pipe, and jet head structure of the present invention.

[0040] Figure 13 This is a schematic diagram of the segmented temperature control mold mechanism structure of the present invention;

[0041] Figure 14 This is a schematic diagram of the structure of the bottom-temperature mold, the medium-temperature mold, and the top-temperature mold of the present invention;

[0042] Figure 15 This is a cross-sectional view of the low-temperature mold structure of the present invention;

[0043] Figure 16 This is a cross-sectional view of the medium-temperature mold structure of the present invention;

[0044] Figure 17 This is a bottom view of the top-temperature mold structure of the present invention.

[0045] In the diagram: 1. Heating and heat conduction mechanism; 2. Segmented temperature control mold mechanism; 3. Nut and cap body; 101. Support platform; 102. Diffuser groove; 103. Circular water frame; 104. Arc water frame; 105. Drain pipe; 106. Threaded connector; 107. Water injection pipe; 108. Water pump; 109. Protective frame; 110. Guide rod; 111. Sliding sleeve plate; 112. First spring; 113. Arc-shaped pressure plate; 114. Lower pressure port; 115. Rebound rod; 116. Electromagnetic heating plate; 117. Bent pressure frame; 118. Second spring; 119. Side sliding groove; 120. Threaded cylinder; 121. Side sliding column; 122. Push-pull plate; 123. Threaded column; 124. Lower pressure plate; 25. Cylinder; 126. Sealing cover; 127. Solenoid valve tube; 128. Horizontal guide rod; 129. Reciprocating lead screw; 130. Threaded sleeve; 131. Main air pipe; 132. Jet nozzle; 133. Air supply pipe; 134. Side pressure head; 135. Motor; 136. First bolt post; 137. Limiting post; 138. Strip block; 139. Exhaust port; 140. Recessing plate; 201. Low-temperature mold; 202. Medium-temperature mold; 203. Top-temperature mold; 204. Sealing groove; 205. Sealing gasket; 206. Second bolt post; 207. Collar plate; 208. Heat-conducting base plate; 209. Butt socket; 210. Heating groove; 211. Fin; 212. Rectangular slot. Detailed Implementation

[0046] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0047] Please see Figures 1-17 The present invention provides a technical solution: an industrial silicon refining and purification device, comprising a heating and heat conduction mechanism 1, a segmented temperature control mold mechanism 2, and a nut cap body 3;

[0048] Please refer to Figure 4 , Figure 5 , Figure 6 , Figure 7 , Figure 8 , Figure 9 , Figure 10 , Figure 11 and Figure 12The diagram illustrates the overall structure of the heating and heat conduction mechanism 1. The mechanism includes a support platform 101. A diffusion groove 102 is formed on the top of the support platform 101. A circular water frame 103 is provided inside the diffusion groove 102. An arc water frame 104 is fixedly connected to the surface of the circular water frame 103 through an opening. Both the circular water frame 103 and the arc water frame 104 are in contact with the inner wall of the diffusion groove 102. A threaded connector 106 is fixedly connected to the bottom of the circular water frame 103 through an opening, and the bottom end of the threaded connector 106 extends through... A water injection pipe 107 is threadedly connected to the inner side of the threaded pipe 106, which passes through the support platform 101 and extends to the bottom of the support platform 101. A water pump 108 is fixedly connected to the bottom of the support platform 101, and the bottom end of the water injection pipe 107 is rotatably connected to the outlet of the water pump 108 through a bearing component. A drain pipe 105 is fixedly connected to the bottom of the arc water frame 104 through an opening, and the bottom end of the drain pipe 105 passes through the support platform 101 and extends to the bottom of the support platform 101. The segmented temperature control mold mechanism 2 is installed on the top of the support platform 101.

[0049] Protective frames 109 are fixedly installed on both sides, front and rear of the top of the load-bearing platform 101 via brackets. A guide rod 110 is fixedly connected to the top of the protective frame 109. A sliding sleeve plate 111 is slidably installed on the surface of the guide rod 110. A first spring 112 is sleeved on the surface of the guide rod 110. An arc-shaped pressure plate 113 is fixedly connected to one side of the sliding sleeve plate 111. A pressing port 114 for cooperating with the arc-shaped pressure plate 113 is opened on the top of the protective frame 109. A spring is slidably installed on one side of the protective frame 109 through an opening. The rod 115 has an electromagnetic heating plate 116 fixedly connected to one end of the rebound rod 115 located in the inner cavity of the protective frame 109. The heating temperature of the electromagnetic heating plate 116 is adjustable from 300℃ to 800℃ and adopts PID temperature control. The other end of the rebound rod 115 is fixedly connected to the push plate 140. A second spring 118 is sleeved on the surface of the rebound rod 115 and between the protective frame 109 and the push plate 140. A curved pressure frame 117 that cooperates with the arc-shaped pressure plate 113 is fixedly connected to one side of the electromagnetic heating plate 116.

[0050] Side sliding grooves 119 are provided on both sides of the load-bearing platform 101. A threaded cylinder 120 is fixedly installed on the surface of the load-bearing platform 101 through an opening. A side sliding column 121 is slidably installed on the inner side of the side sliding groove 119. A push-pull plate 122 is fixedly connected between the front ends of the two side sliding columns 121. A threaded column 123 that cooperates with the threaded cylinder 120 is rotatably connected to the surface of the push-pull plate 122 through an opening. A lower pressure plate 124 is fixedly installed on the top between the two side sliding columns 121 through a bracket. A cylinder 125 is fixedly installed on the top of the lower pressure plate 124 through an opening. A sealing cover 126 is fixedly installed on the bottom end of the cylinder 125.

[0051] Both sides of the top of the sealing cover 126 are fixedly installed with solenoid valve tubes 127 through openings. The solenoid valve tubes 127 are high-temperature resistant solenoid valves used for injecting molten silicon. A motor 135 is fixedly installed on the surface of the sealing cover 126 via a bracket. The output shaft of the motor 135 is fixedly connected to a reciprocating screw 129 via a coupling. The rear end of the reciprocating screw 129 passes through the sealing cover 126 and is rotatably connected to the rear part of the inner cavity of the sealing cover 126 via bearings. Both sides of the inner cavity of the sealing cover 126 are... A horizontal guide rod 128 is fixedly connected. A threaded sleeve 130 is slidably installed on the brackets of the two horizontal guide rods 128. The threaded sleeve 130 is threadedly connected to the reciprocating screw 129. A main air pipe 131 is fixedly connected to the bottom of the threaded sleeve 130. A jet head 132 is fixedly connected to the bottom of the main air pipe 131 through an opening. Air supply pipes 133 are fixedly installed on both sides of the surface of the main air pipe 131 through openings. The top end of the air supply pipe 133 passes through the sealing cover 126 and extends to the outside of the sealing cover 126.

[0052] The sealing cover 126 has side pressure heads 134 that cooperate with the sliding sleeve plate 111 fixedly connected to both sides, front and rear of the sealing cover 126 via fixing plates. The bottom of the sealing cover 126 is fixedly connected to a strip block 138. The protective frame 109 has limit posts 137 fixedly installed on both sides via brackets. The top of the load-bearing platform 101 is equipped with a first bolt post 136. The top of the sealing cover 126 is provided with an exhaust hole 139.

[0053] Please refer to Figure 13 , Figure 14 , Figure 15 , Figure 16 and Figure 17 The structure of the segmented temperature control mold mechanism 2 is shown. The segmented temperature control mold mechanism 2 includes a bottom temperature mold 201, a medium temperature mold 202, and a top temperature mold 203. The bottom temperature mold 201, the medium temperature mold 202, and the top temperature mold 203 are stacked vertically in sequence. The medium temperature mold 202, the bottom temperature mold 201, and the top temperature mold 203 are all provided with sealing grooves 204 on opposite sides. A sealing gasket 205 is provided on the inner side of the sealing groove 204. The sealing gasket 205 is made of high temperature resistant expanded graphite to ensure the sealing performance between the molds and prevent the leakage of silicon melt. The bottom of the bottom temperature mold 201 is fixedly installed with a heat-conducting base plate 208 that works with the circular water frame 103 and the arc water frame 104 through an opening. The heat-conducting base plate 208 is made of copper-tungsten alloy to ensure rapid heat conduction.

[0054] A collar plate 207 is fixedly connected to the bottom of the surface of the bottom temperature mold 201, and the collar plate 207 is sleeved on the surface of the first bolt post 136. A second bolt post 206 is fixedly installed on the top edge side of the bottom temperature mold 201 and the medium temperature mold 202. The bottom edge side of the medium temperature mold 202 and the top temperature mold 203 is provided with a mating insertion hole 209 that is used to cooperate with the second bolt post 206. The nut cap body 3 is threadedly connected to the first bolt post 136 and the second bolt post 206. Fins 211 are fixedly installed on both sides, as well as the front and rear of the top temperature mold 203. A rectangular slot 212 is provided at the bottom of the top temperature mold 203. Heating grooves 210 are provided on both sides, as well as the front and rear of the medium temperature mold 202.

[0055] This invention also discloses a method for the selection and purification of industrial silicon, specifically including the following steps:

[0056] S1. Mold installation: Install the bottom temperature mold 201, the medium temperature mold 202 and the top temperature mold 203 on the top of the support platform 101 through the nut cap body 3, and then make the sealing cover 126 connect with the top of the top temperature mold 203.

[0057] S2, Ingot Refining: By rapidly conducting heat to the bottom temperature mold 201, keeping the medium temperature mold 202 warm, and dissipating heat to the top temperature mold 203, impurities accumulate on the top of the industrial silicon.

[0058] S3. Impurity Removal: Remove the cooled industrial silicon along with the segmented temperature control mold mechanism 2 from the top of the support platform 101, then open the segmented temperature control mold mechanism 2 to remove the industrial silicon, and cut and grind it according to the concentrated area of ​​impurities on the top.

[0059] The more specific steps of the above-mentioned industrial silicon beneficiation and purification method are as follows:

[0060] S1. Mold Installation: First, use a hoisting device to install the bottom temperature mold 201 on the top of the support platform 101, aligning the collar plate 207 with the first bolt post 136. Then, use the nut cap body 3 for threaded fixation. Next, place a sealing gasket 205 inside the sealing groove 204 on the top of the bottom temperature mold 201. Then, install the intermediate temperature mold 202 on top of the bottom temperature mold 201. Finally, install the top temperature mold 203 on top of the intermediate temperature mold 202. Use the nut cap body 3 and the threaded connection of the second bolt post 206 to fix the bottom temperature mold 201, intermediate temperature mold 202, and top temperature mold 203 as a whole. During installation, several limiting posts 137 limit the position to ensure that the bottom temperature mold 201 can be installed in the exact center of the top of the support platform 101. Then, push the push... Pull plate 122 moves sealing cover 126 to the top of top temperature mold 203, then rotates threaded column 123 to connect with threaded cylinder 120 to fix sealing cover 126. Then, start cylinder 125 to push sealing cover 126 down so that sealing cover 126 docks with top temperature mold 203 and closes. Strip block 138 is inserted into the inside of rectangular slot 212 for limiting. During the descent, side pressure head 134 presses the surrounding sliding sleeve plate 111, so that arc surface pressure plate 113 descends through lower pressure port 114 to press the bent pressure frame 117. The bent pressure frame 117 uses the guide of spring rod 115 to push electromagnetic heating plate 116 to move towards medium temperature mold 202 until electromagnetic heating plate 116 is completely docked with heating tank 210. At this time, the installation work is completed.

[0061] S2. Ingot Refining: Open the solenoid valve 127 to inject high-temperature liquid silicon into the inner side of the bottom-temperature mold 201, the medium-temperature mold 202, and the top-temperature mold 203 until the liquid silicon reaches the top of the top-temperature mold 203. Then close the solenoid valve 127. Subsequently, activate the four electromagnetic heating plates 116 to heat the medium-temperature mold 202 and keep the liquid silicon inside the medium-temperature mold 202 warm. Next, start the water pump 108 and inject cooling water into the inner side of the circular water frame 103 through the threaded pipe 106. Then, after passing through several arc water frames 104, the water flows in a diffused manner and is finally discharged through the drain pipe 105. During the flow, the liquid silicon in the bottom temperature mold 201 and its inner side is conducted heat by the contact with the heat-conducting base plate 208. At the same time, the fins 211 dissipate heat from the top temperature mold 203. Meanwhile, the motor 135 is started to drive the reciprocating screw 129 to rotate, thereby causing the threaded sleeve 130 to drive the main gas pipe 131 to move back and forth. Argon gas is injected into the main gas pipe 131 through the gas delivery pipe 133.

[0062] At this point, the overall state of the segmented temperature control mold mechanism 2 and the internal liquid silicon is as follows:

[0063] 2.1 Bottom heat conduction section: The flowing water inside the circular water frame 103 is used to quickly conduct heat to the bottom temperature mold 201 and the liquid silicon inside it, and quickly remove the heat from the bottom of the bottom temperature mold 201, so that the silicon melt starts to solidify from the bottom first, forming a stable solidification starting surface.

[0064] 2.2 Middle Insulation Section: The medium-temperature mold 202 is heated by the electromagnetic heating plate 116 to keep it warm. This method is to block radial diffusion heat dissipation, maintain the axial unidirectional temperature gradient, ensure that the solidification front advances steadily upward, avoid lateral segregation, and also prevent impurities from dispersing.

[0065] 2.3 Top heat dissipation enrichment section: The top temperature mold 203 uses fins 211 and accelerated heat dissipation to rapidly cool the unsolidified melt at the top, concentrating the impurities that were previously displaced into a small area at the top, reducing the impurity concentration from 10%-15% to 8%-10%, thus facilitating subsequent removal. During this process, the jet nozzle 132 continuously injects air into the top of the silicon melt and squeezes out excess air through the strip block 138, preventing the silicon melt from being oxidized and introducing new impurities during solidification.

[0066] S3. Impurity Removal: The segmented gradient temperature control environment formed by the bottom temperature mold 201, the medium temperature mold 202, and the top temperature mold 203 allows the silicon melt to solidify directionally from bottom to top, efficiently enriching impurities at the top. Cooling is completed upon complete solidification. Then, the sealing cover 126 is moved away, and the bottom temperature mold 201 and the support platform 101 are loosened. The silicon block and the segmented temperature control mold mechanism 2 are then transported away as a whole using hoisting equipment. The silicon block is then removed, and the enriched area at the top of the silicon block is tested using a detector. Based on the test results, the corresponding impurity accumulation area is removed, thereby completing the purification of industrial silicon.

[0067] Furthermore, any content not described in detail in this specification is existing technology known to those skilled in the art.

Claims

1. An industrial silicon refining and purification device, comprising a heating and heat conduction mechanism (1), a segmented temperature control mold mechanism (2), and a nut cap body (3), characterized in that: The heating and heat conduction mechanism (1) includes a support platform (101). A diffusion groove (102) is provided on the top of the support platform (101). A circular water frame (103) is provided on the inner side of the diffusion groove (102). An arc water frame (104) is fixedly connected to the surface of the circular water frame (103) through an opening. Both the circular water frame (103) and the arc water frame (104) are in contact with the inner wall of the diffusion groove (102). A threaded pipe (106) is fixedly connected to the bottom of the circular water frame (103) through an opening. The bottom end of the threaded pipe (106) penetrates the support platform (101). And extends to the bottom of the support platform (101), the inner thread of the threaded pipe (106) is connected to the water injection pipe (107), the bottom of the support platform (101) is fixedly connected to the water pump (108), and the bottom end of the water injection pipe (107) is rotatably connected to the outlet of the water pump (108) through the bearing component, the bottom of the arc water frame (104) is fixedly connected to the drain pipe (105) through the opening, and the bottom end of the drain pipe (105) passes through the support platform (101) and extends to the bottom of the support platform (101), and the segmented temperature control mold mechanism (2) is installed on the top of the support platform (101).

2. The industrial silicon beneficiation and purification apparatus according to claim 1, characterized in that: The top of the support platform (101) is fixedly equipped with protective frames (109) on both sides, front and rear by brackets. A guide rod (110) is fixedly connected to the top of the protective frame (109). A sliding sleeve plate (111) is slidably installed on the surface of the guide rod (110). A first spring (112) is sleeved on the surface of the guide rod (110). An arc-shaped pressure plate (113) is fixedly connected to one side of the sliding sleeve plate (111). A pressing port (114) is opened on the top of the protective frame (109) to cooperate with the arc-shaped pressure plate (113).

3. The industrial silicon beneficiation and purification apparatus according to claim 2, characterized in that: A spring rod (115) is slidably installed on one side of the protective frame (109) through an opening. An electromagnetic heating plate (116) is fixedly connected to one end of the spring rod (115) located in the inner cavity of the protective frame (109). A retaining plate (140) is fixedly connected to the other end of the spring rod (115). A second spring (118) is sleeved on the surface of the spring rod (115) between the protective frame (109) and the retaining plate (140). A curved pressure frame (117) that cooperates with the arc-shaped pressure plate (113) is fixedly connected to one side of the electromagnetic heating plate (116).

4. The industrial silicon beneficiation and purification apparatus according to claim 3, characterized in that: The support platform (101) has side sliding grooves (119) on both sides. A threaded cylinder (120) is fixedly installed on the surface of the support platform (101) through an opening. A side sliding column (121) is slidably installed on the inner side of the side sliding groove (119). A push-pull plate (122) is fixedly connected between the front ends of the two side sliding columns (121). A threaded column (123) that cooperates with the threaded cylinder (120) is rotatably connected to the surface of the push-pull plate (122) through an opening. A lower pressure plate (124) is fixedly installed on the top between the two side sliding columns (121) through a bracket. A cylinder (125) is fixedly installed on the top of the lower pressure plate (124) through an opening. A sealing cover (126) is fixedly installed on the bottom end of the cylinder (125).

5. The industrial silicon beneficiation and purification apparatus according to claim 4, characterized in that: Solenoid valve tubes (127) are fixedly installed on both sides of the top of the sealing cover (126) through openings. A motor (135) is fixedly installed on the surface of the sealing cover (126) through a bracket. The output shaft of the motor (135) is fixedly connected to a reciprocating screw (129) through a coupling. The rear end of the reciprocating screw (129) passes through the sealing cover (126) and is rotatably connected to the rear part of the inner cavity of the sealing cover (126) through a bearing. Horizontal guide rods (128) are fixedly connected on both sides between the front and rear parts of the inner cavity of the sealing cover (126). The horizontal guide rod (128) bracket is slidably mounted with a threaded sleeve (130), and the threaded sleeve (130) is threadedly connected to the reciprocating screw (129). The bottom of the threaded sleeve (130) is fixedly connected to a main air pipe (131). The bottom of the main air pipe (131) is fixedly connected to a jet head (132) through an opening. Both sides of the surface of the main air pipe (131) are fixedly mounted with air supply pipes (133) through openings. The top end of the air supply pipe (133) penetrates the sealing cover (126) and extends to the outside of the sealing cover (126).

6. The industrial silicon refining and purification apparatus according to claim 5, characterized in that: The sealing cover (126) has side pressure heads (134) that cooperate with the sliding sleeve plate (111) fixedly connected to both sides, front and rear of the sealing cover (126). A strip block (138) is fixedly connected to the bottom of the sealing cover (126). Limiting posts (137) are fixedly installed on both sides of the protective frame (109) through brackets.

7. The industrial silicon beneficiation and purification apparatus according to claim 6, characterized in that: The top of the load-bearing platform (101) is equipped with a first bolt column (136), and the top of the sealing cover (126) is provided with an exhaust hole (139).

8. The industrial silicon refining and purification apparatus according to claim 7, characterized in that: The segmented temperature control mold mechanism (2) includes a bottom temperature mold (201), a medium temperature mold (202), and a top temperature mold (203), and the bottom temperature mold (201), the medium temperature mold (202), and the top temperature mold (203) are stacked vertically in sequence. The medium temperature mold (202), the bottom temperature mold (201), and the top temperature mold (203) are all provided with a sealing groove (204) on their opposite sides. A sealing gasket (205) is provided on the inner side of the sealing groove (204). The bottom of the bottom temperature mold (201) is fixedly installed with a heat-conducting base plate (208) that cooperates with the round water frame (103) and the arc water frame (104) through an opening.

9. An industrial silicon beneficiation and purification apparatus according to claim 8, characterized in that: A collar plate (207) is fixedly connected to the bottom of the surface of the bottom temperature mold (201), and the collar plate (207) is sleeved on the surface of the first bolt post (136). A second bolt post (206) is fixedly installed on the top edge side of the bottom temperature mold (201) and the medium temperature mold (202). The bottom edge side of the medium temperature mold (202) and the top temperature mold (203) is provided with a mating insertion hole (209) that is used to cooperate with the second bolt post (206). The nut cap body (3) is threadedly connected to the first bolt post (136) and the second bolt post (206). Fins (211) are fixedly installed on both sides, as well as the front and rear of the top temperature mold (203). A rectangular slot (212) is provided at the bottom of the top temperature mold (203). Heating grooves (210) are provided on both sides, as well as the front and rear of the medium temperature mold (202).

10. The method for industrial silicon beneficiation and purification according to claim 1, characterized in that: Specifically, the following steps are included: S1. Mold installation: Install the bottom temperature mold (201), medium temperature mold (202) and top temperature mold (203) on the top of the support platform (101) through the nut cap body (3), and then make the sealing cover (126) align with the top of the top temperature mold (203); S2, Ingot purification: By rapidly conducting heat to the bottom temperature mold (201), keeping the medium temperature mold (202) warm, and dissipating heat to the top temperature mold (203), impurities accumulate on the top of the industrial silicon. S3, Impurity Removal: Remove the cooled industrial silicon through the segmented temperature control mold mechanism (2) from the top of the support platform (101), then open the segmented temperature control mold mechanism (2) to remove the industrial silicon, and cut and grind it according to the concentrated area of ​​impurities on the top.

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