Antiskid composite board and preparation method thereof
By hot-pressing waste rubber particles into the surface of thermoplastic composite sheet to form a mechanically embedded structure, the problem of insufficient bonding strength between the anti-slip layer and the matrix is solved, and a high-performance, low-cost anti-slip composite material is realized.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- JIANGSU QIYI TECH
- Filing Date
- 2026-05-18
- Publication Date
- 2026-07-17
AI Technical Summary
The existing composite material boards have insufficient bonding strength between the anti-slip layer and the matrix, especially the poor adhesion to non-polar matrices, which makes the anti-slip layer easy to peel off, and the material and process costs are high.
Waste rubber granules are used as an anti-slip layer and embedded into a thermoplastic polymer matrix through hot pressing to form a mechanically embedded structure, which avoids dependence on adhesive strength and is particularly suitable for non-polar matrices.
It achieves a high-strength anti-slip layer, improves the dynamic and static friction coefficients of the board, reduces costs, and provides excellent wear resistance and ease of processing, making it suitable for industrial production.
Smart Images
Figure CN122401731A_ABST