Anti-slip conveying device for high-density integrated circuit lead frame plating line
By setting up a drive and adjustment mechanism in the conveying device of the high-density integrated circuit lead frame electroplating line, the slippage problem caused by insufficient friction was solved, achieving stable conveying and precise positioning, and improving product quality.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- DONGGUAN ALLMERIT TECH CO LTD
- Filing Date
- 2026-04-03
- Publication Date
- 2026-07-17
AI Technical Summary
After electroplating, the high-density integrated circuit lead frame has a refined structural design and light weight, which leads to insufficient friction between it and the conveyor belt. This can easily cause slippage, affecting the stability of the conveyor and the positioning accuracy. It may also lead to plating wear and structural deformation.
An anti-slip conveying device was designed. By setting a drive mechanism and an adjustment mechanism on the plate, the gear set of the driven wheel group is driven to move down by the lifting cylinder, so that the belt segment fits into the driving wheel group, thereby increasing the friction. The plate spacing is adjusted by the adjustment mechanism to adapt to products of different widths.
This effectively prevents the lead frame from slipping during transport, improves transport stability and positioning accuracy, protects the integrity of the coating, and increases the product qualification rate.
Smart Images
Figure CN122403007A_ABST