A high-temperature-resistant low-dielectric composite material with a multiphase interpenetrating network structure and a preparation method thereof
By constructing a high-temperature resistant, low-dielectric composite material with a multi-level interpenetrating network structure of "sea-island-bridge", the balance problem of existing materials in terms of dielectric properties, heat resistance and toughness has been solved. This has achieved a synergistic improvement in low dielectric loss, high heat resistance, high toughness and low moisture absorption, meeting the needs of high-frequency communication and computing fields.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- SHANGHAI MINGQIAN IND CO LTD
- Filing Date
- 2026-05-06
- Publication Date
- 2026-07-17
AI Technical Summary
Existing polymer materials struggle to achieve a balance among several mutually restrictive key performance indicators, such as low dielectric loss, high heat resistance, high toughness, low moisture absorption, and good processability, thus failing to meet the high-frequency and high-speed requirements of fields such as fifth-generation and sixth-generation mobile communication technologies, millimeter-wave radar, satellite communication, and high-performance computing.
High-temperature resistant, low-dielectric composite material with a multi-interpenetrating network structure is adopted. Through the "sea-island-bridge" multi-level interpenetrating network structure, a chemical bond-driven three-dimensional integrated network is constructed using components such as maleic anhydride-grafted polyphenylene ether, thermoplastic polyimide prepolymer, surface-amined aramid pulp, and 4,4'-diphenylmethane bismaleimide, so as to achieve synergistic enhancement of the performance of each component.
It achieves a synergistic improvement in low dielectric loss, high heat resistance, high toughness and low moisture absorption. The material maintains low and stable dielectric properties in high temperature and high humidity environments, thereby improving signal integrity, power efficiency and reliability.
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