Preparation method of high-thermal-conductivity high-insulation epoxy resin composite material based on high-frequency bipolar square wave electric field induced inorganic filler orientation to construct thermal conduction network
By adding sheet-like and spherical fillers to epoxy resin and utilizing segmented frequency conversion electric field technology with high-frequency bipolar square wave electric field, the problems of filler agglomeration and discontinuous thermal conductivity pathways were solved, resulting in epoxy resin composite materials with high thermal conductivity and high insulation, thus improving the heat dissipation and insulation performance of the device.
CN122404918APending Publication Date: 2026-07-17MAINTENANCE & TEST CENTRE CSG EHV POWER TRANSMISSION CO
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- MAINTENANCE & TEST CENTRE CSG EHV POWER TRANSMISSION CO
- Filing Date
- 2026-06-03
- Publication Date
- 2026-07-17
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Figure CN122404918A_ABST
Abstract
基于高频双极方波电场诱导无机填料取向构建导热网络的高导热高绝缘环氧树脂复合材料的制备方法，涉及高分子复合材料热管理与电绝缘材料技术领域。本发明的目的是为了解决现有环氧树脂复合材料在低填料含量下难以形成连续导热通路，以及导热性能提升受限且易影响电绝缘性能的问题。本发明中取向形成的导热通路提高了热量传导与散逸效率，有助于降低交流电场作用下的局部热积累与电场畸变风险，从而实现导热性能与电绝缘性能的协同提升。本发明可获得基于高频双极方波电场诱导无机填料取向构建导热网络的高导热高绝缘环氧树脂复合材料的制备方法。
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