A method for detecting the size of a circuit board and a blind hole
By combining a line scan camera and a surface laser sensor, the problems of light interference and health risks in blind hole detection on circuit boards have been solved, achieving high-precision detection of blind hole dimensions and internal defects.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- 苏州秒测高新科技有限公司
- Filing Date
- 2026-04-10
- Publication Date
- 2026-07-17
AI Technical Summary
Existing optical inspection methods for blind holes on circuit boards are difficult to directly detect internal defects and dimensional deviations, and the inspection accuracy is easily affected by light, which can affect the health of operators.
By combining a line scan camera and a surface laser sensor, grayscale images and height data are acquired to calculate the position coordinates and dimensions of blind holes. Image analysis technology is then used to detect the lower diameter, upper diameter, and depth of the blind holes, thus achieving automated detection.
It achieves high-precision, automated blind hole detection, eliminates the influence of light, improves the accuracy and efficiency of detection results, and avoids health risks to operators.
Smart Images
Figure CN122408604A_ABST