Equipment and method for testing mechanical properties of material in high-temperature fuel gas environment
By designing a material mechanical property testing device under high temperature and gas environment, and adopting a double-wall structure of the steady flow section component and a high-pressure cooling air system, the problem that existing equipment cannot simulate high pressure characteristics and unstable flow rate is solved, and accurate mechanical property testing of CMC materials under high temperature and high pressure environment is realized.
Patent Information
- Application Number
- CN202610773143.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2026-06-01
- Publication Date
- 2026-07-17
AI Technical Summary
In existing high-temperature gas environments, the mechanical property testing equipment for CMC materials cannot simulate high-pressure characteristics, and the flow rate is difficult to stabilize and measure, resulting in test data that cannot accurately support the strength design analysis of CMC components under service conditions.
A material mechanical property testing device under high temperature gas environment was designed, including a test piece, a mounting base assembly, a loading and bonding block, a sealing strip, a plug assembly, a sealing sheet, an upper loading chain assembly, a lower loading chain assembly, a flow stabilization section assembly, and a load-bearing frame assembly. Through the double-wall structure of the flow stabilization section assembly and the high-pressure cooling air system, a stable high temperature gas flow field and cooling system are formed to ensure the mechanical property testing of the test piece under high temperature and high pressure environment.
The mechanical properties of CMC materials were tested under high temperature, high pressure and high speed gas environment, simulating the high temperature gas load conditions in actual applications, ensuring the accuracy of test data and the stability of equipment, and avoiding test errors caused by thermal deformation or damage.