A method for testing the copper peel strength of an ultrathin carrier

By bonding a rigid carrier layer and structural adhesive onto ultrathin copper foil, the stability and accuracy issues of peel strength testing for ultrathin copper foil are resolved, ensuring that the test results truly reflect product quality and avoiding the shortcomings of traditional methods.

CN122409489APending Publication Date: 2026-07-17NANYA NEW MATERIAL TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
NANYA NEW MATERIAL TECH CO LTD
Filing Date
2026-04-22
Publication Date
2026-07-17

AI Technical Summary

Technical Problem

Existing technologies are difficult to reliably and accurately test the peel strength between ultrathin copper foil (≤5μm) and resin substrate. Traditional methods are prone to copper foil breakage or changes in the interface state after electroplating, resulting in distorted test results.

Method used

An ultra-thin copper foil layer is bonded to a rigid carrier tape layer and structural adhesive. The adhesion between the copper foil and the resin substrate is stably measured using a peel tester to ensure that the original interface state is not changed. This process includes cleaning, bonding the rigid carrier tape, cutting the test strip, and peel testing.

Benefits of technology

It enables stable and accurate measurement of the peel strength of ultrathin copper foil without damaging the original structure of the sample, meeting the requirements for copper clad laminate quality assessment, and the test results are true and reliable.

✦ Generated by Eureka AI based on patent content.

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Abstract

The application discloses a kind of ultra-thin carrier copper peel strength test methods. The rigid carrier layer is coated with structural adhesive on the adhering side of the rigid carrier layer, and the adhering side coated with structural adhesive is adhered to the upper surface of the ultra-thin copper foil layer, and then compacted to remove bubbles, so that the rigid carrier layer and the ultra-thin copper foil layer are firmly bonded to form the copper-clad plate sample to be tested. The copper-clad plate sample with the rigid carrier layer adhered is cut into a test strip of standard width, and the width of one end of the cut rigid carrier layer extends beyond the outer end surface of the resin substrate layer, forming a pulling end head before pulling the test. The test method of the present application can stably and accurately complete the peel strength test of ultra-thin copper foil (≤5 μm) without changing the original interface state of ultra-thin copper foil and resin substrate, without damaging the original structure of the sample, meeting the demand of the industry for accurate evaluation of the quality of copper-clad plate.
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