A bonding interface performance detection system for car-grade chips

Abstract

This invention discloses a bonding interface performance testing system for automotive-grade chips, belonging to the field of performance testing technology. The system includes a multi-environment collaborative simulation unit, a multi-dimensional real-time monitoring unit, a multi-modal non-destructive imaging testing unit, and an intelligent data processing and defect assessment unit. Through a linked integrated architecture of each unit, this invention achieves coordinated control and timing synchronization of the entire system, with the intelligent data processing and defect assessment unit as the core. It constructs a collaborative operating mechanism encompassing automotive service condition reproduction, online monitoring of multi-dimensional interface performance, multi-modal non-destructive testing of interface defects, and data processing and defect assessment throughout the entire process. This addresses the technical problems in existing technologies, such as the disconnect between testing conditions and actual automotive service scenarios, the fragmentation of performance monitoring and defect detection, and the inability to achieve integrated closed-loop testing of bonding interface performance and defects under all operating conditions. These issues result in test results that fail to accurately reflect the actual reliability of the bonding interface under automotive service conditions.

Description

Technical Field

[0001] This invention relates to the field of performance testing technology, and in particular to a bonding interface performance testing system for automotive-grade chips. Background Technology

[0002] The bonding interface performance testing system for automotive-grade chips uses non-destructive testing technology to accurately evaluate voids, cracks, and bonding strength of the bonding layer between the chip and the substrate. It aims to eliminate interface defects and ensure that the chip has low thermal resistance and a stable structure under harsh environments such as high temperature and vibration, preventing overheating or delamination failure, thereby ensuring the long-term reliability and safe operation of automotive electronic systems.

[0003] Currently, existing technologies for bonding interface performance testing systems for automotive-grade chips generally suffer from a disconnect between testing conditions and actual automotive service scenarios, and a separation between performance monitoring and defect detection. They cannot achieve integrated closed-loop testing of bonding interface performance and defects under all operating conditions. Furthermore, they suffer from insufficient precision in collaborative control under multi-stress composite conditions, misalignment of operating conditions and testing data timing, high false negative and false positive rates due to a single testing data source, and an inability to identify early performance degradation and minor defects at the interface. These issues severely affect the ability of the testing results to accurately reflect the actual reliability of the bonding interface under automotive service conditions, making it difficult to meet the core requirements of long-life reliability verification and full life-cycle health status assessment for automotive-grade chips.

[0004] Therefore, a bonding interface performance testing system for automotive-grade chips is proposed to solve the above problems. Summary of the Invention

[0005] The main objective of this invention is to provide a bonding interface performance testing system for automotive-grade chips, in order to solve the problems mentioned in the background above.

[0006] To achieve the above objectives, the technical solution adopted by this invention is: a bonding interface performance testing system for automotive-grade chips, the system comprising a multi-environment collaborative simulation unit, a multi-dimensional real-time monitoring unit, a multi-modal non-destructive imaging testing unit, and an intelligent data processing and defect assessment unit, wherein:

[0007] The multi-environment collaborative simulation unit is used to reproduce the automotive-grade chip's on-board service conditions, providing a test environment that fits the actual on-board service scenario for bonding interface performance testing, and simultaneously generating operating condition control benchmark data and component operating status closed-loop feedback data and transmitting them to the intelligent data processing and defect assessment unit. The multi-environment collaborative simulation unit has built-in temperature control components, controllable humidity adjustment components, variable frequency vibration simulation components, and mechanical stress loading components. The components are electrically connected to each other through a control bus. The multi-dimensional real-time monitoring unit is used to be deployed in conjunction with the multi-environment collaborative simulation unit to synchronously collect test environment parameters and multi-dimensional performance parameters of the bonding interface, generate raw performance monitoring data with unique collection identifiers and timestamps, and transmit them in real time to the intelligent data processing and defect assessment unit through the signal transmission component. The multi-dimensional real-time monitoring unit has built-in temperature and humidity sensing components, interface stress sensing components, vibration response sensing components, thermal conductivity online monitoring components, and interface contact resistance online monitoring components. Each component is electrically connected to the signal transmission component. The multimodal nondestructive imaging detection unit is used to perform multimodal nondestructive testing on the bonding interface of the automotive-grade chip under test. It achieves full coverage of bonding interface defects through multi-component synchronous layered scanning, generates original imaging detection data with unique acquisition identifier and timestamp, and transmits it to the intelligent data processing and defect assessment unit in real time through the signal transmission component. The multimodal nondestructive imaging detection unit has built-in infrared thermal imaging components, high-frequency ultrasonic phased array components, and X-ray tomography components, and each component is electrically connected to the signal transmission components. The intelligent data processing and defect assessment unit is used to realize the coordinated control and timing synchronization of the entire system, receive and process the raw performance monitoring data and raw imaging detection data, complete the defect identification, performance assessment and life prediction of the bonding interface, and generate and output the comprehensive detection results. The intelligent data processing and defect assessment unit has built-in operating condition configuration components, synchronization triggering components, data acquisition and analysis components, and defect identification and assessment components. The components are electrically connected through an internal bus. The multi-environment collaborative simulation unit, multi-dimensional real-time monitoring unit, multi-modal non-destructive imaging detection unit, and intelligent data processing and defect assessment unit are integrated and linked through signal transmission components.

[0008] Preferably, the multi-environment collaborative simulation unit is specifically used for: The temperature control component, the controllable humidity regulation component, the frequency conversion vibration simulation component, and the mechanical stress loading component can be controlled to operate independently, while the other components are in a standby locked non-working state, outputting a single-factor working condition environment. The system controls two or more of the following components to operate simultaneously: temperature control, controllable humidity regulation, frequency conversion vibration simulation, and mechanical stress loading. It outputs a complex working environment with multiple factors superimposed according to a preset synchronization sequence, parameter linkage relationship, and alternating cycle logic. Simultaneously generate operating condition control baseline data and component operating status closed-loop feedback data, and transmit them to the intelligent data processing and defect assessment unit.

[0009] Preferably, the mechanical stress loading component built into the multi-environment collaborative simulation unit is specifically used for: The sample to be tested is clamped and fixed by a special fixture. The special fixture adopts a modular split structure and is equipped with replaceable clamping position modules. The clamping position is equipped with elastic limiting parts and insulating and heat-insulating pads. The stress is precisely applied to the bonding interface of the sample being tested through the stress transmission channel inside the tooling.

[0010] Preferably, the multi-dimensional real-time monitoring unit is specifically used for: Simultaneously collect temperature and humidity data of the test environment, stress distribution data of the bonding interface, vibration response data, thermal conductivity data, and interface contact resistance data; Generate raw performance monitoring data with a unique collection identifier and timestamp; The raw performance monitoring data is transmitted in real time to the intelligent data processing and defect assessment unit via the signal transmission component.

[0011] Preferably, the interface stress sensing component built into the multi-dimensional real-time monitoring unit is specifically used for: The normal stress and tangential shear stress at the bonding interface are simultaneously collected by four sets of MEMS micro strain gauges arranged in a ring symmetrically on the outermost edge of the BGA substrate pads. The welding points of the strain gauge sensitive grid and the outermost ring of solder balls on the substrate are arranged in a one-to-one correspondence.

[0012] Preferably, the multimodal nondestructive imaging detection unit is specifically used for: The bonding interface is simultaneously scanned in parallel using an infrared thermal imaging component, a high-frequency ultrasonic phased array component, and an X-ray tomography component. Collect temperature distribution imaging data of the bonding interface, 3D ultrasound imaging data of the internal structure, and micron-level X-ray tomography data of the deep structure. The system generates raw imaging detection data with a unique acquisition identifier and timestamp, which is then transmitted in real time to the intelligent data processing and defect assessment unit via a signal transmission component.

[0013] Preferably, the high-frequency ultrasonic phased array component built into the multimodal nondestructive imaging detection unit is specifically used for: A 128-channel high-frequency phased array probe is used, which automatically adjusts the probe frequency and focusing depth according to the adhesive layer thickness and solder ball size; The bonding interface is scanned layer by layer to output 3D ultrasound imaging data of the internal structure.

[0014] Preferably, the intelligent data processing and defect assessment unit is specifically used for: The operating condition configuration component sends operating condition control commands to the multi-environment collaborative simulation unit. The synchronous triggering component sends synchronous acquisition commands to the multi-dimensional real-time monitoring unit and the multi-modal non-destructive imaging detection unit. The synchronous control module of the synchronous triggering component and the multi-environment collaborative simulation unit completes timing calibration through a shared isothermal crystal timing source.

[0015] Preferably, the built-in synchronization triggering component of the intelligent data processing and defect assessment unit is specifically used for: A unified trigger signal is output to the trigger ports of each sensing component of the multi-dimensional real-time monitoring unit and each imaging component of the multi-modal non-destructive imaging detection unit. This ensures that the acquisition timestamps of the multi-dimensional real-time monitoring unit and the multi-modal non-destructive imaging detection unit are perfectly matched.

[0016] Preferably, the data acquisition and analysis component built into the intelligent data processing and defect assessment unit is specifically used for: It receives raw data transmitted from the multi-dimensional real-time monitoring unit and the multi-modal non-destructive imaging detection unit, and performs data noise reduction, format unification, outlier removal, timestamp matching and alignment, and data normalization processing. The processed standardized data is divided into two paths: one path is encrypted and stored in the built-in high-capacity storage medium, and the other path is transmitted to the defect identification and assessment component. Data and comprehensive test reports are exported through a multi-protocol data output port, which is compatible with RS485, Ethernet, and USB communication protocols.

[0017] The present invention has the following beneficial effects: 1. This invention utilizes a collaborative integrated architecture comprising a multi-environmental collaborative simulation unit, a multi-dimensional real-time monitoring unit, a multi-modal non-destructive imaging detection unit, and an intelligent data processing and defect assessment unit. With the intelligent data processing and defect assessment unit at its core, it achieves collaborative control and timing synchronization across the entire system. This constructs a collaborative operating mechanism encompassing vehicle-mounted service condition reproduction, online monitoring of multi-dimensional interface performance, multi-modal non-destructive testing of interface defects, and data processing and defect assessment throughout the entire process. This enables the synchronous acquisition, correlation analysis, and integrated closed-loop detection of performance parameters and defect characteristics of automotive-grade chip bonding interfaces under simulated service conditions. Compared to existing technologies, this significantly improves the fit between the testing environment and actual vehicle-mounted service scenarios, the timing matching of multi-source testing data, and the comprehensive coverage of bonding interface performance and defect detection. Therefore, it solves the technical problems in existing technologies where testing conditions are disconnected from actual vehicle-mounted service scenarios, performance monitoring and defect detection are fragmented, and integrated closed-loop detection of bonding interface performance and defects under all conditions is impossible, leading to test results that fail to accurately reflect the actual reliability of bonding interfaces under automotive-mounted service conditions.

[0018] 2. This invention utilizes a multi-component independent and collaborative operation control mechanism built into the multi-environment collaborative simulation unit, combined with a synchronous triggering and shared timing source calibration mechanism of the intelligent data processing and defect assessment unit. This enables independent and controllable output of single-factor operating conditions and synchronous collaborative output of two or more multi-factor superimposed composite operating conditions. Simultaneously, it ensures precise timing matching of operating condition output, performance data acquisition, and imaging data acquisition. Compared with existing technologies, this invention improves the flexibility and accuracy of vehicle service condition reproduction, the collaborative control precision of multi-stress composite operating conditions, and the correlation accuracy between operating conditions and test data. Therefore, it solves the technical problems in existing technologies, such as the inability to flexibly adapt to single-factor and multi-factor composite test scenarios, insufficient collaborative control precision of multi-stress operating conditions, timing misalignment of operating conditions and test data, and the inability to accurately establish the correspondence between environmental stress and the performance degradation and defect evolution of the bonding interface.

[0019] 3. This invention achieves deep fusion analysis of bonding interface performance time-series data and defect spatial imaging data, accurate defect identification and classification, and remaining service life prediction by using a multi-dimensional real-time monitoring unit to synchronously acquire multi-physical interface performance parameters, a multi-modal non-destructive imaging detection unit to perform multi-dimensional layered scanning imaging, and a multi-source data standardization preprocessing and multi-modal fusion defect identification and evaluation mechanism in an intelligent data processing and defect assessment unit. Compared with existing technologies, this invention can improve the identification rate of early minor defects in bonding interfaces, the accuracy of defect type and severity level determination, and the reliability of bonding interface performance assessment and life prediction. Therefore, it can solve the technical problems of high defect false detection rate and false detection rate of single detection data source in existing technologies, inability to identify early performance degradation and minor defects of interfaces, and inability to achieve full life cycle health status assessment and life prediction of bonding interfaces. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the overall system architecture of the present invention; Figure 2 This is a schematic diagram of the architecture of the multi-environment collaborative simulation unit of the present invention; Figure 3 This is a schematic diagram of the architecture of the multi-dimensional real-time monitoring unit of the present invention; Figure 4 This is a schematic diagram illustrating the variation of the health status of the bonding interface with temperature in Embodiment 3 of the present invention. Detailed Implementation

[0021] To make the technical means, creative features, objectives and effects of this invention easier to understand, the invention will be further described below in conjunction with specific embodiments.

[0022] Example 1, please refer to Figure 1 , Figure 2 and Figure 3As shown: A bonding interface performance testing system for automotive-grade chips includes a multi-environment collaborative simulation unit, a multi-dimensional real-time monitoring unit, a multi-modal non-destructive imaging testing unit, and an intelligent data processing and defect assessment unit. The four units are integrated through a signal transmission component to adapt to the full-condition performance testing and defect identification of the bonding interface between automotive-grade BGA chips and substrates.

[0023] The multi-environment collaborative simulation unit is used to reproduce the automotive-grade chip's on-board service conditions, providing a test environment that fits the actual on-board service scenario for bonding interface performance testing. It simultaneously generates operating condition control benchmark data and component operating status closed-loop feedback data and transmits them to the intelligent data processing and defect assessment unit. The multi-environment collaborative simulation unit has built-in temperature control components, controllable humidity adjustment components, variable frequency vibration simulation components, and mechanical stress loading components. The components are electrically connected to each other through a control bus, and the control ports of each component are electrically connected to the operating condition configuration components of the intelligent data processing and defect assessment unit.

[0024] When reproducing vehicle-mounted service conditions, the multi-environment collaborative simulation unit is specifically used for: controlling any single component among the temperature control component, controllable humidity regulation component, variable frequency vibration simulation component, and mechanical stress loading component to operate independently under control, while the other components are in a standby locked non-working state, outputting a single-factor operating environment; controlling two or more components among the temperature control component, controllable humidity regulation component, variable frequency vibration simulation component, and mechanical stress loading component to operate simultaneously under control, outputting a composite operating environment with multiple factors superimposed according to a preset synchronization sequence, parameter linkage relationship, and alternating loop logic; and synchronously generating operating condition control benchmark data and component operating status closed-loop feedback data, which are then transmitted to the intelligent data processing and defect assessment unit.

[0025] The specific implementation methods for the single-factor operating environment and the multi-factor superimposed composite operating environment are as follows: The single-factor operating environment refers to an environment in which any single component among the temperature control component, controllable humidity regulation component, frequency conversion vibration simulation component, and mechanical stress loading component operates independently and under control, while the other components are in a standby, locked, and non-operating state, outputting only a single environmental stress factor to the test chamber. The output parameter range of each single-factor operating condition is compatible with automotive-grade chip full-scenario testing standards, and those skilled in the art can directly complete parameter configuration based on the corresponding standards, specifically including: Single-factor temperature operation: Only the temperature control component operates, and it can output a wide temperature range environment of -55℃ to 155℃. It is compatible with the test requirements of AEC-Q100 Grade0 to Grade3 automotive-grade chips (Grade0 standard temperature range -40℃ to 150℃). It can cover the extended test requirements of automotive extreme high and low temperature service scenarios, and is suitable for extreme high and low temperature service scenarios of automotive power domain, chassis domain, body domain, and intelligent driving domain chips. It supports constant temperature mode, gradient heating / cooling mode, temperature alternating cycle mode, and transient temperature shock mode. The temperature control accuracy is ±0.3℃, and the maximum temperature change rate can reach 30℃ / min. It is suitable for automotive-grade chip high and low temperature storage, temperature cycling, and temperature shock test requirements. Humidity Single Factor Operating Condition: Only the controllable humidity adjustment component operates, which can output a full range of humidity environment from 10%RH to 95%RH, with a humidity control accuracy of ±1.5%RH. It supports steady-state damp heat and alternating damp heat modes, and has built-in anti-condensation control logic to ensure that the chamber dew point temperature is always lower than the sample surface temperature during the test, avoiding test failure caused by condensation. It is fully compatible with the steady-state damp heat and bias humidity test requirements of automotive-grade chips in the AEC-Q100 standard. Vibration Single-Factor Condition: Only the frequency conversion vibration simulation component operates. It adopts a three-axis six-degree-of-freedom vibration table structure and can output vibration conditions with a frequency range of 5Hz to 3000Hz and an acceleration amplitude of 0.1g to 60g. It supports sinusoidal vibration, random vibration, half-sinusoidal impact vibration, and road spectrum reproduction vibration modes. The vibration parameters in the vertical, horizontal, and lateral dimensions can be configured independently, fully covering vibration and impact scenarios of different road conditions in vehicles, and adapting to the mechanical vibration and mechanical impact testing requirements of automotive-grade chips. Single-factor mechanical stress test: Only the mechanical stress loading component operates, employing a coaxial loading structure with a chip clamping force application end and a rigid substrate locking end. The force application end is rigidly clamped and fixed to the side of the BGA chip via high-temperature resistant insulating ceramic claws, without obstructing the detection path of the bonding interface between the upper and lower surfaces of the chip. The integrated design of the substrate locking end and the clamping position of the dedicated fixing fixture can output static tensile / compressive stress of 0.05N to 600N and dynamic cyclic shear stress of 0.05N to 250N, with a stress loading accuracy of ±0.3%FS, a loading stroke of ±10mm, and a positioning accuracy of ±2μm, adapting to automotive-grade chip bonding interface tensile and shear strength and fatigue life test requirements. The force application end accurately transfers tensile / compressive and shear stress to the bonding interface between the BGA chip and the substrate through the coaxial relative displacement of the chip and the substrate, avoiding test data distortion caused by stress displacement.

[0026] The independent output of single-factor operating conditions is achieved through the operating condition configuration component of the intelligent data processing and defect assessment unit. Those skilled in the art can select the target single-factor type and configure the corresponding operating parameters through this module. The system automatically controls the corresponding component to start independently, while the other components are locked in standby mode, thus completing the stable output and closed-loop calibration of the single-factor operating environment.

[0027] The aforementioned multi-factor superposition composite working environment refers to a composite working environment formed by the simultaneous controlled operation of two or more components among the temperature control component, controllable humidity regulation component, variable frequency vibration simulation component, and mechanical stress loading component, according to a preset synchronization sequence, parameter linkage relationship, and alternating cycle logic, simultaneously outputting two or more environmental stress factors to the test chamber. The coordinated output of the composite working environment is achieved through a synchronization control module electrically connected to the intelligent data processing and defect assessment unit. The synchronization control module has a built-in automotive-grade chip composite working environment synchronization control logic, which can realize the synchronization of the start / stop timing of multiple components, the synchronization of parameter change nodes, and the matching of cycle periods. The time difference of the parameter change trigger nodes of each component is ≤1ms, specifically including: Dual-factor superposition composite working conditions: Supports the superposition of any two single factors such as synchronous temperature and humidity alternation, temperature-vibration coordination, temperature-stress coordination, humidity-vibration coordination, and vibration-stress coordination; For example, under the synchronous temperature and humidity alternation working condition, the temperature rise and fall node of the temperature control component is completely synchronized with the humidity adjustment node of the controllable humidity adjustment component, and the cycle can be configured from 30min to 120h, which is compatible with the accelerated aging test requirements of automotive-grade chips. Three-factor and above all-factor superimposed composite working conditions: Supports any three of the four factors of high temperature, high humidity, vibration, and mechanical stress, as well as the superposition of all factors; In the all-factor superimposed mode, the synchronous control module can realize full-time matching of temperature alternation cycle, humidity synchronous adjustment, vibration condition synchronous start and stop, and mechanical stress dynamic loading, completely reproducing the composite service scenario of automotive-grade chips simultaneously bearing temperature and humidity alternation, road condition vibration, assembly stress, and thermomechanical stress during actual vehicle service. It also supports transient composite working condition modes of temperature shock, random vibration, and dynamic stress, filling the gap in the simulation of extreme transient working conditions in existing technologies.

[0028] When operating under combined conditions, each component is equipped with an independent closed-loop feedback module, which can transmit real-time operating parameters back to the intelligent data processing and defect assessment unit, compare them with preset benchmark parameters in real time and automatically correct them, ensuring long-term stability and control accuracy under multiple overlapping operating conditions.

[0029] The multi-dimensional real-time monitoring unit is used in conjunction with the multi-environment collaborative simulation unit to synchronously collect test environment parameters and multi-dimensional performance parameters of the bonding interface, generate raw performance monitoring data with unique collection identifiers and timestamps, and transmit them in real time to the intelligent data processing and defect assessment unit through the signal transmission component. The multi-dimensional real-time monitoring unit has built-in temperature and humidity sensing components, interface stress sensing components, vibration response sensing components, thermal conductivity online monitoring components, and interface contact resistance online monitoring components, and each component is electrically connected to the signal transmission component.

[0030] When performing coordinated monitoring, the multi-dimensional real-time monitoring unit is specifically used to: synchronously collect temperature and humidity data of the test environment, stress distribution data of the bonding interface, vibration response data, thermal conductivity data, and interface contact resistance data; generate raw performance monitoring data with a unique acquisition identifier and timestamp; and transmit the raw performance monitoring data to the intelligent data processing and defect assessment unit in real time through the signal transmission component.

[0031] Among them, the interface stress sensing component uses 4 sets of MEMS micro strain gauges, which are arranged in a ring symmetrically on the edge of the outermost pad of the BGA substrate and on the same layer as the outermost solder ball. The strain gauge sensitive grid is arranged one-to-one with the solder point of the outermost solder ball, which can simultaneously collect the overall normal stress and tangential shear stress of the bonding interface, with a layout accuracy of ±5μm and a sampling frequency of up to 1MHz. The online thermal conductivity monitoring component includes a first micro heat flow sensor and a temperature sensor attached to the upper surface of the chip, and a second micro heat flow sensor and a temperature sensor attached to the lower surface of the substrate. It is equipped with a built-in interface thermal resistance calculation module, which can collect heat flow density and temperature data of the upper surface of the chip and the lower surface of the substrate in real time. Combined with the known material and thickness parameters of the chip, substrate and adhesive layer of the sample under test, the thermal resistance and real-time thermal conductivity of the adhesive interface are calculated and separated by the steady-state thermal resistance method. The interface contact resistance online monitoring component adopts the four-wire Kelvin test method and is electrically connected to the solder ball circuit of the BGA chip. It can collect the micro-ohm level contact resistance of the bonding interface in real time, with a sampling frequency of up to 100kHz. It captures the contact resistance change signal before interface failure and fills the gap in the existing technology for synchronous monitoring of interface electrical performance.

[0032] The multimodal nondestructive imaging detection unit is used to perform multimodal nondestructive testing on the bonding interface of the automotive-grade chip under test. It achieves full coverage of bonding interface defects through multi-component synchronous layered scanning, generates original imaging detection data with unique acquisition identifier and timestamp, and transmits it to the intelligent data processing and defect assessment unit in real time through the signal transmission component. The multimodal nondestructive imaging detection unit has built-in infrared thermal imaging components, high-frequency ultrasonic phased array components, and X-ray tomography components, each of which is electrically connected to the signal transmission components.

[0033] When performing non-destructive testing, the multimodal non-destructive imaging detection unit is specifically used to: simultaneously trigger parallel scanning of the bonding interface through the infrared thermal imaging component, the high-frequency ultrasonic phased array component, and the X-ray tomography component; collect temperature distribution imaging data of the bonding interface, 3D ultrasonic imaging data of the internal structure, and micron-level X-ray tomography data of the deep structure; generate raw imaging detection data with a unique acquisition identifier and timestamp, and transmit it to the intelligent data processing and defect assessment unit in real time through the signal transmission component.

[0034] Among them, the three types of imaging components adopt a coaxial ring staggered arrangement structure. With the normal central axis of the bonding interface of the sample under test as the center, they are staggered at equal angles along the circumference. The detection ends all face the bonding interface of the sample under test, and the detection paths do not cross or block each other. The scanning is performed according to the preset time-division synchronous scanning logic. The time-division synchronous scanning logic is as follows: after the synchronous triggering component outputs a unified trigger signal, the three types of components complete a single frame / single scan in the order of infrared thermal imaging, high-frequency sweep ultrasonic phased array, and X-ray tomography within the preset time window. The total time of a single scan is ≤1s. Each scan is bound to the same reference timestamp to realize the temporal correlation of working conditions, performance data, and imaging data. The infrared thermal imaging component uses a cooled mid-wave infrared detector with a temperature measurement accuracy of ±0.2℃ and an imaging frame rate of up to 200Hz. It is used to capture abnormal areas of local heat accumulation and uneven heat conduction at the bonding interface, enabling rapid screening of thermal defects. The high-frequency ultrasonic phased array component uses a 128-channel high-frequency phased array probe, which can automatically adjust the probe frequency and focusing depth according to the thickness of the adhesive layer and the size of the solder ball, perform layer-by-layer scanning imaging of the adhesive interface, and output 3D ultrasonic imaging data of the internal structure. The X-ray tomography scanning component uses a nano-focus X-ray source with a focal size as small as 3μm, enabling tomographic scanning and 3D reconstruction of the bonding interface. It can accurately locate the position and extent of interface delamination, delamination, and solder ball cracking defects. The data from the three types of imaging components complement each other, enabling full-dimensional and full-depth non-destructive testing of interface defects, solving the problem of high defect false negative rates in existing single imaging modes.

[0035] The intelligent data processing and defect assessment unit is used to realize the coordinated control and timing synchronization of the entire system, receive and process the raw performance monitoring data and raw imaging detection data, complete the defect identification, performance assessment and life prediction of the bonding interface, and generate and output the comprehensive detection results. The intelligent data processing and defect assessment unit has built-in operating condition configuration components, synchronization triggering components, data acquisition and analysis components, and defect identification and assessment components. These components are electrically connected through an internal bus.

[0036] When performing data processing and system control, the intelligent data processing and defect assessment unit is specifically used to: issue operating condition control commands to the multi-environment collaborative simulation unit through the operating condition configuration component; issue synchronous acquisition commands to the multi-dimensional real-time monitoring unit and the multi-modal non-destructive imaging detection unit through the synchronous trigger component; and complete timing calibration of the synchronous trigger component and the synchronous control module of the multi-environment collaborative simulation unit through a shared isothermal crystal timing source.

[0037] Specifically, the synchronization triggering component is used to output a unified trigger signal to the trigger ports of each sensing component of the multi-dimensional real-time monitoring unit and each imaging component of the multi-modal non-destructive imaging detection unit, ensuring that the acquisition timestamps of the multi-dimensional real-time monitoring unit and the multi-modal non-destructive imaging detection unit are perfectly matched. The synchronization triggering component and the synchronization control module share the same temperature-controlled crystal oscillator timing source, with a timing synchronization error ≤500ns, guaranteeing that the operating condition output and the data acquisition timestamp are perfectly matched.

[0038] The data acquisition and analysis component is specifically used for: receiving raw data transmitted from the multi-dimensional real-time monitoring unit and the multi-modal non-destructive imaging detection unit; performing data noise reduction, format unification, outlier removal, timestamp matching and alignment, and data normalization; dividing the processed standardized data into two paths, one encrypted and stored in the built-in large-capacity storage medium, and the other transmitted to the defect identification and evaluation component; and exporting the data and comprehensive inspection report through a multi-protocol data output port, which is compatible with RS485, Ethernet, and USB communication protocols.

[0039] Furthermore, the coordinated implementation method of the multi-environment collaborative simulation unit, multi-dimensional real-time monitoring unit, multi-modal non-destructive imaging detection unit, and intelligent data processing and defect assessment unit is as follows: During the test preparation phase, the sample to be tested is first clamped and fixed. The automotive-grade BGA chip to be tested and the substrate bonding sample are fixed in a special fixture inside the test chamber. The special fixture is made of insulating, high-temperature resistant, and vibration-resistant polyimide material. It is equipped with clamping positions and elastic limiting parts that match the shape of the sample to be tested. It can be adapted to automotive-grade BGA chips and PCB substrates and ceramic substrates of different sizes. After clamping and fixing, it ensures that the bonding interface is subjected to uniform force. The sensing units of the interface stress sensing component and the thermal conductivity online monitoring component are arranged in the preset positions. The interface contact resistance online monitoring component is electrically connected to the sample solder ball circuit. It is confirmed that the sample bonding interface and the detection end of the multimodal non-destructive imaging detection unit are set coaxially and opposite to each other. The test mode and operating parameters are configured through the working condition configuration component of the intelligent data processing and defect assessment unit, including the selection of single-factor and composite working condition types, working condition control parameters, synchronous acquisition timing, and data acquisition rules, to complete the system calibration before testing, zero-point calibration of each sensing component, and focal length calibration of the imaging component.

[0040] During the test execution phase, the intelligent data processing and defect assessment unit sends a start command to the multi-environment collaborative simulation unit. The multi-environment collaborative simulation unit runs according to preset parameters to reproduce the corresponding single-factor or composite vehicle working condition environment. The synchronous triggering component sends out a unified nanosecond-level trigger signal, and the multi-dimensional real-time monitoring unit and the multi-modal non-destructive imaging detection unit start data acquisition simultaneously. The acquired raw data is transmitted to the intelligent data processing and defect assessment unit in real time. The intelligent data processing and defect assessment unit processes the received raw data in real time, simultaneously completing defect identification, performance degradation analysis, and defect evolution prediction, thus achieving closed-loop operation of the entire testing process.

[0041] At the end of the test, the intelligent data processing and defect assessment unit issues a shutdown command, and each unit stops running in a preset order, generating a complete comprehensive test report and completing the test process.

[0042] Example 2, please refer to Figure 1 As shown: This embodiment is a parallel detailed embodiment of the bonding interface performance testing system for automotive-grade chips described in Embodiment 1. Except for the optimization of the multi-environment collaborative simulation unit, the other technical contents are completely consistent with Embodiment 1, and will not be repeated here. In this embodiment, the specific optimized implementation of the multi-environment collaborative simulation unit is as follows: In the operating condition control stage, the temperature control component adopts a dual-cavity gradient temperature control structure and is electrically connected to the controllable humidity adjustment component through a synchronous control module. The signal input terminal of the synchronous control module is electrically connected to the operating condition configuration component of the intelligent data processing and defect assessment unit, which can realize synchronous alternating temperature and humidity cycle. The cycle period is adapted to the automotive-grade chip accelerated aging test standard, and it can achieve transient temperature shock of up to 30℃ / min, reproducing the extreme operating conditions of cold start and hot shutdown of automotive chips.

[0043] The variable frequency vibration simulation component adopts a three-axis, six-degree-of-freedom vibration table structure, which can simulate vibration conditions in three dimensions: vertical, horizontal, and lateral. The vibration amplitude, frequency, and waveform can all be configured through the control bus. It can directly import on-board real-world road spectrum data and reproduce the vibration and impact parameters of different road conditions in a 1:1 ratio. The variable frequency vibration simulation component and the mechanical stress loading component are electrically connected through the control bus. The control ports of both are electrically connected to the intelligent data processing and defect assessment unit, which can realize the time synchronization of vibration impact and dynamic stress loading.

[0044] In this embodiment, the dedicated fixture adopts a modular split structure and is fixed on the vibration table support surface of the multi-environment collaborative simulation unit. The fixture is equipped with replaceable clamping position modules, which can be adapted to automotive-grade BGA chips and PCB substrates, ceramic substrates, and aluminum substrates with different package sizes and pin counts. The clamping positions are equipped with elastic limiting components and insulating thermally conductive pads. The insulating thermally conductive pads are polyimide composite gaskets filled with high thermal conductivity aluminum nitride ceramic, which have high rigidity, high thermal conductivity, and buffer elasticity. This ensures electrical insulation and temperature uniformity, while avoiding vibration transmission attenuation and clamping stress concentration. After clamping and fixing, it ensures uniform stress on the bonding interface and avoids sample displacement and resonance affecting the detection accuracy of each unit and component during the test. The fixture is equipped with a stress transmission channel. The force application end of the mechanical stress loading component applies tensile / compressive and shear stresses to the bonding interface between the BGA chip and the substrate through the coaxial relative displacement of the chip and the substrate, avoiding test data distortion caused by stress displacement.

[0045] The multi-environment collaborative simulation unit is configured with an accelerated aging reliability test mode. In this mode, the temperature control component, controllable humidity regulation component, variable frequency vibration simulation component, and mechanical stress loading component synchronously receive control signals from the intelligent data processing and defect assessment unit via a control bus and start running synchronously. This mode superimposes four types of operating conditions: high temperature, high humidity, random vibration, and dynamic mechanical stress, corresponding to the all-factor composite operating condition in Example 1. This mode constructs a multi-stress coupled accelerated aging equation based on the Hallberg-Peck temperature and humidity acceleration model and the inverse power-law vibration and mechanical stress acceleration models, strictly adhering to the principle of consistency of accelerated test failure mechanisms, and combining automotive-grade chips with conventional automotive engine bay service. The baseline stress level for service is set (annual average ambient temperature 40℃, relative humidity 40%RH, road equivalent vibration acceleration 1.2g, assembly service baseline peak shear stress 2N). Accelerated stress parameters are set: temperature 85℃, humidity 85%RH, random vibration acceleration 15g, dynamic shear stress peak 50N. Accelerated aging is achieved by strengthening stress through multi-field coupling. The total acceleration factor can reach 75 times according to model calculation. It can complete the aging test equivalent to 10 years of vehicle service time within 1170h, quickly evaluate the performance degradation law and failure critical conditions of the bonding interface after long-term use, and adapt to the long-life reliability verification requirements of automotive-grade chips for 15 years / 200,000 kilometers.

[0046] This system supports two operating modes: step-by-step detection under composite conditions and continuous synchronous detection. In step-by-step detection mode, the intelligent data processing and defect assessment unit can independently activate the core components of the corresponding unit, and output independently according to the single-factor conditions in Embodiment 1, to carry out high and low temperature tests, damp heat tests, vibration tests, tensile and shear strength tests, thermal conductivity tests, and contact resistance tests. In continuous synchronous detection mode, the intelligent data processing and defect assessment unit can simultaneously activate all units and supporting components, and output collaboratively according to the multi-factor composite conditions in Embodiment 1, to fully simulate the entire process of composite conditions in actual automotive chip operation, and realize online detection and failure analysis of the bonding interface under all conditions.

[0047] Example 3, please refer to Figure 1 and Figure 4 As shown: This embodiment is a parallel detailed embodiment of the bonding interface performance testing system for automotive-grade chips described in Embodiment 1. Except for the optimization of the multi-dimensional real-time monitoring unit and the multi-modal non-destructive imaging testing unit, the remaining technical content is completely consistent with Embodiment 1, and will not be repeated here. In this embodiment, the specific optimization implementation process and core logic of the multi-dimensional real-time monitoring unit and the multi-modal non-destructive imaging testing unit are as follows: During the multi-dimensional data acquisition phase, in addition to the four sets of ring-shaped MEMS micro strain gauges, the interface stress sensing component of the multi-dimensional real-time monitoring unit can also add a distributed strain sensing array according to the arrangement of the solder ball array of the sample under test. The array is arranged one-to-one with the solder ball array of the BGA chip. The strain gauge sensitive grid is coaxially arranged with the corresponding solder ball welding point to realize stress distribution imaging of the entire bonding interface and accurately locate the local stress concentration area of ​​the interface.

[0048] Both the online thermal conductivity monitoring component and the infrared thermal imaging component of the multimodal non-destructive imaging detection unit achieve data interaction with the intelligent data processing and defect assessment unit through the signal transmission component. The interface heat flux density and temperature gradient data collected by the online thermal conductivity monitoring component and the chip surface temperature field distribution data collected by the infrared thermal imaging component are matched with timestamps and synchronously calculated by the intelligent data processing and defect assessment unit. This not only calculates the average thermal conductivity of the bonding interface, but also generates an interface thermal conductivity distribution cloud map and synchronously provides feedback on areas with abnormal local heat dissipation performance of the interface.

[0049] The temperature and humidity sensing components are distributed in a multi-node manner, fixed to the inner wall of the test chamber, around the sample clamping position, and near the detection end of the imaging component. The temperature and humidity parameters of the test environment are collected synchronously at multiple points to eliminate test errors caused by uneven temperature and humidity distribution inside the chamber. The vibration response sensing components use a triaxial accelerometer, rigidly fixed to the bearing platform of the frequency conversion vibration simulation component and the sample fixture surface. It synchronously collects the vibration parameters input to the platform and the actual response vibration parameters of the sample under vibration conditions, forming a closed-loop verification with the operating condition control reference data of the multi-environment collaborative simulation unit to ensure the accuracy of vibration condition reproduction.

[0050] In the multimodal nondestructive imaging stage, the infrared thermal imaging component of the multimodal nondestructive imaging detection unit adopts the phase-locked infrared thermal imaging mode, which can capture the transient temperature changes of the bonding interface during dynamic operation under composite working conditions, identify early defects such as interface cold solder joints and abnormal interface thermal resistance, and solve the pain point that conventional infrared imaging cannot detect tiny thermal defects under dynamic working conditions.

[0051] The high-frequency ultrasonic phased array component adopts a dynamic focusing and frequency sweeping mode, using a 128-channel high-frequency phased array probe with an adjustable center frequency of 10MHz to 100MHz. It can automatically adjust the probe frequency and focusing depth according to the adhesive layer thickness and solder ball size, and perform layer-by-layer scanning imaging of the adhesive interface. It can accurately identify internal cracks, interface debonding, bubbles, and poor soldering defects in the interface solder balls, with a detection resolution of up to 3μm. It can capture early interface damage at the micron level and output 3D ultrasonic imaging data of the internal structure.

[0052] The X-ray tomography scanning module adopts a helical tomography scanning mode, which can complete scanning imaging under dynamic conditions of vibration and temperature change, reconstruct the 3D structure of the bonding interface and solder ball array, and accurately locate the location and size of deep layer defects, solder ball cracks, and bridging defects in the interface.

[0053] The three types of imaging components form a three-level detection system for thermal defects, microstructural defects, and deep structural defects. The data are complementary and mutually verified, enabling full-dimensional, non-destructive detection of interface defects without blind spots, and significantly reducing the rate of missed and false detections.

[0054] During the data synchronization triggering phase, the multimodal nondestructive imaging detection unit and the multidimensional real-time monitoring unit are electrically connected through a synchronization triggering component. The signal input end of the synchronization triggering component is electrically connected to the intelligent data processing and defect assessment unit, and the signal output end is electrically connected to the trigger ports of each sensing component of the multidimensional real-time monitoring unit and each imaging component of the multimodal nondestructive imaging detection unit, respectively. The synchronization triggering component and the synchronization control module of the multi-environment collaborative simulation unit share the same isothermal crystal timing source to ensure that the timing of the operating condition output, performance data acquisition, and imaging data acquisition is completely synchronized.

[0055] When the synchronous triggering component outputs a unified trigger signal, the environmental parameters and interface performance parameters collected by the multi-dimensional real-time monitoring unit are completely consistent with the imaging data collected by the multi-modal non-destructive imaging detection unit in terms of acquisition timestamp, with a time error of ≤500ns. This can accurately correspond to the relationship between environmental stress and interface performance and defect status at any time point in the composite working condition, and can be used for subsequent analysis of the influence of single factors or multiple factors on the performance of the bonding interface in the composite working condition.

[0056] The intelligent data processing and defect assessment unit sends gradient temperature control / temperature shock commands to the temperature control component and simultaneously sends commands to the synchronous triggering component to collect data synchronously at temperature nodes. The synchronous triggering component outputs trigger signals at preset temperature nodes. The multi-dimensional real-time monitoring unit and the multi-modal non-destructive imaging detection unit simultaneously collect performance data and imaging data at corresponding temperature nodes. The data acquisition and analysis component matches and correlates multiple sets of data at the same time stamp to generate a correspondence between the health status of the bonding interface and temperature changes, and accurately locates the critical temperature nodes where interface performance changes abruptly.

[0057] Example 4, please refer to Figure 1 As shown: This embodiment is a preferred embodiment of the bonding interface performance testing system for automotive-grade chips described in Embodiments 1, 2, and 3. Except for the optimization of the intelligent data processing and defect assessment unit, the remaining technical content is completely consistent with the aforementioned embodiments, and will not be repeated here. In this embodiment, the specific optimization implementation process and core logic of the intelligent data processing and defect assessment unit are as follows: Defect identification and performance evaluation are based on a dedicated processing engine built with a built-in automotive-grade chip bonding interface performance database and a multimodal fusion defect identification model. The engine has built-in data matching rules, defect identification rules and performance evaluation standards, and can automatically match the corresponding processing logic according to the type of collected data.

[0058] In the data preprocessing stage, the data acquisition and analysis component receives raw data transmitted from the multi-dimensional real-time monitoring unit and the multi-modal non-destructive imaging detection unit, and performs standardized preprocessing operations, including data noise reduction, format unification, outlier removal, timestamp matching and alignment, and data normalization, to eliminate environmental interference, electromagnetic interference, and sampling errors during the data acquisition process, ensuring the validity and consistency of the data. After preprocessing, the standardized data is divided into two paths: one path is fully encrypted and stored in the built-in large-capacity storage medium for subsequent test traceability, data reproduction, standard iteration, and model optimization; the other path is transmitted in real time to the defect identification and evaluation component for subsequent real-time defect identification and performance evaluation.

[0059] In the defect identification stage, the defect identification and evaluation component calls the built-in automotive-grade chip bonding interface performance database to compare standardized performance data and imaging data with standard thresholds in the database to initially screen abnormal data; at the same time, it calls the multimodal fusion defect identification model to complete defect feature extraction, defect type differentiation, defect location localization, and defect severity level determination, distinguishing between non-impact defects, critical defects, and fatal defects.

[0060] Among them, the automotive-grade chip bonding interface performance database is built based on massive automotive-grade BGA chip packaging test data, failure analysis data, and automotive service condition data. It covers bonding interface performance standard thresholds, defect feature libraries, and failure criteria for different package sizes, different substrate materials, and different solder systems. All thresholds meet the requirements of AEC-Q100, ISO16750, and GB / T38114-2019 automotive-grade standards.

[0061] The multimodal fusion defect recognition model employs a dual-branch CNN-Transformer network for multimodal feature fusion, with the following specific structure: The first branch is the temporal feature extraction branch. The input is standardized multi-dimensional performance monitoring time-series data. Local temporal features are extracted first through a 2-layer 1D-CNN network, and then long-term temporal dependency features are extracted through a 2-layer bidirectional LSTM network to capture the early decay signal of interface performance. The output is a 256-dimensional temporal feature vector. The second branch is the spatial feature extraction branch. The input is standardized multimodal imaging data, including infrared thermal images, ultrasound C-scan images, and X-ray tomographic slices. First, local defect spatial features are extracted through a 3-layer 2D-CNN network, and then global spatial features are extracted through a 4-layer Transformer encoder to achieve accurate identification of minute defects. The output is a 256-dimensional spatial feature vector. The feature vectors output from the two branches are deeply fused through a cross-modal attention module. The cross-modal attention module adopts a multi-head attention mechanism with 8 heads, and performs weight allocation and association mapping on temporal and spatial features. The fused feature vector is passed through a fully connected layer and a Softmax classification layer to output the recognition results of defect type, location, size, and severity level.

[0062] The model uses a weighted combination of cross-entropy loss function and Dice loss function as the loss function. It was pre-trained, validated and optimized using more than 100,000 sets of automotive-grade chip bonding interface defect samples. The training samples cover labeled data of different packaging forms and different defect types. The labeling rules comply with the requirements for judging chip packaging interface defects in IPC-9701 "Performance Testing Specification for Surface Mount Devices" and AEC-Q100 standard. The final model has a defect recognition accuracy of ≥99.5% and a micron-level micro-defect recognition rate of ≥98%, which is far higher than the single-modal recognition models in the existing technology.

[0063] In the performance evaluation and lifespan prediction stage, the defect identification and evaluation component assesses the current health status and performance degradation of the bonding interface based on the identified defect characteristics, interface performance data, and operating parameters, combined with failure criteria in the performance database. At the same time, it predicts the evolution trend of defects based on the particle filter algorithm, calculates the remaining lifespan of the bonding interface, and clarifies the critical failure conditions, providing data support for chip packaging process optimization and automotive service life design.

[0064] In the comprehensive test report generation stage, the data acquisition and analysis component receives the output results from the defect identification and assessment component and automatically generates a standardized comprehensive test report. The report includes full-process traceability of test environment parameters, change curves of core interface performance indicators, defect location distribution map and 3D imaging, defect type and severity level determination, defect impact assessment, and remaining service life prediction. The report can be directly exported for automotive-grade chip packaging quality control, incoming material inspection, process optimization, and reliability verification.

[0065] The data acquisition and analysis component is equipped with multi-protocol data output ports, which are compatible with external display devices, storage devices, and host computer systems. Among them, Ethernet and USB 3.0 high-speed interfaces are used for the rapid export of large-capacity imaging data, full-process test data, and comprehensive test reports, while RS485 serial interfaces are used for real-time low-speed transmission of test condition parameters, defect warning signals, and core performance indicators, fully compatible with RS485, Ethernet, and USB communication protocols. For identified critical and fatal defects, audible and visual defect risk warning signals are generated simultaneously and pushed to external display devices and control systems through corresponding ports to achieve real-time early warning and closed-loop management of defects.

[0066] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of the invention. Various changes and modifications can be made to the invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of the present invention as claimed. The scope of protection of this invention is defined by the appended claims and their equivalents.

Claims

1. A bonding interface performance testing system for automotive-grade chips, characterized in that, The system includes a multi-environment collaborative simulation unit, a multi-dimensional real-time monitoring unit, a multi-modal non-destructive imaging detection unit, and an intelligent data processing and defect assessment unit, wherein: The multi-environment collaborative simulation unit is used to reproduce the automotive-grade chip's on-board service conditions, providing a test environment that fits the actual on-board service scenario for bonding interface performance testing, and simultaneously generating operating condition control benchmark data and component operating status closed-loop feedback data and transmitting them to the intelligent data processing and defect assessment unit. The multi-environment collaborative simulation unit has built-in temperature control components, controllable humidity adjustment components, variable frequency vibration simulation components, and mechanical stress loading components. The components are electrically connected to each other through a control bus. The multi-dimensional real-time monitoring unit is used to be deployed in conjunction with the multi-environment collaborative simulation unit to synchronously collect test environment parameters and multi-dimensional performance parameters of the bonding interface, generate raw performance monitoring data with unique collection identifiers and timestamps, and transmit them in real time to the intelligent data processing and defect assessment unit through the signal transmission component. The multi-dimensional real-time monitoring unit has built-in temperature and humidity sensing components, interface stress sensing components, vibration response sensing components, thermal conductivity online monitoring components, and interface contact resistance online monitoring components. Each component is electrically connected to the signal transmission component. The multimodal nondestructive imaging detection unit is used to perform multimodal nondestructive testing on the bonding interface of the automotive-grade chip under test. It achieves full coverage of bonding interface defects through multi-component synchronous layered scanning, generates original imaging detection data with unique acquisition identifier and timestamp, and transmits it to the intelligent data processing and defect assessment unit in real time through the signal transmission component. The multimodal nondestructive imaging detection unit has built-in infrared thermal imaging components, high-frequency ultrasonic phased array components, and X-ray tomography components, and each component is electrically connected to the signal transmission components. The intelligent data processing and defect assessment unit is used to realize the coordinated control and timing synchronization of the entire system, receive and process the raw performance monitoring data and raw imaging detection data, complete the defect identification, performance assessment and life prediction of the bonding interface, and generate and output the comprehensive detection results. The intelligent data processing and defect assessment unit has built-in operating condition configuration components, synchronization triggering components, data acquisition and analysis components, and defect identification and assessment components. The components are electrically connected through an internal bus. The multi-environment collaborative simulation unit, multi-dimensional real-time monitoring unit, multi-modal non-destructive imaging detection unit, and intelligent data processing and defect assessment unit are integrated and linked through signal transmission components.

2. The bonding interface performance testing system for automotive-grade chips according to claim 1, characterized in that, The multi-environment collaborative simulation unit is specifically used for: The temperature control component, the controllable humidity regulation component, the frequency conversion vibration simulation component, and the mechanical stress loading component can be controlled to operate independently, while the other components are in a standby locked non-working state, outputting a single-factor working environment. The system controls two or more of the following components to operate simultaneously: temperature control, controllable humidity regulation, frequency conversion vibration simulation, and mechanical stress loading. It outputs a complex working environment with multiple factors superimposed according to a preset synchronization sequence, parameter linkage relationship, and alternating cycle logic. Simultaneously generate operating condition control baseline data and component operating status closed-loop feedback data, and transmit them to the intelligent data processing and defect assessment unit.

3. The bonding interface performance testing system for automotive-grade chips according to claim 2, characterized in that, The mechanical stress loading component built into the multi-environment collaborative simulation unit is specifically used for: The sample to be tested is clamped and fixed by a special fixture. The special fixture adopts a modular split structure and is equipped with replaceable clamping position modules. The clamping position is equipped with elastic limiting parts and insulating and heat-insulating pads. The stress is precisely applied to the bonding interface of the sample being tested through the stress transmission channel inside the tooling.

4. The bonding interface performance testing system for automotive-grade chips according to claim 1, characterized in that, The multi-dimensional real-time monitoring unit is specifically used for: Simultaneously collect temperature and humidity data of the test environment, stress distribution data of the bonding interface, vibration response data, thermal conductivity data, and interface contact resistance data; Generate raw performance monitoring data with a unique collection identifier and timestamp; The raw performance monitoring data is transmitted in real time to the intelligent data processing and defect assessment unit via the signal transmission component.

5. The bonding interface performance testing system for automotive-grade chips according to claim 4, characterized in that, The interface stress sensing component built into the multi-dimensional real-time monitoring unit is specifically used for: The normal stress and tangential shear stress at the bonding interface are simultaneously collected by four sets of MEMS micro strain gauges arranged in a ring symmetrically on the outermost edge of the BGA substrate pads. The welding points of the strain gauge sensitive grid and the outermost ring of solder balls on the substrate are arranged in a one-to-one correspondence.

6. The bonding interface performance testing system for automotive-grade chips according to claim 1, characterized in that, The multimodal nondestructive imaging detection unit is specifically used for: The bonding interface is simultaneously scanned in parallel using an infrared thermal imaging component, a high-frequency ultrasonic phased array component, and an X-ray tomography component. Collect temperature distribution imaging data of the bonding interface, 3D ultrasound imaging data of the internal structure, and micron-level X-ray tomography data of the deep structure. The system generates raw imaging detection data with a unique acquisition identifier and timestamp, which is then transmitted in real time to the intelligent data processing and defect assessment unit via a signal transmission component.

7. The bonding interface performance testing system for automotive-grade chips according to claim 6, characterized in that, The high-frequency ultrasonic phased array component built into the multimodal nondestructive imaging detection unit is specifically used for: A 128-channel high-frequency phased array probe is used, which automatically adjusts the probe frequency and focusing depth according to the adhesive layer thickness and solder ball size; The bonding interface is scanned layer by layer to output 3D ultrasound imaging data of the internal structure.

8. The bonding interface performance testing system for automotive-grade chips according to claim 1, characterized in that, The intelligent data processing and defect assessment unit is specifically used for: The operating condition configuration component sends operating condition control commands to the multi-environment collaborative simulation unit. The synchronous triggering component sends synchronous acquisition commands to the multi-dimensional real-time monitoring unit and the multi-modal non-destructive imaging detection unit. The synchronous control module of the synchronous triggering component and the multi-environment collaborative simulation unit completes timing calibration through a shared isothermal crystal timing source.

9. The bonding interface performance testing system for automotive-grade chips according to claim 8, characterized in that, The built-in synchronization triggering component of the intelligent data processing and defect assessment unit is specifically used for: A unified trigger signal is output to the trigger ports of each sensing component of the multi-dimensional real-time monitoring unit and each imaging component of the multi-modal non-destructive imaging detection unit. This ensures that the acquisition timestamps of the multi-dimensional real-time monitoring unit and the multi-modal non-destructive imaging detection unit are perfectly matched.

10. The bonding interface performance testing system for automotive-grade chips according to claim 1, characterized in that, The data acquisition and analysis component built into the intelligent data processing and defect assessment unit is specifically used for: It receives raw data transmitted from the multi-dimensional real-time monitoring unit and the multi-modal non-destructive imaging detection unit, and performs data noise reduction, format unification, outlier removal, timestamp matching and alignment, and data normalization processing. The processed standardized data is divided into two paths: one path is encrypted and stored in the built-in high-capacity storage medium, and the other path is transmitted to the defect identification and assessment component. Data and comprehensive test reports are exported through a multi-protocol data output port, which is compatible with RS485, Ethernet, and USB communication protocols.

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