Through-hole structure positioning detection method, electronic device, storage medium and program

By acquiring RGB images and point cloud data, the plane equation and pose information are determined, solving the problems of insufficient accuracy and poor flexibility in through-hole detection, and realizing efficient and automated through-hole structure positioning and quality inspection.

CN122415474APending Publication Date: 2026-07-17SHANGHAI AIRCRAFT MFG

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
SHANGHAI AIRCRAFT MFG
Filing Date
2026-04-14
Publication Date
2026-07-17

AI Technical Summary

Technical Problem

Existing through-hole inspection methods suffer from insufficient inspection accuracy and poor flexibility, making it difficult to achieve efficient automated production.

Method used

By acquiring RGB images and point cloud data of the target device, the plane equation of the target plane is determined, and the pose information of the detection camera is determined by the projection matrix between the RGB images and point cloud data and the plane equation, thereby realizing automatic positioning and quality inspection of the through-hole structure.

Benefits of technology

It improves the detection accuracy and efficiency of through-hole structures, realizes automatic positioning and quality inspection, and meets the high efficiency and versatility requirements of modern automated production.

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Abstract

本发明实施例公开了一种通孔结构定位检测方法、电子设备、存储介质及程序,其中,方法包括:获取目标器件的RGB图像和点云数据;根据点云数据确定目标器件上目标平面的平面方程;根据目标器件的RGB图像和点云数据确定目标器件上通孔结构在RGB图像的坐标系空间的中心坐标数据集合;根据通孔结构在RGB图像的坐标系空间的中心坐标数据集合、目标器件的RGB图像和点云数据之间的投影矩阵和目标平面的平面方程确定检测相机的位姿信息;其中,检测相机用于根据位姿信息对目标器件上的通孔结构进行质量检测。本发明实施例的技术方案能够实现通孔结构的自动定位与质量检测,进而提高通孔结构的检测效率和检测精度。
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