A method and system for surface defect identification of SRP test samples
By continuously tracking the local rewetting and drying process of abnormal areas on the surface of SRP test samples, and using the intersection displacement and regional connectivity changes to identify cleaning residue abnormalities, the problem of misjudgment in the detection of defects in patternless wafers is solved, and the reliability of detection is improved.
CN122415609APending Publication Date: 2026-07-17CHONGQING EAGLE VALLEY OPTOELECTRONICS
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Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- CHONGQING EAGLE VALLEY OPTOELECTRONICS
- Filing Date
- 2026-06-16
- Publication Date
- 2026-07-17
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Figure CN122415609A_ABST
Abstract
本发明公开了一种用于SRP测试样品的表面缺陷识别方法及系统，具体涉及半导体样品表面检测领域，包括获取完成清洗和干燥处理的SRP测试样品，在相同成像倍率和相同照明条件下，对待检表面按半幅视场横向移动、半幅视场纵向换行的方式逐幅采集局部图像，并按相邻局部图像的重合区域进行位置对齐和图像拼接，输出干态图像；本发明通过对表面异常区域在局部再润湿和再干燥过程中的边界演变进行连续跟踪识别，以解决无图形晶圆缺陷检测场景下SRP测试样品表面清洗残留异常与真实表面缺陷难以可靠区分的问题。
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