Improved heat dissipation structure and method for manufacturing a resistor
By employing a synergistic structure of an aluminum nitride ceramic substrate and a hexagonal boron nitride heat-spreading coating in a precision resistor, a continuous thermal conduction path is formed, solving the problems of hot spot concentration and insufficient heat dissipation in existing resistors. This achieves the dual goals of efficient heat dissipation and miniaturized packaging, improving the resistor's operational stability and adaptability.
Patent Information
- Application Number
- CN202610694616.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2026-05-20
- Publication Date
- 2026-07-17
AI Technical Summary
The existing precision resistors have insufficient heat dissipation capacity, resulting in concentrated hot spots and excessive resistance temperature drift. They cannot simultaneously achieve the dual goals of heat dissipation and miniaturized packaging, making it difficult to meet the development needs of RF and audio power amplifier modules.
The synergistic structure of aluminum nitride ceramic substrate and hexagonal boron nitride heat-spreading coating layer forms a continuous heat conduction path, realizing bidirectional rapid conduction of heat from the resistor. Combined with serpentine or grid-like resistor circuit structure, it meets the requirements of heat dissipation and miniaturization.
It achieves rapid dispersion and efficient heat dissipation from the resistor, improving operational stability and service life. It also meets the ultra-thin and miniaturized packaging requirements of power amplifier modules, solving the problems of hot spot concentration and resistance temperature drift.
Smart Images
Figure CN122417587A_ABST