Composite electrode material, preparation method thereof, negative electrode sheet and solid-state battery

By using a composite structure of porous silicon nanosheets, a uniform and dense carbon shell, and a phosphorus-doped silicon framework, combined with copper nanoparticle conductive bridges, the volume expansion and conductivity issues of silicon-based anode materials were solved, achieving efficient electron/ion transport and structural stability, thus improving the performance of solid-state batteries.

CN122417850APending Publication Date: 2026-07-17CHINA FAW CO LTD
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Patent Information

Application Number
CN202610734541.X
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2026-05-26
Publication Date
2026-07-17

AI Technical Summary

Technical Problem

Existing silicon-based anode materials exhibit severe volume expansion during lithium insertion/extraction, leading to structural pulverization, low electronic conductivity, and low ion diffusion coefficient. Traditional modification methods have limited effectiveness, making it difficult to construct stable and efficient composite structures.

Method used

A porous silicon nanosheet structure is used to provide an expansion buffer space, a uniform and dense carbon shell is used for mechanical constraint, a phosphorus-doped silicon framework is constructed to improve conductivity, and a three-dimensional conductive network is constructed through a continuous carbon shell, with copper nanoparticles embedded to form dot-like conductive bridges, thus forming a triple conductive pathway.

Benefits of technology

It effectively suppresses volume expansion, stabilizes the solid electrolyte interface film, improves electron/ion transport efficiency, enhances structural stability, and increases battery capacity and cycle life.

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Abstract

本发明涉及固态电池技术领域,具体而言,涉及一种复合电极材料及其制备方法、负极极片和固态电池。复合电极材料包括磷掺杂多孔硅纳米片和包覆在磷掺杂多孔硅纳米片表面的碳壳,且碳壳中嵌入有铜纳米颗粒。本通过“多孔硅纳米片”结构提供膨胀缓冲空间,再以“均匀致密碳壳”进行机械约束,双管齐下可有效抑制体积膨胀问题,稳定SEI膜;构建“磷掺杂硅骨架”提升本征电导率,外部“连续碳壳”构建三维导电网络,碳壳内部“嵌入铜纳米颗粒”形成点状导电桥,三重导电通路协同作用,极大提升了电子 / 离子传输效率;此外,磷掺杂增强硅的界面键合强度,碳壳与嵌入的铜颗粒共同起到“铠甲”和“铆钉”的作用,增强了结构稳定性,能够防止粉化。
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