Copper structure with two-step structure and method for manufacturing the same
By fabricating bosses on copper foil and setting dry film protection areas, combined with controlled-depth etching to form recessed grooves, the corrosion problem at the root of the bosses was solved, improving the bonding strength between the bosses and the substrate, as well as the structural integrity and yield of the product.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- TAISHAN JINGCHENGDA CIRCUIT TECH CO LTD
- Filing Date
- 2026-04-10
- Publication Date
- 2026-07-17
AI Technical Summary
In the existing technology for manufacturing copper structural parts with bosses and recesses, the root of the boss is easily corroded, which leads to a decrease in connection strength and dimensional deviation from design tolerances, affecting the structural integrity and yield of the product.
A boss is prepared on a copper foil and a completely covered dry film protection area is set. A recessed groove is formed by controlled-depth etching to form a copper structural component with a two-stage step structure. The dry film protection area is used to tightly wrap the root of the boss without gaps to avoid the risk of side etching.
This improves the bonding strength between the boss and the copper foil substrate, ensures that the root of the boss is not corroded, enhances the structural integrity and processing yield of the product, and achieves precise positional consistency between the boss and the recessed groove.
Smart Images
Figure CN122421218A_ABST