Wafer rotating support device and wafer cleaning device

By designing a wafer rotation support device, the protrusions and connections of the integrated structure are used to increase the contact area, which solves the problems of edge wear and crack defects during wafer cleaning, and achieves higher wafer yield and cleaning stability.

CN122421707APending Publication Date: 2026-07-17ANHUI JUHE MICROELECTRONICS CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
ANHUI JUHE MICROELECTRONICS CO LTD
Filing Date
2026-06-15
Publication Date
2026-07-17

AI Technical Summary

Technical Problem

During the wafer cleaning process, the discontinuity of the support surface during wafer rotation leads to edge wear and crack defects, affecting the polishing quality.

Method used

A wafer rotation support device is designed, which includes a support protrusion and a limiting protrusion. The connecting part and the support protrusion form an integral structure, which increases the contact area, reduces contact stress, and reduces the risk of wafer edge damage.

Benefits of technology

It significantly reduces the risk of damage to wafer edges, improves wafer yield, and ensures the stability and accuracy of the cleaning process.

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Abstract

本申请涉及半导体设备领域，具体涉及一种晶圆旋转支撑装置及晶圆清洗装置。其中晶圆旋转支撑装置包括第一转动结构与第二转动结构，第一转动结构包括前固定盘、第一接触轮和后固定盘，第一接触轮位于前固定盘与后固定盘之间，第一接触轮具有引流槽；前固定盘包括间隔设置的凸出部和连接部，凸出部包括支撑凸部和限位凸部，支撑凸部相对于第一转动结构的倾斜角度小于限位凸部相对于第一转动结构的倾斜角度，连接部与支撑凸部连接；沿第一转动结构的轴向，连接部与第一接触轮的引流槽对准，且沿第一转动结构的径向，连接部顶面至第一转动结构的中心轴线的距离大于或等于第一接触轮的半径。通过本申请，能够减小晶圆在转动过程中的磨损。
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