An artificial intelligence-based semiconductor package automatic optical inspection method and system
By introducing a two-stage interpretation process of AOI and AI and a closed-loop adaptive mechanism into semiconductor packaging inspection, the problems of high over-kill rate of traditional AOI and high cost of AI are solved, and efficient, accurate and low-cost packaging appearance inspection is achieved.
CN122421733APending Publication Date: 2026-07-17NINGBO LIANHONG ELECTRONIC TECH CO LTD
View PDF 1 Cites 0 Cited by
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- NINGBO LIANHONG ELECTRONIC TECH CO LTD
- Filing Date
- 2026-01-28
- Publication Date
- 2026-07-17
Smart Images
Figure CN122421733A_ABST
Abstract
本发明公开一种基于人工智能的半导体封装自动光学检测方法及系统，采用AOI规则初判与CNN智能覆判的双阶段架构，并引入针对固化树脂工艺变异的自适应死循环更新机制：仅对AOI疑似不良品进行ROI精确分割及96×96子图像CNN覆判，结合半监督学习自动收集确认不良品数据迭代优化模型。相较传统AOI，过杀率降低约29.89%，TPI首次检测良率提升0.31%，人工覆判环节基本消除，具备显著非显而易见的技术进步。
Need to check novelty before this filing date? Find Prior Art