Transparent antenna welding method and automatic welding system

Abstract

The application relates to the technical field of electronic components, and discloses a transparent antenna welding method and an automatic welding system, which comprises the following steps: making the core body of a coaxial signal line overlap the welding pad of an antenna circuit without a gap, the surface of the welding pad being provided with a blackening layer; setting a low-temperature tin paste with adjustable preset quantity in the welding area of the welding pad; emitting welding laser through a semiconductor laser, and focusing the welding laser on the blackening layer, the focused light spot of the welding laser covering the welding area of the welding pad and part of the core body of the coaxial signal line; the welding laser breaks the blackening layer in the range covered by the focused light spot, so that the core body of the coaxial signal line is combined with the welding pad metal, and the target time length during which the welding laser acts on the blackening layer is fed back according to the target temperature of the contact interface between the core body of the coaxial signal line and the welding pad; after the welding spot formed between the core body of the coaxial signal line and the welding pad is detected at multiple angles, the transparent antenna with completed welding is output. The application improves the reliability and efficiency of transparent antenna welding.

Description

Technical Field

[0001] This application relates to the field of electronic component technology, specifically to a transparent antenna welding method and an automatic welding system. Background Technology

[0002] With the rapid development of consumer electronics, automotive electronics, and IoT devices, antennas, as key components for signal transmission and reception, are evolving towards thinner, more integrated, and more transparent designs. Transparent antennas, due to their excellent optical transparency and spatial compatibility, are being used more and more widely in fields such as smartphones, automotive antennas, wearable devices, and smart homes.

[0003] In related technologies, transparent antennas use transparent polyethylene (PE) material as the support substrate to support the antenna circuitry. The core of the signal line is electrically connected to the antenna circuitry through welding, thereby completing the signal transmission between the antenna and the external circuitry. However, the upper limit of the temperature resistance of the transparent PE support is only about 85℃, while the welding temperature required by traditional welding processes (such as hot air welding, infrared welding, and soldering iron welding) is usually above 150℃, or even higher. Using such high-temperature welding methods will directly cause the PE support to undergo thermal deformation, melting, or even carbonization, damaging the structural integrity of the antenna product and causing the product to be scrapped. Even if low-temperature solder paste with a melting point of 138℃ is used for manual welding, there is still a risk of local temperature exceeding the limit due to the difficulty in accurately controlling the local heating area and heating time during manual operation. In addition, the poor fluidity of the solder paste makes it difficult to guarantee the welding quality, resulting in extremely low production efficiency. Summary of the Invention

[0004] In view of this, this application provides a transparent antenna welding method and an automatic welding system to solve the aforementioned technical problems.

[0005] In a first aspect, embodiments of this application disclose a transparent antenna welding method, including: The transparent PE bracket carrying the antenna line is fed into a material positioning seat that matches the outline of the transparent PE bracket, and the core of the coaxial signal line is seamlessly attached to the pad of the antenna line, wherein the surface of the pad has a blackening layer. Based on the size of the pad, a preset amount of low-temperature solder paste is applied to the soldering area of ​​the pad, and the low-temperature solder paste is connected to the core of the coaxial signal line on the blackening layer. A welding laser is emitted by a semiconductor laser and focused onto the blackening layer, wherein the focused spot of the welding laser covers the welding area of ​​the pad and part of the core of the coaxial signal line; Based on the operating parameters of the semiconductor laser, the welding laser breaks through the blackening layer within the coverage area of ​​the focused spot, so that the core of the coaxial signal line is bonded to the metal of the pad. The target duration of the welding laser acting on the blackening layer is fed back according to the target temperature of the contact interface between the core of the coaxial signal line and the pad. After performing multi-angle detection on the solder joints formed between the core of the coaxial signal line and the solder pad, the completed soldering transparent antenna is output.

[0006] In one possible example, the target temperature range of the contact interface is 120-200℃, the target duration is ≤5ms; and within the 5ms time range, the welding laser breaks through the blackening layer within the coverage area of ​​the focused spot, causing the contact interface between the core of the coaxial signal line and the pad to heat up to 120-200℃, and the surface temperature of the transparent PE bracket is ≤85℃.

[0007] In one possible example, the operating parameters of the semiconductor laser include: a pulse frequency of 30-100Hz and an output power of 30-80W.

[0008] In one possible example, the wavelength range of the welding laser is 808-980 nm, and the diameter range of the focused spot is 0.1-1.0 mm.

[0009] In one possible example, the pad size ranges from 0.5mm × 0.5mm to 1.0mm × 2.0mm, and the thickness of the blackening layer ranges from 1 to 5nm.

[0010] In one possible example, the thickness of the solder joint formed between the core of the coaxial signal line and the pad is 0.4-1.3 mm, the tensile strength is ≥10 N, and the contact resistance is ≤10 mΩ.

[0011] In one possible example, the transparent PE support has a PET film layer attached to the transparent PE support, and the antenna lines are fabricated on the PET film layer, with the solder pads provided on the antenna lines.

[0012] In one possible example, the thickness of the transparent PE support is 0.2-5.0 mm, the thickness of the PET film is 0.1-0.3 mm, and the light transmittance of the PET film is ≥90%.

[0013] In one possible example, the real-time temperature of the contact interface is acquired by an infrared temperature sensor, and the output power of the semiconductor laser or the target duration is dynamically adjusted based on the difference between the real-time temperature and the target temperature.

[0014] Secondly, embodiments of this application disclose an automated transparent antenna welding system for use in any of the transparent antenna welding methods described in the above embodiments, comprising: The central control module, and the feeding and positioning module, soldering module, welding module, detection module, and discharging module electrically connected to the central control module, are all under the control of the central control module: The feeding and positioning module feeds the transparent PE bracket carrying the antenna line into the material positioning seat that matches the outline of the transparent PE bracket, and makes the core of the coaxial signal line overlap the pad of the antenna line without gap. The soldering module applies a preset amount of adjustable low-temperature solder paste to the soldering area of ​​the pad based on the size of the pad, and the low-temperature solder paste is connected to the core of the coaxial signal line on the blackening layer. The welding module emits a welding laser through a semiconductor laser and focuses the welding laser onto the blackened layer. Based on the operating parameters of the semiconductor laser, the welding laser breaks through the blackened layer within the coverage area of ​​the focused spot, so that the core of the coaxial signal line is bonded to the metal of the pad. The detection module performs multi-angle detection on the solder joints formed between the core of the coaxial signal line and the solder pad. The output module outputs a transparent antenna that has been welded.

[0015] In summary, compared with the prior art, this application discloses a transparent antenna welding method and an automatic welding system, comprising: feeding a transparent PE bracket carrying antenna lines into a material positioning seat that matches the contour of the transparent PE bracket, and ensuring that the core of the coaxial signal line is seamlessly overlapped on the pads of the antenna lines, wherein the surface of the pads has a blackening layer; setting a preset amount of adjustable low-temperature solder paste in the welding area of ​​the pads based on the size of the pads, and connecting the low-temperature solder paste to the core of the coaxial signal line on the blackening layer; emitting a welding laser through a semiconductor laser and focusing the welding laser onto the blackening layer. The welding laser's focused spot covers the welding area of ​​the pad and part of the coaxial signal line core. Based on the semiconductor laser's operating parameters, the welding laser breaks through the blackening layer within the focused spot's coverage area, allowing the coaxial signal line core to bond with the pad metal. The target duration of the welding laser's action on the blackening layer is fed back based on the target temperature of the contact interface between the coaxial signal line core and the pad. After multi-angle detection of the solder joint formed between the coaxial signal line core and the pad, the completed welding transparent antenna is output. Thus, the reliability and efficiency of transparent antenna welding are improved through the above settings. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a flowchart of a transparent antenna welding method according to an embodiment of this application; Figure 2 This is a schematic diagram of the structure of the first transparent antenna according to an embodiment of this application; Figure 3 This is a schematic diagram of the structure of the second type of transparent antenna according to an embodiment of this application; Figure 4 This is a frame diagram of the automatic welding system for transparent antennas according to an embodiment of this application. Detailed Implementation

[0018] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. In the following description, when referring to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the claims.

[0019] It should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element. Furthermore, components, features, and elements with the same names in different embodiments of this application may have the same meaning or different meanings, the specific meaning of which must be determined by its interpretation in that specific embodiment or further in conjunction with the context of that specific embodiment.

[0020] It should be understood that the specific embodiments described herein are merely illustrative of this application and are not intended to limit this application.

[0021] In the following description, the use of suffixes such as "module," "part," or "unit" to denote elements is solely for the purpose of illustrative purposes and has no specific meaning in itself. Therefore, "module," "part," or "unit" may be used interchangeably.

[0022] In the description of this application, it should be noted that the terms "upper," "lower," "left," "right," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0023] The technical solutions shown in this application will be described in detail below through specific embodiments. It should be noted that the order of description of the following embodiments is not intended to limit the priority of the embodiments.

[0024] As described in the background section, the upper temperature limit of the transparent PE bracket in the relevant technology is only about 85°C, while the welding temperature required by traditional welding processes (such as hot air welding, infrared welding, and soldering iron welding) is usually above 150°C or even higher. Using such high-temperature welding methods will directly cause the PE bracket to undergo thermal deformation, melting, or even carbonization, damaging the structural integrity of the antenna product and causing the product to be scrapped. Even if low-temperature solder paste with a melting point of 138°C is used for manual welding, there is still a risk of local temperature exceeding the limit because manual operation makes it difficult to accurately control the local heating area and heating time. In addition, the solder paste has poor fluidity, making it difficult to guarantee welding quality and resulting in extremely low production efficiency.

[0025] Based on this, this application discloses a transparent antenna welding method, referring to... Figures 1 to 3 The transparent antenna welding method includes: S101, the transparent PE bracket 1 carrying the antenna line 4 is fed into the material positioning seat that matches the contour of the transparent PE bracket 1, and the core of the coaxial signal line 2 is seamlessly connected to the pad 5 of the antenna line 4, wherein the surface of the pad 5 has a blackening layer 5a.

[0026] In this step, the transparent PE bracket 1 carrying the antenna line 4 can be regarded as a semi-finished transparent antenna for the coaxial signal line 2 to be soldered. Specifically, the transparent PE bracket 1 is provided with a PET film layer 3, the PET film layer 3 is attached to the transparent PE bracket 1, and the antenna line 4 is prepared on the PET film layer 3. The antenna line 4 is provided with a solder pad 5, and the surface of the solder pad 5 has a blackening layer 5a.

[0027] Preferably, the thickness of the transparent PE support 1 is 0.2-5.0 mm, its upper temperature resistance is 85℃, the thickness of the PET film layer 3 is 0.1-0.3 mm, its light transmittance is ≥90%, and the thickness of the blackening layer 5a is 1-5 nm.

[0028] Furthermore, the transparent PE bracket 1 can be batch-grabbed by a robotic arm using vacuum adsorption and transported to a material positioning seat. The material positioning seat has a contoured groove that matches the outline of the transparent PE bracket 1, and its inner wall is provided with a flexible buffer layer (such as silicone) to prevent the transparent PE bracket 1 from being scratched or deformed by pressure during the positioning process.

[0029] Furthermore, after the transparent PE bracket 1 is fixed, the core of the coaxial signal line 2 is seamlessly overlapped on the pad 5. Specifically, the end of the coaxial signal line 2 is pre-treated by stripping the outer sheath, shielding layer, and insulation layer, exposing a 1-3mm long tin-plated copper core. The insulation part of the coaxial signal line 2 is clamped by a flexible clamp (the clamping surface is made of silicone material, and the clamping pressure is 0.05-0.1MPa), and the exposed core is precisely placed on the surface of the pad 5, so that the axial direction of the core is basically consistent with the length direction of the pad 5, and the end of the core is flush with or slightly recessed from the edge of the pad 5. Under the slight pressure of the flexible clamp, the core and the blackened layer 5a of the pad 5 form a tight physical contact, with no air gap macroscopically, thereby avoiding energy scattering or interface oxidation caused by air layer during subsequent laser irradiation.

[0030] It should be noted that in this step, gapless overlap means that there is no visible air gap between the core and the blackening layer 5a, but a metal bond has not yet been formed between the two. Due to the presence of the blackening layer 5a, the core and the pad 5 are not conductive at this time. This overlap method provides a stable initial contact state for subsequent laser welding.

[0031] S102, a preset amount of low-temperature solder paste is applied to the soldering area of ​​the pad 5 based on the size of the pad 5, and the low-temperature solder paste is connected to the core of the coaxial signal line 2 on the blackening layer 5a.

[0032] In this step, after the core of the coaxial signal line 2 is seamlessly overlapped with the pad 5, low-temperature solder paste is added at specific points and in specific quantities to the blackened layer 5a of the pad 5, so that the solder paste simultaneously contacts the blackened layer 5a and the core of the coaxial signal line 2, providing the necessary conditions for subsequent laser melting of solder paste, breaking of the blackened layer 5a and formation of metal bonding.

[0033] Furthermore, the low-temperature solder paste selected in this embodiment is a tin-bismuth-based or tin-bismuth-silver-based lead-free solder with a melting point of 138°C, so as to complete the soldering without damaging the transparent PE bracket 1 with a temperature resistance limit of only 85°C.

[0034] Preferably, the size of the pad 5 ranges from 0.5mm × 0.5mm to 1.0mm × 2.0mm.

[0035] It is understandable that the application of low-temperature solder paste can be implemented in two ways. In step S101, after the core of the coaxial signal line 2 has been attached to the pad 5, the low-temperature solder paste is applied to the junction area between the core and the pad 5, so that the solder paste covers part of the side of the core and the surface of the adjacent black layer 5a. The paste-like properties of the low-temperature solder paste cause it to automatically gather under the action of surface tension, wrapping the contact angle area between the core and the pad 5, forming a bridging structure of "core, low-temperature solder paste and black layer".

[0036] Alternatively, low-temperature solder paste can be applied to the soldering area of ​​the blackened layer 5a of the pad 5 first, and then the core can be pressed onto the low-temperature solder paste. At this time, the core and the pad 5 are not in direct contact, but are indirect contact through the solder paste layer. Regardless of which method is used, the common feature is that before laser irradiation, the low-temperature solder paste has already been in contact with or adjacent to the core of the coaxial signal line 2 on the blackened layer 5a.

[0037] S103, a welding laser is emitted by a semiconductor laser and focused onto the blackening layer 5a, wherein the focused spot of the welding laser covers the welding area of ​​the pad 5 and part of the core of the coaxial signal line 2.

[0038] In this step, this embodiment uses a semiconductor laser as the welding light source to emit welding laser. Semiconductor lasers have advantages such as high electro-optical conversion efficiency, small size, long lifespan, and stable output power, making them particularly suitable for micro-welding of precision electronic components.

[0039] Preferably, the wavelength range of the welding laser is 808-980nm. This wavelength range is beneficial for the absorption of the solder pad 5 (usually copper-based or copper-plated) and the tin-plated copper core of the coaxial signal line 2, which can effectively convert light energy into heat energy.

[0040] In one embodiment, the welding laser in the wavelength range of 808-980nm can be used with a back-illumination scheme, that is, the welding laser in this band can pass through the transparent PE support 1 and PET film 3 with a transmittance of ≥90% to reach the surface of the pad 5 without being significantly absorbed or scattered by the substrate.

[0041] Furthermore, the blackening layer 5a has a certain absorption enhancement effect on welding lasers in the wavelength range of 808-980nm, which helps to concentrate laser energy at the interface and achieve rapid decomposition or peeling of the blackening layer 5a.

[0042] Furthermore, the welding laser is focused into a spot that irradiates the surface of the pad 5. The preferred diameter range of the focused spot is 0.1-1.0 mm. Specifically, when the size of the pad 5 is small (e.g., 0.5 mm × 0.5 mm), the diameter of the focused spot can be adjusted to 0.1-0.3 mm to ensure energy concentration and prevent heat from spreading to areas outside the pad 5. When the size of the pad 5 is large (e.g., 1.0 mm × 2.0 mm), the diameter of the focused spot can be adjusted to 0.5-1.0 mm, or a multi-segment scanning method can be used to cover the entire welding area.

[0043] The focused spot simultaneously covers the soldering area of ​​pad 5 (the central area of ​​pad 5 or the core overlap area) and part of the core of coaxial signal line 2.

[0044] It should be noted that focusing the welding laser to the blackening layer 5a means precisely positioning the focal plane of the laser beam at the blackening layer 5a on the surface of the pad 5. The spot diameter at the focal plane is the smallest and the energy density is the highest, which can generate instantaneous high temperature to decompose or peel off the blackening layer 5a within milliseconds, thus avoiding overheating damage to the transparent PE support 1 or PET film layer 3.

[0045] S104, based on the operating parameters of the semiconductor laser, the welding laser breaks through the blackened layer 5a within the coverage area of ​​the focused spot, so that the core of the coaxial signal line 2 is metal-bonded to the pad 5. The target duration of the welding laser acting on the blackened layer 5a is fed back according to the target temperature of the contact interface between the core of the coaxial signal line 2 and the pad 5.

[0046] In this step, the semiconductor laser emits a welding laser according to preset operating parameters to perform a welding operation. The instantaneous high energy of the laser breaks the blackening layer 5a within the coverage area of ​​the focused spot, so that the core of the coaxial signal line 2 and the pad 5 are metal bonded together.

[0047] Optional operating parameters for semiconductor lasers include: pulse frequency of 30-100Hz and output power of 30-80W.

[0048] Among them, a pulse frequency of 30-100Hz ensures that the energy density of a single pulse is high enough, while avoiding the energy accumulation effect caused by excessively high frequency, and the preferred frequency is 50Hz.

[0049] Furthermore, when the welding laser is focused onto the surface of the blackened layer 5a, the laser energy is rapidly deposited within the nanometer-thickness due to the high absorption rate of the blackened layer 5a (a dense oxide layer with a thickness of 1-5 nm). This causes a sharp rise in local temperature, and the blackened layer 5a undergoes thermal decomposition or thermal stripping in a very short time (milliseconds). Simultaneously, while the laser is heating, the pre-placed low-temperature solder paste melts rapidly (melting point 138°C). The molten low-temperature solder paste has extremely high chemical activity, which can dissolve or replace the oxides in the blackened layer 5a, further promoting their removal, and wetting the metal surface of the exposed pad 5 within the coverage area of ​​the focused laser spot. Then, the molten low-temperature solder paste reacts with the exposed metal of the pad 5 and the core of the coaxial signal line 2 at the interface to form an intermetallic compound.

[0050] It should be noted that this step uses the target temperature of the contact interface between the core of the coaxial signal line 2 and the pad 5 to feed back the target duration of the welding laser acting on the blackened layer 5a, thereby ensuring that the surface temperature of the transparent PE bracket 1 is always below 85℃.

[0051] Specifically, the target temperature range for the contact interface is 120-200℃, and the target duration is ≤5ms.

[0052] Within a 5ms time range, the welding laser breaks through the blackened layer 5a within the coverage area of ​​the focused spot, causing the contact interface between the core of the coaxial signal line 2 and the pad 5 to heat up to 120-200℃, and the surface temperature of the transparent PE bracket 1 is ≤85℃.

[0053] Furthermore, the real-time temperature of the contact interface can be collected by an infrared temperature sensor, and the output power or target duration of the semiconductor laser can be dynamically adjusted based on the difference between the real-time temperature and the target temperature.

[0054] In the specific execution of step S104, thermal management of the contact interface is achieved by controlling the operating parameters of the semiconductor laser. Specifically, based on the melting characteristics of the low-temperature solder paste and the heat resistance limit of the pad 5 and the core of the coaxial signal line 2, the target temperature range of the contact interface is set to 120-200℃. At the same time, the target duration of the welding laser acting on the blackened layer 5a is limited to ≤5ms. Within this 5ms time window, the welding laser, with its instantaneous high energy density, quickly breaks through the blackened layer 5a within the coverage area of ​​the focused spot, and raises the temperature of the contact interface between the core of the coaxial signal line 2 and the pad 5 to 120-200℃. Due to the extremely short action time, the heat does not have time to diffuse to the surroundings, ensuring that the surface temperature of the transparent PE bracket 1 never exceeds 85℃, thereby completely avoiding thermal deformation or melting of the bracket.

[0055] To ensure that the contact interface temperature remains stable within the target range, this embodiment further introduces closed-loop temperature feedback control. The temperature data of the contact interface is collected in real time by an infrared temperature sensor, and the real-time temperature is compared with the preset target temperature. The output power or target duration of the semiconductor laser is dynamically adjusted based on the difference between the two. When the measured temperature is lower than the lower limit of the target temperature, the target duration is appropriately extended (still controlled within 5ms) or the power of subsequent pulses is increased. When the measured temperature is higher than the upper limit of the target temperature, the target duration is shortened or the output power is reduced.

[0056] Through this millisecond-level rapid feedback adjustment, even if there are fluctuations in the thickness of the blackening layer 5a in the incoming batch or differences in the degree of core oxidation, the actual welding temperature of each contact interface can still be stabilized within the process window of 120-200℃. This ensures that the blackening layer 5a is reliably removed, the low-temperature solder paste is fully wetted, and the intermetallic compound is uniformly formed. At the same time, the transparent PE bracket 1 is always kept below the safe temperature. Actual mass production verification shows that by using the above-mentioned process with a target duration of ≤5ms and temperature feedback control, the soldering rate can reach more than 99.5%, the overall defect rate is less than 0.5%, and the transparent PE bracket 1 has no thermal deformation or performance degradation.

[0057] S105 performs multi-angle detection on the solder joint formed between the core of the coaxial signal line 2 and the solder pad 5, and then outputs the completed transparent antenna.

[0058] In this step, after laser welding is completed, the solder joint quality inspection and finished product output stage is entered. That is, the solder joints formed between the core of the coaxial signal line 2 and the solder pad 5 are automatically inspected from multiple angles with high precision to ensure that the electrical performance and mechanical strength of each solder joint meet the design requirements. Qualified products and defective products are automatically separated, and finally, the welded transparent antenna is output.

[0059] The quality of the solder joints formed by the welding method in this embodiment is characterized by the following key parameters: the thickness of the solder joint formed between the core of the coaxial signal line 2 and the solder pad 5 is 0.4-1.3mm. This thickness can ensure sufficient mechanical strength and avoid signal crosstalk or spatial interference caused by excessive solder thickness; the tensile strength is ≥10N, ensuring that it can withstand a certain amount of external force during subsequent assembly or use without detachment; the contact resistance is ≤10mΩ, ensuring low-loss transmission of high-frequency signals and meeting the stringent electrical reliability requirements of transparent antennas in consumer electronics, automotive electronics and other fields.

[0060] In a preferred embodiment, the semiconductor laser has a wavelength of 980nm, a power adjustment range of 30-80W, a laser focusing spot diameter of 0.2mm, a pulse frequency of 30Hz, a single pad soldering time of 3ms, and a preset weight of 0.01-0.05g. Continue to refer to Figure 4This application also discloses an automatic transparent antenna welding system, which can be used in any of the above-described transparent antenna welding methods. The automatic transparent antenna welding system is implemented by a fully automated transparent antenna laser welding device integrated in a frame.

[0061] The automatic welding system for transparent antennas includes a central control module 201, and a feeding and positioning module 202, a soldering module 203, a welding module 204, a detection module 205, and a discharging module 206 that are electrically connected to the central control module 201.

[0062] In the specific implementation process, under the control of the central control module 201, the feeding and positioning module 202 feeds the transparent PE bracket 1 carrying the antenna line 4 to the material positioning seat that matches the contour of the transparent PE bracket 1, and makes the core of the coaxial signal line 2 overlap the pad 5 of the antenna line 4 without gap; the soldering module 203 sets a preset amount of adjustable low temperature solder paste in the soldering area of ​​the pad 5 based on the size of the pad 5, and the low temperature solder paste is connected to the core of the coaxial signal line 2 on the blackening layer 5a; the welding module 204 emits a welding laser through a semiconductor laser and focuses the welding laser to the blackening layer 5a. Based on the working parameters of the semiconductor laser, the welding laser breaks through the blackening layer 5a within the coverage area of ​​the focused spot, so that the core of the coaxial signal line 2 is metal-bonded with the pad 5; the detection module 205 performs multi-angle detection on the solder joint formed between the core of the coaxial signal line 2 and the pad 5; the unloading module 206 outputs the transparent antenna that has been welded.

[0063] In one example, the feeding and positioning module 202 may include a feeding conveyor belt, a material sorting unit, a feeding robot, and a material positioning seat. The feeding conveyor belt is used to batch operate the transparent PE brackets 1 carrying the antenna lines 4. The material sorting unit is used to sort the disordered transparent PE brackets 1 into an ordered state. The feeding robot grabs the transparent PE brackets 1 by vacuum adsorption and transfers them to the material positioning seat.

[0064] In one example, the welding module 204 may include a laser focusing component unit and an infrared temperature sensor for focusing the welding laser emitted by the semiconductor laser onto the blackening layer 5a. The infrared temperature sensor collects the real-time temperature of the contact interface and feeds the real-time temperature signal back to the central control module 201 to achieve closed-loop control of the welding temperature.

[0065] Optionally, the feeding positioning module 202 may also include a vision positioning unit and an XYZ three-axis adjustment platform; the vision positioning unit includes an industrial CCD camera and an image recognition module. The industrial CCD camera is used to collect the position information of the pads 5 on the transparent PE bracket 1 and transmit the position information of the pads 5 to the central control module 201. The image recognition module identifies the position deviation of the pads 5 and feeds back the adjustment signal to the central control module 201. Then, the XYZ three-axis adjustment platform can move the material positioning seat to achieve precise alignment between the pads 5 and the semiconductor laser emitter, wherein the positioning accuracy is ±0.01mm.

[0066] In one example, the detection module 205 may include a detection robot, a high-definition vision detection unit, and a defective product sorting unit. The detection robot moves the high-definition vision detection unit to take multi-angle pictures of the solder joints and collect solder joint image information. The high-definition vision detection unit is electrically connected to the image recognition module to identify whether there are defects such as cold solder joints, false solder joints, cracks, and solder ball overflows in the solder joints, with an identification accuracy of ≥99.8%. The defective product sorting unit automatically sorts the defective products into the defective product storage box according to the detection results.

[0067] In one example, the discharge module 206 may include a discharge conveyor belt and a discharge robot. The discharge robot grabs the qualified transparent antenna finished products and transfers them to the discharge conveyor belt to realize the automated discharge and collection of products. The discharge conveyor belt is equipped with a product counting unit to count the discharge quantity in real time, which is convenient for production control.

[0068] In one example, the central control module 201 may include a PLC controller, a touch operation panel, and a data storage unit. The PLC controller is used to receive feedback signals from each module, output control commands, and coordinate the orderly operation of each mechanism to realize full-process automation of feeding, positioning, welding, inspection, and unloading. The touch operation panel is used for parameter setting (such as output power, focused spot diameter, target duration, low-temperature solder paste preset amount, etc.), operation status monitoring, and fault alarms. The data storage module is used to store welding parameters, inspection results, and other data for easy traceability and data analysis.

[0069] Preferably, the central control module 201 also includes a fault self-diagnosis unit. When faults such as positioning deviation, abnormal temperature, or material jamming occur, the fault self-diagnosis unit automatically stops the system operation and issues an alarm signal. At the same time, it displays the cause of the fault on the touch operation panel for easy troubleshooting.

[0070] In a preferred embodiment of the automatic welding system for transparent antennas, the feeding conveyor belt speed is set to 0.5 m / s, the material sorting unit adopts vibration sorting, the suction force of the feeding robot is adjustable from 0.1 to 0.3 MPa, the industrial CCD camera has a resolution of 12 megapixels, the XYZ three-axis adjustment platform has a stroke of 500 mm × 300 mm × 100 mm and an adjustment accuracy of 0.001 mm, the welding laser wavelength of the semiconductor laser is 980 nm, the diameter of the focused spot is 0.2 mm, the pulse frequency is 30 Hz, the target duration is 3 ms, the low-temperature solder paste pre-filled amount is 0.01-0.05 g, the high-definition vision inspection unit has 10 megapixels, the inspection robot has a stroke of 600 mm × 400 mm × 150 mm, the sorting speed of the defective product sorting unit is synchronized with the welding speed, and the data storage module has a capacity of 16 GB.

[0071] The operation process of the automatic transparent antenna welding system is as follows: First, feeding: The transparent antenna material (the transparent PE bracket 1 carrying the antenna line 4) is placed into the feeding conveyor belt. The material sorting unit sorts the material to a uniform orientation. The feeding robot grabs the material through vacuum adsorption and transfers it to the material positioning seat to complete the initial positioning. Then, positioning: The industrial CCD camera collects the position information of the solder pad 5, the image recognition module identifies the deviation and provides feedback, and the XYZ three-axis adjustment platform drives the fixture assembly to move, achieving precise alignment between the solder pad 5 and the semiconductor laser emitter. Next, welding: The soldering module 203 sets a preset amount of adjustable low-temperature solder paste in the welding area of ​​the solder pad 5 based on the size of the solder pad 5. The semiconductor laser emits welding laser. The laser is focused onto the blackened layer 5a, instantly breaking it off. An infrared temperature sensor collects the real-time temperature of the contact interface and feeds the signal back to the central control module 201. The central control module 201 adjusts the laser parameters, resulting in a contact interface temperature of 165°C and a surface temperature of 78°C for the transparent PE support 1, completing the welding process. Afterwards, a robotic arm moves a high-definition vision inspection unit to capture images of the weld points from multiple angles, identifying whether they are qualified. Defective products are sorted into a storage box, while qualified products enter the unloading stage. Finally, a robotic arm picks up qualified products and transfers them to the unloading conveyor belt. A product counting unit counts the number of products unloaded, completing the fully automated welding process.

[0072] The test results showed that the fully automated welding production efficiency reached 15 pieces / minute, with a single product taking 10 seconds; in terms of welding quality, the tinning rate was 100%, the tensile strength of the solder joint was 11.2N, and the contact resistance was 5mΩ; the substrate condition was that the transparent PE bracket 1 was free from deformation and melting, the substrate damage rate was 0%, and the overall defect rate was only 0.2%.

[0073] In a preferred embodiment of the automatic welding system for transparent antennas, based on the aforementioned system operation process steps, the welding laser wavelength of the semiconductor laser is adjusted to 915nm, the output power to 40W, the diameter of the focused spot to 0.3mm, the pulse frequency to 50Hz, and the target duration to 4ms. This results in a contact interface temperature of 150℃, a surface temperature of 75℃ for the transparent PE support 1, a tinning rate of 99.8%, a solder joint tensile strength of 10.5N, and a contact resistance of 6mΩ. The substrate condition is that the transparent PE support 1 is free from deformation and melting, the substrate damage rate is 0.2%, and the overall defect rate is only 0.4%.

[0074] In another preferred embodiment of the automatic welding system for transparent antennas, based on the aforementioned system operation process steps, the welding laser wavelength of the semiconductor laser is adjusted to 808nm, the output power to 60W, the diameter of the focused spot to 0.5mm, the pulse frequency to 80Hz, and the target duration to 5ms. This results in a contact interface temperature of 180℃, a surface temperature of 82℃ for the transparent PE support 1, a tinning rate of 99.6%, a solder joint tensile strength of 10.8N, and a contact resistance of 7mΩ. The substrate condition is that the transparent PE support 1 is free from deformation and melting, the substrate damage rate is 0.3%, and the overall defect rate is only 0.5%.

[0075] The present application has been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only for the purpose of helping to understand the core ideas of the present application. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of the present application. Therefore, the content of this specification should not be construed as a limitation of the present application.

Claims

1. A method for welding a transparent antenna, characterized in that, include: The transparent PE bracket carrying the antenna line is fed into a material positioning seat that matches the outline of the transparent PE bracket, and the core of the coaxial signal line is seamlessly attached to the pad of the antenna line, wherein the surface of the pad has a blackening layer. Based on the size of the pad, a preset amount of low-temperature solder paste is applied to the soldering area of ​​the pad, and the low-temperature solder paste is connected to the core of the coaxial signal line on the blackening layer. A welding laser is emitted by a semiconductor laser and focused onto the blackening layer, wherein the focused spot of the welding laser covers the welding area of ​​the pad and part of the core of the coaxial signal line; Based on the operating parameters of the semiconductor laser, the welding laser breaks through the blackening layer within the coverage area of ​​the focused spot, so that the core of the coaxial signal line is bonded to the metal of the pad. The target duration of the welding laser acting on the blackening layer is fed back according to the target temperature of the contact interface between the core of the coaxial signal line and the pad. After performing multi-angle detection on the solder joints formed between the core of the coaxial signal line and the solder pad, the completed soldering transparent antenna is output.

2. The transparent antenna welding method as described in claim 1, characterized in that, The target temperature range of the contact interface is 120-200℃, and the target duration is ≤5ms; and within the 5ms time range, the welding laser breaks through the blackening layer within the coverage area of ​​the focused spot, so that the contact interface between the core of the coaxial signal line and the pad is heated to 120-200℃, and the surface temperature of the transparent PE bracket is ≤85℃.

3. The transparent antenna welding method as described in claim 1, characterized in that, The operating parameters of the semiconductor laser include: pulse frequency of 30-100Hz and output power of 30-80W.

4. The transparent antenna welding method as described in claim 1, characterized in that, The wavelength range of the welding laser is 808-980nm, and the diameter range of the focused spot is 0.1-1.0mm.

5. The transparent antenna welding method as described in claim 1, characterized in that, The size of the pads ranges from 0.5mm×0.5mm to 1.0mm×2.0mm, and the thickness of the blackening layer ranges from 1-5nm.

6. The transparent antenna welding method as described in claim 1, characterized in that, The thickness of the solder joint formed between the core of the coaxial signal line and the solder pad is 0.4-1.3mm, the tensile strength is ≥10N, and the contact resistance is ≤10mΩ.

7. The transparent antenna welding method as described in claim 1, characterized in that, The transparent PE bracket has a PET film layer, which is attached to the transparent PE bracket, and the antenna circuit is fabricated on the PET film layer, with the solder pads provided on the antenna circuit.

8. The transparent antenna welding method as described in claim 7, characterized in that, The thickness of the transparent PE support is 0.2-5.0 mm, the thickness of the PET film layer is 0.1-0.3 mm, and the light transmittance of the PET film layer is ≥90%.

9. The transparent antenna welding method as described in claim 2, characterized in that, The real-time temperature of the contact interface is collected by an infrared temperature sensor, and the output power of the semiconductor laser or the target duration is dynamically adjusted based on the difference between the real-time temperature and the target temperature.

10. An automated transparent antenna welding system, used in the transparent antenna welding method as described in any one of claims 1 to 9, characterized in that, include: The central control module, and the feeding and positioning module, soldering module, welding module, detection module, and discharging module electrically connected to the central control module, are all under the control of the central control module: The feeding and positioning module feeds the transparent PE bracket carrying the antenna line into the material positioning seat that matches the outline of the transparent PE bracket, and makes the core of the coaxial signal line overlap the pad of the antenna line without gap. The soldering module applies a preset amount of adjustable low-temperature solder paste to the soldering area of ​​the pad based on the size of the pad, and the low-temperature solder paste is connected to the core of the coaxial signal line on the blackening layer. The welding module emits a welding laser through a semiconductor laser and focuses the welding laser onto the blackened layer. Based on the operating parameters of the semiconductor laser, the welding laser breaks through the blackened layer within the coverage area of ​​the focused spot, so that the core of the coaxial signal line is bonded to the metal of the pad. The detection module performs multi-angle detection on the solder joints formed between the core of the coaxial signal line and the solder pad. The output module outputs a transparent antenna that has been welded.

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