control device

Abstract

The drawing device (1) of the present application controls the focusing height of light emitted from a drawing section (41) based on information from a height measuring section (71) that measures the height of a main surface, i.e., an upper surface (91), of a substrate (9), and moves the substrate (9) to draw a pattern on the upper surface (91). The drawing section (41) and the height measuring section (71) are arranged separately in the moving direction of a holding section (21). A correction reference section of a reference unit (5) includes a reflection region that reflects light emitted from the height measuring section (71), and an edge that changes the reflection state of the light. A distance correction section of a calculation section acquires the distance between the drawing section (41) and the height measuring section (71) based on the edge detection position of the correction reference section of the height measuring section (71) whose output changes due to the edge, and the drawing correction position of the correction reference section at which light emitted from the drawing section (41) is irradiated to a prescribed position of the correction reference section.

Description

[0001] Related applications

[0002] This application claims the benefit of priority to Japanese Patent Application JP2025-8202, filed on January 21, 2025, the entire disclosure of which is incorporated herein by reference. Technical Field

[0003] This invention relates to a technique of emitting modulated light onto a substrate to draw patterns on the substrate. Background Technology

[0004] Conventionally, in drawing patterns on printed circuit boards, semiconductor substrates, etc. (hereinafter referred to as "substrate"), drawing devices are used to directly draw patterns by irradiating the substrate with modulated light and scanning the irradiated area of ​​the light. In the drawing device, minute height variations on the substrate surface are measured, and the focusing height of the drawing head is adjusted based on the measurement results.

[0005] To achieve high-precision and high-resolution drawing, it is also necessary to accurately measure the height of the substrate surface and control the focusing height of the drawing light. In feedback control, where the focusing height of the drawing light is adjusted simultaneously with the substrate surface height, a delay in focusing height control can lead to focus shift. Therefore, a method called feedforward control is proposed, where the substrate surface height is measured before drawing, and the height information is read out during drawing for focusing control.

[0006] For example, in the exposure apparatus disclosed in Japanese Patent Application Publication No. 2005-266779 (Document 1) as a drawing device, a displacement sensor is used to measure the focus as the photosensitive material passes below the detection unit. Then, based on the focus measurement data, focus control is performed to align the focal point of the light beam illuminating from the exposure head with the observed surface of the photosensitive material.

[0007] However, in order to perform high-precision drawing, it is necessary to make the projection lens used for drawing close to the substrate surface. Therefore, as with the drawing device in Document 1, it is preferable to separate the position of the height measuring part (displacement sensor) for measuring the height of the substrate surface and the drawing part (exposure head) for performing drawing in the drawing direction.

[0008] On the other hand, when the height measuring unit and the drawing unit are configured separately, the positional relationship of these components may slightly change due to assembly and installation errors, changes in the assembly state over time, and changes caused by heat. If the positional relationship changes, the relationship between the height obtained by the height measuring unit and the coordinates on the substrate will deviate, or there will be a deviation between the obtained height and the height of the desired drawing position, resulting in the inability to perform correct automatic focusing control. Therefore, it is necessary for a professional operator to periodically and accurately measure the positional relationship between the drawing unit and the height measuring unit and reflect the measurement results in the drawing control. Thus, maintaining drawing accuracy requires time-consuming and costly operations. Summary of the Invention

[0009] The purpose of this invention is to easily maintain drawing accuracy.

[0010] One aspect of the present invention is a drawing apparatus for drawing a pattern on a substrate, wherein the drawing apparatus comprises: a holding part for holding the substrate; a drawing part for emitting modulated light for drawing onto a main surface of the substrate held by the holding part; a moving mechanism for moving the holding part relative to the drawing part in a moving direction parallel to the main surface of the substrate held by the holding part; a height measuring part disposed at a position separate from the drawing part in the moving direction, irradiating light onto the main surface of the substrate and receiving reflected light from the main surface to measure the height of the main surface; a position acquisition part for acquiring the position of the holding part relative to the drawing part in the moving direction; and a control part for controlling the emission of light from the drawing part and the focusing height of the light based on information from the height measuring part and the position acquisition part, and for moving the holding part in the moving direction. The device is moved to draw a pattern on the main surface of the substrate; a correction reference portion is fixed in position relative to the holding portion in the moving direction, and includes a reflective area that reflects light emitted from the height measuring portion, and the edge of the reflective area whose reflection state changes as the holding portion moves in the moving direction; an observation portion observes the light emitted from the drawing portion toward the correction reference portion; and a distance correction portion obtains the distance between the drawing portion and the height measuring portion in the moving direction based on the edge detection position of the correction reference portion in the moving direction, which changes due to the edge of the correction reference portion, as determined by the output of the height measuring portion, and the drawing correction position of the correction reference portion in the moving direction when the light from the drawing portion illuminates a predetermined position of the correction reference portion, as observed by the observation portion.

[0011] In this invention, it is easy to maintain the accuracy of the drawing.

[0012] In the second embodiment of the present invention, based on the drawing device of the first embodiment, the reflective area of ​​the correction reference part is a strip-shaped area perpendicular to the moving direction, and the edge of the correction reference part is a straight edge of the reflective area perpendicular to the moving direction.

[0013] A third embodiment of the present invention is a drawing apparatus for drawing a pattern on a substrate. The drawing apparatus includes: a holding section for holding the substrate; a drawing section for emitting modulated light for drawing onto a main surface of the substrate held by the holding section; a moving mechanism for moving the holding section relative to the drawing section in a moving direction parallel to the main surface of the substrate held by the holding section; a height measuring section disposed at a position separate from the drawing section in the moving direction, irradiating light onto the main surface of the substrate and receiving reflected light from the main surface to measure the height of the main surface; a position acquisition section for acquiring the position of the holding section relative to the drawing section in the moving direction; and a control section for controlling the emission of light from the drawing section and the focusing height of the light based on information from the height measuring section and the position acquisition section. The mechanism moves the holding part in the moving direction to draw a pattern on the main surface of the substrate; a correction reference part is fixed relative to the holding part in the moving direction and includes a reflection area that reflects light emitted from the height measuring part; an observation part observes the focusing state of light emitted from the drawing part to the correction reference part; and a focus correction part moves the correction reference part to the measuring position of the height measuring part by the moving mechanism, obtains the height of the reflection area of ​​the correction reference part, i.e., the measuring height, moves the correction reference part to the drawing position of the drawing part, observes the focusing state by the observation part, and aligns the focusing height of the light from the drawing part with the height of the correction reference part by the focusing mechanism of the drawing part, and associates the measuring height with the state of the focusing mechanism.

[0014] In the fourth embodiment of the present invention, based on the drawing apparatus of any one of embodiments one to three, the position of the holding part when the holding part holds the substrate is such that the reflective area of ​​the correction reference part is located at the measurement position of the height measuring part.

[0015] In the fifth embodiment of the present invention, based on any one of embodiments one to three (or any one of embodiments one to four) of the drawing apparatus, the correction reference unit includes a reference pattern, and when the position of the drawing unit in a direction perpendicular to the moving direction is obtained, the reference pattern and the projection pattern of light emitted from the drawing unit are observed by the observation unit together.

[0016] The sixth embodiment of the present invention, based on any one of embodiments one to three (or any one of embodiments one to five) of the drawing device, includes: a base; a head support fixed to the base and on which the drawing unit is mounted; and a sensor support separated from the head support in the moving direction and fixed to the base, on which the height measuring unit is mounted.

[0017] The above-mentioned objects and other objects, features, forms and advantages will be explained by the following detailed description of the invention with reference to the accompanying drawings. Attached Figure Description

[0018] Figure 1 It is a three-dimensional diagram representing a drawing device.

[0019] Figure 2 This is a side view showing the area near the first head support and the second head support.

[0020] Figure 3 This is a top view showing the first head support and the area near the second head support.

[0021] Figure 4 This is a side view schematically showing the structure of the height measuring unit.

[0022] Figure 5 This is a side view showing the internal structure of the reference element.

[0023] Figure 6 It is a top view of the light-blocking pattern.

[0024] Figure 7 It is a block diagram representing the components of the action that corrects the positional relationship between the drawing part and the height measuring part.

[0025] Figure 8 This is a diagram illustrating an example of the process of a correction action.

[0026] Figure 9 This is a diagram used to illustrate the correction action.

[0027] Figure 10 These are diagrams illustrating other examples of the process of corrective actions.

[0028] Figure 11 This is a diagram used to illustrate the correction action.

[0029] Figure 12 This is a side view showing other configuration examples of the sensor array.

[0030] The following explains the reference numerals in the accompanying drawings.

[0031] 1. Drawing device

[0032] 8. Control Department

[0033] 9 substrate

[0034] 21. Maintenance Section

[0035] 22. Mobile mechanism

[0036] 23 First Moving Mechanism

[0037] 26 Location Acquisition Department

[0038] 41 Drawing Department

[0039] 51 Calibration reference section

[0040] 52 Observation Department

[0041] 61 First support section

[0042] 62 Second head support section

[0043] 63 Sensor support section

[0044] 66 abutment

[0045] 71 Height Measurement Unit

[0046] 91 Top surface (main surface of the substrate)

[0047] 511 Road Markings (Base Pattern)

[0048] 512 Reflection Area

[0049] 513 Edge

[0050] 811 Distance Correction Unit

[0051] 812 Focal Length Correction Unit Detailed Implementation

[0052] Figure 1 This is a perspective view of a drawing apparatus 1 illustrating one embodiment of the present invention. The drawing apparatus 1 is a direct drawing apparatus that illuminates a substrate 9 with spatially modulated, generally beam-shaped light, and draws a pattern on the substrate 9 by scanning the irradiated area of ​​the light on the substrate 9. The upper surface 91 of the substrate 9 is the main surface of the substrate 9, which is the surface of the photosensitive material layer. "Main surface" refers to the larger principal surface among the surfaces constituting the surface of the substrate 9; when the substrate 9 is plate-shaped, the larger surface (excluding the end faces) is the main surface. Figure 1 In the diagram, arrows represent three mutually orthogonal directions as the X, Y, and Z directions. Figure 1 In the example shown, the X and Y directions are horizontal directions that are perpendicular to each other, and the Z direction is vertical (i.e., up and down). The same applies to other figures.

[0053] The substrate 9 is, for example, a generally rectangular flat printed circuit board. The substrate of the substrate 9 is, for example, a generally rectangular flat component formed of a composite material containing glass and resin. Sometimes, circuit patterns are formed on the substrate. The substrate 9 has a photosensitive material layer as the top layer. The type and shape of the substrate 9 can be varied.

[0054] The drawing device 1 includes a staged holding part 21, a moving mechanism 22 for moving the holding part 21, an alignment part 3, a head array 4, a reference unit 5, a sensor array 7, and a control unit 8. The control unit 8 controls the moving mechanism 22, the alignment part 3, the head array 4, and the sensor array 7. The drawing device 1 also includes a first head support part 61, a second head support part 62, and a base 66.

[0055] The holding part 21 is a generally rectangular plate-shaped member disposed below the alignment part 3, the head array 4, and the sensor array 7 (i.e., the (-Z) side). The holding part 21 holds the substrate 9 in a horizontal state from below. The holding part 21 may, for example, have a vacuum chuck that adsorbs and holds the lower surface of the substrate 9. The holding part 21 may also have a structure other than a vacuum chuck, for example, it may be a mechanical chuck. The upper surface 91 of the substrate 9 placed on the holding part 21 is perpendicular to the Z direction and parallel to the X and Y directions.

[0056] The moving mechanism 22 moves the holding part 21 relative to the alignment part 3, the head array 4, and the sensor array 7 in a horizontal direction (i.e., in a direction parallel to the upper surface 91 of the substrate 9). The moving mechanism 22 is mounted on the upper surface of the base 66 and is supported from below by the base 66.

[0057] The moving mechanism 22 has a first moving mechanism 23 and a second moving mechanism 24. The second moving mechanism 24 supports the holding part 21 from below, causing the holding part 21 to move linearly along the guide rail in the X direction. The first moving mechanism 23 supports the second moving mechanism 24 from below, causing the holding part 21 and the second moving mechanism 24 to move linearly together along the guide rail in the Y direction. The drive source for the first moving mechanism 23 and the second moving mechanism 24 is, for example, a linear servo motor or a drive source with a motor mounted on a ball screw. The structure of the first moving mechanism 23 and the second moving mechanism 24 can be modified in various ways.

[0058] Although the illustration is omitted, a lifting mechanism for moving the holding part 21 in the Z direction is provided below the holding part 21, that is, between the holding part 21 and the second moving mechanism 24. In the drawing device 1, a rotating mechanism for rotating the holding part 21 about a rotation axis in the Z direction may also be provided.

[0059] The drawing device 1 also includes a position acquisition unit 26. The position acquisition unit 26 is a so-called linear encoder, having a scale 261 extending in the Y direction mounted on the base 66 and an encoder 262 mounted on the lower surface of the Y-axis worktable 231, which is moved by the first moving mechanism 23. The aforementioned second moving mechanism 24 is mounted on the Y-axis worktable 231. By receiving reflected light from the scale 261, the encoder 262 obtains the correct position of the Y-axis worktable 231 relative to the base 66 in the Y direction through the receipt of reflected light emitted towards the scale 261.

[0060] The correct position of the Y-axis stage 231 relative to the base 66 is also the position of the holding part 21 relative to the drawing part 41, which is fixed on the base 66, in the Y direction. That is, the position acquisition unit 26 acquires the position of the holding part 21 relative to the drawing part 41 in the moving direction of the holding part 21 during drawing. In the description of this embodiment, "Y direction" (either the +Y direction or the -Y direction) means "the moving direction of the holding part 21 during drawing". When only "moving direction" is indicated, this moving direction refers to "Y direction".

[0061] A linear encoder (not shown) is also provided between the Y-axis worktable 231 and the holding part 21. The correct position of the holding part 21 in the X direction relative to the Y-axis worktable 231 is obtained by the linear encoder, that is, the correct position of the holding part 21 in the X direction relative to the base 66.

[0062] The first head support 61 and the second head support 62 are erected on the upper surface of the base 66. Figure 1 In the example shown, the first head support 61 and the second head support 62 are respectively portal members (so-called gantry) spanning the retaining part 21 and the moving mechanism 22. The first head support 61 and the second head support 62 have approximately the same shape and are arranged along the Y direction. The second head support 62 is disposed on the (+Y) side of the first head support 61. In this embodiment, the first head support 61 is fixed to the base 66. In addition, the second head support 62 is also fixed to the base 66.

[0063] Figure 2 This is a side view showing the area near the first head support 61 and the second head support 62. Figure 3 This is a top view showing the area near the first head support 61 and the second head support 62.

[0064] like Figures 1 to 3 As shown, the alignment part 3 has a plurality of (in) arranged along the X direction. Figure 1In the example shown, there are three camera units 31. Each camera unit 31, for example, is a digital camera that uses a CCD (Charged Coupled Device) or CMOS (Complementary Metal Oxide Semiconductor) as its imaging element. Each camera unit 31 is supported by a first head support 61 above the holding unit 21 and the moving mechanism 22. Figure 1 In the example shown, three camera units 31 are mounted on the side of the first head support unit 61 on the (-Y) side.

[0065] Of the three camera units 31, for example, the central camera unit 31 is fixed to the first head support 61, while the other two camera units 31 can move along the X direction on the first head support 61. This allows the distance between the camera units 31 in the X direction to be changed.

[0066] Each camera unit 31 captures images of alignment marks (not shown) pre-set on the upper surface 91 of the substrate 9. In the drawing device 1, the position of the substrate 9 on the holding unit 21 is detected based on the images acquired by the camera units 31 (i.e., the images of the alignment marks). Then, the substrate 9 is aligned according to the detected position of the substrate 9, that is, the relative position of the substrate 9 with respect to the head array 4 is corrected.

[0067] The head array 4 includes a first array 401 supported by a first head support 61 and a second array 402 supported by a second head support 62. The first array 401 and the second array 402 each include a plurality of drawing sections 41. Each drawing section 41 is a so-called drawing head that emits modulated light for drawing onto the upper surface 91 of the substrate 9 held in the holding section 21.

[0068] exist Figure 1 In the example shown, the first array 401 has four drawing portions 41 arranged in a roughly straight line, approximately parallel to the X direction. The second array 402 also has four drawing portions 41 arranged in a roughly straight line, approximately parallel to the X direction. The four drawing portions 41 of the first array 401 and the four drawing portions 41 of the second array 402 have approximately the same shape and approximately the same structure.

[0069] The four drawing sections 41 of the first array 401 are mounted on the side of the first head support 61 on the (+Y) side, and are supported by the first head support 61 above the holding section 21 and the moving mechanism 22. Similarly, the four drawing sections 41 of the second array 402 are mounted on the side of the second head support 62 on the (-Y) side, and are supported by the second head support 62 above the holding section 21 and the moving mechanism 22. The second array 402 is adjacent to the first array 401 in the Y direction on the (+Y) side of the first array 401 (i.e., configured in a near or contacting state), and faces the first array 401 in the Y direction.

[0070] The four drawing portions 41 of the first array 401 are arranged at equal intervals in the X direction. The four drawing portions 41 of the second array 402 are also arranged at equal intervals in the X direction. The four drawing portions 41 of the second array 402 are positioned differently in the X direction from the four drawing portions 41 of the first array 401. In other words, the eight drawing portions 41 of the head array 4 are arranged in a sawtooth pattern. As a result, the second array 402 illuminates modulated light at a different position in the X direction on the upper surface 91 of the substrate 9 than the first array 401.

[0071] Furthermore, the number and arrangement of the drawing units 41 included in the first array 401, and the number and arrangement of the drawing units 41 included in the second array 402, can be varied. Additionally, in the head array 4, for example, a plurality of drawing units 41 may be arranged in a straight line along the X direction and supported by a single support. Alternatively, the number of drawing units 41 provided on the head array 4 may be only one. That is, the drawing device 1 has more than one drawing unit 41.

[0072] Each drawing unit 41 includes a light source unit, an illumination optical system, a light modulation unit, and a projection optical system. For example... Figure 2 As shown, the projection optical system 411 includes a focusing mechanism 412. The focusing mechanism 412 can be considered as an optical mechanism different from the projection optical system 411. The light source unit, illumination optical system, light modulation unit, and projection optical system 411 are housed inside the cover 413. In the drawing unit 41, the light source serving as the light source unit can be, for example, an LED (Light Emitting Diode) or an LD (Laser Diode). The light source can also be a light source other than LEDs and LDs.

[0073] Light emitted from the light source is guided to the light modulation unit via an illumination optical system. The light modulator includes, for example, a DMD (Digital Micro Mirror Device) or a GLV (Grating Light Valve) (a registered trademark of Silicon Light Machines, Sunnyvale, California, USA). This light modulator modulates (i.e., spatially modulates) the light emitted from the light source. The light emitted from the light modulation unit is then projected onto the upper surface 91 of the substrate 9 located below the drawing unit 41 via a projection optical system 411.

[0074] The focusing mechanism 412 is disposed, for example, at the lower part of the projection optical system 411. The configuration of the focusing mechanism 412 can be modified in various ways; for example, the focusing mechanism 412 can be mounted on the side of the first head support 61 and the second head support 62.

[0075] The focusing mechanism 412 is a mechanism that moves the position of the focusing lens along the optical axis. The focusing lens is moved, for example, by a linear servo motor or a mechanism with a motor mounted on a ball screw. The focusing mechanism 412 moves the focusing lens vertically to align the focusing position (focusing position) of the light emitted from the drawing unit 41 with the upper surface 91 of the substrate 9. That is, the focusing mechanism 412 makes the height of the focusing position (hereinafter also referred to as "focusing height") the same as the height of the upper surface 91. The focusing height is the position in the height direction of the image formed by the light modulator. The focusing lens can be one optical element or two or more optical elements. In addition, when the substrate 9 is arranged in an upright or tilted position and the Z direction is not aligned with the direction of gravity, the height direction corresponding to the focusing height is also not aligned with the direction of gravity.

[0076] like Figures 1 to 3 As shown, the sensor array 7 has a plurality of height measuring units 71, which are arranged in a generally straight line, approximately parallel to the X direction, on the (-Y) side of the three imaging units 31 of the alignment unit 3. Among the plurality of height measuring units 71, starting from the end, every two units correspond to a drawing unit 41. Figure 3 In the example shown, the sensor array 7 has sixteen height measuring units 71 corresponding to eight drawing units 41. In the sensor array 7, a pair of height measuring units 71 corresponding to each drawing unit 41 of the first array 401 and a pair of height measuring units 71 corresponding to each drawing unit 41 of the second array 402 are arranged alternately in the X direction. In the sensor array 7, the plurality of height measuring units 71 are arranged at a pitch of the stepping amount, i.e., the "step length", of the holding unit 21 in the X direction, as described later.

[0077] A plurality of height measuring units 71 are supported by unit support units 73 that protrude in the (-Y) direction from the side of the first head support unit 61 on the (-Y) side. The unit support unit 73 is a generally strip-shaped member that extends approximately parallel to the X direction on the (-Y) side, closer to the first head support unit 61. The plurality of height measuring units 71 are positioned approximately the same in the Y and Z directions. Each height measuring unit 71 is positioned separately from the corresponding drawing unit 41 in the Y direction, which is the direction of movement during drawing. Here, "separation" of the drawing unit 41 and the height measuring unit 71 means that the drawing position of the drawing unit 41 and the measuring position of the height measuring unit 71 are not consistent in the Y direction, which means that the measurement results of the height measuring unit 71 are temporarily stored and read out during drawing for the focusing action of the drawing unit 41.

[0078] Figure 4 This is a schematic side view showing the structure of one height measuring unit 71. The structures of other height measuring units 71 are similar. Figure 4 The structures shown are roughly the same. Figure 4 The longitudinal section of the substrate 9 is also shown in the diagram. The height measuring unit 71 is a mechanism that detects the height of the upper surface 91 of the substrate 9 in the predetermined area to be drawn by the corresponding drawing unit 41, i.e., its position in the vertical direction, before actual drawing. The height measuring unit 71 emits light (hereinafter referred to as "detection light") toward the substrate 9, forms a light spot on the substrate 9, and obtains the light intensity distribution of the reflected light from the light spot.

[0079] The height measuring unit 71 includes an illumination unit 74 that emits detection light to the upper surface 91 of the substrate 9, and a light-receiving unit 75 that receives reflected light from the substrate 9. The illumination unit 74 and the light-receiving unit 75 are, for example, arranged facing each other in the Y direction. Figure 4 In the example shown, the light-receiving part 75 is located on the (-Y) side of the illumination part 74. Furthermore, the configuration of the illumination part 74 and the light-receiving part 75 can be varied. For example, the light-receiving part 75 can also be located on the (+Y) side of the illumination part 74.

[0080] The illumination unit 74 includes a light source 741 and an illumination optical system 742. The illumination optical system 742 includes, for example, a plurality of optical elements such as lenses. Figure 4 In the diagram, a plurality of optical elements of the illumination optical system 742 are indicated by dashed lines. The light source 741 emits detection light. The detection light has a different wavelength than the light emitted from the drawing section 41 (i.e., the drawing light), so that the photosensitive material present on the surface of the substrate 9 is not photosensitive. The illumination optical system 742 converges the detection light emitted from the light source 741 and guides it towards the upper surface 91 of the substrate 9, forming a light spot on the upper surface 91. This light spot is, for example, a generally elongated oval shape that is longer in the X direction.

[0081] The light-receiving unit 75 includes a detection optical system 751 and a detection unit 752. The detection optical system 751 includes, for example, a plurality of optical elements such as lenses. Figure 4 In the diagram, a plurality of optical elements of the detection optical system 751 are indicated by dashed lines. The detection optical system 751 guides the detection light reflected by the substrate 9 to the detection unit 752. The detection unit 752 receives the reflected light guided by the detection optical system 751 through the detection surface 753 and obtains the light quantity distribution of the reflected light on the detection surface 753. The detection unit 752 is, for example, a line sensor in which a plurality of light-receiving elements (i.e., pixels) such as CMOS or CCD are arranged in a generally linear shape.

[0082] exist Figure 4 In this system, if the arrangement direction of the plurality of pixels of the detection unit 752 is set as the u-axis, and the direction perpendicular to the u-axis and parallel to the upper surface 91 is set as the v-axis, then the v-direction is consistent with the X-direction mentioned above, and the u-direction corresponds to the Y-direction in the top view. In the height measuring unit 71, an image of the spot of the detection light on the substrate 9 is formed on the detection surface 753. Furthermore, by measuring the centroid position of the detection image in the u-direction, the position of the spot of the detection light on the upper surface 91 in the Z-direction, i.e., the height, is detected. As described above, the height measuring unit 71 measures the height of the upper surface 91 by irradiating light onto the upper surface 91, which is the main surface of the substrate 9, and receiving the reflected light from the upper surface 91.

[0083] exist Figure 1 In the drawing apparatus 1 shown, the pattern on the substrate 9 is drawn in a so-called multipath manner. Specifically, modulated light is irradiated onto the upper surface 91 of the substrate 9 from a plurality of drawing units 41, and the substrate 9 is moved in the (+Y) direction by the first moving mechanism 23 of the moving mechanism 22 and passes under the head array 4. As a result, the irradiated area of ​​the light from the plurality of drawing units 41 scans the substrate 9 along the Y direction, and the substrate 9 is drawn. During drawing, information on the position and deformation of the substrate 9 obtained in advance by the alignment unit 3 is used.

[0084] When the substrate 9 is moved in the (+Y) direction and drawing is performed, the height of the upper surface 91 is repeatedly measured by eight height measuring units 71 (hereinafter referred to as "first height measuring units 71") located exactly on the (-Y) side of the drawing position of the eight drawing units 41. In fact, the height of the upper surface 91 is repeatedly measured by all sixteen drawing units 41. Hereinafter, the height measuring units 71 that are not part of the first height measuring units 71 will be referred to as "second height measuring units 71".

[0085] The height information of the upper surface 91 is stored together with the position information obtained from the position acquisition unit 26 when the information is acquired. By referring to the position information, when a position on the upper surface 91, whose height has been measured by each of the first height measurement units 71, reaches the drawing position of the drawing unit 41, the focusing mechanism 412 of the drawing unit 41 is controlled based on the measurement result. For example, the height information of the upper surface 91 is converted into the position information of the focusing lens and controlled to be at the desired position of the focusing lens on the optical axis. As a result, the focusing height is accurately aligned with the height of the upper surface 91.

[0086] Thus, by controlling the control unit 8, based on the information from the height measuring unit 71 and the position acquisition unit 26, the emission of light from the drawing unit 41 and the focusing height of the light are controlled, and the holding unit 21 is moved in the (+Y) direction as the moving direction, thereby drawing a pattern on the upper surface 91 of the substrate 9.

[0087] Next, the second moving mechanism 24 moves the substrate 9 a predetermined distance in the X direction (e.g., towards the (-X) side). In the following description, this predetermined distance will also be referred to as the "step length". As a result, the position on the substrate 9, whose height has been measured by the eight second height measuring units 71, is located at the drawing position of the eight drawing units 41 in the X direction.

[0088] Then, the substrate 9 is moved in the (-Y) direction by the first moving mechanism 23, and light is irradiated onto the substrate 9 from the drawing unit 41, which moves in parallel with this movement, to draw a pattern on the substrate 9. At this time, using the measurement results of the second height measuring unit 71 stored together with the position information, focus control is performed when the position where the measurement results are obtained passes directly below the drawing unit 41. As a result, the focused height is accurately aligned with the height of the upper surface 91. As described above, even when the holding unit 21 moves in the (-Y) direction, which is the moving direction, the control unit 8 can control the emission of light from the drawing unit 41 and the focused height of the light based on the information from the height measuring unit 71 and the position acquisition unit 26, and move the holding unit 21 to draw a pattern on the upper surface 91 of the substrate 9.

[0089] exist Figure 1In the drawing apparatus 1 shown, drawing is performed on the necessary area of ​​the substrate 9 by moving the substrate 9 back and forth once in the Y direction. Of course, the operation of the drawing apparatus 1 is not limited to the above description; the substrate 9 can also be patterned by alternating light irradiation towards the substrate 9 moving in the Y direction and stepping movement of the substrate 9 in the X direction as needed. In this case, the number and arrangement of the height measuring units 71 can be designed to correspond to the operation. In the drawing apparatus 1, the substrate 9 can also be patterned in a single-path method (also called a "one-path method") by moving the substrate 9 only once relative to the head array 4 in the Y direction.

[0090] like Figure 1 and Figure 2 As shown, a reference unit 5 is arranged on the (+Y) side of the holding part 21. The reference unit 5 is fixed on the Y-axis worktable 231 of the first moving mechanism 23 and is longer in the X direction. Figure 5 This is a side view showing the internal structure of the reference unit 5. The reference unit 5 includes a calibration reference section 51, an observation section 52, a moving mechanism 53 for moving the observation section 52, and a cover 54.

[0091] The calibration reference section 51 is a portion on a transparent component 50, such as glass, where a light-shielding pattern 510 is formed using a metal such as chromium. Since the reference unit 5 is fixed to the Y-axis stage 231, the calibration reference section 51 is fixed in position relative to the holding section 21 in the direction of movement (Y direction) of the holding section 21 during drawing. The observation section 52 is positioned below the calibration reference section 51. The observation section 52 is a camera containing a two-dimensional imaging element, ensuring that the imaging position in the vertical direction, i.e., the focusing position in the height direction, is correctly aligned with the light-shielding pattern 510 of the calibration reference section 51. The observation section 52 is a microscope for high-precision observation. The optical axis of the observation section 52 is bent from the Z direction to the X direction, effectively utilizing space by orienting the microscope tube towards the X direction. The moving mechanism 53 moves the observation section 52 in the X direction. The drive source of the moving mechanism 53 is a linear servo motor or a drive source with a motor mounted on a ball screw. The cover 54 houses the observation section 52 and the moving mechanism 53 internally.

[0092] Figure 6 This is a top view of the light-shielding pattern 510 of the calibration reference section 51. (Example) Figure 5 and Figure 6As shown, the light-shielding pattern 510 has a marking line 511 and a reflective area 512. The marking line 511 is provided with graduations that are longer in the X direction and shorter in the Y direction at regular intervals in the X direction. In fact, the intervals of the graduations are extremely small. The line extending in the X direction of the marking line 511 is sufficiently thin. The reflective area 512 is also a region that is longer in the X direction and has a fixed width in the Y direction. The reflective area 512 is the region that reflects the detection light emitted from the height measuring unit 71. As will be described later, the calibration reference unit 51 can be moved downwards from the height measuring unit 71, and the reflective area 512 is sufficiently large relative to the illumination range of the detection light from the height measuring unit 71, and is a so-called "beta area". Outside the reflective area 512, the detection light passes through the transparent member 50 without being reflected.

[0093] The datum line 511 is used to determine the drawing position of the drawing unit 41. Here, "drawing position" refers to a specific position of the drawing unit 41 in the area on the substrate 9 where light is irradiated (assuming it is stationary), typically the centroid of the irradiated area. For example, when the DMD is used as a light modulation unit, it is the centroid position of the image of the DMD on the substrate 9.

[0094] The marking position of the marking section 41 is determined using the caliper 511. Specifically, when acquiring the marking position, the reference unit 5 moves to a predetermined position below the marking section 41 of the object being measured, and the observation unit 52 moves directly below the marking section 41. Then, light is emitted from the marking section 41 towards the caliper 511, forming an image of a predetermined projection pattern (hereinafter referred to as the "projection pattern") on or near the caliper 511. The observation unit 52 captures the projection pattern formed on the calibration reference section 51. Thus, the position and focus state of the light emitted from the marking section 41 towards the calibration reference section 51 are observed. The control unit 8 repeatedly acquires the focus state of the light from the marking section 41 as performed by the observation unit 52 and adjusts the focusing mechanism 412 of the marking section 41. Through control of the focusing mechanism 412 based on the focus state, the focused height of the light from the marking section 41 is accurately aligned with the upper surface of the calibration reference section 51 and the light-shielding pattern 510.

[0095] Then, based on the positional relationship between the projected pattern and the caliper 511 obtained by the observation unit 52, and the position of the Y-axis stage 231 in the Y direction obtained by the position acquisition unit 26, the correct positions of the drawing unit 41 in the X and Y directions are obtained. By performing the above operation on all drawing units 41, the correct positions of all drawing units 41 relative to the base 66 are obtained.

[0096] Next, the operation of measuring the correct positional relationship between the drawing unit 41 and the height measuring unit 71 corresponding to the drawing unit 41 in the drawing device 1 will be described. This measurement operation is also an operation to correct the positional relationship between the drawing unit 41 and the height measuring unit 71. As the positional relationship between the drawing unit 41 and the height measuring unit 71, the distance in the Y direction between the drawing position of the drawing unit 41 (e.g., the center of gravity of the irradiated area) and the measuring position of the height measuring unit 71 is obtained, as well as the relationship between the height measured by the height measuring unit 71 and the state of the preferred focusing mechanism 412 when the area where the height is obtained is moved directly below the drawing unit 41. The "state of the focusing mechanism" refers to the state of the focusing mechanism 412 corresponding to the focusing height, such as the position of the focusing lens.

[0097] Figure 7 This is a block diagram showing the components related to the operation of correcting the positional relationship between the drawing unit 41 and the height measuring unit 71. During the correction operation, the control unit 8 controls the drawing unit 41, the moving mechanism 22, the height measuring unit 71, the position acquisition unit 26, and the observation unit 52. Here, the drawing unit 41 and the height measuring unit 71 are the drawing unit 41 and the height measuring unit 71 that are the objects of correction. Furthermore, the control unit 8 is connected to an arithmetic unit 81, which is a computer. The arithmetic unit 81 includes a distance correction unit 811 and a focus correction unit 812. The arithmetic unit 81 can also be part of the control unit 8. The distance correction unit 811 and the focus correction unit 812 are functions implemented through computer calculations.

[0098] The distance correction unit 811 calculates the correct distance in the Y direction between the drawing position of the drawing unit 41 and the measurement position of the height measuring unit 71 based on the obtained information. The focus correction unit 812 correlates the height of the measurement position obtained by the height measuring unit 71 with the state of the focusing mechanism 412 based on the obtained information. Furthermore, the distance correction unit 811 and the focus correction unit 812 instruct each component to perform the operations described below through the control unit 8 to obtain the information required for correction.

[0099] Figure 8 This is a diagram illustrating an example of the process of a correction action. Figure 9 This diagram illustrates the correction operation, showing the correction reference units 51 at different positions arranged vertically. Hereinafter, we will focus on explaining a drawing unit 41 and its corresponding height measuring unit 71. Furthermore, in... Figure 1 In the drawing device 1, two height measuring units 71 correspond to one drawing unit 41. The height measuring unit 71 in the following description can be either of the two height measuring units 71.

[0100] exist Figure 8In the example of the operation, firstly, the holding part 21 is moved to the position where the holding substrate 9 is held (hereinafter referred to as the "loading position") by the moving mechanism 22 (step S11). At this time, as Figure 9 As shown by reference numeral 101 in the accompanying drawings, the correction reference section 51 of the reference unit 5 is located below the height measuring section 71. The measuring position of the height measuring section 71 is located above the reflection area 512 of the correction reference section 51. In this state, the holding section 21 can also perform the loading operation of holding the substrate 9. Figure 9 In the figure, the measuring position (in the Y direction) of the height measuring unit 71 is indicated by the dashed line 72, hereinafter referred to as "measuring position 72".

[0101] Next, in step S11, the height of the reflective area 512 is measured by the height measuring unit 71 (hereinafter also referred to as "measurement height") (step S12). Hereinafter, the position of the correction reference unit 51 when the height measuring unit 71 measures the height of the reflective area 512 will be referred to as the "height measurement position of the correction reference unit 51". Information indicating the measured height is sent to the focus correction unit 812. The measurement of the height of the reflective area 512 is the measurement of the relative height of the reflective area 512 with respect to the height measuring unit 71, and can also be understood as the measurement of the height of the height measuring unit 71 relative to the object being measured. Furthermore, during drawing, the approximate height of the upper surface 91 of the substrate 9 is pre-aligned with the height of the reflective area 512 by a mechanism that raises and lowers the holding unit 21.

[0102] Next, the Y-axis stage 231 moves at a low speed in the (+Y) direction, and the height measuring unit 71 repeatedly checks the light reception status of the reflected light. Figure 9 As shown by reference numeral 102 in the attached drawing, when the measuring position 72 reaches the (-Y) side of the reflection area 512, the straight edge 513 extending in the X direction (refer to) Figure 6 When the height measuring unit 71 does not detect reflected light, information indicating the position of the correction reference unit 51 in the Y direction is sent from the position acquisition unit 26 to the distance correction unit 811 (step S13). Hereinafter, the position of the correction reference unit 51 in the Y direction (the direction of movement during drawing) when the output of the height measuring unit 71 changes due to the edge 513 will be referred to as the "edge detection position" of the correction reference unit 51. The position of the correction reference unit 51 in the Y direction can also be understood as the position of the Y-axis worktable 231 in the Y direction, or the position of the holding unit 21 in the Y direction.

[0103] Next, as Figure 9As shown by reference numeral 103 in the accompanying drawings, the correction reference unit 51 moves downwards from the drawing unit 41, i.e., to the drawing position of the drawing unit 41, via the first moving mechanism 23 (step S14). Light of a predetermined projection pattern is emitted from the drawing unit 41 to the correction reference unit 51, and the position of the focusing lens of the focusing mechanism 412 (the so-called AF axis indication position) is adjusted by the observation unit 52 to maximize the contrast of the projection pattern. In other words, the focusing state is observed by the observation unit 52, and the focusing height of the light from the drawing unit 41 is aligned with the height of the correction reference unit 51 by the focusing mechanism 412 of the drawing unit 41 (step S15). Then, information indicating the state of the focusing mechanism 412 is sent to the focusing correction unit 812, where the measurement height of the reflection area 512 obtained by the measurement unit 71 in step S12 is correlated with the state of the focusing mechanism 412 (i.e., the focusing height) (step S16).

[0104] Next, the control unit 8 adjusts the position of the correction reference unit 51 to a predetermined position relative to the drawing unit 41 by controlling the drawing unit 41, the moving mechanism 22, the position acquisition unit 26, and the observation unit 52. That is, by observing the projected pattern through the observation unit 52 and moving the Y-axis worktable 231, the relative position is adjusted so that the datum line 511 and the projected pattern form a predetermined positional relationship in the Y direction. The position of the correction reference unit 51 in the Y direction at this time is acquired (step S17). When the observation unit 52 observes that light from the drawing unit 41 illuminates the predetermined position of the correction reference unit 51, the aforementioned position of the correction reference unit 51 in the Y direction (movement direction) is referred to below as the "drawing correction position of the correction reference unit 51". In addition, in this state, the correct position of the drawing position in the X direction can also be acquired. Information indicating the drawing correction position of the correction reference unit 51 is sent to the distance correction unit 811.

[0105] exist Figure 9 In the accompanying drawing, the position in the Y direction of the drawing is indicated by a dashed line 42. Hereinafter, this position will be simply referred to as "drawing position 42". In the state shown by reference numeral 103, the drawing position 42 is located at a predetermined position relative to the datum line 511. That is, the distance 111 between the datum line 511 and the drawing position 42 is a predetermined distance. Furthermore, the distance 112 between the center position of the datum line 511 in the Y direction and the edge 513 of the reflective area 512 is also a distance known in advance as a design value.

[0106] Furthermore, the distance 113 between the edge detection position of the correction reference unit 51 (the position of the correction reference unit 51 indicated by reference numeral 102) and the drawing correction position of the correction reference unit 51 (the position of the correction reference unit 51 indicated by reference numeral 103) can be obtained as the difference between these positions. In the distance correction unit 811, the distance 113 is calculated, and the correct distance 114 between the drawing unit 41 (more precisely, the drawing position 42) and the height measuring unit 71 (more precisely, the height measuring position 72) in the Y direction (the moving direction of the holding unit 21 during drawing) is obtained by subtracting the difference between the distance 112 and the distance 111 from the distance 113 (step S18). When this operation is expressed as a formula, it is "distance 114 = distance 113 - (distance 112 - distance 111)".

[0107] Furthermore, since the position of the holding part in the X direction when the holding part 21 moves in the (+Y) direction during drawing differs from the position of the holding part in the X direction when the holding part moves in the (-Y) direction by only a step distance, there will not be a significant difference. Therefore, when determining the position of a drawing part 41, the position measured by the holding part 41 is used together with the positional relationship between the drawing part 41 and the two height measuring parts 71 (first and second height measuring parts 71) located on the (-Y) side of the drawing part 41. Figure 10 (The same applies to the action).

[0108] As another example of step S17, the drawing correction position of the correction reference unit 51 can be determined as follows. When transitioning from step S16 to step S17, no fine-tuning of the position of the correction reference unit 51 is performed; instead, the position of the correction reference unit 51 is obtained as the drawing correction position. Furthermore, the distance 111 between the mark 511 and the drawing position 42 is obtained by photographing the mark 511 and the projected pattern using the observation unit 52. Then, the correct distance 114 between the drawing unit 41 and the height measuring unit 71 is obtained through the same calculation as described above. In this case, the correct position of the drawing position in the X direction can also be obtained simultaneously.

[0109] Figure 10 These are diagrams illustrating other examples of the process of corrective actions. Figure 11 This is a diagram used to illustrate the correction operation, with the correction reference parts 51 arranged vertically to show the correction reference parts 51 located at different positions.

[0110] exist Figure 10 In the example of the action, firstly, such as Figure 11As shown by reference numeral 131 in the accompanying drawings, the correction reference unit 51 moves downwards from the drawing unit 41, i.e., to the drawing position, via the first moving mechanism 23 (step S21), aligning the focused height of the light from the drawing unit 41 with the upper surface of the correction reference unit 51 (step S22). That is, the focusing state is observed by the observation unit 52, and the focusing mechanism 412 of the drawing unit 41 aligns the focused height of the light from the drawing unit 41 with the height of the correction reference unit 51. Then, information indicating the state of the focusing mechanism 412 is sent to the focus correction unit 812. Figure 11 In, with Figure 9 Similarly, the plotting position in the Y direction is assigned the reference numeral 42.

[0111] Furthermore, the control unit 8 performs the same operation as step S17 above by controlling the drawing unit 41, the moving mechanism 22, the position acquisition unit 26, and the observation unit 52, thereby adjusting the position of the correction reference unit 51 to the drawing correction position. Information indicating the drawing correction position of the correction reference unit 51 is sent to the distance correction unit 811 (step S23).

[0112] At step S23, the correct position of the drawing position in the X direction can also be obtained. Thus, the correct positions of the drawing position relative to the base 66 in the X and Y directions are obtained.

[0113] Next, the holding part 21 moves to the loading position (step S24). At this time, as Figure 11 As shown by reference numeral 132 in the attached drawing, the correction reference unit 51 is located below the height measuring unit 71, that is, the measurement position 72 of the height measuring unit 71 is located on the reflection area 512 of the correction reference unit 51. In this state, the holding unit 21 can also perform the loading operation of holding the substrate 9. Next, in step S24, the height of the reflection area 512 is measured by the height measuring unit 71 (step S25). The measured height is sent to the focus correction unit 812. In the focus correction unit 812, the measured height of the reflection area 512 of the measuring unit 71 is associated with the state (focus height) of the focusing mechanism 412 (step S26). Information indicating the height measurement position, which is the position of the correction reference unit 51 in the Y direction, is sent to the distance correction unit 811.

[0114] Next, the Y-axis stage 231 moves at a low speed in the (+Y) direction, and the height measuring unit 71 repeatedly checks the light reception status of the reflected light. Figure 11 As shown by reference numeral 133 in the attached figure, when the measuring position 72 reaches the edge 513 on the (-Y) side of the reflection area 512, the height measuring unit 71 cannot detect the reflected light. Information indicating the position of the correction reference unit 51 in the Y direction at this time, that is, information indicating the edge detection position of the correction reference unit 51, is sent from the position acquisition unit 26 to the distance correction unit 811 (step S27).

[0115] Here, with reference numeral 131 in the attached drawing, the drawing position 42 is located at a predetermined position relative to the datum line 511. That is, the distance 143 between the datum line 511 and the drawing position 42 is a predetermined distance. The distance 144 between the center position of the datum line 511 in the Y direction and the edge 513 of the reflection area 512 is also a distance known in advance as a design value. Furthermore, the distance 141 between the drawing correction position of the correction reference part 51 (the position of the correction reference part 51 indicated by reference numeral 131) and the height measurement position of the correction reference part 51 (the position of the correction reference part 51 indicated by reference numeral 132) can be obtained as the difference between these positions. The distance 142 between the height measurement position of the correction reference part 51 (the position of the correction reference part 51 indicated by reference numeral 132) and the edge detection position of the correction reference part 51 (the position of the correction reference part 51 indicated by reference numeral 133) can be obtained as the difference between these positions.

[0116] The distance correction unit 811 calculates distances 141 and 142, and subtracts the difference between distances 144 and 143 from the difference between distances 141 and 142, thereby obtaining the correct distance 145 between the drawing unit 41 (more precisely, the drawing position 42) and the height measuring unit 71 (more precisely, the height measuring position 72) in the Y direction (i.e., the movement direction of the holding unit 21 during drawing) (step S28). This operation can be expressed as a formula: "Distance 145 = (Distance 141 - Distance 142) - (Distance 144 - Distance 143)".

[0117] As another example of step S23, the drawing correction position of the correction reference unit 51 can be determined as follows. When transitioning from step S22 to step S23, no fine-tuning of the position of the correction reference unit 51 is performed; instead, the position of the correction reference unit 51 is obtained as the drawing correction position. Furthermore, the distance 143 between the mark 511 and the drawing position 42 is obtained by photographing the mark 511 and the projected pattern using the observation unit 52. Then, the correct distance 145 between the drawing unit 41 and the height measuring unit 71 is obtained through the same calculation as described above. In this case, the correct position of the drawing position in the X direction can also be obtained simultaneously.

[0118] As mentioned above, Figure 8 and Figure 10The operation is achieved by issuing commands to the control unit 8 through the distance correction unit 811 and the focus correction unit 812 of the calculation unit 81. However, it is not necessary to explicitly distinguish which step in a series of actions is performed by each of the distance correction unit 811 and the focus correction unit 812. The distance correction unit 811 mainly performs the function of acquiring information about the distance between the drawing unit 41 and the height measuring unit 71 in the Y direction and performs calculation functions. The focus correction unit 812 mainly performs the function of acquiring the height measuring and focusing mechanism status and the function of associating them.

[0119] pass Figure 8 or Figure 10 The operation shown quickly obtains the correct distance between the drawing position of the drawing unit 41 and the height measuring position of the height measuring unit 71 in the moving direction (Y direction) of the holding unit 21. Furthermore, the height measurement result of the height measuring unit 71, i.e., the measured height, can be accurately and quickly correlated with the state of the focusing mechanism 412. Therefore, the focusing mechanism 412 can be controlled in correspondence with the measured height at each position of the upper surface 91 of the substrate 9 during drawing, enabling accurate alignment of the focusing height with the upper surface 91.

[0120] As described above, the positional relationship between the drawing unit 41 and the height measuring unit 71 can be easily obtained in the drawing device 1. For example, even if the distance between the drawing position and the height measurement value changes due to temperature changes, air pressure changes, or structural changes over time in the room where the drawing device 1 is installed, or if the position of the focusing lens or projection lens within the drawing unit 41 changes, corrections corresponding to these changes can be made quickly at the desired time. As a result, drawing accuracy can be easily maintained while suppressing a decrease in throughput. In particular, when multiple drawing units 41 are provided as in the drawing device 1, each drawing unit 41 can be calibrated quickly, thus significantly reducing the cost of calibration operations. Furthermore, it is possible to cope with drastic changes in the device installation environment.

[0121] Figure 12 This is a side view showing other configuration examples of sensor array 7, corresponding to Figure 2 Regarding Figure 2 The same constituent elements are labeled with the same reference numerals. Figure 12In the example shown, unlike the gate-shaped sensor support 63 of the first head support 61 and the second head support 62, the sensor support 63 is separated from the first head support 61 and the second head support 62 in the Y direction and fixed to the base 66. The sensor array 7 is fixed to the sensor support 63. That is, the height measuring unit 71 is mounted on the sensor support 63. In this way, the drawing unit 41 and the height measuring unit 71 can also be significantly separated in the Y direction. When the drawing unit 41 and the height measuring unit 71 are significantly separated, the positional relationship between the drawing position and the height measuring position changes by a larger amount with the passage of temperature and time, therefore it is preferable to... Figure 8 , Figure 10 The operation corrects the distance and focus height in the Y direction at the desired time. In particular, when the cover of the height measuring unit 71 and the cover of the drawing unit 41 are separate, it is preferable to provide the above-mentioned correction function on the drawing device 1.

[0122] Various modifications can be made to the drawing device 1 described above.

[0123] If the reflection area 512 of the calibration reference unit 51 is large enough relative to the illumination range of the detection light, it may not be a strip. The reflection area 512 does not need to be a single area; it can be a plurality of areas that reflect the detection light from a plurality of height measuring units 71 when the height of the calibration reference unit 51 is measured.

[0124] The edge 513 of the calibration reference section 51 does not need to be the edge of the reflective area 512 for height measurement. It can be provided in various ways as long as the reflection state of the detection light emitted from the height measurement section 71 can change as the holding section 21 moves in the Y direction. For example, the edge 513 can be the edge of a reflective area different from the reflective area 512. The edge 513 is not limited to a straight line extending in the X direction. For example, the edge of an opening provided in the reflective area 512 can also function as an edge that changes the reflection state of the detection light.

[0125] like Figure 6 As shown, by setting the reflective area 512 as a strip perpendicular to the Y direction and setting the edge 513 as an edge perpendicular to the Y direction of the reflective area 512, the edge detection position can be stably detected, and the light-shielding pattern 510 can be simplified. When the calibration reference 51 is only used to determine the correlation between the height and the state of the focusing mechanism, the caliper 511 can be omitted.

[0126] Furthermore, in the drawing device 1, the calibration reference unit 51 includes a datum line 511 as a reference pattern. When acquiring the position of the drawing unit 41 in the X direction, which is perpendicular to the Y direction, this datum line 511 can be observed by the observation unit 52 along with the projection pattern of the light emitted from the drawing unit 41. Thus, the calibration reference unit 51 can be used to measure the drawing position of the drawing unit 41 (i.e., to correct the drawing position), correct the distance between the drawing unit 41 and the height measuring unit 71, and correct the relationship between the measured height of the height measuring unit 71 and the focusing height of the drawing unit 41. The reference pattern is not limited to the datum line 511; various patterns can be used.

[0127] The observation unit 52 may not be a two-dimensional camera unit, but rather a one-dimensional camera unit that observes a region extending in the Y direction within the correction reference unit 51. Furthermore, the observation unit 52 is not necessarily limited to observing the correction reference unit 51 from below. The observation unit 52 may also observe the focusing state of light from the drawing unit 41 from an obliquely upward position.

[0128] As long as the position of the calibration reference unit 51 relative to the holding unit 21 in the Y direction (the direction of movement of the holding unit 21 during drawing) is fixed, it can also be provided in other positions. For example, the calibration reference unit 51 (or reference unit 5) can also be provided on the holding unit 21.

[0129] The height measurement of the height measuring unit 71 is not limited to the method of obliquely irradiating the upper surface 91 of the substrate 9 with the detection light. For example, the height measuring unit 71 may also irradiate the detection light perpendicularly to the upper surface 91 and measure the height of the upper surface 91 by observing the interference between the detection light and the reflected light. In this way, in the height measuring unit 71, as long as the height of the upper surface 91 is measured by irradiating the upper surface 91, which is the main surface of the substrate 9, with the detection light and receiving the reflected light from the upper surface 91, various measurement methods can be used.

[0130] The modulation light emitted from the drawing unit 41 for drawing is not limited to spatially modulated two-dimensional light, but can also be spatially modulated one-dimensional light. Furthermore, it can also be light modulated into a single beam, rather than spatially modulated, i.e., ON / OFF control is performed. The above-described correction operation is applicable to the drawing apparatus 1 for performing extremely high-precision drawing. For example, it is applicable when the permissible error of the drawing position in the movement direction is 1 μm or less, more preferably 0.5 μm or less. In addition, it is applicable when the permissible error of the allowable focusing height in the height direction is 100 μm or less, more preferably 50 μm or less.

[0131] The calculation processing in the distance correction unit 811 is not limited to Figure 8 , Figure 10The processing is shown. By changing the action and the light-blocking pattern 510, some or all of the fixed values ​​or design values ​​in these calculations can be omitted. Conversely, other fixed values ​​or design values ​​can also be imported into these calculations. In any case, in the distance correction unit 811, the distance between the drawing unit 41 and the height measuring unit 71 in the relative movement direction of the holding unit during drawing is quickly obtained, at least based on the edge detection position and the drawing correction position.

[0132] In the above example of operation, when the height of the reflective area 512 is measured by the height measuring unit 71, the holding unit 21 is located at the loading position of the substrate 9, so that the holding of the substrate 9 and the height measurement can be performed simultaneously. However, the position of the holding unit 21 when measuring the height of the reflective area 512 is not limited to this position.

[0133] The position acquisition unit 26 is not limited to a so-called linear encoder. Various mechanisms can be used as long as the position of the holding unit 21 relative to the drawing unit 41 in the moving direction during drawing can be acquired. For example, when the holding unit 21 and the Y-axis worktable 231 move in the Y direction via a ball screw mechanism, a rotary encoder mounted on a motor that rotates the ball screw can also function as the position acquisition unit 26.

[0134] The substrate 9, which is the object of the drawing, is not limited to a so-called printed wiring substrate. The substrate of the substrate 9 can be various materials such as semiconductor, glass, resin, and metal. The photosensitive material layer provided on the upper surface 91 of the substrate 9 can be any material that is affected by the drawing light.

[0135] In the drawing device 1, the holding unit 21 can be moved relative to the drawing unit 41 and the height measuring unit 71 in the moving direction (Y direction) by the first moving mechanism 23. For example, the holding unit 21 can be fixed, and the drawing unit 41 and the height measuring unit 71 can be moved in the Y direction above the holding unit 21 by the moving mechanism. In addition, the drawing unit 41 can also be moved in the X direction by the moving mechanism.

[0136] The structures of the above-described embodiments and their variations can be appropriately combined as long as they do not contradict each other.

[0137] Although the invention has been described and illustrated in detail, the above description is exemplary and not restrictive. Therefore, various modifications or forms are possible without departing from the scope of the invention.

Claims

1. A drawing apparatus for drawing a pattern on a substrate, wherein, have: Holding section, holding substrate; The drawing section emits modulated light for drawing onto the main surface of the substrate held by the holding section; The moving mechanism moves the holding portion relative to the drawing portion in a moving direction parallel to the main surface of the substrate held by the holding portion; A height measuring unit is disposed at a position separate from the drawing unit in the moving direction, and illuminates the main surface of the substrate with light and receives reflected light from the main surface, thereby measuring the height of the main surface; The position acquisition unit acquires the position of the holding unit relative to the drawing unit in the moving direction; The control unit controls the emission of light from the drawing unit and the focusing height of the light based on information from the height measuring unit and the position acquisition unit, and moves the holding unit in the moving direction to draw a pattern on the main surface of the substrate. The calibration reference section is fixed relative to the position of the holding section in the moving direction, and includes a reflection area that reflects light emitted from the height measuring section, and the edge of the reflection area that changes as the holding section moves in the moving direction; The observation section observes the light emitted from the drawing section to the calibration reference section; as well as The distance correction unit obtains the distance between the drawing unit and the height measuring unit in the moving direction based on the edge detection position of the correction reference unit in the moving direction, which changes due to the edge of the correction reference unit, and the drawing correction position of the correction reference unit in the moving direction when light from the drawing unit illuminates a predetermined position of the correction reference unit, as observed by the observation unit.

2. The drawing device according to claim 1, wherein, The reflective area of ​​the correction reference is a strip-shaped region perpendicular to the direction of movement, and the edge of the correction reference is a straight edge of the reflective area perpendicular to the direction of movement.

3. A drawing apparatus for drawing a pattern on a substrate, wherein, have: Holding section, holding substrate; The drawing section emits modulated light for drawing onto the main surface of the substrate held by the holding section; The moving mechanism moves the holding portion relative to the drawing portion in a moving direction parallel to the main surface of the substrate held by the holding portion; A height measuring unit is disposed at a position separate from the drawing unit in the moving direction, and illuminates the main surface of the substrate with light and receives reflected light from the main surface to measure the height of the main surface; The position acquisition unit acquires the position of the holding unit relative to the drawing unit in the moving direction; The control unit controls the emission of light from the drawing unit and the focusing height of the light based on information from the height measuring unit and the position acquisition unit, and moves the holding unit in the moving direction to draw a pattern on the main surface of the substrate. The calibration reference section is fixed in position relative to the holding section in the moving direction and includes a reflective area that reflects light emitted from the height measuring section; The observation section observes the focusing state of the light emitted from the drawing section to the correction reference section; and The focus correction unit moves the correction reference unit to the measurement position of the height measurement unit via the moving mechanism, obtains the height of the reflection area of ​​the correction reference unit (i.e., the measurement height), moves the correction reference unit to the drawing position of the drawing unit, observes the focus state via the observation unit, and aligns the focus height of the light from the drawing unit with the height of the correction reference unit via the focusing mechanism of the drawing unit, thus associating the measurement height with the state of the focusing mechanism.

4. The drawing device according to any one of claims 1 to 3, wherein, When the holding part holds the substrate, the position of the holding part is such that the reflection area of ​​the correction reference part is located at the measurement position of the height measuring part.

5. The drawing apparatus according to any one of claims 1 to 3, wherein, The correction reference section includes a reference pattern, which is observed by the observation section together with the projection pattern of light emitted from the drawing section when the position of the drawing section in a direction perpendicular to the moving direction is obtained.

6. The drawing device according to any one of claims 1 to 3, wherein, have: abutment; A head support portion is fixed to the base and is equipped with the drawing portion; The sensor support is separated from the head support in the direction of movement and fixed to the base, and the height measuring part is installed thereon.

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