Method and device for calculating PCB expansion and contraction compensation value, electronic equipment and storage medium
By calculating the actual and theoretical coordinate offsets of the PCB, and using translation or affine transformation compensation methods to determine the processing coordinates, the problem of PCB processing position deviation is solved, thus improving manufacturing accuracy and efficiency.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- DELTON TECH (GUANGZHOU) INC
- Filing Date
- 2026-03-25
- Publication Date
- 2026-07-21
AI Technical Summary
Existing PCB expansion and contraction compensation methods are relatively simple, which leads to deviations between the processing position and the theoretical position. This can easily cause problems such as hole alignment deviation, hole ring breakage, and pattern displacement, thus reducing manufacturing efficiency.
By obtaining the actual and theoretical coordinates of multiple predetermined target points on the PCB, the overall offset is calculated, and the compensation processing coordinates are determined by translation compensation method or affine transformation compensation method. The appropriate compensation method is selected according to the offset threshold.
Accurately determine the compensation machining coordinates to reduce machining position deviations, improve manufacturing precision and efficiency, and avoid product scrap.
Smart Images
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Abstract
Description
Technical Field
[0001] This application relates to the technical field of PCB manufacturing, and more specifically, to a method, apparatus, electronic device, and storage medium for calculating PCB expansion and contraction compensation values. Background Technology
[0002] PCB manufacturing is a complex process involving wet processes (such as copper plating, electroplating, pattern transfer, and solder mask) and thermal processes (such as lamination, baking, and hot air leveling). These processes inevitably cause dimensional changes (expansion or contraction) in the material. These changes are usually non-uniform and difficult to predict, and are mainly affected by a variety of factors such as material properties, process parameters, and pattern distribution uniformity.
[0003] When a PCB experiences expansion and contraction, the actual hole positions and graphic positions on the PCB will deviate from the theoretical positions of the original design. In fields such as high-density interconnect (HDI) boards, IC carrier boards, and multilayer boards, the line width and line spacing (L / S) are extremely small, and the hole position accuracy requirements are extremely high. This deviation can lead to alignment errors and hole ring breakage. Currently, most methods for compensating for PCBs subject to expansion and contraction are holistic, meaning that the PCB's dimensions before and after expansion and contraction are optimized to match the theoretical dimensions during subsequent manufacturing. However, this method is relatively simple and not entirely reasonable. In subsequent PCB manufacturing, the actual processing positions on the PCB can still deviate from the theoretical positions, leading to issues such as hole alignment misalignment, hole ring breakage, pattern shifting, dimensional deviations, and open / short circuits caused by misalignment in high-density interconnect (HDI) boards, IC carriers, and multilayer boards. This can even result in product scrap, requiring repeated optimization and experimentation to determine a suitable PCB size. This process is inconvenient for PCB manufacturing and reduces manufacturing efficiency. Summary of the Invention
[0004] The purpose of this application is to provide a method, apparatus, electronic device, and storage medium for calculating PCB expansion and contraction compensation values, which can more accurately determine the compensation processing coordinates of the PCB, thereby reducing or eliminating the deviation between the actual processing position and the theoretical position on the PCB during subsequent PCB manufacturing. This facilitates PCB manufacturing and effectively improves PCB manufacturing efficiency.
[0005] To achieve the above objectives, firstly, this application provides a method for calculating PCB expansion / contraction compensation values, including: Obtain the actual target coordinates and theoretical target coordinates corresponding to multiple predetermined target points on the PCB; The overall offset of the PCB is calculated based on the actual target coordinates and theoretical target coordinates corresponding to multiple predetermined target points. When the total offset of the PCB is greater than or equal to the preset offset threshold, the compensation processing coordinates of the PCB are calculated using the translation compensation method. When the total offset of the PCB is less than the preset offset threshold, the affine transformation compensation method is used to calculate the compensated processing coordinates of the PCB.
[0006] In a preferred embodiment of this application, the step of calculating the overall offset of the PCB based on the actual target coordinates and theoretical target coordinates corresponding to multiple predetermined target points includes: Based on the actual target coordinates and theoretical target coordinates corresponding to multiple predetermined target points, calculate the target point offsets corresponding to the multiple predetermined target points respectively. The overall offset of the PCB is calculated based on the target offset corresponding to multiple predetermined target points.
[0007] In a preferred embodiment of this application, calculating the overall offset of the PCB based on the target point offsets corresponding to multiple predetermined target points includes: Calculate the average offset corresponding to multiple predetermined target points based on the target point offsets corresponding to multiple predetermined target points. The overall offset of the PCB is calculated based on the average offset corresponding to multiple predetermined target points.
[0008] In a preferred embodiment of this application, the step of calculating the compensated processing coordinates of the PCB using the translation compensation method includes: The theoretical coordinates of the corresponding processing position on the PCB are added to the average offsets of multiple predetermined target points to calculate the compensated processing coordinates of the PCB.
[0009] In a preferred embodiment of this application, the step of calculating the compensated machining coordinates of the PCB using the affine transformation compensation method includes: Construct a system of linear equations, as follows: ; ;
[0010] Where a, b, c, d, e, and f are affine transformation parameters, (Xi, Yi) are the theoretical target coordinates of the i-th predetermined target, and (Xi', Yi') are the actual target coordinates of the i-th predetermined target. Based on the actual target coordinates and theoretical target coordinates corresponding to multiple predetermined target points, as well as the linear equation system, the specific values of a, b, c, d, e, and f are obtained by solving. Substituting the specific values of a, b, c, d, e, and f into the system of linear equations, we obtain the calculation equation for the compensation coordinates of the PCB. Substitute the theoretical coordinates of the corresponding processing position on the PCB into the PCB compensation coordinate calculation equation to obtain the corresponding compensation processing coordinates of the PCB.
[0011] In a preferred embodiment of this application, the method further includes: Determine if there are localized expansion / contraction deviations after PCB expansion / contraction compensation; If there is a local expansion / contraction deviation, obtain the actual target coordinates and theoretical target coordinates corresponding to multiple detection target points in the local area of the PCB. Based on the actual target coordinates and theoretical target coordinates corresponding to multiple detection target points, the overall offset of the local area of the PCB is calculated. When the overall offset of a local area of the PCB is greater than or equal to a preset offset threshold, the compensation processing coordinates of the local area of the PCB are calculated using the translation compensation method. When the overall offset of a local area of the PCB is less than a preset offset threshold, the compensation machining coordinates of the local area of the PCB are calculated using the affine transformation compensation method.
[0012] In a preferred embodiment of this application, the number of predetermined target points is four, and the four predetermined target points are located at the four corners of the PCB.
[0013] Secondly, this application provides a device for calculating PCB expansion and contraction compensation values, comprising: The target coordinate acquisition module is used to acquire the actual target coordinates and theoretical target coordinates corresponding to multiple predetermined target points on the PCB. The offset calculation module is used to calculate the overall offset of the PCB based on the actual target coordinates and theoretical target coordinates corresponding to multiple predetermined target points. The translation compensation module is used to calculate the compensation processing coordinates of the PCB using the translation compensation method when the total offset of the PCB is greater than or equal to a preset offset threshold. The affine transformation compensation module is used to calculate the compensated processing coordinates of the PCB using the affine transformation compensation method when the total offset of the PCB is less than a preset offset threshold.
[0014] Thirdly, this application provides an electronic device, including a memory and a processor, wherein the memory is used to store a computer program, and the processor runs the computer program to enable the electronic device to perform the above-described method for calculating PCB expansion and contraction compensation values.
[0015] Fourthly, this application provides a computer-readable storage medium storing a computer program that, when executed by a processor, implements the above-described method for calculating PCB expansion and contraction compensation values.
[0016] This application discloses a method, apparatus, electronic device, and storage medium for calculating PCB expansion and contraction compensation values, which, compared with the prior art, have at least the following advantages: This application calculates the overall offset of the PCB by obtaining the actual and theoretical target coordinates corresponding to multiple predetermined target points. When the overall offset of the PCB is greater than or equal to a preset offset threshold, the compensation processing coordinates of the PCB are calculated using a translation compensation method. When the overall offset of the PCB is less than the preset offset threshold, the compensation processing coordinates of the PCB are calculated using an affine transformation compensation method. The appropriate PCB expansion / contraction compensation method (translation compensation method or affine transformation compensation method) is determined by the magnitude of the overall offset of the PCB. In this way, the compensation processing coordinates of the PCB can be determined more accurately. In subsequent PCB manufacturing, this reduces or eliminates the deviation between the actual and theoretical positions on the PCB, improving the accuracy of pattern positioning and alignment. This makes high-density interconnect (HDI) boards, IC carrier boards, multilayer boards, etc., less prone to problems such as hole alignment deviation, hole ring breakage, pattern displacement, dimensional deviation, and alignment deviation leading to open or short circuits, or even product scrap. Compared to the overall expansion and contraction compensation method in existing technologies, this eliminates the need for continuous optimization and trial in subsequent PCB manufacturing, thus facilitating PCB manufacturing and effectively improving PCB manufacturing efficiency. Attached Figure Description
[0017] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments of this application will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.
[0018] Figure 1 This is a flowchart illustrating the method for calculating PCB expansion and contraction compensation values provided in the embodiments of this application. Figure 2 This is a schematic diagram showing the actual target coordinates and theoretical target coordinates corresponding to the four predetermined target points of the PCB provided in this application embodiment; Figure 3 This is a structural block diagram of the PCB expansion and contraction compensation value calculation device provided in the embodiments of this application; Figure 4 This is a schematic diagram of the internal structure of the computer device provided in the embodiments of this application. Detailed Implementation
[0019] The specific embodiments of this application will be described in further detail below with reference to the accompanying drawings and examples. The following examples are used to illustrate this application, but are not intended to limit the scope of this application.
[0020] When a PCB experiences expansion and contraction, the actual hole positions and graphic positions on the PCB will deviate from the theoretical positions of the original design. In fields such as high-density interconnect (HDI) boards, IC carrier boards, and multilayer boards, the line width and line spacing (L / S) are extremely small, and the hole position accuracy requirements are extremely high. This deviation can lead to alignment errors and hole ring breakage. Currently, most methods for compensating for PCBs subject to expansion and contraction are holistic, meaning that the PCB's dimensions before and after expansion and contraction are optimized to match the theoretical dimensions during subsequent manufacturing. However, this method is relatively simple and not entirely reasonable. In subsequent PCB manufacturing, the actual processing on the PCB can still deviate from the theoretical positions, leading to issues such as hole alignment deviations, hole ring breakage, pattern shifting, dimensional errors, and open / short circuits caused by misalignment in high-density interconnect (HDI) boards, IC carriers, and multilayer boards. This can even result in product scrap, requiring repeated optimization and experimentation to determine the most suitable PCB dimensions. This process is inconvenient for PCB manufacturing and reduces manufacturing efficiency.
[0021] To address the problems in the prior art, this application provides a method, apparatus, electronic device, and storage medium for calculating PCB expansion and contraction compensation values. This method can accurately determine the compensation processing coordinates of the PCB, thereby reducing or eliminating the deviation between the actual processing position and the theoretical position on the PCB during subsequent PCB manufacturing. This facilitates PCB manufacturing and effectively improves PCB manufacturing efficiency.
[0022] See Figure 1 , Figure 1 This is a flowchart illustrating the method for calculating PCB expansion and contraction compensation values provided in this application embodiment.
[0023] The method for calculating PCB expansion and contraction compensation values described in this application embodiment can be applied to computer equipment such as servers, which can be computer equipment used in conjunction with the PCB manufacturing process.
[0024] This application provides a method for calculating PCB expansion and contraction compensation values, which can be applied to the PCB manufacturing process, and includes the following steps: Step S110: Obtain the actual target coordinates and theoretical target coordinates corresponding to multiple predetermined target points on the PCB.
[0025] In one embodiment, the PCB may be a PCB used in the fields of high-density interconnect (HDI) boards, IC carrier boards, multilayer boards, etc., or it may be a PCB used in other fields. Other fields will not be listed one by one here.
[0026] In one embodiment, the predetermined target point of the PCB can be a predetermined hole on the PCB, or a predetermined processing position of a pattern on the PCB. This application embodiment uses a predetermined hole on the PCB as an example for elaboration, introduction, and explanation. Specifically, the PCB may have four predetermined target points, each located at one of the four corners of the PCB. The actual target point coordinates and theoretical target point coordinates corresponding to the four predetermined target points of the PCB can be found in [reference needed]. Figure 2 The diagram shows that, Figure 2 In this embodiment, targets 1, 2, 3, and 4 are the theoretical targets corresponding to the four predetermined targets, and targets 1', 2', 3', and 4' are the actual targets corresponding to the four predetermined targets. The coordinates (x1, y1), (x2, y2), (x3, y3), and (x4, y4) are the coordinates of the theoretical targets corresponding to the four predetermined targets, and the coordinates (x1', y1'), (x2', y2'), (x3', y3'), and (x4', y4') are the coordinates of the actual targets corresponding to the four predetermined targets. In the following embodiments of this application, the example of four predetermined targets for a PCB is used to elaborate, explain, and interpret the calculation method of the PCB expansion and contraction compensation value in this embodiment of the application. Understandably, in other embodiments, the number of multiple predetermined target points on the PCB can be other numbers, for example, the number of multiple predetermined target points on the PCB can be six; in other embodiments, the positions of the four predetermined target points can also be not located at the four corners of the PCB, and the positions of the four predetermined target points can also be any four positions on the PCB, but it is not suitable to use four positions clustered together on the PCB, but rather four positions dispersed on the PCB.
[0027] When obtaining the actual target coordinates and theoretical target coordinates corresponding to multiple predetermined target points on a PCB, the actual target coordinates and theoretical target coordinates corresponding to multiple predetermined target points on the PCB can be data input by the staff into the computer equipment; the actual target coordinates and theoretical target coordinates corresponding to multiple predetermined target points on the PCB can be obtained by image detection or mechanical measurement. Among them, the image detection method can use optical inspection equipment (AOI / AVI), and the mechanical measurement method can use a coordinate measuring machine (CMM).
[0028] Step S120: Calculate the overall offset of the PCB based on the actual target coordinates and theoretical target coordinates corresponding to multiple predetermined target points.
[0029] Understandably, the total offset of a PCB can be the offset of the PCB's center of gravity. The larger the total offset of a PCB, the more the PCB's center of gravity is offset, and vice versa.
[0030] Step S130: When the total offset of the PCB is greater than or equal to the preset offset threshold, the compensation processing coordinates of the PCB are calculated using the translation compensation method.
[0031] In one embodiment, if the PCB hole is a blind hole, the preset offset threshold can be 100um; if the PCB hole is a receiving hole, the preset offset threshold can be 200um. It is understood that the preset offset threshold is not a specific value. In other embodiments, the preset offset threshold can be adjusted. For example, if the PCB hole is a blind hole, the preset offset threshold can also be 90um.
[0032] The translation compensation method involves compensating the PCB processing position with the same amount of translation to calculate the compensated processing coordinates of the PCB. The PCB processing position can include the processing position of PCB holes, the processing position of PCB images, etc. Understandably, the calculated compensated processing coordinates of the PCB can be used for subsequent PCB manufacturing. When the total offset of the PCB is greater than or equal to the preset offset threshold, it indicates that the offset of the PCB center of gravity is too large. The translation compensation method is more suitable for the expansion and contraction compensation of the PCB center of gravity offset, so as to effectively reduce or eliminate the large offset of the PCB processing position.
[0033] Step S140: When the total offset of the PCB is less than the preset offset threshold, the affine transformation compensation method is used to calculate the compensation processing coordinates of the PCB.
[0034] Understandably, steps S130 and S140 are not executed in a sequential order, but are executed selectively based on the total offset of the PCB and the preset offset threshold.
[0035] Affine transformation compensation is a method that combines affine transformation and dynamic compensation techniques to improve the accuracy of PCB manufacturing. Based on affine transformation, it obtains the compensated processing coordinates of the PCB through linear transformations (rotation, scaling, shearing) and translation operations. When the overall offset of the PCB is less than a preset offset threshold, it indicates that the offset of the PCB's center of gravity is too small, and there may be more micro-changes (rotation, scaling, shearing). Affine transformation compensation is more suitable for compensating for the expansion and contraction of the PCB's center of gravity when the offset is small, thus effectively reducing or eliminating the PCB processing position with small offset.
[0036] The PCB expansion / contraction compensation value calculation method in this application embodiment calculates the overall offset of the PCB by obtaining the actual target coordinates and theoretical target coordinates corresponding to multiple predetermined target points on the PCB. When the overall offset of the PCB is greater than or equal to a preset offset threshold, the compensation processing coordinates of the PCB are calculated using a translation compensation method. When the overall offset of the PCB is less than the preset offset threshold, the compensation processing coordinates of the PCB are calculated using an affine transformation compensation method. The appropriate PCB expansion / contraction compensation method (translation compensation method or affine transformation compensation method) is determined by the magnitude of the overall offset of the PCB. This method can more accurately determine the compensation processing coordinates of the PCB, effectively reducing the situations of "overcompensation," "miscompensation," and "undercompensation," and using the PCB compensation processing coordinates for subsequent PCB... This manufacturing method reduces or eliminates the deviation between the actual and theoretical positions on the PCB during subsequent PCB manufacturing, improving the accuracy of pattern positioning and alignment. This makes high-density interconnect (HDI) boards, IC carrier boards, and multilayer boards less prone to problems such as hole alignment deviations, hole ring breakage, pattern displacement, dimensional deviations, and alignment deviations leading to open or short circuits, or even product scrap. Compared to the overall expansion and contraction compensation method in existing technologies, this PCB expansion and contraction compensation calculation method changes the PCB expansion and contraction compensation from the expansion and contraction compensation of the board size to the expansion and contraction compensation of the PCB processing position, making it more specific and precise. This eliminates the need for continuous optimization and trial in subsequent PCB manufacturing, thus facilitating PCB manufacturing and effectively improving PCB manufacturing efficiency.
[0037] In one embodiment, calculating the overall offset of the PCB based on the actual target coordinates and theoretical target coordinates corresponding to multiple predetermined target points may include the following steps: Based on the actual target coordinates and theoretical target coordinates corresponding to multiple predetermined target points, calculate the target point offsets corresponding to the multiple predetermined target points respectively. The overall offset of the PCB is calculated based on the target offset corresponding to multiple predetermined target points.
[0038] Specifically, that is, based on the actual target coordinates and theoretical target coordinates corresponding to each predetermined target point, the target offset corresponding to each predetermined target point is calculated respectively; then, based on the target offset corresponding to all predetermined target points, the total offset of the PCB is calculated. The target offset corresponding to each predetermined target point includes the offset in the x-axis direction and the offset in the y-axis direction. The total offset of the PCB is the sum of the offsets, which has only a single offset value, which is obtained by summing the offsets in the x-axis direction and the offsets in the y-axis direction.
[0039] Furthermore, calculating the overall offset of the PCB based on the target offsets corresponding to multiple predetermined target points can include the following steps: Calculate the average offset corresponding to multiple predetermined target points based on the target point offsets corresponding to multiple predetermined target points. The overall offset of the PCB is calculated based on the average offset corresponding to multiple predetermined target points.
[0040] Specifically, the average offset corresponding to multiple predetermined target points includes the average offset in the x-axis direction and the average offset in the y-axis direction. When calculating the overall offset of the PCB based on the average offset corresponding to multiple predetermined target points, the overall offset of the PCB can be calculated using the formula for the overall centroid offset, which is as follows: ; Where Total offset represents the total offset of the PCB, Mean△X represents the average offset in the x-axis direction, Mean△Y represents the average offset in the y-axis direction, and sqrt is the square root.
[0041] For example, suppose the theoretical target coordinates corresponding to the four predetermined target points are target 1 (100, 100), target 2 (-100, 100), target 3 (100, -100), and target 4 (-100, -100); and the actual target coordinates corresponding to the four predetermined target points are target 1' (100.1, 100), target 2' (-100, 100.1), target 3' (100.2, -100.1), and target 4' (-100.1, -100.2). Then, after calculation, the total offset of the PCB calculated using these four predetermined target points is 0.0707 mm.
[0042] Using the above method, the overall offset of the PCB can be calculated more accurately based on the actual target coordinates and theoretical target coordinates corresponding to multiple predetermined target points. This allows for a more accurate determination of the appropriate PCB expansion and contraction compensation method, a more accurate determination of the PCB compensation processing coordinates, and a more effective reduction of "overcompensation," "miscompensation," and "undercompensation."
[0043] In one embodiment, calculating the compensated machining coordinates of the PCB using the translation compensation method may include: The theoretical coordinates of the corresponding processing position on the PCB are added to the average offsets of multiple predetermined target points to calculate the compensated processing coordinates of the PCB.
[0044] Specifically, the average offset corresponding to multiple predetermined target points includes the average offset in the x-axis direction and the average offset in the y-axis direction. When the theoretical coordinates of the corresponding processing position of the PCB are added to the average offsets corresponding to multiple predetermined target points, the x-axis and y-axis are added to calculate the compensated processing coordinates of the corresponding processing position of the PCB.
[0045] For example, suppose the theoretical target coordinates corresponding to the four predetermined target points are target 1 (100, 100), target 2 (-100, 100), target 3 (100, -100), and target 4 (-100, -100); and the actual target coordinates corresponding to the four predetermined target points are target 1' (101, 100), target 2' (-100, 101), target 3' (100.2, -100.1), and target 4' (-99, -100.2). Then, after calculation, through these four... The total offset of the PCB calculated from the predetermined target points is 0.529mm. Since 0.529mm is greater than 100um, the compensation machining coordinates of the PCB are calculated using the translation compensation method. After calculation, the average offset in the x-axis direction is 0.5 and the average offset in the y-axis direction is 0.175. Therefore, the x-coordinate of the compensation machining coordinates of the corresponding machining position of the PCB is equal to the x-coordinate of the theoretical target point coordinates + 0.5, and the y-coordinate of the compensation machining coordinates is equal to the y-coordinate of the theoretical target point coordinates + 0.175.
[0046] By adding the theoretical coordinates of the PCB processing position to the average offset of multiple predetermined target points as described above, the compensated processing coordinates of the PCB processing position can be calculated. This method combines the offsets of multiple predetermined target points, thus enabling a faster and more accurate calculation of the compensated processing coordinates of the PCB processing position.
[0047] In one embodiment, calculating the compensated machining coordinates of the PCB using the affine transformation compensation method may include the following steps: Construct a system of linear equations, as follows: ; ;
[0048] Where a, b, c, d, e, and f are affine transformation parameters, (Xi, Yi) are the theoretical target coordinates of the i-th predetermined target point, and (Xi', Yi') are the actual target coordinates of the i-th predetermined target point; a, b, c, d, e, and f need to be solved; a and e mainly control scaling in the x-axis and y-axis directions, b and d mainly control shearing and rotation, and c and f control translation in the x-axis and y-axis directions. Based on the actual target coordinates and theoretical target coordinates corresponding to multiple predetermined target points, as well as the linear equation system, the specific values of a, b, c, d, e, and f are obtained by solving. Substituting the specific values of a, b, c, d, e, and f into the system of linear equations, we obtain the calculation equation for the compensation coordinates of the PCB. Substitute the theoretical coordinates of the corresponding processing position on the PCB into the PCB compensation coordinate calculation equation to obtain the corresponding compensation processing coordinates of the PCB.
[0049] For example, suppose the theoretical target coordinates corresponding to the four predetermined target points are target 1 (100, 100), target 2 (-100, 100), target 3 (100, -100), and target 4 (-100, -100); and the actual target coordinates corresponding to the four predetermined target points are target 1' (100.1, 100), target 2' (-100, 100.1), target 3' (100.2, -100.1), and target 4' (-100.1, -100.2). Then, after calculation, the total offset of the PCB calculated using these four predetermined target points is 0.0707mm. Since 0.0707mm is less than 100um, it is suitable to use the affine transformation compensation method to calculate the compensation processing coordinates of the PCB. Substituting the coordinates corresponding to the four predetermined target points into the above system of linear equations, we obtain the following system of equations: For target 1 and target 1' ...(1) ...(2) For target 2 and target 2' ...(3) ...(4) For target 3 and target 3' ...(5) ...(6) For target 4 and target 4' ...(7) ...(8) When solving for a, b, c, d, e, and f, the above system of equations is transformed into a matrix for solution, where, The first system of equations (the system of equations containing parameters a, b, and c, i.e., equations (1), (3), (5), and (7)): The first system of equations contains parameters a, b, and c, and is only related to Xi'. ,matrix:
[0050]
[0051] The second system of equations (the system of equations containing parameters d, e, and f, i.e., equations (2), (4), (6), and (8)): The second system of equations contains parameters d, e, and f, and is only related to Yi'. ,matrix:
[0052]
[0053] Solving the overdetermined system of equations using the least squares method
[0054] calculate
[0055]
[0056] calculate
[0057]
[0058] calculate
[0059]
[0060] Solve for a, b, c
[0061] Finally, we obtain a=1.001, b=0, c=0.05; similarly, we can obtain d=0, e=1.001, f=-0.05; substituting the specific values of a, b, c, d, e, and f into the linear equation system, we obtain the calculation equation for the compensation coordinates of the PCB processing position: ; ;
[0062] By substituting the theoretical coordinates of the corresponding processing position on the PCB into the above calculation equation for the compensation coordinates of the PCB processing position, the obtained Xi' and Yi' are the compensation processing coordinates of the PCB.
[0063] By using the above calculation method for the PCB's corresponding compensation processing coordinates, the PCB's corresponding compensation processing coordinates can be calculated more accurately, thus better reducing the occurrence of "overcompensation," "miscompensation," and "undercompensation."
[0064] In one embodiment, the method for calculating the PCB expansion / contraction compensation value according to this application may further include the following steps: Determine if there are localized expansion / contraction deviations after PCB expansion / contraction compensation; If there is a local expansion / contraction deviation, obtain the actual target coordinates and theoretical target coordinates corresponding to multiple detection target points in the local area of the PCB. Based on the actual target coordinates and theoretical target coordinates corresponding to multiple detection target points, the overall offset of the local area of the PCB is calculated. When the overall offset of a local area of the PCB is greater than or equal to a preset offset threshold, the compensation processing coordinates of the local area of the PCB are calculated using the translation compensation method. When the overall offset of a local area of the PCB is less than a preset offset threshold, the compensation machining coordinates of the local area of the PCB are calculated using the affine transformation compensation method.
[0065] Specifically, the local area is a local area of the PCB, which is formed by multiple PCB holes or other processing locations at a certain local position of the PCB; the definition of the local area can be based on a predetermined area or the number of holes that need to be compensated for secondary expansion and contraction. Understandably, the above steps are actually to determine whether a local area of the PCB needs secondary expansion and contraction compensation; the steps of the above secondary expansion and contraction compensation can be referred to the relevant content of steps S110 to S140 above, and will not be elaborated or repeated here. When determining whether there are localized expansion / contraction deviations after PCB expansion / contraction compensation, the offset of all PCB processing positions after compensation can be calculated. This offset includes the offset in the x-axis direction and the offset in the y-axis direction. By comparing the offset of the PCB processing positions with the preset comparison offset for secondary compensation, the processing positions that require secondary expansion / contraction compensation can be determined. If the number of processing positions requiring secondary compensation is small and relatively scattered, and cannot form a localized area, then secondary expansion / contraction compensation is not performed. If the number of processing positions requiring secondary compensation can form a localized area at a certain location on the PCB, then secondary expansion / contraction compensation is performed.
[0066] The above method can be used to perform secondary expansion and contraction compensation on local areas of PCBs with local expansion and contraction deviations. Secondary expansion and contraction compensation can further reduce the occurrence of "overcompensation", "miscompensation" and "undercompensation", so that the deviation between the actual processing position and the theoretical position on the PCB is reduced or eliminated more in the subsequent PCB manufacturing, making the PCB manufacturing more refined and accurate.
[0067] In order to execute the methods corresponding to the above embodiments and achieve the corresponding functions and technical effects, a PCB expansion and contraction compensation value calculation device is provided below.
[0068] See Figure 3 , Figure 3 This is a structural block diagram of the PCB expansion and contraction compensation value calculation device provided in the embodiments of this application.
[0069] The PCB expansion / contraction compensation value calculation device provided in this application embodiment includes: The target coordinate acquisition module 310 is used to acquire the actual target coordinates and theoretical target coordinates corresponding to multiple predetermined target points on the PCB. The offset calculation module 320 is used to calculate the overall offset of the PCB based on the actual target coordinates and theoretical target coordinates corresponding to multiple predetermined target points. The translation compensation module 330 is used to calculate the compensation processing coordinates of the PCB using the translation compensation method when the total offset of the PCB is greater than or equal to a preset offset threshold. The affine transformation compensation module 340 is used to calculate the compensated processing coordinates of the PCB using the affine transformation compensation method when the total offset of the PCB is less than a preset offset threshold.
[0070] The PCB expansion and contraction compensation value calculation device provided in this application calculates the total offset of the PCB by acquiring the actual target point coordinates and theoretical target point coordinates corresponding to multiple predetermined target points of the PCB. When the total offset of the PCB is greater than or equal to a preset offset threshold, the compensation processing coordinates of the PCB are calculated using a translation compensation method. When the total offset of the PCB is less than the preset offset threshold, the compensation processing coordinates of the PCB are calculated using an affine transformation compensation method. The appropriate expansion and contraction compensation method (translation compensation method or affine transformation compensation method) of the PCB is determined by the magnitude of the total offset of the PCB. In this way, the compensation processing coordinates of the PCB can be determined more accurately, and P... The CB's compensated machining coordinates are used in subsequent PCB manufacturing, reducing or eliminating the deviation between the actual machining position and the theoretical position on the PCB during subsequent manufacturing. This improves the accuracy of pattern positioning and alignment, making it less likely for high-density interconnect (HDI) boards, IC carrier boards, multilayer boards, etc., to have problems such as hole alignment deviation, hole ring breakage, pattern displacement, dimensional deviation, and alignment deviation leading to open or short circuits, or even product scrap. Compared with the overall expansion and contraction compensation method in the existing technology, this eliminates the need for continuous optimization and trial in subsequent PCB manufacturing, thus facilitating PCB manufacturing and effectively improving PCB manufacturing efficiency.
[0071] As an optional implementation, the offset calculation module 320 can be specifically used for: Based on the actual target coordinates and theoretical target coordinates corresponding to multiple predetermined target points, calculate the target point offsets corresponding to the multiple predetermined target points respectively. The overall offset of the PCB is calculated based on the target offset corresponding to multiple predetermined target points.
[0072] Furthermore, when calculating the overall offset of the PCB based on the target offsets corresponding to multiple predetermined target points, the offset calculation module 320 can: Calculate the average offset corresponding to multiple predetermined target points based on the target point offsets corresponding to multiple predetermined target points. The overall offset of the PCB is calculated based on the average offset corresponding to multiple predetermined target points.
[0073] As an optional implementation, the translation compensation module 330 can be specifically used for: The theoretical coordinates of the corresponding processing position on the PCB are added to the average offsets of multiple predetermined target points to calculate the compensated processing coordinates of the PCB.
[0074] As an optional implementation, the affine variation compensation module 340 can be specifically used for: Construct a system of linear equations, as follows: ; ;
[0075] Where a, b, c, d, e, and f are affine transformation parameters, (Xi, Yi) are the theoretical target coordinates of the i-th predetermined target, and (Xi', Yi') are the actual target coordinates of the i-th predetermined target. Based on the actual target coordinates and theoretical target coordinates corresponding to multiple predetermined target points, as well as the linear equation system, the specific values of a, b, c, d, e, and f are obtained by solving. Substituting the specific values of a, b, c, d, e, and f into the system of linear equations, we obtain the calculation equation for the compensation coordinates of the PCB. Substitute the theoretical coordinates of the corresponding processing position on the PCB into the PCB compensation coordinate calculation equation to obtain the corresponding compensation processing coordinates of the PCB.
[0076] As an optional implementation, the PCB expansion and contraction compensation value calculation device of this application embodiment may further include a judgment module for judging whether there is expansion and contraction deviation in local areas after PCB expansion and contraction compensation. The target coordinate acquisition module 310 can also be used to acquire the actual target coordinates and theoretical target coordinates corresponding to multiple detection target points in a local area of the PCB when there is a local expansion and contraction deviation. The offset calculation module 320 can also be used to calculate the overall offset of a local area of the PCB based on the actual target coordinates and theoretical target coordinates corresponding to multiple detection target points. The translation compensation module 330 can also be used to calculate the compensation processing coordinates of the local area of the PCB when the overall offset of a local area of the PCB is greater than or equal to a preset offset threshold. The affine transformation compensation module 340 can also be used to calculate the compensation processing coordinates of the local area of the PCB when the overall offset of a local area of the PCB is less than a preset offset threshold.
[0077] The aforementioned PCB expansion and contraction compensation value calculation device can implement the PCB expansion and contraction compensation value calculation method described above. Specific limitations and other details of the aforementioned PCB expansion and contraction compensation value calculation device embodiment can be found in the PCB expansion and contraction compensation value calculation method described above, and will not be repeated in the embodiment.
[0078] This application also provides an electronic device, including a memory and a processor. The memory is used to store a computer program, and the processor runs the computer program to enable the electronic device to perform the above-described method for calculating PCB expansion and contraction compensation values.
[0079] Optionally, the aforementioned electronic device may be a computer device such as a server.
[0080] In one embodiment, the internal structure of the computer device of this application can be as follows: Figure 4 As shown.
[0081] This application also provides a computer-readable storage medium storing a computer program that, when executed by a processor, implements the above-described method for calculating PCB expansion and contraction compensation values.
[0082] In the several embodiments provided in this application, it should be understood that the disclosed apparatus and methods can also be implemented in other ways. The apparatus embodiments described above are merely illustrative. For example, the flowcharts and block diagrams in the accompanying drawings illustrate the architecture, functionality, and operation of possible implementations of apparatus, methods, and computer program products according to various embodiments of this application. In this regard, each block in a flowchart or block diagram may represent a module, segment, or portion of code containing one or more executable instructions for implementing a specified logical function. It should also be noted that in some alternative implementations, the functions marked in the blocks may occur in a different order than those marked in the drawings. For example, two consecutive blocks may actually be executed substantially in parallel, and they may sometimes be executed in reverse order, depending on the functions involved. It should also be noted that each block in a block diagram and / or flowchart, and combinations of blocks in block diagrams and / or flowcharts, can be implemented using a dedicated hardware-based system that performs the specified function or action, or using a combination of dedicated hardware and computer instructions.
[0083] In addition, the functional modules in the various embodiments of this application can be integrated together to form an independent part, or each module can exist independently, or two or more modules can be integrated to form an independent part.
[0084] If the aforementioned functions are implemented as software functional modules and sold or used as independent products, they can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, or a portion of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods described in the various embodiments of this application. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.
[0085] The above description is merely an embodiment of this application and is not intended to limit the scope of protection of this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the scope of protection of this application. It should be noted that similar reference numerals and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.
[0086] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.
[0087] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Similarly, in the description of this application, the terms "first," "second," etc., are used only for descriptive distinction and should not be construed as indicating or implying relative importance. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.
Claims
1. A method for calculating PCB expansion and contraction compensation values, characterized in that, include: Obtain the actual target coordinates and theoretical target coordinates corresponding to multiple predetermined target points on the PCB; The overall offset of the PCB is calculated based on the actual target coordinates and theoretical target coordinates corresponding to multiple predetermined target points. When the total offset of the PCB is greater than or equal to the preset offset threshold, the compensation processing coordinates of the PCB are calculated using the translation compensation method. When the total offset of the PCB is less than the preset offset threshold, the affine transformation compensation method is used to calculate the compensated processing coordinates of the PCB.
2. The method for calculating PCB expansion and contraction compensation value according to claim 1, characterized in that, The step of calculating the overall offset of the PCB based on the actual target coordinates and theoretical target coordinates corresponding to multiple predetermined target points includes: Based on the actual target coordinates and theoretical target coordinates corresponding to multiple predetermined target points, calculate the target point offsets corresponding to the multiple predetermined target points respectively. The overall offset of the PCB is calculated based on the target offset corresponding to multiple predetermined target points.
3. The method for calculating PCB expansion and contraction compensation value according to claim 2, characterized in that, The step of calculating the overall offset of the PCB based on the target point offsets corresponding to multiple predetermined target points includes: Calculate the average offset corresponding to multiple predetermined target points based on the target point offsets corresponding to multiple predetermined target points. The overall offset of the PCB is calculated based on the average offset corresponding to multiple predetermined target points.
4. The method for calculating PCB expansion and contraction compensation value according to claim 3, characterized in that, The calculation of the PCB's compensated machining coordinates using the translation compensation method includes: The theoretical coordinates of the corresponding processing position on the PCB are added to the average offsets of multiple predetermined target points to calculate the compensated processing coordinates of the PCB.
5. The method for calculating PCB expansion and contraction compensation value according to claim 1, characterized in that, The calculation of the PCB's compensated machining coordinates using the affine transformation compensation method includes: Construct a system of linear equations, as follows: ； ； Where a, b, c, d, e, and f are affine transformation parameters, (Xi, Yi) are the theoretical target coordinates of the i-th predetermined target, and (Xi', Yi') are the actual target coordinates of the i-th predetermined target. Based on the actual target coordinates and theoretical target coordinates corresponding to multiple predetermined target points, as well as the linear equation system, the specific values of a, b, c, d, e, and f are obtained by solving. Substituting the specific values of a, b, c, d, e, and f into the system of linear equations, we obtain the calculation equation for the compensation coordinates of the PCB. Substitute the theoretical coordinates of the corresponding processing position on the PCB into the PCB compensation coordinate calculation equation to obtain the corresponding compensation processing coordinates of the PCB.
6. The method for calculating PCB expansion and contraction compensation value according to claim 1, characterized in that, The method further includes: Determine if there are localized expansion / contraction deviations after PCB expansion / contraction compensation; If there is a local expansion / contraction deviation, obtain the actual target coordinates and theoretical target coordinates corresponding to multiple detection target points in the local area of the PCB. Based on the actual target coordinates and theoretical target coordinates corresponding to multiple detection target points, the overall offset of the local area of the PCB is calculated. When the overall offset of a local area of the PCB is greater than or equal to a preset offset threshold, the compensation processing coordinates of the local area of the PCB are calculated using the translation compensation method. When the overall offset of a local area of the PCB is less than a preset offset threshold, the compensation machining coordinates of the local area of the PCB are calculated using the affine transformation compensation method.
7. The method for calculating PCB expansion and contraction compensation value according to claim 1, characterized in that, The number of predetermined target points is four, and the four predetermined target points are located at the four corners of the PCB.
8. A device for calculating PCB expansion and contraction compensation values, characterized in that, include: The target coordinate acquisition module is used to acquire the actual target coordinates and theoretical target coordinates corresponding to multiple predetermined target points on the PCB. The offset calculation module is used to calculate the overall offset of the PCB based on the actual target coordinates and theoretical target coordinates corresponding to multiple predetermined target points. The translation compensation module is used to calculate the compensation processing coordinates of the PCB using the translation compensation method when the total offset of the PCB is greater than or equal to a preset offset threshold. The affine transformation compensation module is used to calculate the compensated processing coordinates of the PCB using the affine transformation compensation method when the total offset of the PCB is less than a preset offset threshold.
9. An electronic device, characterized in that, The device includes a memory and a processor, the memory being used to store a computer program, and the processor running the computer program to cause the electronic device to perform the method for calculating the PCB expansion / contraction compensation value according to any one of claims 1 to 7.
10. A computer-readable storage medium, characterized in that, It stores a computer program that, when executed by a processor, implements the method for calculating the PCB expansion / contraction compensation value as described in any one of claims 1 to 7.