Distribution box and assembly thereof

Abstract

The application provides a distribution box and an assembly thereof, and belongs to the technical field of distribution boxes. The distribution box comprises a cabinet body, a main cavity, a secondary cavity and an isolation plate. The main cavity and the secondary cavity are arranged along the front-rear direction of the cabinet body. An end face of the isolation plate close to the secondary cavity serves as a measurement surface. An infrared thermal imaging temperature measurement system, a partitioned liquid cooling system, a movable frame, a driving assembly and a main control board are arranged in the secondary cavity. The main cavity and the secondary cavity arranged in front and back are matched with the high-thermal-conductivity isolation plate to realize physical isolation of electrical components and a heat dissipation system. The high-protection level of the distribution box is ensured without affecting the normal installation and operation of the electrical components. The movable infrared thermal imaging temperature measurement system realizes global temperature monitoring of the measurement surface and accurate identification of high-temperature areas. The partitioned liquid cooling modules distributed in a matrix form are matched to realize targeted and accurate cooling of the high-temperature areas, greatly improve the heat dissipation efficiency and reduce the heat dissipation energy consumption, and ensure the long-term stable operation of the distribution box.

Description

Technical Field

[0001] This invention relates to the field of distribution box technology, and more specifically to distribution boxes and their components. Background Technology

[0002] As a core terminal device in power transmission and distribution systems, distribution boxes are widely used in industrial production, new energy photovoltaic energy storage, data centers, municipal infrastructure, and other scenarios. They integrate various electrical components such as circuit breakers, contactors, and frequency converters. These components generate significant Joule losses and switching losses during operation, requiring a stable cooling system to ensure safe operation. Furthermore, outdoor and cluster deployment scenarios place stringent demands on the protection level, heat dissipation efficiency, operational reliability, and maintenance-free performance of distribution boxes. Existing distribution boxes mostly employ air cooling, which cannot achieve targeted and precise cooling for high-temperature areas, resulting in high energy consumption and low efficiency. Summary of the Invention

[0003] The purpose of this invention is to overcome the shortcomings and deficiencies of the existing technology and to provide a distribution box and its components.

[0004] The technical solution adopted by this invention is as follows: Firstly, this application provides a distribution box, including a cabinet, a main cavity, a secondary cavity, and an isolation plate. The main cavity and the secondary cavity are arranged along the front-rear direction of the cabinet. The isolation plate is made of a high thermal conductivity metal and is sealed inside the cabinet, sealing and isolating the main cavity and the secondary cavity. The end face of the isolation plate near the secondary cavity serves as a measuring surface. An infrared thermal imaging temperature measurement system, a zoned liquid cooling system, a movable frame, a drive assembly, and a main control board are disposed within the secondary cavity. The movable frame is slidably disposed in the secondary cavity along the front-rear direction of the cabinet. The drive assembly is used to drive the movable frame to move back and forth. The infrared thermal imaging temperature measurement system is fixed to the movable frame. In the middle of the frame, a temperature data monitoring and temperature heat map is generated for the measurement surface. The partitioned liquid cooling system includes multiple partitioned liquid cooling modules and liquid cooling circuits. The multiple partitioned liquid cooling modules are evenly distributed on the side of the moving frame facing the measurement surface. The liquid cooling circuit is connected to each partitioned liquid cooling module to provide coolant to the partitioned liquid cooling modules. The main control board is electrically connected to the infrared thermal imaging temperature measurement system, the partitioned liquid cooling system, and the drive component, respectively. It is used to control the coolant supply of the partitioned liquid cooling modules according to the temperature heat map and control the drive component to drive the moving frame to move closer to the measurement surface, so as to target the cooling of the target area through the partitioned liquid cooling modules.

[0005] In some embodiments, the main control board is further configured to: when the identified high-temperature area spans the corresponding areas of two or more adjacent partition liquid cooling modules, the main control board simultaneously activates all partition liquid cooling modules covering the high-temperature area, and differentially adjusts the coolant flow rate of each partition according to the temperature distribution of the high-temperature area, so as to achieve precise cooling of the boundary area without blind spots.

[0006] In some embodiments, the secondary cavity includes a central cooling cavity and a high-voltage wiring cavity and a low-voltage wiring cavity located outside the cooling cavity. Each cavity is sealed and isolated from the others. The infrared thermal imaging temperature measurement system, the partitioned liquid cooling system, the moving frame, the drive assembly, and the main control board are disposed in the cooling cavity.

[0007] In some embodiments, the plurality of partitioned liquid cooling modules are uniformly distributed in a matrix, each partitioned liquid cooling module corresponding to an independent area of ​​the measurement surface, and each partitioned liquid cooling module includes a microchannel liquid cooling plate, an elastic thermally conductive bonding layer, a pressure buffer chamber, a control valve, and a miniature infrared temperature measurement unit; the elastic thermally conductive bonding layer is disposed on the side of the microchannel liquid cooling plate facing the measurement surface, the pressure buffer chamber is connected to the liquid inlet end of the microchannel liquid cooling plate, a pressure detection component is provided in the pressure buffer chamber, the pressure detection component is electrically connected to the main control board, and the control valve is used to control the flow of coolant in the corresponding partitioned liquid cooling module.

[0008] In some embodiments, the liquid cooling circuit includes a main liquid supply pipeline, a main liquid return pipeline, multiple liquid supply branch pipelines corresponding one-to-one with the partitioned liquid cooling modules, multiple liquid return branch pipelines, a liquid cooling drive pump, a buffer damping component, and an expansion and pressure stabilizing tank. The liquid-cooled drive pump has its outlet end connected to the main liquid supply pipeline, its inlet end connected to the outlet side of the external cooling heat exchange interface, and its outlet end connected to the return side of the main liquid return pipeline. The main liquid supply pipeline is connected to the inlet of the corresponding zone liquid cooling module through each liquid supply branch pipeline, and the main liquid return pipeline is connected to the outlet of the corresponding zone liquid cooling module through each liquid return branch pipeline. The buffer damping element is connected in series between the liquid outlet of the liquid-cooled drive pump and the main liquid supply pipeline, and the expansion pressure stabilizing tank is connected in parallel with the main liquid supply pipeline. The control valves are connected in series on each of the liquid supply branch pipelines.

[0009] In some embodiments, the main control board is configured as follows: First, control the drive component to drive the moving frame to the first position away from the measurement surface, and use the infrared thermal imaging temperature measurement system to complete the full-area temperature measurement of the measurement surface and generate a temperature heat map to identify the high-temperature area of ​​the measurement surface; Then, control the drive component to drive the moving frame to the second position close to the measurement surface, and perform coordinate and temperature verification and locking of the high-temperature area to eliminate temperature measurement errors; Next, the drive assembly is controlled to drive the moving frame to the third position that is in contact with the measurement surface, so that the elastic thermally conductive bonding layer of the partitioned liquid cooling module is in close contact with the measurement surface; Finally, based on the location and temperature of the high-temperature area, the control valve of the corresponding zone liquid cooling module is opened to adjust the coolant flow rate for targeted cooling.

[0010] In some embodiments, the main control board has a built-in health prediction module, which is configured to: pre-store a health status thermal characteristic benchmark database matching various electrical appliances in the main cavity, the benchmark database being updated to adapt to changes in on-site working conditions and equipment status; collect full-cycle temperature thermal maps of the measurement surface at preset cycles through an infrared thermal imaging temperature measurement system, and extract multi-dimensional thermal characteristic parameters corresponding to each temperature measurement area; compare the real-time extracted thermal characteristic parameters with the health status thermal characteristic benchmark database, and identify early deterioration abnormal states of electrical appliances within the national standard temperature rise limit through multi-cycle continuous judgment anti-false judgment rules; determine specific fault types based on the multi-dimensional thermal characteristic parameters, and dynamically adjust the cooling parameters of the corresponding partition liquid cooling module according to the abnormal state level and fault type, matching differentiated graded cooling strategies, early warning levels, and maintenance prompts.

[0011] In some embodiments, the main control board has a built-in self-learning optimization module, which is configured to: continuously collect core operating data of the entire life cycle of the distribution box, construct a standardized dataset according to the time dimension; adopt a lightweight edge machine learning algorithm adapted to the embedded main control board, complete the training and iteration of the cooling scheduling model locally on the main control board, and establish a multi-objective coupled optimization function with constraints with the three core optimization objectives of maximizing the service life of electrical appliances, minimizing the energy consumption of the cooling system, and optimizing the operational stability; dynamically schedule differentiated cooling strategies according to real-time operating conditions, and continuously iterate and optimize the model parameters through real-time operating data.

[0012] Secondly, this application also provides a power distribution box assembly, including several power distribution boxes, a main cooling base station, and a cooling box and a return box corresponding to each power distribution box; the main cooling base station is connected to a ring-shaped cluster liquid supply main pipeline and a ring-shaped cluster liquid return main pipeline, which are respectively connected to the liquid cooling circuit of each power distribution box to form a conventional cooling cycle for the power distribution box; the liquid inlet of the cooling box is connected to the ring-shaped cluster liquid supply main pipeline, and its liquid outlet is connected to the liquid inlet of the corresponding power distribution box's liquid cooling circuit, for providing low-temperature cold liquid to the power distribution box to achieve rapid cooling; the liquid inlet of the return box is connected to the liquid outlet of the corresponding power distribution box's liquid cooling circuit, and its liquid outlet is connected to the ring-shaped cluster liquid return main pipeline, for storing high-temperature hot liquid after heat exchange during rapid cooling.

[0013] In some embodiments, a cooling replenishment control valve and an acceleration control valve are respectively provided on the two connecting pipes of the cooling box; a buffer control valve and a drain control valve are respectively provided on the two connecting pipes of the return box; all control valves are electrically connected to the main control board of the corresponding distribution box. During normal operation, the distribution box is cooled only by the main cooling base station; When the distribution box needs to be cooled down quickly, the acceleration control valve and the buffer control valve are opened to supply the cold box with low-temperature coolant to achieve rapid cooling. The high-temperature hot liquid after heat exchange is directly stored in the return box. After cooling is completed, the corresponding valves are closed and the normal cooling mode is switched back. After cooling is completed, the drain control valve will automatically open during periods of low load and low electricity price to drain the hot liquid stored in the return tank back to the main cooling base station, thus completing the cooling and regeneration process. When the main cooling base station fails, the connection between the power distribution box and the cluster pipeline is cut off, and the control valves corresponding to the cooling box and return box are opened to form an independent emergency cooling cycle.

[0014] The beneficial effects of this invention are as follows: By arranging the main cavity and secondary cavity at the front and rear, and cooperating with a high thermal conductivity isolation plate, this invention achieves physical isolation between electrical components and the heat dissipation system, ensuring a high protection level for the distribution box without affecting the normal installation and maintenance of electrical components; by using a movable infrared thermal imaging temperature measurement system, it achieves full-area temperature monitoring and accurate identification of high-temperature areas on the measurement surface, and with the matrix-distributed partitioned liquid cooling modules, it achieves targeted and precise cooling of high-temperature areas, greatly improving heat dissipation efficiency, reducing heat dissipation energy consumption, ensuring the long-term stable operation of the distribution box, and extending the service life of the equipment. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, obtaining other drawings based on these drawings without creative effort still falls within the scope of the present invention.

[0016] Figure 1 This is a schematic diagram of the distribution box in this invention; Figure 2 This is a cross-sectional view of the distribution box in this invention. Figure 1 ; Figure 3 This is a cross-sectional view of the distribution box in this invention. Figure 2 ; Figure 4 This is a structural diagram of the distribution box in this invention; Figure 5 This is a schematic diagram of the health prediction module in this invention; Figure 6 This is a schematic diagram of the self-learning optimization module in this invention. Detailed Implementation

[0017] The following description provides specific application scenarios and requirements for this specification, intended to enable those skilled in the art to make and use the contents of this specification. Various partial modifications to the disclosed embodiments will be apparent to those skilled in the art, and the general principles defined herein can be applied to other embodiments and applications without departing from the spirit and scope of this specification. Therefore, this specification is not limited to the embodiments shown, but rather to the widest scope consistent with the claims.

[0018] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "longitudinal", "lateral", "radial", "length", "width", "thickness", "upper", "lower", "left", "right", "front", "rear", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are mainly for the purpose of better describing this application and its embodiments, and are not intended to limit the indicated device, element or component to have a specific orientation, or to be constructed and operated in a specific orientation.

[0019] It should be noted that the terms "first," "second," and similar words do not indicate any order, quantity, or importance, but are only used to distinguish different components and should not be construed as limiting the embodiments of this application.

[0020] It should be noted that the terms "installation," "setup," "equipped with," "connection," and "connected" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral structures; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium, or internal connections between two devices, components, or parts.

[0021] It should be noted that the terms "in some embodiments," "exemplarily," and "for example" are used to indicate examples, illustrations, or descriptions. Any embodiment or design described in this application as "in some embodiments," "exemplarily," or "for example" should not be construed as being more preferred or advantageous than other embodiments or designs. Specifically, the use of terms such as "in some embodiments," "exemplarily," and "for example" is intended to present related concepts in a specific manner, meaning that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of the above terms in various places in the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. Those skilled in the art will explicitly and implicitly understand that the embodiments described herein can be combined with other embodiments.

[0022] Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0023] Regarding the accompanying drawings of this application, it should be clearly understood that the drawings are for illustrative and descriptive purposes only and are not intended to limit the scope of this specification. It should also be understood that the drawings are not necessarily drawn to scale.

[0024] In existing technologies, distribution boxes generally suffer from low heat dissipation efficiency and poor heat dissipation effect during long-term operation.

[0025] Based on the above issues, such as Figures 1 to 6 As shown, this application proposes a distribution box, including a cabinet 1, a main cavity 2, a secondary cavity 3 and an isolation plate 4. The main cavity 2 and the secondary cavity 3 are arranged along the front and rear direction of the cabinet 1. The isolation plate 4 is made of a high thermal conductivity metal and is sealed inside the cabinet 1 to seal and isolate the main cavity 2 and the secondary cavity 3. The end face of the isolation plate 4 near the secondary cavity 3 serves as a measuring surface.

[0026] For example, the high thermal conductivity metal material can be selected from metal materials with excellent thermal conductivity such as 6061 aluminum alloy, 304 stainless steel, and copper. The main cavity 2 is used to install various electrical components such as circuit breakers, contactors, and frequency converters. The mounting base of the electrical components is tightly fitted with the isolation plate 4, so that the heat generated by the operation of the components can be quickly conducted to the secondary cavity 3 through the isolation plate 4.

[0027] The secondary cavity 3 is equipped with an infrared thermal imaging temperature measurement system 5, a zoned liquid cooling system 6, a movable frame 7, a drive assembly, and a main control board. The movable frame 7 is slidably mounted in the secondary cavity 3 along the front-to-back direction of the cabinet 1. The drive assembly is used to drive the movable frame 7 to move back and forth. The infrared thermal imaging temperature measurement system 5 is fixed in the middle of the movable frame 7 and is used to monitor the temperature data of the measurement surface and generate a temperature thermogram. Specifically, the infrared thermal imaging temperature measurement system 5 includes an infrared thermal imaging module, a wide-angle focusing lens, and a sealed protective shell, which can realize temperature acquisition of the entire measurement surface without blind spots. The drive assembly includes a drive motor, a transmission screw, and a guide rail. The guide rail is fixed to the inner wall of the secondary cavity 3 along the front-to-back direction of the cabinet 1. The movable frame 7 slides with the guide rail. The drive motor is connected to the movable frame 7 through the transmission screw to realize the precise translation of the movable frame 7.

[0028] The drive assembly's transmission screw is equipped with an absolute encoder, which is electrically connected to the main control board to provide real-time feedback on the precise position coordinates of the moving frame 7. During factory commissioning of the power distribution box, the reference coordinates of the three working positions of the moving frame 7, as well as the one-to-one correspondence coordinate mapping relationship between each partition liquid cooling module and the temperature measurement area of ​​the measuring surface, are pre-calibrated to ensure that the positioning coordinates of the high-temperature area are completely matched with the contact position of the corresponding partition liquid cooling module.

[0029] The partitioned liquid cooling system 6 includes multiple partitioned liquid cooling modules and liquid cooling circuits. The partitioned liquid cooling modules are evenly distributed on the side of the moving frame 7 facing the measurement surface. The liquid cooling circuits are connected to each partitioned liquid cooling module to provide coolant. The main control board is electrically connected to the infrared thermal imaging temperature measurement system 5, the partitioned liquid cooling system 6, and the drive assembly. It controls the coolant supply to the partitioned liquid cooling modules based on the temperature thermogram and controls the drive assembly to move the moving frame 7 closer to the measurement surface, thus achieving targeted cooling of the target area through the partitioned liquid cooling modules.

[0030] When a high-temperature area is identified that spans the corresponding areas of two or more adjacent liquid cooling modules, the main control board simultaneously activates all liquid cooling modules covering the high-temperature area. Based on the temperature distribution of the high-temperature area, the coolant flow rate of each zone is adjusted differently to achieve precise cooling without blind spots in the boundary area.

[0031] Furthermore, the secondary cavity 3 includes a cooling cavity in the middle, and high-voltage wiring cavities and low-voltage wiring cavities located outside the cooling cavity. The cooling cavity, high-voltage wiring cavities, and low-voltage wiring cavities are separated by sealing partitions, and each cavity is sealed and isolated from the others. The infrared thermal imaging temperature measurement system 5, the partitioned liquid cooling system 6, the moving frame 7, the drive assembly, and the main control board are disposed within the cooling cavity. The main control board is encapsulated in an IP67-rated waterproof sealed box to prevent short-circuit faults caused by coolant leakage. The isolation plate 4 and the partitions between the cooling cavity and the high-voltage and low-voltage wiring cavities are all provided with sealed cable passage holes with IP67 sealing plugs to achieve sealed cable passage between the main cavity 2 and the wiring cavities, ensuring the sealing and isolation effect between each cavity. An environmental temperature and humidity sensor is also installed in the secondary cavity 3. The environmental temperature and humidity sensor is electrically connected to the main control board to collect environmental parameters within the secondary cavity 3 in real time.

[0032] In some embodiments, multiple partitioned liquid cooling modules are uniformly distributed in a matrix, each partitioned liquid cooling module corresponding to an independent temperature measurement and cooling area of ​​the measurement surface. Each partitioned liquid cooling module includes a microchannel liquid cooling plate, an elastic thermally conductive bonding layer, a pressure buffer chamber, a control valve, and a miniature infrared temperature measurement unit. The control valve is used to control the on / off state and flow rate adjustment of the coolant in the corresponding partitioned liquid cooling module. The elastic thermally conductive bonding layer is located on the side of the microchannel liquid cooling plate facing the measurement surface. The miniature infrared temperature measurement unit is embedded in the center of the microchannel liquid cooling plate, with its temperature probe facing the measurement surface and flush with the bonding end face of the microchannel liquid cooling plate. The elastic thermally conductive bonding layer is made of infrared transparent high thermal conductivity material, or a micron-level infrared light-transmitting hole is opened at the position of the temperature probe to ensure that the temperature probe can collect real-time temperature data of the corresponding measurement surface area without obstruction. The miniature infrared temperature measurement unit is electrically connected to the main control board.

[0033] The pressure buffer chamber is connected to the liquid inlet end of the microchannel liquid cooling plate. A pressure detection component is provided in the pressure buffer chamber and is electrically connected to the main control board. The pressure detection component is used to collect the liquid inlet pressure data of the corresponding partition liquid cooling module in real time. On the one hand, it is used to provide feedback on the coolant supply status and determine whether there is any blockage or leakage in the pipeline. On the other hand, it is used to monitor the pipeline pressure status after the moving frame 7 is in place. When the pressure exceeds the preset threshold, overpressure protection is triggered to avoid the elastic thermally conductive bonding layer being damaged by excessive compression.

[0034] For example, the miniature infrared temperature measurement unit can be a MEMS miniature infrared temperature measurement probe or a pinhole miniature thermal imaging module, the pressure detection component can be a miniature pressure sensor, and the control valve can be a valve with linearly adjustable opening, such as an electromagnetic proportional valve or a servo control valve.

[0035] Specifically, the liquid cooling circuit is a closed-loop circulation circuit, including a main liquid supply pipeline, a main liquid return pipeline, multiple supply branch pipelines corresponding to the partitioned liquid cooling modules, multiple return branch pipelines, a liquid cooling drive pump, a buffer damping component, an expansion and pressure stabilizing tank, a flow sensor, and inlet and outlet liquid temperature sensors. The outlet end of the liquid cooling drive pump is connected to the main liquid supply pipeline, and the inlet end is connected to the liquid outlet side of the external cooling heat exchange interface inside the cabinet. The outlet end of the main liquid return pipeline is connected to the liquid return side of the external cooling heat exchange interface inside the cabinet. When a single cabinet is used independently, the external... The cooling heat exchange interface can be directly connected to an external cold source to form an independent closed-loop circulation for each cabinet; the main liquid supply pipeline is connected to the inlet of the corresponding liquid cooling module through each liquid supply branch pipeline, and the main liquid return pipeline is connected to the outlet of the corresponding liquid cooling module through each liquid return branch pipeline; the flow sensor is located at the outlet of the liquid cooling drive pump, and the inlet and outlet liquid temperature sensors are respectively located on the main liquid supply pipeline and the main liquid return pipeline. The flow sensor and the inlet and outlet liquid temperature sensors are electrically connected to the main control board to provide data support for cooling efficiency calculation and flow regulation.

[0036] The buffer damping component is connected in series between the outlet end of the liquid-cooled drive pump and the main liquid supply pipeline. The buffer damping component is a volumetric hydraulic pulsation buffer structure, and its core functions include: first, absorbing the inherent flow pulsation and pressure fluctuation generated during the operation of the liquid-cooled drive pump, controlling the pressure fluctuation in the pipeline within a preset range, and avoiding loosening of pipeline joints and fatigue aging of seals caused by long-term alternating pressure; second, cooperating with the linearly regulating control valve to reduce the instantaneous water hammer impact generated during the opening and closing of the control valve, reducing the peak pressure, and avoiding pipeline overpressure damage.

[0037] The expansion pressure stabilizing tank is connected in parallel with the main liquid supply pipeline. The expansion pressure stabilizing tank is a closed pressure vessel with an elastic diaphragm. Its core functions include: first, dynamically compensating for the volume changes of the coolant due to thermal expansion and contraction caused by temperature changes, always maintaining the pressure stability in the main liquid supply pipeline, and avoiding sudden increases and decreases in system pressure due to temperature fluctuations; second, eliminating negative pressure in the pipeline, preventing cavitation caused by coolant vaporization, and protecting the liquid-cooled drive pump and microchannel liquid cooling plate from cavitation damage; and third, acting as a secondary buffer unit, forming a double protection with the buffer damping components, further absorbing residual pressure shocks in the pipeline, and ensuring the long-term stable operation of the liquid cooling circuit.

[0038] The control valves are connected in series on each of the liquid supply branch pipelines to achieve slow opening and closing of the coolant in the corresponding zone liquid cooling module. For example, the coolant can be an insulating heat exchange medium such as ethylene glycol aqueous solution, insulating cooling oil, or insulating deionized water, and the liquid cooling drive pump can be a sealless magnetic drive pump to eliminate the risk of coolant leakage.

[0039] It is understandable that the various pipelines related to the mobile frame 7 are preferably made of flexible hydraulic hoses that are resistant to high pressure and bending. Some main pipelines can be equipped with drag chains to limit and guide the flexible pipelines. The drag chains are fixed to the inner wall of the cooling chamber along the sliding direction of the mobile frame 7. The flexible pipelines are inserted into the drag chains and bend and move synchronously with the forward and backward translation of the mobile frame 7 to avoid pipeline wear and entanglement.

[0040] In a preferred embodiment, the main control board is configured to: first, control the drive assembly to drive the moving frame 7 to a first position away from the measurement surface, and complete the full-area temperature measurement of the measurement surface and generate a temperature heat map through the infrared thermal imaging temperature measurement system 5 to identify the high-temperature area of ​​the measurement surface; then, control the drive assembly to drive the moving frame 7 to a second position close to the measurement surface, and perform coordinate and temperature verification and locking of the high-temperature area to eliminate temperature measurement errors; next, control the drive assembly to drive the moving frame 7 to a third position in contact with the measurement surface, so that the elastic thermally conductive bonding layer of the partitioned liquid cooling module is tightly bonded to the measurement surface; finally, according to the position and temperature of the high-temperature area, open the control valve of the corresponding partitioned liquid cooling module to adjust the coolant flow rate for targeted cooling.

[0041] During the cooling process, the main control board continuously collects temperature data of the target cooling area through the miniature infrared temperature measurement unit of the liquid cooling module corresponding to the cooling zone in real time. This verifies the cooling effect and dynamically adjusts the coolant flow rate. The entire process does not require the movement of the frame 7, and the cooling process is uninterrupted. The infrared thermal imaging temperature measurement system 5 has already acquired the initial temperature data of the corresponding position of the miniature infrared temperature measurement unit. At the same time, the temperature data of the entire measurement surface can be collected synchronously through the miniature infrared temperature measurement units of all the liquid cooling modules in the zones. This data is then stitched together to form a global temperature field to monitor for the occurrence of secondary high-temperature areas. After the cooling is completed, the control drive component drives the moving frame 7 to reset to the first position. The infrared thermal imaging temperature measurement system 5 completes the global temperature measurement verification. Once the temperature of the entire area is confirmed to meet the standard, the system enters the normal inspection state.

[0042] Specifically, the verification process is achieved by shifting the infrared thermal imaging temperature measurement system 5 back and forth: the first position for full-area temperature measurement is a long-distance position, and the wide-angle focusing lens of the infrared thermal imaging temperature measurement system 5 can cover the entire measurement surface, realizing the initial screening of the full-area temperature and locating the approximate coordinates of the high-temperature area; when the moving frame 7 is shifted to the second position, the straight-line distance between the infrared thermal imaging temperature measurement system 5 and the measurement surface is greatly shortened. Through the focal length adaptation of the wide-angle focusing lens, the high-temperature area located at the first position can be locally magnified and imaged, and the pixel resolution is improved by 3 to 10 times compared with the first position. It can accurately capture the local temperature changes at the millimeter level, while eliminating the distortion error caused by the long-distance wide-angle imaging and the interference of environmental infrared radiation, completing the accurate coordinate locking and temperature verification of the high-temperature area, and ensuring the accurate matching of the subsequent targeted cooling position and flow rate adjustment.

[0043] In some embodiments, the main control board has a built-in health prediction module, which is configured as follows: Step 1: Pre-calibration of the health status thermal characteristic benchmark database. During the factory commissioning phase of the distribution box, under standard ambient temperature (20℃±3℃) and stable thermal balance conditions, the infrared thermal imaging temperature measurement system collects temperature thermal maps of the entire measurement surface area under three standard operating conditions: no-load, rated load, and short-term operating conditions of 1.2 times the rated load (single duration ≤30min, liquid cooling system operating normally). For the temperature measurement area corresponding to each electrical appliance in the main cavity, the benchmark thermal characteristic parameters under the health status are calculated and stored, including: temperature gradient distribution benchmark value, hot spot benchmark location, temperature difference dispersion coefficient benchmark value of equipment in the same circuit / same model, and hysteresis characteristic benchmark curve of temperature rise-load change, forming a health status thermal characteristic benchmark database that matches various electrical appliances in the main cavity. At the same time, the coordinates of each electrical appliance in the corresponding temperature measurement area on the measurement surface and the load synchronization correction coefficient of the three-phase electrical appliances in the same circuit are pre-calibrated in the database to ensure accurate regional correspondence of thermal characteristic comparison and no data interference.

[0044] Before the distribution box is put into operation on site, a second no-load / rated load calibration is performed. After thermal balance is achieved under the actual installation environment and rated operating conditions on site, a temperature thermogram is collected and the baseline parameters and correction coefficients of the database are updated to adapt to the actual installation conditions on site. When the electrical components of the main cavity are replaced or the installation position is adjusted, the main control board triggers a one-click recalibration to complete the synchronous update of the database.

[0045] For each reference thermal characteristic parameter, a pre-calibrated reference threshold is set: the reference threshold is ±15% of the reference value, which can be adjusted according to the type of appliance and voltage level. When the real-time parameter exceeds the reference threshold, it is judged as an abnormal parameter.

[0046] Step 2: Full-cycle thermal characteristic data acquisition and extraction. Using the infrared thermal imaging temperature measurement system 5, following a preset normal inspection cycle (e.g., selectable range: 30min-4h, factory default 1h), the moving frame is continuously controlled to move to the first position to collect full-cycle temperature thermal map data of the measuring surface of the isolation plate 4. Simultaneously, load current and ambient temperature and humidity data are collected at the corresponding times. After completing environmental and load interference corrections, four types of thermal characteristic parameters are extracted for each temperature measurement area. The specific calculation method is as follows: Temperature gradient distribution: Calculate the ratio of the temperature difference between adjacent pixels in the temperature measurement area to the physical distance between the pixels, and take the maximum value in the area as the temperature gradient feature value of the area to characterize the degree of temperature change in the area and identify local temperature peaks. Hotspot migration trajectory: Continuously record the location coordinates of the highest temperature point within the temperature measurement area, generate the location offset trajectory within one normal inspection cycle, calculate the maximum offset distance as the hotspot migration feature value, and characterize the location change pattern of the hotspot; Temperature variation coefficient: The ratio of the standard deviation to the average temperature of a corresponding area of ​​a three-phase electrical appliance in the same circuit or a corresponding area of ​​an electrical appliance of the same model and load, which characterizes the temperature consistency of similar equipment. Temperature rise hysteresis characteristic: The temperature rise data of the temperature measurement area and the load current data of the corresponding electrical appliances are collected synchronously. The sampling frequency is matched to more than twice the sampling frequency of infrared temperature measurement. The time difference between the temperature rise change and the load current change and the Pearson correlation coefficient are calculated to characterize the synchronization characteristics of temperature rise and load.

[0047] The third step is an early anomaly identification and misjudgment prevention mechanism. The real-time extracted thermal feature parameters are compared with the health status thermal feature benchmark database. Through a multi-parameter weighted judgment algorithm, early abnormal states such as hidden aging of electrical appliances, poor contact, and deterioration of internal components are identified, rather than just obvious faults such as excessive temperature. The specific implementation of the multi-parameter weighted judgment algorithm is as follows: For four types of thermal characteristic parameters, preset weights are set according to fault sensitivity, such as temperature gradient distribution 35%, temperature difference dispersion coefficient 30%, temperature rise lag characteristic 25%, and hot spot migration trajectory 10%, to calculate the comprehensive anomaly score of a single region; when the comprehensive anomaly score is ≥60 points, it is determined that there is an early anomaly in the region. The criteria for determining the early abnormal state are: thermal characteristic parameters exceed the benchmark threshold, the comprehensive abnormal score meets the standard, but the absolute temperature of the area does not reach the electrical temperature rise limit specified in the corresponding national standard, that is, the electrical appliance is still operating within the normal temperature range, but internal deterioration has already occurred.

[0048] Simultaneously, a three-level anti-false judgment mechanism is set up: only when the comprehensive anomaly score of the area continuously meets the standard and the thermal characteristic parameters continuously exceed the benchmark threshold for three or more consecutive normal inspection cycles, and parameter deviations caused by changes in ambient temperature and humidity and normal load fluctuations are excluded, is it judged as a valid early anomaly; occasional data anomalies caused by temporary load fluctuations and environmental airflow interference are excluded; after being judged as a valid early anomaly, the collection cycle of the area is switched from the normal inspection cycle to an encrypted inspection cycle, for example, 1 / 10 to 1 / 3 of the normal inspection cycle, with a factory default of 10 minutes, to continuously track changes in thermal characteristics.

[0049] Step 4: Anomaly Classification and Accurate Fault Type Determination. Based on the comprehensive anomaly score of the identified early anomalies, three anomaly levels are classified: mild anomaly (60-79 points), moderate anomaly (80-89 points), and severe anomaly (≥90 points). The cooling strategy of the corresponding liquid cooling module is adjusted in advance. Gradient enhanced cooling is implemented in areas with early anomalies: the coolant flow rate of the corresponding zone is increased by 20% for mild anomalies, 50% for moderate anomalies, and 100% for severe anomalies. At the same time, the thermal characteristics of the area are continuously monitored according to the intensive inspection cycle. When the anomaly continues to worsen, the cooling priority and coolant flow rate of the corresponding area are gradually increased to slow down the rate of electrical degradation.

[0050] The main control board is electrically connected to the current acquisition units of each circuit in the main cavity and the ambient temperature and humidity sensor in the secondary cavity, synchronously acquiring load current and ambient humidity data. Based on the extracted four types of thermal characteristic parameters, a fault type feature matching rule is established, and the specific fault type is determined by combining multiple features. The specific determination method is as follows: When the temperature measurement area shows a sudden change in local temperature gradient, the hot spot position is fixed without shift, the temperature difference dispersion coefficient in the same circuit exceeds the reference threshold by more than 50%, and the Pearson correlation coefficient between the temperature rise hysteresis characteristic and the load current change is ≥0.8, it is judged as a fault of poor contact of the wiring terminal. When the temperature measurement area shows a gradual increase in temperature gradient, the hot spot location shifts and spreads, the temperature difference dispersion coefficient of the same model of equipment continuously exceeds the benchmark threshold by more than 30%, and the correlation coefficient between the temperature rise hysteresis characteristic and load change is ≤0.5, it is judged as a deterioration fault of the internal components of the electrical appliance. When the temperature measurement area shows a uniform increase in temperature gradient across the entire area, no obvious concentration or migration of hot spots, a temperature difference dispersion coefficient exceeding the benchmark threshold by 10%-30%, and a correlation coefficient between the temperature rise lag characteristic and changes in ambient humidity ≥0.7, it is judged as an electrical appliance insulation aging fault. When the temperature measurement area exhibits irregular fluctuations in temperature gradient, random appearance and disappearance of hot spots, drastic changes in the temperature difference dispersion coefficient, and no stable pattern in the temperature rise lag characteristics, it is determined to be an abnormal fault of hidden loose electrical connection.

[0051] When multiple fault characteristics overlap, the core fault type is determined according to the priority of "poor contact > component deterioration > insulation aging > latent loosening". The main control board matches differentiated graded cooling strategies, early warning levels and operation and maintenance prompts according to the specific fault type determined, and simultaneously uploads the fault data to the operation and maintenance platform.

[0052] In some embodiments, the main control board has a built-in self-learning optimization module, which is configured as follows: Step 1: Full-cycle data collection and standardized dataset construction. Continuously collect core operating data of the distribution box throughout its entire life cycle, and construct a standardized dataset according to time windows (factory default 1 hour is one data unit). The core operating data includes: ambient temperature and humidity, real-time load and historical load patterns of each electrical appliance in the main chamber, peak and valley electricity price / power supply cost data, real-time cooling efficiency of each zone liquid cooling module, real-time energy consumption of the liquid cooling system, pre-stored electrical appliance temperature rise-lifetime correlation curves, and electrical appliance health status data and abnormality levels output by the health prediction module. Data cleaning was performed concurrently during dataset construction: outliers were removed using the 3σ criterion, and input features were normalized using min-max normalization to eliminate the influence of different units on model training and ensure the validity of the dataset. The second step is the training and iteration of a lightweight edge machine learning model. A lightweight random forest regression algorithm adapted to the embedded main control board is used to complete the training and iteration of the model locally on the main control board. It does not rely on the cloud platform and can still run normally when the network is disconnected. Model input features: ambient temperature and humidity, load current, appliance health status, historical temperature rise data, and electricity price data for different time periods; Model output objectives: optimal coolant flow rate and optimal output power of liquid-cooled drive pump for each zone's liquid-cooled module; Model hyperparameter settings: The number of decision trees is limited to 10-20, the maximum tree depth is ≤8, pruning is used to compress the model volume, and the computing power and storage limitations of the embedded main control board are adapted. Based on the collected historical dataset, and labeled with the actual temperature rise and energy consumption data after the execution of the cooling strategy, the cooling scheduling model is continuously optimized to learn the intrinsic relationship between load change patterns, temperature rise change patterns, and energy consumption change patterns.

[0053] Step 3: Establishing a multi-objective coupled optimization function. With maximizing the lifespan of electrical components, minimizing cooling system energy consumption, and optimizing operational stability as the three core optimization objectives, and with electrical component operating temperature rise, coolant flow rate, and liquid cooling system pressure as the core control variables, a constrained multi-objective coupled optimization function is established, specifically as follows: Objective function expression: In the formula: L is the expected lifespan of the electrical appliance (calculated by fitting temperature rise data), and P is the real-time energy consumption of the cooling system. This refers to the pressure fluctuation coefficient of the liquid cooling system. , , Weighting coefficient, default value =0.4、 =0.4、 =0.2, the weighting coefficient can be dynamically adjusted according to the health status of appliances output by the health prediction module.

[0054] Constraints: The temperature rise of electrical appliances shall not exceed the temperature rise limit specified in the corresponding national standard; the pressure of the liquid cooling system shall not exceed 80% of the rated pressure; the cooling priority shall conform to the preset importance level of electrical appliances; and the cooling priority of areas with abnormal health conditions shall be the highest.

[0055] Solution method: The multi-objective optimization is transformed into a single-objective solution by using a weighted summation method, and the optimal cooling scheduling parameters are solved by a grid search method to ensure fast solution on the embedded main control board.

[0056] When the health prediction module outputs an increase in the level of electrical appliance abnormality, it automatically increases the level. The weighting coefficient prioritizes ensuring the lifespan of electrical appliances and slows down the rate of degradation.

[0057] Step 4: Dynamic scheduling of differentiated cooling strategies. Based on real-time operating conditions and the optimal parameters output by the model, differentiated cooling strategies are dynamically scheduled. Low load and low power supply cost period: Low load is defined as real-time load ≤ 30% of rated load, and low power supply cost period is the off-peak period of the grid peak-valley electricity price; Based on the historical load patterns learned by the model, the load peak that will be coming within the next 2 hours is predicted, and a targeted pre-cooling strategy is implemented: Only for the electrical areas corresponding to the load peak, the corresponding zone liquid cooling module is turned on in advance to reduce the base temperature of the area to below 60% of the national standard limit, in order to cope with the temperature rise brought by the subsequent load peak, avoid temperature overshoot during the load peak, and at the same time reduce cooling costs by taking advantage of the low electricity price period; High load and high power supply cost periods: High load is defined as real-time load ≥ 80% of rated load, and high power supply cost periods are the peak periods of the grid peak-valley electricity price; Cooling priority is divided into three levels according to "Electrical health anomaly level > Electrical importance > Real-time temperature", and a graded precise cooling strategy is implemented: High-priority areas are cooled with high flow rate, while low-priority areas are only cooled with basic flow rate, such as 20% of rated flow rate, so as to control the temperature rise to meet the standard while minimizing the energy consumption and power supply cost of the cooling system; Extreme ambient temperature conditions: Extreme high temperature is defined as ambient temperature ≥ 50℃, and extreme low temperature is defined as ambient temperature ≤ -20℃; Automatically corrects the temperature warning threshold, basic flow quota and liquid-cooled drive pump output power of each zone: Increases basic flow to prevent coolant freezing under extremely cold conditions, optimizes flow distribution to ensure cooling of core equipment under extremely hot conditions, and is suitable for stable operation in a wide temperature range of -30℃ to +80℃.

[0058] After all cooling strategies are executed, actual temperature rise and energy consumption data are collected synchronously as feedback labels for model iteration. A prediction and error correction mechanism is set up: when the load peak prediction error exceeds 30%, the load prediction weight of the model is automatically corrected to avoid ineffective precooling and increased energy consumption.

[0059] Step 5: Continuous iterative optimization of the model. The weight parameters of the cooling scheduling model are continuously optimized through real-time running data. The model iteration cycle is 7 days, or an emergency iteration is triggered when electrical components are replaced or the anomaly level changes. During the iteration process, 5-fold cross-validation is used to avoid model overfitting. The iterated model needs to be validated after one running cycle. It is only officially used when the prediction accuracy is ≥90% to ensure model stability. The model automatically adapts to parameter changes caused by electrical aging, changes in environmental conditions, performance degradation of the liquid cooling system, and replacement of electrical components, achieving maintenance-free operation throughout its entire life cycle.

[0060] This application also provides a power distribution box assembly, including the aforementioned power distribution box, a main cooling base station, and a cooling box and a return box corresponding to each power distribution box; the cooling box is a pressure-bearing cold storage box with a thermal insulation structure.

[0061] The main cooling base station is connected to a ring-shaped cluster liquid supply main pipeline and a ring-shaped cluster liquid return main pipeline, which are respectively connected to the liquid cooling circuit of each distribution box to form a regular cooling cycle for the distribution box. The inlet of the cooling box is connected to the main liquid supply pipeline of the ring cluster, and its outlet is connected to the liquid cooling circuit inlet of the corresponding electrical distribution box. This is used to provide low-temperature cold liquid to the electrical distribution box to achieve rapid cooling. Both the main liquid supply pipeline and the main liquid return pipeline of the ring cluster are closed loop pipelines to ensure that the liquid supply pressure of all electrical distribution boxes in the cluster is uniform, and there will be no problem of excessive cooling at the near end and insufficient cooling at the far end.

[0062] The inlet of the reflux box is connected to the liquid cooling circuit outlet of the corresponding power distribution box, and its outlet is connected to the main reflux pipeline of the annular cluster, which is used to store the high-temperature hot liquid after heat exchange during the rapid cooling process.

[0063] The cooling box has two connecting pipes, each equipped with a cooling replenishment control valve and an acceleration control valve; the return box has two connecting pipes, each equipped with a buffer control valve and a drain control valve; all control valves are electrically connected to the main control board of the corresponding distribution box.

[0064] During normal operation, all control valves remain closed, and the distribution box is cooled only by the main cooling base station. When the distribution box needs to be cooled down quickly, the acceleration control valve and the buffer control valve are opened to supply the cold box with low-temperature coolant to achieve rapid cooling. The high-temperature hot liquid after heat exchange is directly stored in the return box. After cooling is completed, the corresponding valves are closed and the system switches back to normal cooling mode.

[0065] After cooling is completed, the drain control valve will automatically open during periods of low load and low electricity price to drain the hot liquid stored in the return tank back to the main cooling base station, thus completing the cooling and regeneration process.

[0066] When the main cooling base station fails, disconnect the connection between the power distribution box and the cluster pipeline, open the corresponding control valves of the cooling box and return box to form an independent emergency cooling cycle, and ensure that the power distribution box does not exceed the temperature so that staff can perform maintenance.

[0067] In summary, after reading this detailed disclosure, those skilled in the art will understand that the foregoing detailed disclosure is presented by way of example only and is not restrictive. Although not explicitly stated herein, those skilled in the art will understand that the requirements of this application encompass various reasonable changes, improvements, and modifications to the embodiments. These changes, improvements, and modifications are intended to be made by this application and are within the spirit and scope of the exemplary embodiments of this application.

[0068] Furthermore, it should be understood that in the foregoing description of the embodiments of this application, various features are combined in a single embodiment, drawing, or description for the purpose of simplifying the understanding of a feature. However, this does not mean that the combination of these features is necessary, and those skilled in the art may readily identify some of the devices as separate embodiments when reading this application. That is, the embodiments in this application can also be understood as an integration of multiple sub-embodiments. It is also valid when each sub-embodiment contains fewer than all the features of a single foregoing disclosed embodiment.

[0069] Finally, it should be understood that the embodiments disclosed herein are illustrative of the principles of the embodiments of this application. Other modified embodiments are also within the scope of this application. Therefore, the embodiments disclosed herein are merely examples and not limitations. Those skilled in the art can adopt alternative configurations to implement the applications in this application based on the embodiments in this application. Therefore, the embodiments of this application are not limited to the embodiments precisely described in the application.

Claims

1. A distribution box, characterized in that, The system includes a cabinet, a main cavity, a secondary cavity, and an isolation plate. The main cavity and the secondary cavity are arranged along the front-to-back direction of the cabinet. The isolation plate is made of a high thermal conductivity metal and is sealed inside the cabinet, isolating the main cavity from the secondary cavity. The end face of the isolation plate near the secondary cavity serves as the measuring surface. The secondary cavity houses an infrared thermal imaging temperature measurement system, a zoned liquid cooling system, a moving frame, a drive assembly, and a main control board. The moving frame slides along the front-to-back direction within the secondary cavity. The drive assembly drives the moving frame to move back and forth. The infrared thermal imaging temperature measurement system is fixed in the middle of the moving frame and monitors the temperature data of the measuring surface to generate a temperature thermogram. The zoned liquid cooling system includes multiple sub-cavities... The system includes multiple partitioned liquid cooling modules and a liquid cooling circuit. These modules are evenly distributed on one side of the moving frame facing the measurement surface. The liquid cooling circuit is connected to each partitioned liquid cooling module to provide coolant. The main control board is electrically connected to the infrared thermal imaging temperature measurement system, the partitioned liquid cooling system, and the drive assembly. It controls the coolant supply to the partitioned liquid cooling modules based on the temperature thermogram and controls the drive assembly to move the moving frame closer to the measurement surface, thus achieving targeted cooling of the target area through the partitioned liquid cooling modules. The multiple partitioned liquid cooling modules are evenly distributed in a matrix, with each module corresponding to an independent area of ​​the measurement surface. Each module includes a microchannel liquid-cooled plate, an elastic thermally conductive bonding layer, a pressure buffer chamber, a control valve, and a miniature infrared temperature measurement unit. The elastic thermally conductive bonding layer is located on the side of the microchannel liquid-cooled plate facing the measurement surface. The pressure buffer chamber is connected to the liquid inlet end of the microchannel liquid-cooled plate and contains a pressure detection component electrically connected to the main control board. The control valve is used to control the flow of coolant in the corresponding zone liquid-cooled module. The liquid-cooling circuit includes a main liquid supply pipeline, a main liquid return pipeline, multiple liquid supply branch pipelines corresponding to each zone liquid-cooled module, multiple liquid return branch pipelines, a liquid-cooled drive pump, a buffer damping component, and an expansion and pressure stabilizing tank. The outlet of the liquid-cooled drive pump is connected to the main liquid supply pipeline, the inlet of the liquid-cooled drive pump is connected to the outlet side of the external cooling heat exchange interface, and the outlet of the main liquid return pipeline is connected to the return side of the external cooling heat exchange interface. The main liquid supply pipeline is connected to the inlet of the corresponding partition liquid-cooled module through each liquid supply branch pipeline, and the main liquid return pipeline is connected to the outlet of the corresponding partition liquid-cooled module through each liquid return branch pipeline. The buffer damping element is connected in series between the outlet of the liquid-cooled drive pump and the main liquid supply pipeline, and the expansion pressure stabilizing tank is connected in parallel with the main liquid supply pipeline. The control valves are connected in series with each liquid supply branch pipeline.

2. The distribution box according to claim 1, characterized in that, The main control board is also configured to: when the identified high-temperature area spans the corresponding areas of two or more adjacent partition liquid cooling modules, the main control board simultaneously activates all partition liquid cooling modules covering the high-temperature area, and adjusts the coolant flow rate of each partition differently according to the temperature distribution of the high-temperature area, so as to achieve precise cooling of the boundary area without blind spots.

3. The distribution box according to claim 1, characterized in that, The secondary cavity includes a central cooling cavity and a high-voltage wiring cavity and a low-voltage wiring cavity located outside the cooling cavity. Each cavity is sealed and isolated from the others. The infrared thermal imaging temperature measurement system, the partitioned liquid cooling system, the moving frame, the drive assembly, and the main control board are located in the cooling cavity.

4. The distribution box according to claim 1, characterized in that, The main control board is configured as follows: First, control the drive component to drive the moving frame to the first position away from the measurement surface, and use the infrared thermal imaging temperature measurement system to complete the full-area temperature measurement of the measurement surface and generate a temperature heat map to identify the high-temperature area of ​​the measurement surface; Then, control the drive component to drive the moving frame to the second position close to the measurement surface, and perform coordinate and temperature verification and locking of the high-temperature area to eliminate temperature measurement errors; Next, the drive assembly is controlled to drive the moving frame to the third position that is in contact with the measurement surface, so that the elastic thermally conductive bonding layer of the partitioned liquid cooling module is in close contact with the measurement surface; Finally, based on the location and temperature of the high-temperature area, the control valve of the corresponding zone liquid cooling module is opened to adjust the coolant flow rate for targeted cooling.

5. The distribution box according to claim 1, characterized in that, The main control board has a built-in health prediction module, which is configured to: pre-store a health status thermal characteristic benchmark database matching various electrical appliances in the main cavity, and update the benchmark database to adapt to changes in on-site working conditions and equipment status; collect full-cycle temperature thermal maps of the measurement surface at preset cycles through an infrared thermal imaging temperature measurement system, and extract multi-dimensional thermal characteristic parameters corresponding to each temperature measurement area; compare the real-time extracted thermal characteristic parameters with the health status thermal characteristic benchmark database, and identify early deterioration abnormal states of electrical appliances within the national standard temperature rise limit through multi-cycle continuous judgment anti-false judgment rules; determine specific fault types based on the multi-dimensional thermal characteristic parameters, and dynamically adjust the cooling parameters of the corresponding partition liquid cooling modules according to the abnormal state level and fault type, matching differentiated graded cooling strategies, early warning levels, and maintenance prompts.

6. The distribution box according to claim 1, characterized in that, The main control board has a built-in self-learning optimization module, which is configured to: continuously collect core operating data of the entire life cycle of the distribution box and construct a standardized dataset according to the time dimension; adopt a lightweight edge machine learning algorithm adapted to the embedded main control board to complete the training and iteration of the cooling scheduling model locally on the main control board; establish a multi-objective coupled optimization function with constraints with the three core optimization objectives of maximizing the service life of electrical appliances, minimizing the energy consumption of the cooling system, and optimizing the operational stability; dynamically schedule differentiated cooling strategies according to real-time operating conditions; and continuously iterate and optimize the model parameters through real-time operating data.

7. A distribution box assembly, characterized in that, It includes several distribution boxes as described in any one of claims 1 to 6, a main cooling base station, and a cooling box and a return box corresponding to each distribution box; the main cooling base station is connected to a ring-shaped cluster liquid supply main pipeline and a ring-shaped cluster liquid return main pipeline, which are respectively connected to the liquid cooling circuit of each distribution box to form a conventional cooling cycle for the distribution box; the liquid inlet of the cooling box is connected to the ring-shaped cluster liquid supply main pipeline, and its liquid outlet is connected to the liquid inlet of the corresponding distribution box's liquid cooling circuit, for providing low-temperature cold liquid to the distribution box to achieve rapid cooling; the liquid inlet of the return box is connected to the liquid outlet of the corresponding distribution box's liquid cooling circuit, and its liquid outlet is connected to the ring-shaped cluster liquid return main pipeline, for storing high-temperature hot liquid after heat exchange during rapid cooling.

8. The distribution box assembly according to claim 7, characterized in that, The cooling box has two connecting pipes, each equipped with a cooling replenishment control valve and an acceleration control valve; the return box has two connecting pipes, each equipped with a buffer control valve and a drain control valve; all control valves are electrically connected to the main control board of the corresponding distribution box. During normal operation, the distribution box is cooled only by the main cooling base station; When the distribution box needs to be cooled down quickly, the acceleration control valve and the buffer control valve are opened to supply the cold box with low-temperature coolant to achieve rapid cooling. The high-temperature hot liquid after heat exchange is directly stored in the return box. After cooling is completed, the corresponding valves are closed and the normal cooling mode is switched back. After cooling is completed, the drain control valve will automatically open during periods of low load and low electricity price to drain the hot liquid stored in the return tank back to the main cooling base station, thus completing the cooling and regeneration process. When the main cooling base station fails, the connection between the power distribution box and the cluster pipeline is cut off, and the control valves corresponding to the cooling box and return box are opened to form an independent emergency cooling cycle.

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