Pressing control method and system for multilayer circuit board based on dynamic compensation

By constructing an interlayer topology network and a dynamic compensation matrix, the problem of inaccurate finished product dimensions caused by interlayer thermal coupling effect in multilayer circuit boards was solved, achieving precise lamination control of multilayer circuit boards and improving the accuracy of finished product dimensions.

CN122438282APending Publication Date: 2026-07-21KUNSHAN SUHANG CIRCUIT BOARD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2026-05-27
Publication Date
2026-07-21

AI Technical Summary

Technical Problem

Existing technologies fail to effectively consider the interlayer thermal coupling effect in multilayer circuit board manufacturing, resulting in low dimensional accuracy of finished products, inability to accurately assess interlayer stress distribution and suppression requirements, and affecting the accuracy of the lamination process.

Method used

By labeling the multidimensional feature parameter set of each inner core board, an interlayer topology network is constructed. Combined with the dynamic compensation matrix and real-time temperature field parameters, global topology mapping and closed-loop pressing control are performed to dynamically correct local dimensional offsets and generate a dynamic compensation matrix to control the temperature rise rate and pressurization curve of the press.

Benefits of technology

It improves the dimensional accuracy of multilayer circuit boards, fully considers the interlayer thermal coupling effect, realizes dynamic control of local dimensional deviations, and enhances the accuracy of the lamination process.

✦ Generated by Eureka AI based on patent content.

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Abstract

The application discloses a kind of based on dynamic compensation's multilayer circuit board's pressing control method and system, and the application relates to the technical field of multilayer circuit board, in multilayer circuit board, based on the identification of interlayer topological network to determine the initial stress distribution of each layer in the pressing process of multilayer circuit board in layer core board, and combining preset pressing process parameters, the initial stress distribution of each layer in layer core board is globally topological mapping, to evaluate interlayer stress inhibition demand, generate each layer in layer core board dynamic compensation matrix based on spatial coordinate position.Real-time temperature field and flow glue dynamics parameters of interlayer of multilayer circuit board are acquired, and combined with dynamic compensation matrix, pressing deformation evolution is carried out, and the local size offset content of each layer core board is dynamically corrected;According to the reverse tracing of the local size offset content, the temperature rise rate and the pressing curve of the pressing machine are determined, and the closed-loop pressing control is carried out on the multilayer circuit board, and the accuracy of the finished product size of the multilayer circuit board is improved.
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