Highly heat-conductive wave-absorbing carbon fiber heat-conductive gasket and preparation method thereof

By modifying and coating carbon fibers, high thermal conductivity and microwave absorbing carbon fiber thermal pads are prepared, which solves the problem of insufficient microwave absorption and thermal conductivity in the existing technology, achieves high efficiency in thermal conductivity and microwave absorption, and improves the insulation and mechanical properties of the material, making it suitable for semiconductor packaging materials.

CN122445192APending Publication Date: 2026-07-24HUNAN FEIHONGDA NEW MATERIAL CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
HUNAN FEIHONGDA NEW MATERIAL CO LTD
Filing Date
2026-06-05
Publication Date
2026-07-24

AI Technical Summary

Technical Problem

Existing thermal pads for semiconductors have shortcomings in terms of microwave absorption and thermal conductivity, and their manufacturing process is complex and costly, making it difficult to meet modern energy-saving and environmental protection requirements.

Method used

Carbon fiber was modified by soaking it in a strong acid solution and mixing it with sodium cholate. Carbonyl iron powder, copper powder and alumina powder were then coated with polydopamine and dodecyltrimethoxysilane to form a coated mixed powder. This powder was then mixed with a hydroxyl-terminated polydimethylsiloxane silicone rubber matrix and a crosslinking agent to prepare a high thermal conductivity and microwave-absorbing carbon fiber thermal pad.

Benefits of technology

It achieves high heat transfer capacity in all directions for the thermal pad, while also possessing excellent wave absorption performance, improving the insulation performance and mechanical stability of the material, reducing the risk of yellowing and cracking, and meeting modern energy-saving and environmental protection requirements.

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Abstract

The application relates to the field of semiconductor technology, in particular to a high-thermal-conductivity wave-absorbing carbon fiber heat-conducting gasket and a preparation method thereof. The preparation method comprises the following steps: preparing sodium cholate modified carbon fibers; mixing iron carbonyl powder, copper powder, aluminum oxide powder and water to form a suspension; sequentially performing polydopamine coating and dodecyltrimethoxysilane coating on the suspension to obtain coated mixed powder; and stirring, mixing, warming and mixing, and extruding a hydroxyl-terminated polydimethylsiloxane silicone rubber matrix, the sodium cholate modified carbon fibers, the coated mixed powder and a crosslinking agent to obtain the high-thermal-conductivity wave-absorbing carbon fiber heat-conducting gasket. The sodium cholate modified carbon fibers and the coated mixed powder are used as fillers to be mixed with the hydroxyl-terminated polydimethylsiloxane silicone rubber matrix and the crosslinking agent to prepare the high-thermal-conductivity wave-absorbing carbon fiber heat-conducting gasket, which has high thermal conductivity and excellent wave-absorbing performance; the fillers and the matrix are closely combined and uniformly dispersed, the processability and the mechanical stability are improved, the yellowing resistance is enhanced, and the comprehensive use performance is excellent.
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Citation Information

Patent Citations

  • CN112140595A

  • CN118996837A

  • CN119615607A