Adhesive material for quantum current sensor package, sensor and process of making

Abstract

The application relates to an adhesive material for a quantum current sensor package, a sensor and a process method, and relates to the technical field of measurement device packaging. A first substrate and a second substrate are provided; a plurality of slurries with gradient changes in target values of thermal expansion coefficients are prepared; the slurries all comprise a ceramic matrix phase, a nano-filler control phase and a fiber reinforced phase, the material proportions of the different slurries are different, and the target values of the thermal expansion coefficients are determined according to the difference between the thermal expansion coefficients of the first substrate and the second substrate; the plurality of slurries are coated on the interface of the first substrate layer by layer according to the gradient changes, so as to form an adhesive layer; after each layer of slurry is coated, a pre-solidification treatment is performed, so as to form a transition zone of component interdiffusion; the second substrate is covered on the adhesive layer, so as to form a composite adhesive structure. Through the design of the three-phase composite adhesive layer with gradient matching, flexible matching of the thermal expansion coefficients in the multi-interface system is realized, and meanwhile, low stress, high thermal conductivity, high toughness and low temperature process compatibility to sensitive elements are considered.

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