Flow channel structure
By integrating fluid channels and heat insulation cavities on the substrate, the problems of large space occupation and low disassembly and assembly efficiency of heat dissipation devices are solved, and simultaneous heat dissipation and efficient disassembly and assembly of multiple heat-dissipating components are realized.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- CHAMP TECH OPTICAL (FOSHAN) CORP
- Filing Date
- 2025-01-24
- Publication Date
- 2026-07-24
AI Technical Summary
The independent layout of the heat dissipation pipes of the heat dissipation device results in a large space occupation and low disassembly and assembly efficiency.
A flow channel structure is designed, including multiple fluid channels and heat insulation cavities on a substrate. Heat insulation cavities are provided between the fluid channels to prevent heat exchange of the heat transfer medium. The flow channel structure reduces space occupation and improves disassembly and assembly efficiency through integrated design.
It achieves simultaneous heat dissipation of multiple heat-receiving components, reduces the space occupied by the flow channel structure, improves disassembly and assembly efficiency, and ensures the independent heat exchange effect of each fluid channel.
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Figure CN122447564A_ABST