Flow channel structure

By integrating fluid channels and heat insulation cavities on the substrate, the problems of large space occupation and low disassembly and assembly efficiency of heat dissipation devices are solved, and simultaneous heat dissipation and efficient disassembly and assembly of multiple heat-dissipating components are realized.

CN122447564APending Publication Date: 2026-07-24CHAMP TECH OPTICAL (FOSHAN) CORP
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
CHAMP TECH OPTICAL (FOSHAN) CORP
Filing Date
2025-01-24
Publication Date
2026-07-24

AI Technical Summary

Technical Problem

The independent layout of the heat dissipation pipes of the heat dissipation device results in a large space occupation and low disassembly and assembly efficiency.

Method used

A flow channel structure is designed, including multiple fluid channels and heat insulation cavities on a substrate. Heat insulation cavities are provided between the fluid channels to prevent heat exchange of the heat transfer medium. The flow channel structure reduces space occupation and improves disassembly and assembly efficiency through integrated design.

Benefits of technology

It achieves simultaneous heat dissipation of multiple heat-receiving components, reduces the space occupied by the flow channel structure, improves disassembly and assembly efficiency, and ensures the independent heat exchange effect of each fluid channel.

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Abstract

The application provides a flow channel structure, comprising a substrate, the substrate being provided with fluid channels and heat insulation cavities; wherein the fluid channels are used for flowing of heat conduction mediums, and the number of the fluid channels is set to at least two, any two adjacent fluid channels in the at least two fluid channels are arranged at intervals, and the heat insulation cavities are arranged between any two adjacent fluid channels in the at least two fluid channels; heat insulation mediums are arranged in the heat insulation cavities, and the heat insulation mediums are configured to prevent heat exchange of the heat conduction mediums in the adjacent two fluid channels of the heat insulation cavities in which the heat insulation mediums are located.
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