Debugging device for computer software development

By introducing ventilation mechanisms and heat exchange components into the computer software debugging equipment, the hardware overheating problem caused by the simulator was solved, achieving efficient heat dissipation and ensuring hardware stability during the software debugging process.

CN122450806APending Publication Date: 2026-07-24HEILONGJIANG FORESTRY VOCATIONAL & TECH COLLEGE
View PDF 0 Cites 0 Cited by

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
HEILONGJIANG FORESTRY VOCATIONAL & TECH COLLEGE
Filing Date
2026-04-30
Publication Date
2026-07-24

Smart Images

  • Figure CN122450806A_ABST
    Figure CN122450806A_ABST
Patent Text Reader

Abstract

The application belongs to the technical field of software development equipment, and discloses a debugging device for computer software technology development. The debugging device for computer software technology development comprises a bottom shell and a top cover, the inner bottom wall of the bottom shell is movably connected with the middle portion of the lower surface of the top cover through an elastic member, the inner side wall of the bottom shell is provided with a plurality of device installation modules for the installation of electronic devices, and the inner bottom wall of the bottom shell is provided with air outlet holes for air circulation. The debugging device for computer software technology development can quickly remove a large amount of heat generated during the operation of the device through the cooperative operation of the ventilation mechanism and the heat exchange assembly, effectively reduces the working temperature of the PCB circuit board and the electronic device, avoids the hardware frequency reduction and operation lag caused by high temperature, ensures the stable operation of the emulator during the software debugging process, and solves the problems of low heat dissipation efficiency and easy overheating of the hardware of the traditional debugging device.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] This invention relates to the technical field of software development equipment, specifically to a debugging device for computer software technology development. Background Technology

[0002] Software development debugging broadly refers to the process of reproducing software defects, locating and finding the root cause of the problem, and ultimately solving it. In daily debugging work, emulators are frequently used as a platform to run software and test its stability, thus supporting software development and debugging. Emulators replicate the functionality of one system from another. Emulators typically use a computer as the host platform. Emulation is usually slower than execution on native hardware because it requires translating the target system's instructions into instructions that the host system can understand in real time, or precisely simulating the hardware clock cycle. High performance overhead is a significant drawback of emulators, corresponding to a greater operational load on the host computer hardware. This is most noticeably reflected in a significant increase in computer hardware temperature. High temperatures lead to a significant decrease in hardware frequency, creating a vicious cycle that greatly hinders emulator operation and software development and debugging. Therefore, we propose a debugging device for computer software technology development. Summary of the Invention

[0003] The purpose of this invention is to provide a debugging device for computer software technology development, which solves the problems mentioned in the background art.

[0004] To achieve the above objectives, the present invention is implemented through the following technical solution: a debugging device for computer software technology development, comprising a bottom shell and a top cover, wherein the inner bottom wall of the bottom shell is movably connected to the middle of the lower surface of the top cover through a telescopic component, and the inner side wall of the bottom shell is provided with a plurality of device mounting modules for mounting electronic devices, and the inner bottom wall of the bottom shell is provided with an air outlet for air circulation.

[0005] The bottom of the bottom shell is provided with a ventilation mechanism for ventilation and heat dissipation of the bottom shell and the top cover. The ventilation mechanism includes a ventilation shell, pads, ventilation holes, heat exchange components, cooling fan one and cooling fan two. The ventilation shell is fixedly installed at the bottom of the bottom shell. Several pads are fixedly connected to the lower surface of the ventilation shell. The heat exchange components are installed at the bottom of the bottom shell and inside the ventilation shell. Ventilation holes are opened in the middle of the side wall and bottom wall of the ventilation shell. Cooling fan one is fixedly installed in the middle of the bottom wall inside the ventilation shell. Several cooling fans two are fixedly installed in the bottom wall inside the ventilation shell and outside the cooling fan one.

[0006] Preferably, the telescopic component includes a main tube, a secondary tube, and an annular spring. The bottom end of the main tube is fixedly connected to the middle of the bottom wall of the bottom shell. The top end of the secondary tube is fixedly connected to the lower surface of the top cover. The secondary tube is sleeved on the outside of the main tube. An annular spring is fixedly connected to the top end of the main tube, and the annular spring contacts the inner wall of the secondary tube to fix its position relative to the main tube by friction. The top cover has an installation cavity for mounting a PCB circuit board. The side wall of the top cover has annularly arranged air vents that communicate with the installation cavity. A cooling fan blows air through the main tube and the secondary tube into the installation cavity to dissipate heat from the PCB circuit board.

[0007] Preferably, the device mounting module includes a mounting plate, a support base, an inner cavity, and an air outlet. The mounting plate is fixedly mounted on the inner wall of the bottom shell. Both the mounting plate and the support base have inner cavities. One end of the support base is inserted into the bottom of the mounting plate on the side away from the bottom shell, so that the inner cavities of the two are connected. The upper surface of the support base and the side of the mounting plate away from the bottom shell both have air outlets that are connected to the inner cavities. The mounting plate is connected to the ventilation shell through a connecting pipe.

[0008] Preferably, the heat exchange assembly includes a partition, through holes, a heat insulation plate, a coolant bottle, heat exchange pipes, a pressure assembly, and a vent valve. The partition is fixedly connected to the side wall of the ventilation shell and is located above the ventilation holes. The partition has evenly distributed through holes corresponding to the positions of cooling fan one and cooling fan two. The heat insulation plate is fixedly connected to the upper surface of the partition and surrounds the outside of the through holes. The upper surface of the heat insulation plate is fixedly connected to the inner bottom wall of the bottom shell. Several heat exchange pipes are laid on the partition at the positions corresponding to the through holes. Part of the heat exchange pipes are located inside the cavity of the mounting plate. The coolant bottle is installed on the edge of the upper surface of the partition. The inlet pipe of the heat exchange pipe is connected to the coolant bottle. The pressure assembly is installed on the bottle mouth of the coolant bottle and is located in the hole in the side wall of the ventilation shell. The outlet end of the heat exchange pipe passes through the main pipe and the auxiliary pipe and penetrates the top cover. A vent valve is installed at the outlet end of the heat exchange pipe.

[0009] Preferably, the number of heat exchange pipes is the same as the number of cooling fans 2 and mounting plates, and the three are opposite each other in the vertical direction, with cooling fans 2 arranged in a ring around cooling fans 1 as the axis.

[0010] Preferably, the pressure assembly includes an injection block, a spring groove, a piston rod, a piston head, a rod head, a tension spring, an injection channel, and an injection check valve. The injection block is threaded to the opening of the coolant bottle. A spring groove is formed on the side of the injection block away from the coolant bottle. The piston rod is located in the spring groove, and one end of the piston rod extends through the bottom wall of the spring groove into the coolant bottle and is fixedly connected to the piston head. The other end of the piston rod is fixedly connected to the rod head. The rod head is movably connected to the bottom wall of the spring groove through a tension spring. A through injection channel is formed on the rod head, piston rod, and piston head. An injection check valve is installed at the opening of the injection channel on the rod head.

[0011] Preferably, the heat exchange pipe includes three continuous S-shaped structures, which are respectively located inside the mounting plate, above the first cooling fan and the second cooling fan.

[0012] By adopting the aforementioned technical solution, the beneficial effects of the present invention are: 1. This debugging equipment for computer software technology development can quickly remove a large amount of heat generated during equipment operation through the coordinated operation of ventilation mechanism and heat exchange components, effectively reducing the operating temperature of PCB circuit board and electronic components, avoiding hardware frequency reduction and operation lag due to high temperature, ensuring stable operation of simulator during software debugging, and solving the problems of low heat dissipation efficiency and easy overheating of hardware in traditional debugging equipment.

[0013] 2. The debugging equipment for computer software technology development features a telescopic component that allows for flexible adjustment of the distance between the top cover and the bottom shell, adapting to the installation of electronic components and PCB boards of different sizes. Meanwhile, the friction fixing structure of the ring spring is easy to operate and provides stable positioning. The component mounting module adopts an internal cavity and air outlet design, which, together with the heat exchange pipes, achieves directional air cooling and liquid cooling combined for heat dissipation. The heat dissipation coverage is comprehensive and without dead angles, improving the overall heat dissipation uniformity of the equipment. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the structure of the present invention; Figure 2 This is a front view of the present invention; Figure 3 For the present invention Figure 2 Cross-sectional view of AA; Figure 4 For the present invention Figure 2 Cross-sectional view of BB; Figure 5 For the present invention Figure 4 Enlarged view of point A in the middle; Figure 6 This is a top view of the present invention; Figure 7 For the present invention Figure 6 Cross-sectional view of the bottom shell at point CC.

[0015] In the diagram: 1. Bottom shell; 2. Top cover; 3. Telescopic component; 31. Main pipe; 32. Secondary pipe; 33. Annular spring; 4. Component mounting module; 41. Mounting plate; 42. Support base; 43. Inner cavity; 44. Air outlet; 5. Air vent; 6. Ventilation mechanism; 61. Ventilation shell; 62. Foot pad; 63. Ventilation hole; 64. Heat exchange component; 641. Partition plate; 642. Through hole; 643. Insulation plate; 6 44. Coolant bottle; 645. Heat exchange pipe; 646. Pressure assembly; 6461. Injection block; 6462. Spring groove; 6463. Piston rod; 6464. Piston head; 6465. Rod head; 6466. Tension spring; 6467. Injection channel; 6468. Injection check valve; 647. Vent valve; 65. Cooling fan one; 66. Cooling fan two; 7. Mounting cavity; 8. Vent hole. Detailed Implementation

[0016] Please see Figure 1-7 This invention provides a technical solution: a debugging device for computer software technology development, including a bottom shell 1 and a top cover 2. The inner bottom wall of the bottom shell 1 is movably connected to the middle of the lower surface of the top cover 2 via a telescopic member 3. The inner side wall of the bottom shell 1 is provided with several device mounting modules 4 for mounting electronic devices. The device mounting modules 4 can flexibly install different functional electronic components according to debugging requirements, expanding the debugging and adaptation range of the device. The inner bottom wall of the bottom shell 1 is provided with air outlets 5 for air circulation. The air outlets 5, together with the ventilation mechanism, form a complete airflow circulation, improving the smoothness of heat dissipation.

[0017] A ventilation mechanism 6 is provided at the bottom of the bottom shell 1 for ventilation and heat dissipation of the bottom shell 1 and the top cover 2. The ventilation mechanism 6 includes a ventilation shell 61, feet 62, ventilation holes 63, a heat exchange component 64, a first cooling fan 65, and a second cooling fan 66. The ventilation shell 61 is fixedly installed at the bottom of the bottom shell 1. Several feet 62 are fixedly connected to the lower surface of the ventilation shell 61. The feet 62 raise the ventilation shell 61 to ensure smooth air intake of the bottom ventilation holes 63 and avoid blockage. The heat exchange component 64 is installed at the bottom of the bottom shell 1 and inside the ventilation shell 61. Ventilation holes 63 are opened in the middle of the side wall and the bottom wall of the ventilation shell 61. The side wall and the bottom ventilation holes form a multi-directional air intake channel to increase the air intake volume. A first cooling fan 65 is fixedly installed in the middle of the bottom wall inside the ventilation shell 61. Several second cooling fans 66 are fixedly installed in the bottom wall inside the ventilation shell 61 and outside the first cooling fan 65. The first cooling fan 65 and the second cooling fan 66 form a central and peripheral dual-fan heat dissipation structure to increase the airflow coverage area.

[0018] The telescopic component 3 includes a main tube 31, a secondary tube 32, and an annular spring 33. The bottom end of the main tube 31 is fixedly connected to the middle of the inner bottom wall of the bottom shell 1. The top end of the secondary tube 32 is fixedly connected to the lower surface of the top cover 2. The secondary tube 32 is sleeved on the outside of the main tube 31. The top end of the main tube 31 is fixedly connected to the annular spring 33, and the annular spring 33 contacts the inner wall of the secondary tube 32 to fix its position relative to the main tube 31 by friction. The height can be adjusted by manually pushing and pulling the top cover 2. It automatically locks after being released, without the need for additional locking components, making it easy to operate. The top cover 2 has an installation cavity 7 for the installation of PCB circuit boards. The side wall of the top cover 2 has annularly arranged air vents 8 that communicate with the installation cavity 7. The cooling fan 65 blows air through the main tube 31 and the secondary tube 32 into the installation cavity 7 to dissipate heat from the PCB circuit board. The central airflow blows directly into the core area of ​​the PCB board, quickly reducing the temperature of the core components.

[0019] The device mounting module 4 includes a mounting plate 41, a support base 42, an inner cavity 43, and an air outlet 44. The mounting plate 41 is fixedly mounted on the inner wall of the bottom shell 1. Both the mounting plate 41 and the support base 42 have an inner cavity 43. One end of the support base 42 is inserted into the bottom of the mounting plate 41 on the side away from the bottom shell 1, so that the inner cavities 43 of the two are connected. The upper surface of the support base 42 and the side of the mounting plate 41 away from the bottom shell 1 have an air outlet 44, which are connected to the inner cavity 43. The inner cavity 43 serves as an airflow channel, and the air outlet 44 directs airflow to the electronic device to achieve precise heat dissipation. The mounting plate 41 is connected to the ventilation shell 61 through a connecting pipe.

[0020] The heat exchange assembly 64 includes a partition 641, through holes 642, a heat insulation plate 643, a coolant bottle 644, a heat exchange pipe 645, a pressure assembly 646, and a vent valve 647. The partition 641 is fixedly connected to the side wall of the ventilation shell 61 and is located above the ventilation holes 63. The partition 641 has evenly distributed through holes 642 at positions corresponding to the first cooling fan 65 and the second cooling fan 66. The heat insulation plate 643 is fixedly connected to the upper surface of the partition 641 and surrounds the outside of the through holes 642. The airflow is guided to pass evenly through the heat exchange pipe 645 to improve heat exchange efficiency. The upper surface of the insulation plate 643 is fixedly connected to the inner bottom wall of the bottom shell 1. Several heat exchange pipes 645 are laid on the partition plate 641 at the positions corresponding to the through holes 642. Part of the heat exchange pipes 645 also pass through and are installed in the inner cavity 43 of the mounting plate 41. The coolant bottle 644 is installed on the edge of the upper surface of the partition plate 641. The inlet pipe of the heat exchange pipe 645 is connected to the coolant bottle 644. The pressure component 646 is installed on the bottle mouth of the coolant bottle 644 and is located in the hole in the side wall of the ventilation shell 61. The outlet end of the heat exchange pipe 645 passes through the main pipe 31 and the secondary pipe 32 and passes through the top cover 2. The outlet end of the heat exchange pipe 645 is equipped with a vent valve 647. The vent valve 647 can discharge the air in the pipe to prevent air resistance from affecting the coolant circulation. The heat exchange pipe 645 in the main pipe 31 and the secondary pipe 32 is made of soft pipe to facilitate the movement of the secondary pipe 32 on the main pipe 31.

[0021] The number of heat exchange pipes 645 is the same as the number of cooling fans 66 and mounting plates 41, and the three are vertically opposite each other. The cooling fans 66 are arranged in a ring around the cooling fans 65, ensuring that each mounting plate 41 and electronic device can receive sufficient heat dissipation.

[0022] The pressure assembly 646 includes an injection block 6461, a spring groove 6462, a piston rod 6463, a piston head 6464, a rod head 6465, a tension spring 6466, an injection channel 6467, and an injection check valve 6468. The injection block 6461 is threadedly connected to the opening of the coolant bottle 644. The injection block 6461 has a spring groove 6462 on the side away from the coolant bottle 644. The piston rod 6463 is located in the spring groove 6462, and one end of the piston rod extends through the bottom wall of the spring groove 6462 into the coolant bottle 644 and is fixed therein. A piston head 6464 is fixedly connected to the piston rod 6463, and a rod head 6465 is fixedly connected to the other end of the piston rod 6463. The rod head 6465 is movably connected to the bottom wall of the spring groove 6462 through a tension spring 6466. The coolant bottle 644 is used to store coolant, which can be dry ice or liquid nitrogen. A through-hole injection channel 6467 is opened on the rod head 6465, the piston rod 6463, and the piston head 6464. An injection check valve 6468 is installed at the opening of the injection channel 6467 on the rod head 6465. The injection check valve 6468 prevents coolant backflow and ensures one-way circulation.

[0023] The heat exchange pipe 645 includes three continuous S-shaped structures, which are located inside the mounting plate 41, above the first cooling fan 65 and the second cooling fan 66, respectively. The S-shaped structure increases the heat exchange area, and the three-section distribution achieves all-round liquid cooling.

[0024] When this equipment is working, coolant is first injected into the coolant bottle 644 through the one-way valve 6468. As the coolant is injected, the piston head 6464 is pressed towards the opening of the coolant bottle 644, stretching the tension spring 6466 and ensuring smooth circulation. After the equipment is powered on, cooling fans 1 65 and 2 66 start synchronously. Outside air enters through the ventilation holes 63 of the ventilation housing 61, passes through the through holes 642 of the partition 641, and exchanges heat with the coolant in the heat exchange pipe 645, forming cool air. Part of the cool air enters the mounting cavity 7 of the top cover 2 through the main pipe 31 and the secondary pipe 32, blowing directly onto the PCB circuit board, and the heat is discharged from the air outlet 8. Another part of the cool air enters the inner cavity 43 of the device mounting module 4 and exits through the air outlet 44. The coolant is blown onto the installed electronic components to dissipate heat. As heat exchange proceeds, the coolant in the heat exchange pipe 645 continuously vaporizes and expands, and is discharged through the vent valve 647. The tension spring 6466 rebounds and pressurizes the coolant in the coolant bottle 644 into the heat exchange pipe 645 to replenish it. Users can add coolant to the coolant bottle 644 as needed for debugging, and adjust the height of the telescopic component 3 by pushing and pulling the top cover 2 to adapt to the installation and debugging of different components. The equipment maintains stable operation at low temperature throughout the process, providing reliable hardware support for software debugging.

[0025] Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A debugging device for computer software technology development, comprising a bottom shell and a top cover, characterized in that: The inner bottom wall of the bottom shell is movably connected to the middle of the lower surface of the top cover through a telescopic component. The inner side wall of the bottom shell is provided with several device mounting modules for the installation of electronic devices. The inner bottom wall of the bottom shell is provided with air outlet holes for air circulation. The bottom of the bottom shell is provided with a ventilation mechanism for ventilation and heat dissipation of the bottom shell and the top cover. The ventilation mechanism includes a ventilation shell, pads, ventilation holes, heat exchange components, cooling fan one and cooling fan two. The ventilation shell is fixedly installed at the bottom of the bottom shell. Several pads are fixedly connected to the lower surface of the ventilation shell. The heat exchange components are installed at the bottom of the bottom shell and inside the ventilation shell. Ventilation holes are opened in the middle of the side wall and bottom wall of the ventilation shell. Cooling fan one is fixedly installed in the middle of the bottom wall inside the ventilation shell. Several cooling fans two are fixedly installed in the bottom wall inside the ventilation shell and outside the cooling fan one.

2. The debugging equipment for computer software technology development according to claim 1, characterized in that: The telescopic component includes a main tube, a secondary tube, and an annular spring. The bottom end of the main tube is fixedly connected to the middle of the bottom wall of the bottom shell. The top end of the secondary tube is fixedly connected to the lower surface of the top cover. The secondary tube is sleeved on the outside of the main tube. An annular spring is fixedly connected to the top end of the main tube, and the annular spring contacts the inner wall of the secondary tube to fix its position relative to the main tube by friction. The top cover has an installation cavity for mounting a PCB circuit board. The side wall of the top cover has annularly arranged air vents that communicate with the installation cavity. A cooling fan blows air through the main tube and the secondary tube into the installation cavity to dissipate heat from the PCB circuit board.

3. The debugging equipment for computer software technology development according to claim 2, characterized in that: The device mounting module includes a mounting plate, a support base, an inner cavity, and an air outlet. The mounting plate is fixedly mounted on the inner wall of the bottom shell. Both the mounting plate and the support base have inner cavities. One end of the support base is inserted into the bottom of the mounting plate on the side away from the bottom shell, so that the inner cavities of the two are connected. The upper surface of the support base and the side of the mounting plate away from the bottom shell have air outlets that are connected to the inner cavities. The mounting plate is connected to the ventilation shell through a connecting pipe.

4. The debugging equipment for computer software technology development according to claim 3, characterized in that: The heat exchange assembly includes a partition, through holes, a heat insulation plate, a coolant bottle, heat exchange pipes, a pressure assembly, and a vent valve. The partition is fixedly connected to the side wall of the ventilation shell and is located above the ventilation holes. The partition has evenly distributed through holes corresponding to the positions of cooling fan one and cooling fan two. The heat insulation plate is fixedly connected to the upper surface of the partition and surrounds the outside of the through holes. The upper surface of the heat insulation plate is fixedly connected to the inner bottom wall of the bottom shell. Several heat exchange pipes are laid on the partition at the positions corresponding to the through holes. Part of the heat exchange pipes are located inside the cavity of the mounting plate. The coolant bottle is installed on the edge of the upper surface of the partition. The inlet pipe of the heat exchange pipe is connected to the coolant bottle. The pressure assembly is installed on the bottle mouth of the coolant bottle and is located in the hole in the side wall of the ventilation shell. The outlet end of the heat exchange pipe passes through the main pipe and the auxiliary pipe and penetrates the top cover. A vent valve is installed at the outlet end of the heat exchange pipe.

5. The debugging equipment for computer software technology development according to claim 4, characterized in that: The number of heat exchange pipes is the same as the number of cooling fans 2 and mounting plates, and the three are opposite each other in the vertical direction, with cooling fans 2 arranged in a ring around cooling fans 1 as the axis.

6. The debugging equipment for computer software technology development according to claim 5, characterized in that: The pressure assembly includes an injection block, a spring groove, a piston rod, a piston head, a rod head, a tension spring, an injection channel, and an injection check valve. The injection block is threaded onto the opening of the coolant bottle. A spring groove is formed on the side of the injection block away from the coolant bottle. The piston rod is located in the spring groove, with one end extending through the bottom wall of the spring groove into the coolant bottle and fixedly connected to the piston head. The other end of the piston rod is fixedly connected to the rod head. The rod head is movably connected to the bottom wall of the spring groove via a tension spring. A through injection channel is formed on the rod head, piston rod, and piston head. An injection check valve is installed at the opening of the injection channel on the rod head.

7. The debugging equipment for computer software technology development according to claim 6, characterized in that: The heat exchange pipe includes three continuous S-shaped structures, which are located inside the mounting plate and above the first and second cooling fans, respectively.