A full-automatic chip separating work station and method

Abstract

The application provides a full-automatic chip separation work station, which realizes the continuousness, controllability and traceability of the shock DIE process, and improves the overall production efficiency and product quality stability. It comprises: a cutting material box loading and unloading position, which comprises at least two material box stations, each material box station is used for storing multiple wafers carried by a Ring ring, and each material box station is connected with a factory overhead crane system to realize automatic loading; a multipurpose mechanical arm comprising a first pick-and-place arm and a second pick-and-place arm; a shock DIE protective cover warehouse for storing shock DIE protective covers; a product centering platform for centering the Ring ring wafer; a shock DIE platform for carrying the combination of the shock DIE protective cover and the Ring ring wafer, and built-in vibration driving unit, which produces vibration after the shock DIE protective cover and the wafer are attached to separate the effective DIE and the carrier; a tank-shaped carrier loading platform; a weighing module; an AOI detection module; and a tank-shaped carrier carrying module.

Description

Technical Field

[0001] This invention relates to the technical field of chip separation, specifically to a fully automated chip separation workstation, and also provides a fully automated chip separation method. Background Technology

[0002] In semiconductor packaging and testing processes, after the wafer is diced, the die is usually still attached to carrier structures such as rings and UV films. It is necessary to use vibration to detach the die from the film surface and enter the subsequent collection and testing process. This process is usually called vibration DIE or Shake-off process.

[0003] Existing vibration DIE operations are mostly based on single-machine or semi-automatic equipment, which has the following main shortcomings: (1) Loading and unloading rely on manual labor or a single handling mechanism The lack of continuous automated connection between the wafer hopper and the vibration station results in a high degree of manual intervention, unstable cycle time, and a risk of wafer wobbling or displacement during high-frequency handling.

[0004] (2) The outer ring of the ineffective die lacks effective isolation measures. The outermost edge of a wafer often contains dies with incomplete cutting edges or those deemed invalid by the process. In traditional detachment processes, all dies fall off simultaneously and need to be screened out later, increasing the sorting burden and posing a risk of mixing.

[0005] (3) The product collection method is simple and lacks process control. Existing equipment mostly uses open collection or simple container receiving methods. During the falling process, the core particles are prone to splashing, secondary collisions or electrostatic adsorption, which affects the appearance quality. At the same time, it is difficult to achieve process traceability of the quantity or weight of products corresponding to a single wafer.

[0006] (4) Lack of online measurement and quality linkage mechanism After the vibration DIE is completed, it usually goes directly to the downstream process without verifying the weight or screening the appearance of the collected core particles. This makes it impossible to detect vibration detachment abnormalities (such as insufficient detachment, abnormal breakage, etc.) in a timely manner, resulting in delayed process feedback.

[0007] (5) The processes are scattered and the degree of automation integration is low. Existing vibration DIE equipment typically only has a single vibration separation function. Product collection, measurement, and testing functions are scattered across different workstations, resulting in complex connections between equipment, large space requirements, and difficulty in unified data management.

[0008] Therefore, there is an urgent need for an automated workstation that integrates automatic wafer feeding, precise matching of the oscillation DIE protective cover, effective selective dies removal, directional product collection, weight measurement, and AOI inspection into one unit, so as to realize the continuity, controllability, and traceability of the oscillation DIE process, and improve overall production efficiency and product quality stability. Summary of the Invention

[0009] To address the aforementioned issues, this invention provides a fully automated chip separation station that enables continuous, controllable, and traceable DIE (Diode Extraction) processes, thereby improving overall production efficiency and product quality stability.

[0010] A fully automated chip separation station, characterized in that it comprises: The cutting material box has upper and lower material positions, including at least two material box stations. Each material box station is used to store multiple wafers carried by the Ring. Each material box station is connected to the in-plant crane system to realize automatic feeding. A multi-purpose robotic arm, comprising a first pick-and-place arm and a second pick-and-place arm; The shock DIE protection cover compartment is used to store shock DIE protection covers; Product alignment platform for aligning Ring wafers; The vibration DIE platform is used to support the assembly of the vibration DIE protective cover and the Ring wafer, and has a built-in vibration drive unit that generates vibration after the vibration DIE protective cover is attached to the wafer to separate the effective DIE from the carrier. Tank-shaped loading platform; The weighing module is used to weigh the canister carrier before and after receiving the material to obtain the net weight data of the product. AOI inspection module, used for visual inspection of products after vibration DIE; And a tank carrier handling module, used to transfer the tank carrier between the tank carrier loading platform, the vibrating DIE platform receiving port, the weighing module and the AOI detection module.

[0011] Its further features are: The lower DIE output end of the vibration DIE platform is provided with a tank-shaped carrier placement position. The material inlet of the tank-shaped carrier is connected to the DIE output end, which makes the invalid DIE on the outer ring blocked by the vibration DIE protective cover, ensuring the validity of the DIE flowing into the tank-shaped carrier. The tank carrier placement position is supported on the output end of a linear motion cylinder. The linear motion cylinder drives the tank carrier placement position to switch between the DIE output end and the loading and unloading station. The DIE output end is provided with a guide sleeve to ensure that the DIE reliably enters the tank carrier. It also includes a frame, with a workbench on the upper part of the frame. A cutting box loading and unloading position is set on one side of the workbench at one end of its length. A multi-purpose robotic arm is set at the middle of the upper surface of the workbench corresponding to the cutting box loading and unloading position. A vibration DIE protective cover, a product centering platform, and a vibration DIE platform are arranged on the upper surface of the other side of the workbench at one end of its length. The picking and placing arm of the multi-purpose robotic arm covers the vibration DIE protective cover, the product centering platform, and the vibration DIE platform. The movement range of the can-shaped carrier handling module covers the vibration DIE platform, the can-shaped carrier loading platform, the weighing module, and the AOI inspection module. The first pick-and-place arm and the second pick-and-place arm are coaxially arranged. The first pick-and-place arm is used to pick up the wafer carried by the Ring; the second pick-and-place arm is used to pick up the shock DIE protective cover.

[0012] A fully automated chip separation method, characterized by comprising the following steps: S1. The overhead crane delivers the cassette containing multiple Ring wafers to the wafer cassette unloading position; S2. The multi-purpose robotic arm takes out a Ring wafer and a vibration DIE protective cover, and places them on the vibration DIE platform in sequence, with the vibration DIE protective cover at the bottom and the wafer at the top. S3. The can-shaped carrier transport module transports the empty can to the weighing module for initial weight measurement. S4. After weighing, send the tank carrier to the bottom of the receiving port of the DIE platform. S5, the vibration DIE platform performs vibration separation operation, so that the effective DIE falls into the tank-shaped carrier; S6. After separation, the handling module will send the can-shaped carrier containing the product back to the weighing module for weighing. S7. After weighing, send the tank-shaped carrier to the AOI inspection module for product inspection. S8. After the inspection is completed, the tank carrier is sent back to the tank carrier loading platform; The S9 multi-purpose robotic arm returns the completed Ring to the material box position, while the vibration DIE protective cover remains on the vibration DIE platform to await the next wafer operation.

[0013] By adopting this invention, the entire process of vibration DIE operation is automated, reducing manual intervention; and the vibration DIE protective cover structure prevents invalid DIE from being mixed into the finished product; a traceable relationship between weight data and wafer batches is established; and the stability and consistency of micro DIE collection are improved. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the overall three-dimensional structure of the device of the present invention; Figure 2This is a schematic diagram of the upper and lower material positions of the cutting box in the device of the present invention; Figure 3 This is a schematic diagram of the multi-purpose robotic arm of the device of the present invention; Figure 4 This is a schematic diagram of the shock-absorbing protective cover chamber of the device of the present invention; Figure 5 This is a schematic diagram of the product alignment platform of the device of the present invention; Figure 6 This is a schematic diagram of the vibration DIE platform of the device of the present invention; Figure 7 This is a schematic diagram of the tank-shaped carrier transport module of the device of the present invention; Figure 8 This is a schematic diagram of the weighing module of the device of the present invention; Figure 9 This is a schematic diagram of the AOI detection module of the device of the present invention; Figure 10 This is a schematic diagram of the tank-shaped carrier loading platform of the device of the present invention; The names corresponding to the serial numbers in the diagram are as follows: 10 Material box loading / unloading position for cutting material box, 11 Material box station, 20 Multi-purpose robotic arm, 21 First pick-and-place arm and 22 Second pick-and-place arm, 30 Vibration DIE protective cover chamber, 40 Product centering platform, 50 Vibration DIE platform, 51 DIE output end, 52 Tank carrier placement position, 53 Linear movement cylinder, 54 Filling and loading vehicle entry / exit station, 60 Tank carrier loading platform, 70 Weighing module, 80 AOI inspection module, 90 Tank carrier handling module, 100 Tank loading vehicle, 110 Vibration DIE protective cover, 120 Frame, 121 Workbench. Detailed Implementation

[0015] A fully automated chip separation station, see Figures 1-10 It includes a cutting box loading and unloading position 10, a multi-purpose robotic arm 20, which includes a first picking and placing arm 21 and a second picking and placing arm 22, a vibration DIE protective cover 30, a product centering platform 40, a vibration DIE platform 50, a can-shaped carrier loading platform 60, a weighing module 70, an AOI inspection module 80, and a can-shaped carrier handling module 90; The cutting box loading and unloading positions 10 include at least two box stations 11. Each box station 11 is used to store multiple wafers carried by the Ring. Each box station 11 is connected to the in-plant overhead crane system to achieve automatic loading. The multi-purpose robotic arm 20 includes a first pick-and-place arm 21 and a second pick-and-place arm 22; The shock DIE protection cover compartment 30 is used to store the shock DIE protection cover 110; Product alignment platform 40 is used for the alignment of Ring wafers. When the wafer is not in the exact center of the Ring, this platform is used for wafer alignment. The vibration DIE platform 50 is used to support the combination of the vibration DIE protective cover and the Ring wafer, and has a built-in vibration drive unit. After the vibration DIE protective cover is attached to the wafer, it generates vibration to separate the effective DIE from the carrier. The weighing module 70 is used to weigh the canister carrier before and after receiving the material to obtain the net weight data of the product. AOI inspection module 80 is used for the appearance inspection of products after vibration DIE; The tank carrier handling module 90 is used to transfer the tank carrier between the tank carrier loading platform 60, the vibrating DIE platform receiving port, the weighing module 70, and the AOI inspection module 80.

[0016] In a specific embodiment, a tank-shaped carrier placement position 52 is provided at the lower DIE output end 51 of the vibration DIE platform 50. The material inlet of the tank loading container 100 is connected to the DIE output end 51, which makes the outer ring invalid DIE blocked by the vibration DIE protective cover 110, ensuring the validity of the DIE flowing into the tank loading container 100. The tank carrier placement position 52 is supported on the output end of the linear motion cylinder 53. The linear motion cylinder 53 drives the tank carrier placement position to switch between the DIE output end 51 and the loading and unloading station 54. The DIE output end 51 is provided with a guide sleeve to ensure that the DIE reliably enters the tank carrier 100.

[0017] In specific implementation, it also includes a frame 120, a workbench 121 is provided on the upper part of the frame 120, a cutting box loading and unloading position 10 is provided on one side of the long end of the workbench 121, a multi-purpose robotic arm 20 is provided at the middle position of the upper surface of the workbench 121 corresponding to the cutting box loading and unloading position 10, and a vibration DIE protective cover 30, a product centering platform 40, and a vibration DIE platform 50 are arranged on the upper surface of the other side of the long end of the workbench 121. The picking and placing arm area of ​​the multi-purpose robotic arm 20 covers the vibration DIE protective cover 30, the product centering platform 40, and the vibration DIE platform 50. The movement range of the can-shaped carrier handling module 80 covers the vibration DIE platform 50, the can-shaped carrier loading platform 60, the weighing module 70, and the AOI inspection module 80. The first pick-and-place arm 21 and the second pick-and-place arm 22 are coaxially arranged. The first pick-and-place arm 21 is used to clamp the wafer carried by the Ring ring; the second pick-and-place arm 22 is used to clamp the shock DIE protective cover 110.

[0018] A fully automated chip separation method includes the following steps: S1. The overhead crane delivers the cassette containing multiple Ring wafers to the wafer cassette unloading position 10. S2. The multi-purpose robotic arm takes out a Ring wafer and a vibration DIE protective cover, and places them on the vibration DIE platform in sequence, with the vibration DIE protective cover at the bottom and the wafer at the top. S3. The can-shaped carrier transport module transports the empty can to the weighing module for initial weight measurement. S4. After weighing, send the tank carrier to the bottom of the receiving port of the DIE platform. S5, the vibration DIE platform performs vibration separation operation, so that the effective DIE falls into the tank-shaped carrier; S6. After separation, the handling module will send the can-shaped carrier containing the product back to the weighing module for weighing. S7. After weighing, send the tank-shaped carrier to the AOI inspection module for product inspection. S8. After the inspection is completed, the tank carrier is sent back to the tank carrier loading platform; The S9 multi-purpose robotic arm returns the completed Ring to the material box position, while the vibration DIE protective cover remains on the vibration DIE platform to await the next wafer operation.

[0019] It achieves full automation of the vibration DIE operation process, reducing manual intervention; and prevents invalid DIE from being mixed into the finished product through the vibration DIE protective cover structure; establishes a traceability relationship between weight data and wafer batch; and improves the stability and consistency of micro DIE collection.

[0020] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other specific forms without departing from its spirit or essential characteristics. Therefore, the embodiments should be considered in all respects as exemplary and non-limiting, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within the present invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0021] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A fully automated chip separation station, characterized in that, It includes: The cutting material box has upper and lower material positions, including at least two material box stations. Each material box station is used to store multiple wafers carried by the Ring. Each material box station is connected to the in-plant crane system to realize automatic feeding. A multi-purpose robotic arm, comprising a first pick-and-place arm and a second pick-and-place arm; The shock DIE protection cover compartment is used to store shock DIE protection covers; Product alignment platform for aligning Ring wafers; The vibration DIE platform is used to support the assembly of the vibration DIE protective cover and the Ring wafer, and has a built-in vibration drive unit that generates vibration after the vibration DIE protective cover is attached to the wafer to separate the effective DIE from the carrier. Tank-shaped loading platform; The weighing module is used to weigh the canister carrier before and after receiving the material to obtain the net weight data of the product. AOI inspection module, used for visual inspection of products after vibration DIE; And a tank carrier handling module, used to transfer the tank carrier between the tank carrier loading platform, the vibrating DIE platform receiving port, the weighing module and the AOI detection module.

2. The fully automated chip separation station according to claim 1, characterized in that: The lower DIE output end of the vibration DIE platform is provided with a tank-shaped carrier placement position, and the material inlet of the tank-shaped carrier is connected to the DIE output end.

3. The fully automated chip separation station according to claim 2, characterized in that: The canister placement position is supported on the output end of a linear motion cylinder. The linear motion cylinder drives the canister placement position to switch between the DIE output end and the loading and unloading station. The DIE output end is provided with a guide sleeve to ensure that the DIE reliably enters the canister.

4. The fully automated chip separation station according to claim 1, characterized in that: It also includes a frame, with a workbench on the upper part of the frame. A cutting box loading and unloading position is set on one side of the workbench at one end of its length. A multi-purpose robotic arm is set at the middle of the upper surface of the workbench corresponding to the cutting box loading and unloading position. A vibration DIE protective cover, a product centering platform, and a vibration DIE platform are arranged on the upper surface of the other side of the workbench at one end of its length. The picking and placing arm of the multi-purpose robotic arm covers the vibration DIE protective cover, the product centering platform, and the vibration DIE platform. The movement range of the can-shaped carrier handling module covers the vibration DIE platform, the can-shaped carrier loading platform, the weighing module, and the AOI inspection module.

5. The fully automated chip separation station according to claim 1, characterized in that: The first pick-and-place arm and the second pick-and-place arm are coaxially arranged. The first pick-and-place arm is used to pick up the wafer carried by the Ring; the second pick-and-place arm is used to pick up the shock DIE protective cover.

6. A fully automated chip separation method, comprising using a fully automated chip separation workstation as described in any one of claims 1-5, characterized in that, It includes the following steps: S1. The overhead crane delivers the cassette containing multiple Ring wafers to the wafer cassette unloading position; S2. The multi-purpose robotic arm takes out a Ring wafer and a vibration DIE protective cover, and places them on the vibration DIE platform in sequence, with the vibration DIE protective cover at the bottom and the wafer at the top. S3. The can-shaped carrier transport module transports the empty can to the weighing module for initial weight measurement. S4. After weighing, send the tank carrier to the bottom of the receiving port of the DIE platform. S5. The vibration DIE platform performs vibration separation operations, allowing the effective DIE to fall into the tank-shaped carrier. S6. After separation, the handling module will send the can-shaped carrier containing the product back to the weighing module for weighing. S7. After weighing, send the tank-shaped carrier to the AOI inspection module for product inspection. S8. After the inspection is completed, the tank carrier is sent back to the tank carrier loading platform; The S9 multi-purpose robotic arm returns the completed Ring to the material box position, while the vibration DIE protective cover remains on the vibration DIE platform awaiting the next wafer operation.

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