Semiconductor wafer single wafer cleaning apparatus

Abstract

The present application relates to wafer cleaning technical field, specifically, it is a kind of semiconductor wafer single piece cleaning equipment, including: body, the body is equipped with cleaning tank and double-sided feeding assembly, the cleaning tank and the double-sided feeding assembly are provided with inside and outside cleaning mechanism, the double-sided feeding assembly can be fixed wafer on two sides respectively and wafer is moved into the cleaning tank, the inside and outside cleaning mechanism can be inserted into the double-sided feeding assembly simultaneously clean the front and back of wafer, two wafers are sent into cleaning tank by being fixed back to back, but still relatively independent cleaning of two wafers is carried out by inside and outside cleaning mechanism, prevent crossing while substantially improve cleaning efficiency, and the inside and outside cleaning mechanism can be differentiated to clean the front and back of two wafers, after wafer is fixed, no need to carry out action such as turning over, faster complete cleaning, to comprehensively make production capacity be improved.

Description

Technical Field

[0001] This invention relates to the field of wafer cleaning technology, and more specifically, to a semiconductor wafer single-wafer cleaning device. Background Technology

[0002] A wafer is a silicon wafer used to fabricate silicon semiconductor circuits; its raw material is silicon. High-purity polycrystalline silicon is dissolved, doped with silicon crystal seeds, and then slowly pulled out to form a cylindrical single-crystal silicon wafer. After grinding, polishing, and slicing, the silicon ingot forms a silicon wafer. Wafer cleaning refers to the process of removing contaminants and oxides from the wafer surface using chemical or physical methods during integrated circuit manufacturing, ensuring the wafer surface meets cleanliness requirements. The principle of wafer cleaning is to remove various impurities without damaging the wafer. After wet cleaning, the wafer must be thoroughly dried to ensure the surface is free of watermarks before proceeding to the next process.

[0003] As integrated circuit manufacturing processes continue to shrink, the cleanliness requirements for wafer surfaces have reached the atomic level. Compared to traditional batch cleaning (such as tank wet cleaning), single-wafer cleaning technology has become an indispensable key process in advanced manufacturing processes due to its superior process uniformity, lower risk of cross-contamination, and good compatibility with large-size wafers. It aims to meet the extremely high requirements of advanced semiconductor manufacturing for cleanliness, process precision, and yield control.

[0004] However, the fatal flaw of single-wafer cleaning machines is that they can only clean one wafer at a time, resulting in low cleaning efficiency, long production cycles, and low capacity. Furthermore, because the front side of a wafer houses circuitry, while the back side is only a contact surface, the cleaning logic and standards differ between the two sides. This necessitates flipping the wafer to clean both sides sequentially. Additionally, nitrogen gas is sprayed onto the back side during front-side cleaning to create an air curtain barrier, using the pressure difference to prevent acidic cleaning solutions from flowing onto the back side. This process also etches rough pits and other imperfections on the back side, compromising its smoothness and reducing cleaning efficiency. The yield is low and requires a large amount of nitrogen. When cleaning the front side of the wafer, the adhesive or oxide layer is removed first, followed by rinsing with ultrapure water. The centrifugal force generated by the wafer rotation throws the solution containing the contaminants and pure water out of the wafer edge in a spiral shape. Although this ensures that the water flow covers the entire surface and there are no dead corners, the nozzle directly discharges the solution vertically onto the wafer. The centrifugal force makes the water flow to achieve cleaning, but the impact force is weak. For some firmly attached impurities, it may not be able to completely remove them from the wafer. If they are detected later, rework is required or the yield will decrease directly. Summary of the Invention

[0005] The purpose of this invention is to provide a semiconductor wafer single-wafer cleaning device to solve the above-mentioned problems.

[0006] To achieve the above objectives, the present invention provides a semiconductor wafer single-wafer cleaning device, characterized in that it includes: a body, wherein the body is provided with a cleaning tank and a double-sided loading assembly, and the cleaning tank and the double-sided loading assembly are provided with internal and external cleaning mechanisms; The double-sided loading assembly can fix wafers on both sides and transfer wafers into the cleaning tank; The internal and external cleaning mechanisms can be actively inserted into the double-sided loading assembly to simultaneously clean the front and back sides of the wafer.

[0007] Furthermore, the double-sided feeding assembly includes: A first linear module is installed on the inner top of the body; Guide rods, the two guide rods are vertically arranged on the mover of the first linear module; The self-propelled pneumatic gripper is mounted on two guide rods and can move straight up and down along the two guide rods. A rotating base, which is mounted on the machine body; A fixed frame is mounted on the rotating base; The material picking frame plate is inserted into the fixed frame from top to bottom. The fixed frame has protruding ribs on its inner side and grooves on its side. When the material picking frame plate is inserted into the fixed frame, the protruding ribs are engaged in the grooves. The top of the material picking frame plate has a protrusion. After the self-propelled pneumatic gripper moves down to the protrusion, it can clamp the material picking frame plate. At this time, the self-propelled pneumatic gripper moves up to pull the material picking frame plate out of the fixed frame. The lower half ring has a circular opening on the material picking frame plate, and the two lower half rings are respectively installed on the front and back sides of the material picking frame plate; The upper half ring, the two upper half rings are respectively slidably mounted on the front and back sides of the material picking frame plate, and the lower half ring and the upper half ring on both sides of the material picking frame plate are spliced ​​together at the circular opening to form a ring; The two power plates are concealed within the material picking frame plate and are respectively connected to the two upper half rings. The two power plates are connected to the drive component inside the material picking frame plate. When the drive component is activated, the two power plates lift the two upper half rings, causing the upper half rings to separate from the lower half rings.

[0008] Furthermore, the internal and external cleaning mechanism includes: An electric push rod is mounted on the inner bottom surface of the cleaning tank; A turnover box is connected to the output end of the electric push rod directly above it. The turnover box is connected to the ultrapure water supply source. When the material picking frame plate is lowered into the cleaning tank, the turnover box is attached to and snapped into the material picking frame plate. The two inner nozzles are connected to the turnover box, and the two inner nozzles are respectively obliquely facing the two inner sides of the material picking frame plate; A base plate, which is mounted on the output end of the electric push rod; A polyvinyl alcohol soft brush, which is rotatably mounted on the base plate; The motor is mounted on the base plate and connected to the polyvinyl alcohol soft brush. When the motor is started, it drives the polyvinyl alcohol soft brush to rotate.

[0009] Furthermore, the output end of the electric actuator is equipped with a transverse self-driving base; The base plate is mounted on the transverse self-driving base.

[0010] Furthermore, the internal and external cleaning mechanism also includes: The second linear module, two of the second linear modules are installed on the inner side of the cleaning tank; The first arm, and two groups of several first arms are respectively mounted on two second linear modules; The two external nozzles are respectively installed on two sets of several first arms, and the two external nozzles are obliquely downward facing the front and back sides of the material picking frame plate, and the two external nozzles are connected to the liquid supply source. A plurality of semi-ring nozzles are installed on the inner side of the material pick-up frame plate and correspond to the lower half ring and the upper half ring. The plurality of semi-ring nozzles are connected to a hot nitrogen supply source. After the wafer is fixed, the semi-ring nozzles are flush with the back side of the wafer.

[0011] Furthermore, the tip of the external nozzle is soft and flexible; The second linear module is equipped with several second arms, which are connected to a rigid back plate. The two ends of the rigid back plate are equipped with movable pin plates, and two of the movable pin plates are connected to a pressing strip. The rigid back plate and the pressing strip clamp the end of the outer nozzle in the middle, and the rigid back plate is in contact with the outer nozzle. The two ends of the rigid back plate are connected to fixed end arms. The fixed end arms have grooves, and short push rods are slidably installed in the grooves. The short push rods are connected to the pressing strips. The fixed end arms are equipped with air pipes, which are connected to an air pump and lead to the bottom of the grooves on the fixed end arms.

[0012] Furthermore, two sets of third arms are installed facing each other on the top of the cleaning tank, and each of the two sets of third arms is equipped with a drying nozzle, which is connected to a hot nitrogen supply source. The two drying nozzles are angled downwards and face the front and back sides of the material receiving frame plate, respectively.

[0013] Furthermore, the back of the lower half ring and the upper half ring are fitted with beveled edge rings.

[0014] Furthermore, the two semi-annular nozzles located below are also connected to a negative pressure generator.

[0015] Furthermore, a liquid-collecting support plate is installed on the output end of the electric push rod, and a drain pipe is connected to the lowest point of the liquid-collecting support plate; After the electric push rod is activated, the polymer liquid tray can be pushed into the material picking frame plate.

[0016] Compared with the prior art, the present invention has the following beneficial effects: This invention uses a double-sided loading assembly to fix two wafers back-to-back and feed them into the cleaning tank in one go. However, the internal and external cleaning mechanisms still clean the two wafers relatively independently, preventing cross-cleaning and significantly improving cleaning efficiency. Furthermore, the internal and external cleaning mechanisms can simultaneously perform differentiated cleaning on the front and back sides of the two wafers. After the wafers are fixed, there is no need for flipping or other actions, allowing for faster cleaning and overall capacity improvement. Simultaneously, the internal and external cleaning mechanisms use nitrogen gas to provide highly targeted protection for the back side of the wafers, reducing nitrogen consumption and saving resources. In addition, during wafer cleaning, the internal and external cleaning mechanisms move and spray the cleaning fluid directly onto every part of the wafer, rather than using centrifugal force to make the cleaning fluid flow. This ensures full coverage and that every part of the wafer is directly subjected to the powerful impact of the cleaning fluid, ensuring that all impurities are removed from the wafers, avoiding subsequent rework or a decrease in yield. Attached Figure Description

[0017] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0018] Figure 1 A perspective view of the present invention is shown; Figure 2 A second perspective view of the present invention is shown; Figure 3 A third perspective view of the present invention is shown; Figure 4 A fourth perspective view of the present invention is shown; Figure 5 A partial side view of the invention is shown; Figure 6 A fifth perspective view of the present invention is shown; Figure 7 A sixth perspective view of the present invention is shown; Figure 8 A seventh perspective view of the present invention is shown; Figure 9 An eighth perspective view of the present invention is shown; Figure 10 A ninth perspective view of the present invention is shown; Figure 11 The present invention is shown. Figure 3 Enlarged view of point A; Figure 12 The present invention is shown. Figure 6 Enlarged view of point B; Figure 13 The present invention is shown. Figure 7 Enlarged view of point C; Figure 14 The present invention is shown. Figure 8 Enlarged view of point D; Figure 15 The present invention is shown. Figure 9 Enlarged view of point E; Figure 16 The present invention is shown. Figure 10 Enlarged view at point F; Figure 17 The present invention is shown. Figure 10 Enlarged view of point G.

[0019] In the figure, the same reference numerals represent the same structural element, wherein: 1. Machine body; 2. Cleaning tank; 3. Double-sided feeding assembly; 31. First linear module; 32. Guide rod; 33. Self-propelled pneumatic gripper; 34. Rotary seat; 35. Fixed frame; 36. Material picking frame plate; 37. Lower half ring; 38. Upper half ring; 39. Power plate; 4. Internal and external cleaning mechanism; 41. Electric push rod; 41. Horizontal self-driven base; 42. Turnover box; 43. Inner nozzle; 44. Base plate; 45. Polyvinyl alcohol soft brush; 46. Motor; 47. Second linear module; 48. First support arm; 49. Outer nozzle; 5. Second support arm; 6. Hard back plate; 7. Movable pin plate; 8. Pressing strip; 9. Fixed end arm; 10. Short push rod; 11. Air pipe; 12. Third support arm; 13. Drying nozzle; 14. Beveled edge ring; 15. Liquid collection support plate; 16. Drain pipe. Detailed Implementation

[0020] The present invention will now be described in further detail with reference to the accompanying drawings. These drawings are simplified schematic diagrams, illustrating only the basic structure of the invention, and therefore only show the components relevant to the invention.

[0021] like Figures 1-17As shown, a semiconductor wafer single-wafer cleaning equipment includes: a body 1, a cleaning tank 2 and a double-sided loading assembly 3 inside the body 1, and an inner and outer cleaning mechanism 4 on the cleaning tank 2 and the double-sided loading assembly 3; The double-sided loading assembly 3 can fix wafers on both sides and transfer wafers into the cleaning tank 2; The internal and external cleaning mechanism 4 can actively insert into the double-sided loading assembly 3 to simultaneously clean both sides of the wafer. The double-sided loading assembly 3 fixes two wafers back to back and sends them into the cleaning tank 2 at once. However, the internal and external cleaning mechanism 4 still cleans the two wafers relatively independently, preventing cross-contamination and significantly improving cleaning efficiency. Furthermore, the internal and external cleaning mechanism 4 can simultaneously perform differentiated cleaning on the front and back sides of the two wafers. After the wafers are fixed, there is no need to flip them, etc., completing the cleaning faster and thus improving overall production capacity. At the same time, the internal and external cleaning mechanism 4 uses nitrogen gas to protect the back side of the wafer with highly targeted protection, thereby reducing nitrogen consumption and saving resources. In addition, when cleaning the wafers, the internal and external cleaning mechanism 4 moves and sprays the cleaning fluid directly onto every part of the wafer, rather than using centrifugal force to make the cleaning fluid flow. This ensures full coverage and that every part of the wafer is directly washed by the powerful cleaning fluid, ensuring that all impurities are removed from the wafer and avoiding rework or a decrease in yield.

[0022] Optionally, the double-sided feeding assembly 3 includes: The first linear module 31 is installed on the inner top of the body 1; Guide rods 32, two guide rods 32 are vertically set on the mover of the first linear module 31; The self-propelled pneumatic gripper 33 is mounted on two guide rods 32 and can move straight up and down along the two guide rods 32. Rotary seat 34 is mounted on the machine body 1; Fixed frame 35 is mounted on rotating seat 34; The material picking frame plate 36 is inserted into the fixed frame 35 from top to bottom. The fixed frame 35 has protruding ribs on the inside and grooves on the side of the material picking frame plate 36. When the material picking frame plate 36 is inserted into the fixed frame 35, the protruding ribs are engaged in the grooves. The top of the material picking frame plate 36 has a protrusion. The self-propelled pneumatic gripper 33 moves down to the protrusion and can clamp it. At this time, the self-propelled pneumatic gripper 33 moves up and can pull the material picking frame plate 36 out of the fixed frame 35. The lower half ring 37 has a circular opening on the material picking frame plate 36, and the two lower half rings 37 are respectively installed on the front and back sides of the material picking frame plate 36; The upper half ring 38, the two upper half rings 38 are respectively slidably mounted on the front and back sides of the material picking frame plate 36, and the lower half ring 37 and the upper half ring 38 on both sides of the material picking frame plate 36 are spliced ​​together at the circular opening to form a ring. Two power plates 39 are concealed within the material handling frame plate 36 and are respectively connected to the two upper half rings 38. The two power plates 39 are connected to the drive components inside the material handling frame plate 36. When the drive components are activated, the two power plates 39 lift the two upper half rings 38, separating them from the lower half rings 37. The material handling frame plate 36 is equipped with existing electric devices such as miniature cylinders as the drive components. This cleaning equipment is part of a complete production line. During production, the preceding feeding robot grabs and feeds the wafer to be cleaned, placing the edge of the wafer against the inner side of the lower half ring 37. Then, the drive components inside the material handling frame plate 36 are activated, pushing the upper half rings 38 downwards, so that the upper half rings 38 also adhere to the edge of the wafer. Thus, the upper half rings 38 and the lower half rings 37 together clamp and fix the wafer, with the front of the wafer facing outwards and the back facing the material handling frame plate. Inside 36, the rotating seat 34 is then activated to turn the pick-up frame plate 36 around, and the other side of the pick-up frame plate 36 is turned over. Then, another wafer is fixed in the same way, with the backs of the two wafers facing each other and both facing the inside of the pick-up frame plate 36. Then, the self-propelled pneumatic gripper 33 moves down through two guide rods 32 until it touches the protrusion on the top of the pick-up frame plate 36 and clamps it. Then, the self-propelled pneumatic gripper 33 moves up again to pull the pick-up frame plate 36 with the wafer fixed out of the fixed frame 35. With the help of the first linear module 31, the pick-up frame plate 36 with the wafer fixed is sent into the cleaning tank 2. The two wafers are fixed on the two sides of the pick-up frame plate 36 respectively. This achieves the goal of fixing the two wafers and sending them into the cleaning tank 2, while using the pick-up frame plate 36 to separate the two wafers so that their backs face each other, providing conditions for relatively independent cleaning of the two wafers.

[0023] Optionally, the internal and external cleaning mechanism 4 includes: Electric push rod 41 is installed on the inner bottom surface of the cleaning tank 2; The turnover box 42 is located directly above the electric push rod 41 and connected to its output end. The turnover box 42 is connected to the ultrapure water supply source. When the material pick-up frame plate 36 is lowered into the cleaning tank 2, the turnover box 42 is attached to and locked into the material pick-up frame plate 36. The inner nozzle 43 is connected to the turnover box 42, and the two inner nozzles 43 are respectively inclined towards the two inner sides of the material picking frame plate 36. Base plate 44 is mounted on the output end of electric push rod 41; Polyvinyl alcohol soft brush 45 is rotatably mounted on the base plate 44; Motor 46 is mounted on base plate 44 and connected to polyvinyl alcohol soft brush 45. When motor 46 is started, it drives polyvinyl alcohol soft brush 45 to rotate. When the material picking frame plate 36 is fed into cleaning tank 2, the turnover box 42 is passively engaged into the material picking frame plate 36. After the material picking frame plate 36 is in place, the ultrapure water supply source is simultaneously turned on, motor 46 is started, and electric push rod 41 is activated. The ultrapure water supply source supplies ultrapure water into the turnover box 42 and then discharges it outwards from the two inner nozzles 43. Motor 46 drives polyvinyl alcohol soft brush 45 to start rotating, and electric push rod 41 aligns base plate 44 and turnover box 42. The wafer is lifted upwards, allowing it to fully enter the material pick-up frame plate 36. During this process, the two inner nozzles 43 spray ultrapure water onto the back of the two wafers, while the polyvinyl alcohol soft brush 45 performs a scrubbing. The polyvinyl alcohol soft brush 45, with its advantages of high water absorption, soft elasticity, low particle release, chemical resistance, and antistatic properties, effectively removes particulate impurities and organic contaminants without damaging the wafer surface. After thorough scrubbing, the polyvinyl alcohol soft brush 45 is stopped, and the ultrapure water flow rate is increased to ensure that the large flow rate of ultrapure water sprayed from the two inner nozzles 43 washes away particulate contaminants, thereby completing the cleaning of the back of the two wafers.

[0024] Optionally, the output end of the electric actuator 41 is equipped with a transverse self-driven base 411; The base plate 44 is mounted on the transverse self-driven base 411. The transverse self-driven base 411 has a structure such as a sliding rail slider or a gear rack, which can carry the base plate 44 to move laterally. When the polyvinyl alcohol soft brush 45 is brushing the back of the wafer, the transverse self-driven base 411 is continuously activated in both forward and reverse directions, so that the base plate 44 and the polyvinyl alcohol soft brush 45 move back and forth slightly within the material pick-up frame plate 36. This allows the polyvinyl alcohol soft brush 45 to apply a certain amount of pressure to brush the back of the wafer, improving the brushing effect and preventing particulate impurities and organic contaminants from not being fully removed.

[0025] Optionally, the internal and external cleaning mechanism 4 also includes: The second linear module 47, two second linear modules 47 are installed on the inner side of the cleaning tank 2; The first arm 48, and two sets of several first arms 48 are respectively installed on two second linear modules 47; External nozzles 49 are mounted on two sets of first arms 48, with each nozzle pointing downwards towards the front and back of the pick-up frame plate 36. Both nozzles are connected to the liquid supply source. Semi-ring nozzles are mounted on the inner side of the pick-up frame plate 36, corresponding to the lower ring 37 and upper ring 38. These nozzles are connected to the hot nitrogen supply source. After the wafer is fixed, the semi-ring nozzles are flush with the back of the wafer. Hot nitrogen is simultaneously activated when cleaning the back of the wafer. The gas supply source initially supplies heated, clean nitrogen gas, which is then blown out through several semi-ring nozzles. The hot nitrogen gas is blown from the outer edges of the back surfaces of the two wafers towards the center, creating a hot nitrogen gas curtain between the wafer edges and the lower and upper semi-rings 37 and 38. This curtain prevents acidic cleaning fluid from diffusing through the tiny gaps between the wafer edges and the lower and upper semi-rings 37 and 38 to reach the back surfaces, thus protecting the wafer back surfaces. This method of using hot nitrogen gas directly to protect the areas where the acidic cleaning fluid diffuses is highly targeted and eliminates the need for large amounts of nitrogen to cover and permeate the wafers. The entire back side of the wafer is cleaned, effectively reducing nitrogen usage and saving resources. Simultaneously, the front side of the wafer can be cleaned. The chemical supply source and the second linear module 47 are activated. Under the cyclical movement of the second linear module 47, two external nozzles 49 move up and down, spraying the cleaning solution diagonally downwards onto the front side of the wafer. This allows the cleaning solution to be directly sprayed onto every part of the front side of the wafer via the moving external nozzles 49, instead of relying on centrifugal force to allow the cleaning solution to flow on the wafer. This ensures complete coverage of the front side, with each area directly receiving a strong impact from the cleaning solution, guaranteeing that all impurities are removed from the wafer. This avoids rework or a decrease in yield. The front sides of the two wafers are cleaned on opposite sides without overlapping, remaining independent. However, this allows for relatively independent cleaning of two wafers at once, without the need for flipping or other actions to clean both sides. It enables simultaneous, differentiated cleaning of both sides of the two wafers, significantly improving cleaning efficiency and increasing production capacity.

[0026] Optionally, the tip of the outer nozzle 49 is soft and flexible; The second linear module 47 is equipped with several second arms 5, which are connected to a rigid backplate 6. Movable pins 7 are mounted at both ends of the rigid backplate 6, and two movable pins 7 are connected to a pressing strip 8. The rigid backplate 6 and the pressing strip 8 clamp the end of the outer nozzle 49 in the middle, with the rigid backplate 6 in contact with the outer nozzle 49. Fixed end arms 9 are connected to both ends of the rigid backplate 6. The fixed end arms 9 have grooves, and short push rods 10 are slidably installed in the grooves. The short push rods 10 are connected to the pressing strip 8. Air pipes 11 are mounted on the fixed end arms 9, connected to an air pump and leading to the bottom of the grooves on the fixed end arms 9. When cleaning the front side of the wafer, the air pump is started and stopped regularly, and air is injected into the grooves of the fixed end arms 9 through the air pipes 11, pushing out the short push rods 10. The short push rods 10 then push the pressing strip 8 and the two movable pins 7, causing the pressing strip... 8. The end of the outer nozzle 49 is squeezed on the hard back plate 6 to flatten it, reducing the outlet area of ​​the end of the outer nozzle 49 and increasing the flow rate of the cleaning solution, thereby increasing the impact force of the cleaning solution. After the air pump stops, the pressure in the groove of the fixed end arm 9 disappears, and the outer nozzle 49 rebounds after losing pressure restriction. The cycle of clamping and rebounding strengthens the impact force of the cleaning solution and obtains dynamic rinsing pressure, thereby improving the rinsing cleaning effect and ensuring that all impurities are removed from the wafer. On the other hand, if chemical solution crystallization or particle blockage occurs at the end of the outer nozzle 49, the flattening action can force the crystals to fall off and the particles to flow, preventing the spray flow rate from decreasing or the angle from shifting due to chemical solution crystallization or particle blockage at the end of the outer nozzle 49, thus avoiding affecting the cleaning effect and requiring maintenance.

[0027] Optionally, two sets of third arms 12 are installed facing each other on the top of the cleaning tank 2. Each of the two sets of third arms 12 is equipped with a drying nozzle 13, which is connected to a hot nitrogen supply source. Two drying nozzles 13 are angled downwards towards the front and back sides of the pick-up frame plate 36, respectively. After cleaning, several semi-circular nozzles continuously blow hot nitrogen from the outer edge of the back side of the two wafers towards the center to blow away the residual liquid on the back side, thus completing the drying process. When the self-propelled pneumatic gripper 33 begins to remove the pick-up frame plate 36 from the cleaning tank 2, the hot nitrogen supply source connected to the drying nozzles 13 is turned on. During the upward movement of the pick-up frame plate 36, the two drying nozzles 13 blow hot nitrogen towards the front side of the two wafers at an angle downwards to blow away the residual liquid on the front side, thereby completing the drying work on the front and back sides of the two wafers and preventing water marks from being left on the wafers.

[0028] Optionally, the back of the lower half ring 37 and the upper half ring 38 are equipped with beveled edge mounting rings 14. The edges of the wafer are generally chamfered. After the wafer is fixed, the chamfered edge of the wafer is attached to the beveled edge mounting ring 14, thereby improving the isolation effect between the front and back of the wafer. This makes the diffusion channel of the acid cleaning solution tortuous. Combined with the hot nitrogen curtain, the diffusion channel of the acid cleaning solution is completely blocked, ensuring effective protection of the back of the wafer.

[0029] Optionally, the two lower semi-annular nozzles are also connected to a negative pressure generator. The two lower semi-annular nozzles are connected to the hot nitrogen supply source and the negative pressure generator respectively through electrically controlled three-way valves. Under normal circumstances, they are only connected to the hot nitrogen supply source. When cleaning is completed and the back of the wafer begins to dry, the connection between the semi-annular nozzles and the negative pressure generator is switched on, and the negative pressure generator is activated. In this way, the upper semi-annular nozzle blows hot nitrogen downward to blow away the residual liquid on the back of the wafer, and the lower semi-annular nozzle creates suction to draw away the residual liquid on the back of the wafer. The blowing and suction enhance the drying effect, ensure thorough drying, and prevent water marks from being left on the wafer.

[0030] Optionally, the output end of the electric actuator 41 is equipped with a liquid collection plate 15, and the lowest point of the liquid collection plate 15 is connected to a drain pipe 16. After the electric push rod 41 is activated, the liquid collection tray 15 can be pushed into the pick-up frame plate 36. When cleaning the back side of the wafer, the liquid collection tray 15 is also pushed into the pick-up frame plate 36 by the electric push rod 41. Due to the presence of the liquid collection tray 15, the ultrapure water used for cleaning is blocked in the pick-up frame plate 36. The drain pipe 16 then discharges the collected ultrapure water outward. The ultrapure water used for cleaning the back side is not mixed with acidic cleaning solution. Collecting it separately can reduce the burden of subsequent purification treatment by avoiding mixing with the liquid used for cleaning the front side. When cleaning the wafer, the liquid collection tray 15 and the turnover box 42 form two barriers in the pick-up frame plate 36, which effectively prevents the acidic cleaning solution used for cleaning the front side from spreading into the pick-up frame plate 36 in the form of water mist, thus protecting the back side of the wafer.

[0031] The above description is merely a preferred embodiment of the present invention and is not intended to limit the invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A semiconductor wafer single-wafer cleaning device, characterized in that, include: The machine body (1) is provided with a cleaning tank (2) and a double-sided feeding assembly (3) inside the machine body (1). The cleaning tank (2) and the double-sided feeding assembly (3) are provided with internal and external cleaning mechanisms (4). The double-sided loading assembly (3) can fix wafers on both sides and transfer wafers into the cleaning tank (2); The internal and external cleaning mechanism (4) can be actively inserted into the double-sided loading assembly (3) to simultaneously clean the front and back sides of the wafer.

2. The semiconductor wafer single-wafer cleaning equipment as described in claim 1, characterized in that, The double-sided feeding assembly (3) includes: The first linear module (31) is installed on the inner top of the body (1); Guide rods (32), two guide rods (32) are vertically arranged on the mover of the first linear module (31); The self-propelled pneumatic gripper (33) is mounted on two guide rods (32) and can move straight up and down along the two guide rods (32). A rotating base (34) is disposed on the body (1); A fixed frame (35) is mounted on the rotating seat (34); The material picking frame plate (36) is inserted into the fixed frame (35) from top to bottom. The fixed frame (35) has a rib on the inside and a groove on the side of the material picking frame plate (36). When the material picking frame plate (36) is inserted into the fixed frame (35), the rib is inserted into the groove. The top of the material picking frame plate (36) has a protrusion. The self-propelled pneumatic gripper (33) moves down to the protrusion and can clamp it. At this time, the self-propelled pneumatic gripper (33) moves up and can pull the material picking frame plate (36) out of the fixed frame (35). The lower half ring (37) has a circular opening on the material picking frame plate (36), and the two lower half rings (37) are respectively installed on the front and back sides of the material picking frame plate (36); The upper half ring (38) and the two upper half rings (38) are respectively slidably mounted on the front and back sides of the material picking frame plate (36). The lower half ring (37) and the upper half ring (38) on both sides of the material picking frame plate (36) are spliced ​​together at the circular opening to form a ring. The two power plates (39) are concealed within the material picking frame plate (36) and are respectively connected to the two upper half rings (38). The two power plates (39) are connected to the drive component inside the material picking frame plate (36). When the drive component is started, the two power plates (39) lift the two upper half rings (38) up, so that the upper half rings (38) are separated from the lower half rings (37).

3. The semiconductor wafer single-wafer cleaning equipment as described in claim 2, characterized in that, The internal and external cleaning mechanisms (4) include: An electric push rod (41) is installed on the inner bottom surface of the cleaning tank (2); The turnover box (42) is located directly above the electric push rod (41) and connected to its output end. The turnover box (42) is connected to the ultrapure water supply source. When the material picking frame plate (36) is lowered into the cleaning tank (2), the turnover box (42) is attached to and snapped into the material picking frame plate (36). The two inner nozzles (43) are connected to the turnover box (42), and the two inner nozzles (43) are respectively obliquely facing the two inner sides of the material picking frame plate (36); A base plate (44) is disposed on the output end of the electric push rod (41); Polyvinyl alcohol soft brush (45), the polyvinyl alcohol soft brush (45) is rotatably mounted on the base plate (44); The motor (46) is mounted on the base plate (44) and connected to the polyvinyl alcohol soft brush (45). After the motor (46) is started, it drives the polyvinyl alcohol soft brush (45) to rotate.

4. The semiconductor wafer single-wafer cleaning equipment as described in claim 3, characterized in that, The output end of the electric push rod (41) is equipped with a transverse self-driving base (411). The base plate (44) is mounted on the transverse self-driving base (411).

5. The semiconductor wafer single-wafer cleaning equipment as described in claim 4, characterized in that, The internal and external cleaning mechanism (4) also includes: The second linear module (47) is installed on the inner side of the cleaning tank (2); The first arm (48) and two sets of several first arms (48) are respectively installed on two second linear modules (47); External nozzles (49), two external nozzles (49) are respectively installed on two sets of several first arms (48), and the two external nozzles (49) are obliquely downward facing the front and back sides of the material pick-up frame plate (36), and the two external nozzles (49) are connected to the liquid supply source; A number of semi-ring nozzles are installed on the inner side of the material pick-up frame plate (36) and correspond to the lower half ring (37) and the upper half ring (38). The semi-ring nozzles are connected to a hot nitrogen supply source. After the wafer is fixed, the semi-ring nozzles are flush with the back side of the wafer.

6. The semiconductor wafer single-wafer cleaning equipment as described in claim 5, characterized in that, The end of the external nozzle (49) is soft and elastic; The second linear module (47) is equipped with several second arms (5), and the several second arms (5) are connected to a hard back plate (6). The two ends of the hard back plate (6) are equipped with movable pin plates (7), and the two movable pin plates (7) are connected to a pressing strip (8). The hard back plate (6) and the pressing strip (8) clamp the end of the outer nozzle (49) in the middle, and the hard back plate (6) is attached to the outer nozzle (49). The two ends of the hard back plate (6) are connected to fixed end arms (9). The fixed end arms (9) have grooves, and short push rods (10) are slidably installed in the grooves. The short push rods (10) are connected to the pressing strips (8). The fixed end arms (9) are equipped with air pipes (11), and the air pipes (11) are connected to an air pump and pass into the bottom of the groove on the fixed end arms (9).

7. A semiconductor wafer single-wafer cleaning device as described in claim 6, characterized in that, The top of the cleaning tank (2) is equipped with two sets of third arms (12) facing each other. Each of the two sets of third arms (12) is equipped with a drying nozzle (13), and the drying nozzle (13) is connected to a hot nitrogen supply source. The two drying nozzles (13) are angled downwards toward the front and back sides of the material pick-up frame plate (36), respectively.

8. The semiconductor wafer single-wafer cleaning equipment as described in claim 7, characterized in that, The back of the lower half ring (37) and the upper half ring (38) are fitted with beveled edge rings (14).

9. A semiconductor wafer single-wafer cleaning device as described in claim 8, characterized in that, The two semi-annular nozzles located below are also connected to a negative pressure generator.

10. A semiconductor wafer single-wafer cleaning device as described in claim 9, characterized in that, The output end of the electric push rod (41) is equipped with a liquid-collecting plate (15), and the lowest point of the liquid-collecting plate (15) is connected to a drain pipe (16). After the electric push rod (41) is activated, the polymer liquid tray (15) can be pushed into the material pick-up frame plate (36).

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