Wafer alignment device, wafer alignment system and semiconductor process equipment

Abstract

The present disclosure provides a wafer alignment device, a wafer alignment system and a semiconductor process equipment, and belongs to the technical field of semiconductor manufacturing. The wafer alignment device comprises an alignment chamber, a carrier, a support assembly, a first driving assembly, a second driving assembly and a third driving assembly. The first driving assembly is connected to the second driving assembly. The first driving assembly drives the second driving assembly to move in the vertical direction, so as to drive the carrier to ascend and descend in the vertical direction. The second driving assembly drives the carrier to rotate, so as to drive the wafer located on the carrier to rotate around the first rotation axis of the second driving assembly. The third driving assembly comprises a third driver and a first transmission structure connected to the third driver. The third driver drives the first transmission structure to rotate around its second rotation axis, so as to drive the wafer located on the support assembly to move in the first horizontal direction. The support assembly is connected to the alignment chamber, and is used for supporting the wafer when the third driving assembly drives the wafer to move in the first horizontal direction.

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