Electronic circuit module, electronic device

Abstract

To simplify wiring in an electronic circuit module provided with an antenna, or to miniaturize the electronic circuit module. An electronic circuit module according to an aspect of the present invention is provided with: a first substrate having a first end as a starting end in a first direction and a second end as a terminal end on an opposite side from the first end in the first direction in a plan view; a semiconductor sealing material overlapping the first substrate in the plan view; a first antenna, a second antenna, and a third antenna arranged in order from the first end toward the second end in the first direction in the plan view and located on the first substrate; an IC chip having a first communication section, a second communication section, and a third communication section and located in the semiconductor sealing material; and a first wiring, a second wiring, and a third wiring, wherein the second communication section is located on a side closer to the first end than the first communication section, or on a side closer to the second end than the third communication section in the plan view.

Description

Technical Field

[0001] This disclosure relates to electronic circuit modules and electronic devices having such electronic circuit modules. This application claims priority based on Japanese Patent Application No. 2023-215009, filed on December 20, 2023, the contents of which are incorporated herein by reference. Background Technology

[0002] Patent Document 1 describes an antenna that improves its characteristics by making the wiring length between each feed point of the antenna element and the communication section of the integrated circuit substantially the same, thereby reducing the differences in parameters such as impedance, including parasitic components, in multiple wirings.

[0003] Existing technical documents Patent documents Patent Document 1: Japanese Patent Application Publication No. 2021-5795 Summary of the Invention The problem the invention aims to solve In the antenna-equipped device described in Patent Document 1, to ensure that the lengths of the multiple wires in the antenna are approximately the same, at least a portion of the wires need to be properly wound on the substrate to adjust the length of each wire. Therefore, in the aforementioned device, the wiring on the antenna substrate may become complex, or the formation of the wiring may become difficult. Alternatively, in the aforementioned device, because it is necessary to ensure the area on the substrate used for winding the wiring, the antenna may be enlarged, and consequently, the device may be enlarged.

[0004] Solution for solving the problem One aspect of this disclosure relates to an electronic circuit module comprising: a first substrate having, in a top view, a first end as a beginning in a first direction and a second end as a termination on the side opposite to the first end in the first direction; a semiconductor sealing material overlapping the first substrate in a top view; a first antenna, a second antenna, and a third antenna arranged sequentially in the first direction from the first end toward the second end in a top view and located on the first substrate; an IC chip having a first communication section, a second communication section, and a third communication section and located within the semiconductor sealing material; and a first wiring, a second wiring, and a third wiring, wherein the first wiring connects the first antenna and the first communication section, the second wiring connects the second antenna and the second communication section, and the third wiring connects the third antenna and the third communication section, wherein, in a top view, the second communication section is located on a side closer to the first end than the first communication section, or on a side closer to the second end than the third communication section.

[0005] Invention Effects According to one aspect of this disclosure, in an electronic circuit module that at least transmits or receives electromagnetic waves, it is possible to reduce the impact of wiring connecting the antenna and the IC chip on electromagnetic wave transmission and reception, while simplifying wiring routing or miniaturizing the substrate. Attached Figure Description

[0006] Figure 1 This is a schematic top view of the electronic circuit module involved in Embodiment 1.

[0007] Figure 2 This is a schematic diagram of the electronic device involved in Embodiment 1.

[0008] Figure 3 This is a schematic side sectional view of the electronic circuit module involved in Embodiment 1.

[0009] Figure 4 This is a schematic top view of the first substrate involved in Embodiment 1.

[0010] Figure 5 This is a schematic top view of the semiconductor sealing material involved in Embodiment 1.

[0011] Figure 6 This is a general top view of the electronic circuit modules involved in the comparison method.

[0012] Figure 7 This is a schematic top view of the semiconductor sealing material involved in Embodiment 2.

[0013] Figure 8 This is a schematic top view of the electronic circuit module involved in Embodiment 2.

[0014] Figure 9 This is a schematic top view of the electronic circuit modules involved in other comparison methods.

[0015] Figure 10 This is a schematic top view of the first substrate involved in Embodiment 3.

[0016] Figure 11 This is a schematic top view of the semiconductor sealing material involved in Embodiment 3.

[0017] Figure 12 This is a schematic top view of the electronic circuit module involved in Embodiment 3.

[0018] Figure 13 This is a schematic top view of the semiconductor sealing material involved in Embodiment 4.

[0019] Figure 14 This is a schematic top view of the electronic circuit module involved in Embodiment 4.

[0020] Figure 15This is a schematic top view of the semiconductor sealing material involved in Embodiment 5.

[0021] Figure 16 This is a schematic top view of the electronic circuit module involved in Embodiment 5.

[0022] Figure 17 This is a schematic side sectional view of the electronic circuit module involved in Embodiment 6.

[0023] Figure 18 This is a schematic top view of the second substrate involved in Embodiment 6. Detailed Implementation

[0024] [Implementation Method 1] <Electronic Devices> Hereinafter, one embodiment of the present disclosure will be described in detail. Figure 2 This is a schematic cross-sectional view of the electronic device according to this embodiment. The electronic device 1 according to this embodiment includes a device body 2, an electronic circuit module 3, and a flexible printed circuit board 4.

[0025] The electronic device 1 is a device that performs at least one of the following: transmitting electromagnetic waves from the electronic circuit module 3 based on the processing in the device body section 2, and transmitting a signal corresponding to the electromagnetic waves received in the electronic circuit module 3 to the device body section 2.

[0026] Electronic device 1 can be, for example, a smartphone, tablet computer, or router that performs electromagnetic wave transmission and reception communication. Alternatively, electronic device 1 can be a wireless receiver or beacon receiver, which only performs receiving in electromagnetic wave transmission and reception communication. Furthermore, electronic device 1 can be a GPS transmitter or beacon transmitter, which only performs transmitting in electromagnetic wave transmission and reception communication.

[0027] The device body 2 includes main components for implementing the functions of the electronic device 1, such as a processor, memory, operation unit, or display unit. In particular, the device body 2 can perform processing to generate signals corresponding to electromagnetic waves transmitted by the electronic circuit module 3, or to process signals corresponding to electromagnetic waves received by the electronic circuit module 3.

[0028] The electronic circuit module 3 performs at least one of the electromagnetic wave transmission and reception communication through the following methods. For example, the electronic circuit module 3 may generate and transmit electromagnetic waves based on signals from the device body 2, or transmit signals corresponding to received electromagnetic waves to the device body 2.

[0029] The flexible printed circuit board 4 is a circuit board that transmits and receives signals between the device body 2 and the electronic circuit module 3 and has flexibility. The electronic device 1 can include various known circuit boards other than the flexible printed circuit board 4, as long as it is a circuit board used to transmit signals between two connected components.

[0030] <Electronic Circuit Module: Overview> For details regarding the electronic circuit module 3 involved in this embodiment, please refer to... Figure 3 To provide a more detailed explanation. Figure 3 This is a schematic side sectional view of electronic circuit module 3. It includes... Figure 3 In the schematic side cross-sectional view of the electronic circuit module 3 of this disclosure, a portion of the flexible printed circuit board 4 connected to the electronic circuit module 3 is also illustrated. In this disclosure, the direction facing the drawing and from the laminated substrate 10 toward the semiconductor sealing material 3S is designated as the downward direction, and the direction opposite to this downward direction is designated as the upward direction. Furthermore, the schematic side cross-sectional view of the electronic circuit module 3 of this disclosure shows the side cross-section of the electronic circuit module 3 in the direction perpendicular to the top of the laminated substrate 10 or the semiconductor sealing material 3S. Furthermore, in this disclosure, "top view" refers to viewing the electronic circuit module 3 from above toward the laminated substrate 10 or the semiconductor sealing material 3S. In addition, in the schematic side cross-sectional view of the electronic circuit module 3 of this disclosure, in order to show a part of the electronic circuit module 3 more clearly, the component is sometimes shown through a component located in front of the component.

[0031] <Electronic Circuit Module: First Substrate> like Figure 3 As shown, the electronic circuit module 3 includes a laminated substrate 10. The laminated substrate 10 comprises a plurality of laminated substrates, particularly including... Figure 3 The first substrate 11 is shown. Regarding the first substrate 11 and the components formed on the first substrate 11, refer to... Figure 4 To provide a more detailed explanation. Figure 4 This is a schematic diagram of the first substrate 11 in a top view.

[0032] The first substrate 11 is, for example, a substrate with a rectangular shape in a top view. In this embodiment, the direction along the long side of the first substrate 11 in the top view is designated as the first direction D1, and the direction along the short side of the first substrate 11 is designated as the second direction D2. Therefore, the second direction D2 is perpendicular to the first direction D1. Furthermore, the first substrate 11, as an end in the top view, has a first end 11A as a starting point in the first direction D1 and a second end 11B as a terminal point on the side opposite to the first end 11A in the first direction D1. Further, the first substrate 11, as an end in the top view, has a third end 11C as a starting point in the second direction D2 and a fourth end 11D as a terminal point on the side opposite to the third end 11C in the second direction D2.

[0033] Including Figure 4 In the schematic top view of the first substrate 11 in this disclosure, the intermediate position C1 located in the middle of the first substrate 11 along the first direction D1 is shown with a double-dotted line. In other words, the intermediate position C1 is located at the midpoint between the first end 11A and the second end 11B in the top view. In the schematic plan view of the first substrate 11 in this disclosure, the intermediate position C2 located in the middle of the first substrate 11 along the second direction D2 is shown with a double-dotted line. In other words, the intermediate position C2 is located at the midpoint between the third end 11C and the fourth end 11D in the top view.

[0034] The electronic circuit module 3 has at least three antennas on the first substrate 11. Specifically, the electronic circuit module 3 according to this embodiment has a first antenna 21, a second antenna 22, a third antenna 23, and a fourth antenna 24 on the first substrate 11. The first antenna 21, the second antenna 22, the third antenna 23, and the fourth antenna 24 have a first feed point 31, a second feed point 32, a third feed point 33, and a fourth feed point 34, respectively.

[0035] Each antenna in electronic circuit module 3 performs the following operations: transmitting a signal corresponding to a received electromagnetic wave to a wiring connected to the feed point (described later); and transmitting an electromagnetic wave corresponding to a signal transmitted to the feed point via the wiring. Each antenna can receive and transmit linearly polarized electromagnetic waves, including at least one of V-polarized waves and H-polarized waves. However, it is not limited to this; each antenna can also receive and transmit electromagnetic waves with polarizations other than linear polarization, such as circular polarization.

[0036] In particular, in the top view, along the first direction D1, the electronic circuit module 3 is equipped with a first antenna 21, a second antenna 22, a third antenna 23, and a fourth antenna 24 arranged sequentially on the first substrate 11 in order from the first end 11A toward the second end 11B. Therefore, the first antenna 21 is located closer to the first end 11A than the second antenna 22, and the fourth antenna 24 is located closer to the second end 11B than the third antenna 23.

[0037] Furthermore, the first feed point 31, the second feed point 32, the third feed point 33, and the fourth feed point 34 are also arranged sequentially in the top view in the order from the first end 11A toward the second end 11B. In particular, the first feed point 31, the second feed point 32, the third feed point 33, and the fourth feed point 34 are located at the middle position C2 in the top view.

[0038] <Electronic Circuit Modules: IC Chips and Semiconductor Sealing Materials> Back Figure 3 For example, on the side opposite to the first substrate 11 of the laminated substrate 10, the electronic circuit module 3 includes a module-side connector 3C as a connector, a communication IC chip 40 as an IC chip, and a power IC chip 3P. For example, the module-side connector 3C, the communication IC chip 40 as an IC chip, and the power IC chip 3P may also be formed on the underside of the laminated substrate 10.

[0039] The electronic circuit module 3 also includes a semiconductor sealing material 3S. The semiconductor sealing material 3S seals at least the communication IC chip 40 and the power IC chip 3P within the laminated substrate 10. Therefore, it can be said that the communication IC chip 40 and the power IC chip 3P are located within the semiconductor sealing material 3S, and in a top view, it can be said that the semiconductor sealing material 3S overlaps with the first substrate 11. The semiconductor sealing material 3S may, for example, comprise a molding resin.

[0040] Regarding the semiconductor sealing material 3S and the components located within the semiconductor sealing material 3S, refer to Figure 5 To provide a more detailed explanation. Figure 5 This is a schematic diagram of the semiconductor sealing material 3S from a top view. (Including...) Figure 5 In the schematic plan view of the semiconductor sealing material 3S in this disclosure, components located within the semiconductor sealing material 3S are shown through the components positioned above the semiconductor sealing material 3S. Furthermore, in the schematic plan view of the semiconductor sealing material 3S in this disclosure, the outline of the first substrate 11 is shown in dashed lines, and the module-side connector 3C, located closer to the flexible printed circuit board 4 than the semiconductor sealing material 3S in the top view, is also shown. However, for the sake of simplicity, the illustration of the power IC chip 3P is omitted in the schematic plan view of the semiconductor sealing material 3S in this disclosure. In the schematic plan view of the semiconductor sealing material 3S in this disclosure, the intermediate position C1 located in the first direction D1 of the first substrate 11 and the intermediate position C2 located in the second direction D2 of the first substrate 11 are shown by single-dotted lines.

[0041] The module-side connector 3C is connected, for example, to the body-side connector 2C formed on the flexible printed circuit board 4. The module-side connector 3C may also have multiple terminals 3CT that connect to the terminals of the body-side connector 2C. The electronic circuit module 3 sends signals to the flexible printed circuit board 4 via the module-side connector 3C and the body-side connector 2C, and then sends signals to the device body 2. The module-side connector 3C and the body-side connector 2C are not limited to interlocking connectors; they can also be bonded together by substrate bonding materials such as solder plating, solder bumps, or copper pillars.

[0042] The communication IC chip 40 can also be configured such that its center in the first direction D1 is approximately aligned with the center of the first substrate 11 in the first direction D1. In other words, in a top view, the center of the communication IC chip 40 in the first direction D1 can also be approximately aligned with the center position C1. In this disclosure, "the positions of the two components are approximately aligned" does not necessarily mean that the positions of the two components are completely aligned. For example, the positions of the two components may differ within the range of manufacturing tolerances.

[0043] The communication IC chip 40 has a first communication unit 41, a second communication unit 42, a third communication unit 43, a fourth communication unit 44, and a connector communication unit 49. The first communication unit 41, the second communication unit 42, the third communication unit 43, and the fourth communication unit 44 are located, for example, on the side closer to the third end 11C than the middle position C2 in the top view.

[0044] In this embodiment, the second communication unit 42 is located closer to the first end 11A than the first communication unit 41 in the top view. Furthermore, the third communication unit 43 is located closer to the second end 11B than the fourth communication unit 44 in the top view. Therefore, on the communication IC chip 40, along the first direction D1 in the top view, the second communication unit 42, the first communication unit 41, the fourth communication unit 44, and the third communication unit 43 are arranged sequentially from the first end 11A towards the second end 11B. The connector communication unit 49 is located, for example, on the module-side connector 3C side of the IC chip 40 in the top view, and is connected to any one of the terminals 3CT of the module-side connector 3C via connector wiring 59.

[0045] <Electronic Circuit Module: Wiring> return Figure 3 According to the reference, the electronic circuit module 3 includes a first wiring 51, a second wiring 52, a third wiring 53, and a fourth wiring 54. The first wiring 51, the second wiring 52, the third wiring 53, and the fourth wiring 54 are formed through contact holes formed on the laminated substrate 10 including the first substrate 11.

[0046] The first wiring 51 connects the first feed point 31 of the first antenna 21 to the first communication section 41 of the communication IC chip 40. The second wiring 52 connects the second feed point 32 of the second antenna 22 to the second communication section 42 of the communication IC chip 40. The third wiring 53 connects the third feed point 33 of the third antenna 23 to the third communication section 43 of the communication IC chip 40. The fourth wiring 54 connects the fourth feed point 34 of the fourth antenna 24 to the fourth communication section 44 of the communication IC chip 40.

[0047] Regarding the wiring connecting each antenna on the first substrate 11 to each communication section of the communication IC chip 40, refer to... Figure 1 Further details will be provided. Figure 1 This is a schematic plan view of electronic circuit module 3, in other words... Figure 1 This is a schematic diagram of electronic circuit module 3 in a top view. (Including...) Figure 1 In the schematic plan view of the electronic circuit module 3 in this disclosure, the wiring connecting each antenna on the first substrate 11 to each communication section of the communication IC chip 40 is shown in solid lines. On the other hand, in the schematic plan view of the electronic circuit module 3 in this disclosure, the outlines of the communication IC chip 40 and the module-side connector 3C are shown in dashed lines, and the outlines of the components on the first substrate 11 including each antenna are shown in dashed lines.

[0048] like Figure 1 As shown, in order to connect the antennas on the first substrate 11 to the communication sections of the communication IC chip 40, each wiring is wound within the laminated substrate 10. In particular, all wiring connecting the antennas and the communication sections, such as... Figure 3 As shown, the winding is performed in a winding region 50E located on any substrate of the laminated substrate 10. The winding region 50E is, for example, as shown in... Figure 1 As shown by the dashed line in the top view of the laminated substrate 10, this refers to the area along the first direction D1 and the second direction D2 where the wiring between each feed point of the antenna on the first substrate 11 and each communication section of the communication IC chip 40 can be wound. Since the wiring wound in the winding region 50E is located on the same substrate of the laminated substrate 10, it needs to be wound without intersecting each other. Furthermore, as... Figure 3 As shown, on any substrate of the laminated substrate 10, a winding region may also be formed separately from the winding region 50E. This winding region is used to wind the wiring between the communication sections of the communication IC chip 40, the power IC chip 3P, and the module-side connector 3C.

[0049] Here, from the viewpoint of reducing the impact of parasitic components such as resistance, inductance, or capacitance on the characteristics of the electronic circuit module 3, it is considered to reduce the difference in wiring length in the top view among multiple wirings. Therefore, the wiring connecting each antenna on the first substrate 11 to each communication section of the communication IC chip 40 is sometimes wound longer than the shortest path.

[0050] Based on the above viewpoint, the difference between the wiring length of the first wiring 51 and the wiring length of the second wiring 52 in the top view can also be less than 1 / 20 of the transmission wavelength of the electronic circuit module 3. Furthermore, the difference between the wiring length of the third wiring 53 and the wiring length of the fourth wiring 54 in the top view can also be less than 1 / 20 of the transmission wavelength of the electronic circuit module 3.

[0051] Furthermore, in the top view, the first wiring 51, the second wiring 52, the third wiring 53, and the fourth wiring 54 extend from the first communication unit 41, the second communication unit 42, the third communication unit 43, and the fourth communication unit 44 toward one side of the third end 11C, respectively. With this structure, the wiring can be routed more efficiently from each communication unit located closer to the third end 11C than the middle position C2.

[0052] <Electronic circuit modules involved in the comparison method> Regarding the effects of the electronic circuit module 3 involved in this embodiment, please refer to... Figure 6 This will be explained by comparing it with the electronic circuit modules involved in the comparison method. Figure 6 This is a schematic plan view of the electronic circuit module 3A involved in the comparison method; in other words... Figure 6 This is a schematic diagram of electronic circuit module 3A in a top view.

[0053] Compared to the electronic circuit module 3 of this embodiment, the electronic circuit module 3A in the comparative embodiment differs in the order in which the multiple communication units are arranged in the direction from the first end 11A to the second end 11B. Specifically, in the comparative embodiment, on the communication IC chip 40, along the first direction D1 in the top view, the first communication unit 41, the second communication unit 42, the third communication unit 43, and the fourth communication unit 44 are arranged sequentially from the first end 11A to the second end 11B. Apart from the above, the electronic circuit module 3A in the comparative embodiment has the same configuration as the electronic circuit module 3 of this embodiment.

[0054] Generally, when multiple feed points and multiple communication units are connected by wiring, from the viewpoint of simplifying the routing of the wiring and miniaturizing the electronic circuit module, it is advisable to shorten the distance between the feed point connected by a single wiring and the communication unit. Therefore, from the above viewpoint, it is advisable to set the arrangement order of the antennas on the first substrate 11 and the arrangement order of the communication units of the communication IC chip 40 to be the same as that of the electronic circuit module 3A involved in the comparative method.

[0055] On the other hand, for multiple cablings, in order to reduce the difference in cabling length in the top view, for example, cablings connecting power supply points and communication units that are close to each other require a larger cabling winding area compared to cablings connecting other power supply points and communication units.

[0056] In the comparison method, in the top view, the distance between the second feed point 32 and the second communication unit 42 is shorter than the distance between the first feed point 31 and the first communication unit 41. Therefore, in the comparison method, the winding of the second wiring 52 can sometimes become more complex compared to the first wiring 51. Furthermore, in the comparison method, in the top view, the distance between the third feed point 33 and the third communication unit 43 is shorter than the distance between the fourth feed point 34 and the fourth communication unit 44. Therefore, in the comparison method, the winding of the third wiring 53 can sometimes become more complex compared to the fourth wiring 54.

[0057] In particular, in the comparative method, since the distance between the second feed point 32 and the second communication unit 42 is extremely short in the top view, the second wiring 52 sometimes needs to be partially routed to a side closer to the fourth end 11D than the middle position C2 in the top view. As a result, the wiring, including the second wiring 52, becomes complex in the electronic circuit module 3A involved in the comparative method.

[0058] Furthermore, for example, in the electronic circuit module 3A involved in the comparison method, it is assumed that in the top view, all the wiring from the communication section is led out to the side of the third terminal 11C. In this case, in the top view, the second wiring 52 needs to be wound around the outside of the first wiring 51, and the third wiring 53 needs to be wound around the outside of the fourth wiring 54. In this case, the electronic circuit module 3A needs to be enlarged. Figure 6 The winding region 50E of the stacked substrate 10 in the top view is shown by a single-dot dashed line. Along with this, it is necessary to enlarge the first substrate 11.

[0059] To avoid these problems, at least the second wiring 52 and the third wiring 53 need to be led out from the second communication section 42 and the third communication section 43 towards the fourth terminal 11D in the top view, respectively. In this case, the second wiring 52 and the third wiring 53 need to be wound between the second feed point 32 and the second communication section 42, and between the third feed point 33 and the third communication section 43, respectively, in the top view. Therefore, when the area of ​​the winding region 50E in the top view of the laminated substrate 10 is the same, the structures of the second wiring 52 and the third wiring 53 become more complex. Furthermore, when the area of ​​the winding region 50E in the top view of the laminated substrate 10 is the same, as the lengths of the second wiring 52 and the third wiring 53 differ from those of other wirings, the differences in parasitic inductance or parasitic capacitance between the wirings increase, which can easily affect the characteristics of the electronic circuit module 3A. In order to solve these problems in the electronic circuit module 3A involved in the comparison method, it is necessary to increase the area of ​​the multilayer substrate 10 along with the expansion of the winding region 50E in the top view of the multilayer substrate 10, which in turn requires to enlarge the first substrate 11.

[0060] <Wiring Arrangement> On the communication IC chip 40 of the electronic circuit module 3 according to this embodiment, the second communication section 42, the first communication section 41, the fourth communication section 44, and the third communication section 43 are arranged sequentially from the first end 11A toward the second end 11B. This is contrary to the above-described technical concept of making the arrangement order of the antennas on the first substrate 11 the same as the arrangement order of the communication sections of the communication IC chip 40.

[0061] However, in this embodiment, compared to the comparison method, the difference between the distance between the first feed point 31 and the first communication unit 41, and the difference between the distance between the second feed point 32 and the second communication unit 42 in the top view is smaller. Therefore, in this embodiment, the additional distance required to wrap around the second wiring 52 in order to reduce the difference in wiring length between the first wiring 51 and the second wiring 52 in the top view is reduced, and the second wiring 52 is simplified.

[0062] Furthermore, with the above structure, in this embodiment, the first wiring 51 can be wound around the periphery of the first substrate 11 in the top view. Therefore, in this embodiment, it is easy to wound the second wiring 52 towards a side closer to the center of the first substrate 11 than the first wiring 51 in the top view. In particular, as... Figure 1 As shown, in this embodiment, the winding region 50E in the top view of the laminated substrate 10 is an area that can be easily secured for winding the second wiring 52 toward one side of the middle of the first substrate 11.

[0063] Furthermore, in this embodiment, the difference between the distance between the third feed point 33 and the third communication unit 43 in the top view, and the difference between the distance between the fourth feed point 34 and the fourth communication unit 44, is smaller. Therefore, in this embodiment, the additional distance required to wrap around the third wiring 53 in order to reduce the difference in wiring length between the third wiring 53 and the fourth wiring 54 in the top view is reduced, and the third wiring 53 is simplified.

[0064] Furthermore, with the above structure, in this embodiment, the fourth wiring 54 can be wound around the periphery of the first substrate 11 in the top view. Therefore, in this embodiment, it is easy to wound the third wiring 53 towards the side closer to the center of the first substrate 11 than the fourth wiring 54 in the top view. In particular, as... Figure 1 As shown, in this embodiment, the winding region 50E in the top view of the stacked substrate 10 is an area that can be easily secured for winding the fourth wiring 54 toward one side of the middle of the first substrate 11.

[0065] In this way, the electronic circuit module 3 reduces the impact of each wiring on electromagnetic wave transmission and reception, simplifies the winding of each wiring, or miniaturizes the first substrate 11. The electronic device 1 equipped with the electronic circuit module 3 improves electromagnetic wave transmission or reception performance while facilitating manufacturing or miniaturization.

[0066] Furthermore, this embodiment describes an example where the electronic circuit module 3 has four antennas, but it is not limited to this; for example, it may not have a fourth antenna 24. In this case, the electronic circuit module 3 may also not have a fourth communication unit 44 and a fourth wiring 54 of the communication IC chip 40.

[0067] In this case, in the top view, the second communication unit 42 is located in the first direction D1, closer to the first end 11A than the first communication unit 41, or closer to the second end 11B than the third communication unit 43. Therefore, for the same reasons as described above, the electronic circuit module 3 simplifies the winding of each wiring while reducing the impact of each wiring on electromagnetic wave transmission and reception, or miniaturizes the first substrate 11.

[0068] In this embodiment, the first feed point 31, the second feed point 32, the third feed point 33, and the fourth feed point 34 are located along the first direction D1 in the top view and at the middle position C2. Therefore, in this embodiment, as... Figure 1 As shown, most of the wiring in the laminated substrate 10 can be formed on the side closer to the third end 11C than the middle position C2 in the top view.

[0069] As described in the embodiments below, in an electronic circuit module, there are cases where the number of communication sections of a communication IC chip increases or the number of antennas increases. Along with this, the number of wirings in the electronic circuit module also increases. Therefore, when the area of the routing region 50E in the plan view of the multilayer substrate 10 is the same, the routing of each wiring becomes more complicated.

[0070] With the above structure, in the present embodiment, most of the wirings can be formed only on the side closer to the third end 11C than the intermediate position C2 in the plan view, and it is easy to secure a region for routing the wirings on the side closer to the fourth end 11D than the intermediate position C2. In other words, in the present embodiment, as Figure 1 shown, in the plan view of the multilayer substrate 10, it is easy to route each wiring only on the side closer to the third end 11C than the intermediate position C2 in the routing region 50E. For example, in the present embodiment, the antennas, the communication sections of the communication IC chip 40, and the wirings connecting them in the electronic circuit module 3 increase. In this case, in the present embodiment, without expanding the routing region 50E in the plan view, it is easier to route the increased wirings to the side closer to the fourth end 11D than the intermediate position C2. Therefore, even when the number of wirings increases, the electronic circuit module 3 according to the present embodiment can reduce the influence of each wiring on electromagnetic wave transmission and reception while simplifying the routing of each wiring or miniaturizing the first substrate 11.

[0071] The electronic circuit module 3 according to the present embodiment can also be manufactured by various methods including conventionally known methods. For example, a plurality of substrates including the first substrate 11 formed with each antenna and a substrate having a routing region 50E formed with a plurality of wirings can be laminated to form the multilayer substrate 10. In this case, contact holes can be appropriately formed on the substrates included in the multilayer substrate 10, and the routing of each wiring in the vertical direction of the electronic circuit module 3 can be achieved via these contact holes.

[0072] In addition, on the side of the multilayer substrate 10 opposite to the first substrate 11, each communication section of the communication IC chip 40, the power supply IC chip 3P, and the module-side connector 3C can be formed. In this case, each communication section of the communication IC chip 40 and the power supply IC chip 3P can be sealed with a semiconductor sealing material 3S, thereby completing the manufacturing process of the electronic circuit module 3. In addition, the electronic device 1 can be manufactured by connecting the module-side connector 3C to the main body-side connector 2C and connecting the electronic circuit module 3 to the device main body portion 2 via the flexible printed substrate 4.

[0073] [Embodiment 2] <Change in the position of the IC chip> The electronic circuit module 3 in this embodiment differs from the electronic circuit module 3 in the previous embodiment in that the communication IC chip 40 is positioned differently in the top view. Figure 7 This is a schematic plan view of the semiconductor sealing material 3S involved in this embodiment.

[0074] like Figure 7 As shown in the top view, the communication IC chip 40 of this embodiment is located closer to the module-side connector 3C in the first direction D1 than the center position C1 where the center of the first substrate 11 is located. Therefore, the communication IC chip 40 of this embodiment is closer to the module-side connector 3C. Therefore, the electronic circuit module 3 of this embodiment can shorten the length of the connector wiring 59, making the connection between the communication IC chip 40 and the module-side connector 3C easier.

[0075] Furthermore, in this disclosure, "the communication IC chip 40 is located on a side closer to the module-side connector 3C than the intermediate position C1" does not simply mean that the entire communication IC chip 40 is located on a side closer to the module-side connector 3C than the intermediate position C1. For example, in a top view, the intermediate position of the communication IC chip 40 in the first direction D1 is designated as the intermediate position C3. In this case, in this disclosure, "the communication IC chip 40 is located on a side closer to the module-side connector 3C than the intermediate position C1" could also mean that the intermediate position C3 is located on a side closer to the module-side connector 3C than the intermediate position C1.

[0076] <Other comparison methods involve electronic circuit modules> Regarding the effects of the electronic circuit module 3 involved in this embodiment, please refer to... Figure 8 as well as Figure 9 This will be explained by comparing the electronic circuit modules involved in other comparison methods. Figure 8 This is a schematic plan view of the electronic circuit module 3 involved in this embodiment, in other words... Figure 8 This is a schematic diagram of electronic circuit module 3 in a top view. Figure 9 This is a schematic plan view of electronic circuit module 3B involved in other comparison methods; in other words... Figure 9 This is a schematic diagram of electronic circuit module 3B in a top view.

[0077] Compared to the electronic circuit module 3 of this embodiment, the electronic circuit module 3B in the comparative embodiment differs in the order in which the multiple communication units are arranged in the direction from the first end 11A to the second end 11B. Specifically, in the comparative embodiment, on the communication IC chip 40, along the first direction D1 in the top view, the first communication unit 41, the second communication unit 42, the third communication unit 43, and the fourth communication unit 44 are arranged sequentially from the first end 11A to the second end 11B. Apart from the above, the electronic circuit module 3B in the comparative embodiment has the same configuration as the electronic circuit module 3 of this embodiment.

[0078] like Figure 9 As shown, in electronic circuit module 3B, because the communication IC chip 40 is closer to the module-side connector 3C, the distance between the second power supply point 32 and the second communication section 42 is further shortened. Therefore, in electronic circuit module 3B, the winding of the second wiring 52 becomes more complex. Furthermore, in electronic circuit module 3B, as... Figure 9 As shown by a single-dotted line, in the winding region 50E of the top view of the laminated substrate 10, it becomes more difficult to ensure the area used for winding the second wiring 52.

[0079] On the other hand, the electronic circuit module 3 involved in this embodiment is based on the same reasons as those described in the previous embodiment, such as... Figure 8 As shown by a single-dotted line, in the winding region 50E of the top view of the laminated substrate 10, the area where the second wiring 52 is wound can be more easily secured. In particular, as... Figure 8 As shown, for example, the electronic circuit module 3 involved in this embodiment can more easily set the formation position of the second wiring 52 in the top view to be only located on the side closer to the third end 11C than the middle position C2.

[0080] As described above, the electronic circuit module 3 is not affected by the position of the communication IC chip 40 in the top view. While reducing the impact of each wiring on electromagnetic wave transmission and reception, it simplifies the winding of each wiring or miniaturizes the first substrate 11.

[0081] [Implementation Method 3] <Transmitting and receiving dual-polarized waves> Compared to the electronic circuit module 3 of the previous embodiment, the electronic circuit module 3 according to this embodiment has an increased number of feed points for each antenna on the first substrate 11 and an increased number of communication units for the communication IC chip 40. Consequently, the electronic circuit module 3 according to this embodiment also has an increased number of wiring connections between the feed points and the communication units compared to the electronic circuit module 3 of the previous embodiment.

[0082] Regarding the electronic circuit module 3 involved in this embodiment, refer to... Figure 10 , Figure 11 as well as Figure 12 To provide a more detailed explanation. Figure 10 This is a schematic plan view of the first substrate 11 involved in this embodiment. Figure 11 This is a schematic plan view of the semiconductor sealing material 3S involved in this embodiment. Figure 12 This is a schematic plan view of the electronic circuit module 3 involved in this embodiment.

[0083] like Figure 10 As shown, the first antenna 21, the second antenna 22, the third antenna 23, and the fourth antenna 24 also have a fifth feed point 35, a sixth feed point 36, a seventh feed point 37, and an eighth feed point 38, respectively. The fifth feed point 35, the sixth feed point 36, the seventh feed point 37, and the eighth feed point 38 are arranged, for example, along a first direction D1.

[0084] Furthermore, the fifth feed point 35, the sixth feed point 36, the seventh feed point 37, and the eighth feed point 38 are, for example, located closer to the fourth terminal 11D in the top view than the first feed point 31, the second feed point 32, the third feed point 33, and the fourth feed point 34. Therefore, the fifth feed point 35, the sixth feed point 36, the seventh feed point 37, and the eighth feed point 38 are easily accessible from the side of the fourth terminal 11D on the second direction D2 in the top view for the wiring described later.

[0085] The fifth feed point 35, the sixth feed point 36, the seventh feed point 37, and the eighth feed point 38 can also be located at the middle position C4 of each antenna in the first direction D1 in the top view. Therefore, the fifth feed point 35, the sixth feed point 36, the seventh feed point 37, and the eighth feed point 38 can be easily routed from either side of the first end 11A or the second end 11B in the first direction D1 in the top view, as described later.

[0086] like Figure 11 As shown, the communication IC chip 40 also includes a fifth communication unit 45, a sixth communication unit 46, a seventh communication unit 47, and an eighth communication unit 48. The fifth communication unit 45, the sixth communication unit 46, the seventh communication unit 47, and the eighth communication unit 48 are, for example, located in the top view on the side opposite to the third end 11C where the first communication unit 41, the second communication unit 42, the third communication unit 43, and the fourth communication unit 44 are located in the second direction D2. In particular, the fifth communication unit 45, the sixth communication unit 46, the seventh communication unit 47, and the eighth communication unit 48 are, for example, located in the top view on the side closer to the fourth end 11D than the middle position C2 in the second direction D2.

[0087] In this embodiment, the sixth communication unit 46 is located closer to the first end 11A than the fifth communication unit 45 in the top view. Furthermore, the seventh communication unit 47 is located closer to the second end 11B than the eighth communication unit 48 in the top view. Therefore, on the communication IC chip 40, along the first direction D1 in the top view, the sixth communication unit 46, the fifth communication unit 45, the eighth communication unit 48, and the seventh communication unit 47 are arranged sequentially from the first end 11A towards the second end 11B.

[0088] like Figure 12 As shown, the electronic circuit module 3 further includes a fifth wiring 55, a sixth wiring 56, a seventh wiring 57, and an eighth wiring 58 formed on the laminated substrate 10. The fifth wiring 55 connects the fifth feed point 35 and the fifth communication unit 45. The sixth wiring 56 connects the sixth feed point 36 and the sixth communication unit 46. The seventh wiring 57 connects the seventh feed point 37 and the seventh communication unit 47. The eighth wiring 58 connects the eighth feed point 38 and the eighth communication unit 48.

[0089] The fifth wiring 55, the sixth wiring 56, the seventh wiring 57, and the eighth wiring 58, together with the first wiring 51, the second wiring 52, the third wiring 53, and the fourth wiring 54, are wound inside the winding region 50E in the top view of the laminated substrate 10. Therefore, in the electronic circuit module 3, these wirings need to be wound in a manner that does not cross each other.

[0090] In this embodiment, for the same reasons as described above, the winding of the sixth wiring 56 and the seventh wiring 57 can also be performed more simply. Therefore, the electronic circuit module 3 according to this embodiment reduces the impact of each wiring on electromagnetic wave transmission and reception, simplifies the winding of each wiring, or miniaturizes the first substrate 11.

[0091] Furthermore, as described above, in the top view, most of the first wiring 51, the second wiring 52, the third wiring 53, and the fourth wiring 54 are located on the side closer to the third end 11C than the middle position C2. Therefore, in the electronic circuit module 3 according to this embodiment, as... Figure 12 As shown in the top view, the fifth wiring 55, the sixth wiring 56, the seventh wiring 57, and the eighth wiring 58 can be wound around the fourth end 11D closer than the middle position C2. In other words, the electronic circuit module 3 according to this embodiment enables... Figure 12In the top view, the area 50E of the stacked substrate 10, shown by a single-dotted line, makes it easier to wind the fifth wiring 55, the sixth wiring 56, the seventh wiring 57, and the eighth wiring 58. Thus, regardless of whether the number of wirings increases, the electronic circuit module 3 can easily perform the winding of each wiring while reducing the area increase of the stacked substrate 10 in the top view.

[0092] In particular, in the top view, the fifth wiring 55, the sixth wiring 56, the seventh wiring 57, and the eighth wiring 58 can also be led out from the fifth communication section 45, the sixth communication section 46, the seventh communication section 47, and the eighth communication section 48 towards the fourth end 11D, respectively. In this case, in the top view, the fifth wiring 55, the sixth wiring 56, the seventh wiring 57, and the eighth wiring 58 can be wound more easily on the side closer to the fourth end 11D than the middle position C2. In other words, the electronic circuit module 3 according to this embodiment can easily ensure that the area for winding the fifth wiring 55, the sixth wiring 56, the seventh wiring 57, and the eighth wiring 58 in the winding area 50E in the top view of the laminated substrate 10 is closer to the fourth end 11D than the middle position C2.

[0093] The communication IC chip 40 can also transmit signals corresponding to the first polarization wave to the first feed point 31, the second feed point 32, the third feed point 33, and the fourth feed point 34, respectively. On the other hand, the communication IC chip 40 can also transmit signals corresponding to the second polarization wave, which has a polarization different from the first polarization wave, to the fifth feed point 35, the sixth feed point 36, the seventh feed point 37, and the eighth feed point 38, respectively.

[0094] Furthermore, each antenna can also receive electromagnetic waves containing both a first polarized wave and a second polarized wave. Additionally, upon receiving a first polarized wave, each antenna can transmit the signal corresponding to that first polarized wave to the first feed point 31, the second feed point 32, the third feed point 33, and the fourth feed point 34, respectively. Conversely, upon receiving a second polarized wave, each antenna can transmit the signal corresponding to that second polarized wave to the fifth feed point 35, the sixth feed point 36, the seventh feed point 37, and the eighth feed point 38, respectively.

[0095] In other words, the first communication unit 41, the second communication unit 42, the third communication unit 43, and the fourth communication unit 44 can also perform at least one of transmitting or receiving a signal corresponding to the first polarization wave. On the other hand, the fifth communication unit 45, the sixth communication unit 46, the seventh communication unit 47, and the eighth communication unit 48 can also perform at least one of transmitting or receiving a signal corresponding to the second polarization wave.

[0096] Therefore, the electronic circuit module 3 can also transmit and receive electromagnetic waves with two different polarizations—a first polarized wave and a second polarized wave—through the antennas on the first substrate 11. For example, the first polarized wave can be a V-polarized wave, and the second polarized wave can be an H-polarized wave. In other words, the first polarized wave and the second polarized wave can also be linearly polarized waves whose magnetic field vibration directions are perpendicular to each other. However, it is not limited to this; the first polarized wave and the second polarized wave can also be circularly polarized waves whose magnetic field vibration surfaces rotate in opposite directions. Furthermore, as... Figure 11 As shown, the communication IC chip 40 in this embodiment may also have a separate connector communication section 49 for transmitting and receiving signals corresponding to the first polarization wave and the second polarization wave, respectively, between it and the module-side connector 3C.

[0097] As described above, the electronic circuit module 3 of this embodiment makes it easier to perform electromagnetic wave transmission and reception for multiple systems. Furthermore, the electronic circuit module 3 of this embodiment simplifies the winding of the wiring regardless of whether the number of wires increases. Therefore, the electronic circuit module 3 reduces the impact of each wire on electromagnetic wave transmission and reception, simplifies the winding of each wire, or miniaturizes the first substrate 11, and further improves the electromagnetic wave transmission and reception performance.

[0098] [Implementation Method 4] <Variations on the location of the communications department> Compared with the electronic circuit module 3 of the previous embodiment, the electronic circuit module 3 of this embodiment has a different position of a part of the communication section of the communication IC chip 40, and consequently, the shape of the communication IC chip 40 in the top view is also different.

[0099] Regarding the electronic circuit module 3 involved in this embodiment, refer to... Figure 13 as well as Figure 14 To provide a more detailed explanation. Figure 13 This is a schematic plan view of the semiconductor sealing material 3S involved in this embodiment. Figure 14 This is a schematic plan view of the electronic circuit module 3 involved in this embodiment.

[0100] In this embodiment, the first communication unit 41, the second communication unit 42, the third communication unit 43, and the fourth communication unit 44 are located in the top view closer to the first end 11A than the center position C3 of the communication IC chip 40. On the other hand, the fifth communication unit 45, the sixth communication unit 46, the seventh communication unit 47, and the eighth communication unit 48 are located in the top view closer to the second end 11B than the center position C3 of the communication IC chip 40. Therefore, the shape of the communication IC chip 40 in the top view can also extend in the first direction D1. However, in the top view, the center position C3 can also be located closer to the first end 11A than the center position C1.

[0101] Through the above structure, such as Figure 14 As shown, in the electronic circuit module 3 according to this embodiment, in the top view, the distance between the fifth feed point 35 and the fifth communication unit 45, and the distance between the sixth feed point 36 and the sixth communication unit 46, are longer. Therefore, in this embodiment, as... Figure 14 As shown by a single-dotted line, in the winding region 50E of the top view of the laminated substrate 10, a wider area can be ensured for winding the fifth wiring 55 and the sixth wiring 56. Therefore, the electronic circuit module 3 according to this embodiment can more easily wind the fifth wiring 55 and the sixth wiring 56.

[0102] On the other hand, with the above structure, in the electronic circuit module 3 according to this embodiment, the distance between the seventh feed point 37 and the seventh communication unit 47, and the distance between the eighth feed point 38 and the eighth communication unit 48, are longer in the top view. However, as described above, in the top view, the seventh communication unit 47 and the eighth communication unit 48 are located closer to the second end 11B than the middle position C3. Therefore, in this embodiment, in the winding region 50E in the top view of the laminated substrate 10, a wider area of ​​the laminated substrate 10 in the top view for winding the seventh wiring 57 and the eighth wiring 58 can be ensured on the side of the second end 11B. Therefore, the electronic circuit module 3 according to this embodiment can more easily wind the seventh wiring 57 and the eighth wiring 58.

[0103] Therefore, electronic circuit module 3 can more easily perform the winding of each wiring while further improving the electromagnetic wave transmission and reception performance.

[0104] [Implementation Method 5] <Another variation of the location of the communications department> The electronic circuit module 3 according to this embodiment differs from the electronic circuit module 3 according to the previous embodiment in the location of a portion of the communication section of the communication IC chip 40. Regarding the electronic circuit module 3 according to this embodiment, refer to... Figure 15 as well as Figure 16 To provide a more detailed explanation. Figure 15 This is a schematic plan view of the semiconductor sealing material 3S involved in this embodiment. Figure 16 This is a schematic plan view of the electronic circuit module 3 involved in this embodiment.

[0105] In this embodiment, the fifth communication unit 45, the sixth communication unit 46, the seventh communication unit 47, and the eighth communication unit 48, together with the first communication unit 41, the second communication unit 42, the third communication unit 43, and the fourth communication unit 44, are located in the top view closer to the third end 11C than the middle position C2. Furthermore, in this embodiment, the first communication unit 41, the second communication unit 42, the third communication unit 43, the fourth communication unit 44, the fifth communication unit 45, the sixth communication unit 46, the seventh communication unit 47, and the eighth communication unit 48 are arranged along the first direction D1 in the top view.

[0106] More specifically, the sixth communication unit 46 is located between the second communication unit 42 and the first communication unit 41. The fifth communication unit 45 is located between the first communication unit 41 and the fourth communication unit 44. The eighth communication unit 48 is located between the fourth communication unit 44 and the third communication unit 43. The seventh communication unit 47 is located on the side closer to the second end 11B than the third communication unit 43.

[0107] Therefore, in this embodiment, on the communication IC chip 40, along the first direction D1 in the top view, the second communication unit 42, the first communication unit 41, the fourth communication unit 44, and the third communication unit 43 are arranged sequentially from the first end 11A toward the second end 11B. Furthermore, on the communication IC chip 40, along the first direction D1 in the top view, the sixth communication unit 46, the fifth communication unit 45, the eighth communication unit 48, and the seventh communication unit 47 are arranged sequentially from the first end 11A toward the second end 11B.

[0108] Therefore, for the same reasons as above, the electronic circuit module 3 according to this embodiment simplifies the winding of each wiring formed on the laminated substrate 10, or achieves miniaturization.

[0109] Furthermore, such as Figure 16 As shown, wiring from the first communication unit 41, the second communication unit 42, the third communication unit 43, and the fourth communication unit 44 can also be led out towards the third terminal 11C in the top view. Furthermore, wiring from the fifth communication unit 45, the sixth communication unit 46, the seventh communication unit 47, and the eighth communication unit 48 can also be led out towards the fourth terminal 11D in the top view. Thus, the electronic circuit module 3... Figure 16 As shown by a single-dotted line, the area for winding each wiring can be more extensively ensured in the winding region 50E in the top view of the laminated substrate 10.

[0110] [Implementation Method 6] <Second substrate> The electronic circuit module 3 according to this embodiment differs from the electronic circuit modules 3 according to the aforementioned embodiments in that the laminated substrate 10 further includes a second substrate 12. Regarding the electronic circuit module 3 according to this embodiment, refer to... Figure 17 as well as Figure 18 To provide a more detailed explanation. Figure 17 This is a schematic side sectional view of the electronic circuit module 3 involved in this embodiment. Figure 18 This is a schematic plan view of the second substrate 12 described later in this embodiment.

[0111] like Figure 17 As shown, the laminated substrate 10 includes a second substrate 12 between the first substrate 11 and the semiconductor sealing material 3S. In particular, the second substrate 12 overlaps with the first substrate 11 and the semiconductor sealing material 3S in the top view.

[0112] The first substrate 11 in this embodiment has the same configuration as the first substrate 11 in Embodiment 1. In other words, each antenna of the first substrate 11 in this embodiment has a single feed point. Furthermore, within the semiconductor sealing material 3S in this embodiment, for example, a communication IC chip 40 as described in Embodiments 3, 4, or 5 is located. In other words, the communication IC chip 40 in this embodiment has a first communication unit 41, a second communication unit 42, a third communication unit 43, a fourth communication unit 44, a fifth communication unit 45, a sixth communication unit 46, a seventh communication unit 47, and an eighth communication unit 48.

[0113] The electronic circuit module 3 involved in this embodiment is as follows: Figure 18 As shown, the second substrate 12 includes a fifth antenna 25, a sixth antenna 26, a seventh antenna 27, and an eighth antenna 28. The fifth antenna 25 has a fifth feed point 35, the sixth antenna 26 has a sixth feed point 36, the seventh antenna 27 has a seventh feed point 37, and the eighth antenna 28 has an eighth feed point 38.

[0114] In this embodiment, the fifth wiring 55 connects the fifth feed point 35 of the fifth antenna 25 to the fifth communication unit 45 of the communication IC chip 40. The sixth wiring 56 connects the sixth feed point 36 of the sixth antenna 26 to the sixth communication unit 46 of the communication IC chip 40. The seventh wiring 57 connects the seventh feed point 37 of the seventh antenna 27 to the seventh communication unit 47 of the communication IC chip 40. The eighth wiring 58 connects the eighth feed point 38 of the eighth antenna 28 to the eighth communication unit 48 of the communication IC chip 40.

[0115] Furthermore, the fifth antenna 25, the sixth antenna 26, the seventh antenna 27, and the eighth antenna 28 overlap with the first antenna 21, the second antenna 22, the third antenna 23, and the fourth antenna 24 in the top view, respectively. Further, the fifth antenna 25, the sixth antenna 26, the seventh antenna 27, and the eighth antenna 28 each have a first contact hole 61, a second contact hole 62, a third contact hole 63, and a fourth contact hole 64, respectively. For example, each contact hole connects to the antenna and the second substrate 12 from one side of the first substrate 11 toward the semiconductor sealing material 3S, and is formed at a position overlapping with each feed point of the first substrate 11 in the top view.

[0116] In this embodiment, such as Figure 17 As shown, the first wiring 51 passes through the inside of the first contact hole 61, connecting the first feed point 31 of the first antenna 21 to the first communication section 41 of the communication IC chip 40. The second wiring 52 passes through the inside of the second contact hole 62, connecting the second feed point 32 of the second antenna 22 to the second communication section 42 of the communication IC chip 40. The third wiring 53 passes through the inside of the third contact hole 63, connecting the third feed point 33 of the third antenna 23 to the third communication section 43 of the communication IC chip 40. The fourth wiring 54 passes through the inside of the fourth contact hole 64, connecting the fourth feed point 34 of the fourth antenna 24 to the fourth communication section 44 of the communication IC chip 40.

[0117] The winding of each wiring within the winding region 50E in the top view of the multilayer substrate 10 according to this embodiment can, for example, be performed using the same method as the winding of each wiring in Embodiments 3, 4, or 5. Therefore, for the same reasons as described above, the electronic circuit module 3 according to this embodiment simplifies the winding of each wiring formed on the multilayer substrate 10 or achieves miniaturization.

[0118] In particular, the electronic circuit module 3 according to this embodiment includes a first substrate 11 on which multiple antennas are formed and a second substrate 12 on which other multiple antennas are formed as a laminated substrate 10. Therefore, the electronic circuit module 3 can more easily make the electromagnetic waves transmitted and received by the antennas on the first substrate 11 and the electromagnetic waves transmitted and received by the antennas on the second substrate 12 have different frequencies and other characteristics. Therefore, the electronic circuit module 3 according to this embodiment can realize the transmission and reception of multiple electromagnetic waves with a simpler structure.

[0119] The electronic circuit module 3 of this embodiment includes antennas on a first substrate 11 and antennas on a second substrate 12, which overlap in a top view. Therefore, the electronic circuit module 3 can miniaturize the size of the stacked substrate 10 including the first substrate 11 and the second substrate 12 in a top view.

[0120] In particular, in this embodiment, the connection between each antenna on the first substrate 11 and each communication unit of the communication IC chip 40 is achieved via contact holes provided by each antenna on the second substrate 12. Therefore, for the purpose of achieving the aforementioned connection, the electronic circuit module 3 does not require a design that involves routing wiring to avoid the antennas on the second substrate 12, for example, within the winding region 50E in the top view of the stacked substrate 10. Thus, the electronic circuit module 3 achieves a simpler structure for the connection between each antenna on the first substrate 11 and each communication unit of the communication IC chip 40.

[0121] The communication IC chip 40 can also transmit signals corresponding to a first electromagnetic wave having a first frequency to the first feed point 31, the second feed point 32, the third feed point 33, and the fourth feed point 34, respectively. On the other hand, the communication IC chip 40 can also transmit signals corresponding to a second electromagnetic wave having a second frequency different from the first frequency to the fifth feed point 35, the sixth feed point 36, the seventh feed point 37, and the eighth feed point 38, respectively.

[0122] Furthermore, each antenna on the first substrate 11 can also receive the first electromagnetic wave and transmit the signal corresponding to the first electromagnetic wave to the first feed point 31, the second feed point 32, the third feed point 33, and the fourth feed point 34, respectively. On the other hand, each antenna on the second substrate 12 can also receive the second electromagnetic wave and transmit the signal corresponding to the second electromagnetic wave to the fifth feed point 35, the sixth feed point 36, the seventh feed point 37, and the eighth feed point 38, respectively.

[0123] In other words, the first communication unit 41, the second communication unit 42, the third communication unit 43, and the fourth communication unit 44 can also perform at least one of transmitting or receiving a signal corresponding to the first electromagnetic wave. On the other hand, the fifth communication unit 45, the sixth communication unit 46, the seventh communication unit 47, and the eighth communication unit 48 can also perform at least one of transmitting or receiving a signal corresponding to the second electromagnetic wave.

[0124] Therefore, the electronic circuit module 3 according to this embodiment transmits and receives first electromagnetic waves through antennas on the first substrate 11, and transmits and receives second electromagnetic waves through antennas on the second substrate 12. Thus, the electronic circuit module 3 according to this embodiment is capable of transmitting and receiving electromagnetic waves with two different frequencies. For example, the first electromagnetic wave may be an electromagnetic wave with a higher frequency than the second electromagnetic wave.

[0125] [Summarize] The electronic circuit module disclosed in Scheme 1 comprises: a first substrate having, in a top view, a first end as a starting point in a first direction and a second end as a terminal point on the opposite side of the first end in the first direction, a semiconductor sealing material overlapping the first substrate in the top view, a first antenna, a second antenna, and a third antenna arranged sequentially from the first end toward the second end in the first direction in the top view, and located on the first substrate; an IC chip having a first communication section, a second communication section, and a third communication section, and located within the semiconductor sealing material; and a first wiring, a second wiring, and a third wiring, wherein the first wiring connects the first antenna and the first communication section, the second wiring connects the second antenna and the second communication section, and the third wiring connects the third antenna and the third communication section, wherein, in the top view, the second communication section is located on a side closer to the first end than the first communication section, or on a side closer to the second end than the third communication section.

[0126] In the electronic circuit module of Scheme 2 of this disclosure, as described in Scheme 1 above, the IC chip has a fourth communication unit, comprising a fourth antenna located on the first substrate, arranged along the first direction with the first antenna, the second antenna, and the third antenna, and located in a top view on a side closer to the second end than the third antenna; and a fourth wiring connecting the fourth antenna and the fourth communication unit, wherein in a top view, the second communication unit is located on a side closer to the first end than the first communication unit, and the third communication unit is located on a side closer to the second end than the fourth communication unit.

[0127] In the electronic circuit module of Scheme 3 of this disclosure, as described in Scheme 2 above, the first substrate has a third end as the beginning in a second direction perpendicular to the first direction in a top view. In the top view, the first communication unit, the second communication unit, the third communication unit, and the fourth communication unit are located on a side closer to the third end than the middle of the IC chip in a second direction perpendicular to the first direction. In the top view, the first wiring, the second wiring, the third wiring, and the fourth wiring are respectively led out from the first communication unit, the second communication unit, the third communication unit, and the fourth communication unit to one side of the third end.

[0128] In the electronic circuit module of Scheme 4 of this disclosure, in Scheme 2 or 3 above, the first antenna, the second antenna, the third antenna, and the fourth antenna respectively have a first feed point, a second feed point, a third feed point, and a fourth feed point. The first feed point is connected to the first wiring, the second feed point is connected to the second wiring, the third feed point is connected to the third wiring, and the fourth feed point is connected to the fourth wiring. The first feed point, the second feed point, the third feed point, and the fourth feed point are arranged along the first direction in the top view, and in the top view, they are located in the middle of the first substrate in the second direction perpendicular to the first direction.

[0129] In any of the above-mentioned schemes 2 to 4, the difference between the wiring length of the first wiring and the wiring length of the second wiring in the top view of the electronic circuit module disclosed herein is less than 1 / 20 of the transmission wave wavelength, and the difference between the wiring length of the third wiring and the wiring length of the fourth wiring in the top view can be less than 1 / 20 of the transmission wave wavelength.

[0130] In any of the above-mentioned embodiments 2 to 5, the electronic circuit module of embodiment 6 disclosed herein includes an IC chip having a fifth communication unit, a sixth communication unit, a seventh communication unit, and an eighth communication unit, and having a fifth wiring connecting the first antenna and the fifth communication unit, a sixth wiring connecting the second antenna and the sixth communication unit, a seventh wiring connecting the third antenna and the seventh communication unit, and an eighth wiring connecting the fourth antenna and the eighth communication unit. In a top view, the sixth communication unit is located on the side closer to the first end than the fifth communication unit, and the seventh communication unit may be located on the side closer to the second end than the eighth communication unit.

[0131] In the above-described embodiment 6, the electronic circuit module of embodiment 7 of this disclosure has a third end that is the beginning of a second direction perpendicular to the first direction in a top view, and a fourth end that is the end of a second direction opposite to the third end. In the top view, the first communication unit, the second communication unit, the third communication unit, and the fourth communication unit are located closer to the third end than the middle of the IC chip in the second direction, and the fifth communication unit, the sixth communication unit, the seventh communication unit, and the eighth communication unit can be located closer to the fourth end than the middle of the IC chip in the second direction.

[0132] In the above-described embodiment 7, the electronic circuit module involved in embodiment 8 of this disclosure, in a top view, has the fifth wiring, the sixth wiring, the seventh wiring, and the eighth wiring respectively led out from the fifth communication unit, the sixth communication unit, the seventh communication unit, and the eighth communication unit to one side of the fourth end.

[0133] In the electronic circuit module of Scheme 9 of this disclosure, in the top view of Scheme 7 or 8, the first communication unit, the second communication unit, the third communication unit, and the fourth communication unit are located on a side closer to the first end than the middle of the IC chip in the first direction, and the fifth communication unit, the sixth communication unit, the seventh communication unit, and the eighth communication unit may be located on a side closer to the second end than the middle of the IC chip in the first direction.

[0134] In the above-described embodiment 6, the electronic circuit module of embodiment 10 disclosed herein has a third end as the beginning in a second direction perpendicular to the first direction in a top view, and a fourth end as the end in the second direction opposite to the third end. In the top view, the first communication unit, the second communication unit, the third communication unit, the fourth communication unit, the fifth communication unit, the sixth communication unit, the seventh communication unit, and the eighth communication unit are located closer to the third end than the middle of the IC chip in the second direction. In the top view, the fifth communication unit is located between the first communication unit and the fourth communication unit, the sixth communication unit is located between the first communication unit and the second communication unit, the seventh communication unit is located closer to the second end than the third communication unit, and the eighth communication unit is located between the third communication unit and the fourth communication unit.

[0135] In any of the above-mentioned schemes 6 to 10, the electronic circuit module involved in scheme 11 of this disclosure has a fifth feed point, a sixth feed point, a seventh feed point, and an eighth feed point, respectively. The fifth feed point is connected to the fifth wiring, the sixth feed point is connected to the sixth wiring, the seventh feed point is connected to the seventh wiring, and the eighth feed point is connected to the eighth wiring. The fifth feed point, the sixth feed point, the seventh feed point, and the eighth feed point can be arranged along the first direction.

[0136] In the above-described embodiment 11, the electronic circuit module of embodiment 12 disclosed herein has a third end as the beginning in a second direction perpendicular to the first direction in a top view, and a fourth end as the end in the second direction opposite to the third end. In the top view, at least one of the first wiring, the second wiring, the third wiring, and the fourth wiring is located only on one side from the middle of the first substrate in the second direction to the third end. In the top view, at least one of the fifth feed point, the sixth feed point, the seventh feed point, and the eighth feed point may be located on the side closer to the fourth end than the middle of the first substrate in the second direction.

[0137] In any of the above-described schemes 6 to 12, the electronic circuit module involved in scheme 13 of this disclosure allows the first communication unit, the second communication unit, the third communication unit, and the fourth communication unit to perform at least one of transmitting or receiving a signal corresponding to the first polarization wave, and the fifth communication unit, the sixth communication unit, the seventh communication unit, and the eighth communication unit to perform at least one of transmitting or receiving a signal corresponding to a second polarization wave different from the first polarization wave.

[0138] In the above-described scheme 13, the electronic circuit module involved in scheme 14 of this disclosure can be a linearly polarized wave whose magnetic field vibration directions are perpendicular to each other.

[0139] In any of the above-described embodiments 2 to 5, the electronic circuit module of embodiment 15 disclosed herein includes an IC chip having a fifth communication unit, a sixth communication unit, a seventh communication unit, and an eighth communication unit, and comprising a second substrate, a fifth antenna, a sixth antenna, a seventh antenna, an eighth antenna, a fifth wiring, a sixth wiring, a seventh wiring, and an eighth wiring. The second substrate is located between the first substrate and the semiconductor sealing material and overlaps with the first substrate and the semiconductor sealing material in a top view. The fifth antenna, the sixth antenna, the seventh antenna, and the eighth antenna are arranged sequentially along the first direction in a direction from the first end to the second end in a top view and are located on the second substrate. The fifth wiring connects the fifth antenna and the fifth communication unit, the sixth wiring connects the sixth antenna and the sixth communication unit, the seventh wiring connects the seventh antenna and the seventh communication unit, and the eighth wiring connects the eighth antenna and the eighth communication unit. In the top view, the sixth communication unit is located closer to the first end than the fifth communication unit, and the seventh communication unit may be located closer to the second end than the eighth communication unit.

[0140] In the above-described scheme 15, the electronic circuit module involved in scheme 16 of this disclosure, in a top view, may have the fifth antenna, the sixth antenna, the seventh antenna, and the eighth antenna overlapping with the first antenna, the second antenna, the third antenna, and the fourth antenna, respectively.

[0141] In the above-described embodiment 16, the electronic circuit module of embodiment 17 disclosed herein includes a first contact hole, a second contact hole, a third contact hole, and a fourth contact hole that communicate from one side of the first substrate toward the side of the semiconductor sealing material. The first wiring, the second wiring, the third wiring, and the fourth wiring can pass through the inner sides of the first contact hole, the second contact hole, the third contact hole, and the fourth contact hole, respectively, to connect the IC chip to the first antenna, the second antenna, the third antenna, and the fourth antenna.

[0142] In any of the above-described embodiments 15 to 17, the electronic circuit module involved in embodiment 18 of this disclosure allows the first communication unit, the second communication unit, the third communication unit, and the fourth communication unit to perform at least one of transmitting or receiving a signal corresponding to a first electromagnetic wave having a first frequency, and the fifth communication unit, the sixth communication unit, the seventh communication unit, and the eighth communication unit to perform at least one of transmitting or receiving a signal corresponding to a second electromagnetic wave having a second frequency different from the first frequency.

[0143] The electronic circuit module of embodiment 19 of this disclosure, in any of embodiments 1 to 18 above, includes a connector located on a side closer to the semiconductor sealing material than the first substrate and connected to the IC chip. In a top view, the IC chip may be located on a side closer to the connector in the first direction than the middle of the first substrate.

[0144] The electronic device involved in Scheme 20 of this disclosure may have the electronic circuit module described in any one of Schemes 1 to 19 above.

[0145] This disclosure is not limited to the embodiments described above, and various modifications can be made within the scope of the claims. Embodiments obtained by appropriately combining the technical solutions disclosed in different embodiments are also included in the technical scope of this disclosure. Furthermore, new technical features can be formed by combining the technical methods disclosed in each embodiment.

Claims

1. An electronic circuit module, characterized in that, include: The first substrate has, in a top view, a first end as the beginning in a first direction and a second end as the end on the opposite side of the first end in the first direction. A semiconductor sealing material that overlaps with the first substrate in a top view; The first antenna, the second antenna, and the third antenna are arranged in order from the first end toward the second end along the first direction in a top view and are located on the first substrate; An IC chip having a first communication section, a second communication section and a third communication section, and located within the semiconductor sealing material; as well as A first wiring, a second wiring, and a third wiring are provided. The first wiring connects the first antenna to the first communication unit, the second wiring connects the second antenna to the second communication unit, and the third wiring connects the third antenna to the third communication unit. In the top view, the second communication unit is located on the side closer to the first end than the first communication unit, or on the side closer to the second end than the third communication unit.

2. The electronic circuit module according to claim 1, characterized in that, The IC chip also has a fourth communication unit. The electronic circuit module further includes: a fourth antenna, located on the first substrate, arranged along the first direction with the first antenna, the second antenna, and the third antenna, and located in the top view on a side closer to the second end than the third antenna; The fourth wiring connects the fourth antenna and the fourth communication unit. In the top view, the second communication unit is located on the side closer to the first end than the first communication unit, and the third communication unit is located on the side closer to the second end than the fourth communication unit.

3. The electronic circuit module according to claim 2, characterized in that, The first substrate has a third end that serves as the beginning in a second direction perpendicular to the first direction in a top view. In the top view, the first communication unit, the second communication unit, the third communication unit, and the fourth communication unit are located on a side closer to the third end than the middle of the IC chip in a second direction perpendicular to the first direction. In the top view, the first wiring, the second wiring, the third wiring, and the fourth wiring are respectively led out from the first communication unit, the second communication unit, the third communication unit, and the fourth communication unit to one side of the third end.

4. The electronic circuit module according to claim 2, characterized in that, The first antenna, the second antenna, the third antenna, and the fourth antenna each have a first feed point, a second feed point, a third feed point, and a fourth feed point, respectively. The first feed point is connected to the first wiring, the second feed point is connected to the second wiring, the third feed point is connected to the third wiring, and the fourth feed point is connected to the fourth wiring. The first feed point, the second feed point, the third feed point, and the fourth feed point are arranged along the first direction in the top view, and are located in the middle of the first substrate in the second direction perpendicular to the first direction in the top view.

5. The electronic circuit module according to claim 2, characterized in that, In the top view, the difference between the length of the first wiring and the length of the second wiring is less than 1 / 20 of the transmission wave wavelength, and the difference between the length of the third wiring and the length of the fourth wiring in the top view is less than 1 / 20 of the transmission wave wavelength.

6. The electronic circuit module according to claim 2, characterized in that, The IC chip also has a fifth communication unit, a sixth communication unit, a seventh communication unit, and an eighth communication unit. The electronic circuit module further includes a fifth wiring, a sixth wiring, a seventh wiring, and an eighth wiring. The fifth wiring connects the first antenna and the fifth communication unit, the sixth wiring connects the second antenna and the sixth communication unit, the seventh wiring connects the third antenna and the seventh communication unit, and the eighth wiring connects the fourth antenna and the eighth communication unit. In the top view, the sixth communication unit is located closer to the first end than the fifth communication unit, and the seventh communication unit is located closer to the second end than the eighth communication unit.

7. The electronic circuit module according to claim 6, characterized in that, The first substrate also has a third end that serves as a starting point in a second direction perpendicular to the first direction in a top view, and a fourth end that serves as a terminal point on the side opposite to the third end in the second direction. In the top view, the first communication unit, the second communication unit, the third communication unit, and the fourth communication unit are located in the second direction on the side closer to the third end than the middle of the IC chip, and the fifth communication unit, the sixth communication unit, the seventh communication unit, and the eighth communication unit are located in the second direction on the side closer to the fourth end than the middle of the IC chip.

8. The electronic circuit module according to claim 7, characterized in that, In the top view, the fifth wiring, the sixth wiring, the seventh wiring, and the eighth wiring are respectively led out from the fifth communication unit, the sixth communication unit, the seventh communication unit, and the eighth communication unit toward one side of the fourth end.

9. The electronic circuit module according to claim 7, characterized in that, In the top view, the first communication unit, the second communication unit, the third communication unit, and the fourth communication unit are located in the first direction on the side closer to the first end than the middle of the IC chip, and the fifth communication unit, the sixth communication unit, the seventh communication unit, and the eighth communication unit are located in the first direction on the side closer to the second end than the middle of the IC chip.

10. The electronic circuit module according to claim 6, characterized in that, The first substrate has a third end that serves as a start point in a second direction perpendicular to the first direction in a top view, and a fourth end that serves as a termination point on the side opposite to the third end in the second direction. In the top view, the first communication unit, the second communication unit, the third communication unit, the fourth communication unit, the fifth communication unit, the sixth communication unit, the seventh communication unit, and the eighth communication unit are located in the second direction, closer to the third end than the middle of the IC chip. In the top view, the fifth communication unit is located between the first communication unit and the fourth communication unit, the sixth communication unit is located between the first communication unit and the second communication unit, the seventh communication unit is located on the side closer to the second end than the third communication unit, and the eighth communication unit is located between the third communication unit and the fourth communication unit.

11. The electronic circuit module according to claim 6, characterized in that, The first antenna, the second antenna, the third antenna, and the fourth antenna each have a fifth feed point, a sixth feed point, a seventh feed point, and an eighth feed point, respectively. The fifth feed point is connected to the fifth wiring, the sixth feed point is connected to the sixth wiring, the seventh feed point is connected to the seventh wiring, and the eighth feed point is connected to the eighth wiring. The fifth feed point, the sixth feed point, the seventh feed point, and the eighth feed point are arranged along the first direction.

12. The electronic circuit module according to claim 11, characterized in that, The first substrate has a third end that serves as a start point in a second direction perpendicular to the first direction in a top view, and a fourth end that serves as a termination point on the side opposite to the third end in the second direction. In the top view, at least one of the first wiring, the second wiring, the third wiring, and the fourth wiring is located only on one side of the second direction from the middle of the first substrate to the third end. In the top view, at least one of the fifth feed point, the sixth feed point, the seventh feed point, and the eighth feed point is located on the side of the fourth end that is closer to the middle of the first substrate in the second direction.

13. The electronic circuit module according to claim 6, characterized in that, The first communication unit, the second communication unit, the third communication unit, and the fourth communication unit perform at least one of transmitting or receiving a signal corresponding to the first polarization wave, and the fifth communication unit, the sixth communication unit, the seventh communication unit, and the eighth communication unit perform at least one of transmitting or receiving a signal corresponding to a second polarization wave different from the first polarization wave.

14. The electronic circuit module according to claim 13, characterized in that, The first polarized wave and the second polarized wave are linearly polarized waves whose magnetic field vibration directions are perpendicular to each other.

15. The electronic circuit module according to claim 2, characterized in that, The IC chip has a fifth communication unit, a sixth communication unit, a seventh communication unit, and an eighth communication unit. The electronic circuit module includes: a second substrate located between the first substrate and the semiconductor sealing material and overlapping the first substrate and the semiconductor sealing material in a top view; The fifth, sixth, seventh, and eighth antennas, arranged sequentially from the first end toward the second end along the first direction in the top view, and located on the second substrate, are as follows: The fifth, sixth, seventh, and eighth wirings are provided, wherein the fifth wiring connects the fifth antenna and the fifth communication unit, the sixth wiring connects the sixth antenna and the sixth communication unit, the seventh wiring connects the seventh antenna and the seventh communication unit, and the eighth wiring connects the eighth antenna and the eighth communication unit. In the top view, the sixth communication unit is located closer to the first end than the fifth communication unit, and the seventh communication unit is located closer to the second end than the eighth communication unit.

16. The electronic circuit module according to claim 15, characterized in that, In the top view, the fifth antenna, the sixth antenna, the seventh antenna, and the eighth antenna overlap with the first antenna, the second antenna, the third antenna, and the fourth antenna, respectively.

17. The electronic circuit module according to claim 16, characterized in that, The fifth antenna, the sixth antenna, the seventh antenna, and the eighth antenna each have a first contact hole, a second contact hole, a third contact hole, and a fourth contact hole that communicate from one side of the first substrate toward the side of the semiconductor sealing material. The first wiring, the second wiring, the third wiring, and the fourth wiring pass through the inner sides of the first contact hole, the second contact hole, the third contact hole, and the fourth contact hole, respectively, and connect the IC chip to the first antenna, the second antenna, the third antenna, and the fourth antenna.

18. The electronic circuit module according to claim 15, characterized in that, The first communication unit, the second communication unit, the third communication unit, and the fourth communication unit perform at least one of transmitting or receiving a signal corresponding to a first electromagnetic wave having a first frequency, and the fifth communication unit, the sixth communication unit, the seventh communication unit, and the eighth communication unit perform at least one of transmitting or receiving a signal corresponding to a second electromagnetic wave having a second frequency different from the first frequency.

19. The electronic circuit module according to claim 1, characterized in that, It also includes a connector located on a side closer to the semiconductor sealing material than the first substrate and connected to the IC chip. In the top view, the IC chip is located on the side of the connector closer than the middle of the first substrate in the first direction.

20. An electronic device, characterized in that, Includes the electronic circuit module according to any one of claims 1 to 19.

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