Phase change liquid cooling system, liquid cooling flow control method and device

Abstract

This application provides a phase change liquid cooling system and a liquid cooling flow control method and apparatus, applicable to the field of liquid cooling technology. The phase change liquid cooling system includes: a cold source; multiple heat dissipation nodes, each heat dissipation node including a heat sink and a first controller, the heat sink being used to dissipate heat from the chip; multiple working fluid pumps, different heat sinks being connected to different working fluid pumps, the working fluid pumps being used to drive the phase change working fluid to flow through the connected heat sinks; a heat exchanger, connected to the heat sinks via the working fluid pumps and connected to the cold source via a main valve; a first controller, used to control the rotational speed of the working fluid pump connected to the heat sink in the heat dissipation node according to the temperature of the chip corresponding to the heat dissipation node where the first controller is located; and a second controller, used to control the opening degree of the main valve according to the temperature of the liquefied phase change working fluid after heat exchange in the heat exchanger. Applying this application embodiment can rationally allocate the flow rate of each branch corresponding to the chip in the liquid cooling system, reducing the risk of chip damage due to high temperature.

Description

Technical Field

[0001] This application relates to the field of liquid cooling technology, and in particular to a phase change liquid cooling system and a liquid cooling flow control method and apparatus. Background Technology

[0002] With the development of communication and artificial intelligence technologies, server performance is increasing, but chip power consumption is also increasing year by year. Traditional chip heat dissipation usually uses air cooling, but air cooling has almost reached its limit for high-performance, high-power chips. At the same time, liquid cooling technology is developing rapidly, and solutions such as cold plate liquid cooling have emerged.

[0003] Among current cold plate liquid cooling systems, pump-driven phase change liquid cooling systems have attracted much attention due to their powerful heat dissipation capabilities. The characteristic of a pump-driven phase change liquid cooling system is that a dedicated liquid pump drives the phase change working fluid (usually a low-boiling-point fluorinated refrigerant) to flow to the location of the heat-generating chip. The latent heat of the boiling phase change of the working fluid then dissipates a large amount of heat, achieving a significant reduction in chip temperature.

[0004] In current pump-driven phase change liquid cooling systems, the most critical challenge lies in the fact that when the phase change working fluid boils inside the cold plate at the chip location, it causes instability in the flow path of the entire phase change working fluid, and the flow resistance also fluctuates. This leads to unstable flow of the phase change working fluid, resulting in the risk of localized dry burning of the cold plate and high-temperature damage to the chip. Summary of the Invention

[0005] The purpose of this application is to provide a phase change liquid cooling system and a liquid cooling flow control method and apparatus to rationally allocate the flow rate of each branch corresponding to a chip in the liquid cooling system, thereby reducing the risk of chip damage due to high temperature. The specific technical solution is as follows:

[0006] In a first aspect, embodiments of this application provide a phase change liquid cooling system, the phase change liquid cooling system comprising:

[0007] Cold source;

[0008] Multiple heat dissipation nodes, each heat dissipation node including a heat sink and a first controller, wherein the heat sink is used to dissipate heat from the chip; the first controller is used to control the speed of the working fluid pump connected to the heat sink in the heat dissipation node according to the temperature of the chip corresponding to the heat dissipation node where the first controller is located.

[0009] Multiple working fluid pumps are connected to different radiators, and the working fluid pumps are used to drive the phase change working fluid to flow through the connected radiators.

[0010] The heat exchanger is connected to the radiator via the working fluid pump and to the cold source via the main valve;

[0011] The second controller is used to control the opening degree of the main valve based on the temperature of the phase change working fluid that has been liquefied after heat exchange in the heat exchanger.

[0012] In one embodiment of this application, each heat sink is connected to a working fluid pump at both ends.

[0013] In one embodiment of this application, a liquid storage tank is connected in series between the heat exchanger and the heat dissipation node. A pressure gauge is installed in the liquid storage space of the liquid storage tank for storing the phase change working fluid. The pressure gauge is electrically connected to the second controller. The volume of the liquid storage space can change. The second controller is further used for:

[0014] Based on the pressure collected by the pressure gauge within the liquid storage space, the volume of the liquid storage space is adjusted, wherein the adjusted volume of the liquid storage space is positively correlated with the collected pressure within the liquid storage space.

[0015] In one embodiment of this application, the two ends of the heat exchanger connected to the cold source are connected through a bypass valve, and the second controller is electrically connected to the bypass valve;

[0016] The second controller is also used to control the opening degree of the bypass valve based on the temperature of the phase change working fluid liquefied after heat exchange in the heat exchanger.

[0017] Secondly, embodiments of this application provide a liquid cooling flow control method, applied to the phase change liquid cooling system described in any one of the first aspects, the method comprising:

[0018] Get the temperature of the phase change working fluid that has been liquefied after heat exchange in the heat exchanger;

[0019] The opening degree of the main valve in the phase change liquid cooling system is controlled based on the obtained temperature of the phase change working fluid.

[0020] For each chip, the current temperature of the chip is obtained, and the speed of the working fluid pump connected to the heat sink of the corresponding chip is controlled according to the chip temperature.

[0021] In one embodiment of this application, controlling the opening degree of the main valve in the phase change liquid cooling system based on the obtained temperature of the phase change working fluid includes:

[0022] Determine whether the temperature of the phase change working fluid is greater than a first preset temperature;

[0023] If the temperature is greater than the first preset temperature, the opening increment of the main valve in the phase change liquid cooling system is calculated based on the difference between the temperature of the phase change working fluid and the first preset temperature. The opening of the main valve is increased according to the opening increment, and the process returns to the step of obtaining the temperature of the phase change working fluid that has been liquefied after heat exchange in the heat exchanger.

[0024] If the temperature is less than the first preset temperature, the opening of the main valve is reduced by the difference between the first preset temperature and the temperature of the phase change working fluid. The opening of the main valve is reduced by the amount of the reduction in opening, and the process returns to the step of obtaining the temperature of the phase change working fluid that has been liquefied after heat exchange in the heat exchanger.

[0025] If the temperature is equal to the first preset temperature, then the opening degree of the main valve is kept constant.

[0026] In one embodiment of this application, controlling the rotation speed of the working fluid pump connected to the heat sink corresponding to the chip based on the chip's temperature includes:

[0027] Based on the difference between the chip's temperature and the second preset temperature, calculate the speed adjustment value of the working fluid pump connected to the heat sink corresponding to the chip;

[0028] Adjust the speed of the working fluid pump according to the calculated speed adjustment value;

[0029] Return to the step of obtaining the current temperature of the chip and continue execution until the temperature of the chip is equal to the second preset temperature.

[0030] In one embodiment of this application, a liquid storage tank is connected in series between the heat exchanger and the heat dissipation node in the phase change liquid cooling system. A pressure gauge is installed in the liquid storage space of the liquid storage tank for storing the phase change working fluid. The volume of the liquid storage space can change. The method further includes:

[0031] Based on the pressure collected by the pressure gauge within the liquid storage space, the volume of the liquid storage space is adjusted, wherein the adjusted volume of the liquid storage space is positively correlated with the collected pressure within the liquid storage space.

[0032] In one embodiment of this application, when a working fluid pump is connected to each end of each radiator, the method further includes:

[0033] For each radiator, if one of the working fluid pumps connected to that radiator fails or shuts down, the speed of the other working fluid pump connected to that radiator is increased.

[0034] Thirdly, embodiments of this application provide a liquid cooling flow control device, applied to the phase change liquid cooling system described in any one of the first aspects, the device comprising:

[0035] The temperature acquisition module is used to acquire the temperature of the phase change working fluid that has been liquefied after heat exchange in the heat exchanger.

[0036] The opening adjustment module is used to control the opening of the main valve in the phase change liquid cooling system according to the obtained temperature of the phase change working fluid;

[0037] The speed adjustment module is used to obtain the current temperature of each chip and control the speed of the working fluid pump connected to the heat sink of the corresponding chip based on the chip's temperature.

[0038] In one embodiment of this application, the opening adjustment module is specifically used for:

[0039] Determine whether the temperature of the phase change working fluid is greater than a first preset temperature;

[0040] If the temperature is greater than the first preset temperature, the opening increment of the main valve in the phase change liquid cooling system is calculated based on the difference between the temperature of the phase change working fluid and the first preset temperature. The opening of the main valve is increased according to the opening increment, and the process returns to trigger the execution of the temperature acquisition module.

[0041] If the temperature is less than the first preset temperature, the opening reduction of the main valve is calculated based on the difference between the first preset temperature and the temperature of the phase change working fluid. The opening of the main valve is then reduced according to the opening reduction, and the process returns to trigger the execution of the temperature acquisition module.

[0042] If the temperature is equal to the first preset temperature, then the opening degree of the main valve is kept constant.

[0043] In one embodiment of this application, the speed adjustment module is specifically used for:

[0044] For each chip, obtain the current temperature of that chip;

[0045] Based on the difference between the chip's temperature and the second preset temperature, calculate the speed adjustment value of the working fluid pump connected to the heat sink corresponding to the chip;

[0046] Adjust the speed of the working fluid pump according to the calculated speed adjustment value;

[0047] Return to the step of obtaining the current temperature of the chip and continue execution until the temperature of the chip is equal to the second preset temperature.

[0048] In one embodiment of this application, a liquid storage tank is connected in series between the heat exchanger and the heat dissipation node in the phase change liquid cooling system. A pressure gauge is installed in the liquid storage space of the liquid storage tank for storing the phase change working fluid. The volume of the liquid storage space can change. The device further includes:

[0049] The volume adjustment module is used to adjust the volume of the liquid storage space based on the pressure collected by the pressure gauge, wherein the adjusted volume of the liquid storage space is positively correlated with the collected pressure in the liquid storage space.

[0050] In one embodiment of this application, when a working fluid pump is connected to each end of each radiator, the device further includes:

[0051] The speed boosting module is used to increase the speed of another working fluid pump connected to each radiator in the event of a failure or shutdown of one working fluid pump connected to that radiator.

[0052] Fourthly, embodiments of this application provide a computer-readable storage medium storing a computer program, which, when executed by a processor, implements any of the methods described in the first aspect.

[0053] Fifthly, embodiments of this application also provide a computer program product containing instructions that, when run on a computer, cause the computer to perform any of the methods described in the first aspect above.

[0054] Beneficial effects of the embodiments in this application:

[0055] The phase change liquid cooling system provided in this application provides a heat sink for each chip, with different heat sinks using different working fluids driven by different working fluid pumps. A first controller can control the speed of different working fluid pumps based on the temperature of different chips, thereby controlling the flow rate of the phase change working fluid in different heat sinks. This allows for precise control of the heat dissipation effect of different heat sinks, enabling accurate and reasonable control of the phase change working fluid flow rate in the branch corresponding to each chip in the liquid cooling system. This ensures stable phase change working fluid flow, reduces the risk of localized dry burning of the cold plate, and thus reduces the risk of high-temperature damage to the chips. Furthermore, a second controller can adjust the opening of the main valve between the cold source and the heat exchanger, thereby adjusting the flow rate of the phase change working fluid on the cold source side of the heat exchanger. This allows for control of the heat exchange efficiency between the phase change working fluid on the heat sink side and the phase change working fluid on the cold source side in the heat exchanger. This precisely controls the temperature of the phase change working fluid on the heat sink side after liquefaction and cooling in the heat exchanger, further reducing the risk of high-temperature damage to the chips.

[0056] Furthermore, since the phase change working fluid in the heat sinks corresponding to different chips is driven by different working fluid pumps, when a chip is not in operation or does not require heat dissipation, the working fluid pump connected to the heat sink corresponding to that chip does not need to rotate, and there is no flow of phase change working fluid in that heat sink. Compared to all heat sinks being connected to the same main working fluid pump, where the main working fluid pump needs to rotate to drive the phase change working fluid through all heat sinks when any chip needs heat dissipation, the separate working fluid pump configuration for each heat sink in this embodiment can reduce overall power consumption.

[0057] Furthermore, the first controller and the heatsink are integrated into the heat dissipation node, allowing them to be installed together on the chip side, which facilitates installation. Also, the first controllers corresponding to each heatsink are independent of each other; a failure in any one first controller does not affect the control of the heatsink by the other first controllers.

[0058] Of course, implementing any product or method of this application does not necessarily require achieving all of the advantages described above at the same time. Attached Figure Description

[0059] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other embodiments can be obtained based on these drawings.

[0060] Figure 1 This is a schematic diagram of the structure of a phase change liquid cooling system provided in an embodiment of this application;

[0061] Figure 2 This is a schematic diagram of a heat dissipation node provided in an embodiment of this application;

[0062] Figure 3 A schematic flowchart of the first liquid cooling flow control method provided in the embodiments of this application;

[0063] Figure 4 A schematic flowchart illustrating the second liquid cooling flow control method provided in this application embodiment;

[0064] Figure 5 A schematic flowchart illustrating the third liquid cooling flow control method provided in this application embodiment;

[0065] Figure 6 This is a schematic diagram of the structure of a liquid-cooled flow control device provided in an embodiment of this application.

[0066] Cold source 1; heat dissipation node 2, radiator 21; working fluid pump 3; heat exchanger 4; main valve 5; temperature sensor 6; liquid storage tank 7; pressure sensor 8; liquid cooling manifold 9; bypass valve 10. Detailed Implementation

[0067] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art based on this application are within the scope of protection of this application.

[0068] See Figure 1 , Figure 2 This application provides a phase change liquid cooling system, which includes:

[0069] Cold source 1;

[0070] Multiple heat dissipation nodes 2, each heat dissipation node 2 includes a heat sink 21 and a first controller. The heat sink 21 is used to dissipate heat from the chip. The first controller is used to control the rotation speed of the working fluid pump 3 connected to the heat sink 21 in the heat dissipation node 2 according to the temperature of the chip corresponding to the heat dissipation node 2 where the first controller is located.

[0071] Multiple working fluid pumps 3 are connected to different radiators 21. The working fluid pumps 3 are used to drive the phase change working fluid to flow through the connected radiators 21.

[0072] The heat exchanger 4 is connected to the radiator 21 via the working fluid pump 3 and to the cold source 1 via the main valve 5.

[0073] The second controller is used to control the opening degree of the main valve 5 based on the temperature of the phase change working fluid liquefied after heat exchange in the heat exchanger 4.

[0074] As can be seen from the above, in the phase change liquid cooling system of this application, each chip is equipped with a heat sink 21 for heat dissipation. The phase change working fluid in different heat sinks 21 is driven by different working fluid pumps 3. The first controller can control the rotation speed of different working fluid pumps 3 according to the temperature of different chips, thereby controlling the flow rate of the phase change working fluid in different heat sinks 21. This allows for precise control of the heat dissipation effect of different heat sinks 21, thus enabling precise and reasonable control of the phase change working fluid flow rate of each chip's corresponding branch in the liquid cooling system. This ensures a stable phase change working fluid flow rate, reduces the risk of local dry burning of the cold plate, and thus reduces the risk of high-temperature damage to the chip. In addition, the second controller can also adjust the opening of the main valve 5 between the cold source 1 and the heat exchanger 4, thereby adjusting the flow rate of the phase change working fluid on the cold source 1 side of the heat exchanger 4. This allows for control of the heat exchange efficiency between the phase change working fluid on the heat sink 21 side and the phase change working fluid on the cold source 1 side in the heat exchanger 4. This allows for precise control of the temperature of the phase change working fluid on the heat sink 21 after liquefaction and cooling in the heat exchanger 4, thereby precisely controlling the heat dissipation effect of the phase change working fluid in the heat sink 21 on the chip and further reducing the risk of chip damage due to high temperature.

[0075] Furthermore, since the phase change working fluid in the heat sink 21 corresponding to different chips is driven by different working fluid pumps 3, when a chip is in an inactive state or does not require heat dissipation, the working fluid pump 3 connected to the heat sink 21 corresponding to that chip does not need to rotate, and there is no flow of phase change working fluid in that heat sink 21. Compared with all heat sinks 21 being connected to the same main working fluid pump, where the main working fluid pump needs to rotate to drive the phase change working fluid to flow through all heat sinks 21 when any chip needs heat dissipation, the separate working fluid pump 3 configuration for each heat sink 21 in this embodiment can reduce the overall power consumption.

[0076] Furthermore, the first controller and the heat sink 21 are integrated in the heat dissipation node 2, and can be installed together on the chip side, making installation more convenient. In addition, the first controllers corresponding to each heat sink 21 are independent of each other, and the failure of any first controller will not affect the control of the heat sink 21 by the other first controllers.

[0077] In one possible embodiment, when the temperature of the phase change working fluid after liquefaction in heat exchanger 4 is lower than a first preset temperature, the opening of the main valve 5 is reduced to decrease the flow rate of the phase change working fluid flowing through heat exchanger 4 on the primary side, thereby reducing the heat absorption of the primary-side phase change working fluid on the secondary-side phase change working fluid and increasing the temperature of the secondary-side phase change working fluid after heat exchange. Conversely, when the temperature of the phase change working fluid after liquefaction in heat exchanger 4 is higher than the first preset temperature, the opening of the main valve 5 is increased to increase the flow rate of the primary-side phase change working fluid flowing through heat exchanger 4, thereby increasing the heat absorption of the primary-side phase change working fluid on the secondary-side phase change working fluid and decreasing the temperature of the secondary-side phase change working fluid after heat exchange. When the temperature of the phase change working fluid after liquefaction in heat exchanger 4 is equal to the first preset temperature, the opening of the main valve 5 is kept constant. The first preset temperature is the temperature of the phase change working fluid after cooling through heat exchanger 4 under a preset ideal state.

[0078] In one scenario, a pre-defined relationship can be established between the temperature difference between the liquefied phase change working fluid and a first pre-defined temperature, and the adjustment range of the main valve 5 opening. The adjustment range of the main valve 5 opening is determined according to this relationship, and then the main valve 5 opening is adjusted accordingly. If the adjustment range of the main valve 5 opening is positive, the main valve 5 opening is increased; if the adjustment range of the main valve 5 opening is negative, the main valve 5 opening is decreased.

[0079] In another scenario, the opening of the main valve 5 can be adjusted cyclically. If the temperature of the phase change medium after liquefaction in heat exchanger 4 is lower than the first preset temperature, the opening of the main valve 5 is reduced. If the temperature of the phase change medium after liquefaction in heat exchanger 4 is higher than the first preset temperature, the opening of the main valve 5 is increased. After adjustment, the relationship between the temperature of the phase change medium after liquefaction in heat exchanger 4 and the first preset temperature is re-established, and the next round of adjustment is performed until the temperature of the phase change medium after liquefaction in heat exchanger 4 equals the first preset temperature. The adjustment range of the main valve 5 opening can be a random value each time, or the absolute value of the difference between the temperature of the phase change medium after liquefaction in heat exchanger 4 and the first preset temperature can be positively correlated with the adjustment range each time, and the adjustment range for each time can be determined based on the above relationship.

[0080] In another possible embodiment, for each chip, when the chip temperature is below the second preset temperature, the rotation speed of the working fluid pump 3 is reduced to decrease the flow rate of the phase change working fluid flowing through the heat sink 21, thereby reducing the heat absorption of the chip by the heat sink 21. Conversely, when the chip temperature is above the second preset temperature, the rotation speed of the working fluid pump 3 is increased to increase the flow rate of the phase change working fluid flowing through the heat sink 21, thereby increasing the heat absorption of the chip by the heat sink 21. When the chip temperature equals the second preset temperature, the rotation speed of the working fluid pump 3 is kept constant.

[0081] In one scenario, a correlation can be established between the temperature difference between the chip and a second preset temperature and the adjustment range of the working fluid pump 3's rotation speed. The adjustment range of the working fluid pump 3's rotation speed is determined according to this correlation, and then the rotation speed of the working fluid pump 3 is adjusted accordingly. If the adjustment range of the working fluid pump 3's rotation speed is positive, the rotation speed of the working fluid pump 3 is increased; if the adjustment range of the working fluid pump 3's rotation speed is negative, the rotation speed of the working fluid pump 3 is decreased.

[0082] In another scenario, the speed of the working fluid pump 3 can be adjusted cyclically. If the chip temperature is lower than the second preset temperature, the speed of the working fluid pump 3 is reduced; if the chip temperature is higher than the second preset temperature, the speed of the working fluid pump 3 is increased. After each adjustment, the relationship between the chip temperature and the second preset temperature is redefined, and the next round of adjustment is performed until the chip temperature equals the second preset temperature. The magnitude of each adjustment to the working fluid pump 3 speed can be a random value, or a preset positive correlation can be established between the absolute value of the difference between the chip temperature and the second preset temperature and the magnitude of each adjustment. The magnitude of each adjustment is determined based on this relationship.

[0083] In one possible embodiment, each chip corresponds to a heat dissipation node 2, and a heat dissipation node 2 includes a heat sink 21, or multiple heat sinks 21 connected in series or in parallel. The heat sink 21 can be a cold plate.

[0084] In one possible embodiment, the heat exchanger 4 has four ports. A phase change working fluid loop is formed between the first and second ports, both connected to the outlet and inlet of the cold source 1. A phase change working fluid loop is formed between the third and fourth ports, both connected to the outlet and inlet of the heat sink 21. The cold source 1 side is called the primary side, and the heat sink 21 side is called the secondary side. The phase change working fluid on the primary side and the phase change working fluid on the secondary side are not interconnected. The phase change working fluid on the secondary side flows from the heat exchanger 4 to the heat sink 21, absorbs heat from the chip, and its temperature rises and it vaporizes. Then it flows back to the heat exchanger 4, exchanges heat with the phase change working fluid on the primary side, and its temperature decreases and it liquefies, before flowing back to the heat sink 21. The phase change working fluid on the primary side absorbs the temperature of the phase change working fluid on the secondary side through the heat exchanger 4, its temperature rises and it vaporizes, and its temperature decreases and it liquefies after flowing back to the cold source 1, completing the heat exchange.

[0085] In one possible embodiment, a temperature sensor 6 is provided at the outlet of the heat exchanger 4, which is connected to the inlet of the radiator 21, for detecting the temperature of the liquefied phase change working fluid after being cooled by the heat exchanger 4. The temperature sensor 6 is electrically connected to the second controller.

[0086] In addition, each chip is equipped with a temperature sensor 6 for detecting the chip's temperature. The temperature sensor 6 on the chip is electrically connected to the first controller.

[0087] In one possible embodiment, see Figure 1 Each heat dissipation node 2 has its inlet connected to the same liquid cooling manifold 9, and each heat dissipation node 2 has its outlet connected to the same liquid cooling manifold 9. The two liquid cooling manifolds 9 are respectively connected to the ports on the secondary side of the heat exchanger 4. If a heat dissipation node 2 includes a radiator 21, then the inlet of the radiator 21 is connected to the inlet of the heat dissipation node 2, and the outlet of the radiator 21 is connected to the outlet of the heat dissipation node 2. If a heat dissipation node 2 includes multiple radiators 21 connected in series, then the inlet of the heat dissipation node 2 is connected to the inlet of the radiator 21 closest to the inlet of the heat dissipation node 2, and the outlet of the heat dissipation node 2 is connected to the outlet of the radiator 21 closest to the outlet of the heat dissipation node 2. If a heat dissipation node includes multiple radiators 21 connected in parallel, then the inlet of the heat dissipation node 2 is connected to the inlet of each radiator 21, and the outlet of the heat dissipation node 2 is connected to the outlet of each radiator 21.

[0088] In another possible embodiment, see Figure 1 A liquid storage tank 7 can also be connected between the outlet of the secondary side of the heat exchanger 4 and the inlet of the heat dissipation node 2. The liquid storage tank 7 is used to store the phase change working fluid.

[0089] In another possible embodiment, see Figure 1 A flow meter can also be connected between the outlet of the secondary side of the heat exchanger 4 and the inlet of the heat dissipation node 2 to monitor the flow rate of the phase change working fluid on the secondary side.

[0090] In one possible embodiment, see Figure 1 A temperature sensor 6 and / or a pressure sensor 8 may be installed on the pipe between the inlet of the aforementioned heat dissipation node 2 and the outlet of the secondary side of the heat exchanger 4. A temperature sensor 6 and / or a pressure sensor 8 may be installed on the pipe between the outlet of the aforementioned heat dissipation node 2 and the inlet of the secondary side of the heat exchanger 4. A temperature sensor 6 and / or a pressure sensor 8 may be installed on the pipe between the outlet of the aforementioned cold source 1 and the inlet of the primary side of the heat exchanger 4. A temperature sensor 6 and / or a pressure sensor 8 may be installed on the pipe between the inlet of the aforementioned cold source 1 and the outlet of the primary side of the heat exchanger 4.

[0091] The temperature sensor 6 and / or pressure sensor 8 mentioned above are used to detect the temperature and / or pressure of the pipeline. When the temperature and / or pressure exceed the threshold, an alarm can be triggered, thereby ensuring the safety of the phase change liquid cooling system.

[0092] In one possible embodiment, the first controller is a BMC (Baseboard Management Controller) installed in the heat dissipation node 2.

[0093] In one embodiment of this application, each heat sink 21 is connected to a working fluid pump 3 at both ends.

[0094] As can be seen from the above, since each radiator 21 is connected to a working fluid pump 3 at both ends, if either working fluid pump 3 at one end of a radiator 21 fails or shuts down, the other working fluid pump 3 can continue to work, ensuring that the radiator 21 can continue to dissipate heat. Furthermore, when one working fluid pump 3 is replaced, the other working fluid pump 3 can work normally, facilitating the maintenance of the working fluid pump 3.

[0095] When both working fluid pumps 3 at both ends of a radiator 21 are running, the rotational speeds of the two working fluid pumps 3 can be the same or different. When both working fluid pumps 3 are rotating, the rotational speeds of both working fluid pumps 3 are less than the rotational speed of a single working fluid pump 3.

[0096] In another possible embodiment, a working fluid pump 3 may be connected only at the inlet of each heat dissipation node 2, or only at the outlet of each heat dissipation node 2.

[0097] In one embodiment of this application, a liquid storage tank 7 is connected in series between the heat exchanger 4 and the heat dissipation node 2. A pressure gauge is installed in the liquid storage space of the liquid storage tank 7 for storing the phase change working fluid. The pressure gauge is electrically connected to the second controller. The volume of the liquid storage space can change. The second controller is further used for:

[0098] Based on the pressure collected by the pressure gauge in the liquid storage space, the volume of the liquid storage space is adjusted.

[0099] Among them, the volume of the adjusted storage space is positively correlated with the pressure in the collected storage space.

[0100] As can be seen from the above, in this embodiment, the volume of the storage space can be adjusted based on the pressure within the storage space. The higher the pressure collected in the storage space, the larger the adjusted volume of the storage space, thereby reducing the pressure in the storage space, which in turn reduces the overall pressure in the secondary side pipeline. This prevents excessive pressure in the secondary side pipeline and avoids excessively high saturation temperatures of the phase change working fluid. If the saturation temperature of the phase change working fluid is too high, it will only undergo phase change when it reaches a high saturation temperature, affecting the heat dissipation effect of the radiator. Therefore, in this embodiment, controlling the pressure in the secondary side pipeline can improve the heat dissipation effect of the radiator.

[0101] In one possible embodiment, the space inside the liquid storage tank 7 is a liquid storage space, the side wall of the liquid storage tank 7 is a bellows cover, and the top wall and bottom wall of the liquid storage tank 7 can be relatively close or far apart under the action of the drive motor, thereby compressing or expanding the bellows cover and thus changing the volume of the liquid storage space.

[0102] In another possible embodiment, a movable plate that seals against the side wall is provided between the top and bottom walls of the aforementioned liquid storage tank 7. The space enclosed by the movable plate, the side wall, and the bottom wall is the liquid storage space. The movable plate can move up and down to change the volume of the liquid storage space. The movable plate can be made of materials such as rubber or silicone.

[0103] In one embodiment of this application, see [link to embodiment]. Figure 1 The two ends of the heat exchanger 4 connected to the cold source 1 are connected through a bypass valve 10, and the second controller is electrically connected to the bypass valve 10.

[0104] The second controller is also used to control the opening degree of the bypass valve 10 based on the temperature of the phase change working fluid liquefied after heat exchange in the heat exchanger 4.

[0105] As can be seen from the above, in this embodiment, a bypass valve 10 is provided between the two ends of the heat exchanger 4 connected to the cold source 1, so that a portion of the phase change working fluid flowing out of the cold source 1 flows to the heat exchanger 4, and the other portion flows directly back to the cold source 1 through the bypass valve 10. Therefore, by controlling the opening degree of the bypass valve 10, the proportion of the phase change working fluid flowing out of the cold source 1 into the heat exchanger 4 can be controlled, thereby controlling the heat exchange efficiency of the heat exchanger 4 for the phase change working fluid on the radiator 21 side, and thus controlling the temperature of the liquefied phase change working fluid after heat exchange in the heat exchanger 4.

[0106] In one possible implementation, when the temperature of the phase change working fluid after liquefaction in heat exchanger 4 is lower than a first preset temperature, the opening of bypass valve 10 is increased to increase the flow rate of the phase change working fluid flowing through bypass valve 10, thereby reducing the flow rate of the phase change working fluid flowing through heat exchanger 4 on the primary side. This reduces the heat absorption of the primary-side phase change working fluid by the secondary-side phase change working fluid, thus increasing the temperature of the secondary-side phase change working fluid after heat exchange. Conversely, when the temperature of the phase change working fluid after liquefaction in heat exchanger 4 is higher than the first preset temperature, the opening of bypass valve 10 is decreased to reduce the flow rate of the phase change working fluid flowing through bypass valve 10, thereby increasing the flow rate of the primary-side phase change working fluid flowing through heat exchanger 4. This increases the heat absorption of the primary-side phase change working fluid by the secondary-side phase change working fluid, thus decreasing the temperature of the secondary-side phase change working fluid after heat exchange. When the temperature of the phase change working fluid after liquefaction in heat exchanger 4 is equal to the first preset temperature, the opening of bypass valve 10 is kept constant.

[0107] In one scenario, a pre-defined relationship can be established between the temperature difference between the liquefied phase change working fluid and a first pre-defined temperature, and the adjustment range of the bypass valve 10 opening. The adjustment range of the bypass valve 10 opening is determined according to this relationship, and then the opening of the bypass valve 10 is adjusted. If the adjustment range of the bypass valve 10 opening is positive, the opening of the bypass valve 10 is increased; if the adjustment range of the bypass valve 10 opening is negative, the opening of the main valve 5 is decreased.

[0108] In another scenario, the opening of bypass valve 10 can be adjusted cyclically. If the temperature of the phase change medium after liquefaction in heat exchanger 4 is lower than the first preset temperature, the opening of bypass valve 10 is increased. If the temperature of the phase change medium after liquefaction in heat exchanger 4 is higher than the first preset temperature, the opening of bypass valve 10 is decreased. After adjustment, the relationship between the temperature of the phase change medium after cooling in heat exchanger 4 and the first preset temperature is re-established, and the next round of adjustment is performed until the temperature of the phase change medium after liquefaction in heat exchanger 4 equals the first preset temperature. The magnitude of each adjustment of the opening of bypass valve 10 can be a random value, or the absolute value of the difference between the temperature of the phase change medium after liquefaction in heat exchanger 4 and the first preset temperature can be positively correlated with the magnitude of each adjustment. The magnitude of each adjustment is determined based on this relationship.

[0109] In one embodiment of this application, the working fluid pump 3 is pluggably mounted outside the heat dissipation node 2.

[0110] As can be seen from the above, since the working fluid pump 3 is installed outside the heat dissipation node 2, it does not need to be installed near the chips inside the server. It can be installed outside the server or in other locations, and it does not need to be installed and removed together with the heat dissipation node 2, regardless of where it is installed. The independent pluggable design of the working fluid pump 3 improves the convenience of replacing and installing it, and also reduces the cost of the heat dissipation node 2 itself.

[0111] In another embodiment of this application, see Figure 2 The working fluid pump 3, the first controller, and the radiator 21 can also be installed together in the heat dissipation node 2. In this case, the installation of the radiator 21, the first controller, and the working fluid pump 3 can be completed by installing the heat dissipation node 2 at one time, which can improve the convenience of installation.

[0112] In one embodiment of this application, before the first controller is powered on, each working fluid pump 3 rotates at a speed that is a preset ratio of its maximum rotation speed.

[0113] As can be seen from the above, in this application, when the first controller is not powered on, malfunctions, or is not properly installed, each working fluid pump 3 can still rotate at the default speed to ensure that the phase change liquid cooling system can operate normally.

[0114] The preset ratios mentioned above can be 80%, 75%, 85%, etc., and can be set according to actual needs.

[0115] See Figure 3 This application provides a liquid cooling flow control method, applied to the aforementioned phase change liquid cooling system. After the process starts, the method includes the following steps S301-S303.

[0116] S301: Get the temperature of the phase change working fluid that has been liquefied after heat exchange in the heat exchanger.

[0117] S302: Control the opening degree of the main valve in the above phase change liquid cooling system according to the obtained temperature of the phase change working fluid.

[0118] S303: For each chip, obtain the current temperature of the chip, and control the speed of the working fluid pump connected to the heat sink of the chip according to the chip temperature.

[0119] As can be seen from the above, the phase change liquid cooling system of this application configures a heat sink for each chip for heat dissipation. Different heat sinks use different working fluids driven by different working fluid pumps. The first controller can control the speed of different working fluid pumps according to the temperature of different chips, thereby controlling the flow rate of the phase change working fluid in different heat sinks. This allows for precise control of the heat dissipation effect of different heat sinks, enabling precise and reasonable control of the phase change working fluid flow rate in the branch corresponding to each chip in the liquid cooling system. This ensures stable phase change working fluid flow, reduces the risk of localized dry burning of the cold plate, and thus reduces the risk of high-temperature damage to the chips. Furthermore, the second controller can adjust the opening of the main valve between the cold source and the heat exchanger, thereby adjusting the flow rate of the phase change working fluid on the cold source side of the heat exchanger. This allows for control of the heat exchange efficiency between the phase change working fluid on the heat sink side and the phase change working fluid on the cold source side in the heat exchanger. This precisely controls the temperature of the phase change working fluid on the heat sink side after liquefaction and cooling in the heat exchanger, further reducing the risk of high-temperature damage to the chips.

[0120] Furthermore, since the phase change working fluid in the heat sinks corresponding to different chips is driven by different working fluid pumps, when a chip is not in operation or does not require heat dissipation, the working fluid pump connected to the heat sink corresponding to that chip does not need to rotate, and there is no flow of phase change working fluid in that heat sink. Compared to all heat sinks being connected to the same main working fluid pump, where the main working fluid pump needs to rotate to drive the phase change working fluid through all heat sinks when any chip needs heat dissipation, the separate working fluid pump configuration for each heat sink in this embodiment can reduce overall power consumption.

[0121] Furthermore, the first controller and the heatsink are integrated into the heat dissipation node, allowing them to be installed together on the chip side, which facilitates installation. Also, the first controllers corresponding to each heatsink are independent of each other; a failure in any one first controller does not affect the control of the heatsink by the other first controllers.

[0122] See Figure 4 The above step S302 is achieved through the following steps S302A-S302D.

[0123] S302A: Determine whether the temperature of the above-mentioned phase change working fluid is greater than the first preset temperature.

[0124] If the temperature is greater than the first preset temperature, then step S302B is executed; if the temperature is less than the first preset temperature, then step S302C is executed; if the temperature is equal to the first preset temperature, then step S302D is executed.

[0125] S302B: Based on the difference between the temperature of the phase change working fluid and the first preset temperature, calculate the increase in the opening of the main valve in the phase change liquid cooling system, and increase the opening of the main valve according to the increase in the opening.

[0126] Return to step S301 and continue execution.

[0127] S302C: Based on the difference between the first preset temperature and the temperature of the phase change working fluid, calculate the reduction in the opening of the main valve, and reduce the opening of the main valve according to the reduction in the opening.

[0128] Return to step S301 and continue execution.

[0129] S302D: Controls the opening degree of the above main valve to remain unchanged.

[0130] As can be seen from the above, in this embodiment of the application, the temperature of the phase change working fluid that has cooled down after heat exchange in the heat exchanger is controlled by continuously and cyclically adjusting the opening of the main valve, so that the opening of the main valve is matched with the real-time temperature of the phase change liquid cooling system, thereby achieving precise control of the opening of the main valve.

[0131] See Figure 5 The above step S303 is achieved through the following steps S303A-S303C.

[0132] S303A: For each chip, obtain the current temperature of that chip.

[0133] S303B: Calculate the speed adjustment value of the working fluid pump connected to the heat sink corresponding to the chip based on the difference between the chip's temperature and the second preset temperature.

[0134] S303C: Adjust the speed of the working fluid pump according to the calculated speed adjustment value.

[0135] Determine whether the temperature of the chip is equal to the second preset temperature mentioned above. If yes, end the process. If no, return to step S303A and continue execution until the temperature of the chip is equal to the second preset temperature mentioned above.

[0136] As can be seen from the above, in this embodiment of the application, the flow rate of the phase change working fluid passing through the heat sink is controlled by continuously and cyclically adjusting the working fluid pump speed, thereby controlling the chip temperature and keeping the working fluid pump speed matched with the chip's real-time temperature, thus achieving precise control of the working fluid pump speed.

[0137] In one embodiment, if a radiator connects to two working fluid pumps, and both pumps are rotating, the two pumps can be adjusted synchronously. The adjustment range for each pump can be the same or different, or only the speed of one pump can be adjusted. The adjusted speeds of the two pumps can be the same or different.

[0138] In one embodiment of this application, a liquid storage tank is connected in series between the heat exchanger and the heat dissipation node in the above-mentioned phase change liquid cooling system. A pressure gauge is installed in the liquid storage space of the liquid storage tank used to store the phase change working fluid. The volume of the liquid storage space can change. The above method also includes the following step A.

[0139] Step A: Based on the pressure in the liquid storage space collected by the pressure gauge, adjust the volume of the liquid storage space.

[0140] Among them, the volume of the adjusted storage space is positively correlated with the pressure in the collected storage space.

[0141] As can be seen from the above, in this embodiment, the volume of the storage space can be adjusted based on the pressure within the storage space. The higher the pressure collected in the storage space, the larger the adjusted volume of the storage space, thereby reducing the pressure in the storage space, which in turn reduces the overall pressure in the secondary side pipeline. This prevents excessive pressure in the secondary side pipeline and avoids excessively high saturation temperatures of the phase change working fluid. If the saturation temperature of the phase change working fluid is too high, it will only undergo phase change when it reaches a high saturation temperature, affecting the heat dissipation effect of the radiator. Therefore, in this embodiment, controlling the pressure in the secondary side pipeline can improve the heat dissipation effect of the radiator.

[0142] In one embodiment of this application, when a working fluid pump is connected to each end of each radiator, the above method further includes step B.

[0143] Step B: For each radiator, if one working fluid pump connected to the radiator fails or shuts down, increase the speed of the other working fluid pump connected to the radiator.

[0144] As can be seen from the above, in the case of a failure or shutdown of one of the two working fluid pumps connected to a radiator in this embodiment of the application, the speed of the other working fluid pump is increased so that the other working fluid pump can compensate for the absence of the failed or shut-down working fluid pump, so that the radiator can continue to work normally.

[0145] In one embodiment, the speed increase of the other working fluid pump is the original speed of the faulty or shut-down working fluid pump, or the default speed increase of the other working fluid pump.

[0146] Corresponding to the aforementioned liquid cooling flow control method, this application also provides a liquid cooling flow control device, applied to the aforementioned phase change liquid cooling system, see [link to relevant documentation]. Figure 6 The aforementioned device includes:

[0147] Temperature acquisition module 601 is used to acquire the temperature of the phase change working fluid that has been liquefied after heat exchange in the heat exchanger.

[0148] The opening adjustment module 602 is used to control the opening of the main valve in the phase change liquid cooling system according to the obtained temperature of the phase change working fluid.

[0149] The speed adjustment module 603 is used to obtain the current temperature of each chip and control the speed of the working fluid pump connected to the heat sink of the chip according to the chip temperature.

[0150] As can be seen from the above, the phase change liquid cooling system of this application configures a heat sink for each chip for heat dissipation. Different heat sinks use different working fluids driven by different working fluid pumps. The first controller can control the speed of different working fluid pumps according to the temperature of different chips, thereby controlling the flow rate of the phase change working fluid in different heat sinks. This allows for precise control of the heat dissipation effect of different heat sinks, enabling precise and reasonable control of the phase change working fluid flow rate in the branch corresponding to each chip in the liquid cooling system. This ensures stable phase change working fluid flow, reduces the risk of localized dry burning of the cold plate, and thus reduces the risk of high-temperature damage to the chips. Furthermore, the second controller can adjust the opening of the main valve between the cold source and the heat exchanger, thereby adjusting the flow rate of the phase change working fluid on the cold source side of the heat exchanger. This allows for control of the heat exchange efficiency between the phase change working fluid on the heat sink side and the phase change working fluid on the cold source side in the heat exchanger. This precisely controls the temperature of the phase change working fluid on the heat sink side after liquefaction and cooling in the heat exchanger, further reducing the risk of high-temperature damage to the chips.

[0151] Furthermore, since the phase change working fluid in the heat sinks corresponding to different chips is driven by different working fluid pumps, when a chip is not in operation or does not require heat dissipation, the working fluid pump connected to the heat sink corresponding to that chip does not need to rotate, and there is no flow of phase change working fluid in that heat sink. Compared to all heat sinks being connected to the same main working fluid pump, where the main working fluid pump needs to rotate to drive the phase change working fluid through all heat sinks when any chip needs heat dissipation, the separate working fluid pump configuration for each heat sink in this embodiment can reduce overall power consumption.

[0152] In one embodiment of this application, the opening adjustment module 602 is specifically used for:

[0153] Determine whether the temperature of the phase change working fluid is greater than a first preset temperature;

[0154] If the temperature is greater than the first preset temperature, the opening increment of the main valve in the phase change liquid cooling system is calculated based on the difference between the temperature of the phase change working fluid and the first preset temperature. The opening of the main valve is increased according to the opening increment, and the process returns to trigger the execution of the temperature acquisition module 601.

[0155] If the temperature is less than the first preset temperature, the opening reduction of the main valve is calculated based on the difference between the first preset temperature and the temperature of the phase change working fluid. The opening of the main valve is then reduced according to the opening reduction, and the process returns to trigger the execution of the temperature acquisition module 601.

[0156] If the temperature is equal to the first preset temperature, then the opening degree of the main valve is kept constant.

[0157] As can be seen from the above, in this embodiment of the application, the temperature of the phase change working fluid that has cooled down after heat exchange in the heat exchanger is controlled by continuously and cyclically adjusting the opening of the main valve, so that the opening of the main valve is matched with the real-time temperature of the phase change liquid cooling system, thereby achieving precise control of the opening of the main valve.

[0158] In one embodiment of this application, the speed adjustment module 603 is specifically used for:

[0159] For each chip, obtain the current temperature of that chip;

[0160] Based on the difference between the chip's temperature and the second preset temperature, calculate the speed adjustment value of the working fluid pump connected to the heat sink corresponding to the chip;

[0161] Adjust the speed of the working fluid pump according to the calculated speed adjustment value;

[0162] Return to the step of obtaining the current temperature of the chip and continue execution until the temperature of the chip is equal to the second preset temperature.

[0163] As can be seen from the above, in this embodiment of the application, the flow rate of the phase change working fluid passing through the heat sink is controlled by continuously circulating the working fluid pump speed, thereby controlling the chip temperature and keeping the working fluid pump speed matched with the chip's real-time temperature, thus achieving precise control of the working fluid pump speed.

[0164] In one embodiment of this application, a liquid storage tank is connected in series between the heat exchanger and the heat dissipation node in the phase change liquid cooling system. A pressure gauge is installed in the liquid storage space of the liquid storage tank for storing the phase change working fluid. The volume of the liquid storage space can change. The device further includes:

[0165] The volume adjustment module is used to adjust the volume of the liquid storage space based on the pressure collected by the pressure gauge, wherein the adjusted volume of the liquid storage space is positively correlated with the collected pressure in the liquid storage space.

[0166] As can be seen from the above, in this embodiment, the volume of the storage space can be adjusted based on the pressure within the storage space. The higher the pressure collected in the storage space, the larger the adjusted volume of the storage space, thereby reducing the pressure in the storage space, which in turn reduces the overall pressure in the secondary side pipeline. This prevents excessive pressure in the secondary side pipeline and avoids excessively high saturation temperatures of the phase change working fluid. If the saturation temperature of the phase change working fluid is too high, it will only undergo phase change when it reaches a high saturation temperature, affecting the heat dissipation effect of the radiator. Therefore, in this embodiment, controlling the pressure in the secondary side pipeline can improve the heat dissipation effect of the radiator.

[0167] In one embodiment of this application, when a working fluid pump is connected to each end of each radiator, the device further includes:

[0168] The speed boosting module is used to increase the speed of another working fluid pump connected to each radiator in the event of a failure or shutdown of one working fluid pump connected to that radiator.

[0169] As can be seen from the above, in the case of a failure or shutdown of one of the two working fluid pumps connected to a radiator in this embodiment of the application, the speed of the other working fluid pump is increased so that the other working fluid pump can compensate for the absence of the failed or shut-down working fluid pump, so that the radiator can continue to work normally.

[0170] In another embodiment provided in this application, a computer-readable storage medium is also provided, which stores a computer program that, when executed by a processor, implements the steps of any of the above-described liquid cooling flow control methods.

[0171] In another embodiment provided in this application, a computer program product containing instructions is also provided, which, when run on a computer, causes the computer to execute any of the liquid cooling flow control methods described above.

[0172] In the above embodiments, implementation can be achieved entirely or partially through software, hardware, firmware, or any combination thereof. When implemented using software, it can be implemented entirely or partially as a computer program product. The computer program product includes one or more computer instructions. When the computer program instructions are loaded and executed on a computer, all or part of the processes or functions described in the embodiments of this application are generated. The computer can be a general-purpose computer, a special-purpose computer, a computer network, or other programmable device. The computer instructions can be stored in a computer-readable storage medium or transmitted from one computer-readable storage medium to another. For example, the computer instructions can be transmitted from one website, computer, server, or data center to another website, computer, server, or data center via wired (e.g., coaxial cable, fiber optic, digital subscriber line (DSL)) or wireless (e.g., infrared, wireless, microwave, etc.) means. The computer-readable storage medium can be any available medium that a computer can access or a data storage device such as a server or data center that integrates one or more available media. The available medium can be a magnetic medium (e.g., floppy disk, hard disk, magnetic tape), an optical medium (e.g., DVD), or a semiconductor medium (e.g., solid state disk (SSD)).

[0173] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0174] The various embodiments in this specification are described in a related manner. Similar or identical parts between embodiments can be referred to mutually. Each embodiment focuses on describing the differences from other embodiments. In particular, the descriptions of the method, apparatus, computer-readable storage medium, and computer program product embodiments are relatively simple because they are substantially similar to the method embodiments; relevant parts can be referred to the descriptions of the method embodiments.

[0175] The above description is merely a preferred embodiment of this application and is not intended to limit the scope of protection of this application. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application are included within the scope of protection of this application.

Claims

1. A phase change liquid cooling system, characterized in that, The phase change liquid cooling system includes: Cold source; Multiple heat dissipation nodes, each heat dissipation node including a heat sink and a first controller, wherein the heat sink is used to dissipate heat from the chip; the first controller is used to control the speed of the working fluid pump connected to the heat sink in the heat dissipation node according to the temperature of the chip corresponding to the heat dissipation node where the first controller is located. Multiple working fluid pumps are connected to different radiators, and the working fluid pumps are used to drive the phase change working fluid to flow through the connected radiators. The heat exchanger is connected to the radiator via the working fluid pump and to the cold source via the main valve; The second controller is used to control the opening degree of the main valve based on the temperature of the phase change working fluid that has been liquefied after heat exchange in the heat exchanger.

2. The phase change liquid cooling system according to claim 1, characterized in that, Each radiator is connected to a working fluid pump at both ends.

3. The phase change liquid cooling system according to claim 1, characterized in that, A liquid storage tank is connected in series between the heat exchanger and the heat dissipation node. A pressure gauge is installed in the liquid storage space of the liquid storage tank for storing the phase change working fluid. The pressure gauge is electrically connected to the second controller. The volume of the liquid storage space can change. The second controller is also used for: Based on the pressure collected by the pressure gauge within the liquid storage space, the volume of the liquid storage space is adjusted, wherein the adjusted volume of the liquid storage space is positively correlated with the collected pressure within the liquid storage space.

4. The phase change liquid cooling system according to any one of claims 1-3, characterized in that, The two ends of the heat exchanger connected to the cold source are connected by a bypass valve, and the second controller is electrically connected to the bypass valve. The second controller is also used to control the opening degree of the bypass valve based on the temperature of the phase change working fluid liquefied after heat exchange in the heat exchanger.

5. A liquid cooling flow control method, characterized in that, The method, applied to the phase change liquid cooling system according to any one of claims 1-4, comprises: Get the temperature of the phase change working fluid that has been liquefied after heat exchange in the heat exchanger; The opening degree of the main valve in the phase change liquid cooling system is controlled based on the obtained temperature of the phase change working fluid. For each chip, the current temperature of the chip is obtained, and the speed of the working fluid pump connected to the heat sink of the corresponding chip is controlled according to the chip temperature.

6. The method according to claim 5, characterized in that, The step of controlling the opening degree of the main valve in the phase change liquid cooling system based on the obtained temperature of the phase change working fluid includes: Determine whether the temperature of the phase change working fluid is greater than a first preset temperature; If the temperature is greater than the first preset temperature, the opening increment of the main valve in the phase change liquid cooling system is calculated based on the difference between the temperature of the phase change working fluid and the first preset temperature. The opening of the main valve is increased according to the opening increment, and the process returns to the step of obtaining the temperature of the phase change working fluid that has been liquefied after heat exchange in the heat exchanger. If the temperature is less than the first preset temperature, the opening of the main valve is reduced by the difference between the first preset temperature and the temperature of the phase change working fluid. The opening of the main valve is reduced by the amount of the reduction in opening, and the process returns to the step of obtaining the temperature of the phase change working fluid that has been liquefied after heat exchange in the heat exchanger. If the temperature is equal to the first preset temperature, then the opening degree of the main valve is kept constant.

7. The method according to claim 5, characterized in that, The step of controlling the rotational speed of the working fluid pump connected to the heat sink corresponding to the chip based on the chip's temperature includes: Based on the difference between the chip's temperature and the second preset temperature, calculate the speed adjustment value of the working fluid pump connected to the heat sink corresponding to the chip; Adjust the speed of the working fluid pump according to the calculated speed adjustment value; Return to the step of obtaining the current temperature of the chip and continue execution until the temperature of the chip is equal to the second preset temperature.

8. The method according to any one of claims 5-7, characterized in that, In the phase change liquid cooling system, a liquid storage tank is connected in series between the heat exchanger and the heat dissipation node. A pressure gauge is installed in the liquid storage space of the liquid storage tank for storing the phase change working fluid. The volume of the liquid storage space can change. The method further includes: Based on the pressure collected by the pressure gauge within the liquid storage space, the volume of the liquid storage space is adjusted, wherein the adjusted volume of the liquid storage space is positively correlated with the collected pressure within the liquid storage space.

9. The method according to any one of claims 5-7, characterized in that, When a working fluid pump is connected to each end of each radiator, the method further includes: For each radiator, if one of the working fluid pumps connected to that radiator fails or shuts down, the speed of the other working fluid pump connected to that radiator is increased.

10. A liquid cooling flow control device, characterized in that, The device is applied to the phase change liquid cooling system according to any one of claims 1-4, the device comprising: The temperature acquisition module is used to acquire the temperature of the phase change working fluid that has been liquefied after heat exchange in the heat exchanger. The opening adjustment module is used to control the opening of the main valve in the phase change liquid cooling system according to the obtained temperature of the phase change working fluid; The speed adjustment module is used to obtain the current temperature of each chip and control the speed of the working fluid pump connected to the heat sink of the corresponding chip based on the chip's temperature.

11. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores a computer program that, when executed by a processor, implements the method described in any one of claims 5-9.

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