A laser fusion target pellet sorting device and microsphere sorting device

Abstract

This application relates to a laser fusion target separation and sorting device and a microsphere separation and sorting device, belonging to the field of microsphere separation technology. The laser fusion target separation and sorting device includes a substrate, a first ultrasonic vibrating element, a microsphere receiving mechanism, and a rotating mechanism. The substrate is a hemispherical shell structure with its opening facing upwards, and its inner cavity accommodates the target particles to be separated. The substrate has multiple through holes penetrating its wall thickness, spaced apart around its central axis, which is angled to the horizontal direction. The first ultrasonic vibrating element is located on the substrate. The microsphere receiving mechanism is located below the substrate and has a guide groove with an inclined bottom wall. The projection of the central axis of the substrate and the extension direction of the guide groove in the vertical direction coincides. The rotating mechanism is connected to the substrate and drives the substrate to rotate around its own central axis, causing the target particles to sequentially pass through the through holes and fall into the guide groove. The laser fusion target separation and sorting device of this application can stably, orderly, and at high frequency arrange the target particles into a sequence for precise delivery into the accelerator inlet.

Description

Technical Field

[0001] This application relates to the field of microsphere separation technology, and particularly to a laser fusion target separation and sorting device and a microsphere separation and sorting device. Background Technology

[0002] Inertial confinement fusion (ICF), as one of the solutions to humanity's energy problems, is moving from experimental devices to commercial demonstration power plants. In laser fusion energy (Laser IFE) systems, in order to achieve high repetition rate energy output, the design specifications require driving the laser to work continuously at a frequency of 10 shots per second. This means that cryogenic target pellets of the same frequency (10 per second) need to be precisely injected into the center of the target chamber.

[0003] However, there are difficulties in accurately injecting cryogenic target pellets of the same frequency into the center of the target chamber: Problem of disordered stacking: If the target pellets are stacked and stored, they are very likely to be damaged or stick together due to mutual contact.

[0004] High-frequency separation is difficult: In a very short time (<0.1 seconds), the positioning, separation and release of the target pellet are completed. Traditional solutions such as robotic arms are difficult to balance speed and micro-force protection of the target pellet.

[0005] Difficulty in adapting to low-temperature environments: Target pellets are usually in a low-temperature frozen state, and the reliability of complex active control devices drops sharply at low temperatures.

[0006] Operating in dry or vacuum environments is difficult: When the diameter of the target pellet is reduced to millimeters or even sub-millimeters, the ratio of gravity to surface force (i.e., the Bond number) decreases sharply. In dry air or a vacuum environment, van der Waals forces and electrostatic attraction can indeed be several orders of magnitude greater than gravity, causing the target pellet to stick to the funnel wall and not fall off by its own weight.

[0007] Therefore, there is a need for a device that can ensure that the upstream target preparation device can stably, orderly, and frequently arrange the target into a sequence. Summary of the Invention

[0008] The purpose of this application is to provide a laser fusion target separation and sorting device and a microsphere separation and sorting device, which can stably, orderly and at high frequency arrange the target into a sequence so as to accurately feed it into the accelerator inlet.

[0009] In a first aspect, this application provides a laser fusion target separation and sorting device, which includes a substrate, a first ultrasonic vibrating element, a microsphere receiving mechanism, and a rotating mechanism. The substrate is a hemispherical shell structure with its opening facing upwards, and the inner cavity of the substrate is used to accommodate the target particles to be separated. The substrate has multiple through holes penetrating its wall thickness, and the multiple through holes are distributed at intervals around the central axis of the substrate. The central axis of the substrate is set at an angle to the horizontal direction. The first ultrasonic vibrating element is disposed on the substrate. The microsphere receiving mechanism is located below the substrate and is provided with a guide groove with an inclined bottom wall. The projection of the central axis of the substrate and the extension direction of the guide groove in the vertical direction coincides. The rotating mechanism is connected to the substrate. The rotating mechanism is used to drive the substrate to rotate around its own central axis so that the target particles sequentially pass through the through holes and fall into the guide groove.

[0010] In the laser fusion target separation and sorting device provided in this application, the first ultrasonic vibrator on the substrate helps to prevent the target pellets from sticking to the substrate and from adhering to each other. A rotating mechanism drives the substrate to rotate around its central axis. Under the combined effects of centrifugal force and gravity, the target pellets fall sequentially from the through-hole at the bottom of the substrate and into the guide groove of the microsphere receiving mechanism located below the substrate, achieving high-frequency separation of the target pellets. The target pellets then roll downwards along the guide groove on the inclined bottom wall, arranging them into a sequence. Since the laser fusion target separation and sorting device of this application does not have complex active control devices, it is suitable for low-temperature environments. Furthermore, because the process of the target pellets falling from the through-hole is subject to both centrifugal force and gravity, it is suitable for use in dry air or vacuum environments.

[0011] In conjunction with the first aspect, in an optional embodiment of this application, the diameter of the through hole gradually decreases from the center to the edge along the radial direction of the substrate.

[0012] In the above technical solution, the target pellet has a guiding function, which facilitates the target pellet to enter the through hole and fall out of the through hole.

[0013] In conjunction with the first aspect, in an optional embodiment of this application, the through hole is a countersunk hole with a circular cross-section.

[0014] In the above technical solution, by controlling the minimum aperture of the counterbore, target pellets of the correct size can fall, thus achieving the sorting of target pellets by size.

[0015] In conjunction with the first aspect, in an optional embodiment of this application, the first ultrasonic vibrating element is disposed at the outer periphery of the opening of the substrate.

[0016] The above technical solution helps to further avoid the target pellets from sticking to the substrate and the target pellets from sticking to each other.

[0017] In conjunction with the first aspect, in an optional embodiment of this application, the microsphere receiving mechanism has an arc-shaped receiving area with the opening facing upward, and a guide groove is disposed within the receiving area.

[0018] In the above technical solution, the arc-shaped receiving area can prevent the target shot from splashing out and guide the target shot into the guide groove.

[0019] In conjunction with the first aspect, in an optional embodiment of this application, the receiving area is a fan-shaped groove structure.

[0020] In conjunction with the first aspect, in an optional embodiment of this application, the laser fusion target separation and sorting device further includes a guiding mechanism, which is connected downstream of the microsphere receiving mechanism; the guiding mechanism is provided with a through groove extending in a horizontal direction, and the through groove is connected to the guide groove.

[0021] In conjunction with the first aspect, in an optional embodiment of this application, the laser fusion target separation and sorting device further includes a pulsed semiconductor laser, which is located on the side of the guiding mechanism near the microsphere receiving mechanism; the pulsed semiconductor laser is used to emit laser into the through slot, and the propagation direction of the laser coincides with the axis of the through slot.

[0022] In the above technical solution, the light pressure of the pulsed semiconductor laser and the rolling momentum of the target pellet rolling down the guide groove along the inclined bottom wall can provide power for the target pellet to move forward in the through groove.

[0023] In conjunction with the first aspect, in an optional embodiment of this application, the laser fusion target separation and sorting device further includes a second ultrasonic vibrating element, which is disposed on the microsphere receiving mechanism.

[0024] In the above technical solution, the setting of the second ultrasonic vibrating element helps to prevent the target pellet from sticking to the microsphere receiving mechanism.

[0025] Secondly, this application provides a microsphere separation and sorting device, which includes: a substrate, a first ultrasonic vibrating element, a microsphere receiving mechanism, and a rotating mechanism; the substrate is a hemispherical shell structure with its opening facing upwards, and the inner cavity of the substrate is used to accommodate the microspheres to be separated; the substrate has multiple through holes penetrating its wall thickness, and the multiple through holes are distributed at intervals around the central axis of the substrate, with the central axis of the substrate forming an angle with the horizontal direction; the first ultrasonic vibrating element is disposed on the substrate; the microsphere receiving mechanism is located below the substrate and is provided with a guide groove with an inclined bottom wall; the projection of the central axis of the substrate and the extension direction of the guide groove in the vertical direction coincides; the rotating mechanism is connected to the substrate; the rotating mechanism is used to drive the substrate to rotate around its own central axis, so that the microspheres sequentially pass through the through holes and fall into the guide groove.

[0026] In the microsphere separation and sorting device provided in this application, by setting a first ultrasonic vibrating element on the substrate, it is beneficial to avoid microspheres sticking to the substrate and microspheres sticking to each other; by driving the substrate to rotate around its own central axis through a rotating mechanism, the microspheres will fall sequentially from the through hole located at the bottom of the substrate under the combined action of centrifugal force and gravity, and fall into the guide groove of the microsphere receiving mechanism located below the substrate, thereby realizing high-frequency separation of microspheres; the microspheres roll down the guide groove of the inclined bottom wall in sequence, thereby realizing the arrangement of microspheres into a sequence. Attached Figure Description

[0027] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0028] Figure 1 This is a schematic diagram of the structure of the laser fusion target separation and sorting device provided in the embodiments of this application.

[0029] Figure 2 This is a schematic diagram of the microsphere receiving mechanism and guiding mechanism in the laser fusion target separation and sorting device provided in the embodiments of this application.

[0030] Icons: 100-Laser fusion target separation and sorting device; 110-Substrate; 111-Inner cavity; 112-Through hole; 120-First ultrasonic vibrating element; 130-Microsphere receiving mechanism; 131-Guiding groove; 132-Receiving area; 133-Laser hole; 140-Rotation mechanism; 150-Guiding mechanism; 151-Through groove; 160-Pulsed semiconductor laser; 170-Second ultrasonic vibrating element; 180-Third ultrasonic vibrating element; 200-Target. Detailed Implementation

[0031] The embodiments of the technical solution of this application will now be described in detail with reference to the accompanying drawings. These embodiments are only used to more clearly illustrate the technical solution of this application and are therefore merely examples, and should not be used to limit the scope of protection of this application.

[0032] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs; the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit this application; the terms “comprising” and “having”, and any variations thereof, in the specification and the foregoing description of the drawings are intended to cover non-exclusive inclusion.

[0033] In the description of the embodiments of this application, technical terms such as "first" and "second" are used only to distinguish different objects and should not be construed as indicating or implying relative importance or implicitly specifying the number, specific order, or primary and secondary relationship of the indicated technical features. In the description of the embodiments of this application, "multiple" means two or more (including two), unless otherwise explicitly defined.

[0034] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0035] In the description of the embodiments of this application, the technical terms "upper", "lower", "bottom", "inner" etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. They are only for the convenience of describing the embodiments of this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application.

[0036] In the description of the embodiments of this application, unless otherwise expressly specified and limited, the technical term "connection" and other such terms should be interpreted broadly. For example, it can refer to a fixed connection, a detachable connection, or an integral connection; it can refer to a mechanical connection or an electrical connection; it can refer to a direct connection or an indirect connection through an intermediate medium; it can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this application according to the specific circumstances.

[0037] Example This application provides a laser fusion target separation and sorting device. Figure 1 This is a schematic diagram of the laser fusion target separation and sorting device provided in an embodiment of this application. Figure 2 For a schematic diagram of the microsphere receiving and guiding mechanism in the laser fusion target separation and sorting device provided in this application embodiment, please refer to [link / reference]. Figure 1 and Figure 2 The laser fusion target separation and sorting device 100 includes a substrate 110, a first ultrasonic vibrating element 120, a microsphere receiving mechanism 130, and a rotating mechanism 140.

[0038] The substrate 110 is a hemispherical shell structure with the opening facing upward. The inner cavity 111 of the substrate 110 is used to accommodate the target pellets 200 to be separated from the target pellet preparation device. The substrate 110 has multiple through holes 112 that penetrate its wall thickness. The multiple through holes 112 are distributed at intervals around the central axis of the substrate 110. The central axis of the substrate 110 is set at an angle to the horizontal direction.

[0039] The first ultrasonic vibrating element 120 is disposed on the substrate 110.

[0040] The microsphere receiving mechanism 130 is located below the substrate 110 and is provided with a guide groove 131 with an inclined bottom wall; the projection of the central axis of the substrate 110 and the extension direction of the guide groove 131 in the vertical direction coincides.

[0041] The rotating mechanism 140 is connected to the base 110; the rotating mechanism 140 is used to drive the base 110 to rotate around its own central axis so that the target 200 passes through the through hole 112 and falls into the guide groove 131 in sequence.

[0042] In the laser fusion target separation and sorting device 100 provided in this application, by setting a first ultrasonic vibrator 120 on the substrate 110, it is beneficial to avoid the target pellets 200 from sticking to the substrate 110 and from sticking together or being electrostatically attracted. The substrate 110 is driven to rotate around its own central axis by the rotating mechanism 140. Under the combined action of centrifugal force and gravity, the target pellets 200 will fall sequentially from the through-hole 112 at the bottom of the substrate 110 and into the guide groove 131 of the microsphere receiving mechanism 130 located below the substrate 110, thus achieving high-frequency separation of the target pellets 200. The target pellets 200 then roll downwards along the guide groove 131 on the inclined bottom wall, thus arranging the target pellets 200 into a sequence. Therefore, the laser fusion target separation and sorting device 100 provided in this application can stably, orderly, and at high frequency arrange the target pellets 200 into a sequence for precise delivery into the accelerator inlet. The laser fusion target separation and sorting device 100 provided in this application can provide key front-end material supply technology support for laser fusion energy systems.

[0043] Since the laser fusion target separation and sorting device 100 of this application does not have complex active control devices, it is suitable for low temperature environments; in addition, since the target 200 is subjected to the dual forces of centrifugal force and gravity during the process of falling from the through hole 112, it is suitable for dry air or vacuum environments.

[0044] In some optional embodiments of this application, the diameter of the through hole 112 gradually decreases from the center to the edge along the radial direction of the substrate 110. This design guides the target pellet 200, facilitating its entry into and exit from the through hole 112.

[0045] In some optional embodiments of this application, the through hole 112 is a countersunk hole with a circular cross-section. By controlling the minimum diameter of the countersunk hole, target pellets 200 of the correct size can fall out, thus achieving sorting of the target pellets 200 by size.

[0046] It should be noted that this application does not limit the diameter of the through hole 112, as long as it is slightly larger than the outer diameter of the target pellet 200.

[0047] In some optional embodiments of this application, a plurality of through holes 112 are symmetrically distributed about the central axis of the substrate 110.

[0048] In some optional embodiments of this application, the first ultrasonic vibrating element 120 is disposed at the outer periphery of the opening of the substrate 110. This arrangement helps to further prevent the target pellets 200 from adhering to the substrate 110 and from adhering to each other.

[0049] As an example, the first ultrasonic vibrating element 120 is an ultrasonic vibrating plate.

[0050] In some optional embodiments of this application, the microsphere receiving mechanism 130 has an upward-facing arc-shaped receiving area 132, and a guide groove 131 is disposed within the receiving area 132. The arc-shaped receiving area 132 can prevent the target pellet 200 from splashing out and has a guiding effect on the target pellet 200, guiding the target pellet 200 into the guide groove 131.

[0051] As an example, in this application, the receiving area 132 is a fan-shaped groove structure.

[0052] In some optional embodiments of this application, the microsphere receiving mechanism 130 is generally plate-shaped.

[0053] In some optional embodiments of this application, the rotating mechanism 140 is a speed-regulating motor. It should be noted that in other feasible embodiments of this application, the rotating mechanism 140 may also be a turntable bearing or other structures.

[0054] In some optional embodiments of this application, the laser fusion target separation and sorting device 100 further includes a second ultrasonic vibrator 170, which is disposed on the microsphere receiving mechanism 130. The second ultrasonic vibrator 170 helps to prevent the target 200 from sticking to the microsphere receiving mechanism 130.

[0055] Furthermore, the second ultrasonic vibrating element 170 is disposed on the side of the microsphere receiving mechanism 130 opposite to the substrate 110, and is located at the upper end of the microsphere receiving mechanism 130.

[0056] As an example, the second ultrasonic vibrating element 170 is an ultrasonic vibrating plate.

[0057] In some optional embodiments of this application, the laser fusion target separation and sorting device 100 further includes a guide mechanism 150, which is connected downstream of the microsphere receiving mechanism 130; the guide mechanism 150 is provided with a through groove 151 extending in the horizontal direction, and the through groove 151 communicates with the guide groove 131.

[0058] In some optional embodiments of this application, the guide mechanism 150 is plate-shaped in general.

[0059] Furthermore, the laser fusion target separation and sorting device 100 also includes a third ultrasonic vibrator 180, which is disposed on the guide mechanism 150. The placement of the third ultrasonic vibrator 180 helps to prevent the target 200 from sticking to the guide mechanism 150.

[0060] Furthermore, the third ultrasonic vibrating element 180 is disposed on the lower surface of the guide mechanism 150 and located at the end of the guide mechanism 150 away from the microsphere receiving mechanism 130.

[0061] As an example, the third ultrasonic vibrating element 180 is an ultrasonic vibrating plate.

[0062] In some optional embodiments of this application, the laser fusion target separation and sorting device 100 further includes a pulsed semiconductor laser 160, which is located on the side of the guide mechanism 150 near the microsphere receiving mechanism 130. The pulsed semiconductor laser 160 is used to emit laser light into the through groove 151, and the propagation direction of the laser light coincides with the axis of the through groove 151. In the above scheme, the light pressure of the pulsed semiconductor laser and the rolling momentum of the target 200 rolling down the guide groove 131 along the inclined bottom wall can provide power for the advancement of the target 200 in the through groove 151.

[0063] Furthermore, the pulsed semiconductor laser 160 is located below the microsphere receiving mechanism 130, and the microsphere receiving mechanism 130 is provided with a laser hole 133, which is connected to the through groove 151, so that the laser emitted by the pulsed semiconductor laser 160 can enter the through groove 151 through the laser hole 133 to provide power for the advance of the target 200.

[0064] In some optional embodiments of this application, a detection device (not shown in the figure) and a drilling device (not shown in the figure) may also be provided above the guide mechanism 150 to perform detection and drilling processing on the target pellet 200.

[0065] The aforementioned laser fusion target separation and sorting device is also applicable to the separation and sorting of other microspheres. Therefore, this application also provides a microsphere separation and sorting device, comprising: a substrate, a first ultrasonic vibrating element, a microsphere receiving mechanism, and a rotating mechanism; the substrate is an upward-opening hemispherical shell structure, and the inner cavity of the substrate is used to accommodate the microspheres to be separated; the substrate has multiple through holes penetrating its wall thickness, the multiple through holes being spaced apart around the central axis of the substrate, and the central axis of the substrate being set at an angle to the horizontal direction; the first ultrasonic vibrating element is disposed on the substrate; the microsphere receiving mechanism is located below the substrate and is provided with a guide groove with an inclined bottom wall; the projection of the central axis of the substrate and the extension direction of the guide groove in the vertical direction coincides; the rotating mechanism is connected to the substrate; the rotating mechanism is used to drive the substrate to rotate around its own central axis, so that the microspheres sequentially pass through the through holes and fall into the guide groove.

[0066] In the microsphere separation and sorting device provided in this application, by setting a first ultrasonic vibrating element on the substrate, it is beneficial to avoid microspheres sticking to the substrate and microspheres sticking to each other; by driving the substrate to rotate around its own central axis through a rotating mechanism, the microspheres will fall sequentially from the through hole located at the bottom of the substrate under the combined action of centrifugal force and gravity, and fall into the guide groove of the microsphere receiving mechanism located below the substrate, thereby realizing high-frequency separation of microspheres; the microspheres roll down the guide groove of the inclined bottom wall in sequence, thereby realizing the arrangement of microspheres into a sequence.

[0067] Therefore, the microsphere separation and sorting device provided in this application can be used to reveal the high-frequency ordered flow law of microspheres in gravitational and low-temperature fields, which will have important academic value for the field of precision microsphere manipulation.

[0068] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A laser fusion target pellet separation and sorting apparatus, characterized by, include: The substrate is a hemispherical shell structure with its opening facing upwards. The inner cavity of the substrate is used to accommodate the target pellet to be separated. The substrate has multiple through holes that penetrate its wall thickness. The multiple through holes are distributed at intervals around the central axis of the substrate. The central axis of the substrate is set at an angle to the horizontal direction. A first ultrasonic vibrating element is disposed on the substrate; A microsphere receiving mechanism is located below the substrate and is provided with a guide groove with an inclined bottom wall; the central axis of the substrate and the projection of the extension direction of the guide groove in the vertical direction coincide. A rotating mechanism is connected to the base body; the rotating mechanism is used to drive the base body to rotate around its own central axis so that the target pellets pass through the through holes and fall into the guide groove in sequence.

2. The laser fusion target separation and sorting device according to claim 1, characterized in that, Along the radial direction of the substrate from the center to the edge, the diameter of the through hole gradually decreases.

3. The laser fusion target separation and sorting device according to claim 1, characterized in that, The through hole is a countersunk hole with a circular cross-section.

4. The laser fusion target separation and sorting device according to any one of claims 1 to 3, characterized in that, The first ultrasonic vibrating element is disposed at the outer periphery of the opening of the substrate.

5. The laser fusion target separation and sorting device according to any one of claims 1 to 3, characterized in that, The microsphere receiving mechanism has an upward-facing arc-shaped receiving area, and the guide groove is disposed within the receiving area.

6. The laser fusion target separation and sorting device according to claim 5, characterized in that, The receiving area has a fan-shaped groove structure.

7. The laser fusion target separation and sorting device according to any one of claims 1 to 3, characterized in that, The laser fusion target separation and sorting device further includes a guiding mechanism, which is connected downstream of the microsphere receiving mechanism; the guiding mechanism has a through groove extending in a horizontal direction, which communicates with the guide groove.

8. The laser fusion target separation and sorting device according to claim 7, characterized in that, The laser fusion target separation and sorting device further includes a pulsed semiconductor laser, which is located on the side of the guiding mechanism closer to the microsphere receiving mechanism; the pulsed semiconductor laser is used to emit laser light into the through slot, and the propagation direction of the laser light coincides with the axis of the through slot.

9. The laser fusion target separation and sorting device according to any one of claims 1 to 3, characterized in that, The laser fusion target separation and sorting device further includes a second ultrasonic vibrating element, which is disposed on the microsphere receiving mechanism.

10. A microsphere separation and sorting device, characterized in that, include: The substrate is a hemispherical shell structure with its opening facing upwards. The inner cavity of the substrate is used to accommodate the microspheres to be separated. The substrate has multiple through holes that penetrate its wall thickness. The multiple through holes are distributed at intervals around the central axis of the substrate. The central axis of the substrate is set at an angle to the horizontal direction. A first ultrasonic vibrating element is disposed on the substrate; A microsphere receiving mechanism is located below the substrate and is provided with a guide groove with an inclined bottom wall; the central axis of the substrate and the projection of the extension direction of the guide groove in the vertical direction coincide. A rotating mechanism is connected to the substrate; the rotating mechanism is used to drive the substrate to rotate around its own central axis so that the microspheres pass through the through holes and fall into the guide groove in sequence.

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