Chip coupling method and system

Abstract

The application discloses a chip coupling method and system, comprising calculating an initial position for optical coupling according to a light emitting point position and a center position; after controlling the lens to move to the initial position, searching for an optical signal according to a preset scanning track; after finding the optical signal, entering a dry coupling stage, performing optimization alignment to determine a preliminary maximum optical power; at an alignment position, dispensing glue and entering a wet coupling stage, performing fine coupling scanning to find a final maximum optical power, and performing a second specification inspection; on the basis of passing the second specification inspection, curing the glue to fix the lens, and then performing a final specification inspection. The application can automatically complete identification and positioning of the chip and the lens, positioning and searching of the optical signal, dry and wet coupling, and final curing inspection, does not need manual intervention, can adaptively adjust parameters and specification inspection in the coupling process, can cope with various complex situations, and has high stability.

Description

[0001] This application is a divisional application of the invention patent application with application number CN202610246297.2, entitled "A Chip Coupling Method and System", and the parent application was filed on March 2, 2026. Technical Field

[0002] This invention belongs to the technical field of optical communication manufacturing and packaging, specifically relating to a chip coupling method and system. Background Technology

[0003] Silicon photonics technology is playing an increasingly important role in modern optical communication, sensing, and computing due to its potential for high integration, low cost, and high performance. In the packaging process of silicon photonic modules, efficiently coupling the light emitted from a laser (such as a DFB chip) into an optical fiber or waveguide is a critical and challenging step. This is typically achieved using one or more micrometer-sized lenses.

[0004] Currently, traditional coupling methods largely rely on manual adjustments by operators or semi-automatic equipment, resulting in problems such as low positioning accuracy, time-consuming coupling process, poor repeatability, high dependence on operator experience, and low production efficiency. Especially in the process requiring the integration of dry and wet coupling, wet coupling after adhesive application can cause changes in the optical path due to the adhesive's viscosity and shrinkage during curing, leading to focus misalignment and severely impacting coupling accuracy and efficiency. Summary of the Invention

[0005] The purpose of this invention is to propose a chip coupling method and system to solve the problems in the prior art.

[0006] Therefore, the present invention provides a chip coupling method, comprising: The position of the light-emitting point of the positioning chip is determined, the center position of the lens being picked up is determined, and the initial position for optical coupling is calculated based on the position of the light-emitting point and the center position. After the lens is moved to the initial position, it searches for a light signal according to a preset scanning trajectory. After the optical signal is found, the process enters the dry coupling stage, where optimized alignment is performed to determine the initial maximum optical power, and the first specification check is conducted. After the first specification check is passed, glue is applied at the alignment position and the wet coupling stage is entered. Fine coupling scanning is performed to find the final maximum optical power, and a second specification check is performed. After the second specification check is passed, the glue is cured to fix the lens, and then the final specification check is performed. If the check is passed, the data is saved and the coupling is terminated; if it fails, the process returns or terminates according to the preset strategy. The dry coupling stage determines the initial maximum optical power through peak search, which includes: performing a first round of scanning in the Z-axis direction and a first horizontal direction; performing a first round of scanning in a second direction perpendicular to the first horizontal direction; performing a second round of scanning in the Z-axis direction and the first horizontal direction; and performing a second round of scanning in the second direction perpendicular to the first horizontal direction, wherein the scanning step size and scanning range of the second round of scanning are smaller than those of the first round of scanning. The wet coupling stage includes: performing a first round of scanning in the Z-axis direction and a first transverse direction; performing a first round of scanning in a second direction perpendicular to the first transverse direction; performing a second round of scanning in the Z-axis direction and the first transverse direction; and performing a second round of scanning in the second direction perpendicular to the first transverse direction, wherein the scanning step size and scanning range of the second round of scanning are smaller than those of the first round of scanning; wherein the scanning range and scanning step size of the wet coupling stage are smaller than those of the dry coupling stage.

[0007] Preferably, the position of the light-emitting point of the positioning chip, which positions the center position of the lens being picked up, and the initial position for optical coupling calculated based on the position of the light-emitting point and the center position, includes: The camera identifies and locates the position coordinates of the light-emitting area on the chip; The lower camera identifies and locates the center coordinates of the lens; Based on the position coordinates of the light-emitting area and the center position coordinates of the lens, and combined with the mechanical coordinate system transformation relationship, the initial position for optical coupling between the chip and the lens is calculated.

[0008] Preferably, the step of searching for the light signal according to a preset scanning trajectory includes: The suction nozzle controls the lens to move spirally in the X and Z axis planes according to the first scanning range and the first scanning step size, and monitors the optical power in real time; If the optical power value is greater than the first preset threshold, it is determined that an optical signal has been found, and the spiral scanning is stopped.

[0009] Preferably, if no light signal is found within the preset spiral scanning range, the product TOPS current value is reset, the lens is reset to the initial position, and the spiral light-finding action is performed again.

[0010] Preferably, during the first specification check, the second specification check, and the final specification check, if the optical power of the optical signal is less than the corresponding preset qualified value, it is determined to be unqualified, and the process is returned or terminated according to the preset strategy.

[0011] The present invention also provides a chip coupling system, comprising: A vision module, comprising an upper camera for identifying chip positions and a lower camera for identifying lens positions; The motion module includes a motion platform in four axes (X, Y, Z, TZ) and a nozzle for picking up lenses; An optical power detection module is used to detect optical power signals in real time during the coupling process; A dispensing module, including a precision dispensing valve, which is used to apply adhesive to the lens on the surface of the dispensing needle. A curing module, comprising multiple UV light sources for curing the colloid; The control module is electrically connected to the vision module, motion module, light control and detection module, dispensing module, and curing module.

[0012] Preferably, the suction nozzle is fixed on a motion platform in the Z-axis direction.

[0013] Beneficial effects: 1. This invention, through the combined operation of the upper and lower cameras, can significantly reduce the initial search range, and by combining spiral coarse light finding and pre-coupling, can achieve fast and accurate optical path alignment.

[0014] 2. This invention effectively solves the alignment failure problem caused by changes in the optical path before and after dispensing by performing multiple-directional fine coupling after dry coupling and wet coupling, and effectively improves the coupling accuracy and efficiency.

[0015] 3. This invention can automatically complete the entire process from chip and lens identification and positioning, optical signal positioning and searching, dry and wet coupling, and final curing inspection without manual intervention. Furthermore, it can adapt to parameter and specification testing during the coupling process, can cope with various complex situations, and has extremely high stability. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 A flowchart of the chip coupling method provided by the present invention.

[0018] Figure 2 A detailed flowchart of the chip coupling method provided by the present invention.

[0019] Figure 3 The flowchart illustrates the dry coupling process in the chip coupling method provided by this invention.

[0020] Figure 4 This is a flowchart of the wet coupling process in the chip coupling method provided by the present invention.

[0021] Figure 5 This is a schematic diagram of the spiral light-finding process in the chip coupling method provided by the present invention.

[0022] Figure 6 This is a schematic diagram of the chip coupling system provided by the present invention. Detailed Implementation

[0023] The invention will be more readily understood by referring to the following detailed description of preferred embodiments and included examples. Unless otherwise specified, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. In case of conflict, the definitions in this specification shall prevail.

[0024] In embodiments of this disclosure, such as Figures 1-5 As shown, a chip coupling method and system include: The system locates the position of the light-emitting point of the positioning chip and the center position of the picked-up lens. Based on the position of the light-emitting point and the center position, the initial position for optical coupling is calculated. Specifically, the upper camera identifies and locates the position coordinates of the DFB light-emitting area on the silicon photonics chip. The upper camera photographs the DFB area of ​​the silicon photonics chip fixed on the stage to identify its feature points. Simultaneously, the lens is picked up by a suction nozzle and moved into the field of view of the lower camera for photographing, identifying the position coordinates of the lens center and adjusting the lens's TZ angle to match the angle of the DFB chip. Then, based on the position coordinates identified by the two cameras and combined with the mechanical coordinate transformation relationship, the initial point position coordinates (X0, YO, Z0) for initially aligning the optical axis of the lens with the DFB light-emitting point of the silicon photonics chip are calculated.

[0025] After obtaining the initial point coordinates, the lens is moved to the initial position via the suction nozzle control, and then searches for the light signal according to a preset scanning trajectory; specifically, the control system drives the suction nozzle to perform a two-dimensional spiral scan centered on the initial point, such as... Figure 5 As shown, the spiral scan is performed with a large scanning range and a large scanning step size in order to quickly determine the optical signal, i.e., to find the light.

[0026] By using the combined recognition of the upper and lower cameras and integrating spiral trajectory scanning, light signals can be located in a short time, thus laying the foundation for subsequent rapid and accurate optical path alignment.

[0027] After locating the optical signal, the process enters the dry coupling stage, where optimized alignment is performed to determine the initial maximum optical power and the first specification check is conducted. Specifically, by scanning the Tops current value (the relationship between current and optical power), the peak value of the optical power, i.e., the local maximum point, is found to determine the initial maximum power. Then, the first specification check is performed. The specification check can at least determine whether the optical power meets the preset qualified power value after dry coupling. If it does not meet the requirement, the parameters are adjusted until the specification check is met.

[0028] After the first specification check is passed, the moving lens is dipped in adhesive on the calibration surface and enters the wet coupling stage. After the adhesive is applied, the position changes. Therefore, multiple fine coupling scans are performed to find the final maximum optical power and a second specification check, namely the Spec check, is performed. If it passes, the subsequent steps are carried out. If it does not meet the requirements, the parameters are adjusted or the program is stopped. By combining dry and wet coupling, and performing multiple rounds of fine coupling scanning after adhesive application, the coupling position between the chip and the lens can be accurately repositioned. This effectively solves the alignment failure problem caused by changes in the optical path before and after adhesive application, and greatly improves the overall success rate of coupling.

[0029] After the second specification check is passed, the glue is cured to fix the lens, and then a final specification check is performed. If the check passes, the data is saved and the coupling is terminated; if it fails, the process returns or terminates according to the preset strategy.

[0030] At the same time, performing Spec checks after each critical process, such as dry coupling, wet coupling, and curing, ensures the consistency and reliability of coupling quality for each product, making it particularly suitable for large-scale mass production.

[0031] like Figure 5 As shown, in one embodiment, searching for the light signal according to a preset scanning trajectory includes: The nozzle controls the lens to move spirally in the X and Z axis planes according to the first scanning range and the first scanning step size, and monitors the optical power in real time; If the optical power value is greater than the first preset threshold, it is determined that an optical signal has been found, and the spiral scanning is stopped.

[0032] By using spiral scanning, and with a large first scanning range and a large first scanning step size, the optical signal can be found quickly in a short time, reducing the time spent searching for light and effectively improving the progress of subsequent dry and wet coupling.

[0033] For details on spiral scanning, please refer to [link / reference]. Figure 5It uses the initial position of optical coupling as a starting point and follows a gradually expanding equidistant spiral trajectory to find the light signal. Furthermore, the first preset threshold can be a value set manually according to the actual situation.

[0034] In one embodiment, if no optical signal is found within the preset spiral scanning range, the product is controlled to reset its TOPS current value. The TOPS current value refers to the relationship between the current and light of the silicon photonics product; different products have different current values ​​corresponding to the maximum light value. The lens returns to its initial position and performs the spiral light-finding action again. This spiral light-finding process continues until an optical signal is found.

[0035] In one embodiment, the dry coupling stage determines the initial maximum optical power through peak search. Specifically, the peak search includes: The first round of scanning is performed in the Z-axis direction and the first horizontal direction; The first scan is performed in a second direction perpendicular to the first horizontal direction; A second scan is performed in the Z-axis direction and the first horizontal direction, and a second scan is performed in a second direction perpendicular to the first horizontal direction, wherein the scan step size and scan range of the second scan are smaller than those of the first scan.

[0036] like Figure 3 As shown, the dry coupling stage adopts a step-by-step iterative scanning method: first, a coarse scan is performed in the Z-axis and Y-axis directions, then a coarse scan is performed in the X-axis direction, and finally a fine scan is performed in the Z-axis and Y-axis directions.

[0037] The coarse coupling method has a larger scanning range and a coarser scanning step size, employing an efficiency-first search trajectory optimization algorithm to quickly locate the signal and climb to the main peak of the power response surface. The fine coupling method, on the other hand, uses a high-precision, high-resolution scanning mode to accurately plot and lock the precise peak of the power response surface, compensating for any minute offsets.

[0038] In one embodiment, the wet coupling stage includes: The first round of scanning is performed in the Z-axis direction and the first horizontal direction; The first scan is performed in a second direction perpendicular to the first horizontal direction; A second round of scanning is performed in the Z-axis direction and the first horizontal direction, and a second round of scanning is performed in a second direction perpendicular to the first horizontal direction, wherein the scanning step size and scanning range of the second round of scanning are smaller than those of the first round of scanning; The scanning range and scanning step size in the wet coupling stage are smaller than those in the dry coupling stage.

[0039] like Figure 4As shown, fine coupling is first performed in the Z and Y directions, then in the X direction, followed by fine coupling in the Z and Y directions again, then in the X direction, and finally in the Z and Y directions again. Because the optical path shifts slightly after the adhesive is applied, the power peak position found in the dry coupling stage may no longer be optimal in the wet coupling environment. Therefore, multiple fine coupling operations are performed in the wet coupling process to re-find the optimal coupling point under the current colloidal medium. Through fine scanning, the global maximum optical power under wet coupling conditions is approximated and locked, ensuring that the final coupling efficiency reaches the theoretical optimum.

[0040] In some embodiments, if the optical power of the optical signal is less than the corresponding preset pass value during the first specification check, the second specification check, and the final specification check, it is determined to be unsuccessful, and the process is returned or terminated according to a preset strategy.

[0041] Specifically, if the first specification check fails, the strategy is to return to the spiral coarse light-finding step, and optionally slightly expand the spiral scanning range or adjust the optical power detection threshold.

[0042] If the second specification check fails, the strategy is to first return to the wet coupling fine-tuning step and rescan with a finer step size. If it still fails, the process is terminated, and a dispensing or optical anomaly alarm is issued.

[0043] If the final specification check fails, the strategy is to terminate the process directly and issue an alarm, indicating that the curing process may cause deviations, requiring equipment maintenance or process review.

[0044] Quality inspections are set up at each critical process node. If the light power fails to meet the preset qualification standard for that stage, it is immediately judged as unqualified. This prevents unqualified semi-finished products from flowing into subsequent processes and avoids material waste and equipment time occupation caused by irreversible operations such as dispensing and curing.

[0045] like Figure 6 As shown, an embodiment of a chip coupling system is also provided, employing the above-described coupling method, including: The vision module includes an upper camera for identifying the chip position and a lower camera for identifying the lens position. The motion module includes a motion platform in the X, Y, Z and TZ directions and a suction nozzle for picking up lenses. Specifically, the suction nozzle is set in the module of the Z-axis motion platform, through which lenses can be picked up.

[0046] Optical power detection module, used to detect optical power signal in real time during coupling; The dispensing module includes a precision dispensing valve for applying adhesive to the lens on the surface of the dispensing needle; it also includes a dispensing needle, which, in conjunction with the precision dispensing valve, can apply adhesive to corresponding positions on the lens surface.

[0047] The curing module includes multiple UV light sources, which are used to cure the colloid. The control module is electrically connected to the vision module, motion module, light control and detection module, dispensing module, and curing module. The control module, typically an industrial computer, is electrically connected to the other modules and can process visual information, control the motion platform, acquire optical power data, execute coupled logic algorithms, and manage the entire workflow.

[0048] Finally, it should be noted that the above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A chip coupling method, characterized in that, include: The position of the light-emitting point of the positioning chip is determined, the center position of the lens being picked up is determined, and the initial position for optical coupling is calculated based on the position of the light-emitting point and the center position. After the lens is moved to the initial position, it searches for a light signal according to a preset scanning trajectory. After the optical signal is found, the process enters the dry coupling stage, where optimized alignment is performed to determine the initial maximum optical power, and the first specification check is conducted. After the first specification check is passed, adhesive is applied at the alignment position and the wet coupling stage is entered. Fine coupling scanning is performed to find the final maximum optical power, and a second specification check is performed. After the second specification check is passed, the glue is cured to fix the lens, and then the final specification check is performed. If the check is passed, the data is saved and the coupling is terminated. If the request fails, the system will return or terminate according to the preset strategy. The dry coupling stage determines the initial maximum optical power through peak search, which includes: performing a first round of scanning in the Z-axis direction and a first horizontal direction; performing a first round of scanning in a second direction perpendicular to the first horizontal direction; performing a second round of scanning in the Z-axis direction and the first horizontal direction; and performing a second round of scanning in the second direction perpendicular to the first horizontal direction, wherein the scanning step size and scanning range of the second round of scanning are smaller than those of the first round of scanning. The wet coupling stage includes: performing a first round of scanning in the Z-axis direction and a first transverse direction; performing a first round of scanning in a second direction perpendicular to the first transverse direction; performing a second round of scanning in the Z-axis direction and the first transverse direction; and performing a second round of scanning in the second direction perpendicular to the first transverse direction, wherein the scanning step size and scanning range of the second round of scanning are smaller than those of the first round of scanning; wherein the scanning range and scanning step size of the wet coupling stage are smaller than those of the dry coupling stage.

2. The chip coupling method according to claim 1, characterized in that, The position of the light-emitting point of the positioning chip is used to locate the center position of the lens being picked up. The initial position for optical coupling is calculated based on the position of the light-emitting point and the center position, including: The camera identifies and locates the position coordinates of the light-emitting area on the chip; The lower camera identifies and locates the center coordinates of the lens; Based on the position coordinates of the light-emitting area and the center position coordinates of the lens, and combined with the mechanical coordinate system transformation relationship, the initial position for optical coupling between the chip and the lens is calculated.

3. The chip coupling method according to claim 1, characterized in that, The process of searching for the light signal according to a preset scanning trajectory includes: The suction nozzle controls the lens to move spirally in the X and Z axis planes according to the first scanning range and the first scanning step size, and monitors the optical power in real time; If the optical power value is greater than the first preset threshold, it is determined that an optical signal has been found, and the spiral scanning is stopped.

4. The chip coupling method according to claim 3, characterized in that, If no light signal is found within the preset spiral scanning range, the product TOPS current value is reset, the lens is reset to the initial position, and the spiral light-finding action is performed again.

5. The chip coupling method according to claim 1, characterized in that, During the first specification check, the second specification check, and the final specification check, if the optical power of the optical signal is less than the corresponding preset qualified value, it is determined to be unqualified, and the process is returned or terminated according to the preset strategy.

6. A chip coupling system, characterized in that, The chip coupling method according to any one of claims 1-5 includes: A vision module, comprising an upper camera for identifying chip positions and a lower camera for identifying lens positions; The motion module includes a motion platform in four axes (X, Y, Z, TZ) and a nozzle for picking up lenses; An optical power detection module is used to detect optical power signals in real time during the coupling process; The dispensing module includes a precision dispensing valve, which is used to apply adhesive to the lens on the surface of the dispensing needle. A curing module, comprising multiple UV light sources for curing the colloid; The control module is electrically connected to the vision module, motion module, light control and detection module, dispensing module, and curing module.

7. The chip coupling system according to claim 6, characterized in that, The suction nozzle is fixed on a motion platform in the Z-axis direction.

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