A vibration reliability design method and system for a component interconnection process

Abstract

The application relates to the technical field of electronic component assembly process reliability, and particularly discloses a vibration reliability design method and system for a component interconnection process. The application calculates actual vibration tension by obtaining component mass parameters and vibration acceleration, determining a tension coefficient according to a layout and a substrate fixing structure mode, and determining actual welding tensile strength based on standard unit welding fracture tension and an original cross-sectional area, and then calculates maximum stress of an interconnection structure by combining a stress coefficient and the original cross-sectional area of a welding spot, and judges whether the current interconnection process meets the reliability requirement by comparing the vibration tension and the maximum stress. When the requirement is not met, the area of the welding spot is adjusted and / or a glue is applied for reinforcement, and operation requirements are determined according to a glue adhesion strength model, so that the problem that different weight components lack a fast judgment and matching interconnection process method in the prior art is solved, and fast evaluation and targeted optimization of the vibration reliability design of the component interconnection process are realized.

Description

Technical Field

[0001] This invention relates to the field of electronic component assembly process reliability technology, and in particular to a vibration reliability design method and system for component interconnection processes. Background Technology

[0002] As the reliability requirements of electronic systems become increasingly stringent, process reliability is becoming ever more crucial in micro-assembly processes. The operating conditions of today's electronic systems are becoming increasingly complex, requiring components to interconnect with substrates and withstand vibration tests of varying magnitudes to ensure the reliability of component assembly. With the advancement of domestic component production, components of various functions and weights are emerging. For these components, how to quickly and efficiently identify and adopt the correct and matched interconnection process to ensure process reliability is a pressing issue that the industry urgently needs to address. Under different vibration conditions, the process reliability of interconnecting components of varying weights is a crucial foundation for ensuring the normal service and operation of circuits. Failure of component interconnection nodes will directly affect the electrical performance of the circuit and may even lead to catastrophic failure of the electronic system.

[0003] Therefore, there is an urgent need to provide a technical solution to address the above problems. Summary of the Invention

[0004] To address the aforementioned technical problems, this invention provides a vibration reliability design method and system for component interconnection processes.

[0005] In a first aspect, the present invention provides a vibration reliability design method for component interconnection processes, the technical solution of which is as follows: The mass parameters of the components and the vibration acceleration that the components need to withstand are obtained. Based on the layout of the components and the substrate fixing structure, the tensile coefficient is determined, and the vibration tensile force that the components bear under actual vibration conditions is calculated. Obtain the actual welding fracture tensile force of the standard unit, combine it with the original cross-sectional area of ​​the weld point of the standard unit, calculate the actual welding fracture tensile strength, and confirm the actual welding fracture tensile strength as the actual welding tensile strength of the standard unit. The stress coefficient is determined based on the layout of the components and the substrate fixing structure. The maximum stress that the interconnect structure of the components can withstand is calculated by combining the actual welding tensile strength of the standard unit and the original cross-sectional area of ​​the solder joint determined by the substrate pads corresponding to the components. The vibration tensile force is compared with the maximum stress. If the vibration tensile force is less than the maximum stress, the current interconnect process design is adopted. If the vibration tensile force is not less than the maximum stress, the weld area is adjusted and / or adhesive reinforcement is applied, and the adhesive bonding operation requirements are determined according to the adhesive bonding strength model to obtain an interconnection process design that meets the vibration reliability requirements; wherein, the adhesive bonding strength model is: a mathematical mapping relationship between the adhesive shear strength and the adhesive bonding area and adhesive type established through experimentation.

[0006] The beneficial effects of the vibration reliability design method for component interconnection processes of the present invention are as follows: The method of this invention obtains the component mass parameters and vibration acceleration, and determines the tensile coefficient based on the layout and substrate fixing structure to calculate the actual vibration tensile force. Simultaneously, it determines the actual welding tensile strength based on the standard unit welding fracture tensile force and the original cross-sectional area. Then, it calculates the maximum stress of the interconnect structure by combining the stress coefficient and the original cross-sectional area of ​​the solder joint. By comparing the vibration tensile force with the maximum stress, it determines whether the current interconnect process meets the reliability requirements. If not, it adjusts the solder joint area and / or applies colloid reinforcement, and determines the operation requirements based on the colloid bonding strength model. This solves the problem in the prior art of lacking a rapid judgment and matching interconnect process method for components of different weights, and realizes rapid evaluation and targeted optimization of vibration reliability design for component interconnect processes.

[0007] Based on the above scheme, the vibration reliability design method of the component interconnection process of the present invention can be further improved as follows.

[0008] In one optional approach, the steps of obtaining the mass parameters of the component and the vibration acceleration that the component needs to withstand, determining the tensile force coefficient based on the component's layout and substrate fixing structure, and calculating the vibration tensile force that the component will bear under actual vibration conditions include: The mass parameters of the component are obtained, and the required vibration acceleration is determined according to the application scenario of the component. The tensile force coefficient is determined in combination with the layout of the component and the substrate fixing structure mode. The vibration tension borne by the component under the actual vibration condition is calculated by multiplying the mass parameter, the vibration acceleration, and the tensile coefficient.

[0009] The advantages of adopting the above-mentioned optional method are as follows: by further multiplying the component mass parameters, vibration acceleration and tensile coefficient, the vibration tensile force borne by the component under actual vibration conditions can be accurately calculated, making the vibration tensile force calculation process clearer and more operable, and improving the accuracy of vibration tensile force assessment.

[0010] In one alternative approach, the steps of obtaining the actual weld fracture tensile force of the standard unit, calculating the actual weld fracture tensile strength in conjunction with the original cross-sectional area of ​​the weld joint of the standard unit, and confirming the actual weld fracture tensile strength as the actual weld tensile strength of the standard unit include: The actual welding fracture tensile force of the standard unit was obtained by conducting a welding fracture test on the standard unit. The actual tensile strength of the weld fracture is obtained based on the ratio of the actual weld fracture tensile force of the standard unit to the original cross-sectional area of ​​the weld joint of the standard unit, and the actual tensile strength of the weld fracture is used as the actual weld tensile strength of the standard unit.

[0011] The advantages of adopting the above-mentioned optional method are as follows: by further obtaining the actual welding fracture tensile force through welding fracture test on the standard unit, and combining it with the original cross-sectional area of ​​the weld point of the standard unit to calculate the actual tensile strength of the welding fracture, the actual welding tensile strength of the standard unit is obtained more closely to the real working condition, and the reliability of the tensile strength parameter is enhanced.

[0012] In one optional approach, the step of determining the stress coefficient based on the component layout and substrate fixing structure pattern, and calculating the maximum stress that the interconnect structure of the component can withstand by combining the actual welding tensile strength of the standard cell and the original cross-sectional area of ​​the solder joint determined by the substrate pads corresponding to the component, includes: Based on the layout and the substrate fixing structure, the stress coefficient is analyzed and determined, and based on the size of the substrate pads interconnecting the components, the original cross-sectional area of ​​all solder joints in the interconnection structure of the components is determined. The maximum stress that the interconnect structure of the component can withstand is calculated by multiplying the stress coefficient, the actual welding tensile strength of the standard unit, and the original cross-sectional area of ​​all solder joints.

[0013] The advantages of using the above-mentioned optional method are as follows: by further multiplying the stress coefficient, the actual welding tensile strength of the standard unit, and the original cross-sectional area of ​​all solder joints, the maximum stress that the interconnection structure of the components can withstand is calculated, making the maximum stress calculation process clearer and more complete, and improving the accuracy of stress assessment.

[0014] In one alternative approach, the vibration tensile force is compared with the maximum stress; if the vibration tensile force is less than the maximum stress, then the steps of the current interconnect process design are employed, including: The vibration tensile force is compared with the maximum stress. If the vibration tensile force is less than the maximum stress, the current interconnect process design, which consists of the pad size and soldering parameters of the component, is confirmed to meet the vibration reliability requirements, and the current interconnect process design is adopted.

[0015] The advantages of adopting the above-mentioned optional method are as follows: by further comparing the vibration tensile force value with the maximum stress value, it is confirmed that the current interconnect process design meets the vibration reliability requirements when the vibration tensile force is less than the maximum stress, making the reliability judgment criteria clearer and enhancing the standardization of process design adoption.

[0016] In one alternative approach, if the vibration tensile force is not less than the maximum stress, the steps include adjusting the solder joint area and / or applying adhesive reinforcement, and determining the adhesive bonding operation requirements based on the adhesive bonding strength model to obtain an interconnect process design that meets vibration reliability requirements, including: If the vibration tensile force is determined to be not less than the maximum stress, the solder joint area is increased to increase the maximum stress to exceed the vibration tensile force, and / or, an adhesive is applied between the soldered component and the substrate for reinforcement, and the required adhesive bonding area and adhesive type are calculated using an adhesive bonding strength model to form adhesive bonding operation requirements that include adhesive bonding area and adhesive type. Finally, the interconnect process design that meets the vibration reliability requirements is obtained by combining the adjusted solder joint area and / or the adhesive bonding operation requirements.

[0017] The advantages of adopting the above-mentioned optional methods are as follows: when it is determined that the vibration tensile force is not less than the maximum stress, by increasing the weld area and / or applying adhesive reinforcement, and determining the adhesive bonding area and adhesive type based on the adhesive bonding strength model, the process adjustment path when the reliability requirements are not met is more specific, and the targeting of process optimization is improved.

[0018] In one alternative approach, the step of determining the tensile force coefficient by combining the layout of the components and the substrate fixing structure pattern includes: Based on the layout of the components on the substrate in the layout and the distribution of the fixed support points of the substrate in the substrate fixing structure mode, the stress state of the components under vibration conditions is evaluated, and a value is selected from a preset coefficient range as the tensile force coefficient.

[0019] The advantages of adopting the above optional method are: further assessing the stress state based on the layout of the components on the substrate and the distribution of the substrate fixing points, selecting the tensile coefficient from the preset coefficient range, making the determination of the tensile coefficient more in line with the actual vibration conditions, and improving the rationality of the selection of the tensile coefficient.

[0020] In one alternative approach, the step of analyzing and determining the stress coefficient based on the layout and the substrate fixing structure includes: Based on the solder joint arrangement of components in the layout and the fixed support structure of the substrate in the substrate fixing structure mode, the coupling effect of the solder joint arrangement and the fixed support structure on stress distribution is analyzed, and a value is selected from a preset coefficient range as the stress coefficient based on the coupling effect.

[0021] The beneficial effects of adopting the above optional method are as follows: based on the coupling effect of the weld point arrangement and the fixed support structure on the stress distribution, the stress coefficient is selected from the preset coefficient range, so that the determination of the stress coefficient fully considers the interaction between the layout and the structure, and enhances the scientific nature of the stress coefficient selection.

[0022] In one alternative approach, the step of calculating the required adhesive bonding area and adhesive type using an adhesive bond strength model includes: Construct the colloid bonding strength model, and establish a mapping relationship between colloid shear strength, colloid bonding area and colloid type in the colloid bonding strength model. Based on the mapping relationship, calculate the colloid bonding area and colloid type by back-calculating the bonding force required to supplement the difference between the maximum stress and the vibration tensile force.

[0023] The advantages of adopting the above-mentioned optional methods are as follows: further establishing the mapping relationship between the colloidal shear strength, colloidal bonding area and colloidal type in the colloidal bonding strength model, and back-calculating the colloidal bonding area and colloidal type based on the adhesive force requirement, making the determination of colloidal reinforcement parameters more quantitative and accurate, and improving the design accuracy of colloidal bonding schemes.

[0024] Secondly, the present invention provides a vibration reliability design system for component interconnection processes, the technical solution of which is as follows: The acquisition module is used to acquire the mass parameters of the component and the vibration acceleration that the component needs to withstand, and to determine the tensile coefficient based on the layout of the component and the substrate fixing structure mode, and to calculate the vibration tensile force that the component bears under actual vibration conditions. The processing module is used to obtain the actual welding fracture tensile force of the standard unit, combine it with the original cross-sectional area of ​​the weld point of the standard unit, calculate the actual tensile strength of the welding fracture, and confirm the actual tensile strength of the welding fracture as the actual welding tensile strength of the standard unit. The calculation module is used to determine the stress coefficient based on the layout of the components and the substrate fixing structure mode, and calculate the maximum stress that the interconnect structure of the components can withstand by combining the actual welding tensile strength of the standard unit and the original cross-sectional area of ​​the solder joint determined by the substrate pads corresponding to the components. A comparison module is used to compare the vibration tension with the maximum stress. If the vibration tension is less than the maximum stress, the current interconnect process design is adopted. An adjustment module is used to adjust the weld area and / or apply adhesive reinforcement if the vibration tensile force is not less than the maximum stress, and to determine the adhesive bonding operation requirements based on the adhesive bonding strength model, thereby obtaining an interconnection process design that meets the vibration reliability requirements; wherein, the adhesive bonding strength model is a mathematical mapping relationship between the adhesive shear strength and the adhesive bonding area and adhesive type established through experimentation.

[0025] The beneficial effects of the vibration reliability design system for component interconnection technology of the present invention are as follows: The system of this invention obtains component mass parameters and vibration acceleration, and determines the tensile coefficient based on the layout and substrate fixing structure to calculate the actual vibration tensile force. Simultaneously, it determines the actual welding tensile strength based on the standard unit welding fracture tensile force and the original cross-sectional area. Then, it calculates the maximum stress of the interconnect structure by combining the stress coefficient and the original cross-sectional area of ​​the solder joint. By comparing the vibration tensile force with the maximum stress, it determines whether the current interconnect process meets the reliability requirements. If not, it adjusts the solder joint area and / or applies colloid reinforcement, and determines the operation requirements based on the colloid bonding strength model. This solves the problem in the prior art of lacking a rapid judgment and matching interconnect process method for components of different weights, and realizes rapid evaluation and targeted optimization of vibration reliability design for component interconnect processes.

[0026] The above description is merely an overview of the technical solution of the present invention. In order to better understand the technical means of the present invention and to implement it in accordance with the contents of the specification, and in order to make the above and other objects, features and advantages of the present invention more apparent and understandable, specific embodiments of the present invention are described below. Attached Figure Description

[0027] The accompanying drawings are for illustrative purposes only and are not intended to limit the invention. Furthermore, the same reference numerals denote the same parts throughout the drawings. In the drawings: Figure 1 This is a schematic flowchart illustrating an embodiment of a vibration reliability design method for component interconnection technology according to the present invention. Figure 2 A schematic diagram for calculating the actual vibration tensile force borne by a component using its mass and vibration acceleration; Figure 3This is a schematic diagram for calculating the actual tensile strength at weld fracture based on the actual weld fracture tensile force of a standard unit. Figure 4 A schematic diagram for confirming the actual welding tensile strength of standard units and calculating the maximum stress that components can actually withstand during welding; Figure 5 This is a schematic diagram comparing the actual vibration and tensile forces that components can withstand with the maximum stress that components can actually withstand during welding. Figure 6 A schematic diagram illustrating the corresponding process design of components to ensure that the welding devices can withstand vibration intensity; Figure 7 This diagram illustrates the process design for components when the welded parts cannot withstand vibration intensity. It shows how to adjust the weld area, apply adhesive reinforcement, and form adhesive bonding operation requirements based on the adhesive bonding strength model. Figure 8 A schematic diagram of the overall implementation process of the vibration reliability design method for component interconnection technology; Figure 9 This is a schematic diagram of an embodiment of a vibration reliability design system for component interconnection technology according to the present invention. Detailed Implementation

[0028] Exemplary embodiments of the invention will now be described in more detail with reference to the accompanying drawings. While exemplary embodiments of the invention are shown in the drawings, it should be understood that the invention can be implemented in various forms and should not be limited to the embodiments set forth herein.

[0029] Figure 1 This diagram illustrates a flowchart of an embodiment of a vibration reliability design method for component interconnection processes provided by the present invention. This vibration reliability design method for component interconnection processes can be executed by electronic devices such as terminal devices or servers. The terminal device can be any fixed or mobile terminal, such as user equipment (UE), mobile device, user terminal, terminal, cellular phone, cordless phone, personal digital assistant (PDA), handheld device, computing device, vehicle-mounted device, or wearable device. The server can be a single server or a server cluster consisting of multiple servers. Any electronic device can implement the vibration reliability design method for component interconnection processes by having its processor call computer-readable instructions stored in its memory. Figure 1 As shown, it includes the following steps: S1. Obtain the mass parameters of the component and the vibration acceleration that the component needs to withstand, and determine the tensile force coefficient based on the layout of the component and the substrate fixing structure mode, and calculate the vibration tensile force that the component bears under actual vibration conditions.

[0030] Here, "component" refers to an independent functional unit that is electrically connected and mechanically fixed to a substrate in an electronic system; for example, a 5g ceramic-packaged integrated circuit chip interconnected with a printed circuit board via bottom pads. "Mass parameter" refers to a physical quantity characterizing the weight of a component, expressed in g or kg; for example, the aforementioned integrated circuit chip has a mass parameter of 5g. "Vibration acceleration" refers to the intensity of vibration load that a component must withstand in its application environment, expressed as a multiple of the gravitational acceleration G; for example, the aforementioned integrated circuit chip must withstand a vibration acceleration of 10G in airborne electronic equipment A.

[0031] The layout refers to the design and planning of the arrangement and space occupation of components on the substrate plane; for example, the aforementioned integrated circuit chip is placed in the central area of ​​the substrate, with symmetrical heat dissipation gaps around it, and the long side of the chip is aligned with the airflow direction. The substrate fixing structure refers to the method and distribution of fixing points for mechanically fixing the substrate to the chassis or support frame; for example, the aforementioned substrate uses a four-corner screw fixing structure, with bolts securing it to the aluminum alloy frame at the four corners, and no auxiliary support in the central area. The tensile force coefficient is an adjustment factor used to correct the vibration tensile force calculation results, obtained through a comprehensive evaluation of the layout and substrate fixing structure. Its value is selected within a preset range based on the actual structural conditions; for example, since the aforementioned integrated circuit chip is located in the center of the substrate and the substrate is fixed at the four corners, the tensile force coefficient μ is selected as 1.2 after evaluating the stress state.

[0032] The actual vibration condition refers to the working state of a component under both mechanical vibration shock and temperature cyclic load in a real-world operating environment. For example, the aforementioned integrated circuit chip operates in airborne electronic equipment A, continuously subjected to vertical sinusoidal vibration with a frequency of 50Hz and an amplitude of 2mm, while simultaneously experiencing temperature fluctuations caused by the chip's self-heating. Vibration tensile force refers to the tensile load borne by the component's solder joints under vibration conditions, and its value is equal to the product of the mass parameter, vibration acceleration, and tensile force coefficient. For example, the calculated vibration tensile force F1 of the aforementioned integrated circuit chip is 5g × 10G × 1.2, or 60g·G.

[0033] S2. Obtain the actual welding fracture tensile force of the standard unit, combine it with the original cross-sectional area of ​​the weld point of the standard unit, calculate the actual tensile strength of the welding fracture, and confirm the actual tensile strength of the welding fracture as the actual welding tensile strength of the standard unit.

[0034] The actual weld fracture tensile force of a standard cell refers to the maximum tensile force that causes complete separation of the solder joint, measured through a destructive weld fracture test on the standard cell sample. For example, the measured fracture tensile force F2 of a BGA packaged solder ball standard cell is 150N. The original cross-sectional area of ​​the solder joint of a standard cell refers to the cross-sectional area of ​​a single solder joint after welding, before mechanical testing; for example, the original cross-sectional area of ​​the solder joint of the aforementioned BGA solder ball standard cell. 0.5mm 2 .

[0035] The actual tensile strength at weld fracture refers to the ratio of the actual tensile force at weld fracture of the standard unit to the original cross-sectional area of ​​the weld joint, reflecting the tensile strength per unit area of ​​the weld joint material. For example, the actual tensile strength T1 at weld fracture of the aforementioned standard unit is 150 N ÷ 0.5 mm. 2 That is, 300 MPa. The actual weld tensile strength of the standard unit refers to the value of the actual tensile strength at weld fracture, which is directly used as the strength characterization of the weld material under tension, for subsequent maximum stress calculations; for example, the aforementioned actual tensile strength at weld fracture of 300 MPa is identified as the actual weld tensile strength R of the standard unit. m .

[0036] S3. Determine the stress coefficient based on the layout of the components and the substrate fixing structure pattern. Combine the actual welding tensile strength of the standard unit and the original cross-sectional area of ​​the solder joint determined by the substrate pads corresponding to the components to calculate the maximum stress that the interconnect structure of the components can withstand.

[0037] Among them, the stress coefficient refers to the adjustment factor used to correct the maximum stress calculation result based on the evaluation of the component layout and substrate fixing structure mode, and the value is selected within a preset range; for example, in view of the coupling effect between the solder joint arrangement of the aforementioned integrated circuit chip and the fixed support structure at the four corners of the substrate, after evaluating the stress distribution, the stress coefficient θ is selected as 0.95.

[0038] Here, substrate pads refer to metal patterns arranged on the surface of a substrate for soldering connections with component terminals or solder balls; for example, the substrate pads corresponding to the aforementioned integrated circuit chip are circular copper pads with a diameter of 0.3 mm and a nickel-gold plating layer on the surface. The original cross-sectional area of ​​a solder joint refers to the cross-sectional area of ​​a single solder joint before it is destroyed after the component soldering is completed, and is determined by the size of the substrate pads; for example, the original cross-sectional area of ​​each solder joint of the aforementioned integrated circuit chip. It is 0.25mm 2 The entire chip has a total of 20 solder joints.

[0039] Interconnect structure refers to the electrical and mechanical connection system formed by components, substrate pads, and solder joints between them. For example, the aforementioned integrated circuit chip is soldered to the substrate pads via 20 solder joints, and the resulting interconnect structure simultaneously performs the functions of electrical signal transmission and vibration load transfer. Maximum stress refers to the maximum tensile load that the interconnect structure can withstand before soldering failure. Its value is equal to the product of the stress coefficient, the actual tensile strength of the standard unit, and the original cross-sectional area of ​​all solder joints. For example, the maximum stress of the aforementioned integrated circuit chip... The calculated value is 0.95 × 300 MPa × 20 × 0.25 mm. 2 That is, 1425 N·mm 2 .

[0040] S4. Compare the vibration tension with the maximum stress. If the vibration tension is less than the maximum stress, then the current interconnect process design is adopted.

[0041] The current interconnect process design refers to the existing design based on pad size and soldering parameters, where the layout and process scheme have been completed and vibration reliability needs to be verified. For example, the current interconnect process design of the aforementioned integrated circuit chip is 0.3mm solder joint diameter, 0.3mm solder pad diameter, using lead-free solder paste reflow soldering process, and the number of solder joints is 20.

[0042] S5. If the vibration tensile force is not less than the maximum stress, adjust the weld area and / or apply adhesive reinforcement, and determine the adhesive bonding operation requirements based on the adhesive bonding strength model to obtain an interconnection process design that meets the vibration reliability requirements.

[0043] The colloidal bonding strength model is a mathematical mapping relationship established through experiments, relating colloidal shear strength to colloidal bonding area and colloidal type. The model includes various colloidal types and their corresponding shear strength parameters. When the vibration tensile force is not less than the maximum stress, the difference between the vibration tensile force and the maximum stress is used as the required bonding force. Based on this required bonding force, a colloidal type that meets the shear strength requirement is selected from the model. The required colloidal bonding area is then calculated based on the ratio of the required bonding force to the shear strength of the selected colloidal type.

[0044] The colloidal adhesive strength model is constructed as follows: For various candidate colloidal types, standard colloidal adhesive samples are prepared, and the shear strength values ​​corresponding to each colloidal type are determined by tensile shear tests. A quantitative correspondence between colloidal type, shear strength, and bonding area is established. For example, in the colloidal adhesive strength model, the shear strength is 15 MPa for epoxy resin, 2 MPa for silicone, and 8 MPa for acrylic. Different colloidal types correspond to different shear strengths, and the bonding area is proportional to the total adhesive force.

[0045] The steps for determining the type of colloid based on the colloid bonding strength model are as follows: determine the required additional bonding force value based on the difference between the maximum stress and the vibration tensile force, match the bonding force requirement value with the shear strength of each colloid type in the colloid bonding strength model, and select the colloid type whose shear strength meets the bonding force requirement value as the target colloid type.

[0046] The steps for calculating the adhesive bonding area based on the adhesive bonding strength model are as follows: After selecting the target adhesive type, calculate the required adhesive bonding area based on the ratio of the required adhesive force to the shear strength of the target adhesive type. The calculation formula is: Adhesive bonding area = required adhesive force / shear strength of the target adhesive type.

[0047] The requirements for adhesive bonding operations refer to the specific construction parameters for the adhesive bonding area and adhesive type, calculated and determined using an adhesive bonding strength model. For example, when the vibration tensile force exceeds the maximum stress and the difference is 50N, an epoxy resin adhesive with a shear strength of 15MPa is selected according to the adhesive bonding strength model, and the calculated adhesive bonding area is 50N ÷ 15MPa, which is 3.33mm. 2 The requirements for forming an adhesive bonding process are as follows: use epoxy resin adhesive, apply it evenly to the bottom of the chip, and ensure the bonding area is not less than 3.33 mm. 2 .

[0048] The vibration reliability requirement refers to the performance standard that the interconnect process design maintains intact electrical connections, no solder joint cracks, and no adhesive debonding after undergoing a specified vibration level test. For example, the aforementioned integrated circuit chip must meet the vibration reliability requirement of no solder joint breakage and no adhesive peeling after continuous vibration at 10G acceleration for 48 hours. The interconnect process design refers to the final determined complete component-substrate connection process scheme, including soldering parameters and adhesive bonding parameters. For example, the final interconnect process design of the aforementioned integrated circuit chip is as follows: lead-free solder paste reflow soldering is used, the solder joint diameter and pad diameter are both 0.3mm, the number of solder joints is maintained at 20, and epoxy resin adhesive is used for reinforcement, with an adhesive bonding area of ​​not less than 3.33mm². 2 .

[0049] The technical solution of this embodiment obtains the component mass parameters and vibration acceleration, and determines the tensile force coefficient based on the layout and substrate fixing structure to calculate the actual vibration tensile force. At the same time, it determines the actual welding tensile strength based on the standard unit welding fracture tensile force and the original cross-sectional area. Then, it calculates the maximum stress of the interconnect structure by combining the stress coefficient and the original cross-sectional area of ​​the solder joint. By comparing the vibration tensile force with the maximum stress, it determines whether the current interconnect process meets the reliability requirements. If it does not meet the requirements, it adjusts the solder joint area and / or applies colloid reinforcement and determines the operation requirements based on the colloid bonding strength model. This solves the problem in the prior art of lacking a rapid judgment and matching interconnect process method for components of different weights, and realizes rapid evaluation and targeted optimization of vibration reliability design of component interconnect process.

[0050] In one alternative approach, S1 specifically includes: The mass parameters of the component are obtained, and the required vibration acceleration is determined based on the application scenario of the component. The tensile force coefficient is determined by combining the layout of the component and the substrate fixing structure mode.

[0051] The application scenario refers to the usage environment and functional mission of the components in the complete product, including mechanical environmental conditions and electrical working conditions; for example, the application scenario of the integrated circuit chip in the aforementioned airborne electronic device A is the signal processing board of aircraft B, which needs to withstand engine vibration and alternating day and night temperature differences.

[0052] The vibration tension borne by the component under the actual vibration condition is calculated by multiplying the mass parameter, the vibration acceleration, and the tensile coefficient.

[0053] Among the above-mentioned optional methods, by further multiplying the component mass parameters, vibration acceleration and tensile coefficient, the vibration tensile force borne by the component under actual vibration conditions can be accurately calculated, making the vibration tensile force calculation process clearer and more operable, and improving the accuracy of vibration tensile force assessment.

[0054] In one alternative approach, S2 specifically includes: The actual welding fracture tensile force of the standard unit was obtained by conducting a welding fracture test on the standard unit.

[0055] The solder fracture test refers to the process of applying a controllable tensile load to a standard unit sample until the solder joint breaks in order to obtain the solder fracture tensile force. For example, when performing the solder fracture test on the aforementioned BGA solder ball standard unit, one end of the substrate is fixed, the fixture holds the chip and pulls it upward at a uniform speed, and the tensile force value at the moment when the solder ball completely breaks is recorded as 150N.

[0056] The actual tensile strength of the weld fracture is obtained based on the ratio of the actual tensile strength of the weld fracture to the original cross-sectional area of ​​the weld joint of the standard unit, and the actual tensile strength of the weld fracture is used as the actual tensile strength of the weld fracture of the standard unit.

[0057] In the above-mentioned optional methods, the actual welding fracture tensile force is obtained by conducting welding fracture tests on the standard unit, and the actual welding fracture tensile strength is calculated by combining the original cross-sectional area of ​​the weld point of the standard unit. This makes the acquisition of the actual welding tensile strength of the standard unit closer to the real working condition and enhances the reliability of the tensile strength parameter.

[0058] In one alternative approach, S3 specifically includes: Based on the layout and the substrate fixing structure, the stress coefficient is analyzed and determined, and based on the size of the substrate pads interconnecting the components, the original cross-sectional area of ​​all solder joints in the interconnection structure of the components is determined.

[0059] The substrate pad size refers to the specific geometric parameters of the metal pads on the substrate used for soldering connections, including diameter or length and width. For example, the substrate pad size corresponding to the aforementioned integrated circuit chip is circular with a diameter of 0.3 mm and a pad spacing of 0.5 mm. The original cross-sectional area refers to the projected area of ​​the effective load-bearing cross-section of the solder joint in the horizontal direction before destructive testing. For example, the original cross-sectional area of ​​a single solder joint in the aforementioned integrated circuit chip is π × (0.3 mm). 2 ÷4, which equals 0.071mm 2 .

[0060] The maximum stress that the interconnect structure of the component can withstand is calculated by multiplying the stress coefficient, the actual welding tensile strength of the standard unit, and the original cross-sectional area of ​​all solder joints.

[0061] In the above-mentioned optional methods, the maximum stress that the component interconnection structure can withstand is further calculated by multiplying the stress coefficient, the actual welding tensile strength of the standard unit, and the original cross-sectional area of ​​all solder joints. This makes the maximum stress calculation process clearer and more complete, and improves the accuracy of stress assessment.

[0062] In one alternative approach, S4 specifically includes: The vibration tensile force is compared with the maximum stress. If the vibration tensile force is less than the maximum stress, the current interconnect process design, which consists of the pad size and soldering parameters of the component, is confirmed to meet the vibration reliability requirements, and the current interconnect process design is adopted.

[0063] In the above-mentioned optional methods, by further comparing the vibration tensile force value with the maximum stress value, and determining that the vibration tensile force is less than the maximum stress, the current interconnect process design is confirmed to meet the vibration reliability requirements, making the reliability judgment criteria clearer and enhancing the standardization of process design adoption.

[0064] In one alternative approach, S5 specifically includes: If the vibration tensile force is determined to be not less than the maximum stress, the solder joint area is increased to increase the maximum stress to exceed the vibration tensile force, and / or, an adhesive is applied between the soldered component and the substrate for reinforcement, and the required adhesive bonding area and adhesive type are calculated using an adhesive bonding strength model to form adhesive bonding operation requirements that include adhesive bonding area and adhesive type. Finally, the interconnect process design that meets the vibration reliability requirements is obtained by combining the adjusted solder joint area and / or the adhesive bonding operation requirements.

[0065] The adhesive bonding area refers to the effective contact area actually covered by the adhesive layer when adhesive reinforcement is applied between the bottom of the component and the substrate; for example, the aforementioned epoxy resin adhesive is coated with 0.85mm thick adhesive at each of the four corners of the chip. 2 The total adhesive bonding area is 3.4 mm. 2 The type of adhesive refers to the category of bonding materials with different chemical components used for component reinforcement, including epoxy resin adhesives, silicone adhesives, and acrylic adhesives; for example, the adhesive type selected for the aforementioned reinforcement is a two-component epoxy resin adhesive, which has a shear strength of 15 MPa after curing and an applicable temperature range of -55℃ to +125℃.

[0066] The adjusted solder joint area refers to the total effective load-bearing area after increasing the pad size or the number of solder joints when the vibration tension is not less than the maximum stress; for example, if the pad diameter of the aforementioned integrated circuit chip is increased from 0.3mm to 0.35mm, the adjusted solder joint area is π×(0.35mm). 2 ×20÷4, which equals 1.924mm 2 .

[0067] In the above-mentioned optional methods, when it is determined that the vibration tensile force is not less than the maximum stress, the area of ​​the weld point is increased and / or adhesive reinforcement is applied. The adhesive bonding area and adhesive type are determined according to the adhesive bonding strength model, which makes the process adjustment path when the reliability requirements are not met more specific and improves the pertinence of process optimization.

[0068] In one alternative approach, the step of determining the tensile force coefficient by combining the layout of the components and the substrate fixing structure pattern includes: Based on the layout of the components on the substrate in the layout and the distribution of the fixed support points of the substrate in the substrate fixing structure mode, the stress state of the components under vibration conditions is evaluated, and a value is selected from a preset coefficient range as the tensile force coefficient.

[0069] The layout position refers to the specific coordinate region of the component on the substrate plane and its spatial relationship with respect to the substrate edge and fixing points; for example, the aforementioned integrated circuit chip is positioned slightly to the left of the substrate center, 30mm from the left edge of the substrate, and 25mm from the front edge. The distribution of fixing points refers to the geometric distribution of the fixing connection points between the substrate and the overall structure on the substrate plane; for example, the fixing points of the substrate are four corner screw holes with a hole spacing of 120mm in the length direction, and no auxiliary support points in the central area.

[0070] The stress state refers to the combination of tensile, compressive, and shear stress components generated at the solder joints due to inertial loads under vibration conditions. For example, when the substrate is subjected to vertical vibration, the chip in the central region experiences tensile stress perpendicular to the solder joint interface due to the elastic deformation of the substrate, and simultaneously experiences shear stress due to the displacement of the chip's center of mass; the stress state is a combination of tensile and shear stress. The preset coefficient range refers to the upper and lower limits of the tensile force coefficient or stress coefficient determined in advance based on experiments and experience; for example, the preset coefficient range for the tensile force coefficient is 1.0 to 1.3, and the preset coefficient range for the stress coefficient is 0.9 to 1.0.

[0071] In the above-mentioned optional methods, the stress state is further evaluated based on the layout of the components on the substrate and the distribution of the substrate fixing points. The tensile coefficient is selected from the preset coefficient range, so that the determination of the tensile coefficient is more in line with the actual vibration conditions and the rationality of the selection of the tensile coefficient is improved.

[0072] It should be noted that the evaluation factors for the layout include the type of component placement on the substrate, which is divided into center layout, edge layout, and corner layout; the evaluation factors for the substrate fixing structure include the type of fixing point distribution, which is divided into four-corner fixing, peripheral fixing, and array fixing; based on the combination of layout type and fixing point distribution type, a tension coefficient is selected from a preset coefficient range, where the tension coefficient is the upper limit when center layout and four-corner fixing are combined, and the tension coefficient is the lower limit when peripheral fixing or array fixing are combined.

[0073] In one alternative approach, the step of analyzing and determining the stress coefficient based on the layout and the substrate fixing structure includes: Based on the solder joint arrangement of components in the layout and the fixed support structure of the substrate in the substrate fixing structure mode, the coupling effect of the solder joint arrangement and the fixed support structure on stress distribution is analyzed, and a value is selected from a preset coefficient range as the stress coefficient based on the coupling effect.

[0074] The solder joint arrangement refers to the geometric distribution and spacing of all solder joints on the component; for example, the aforementioned integrated circuit chip uses a dual-in-line layout with 10 solder joints on each side along the long side of the chip, and the spacing between adjacent solder joints is 0.5mm. The fixed support structure refers to the mechanical connection method and rigidity characteristics between the substrate and the overall structure for transferring loads; for example, the substrate is fixed to an aluminum alloy frame using four corner screws, and the fixed support structure has reinforcing ribs on all four sides of the frame, providing a support rigidity of 200N / mm.

[0075] The coupling effect refers to the combined effect of the interaction between the solder joint arrangement and the substrate fixing support structure, which together change the stress distribution of the solder joints. For example, the coupling effect between the substrate four-corner fixing support structure and the chip dual in-line package solder joint arrangement is manifested as stress concentration at the four corner solder joints and lower stress at the center solder joint.

[0076] In the above-mentioned optional methods, the stress coefficient is further selected from the preset coefficient range based on the coupling effect of the weld point arrangement and the fixed support structure on the stress distribution. This ensures that the determination of the stress coefficient fully considers the interaction between the layout and the structure, and enhances the scientific nature of the stress coefficient selection.

[0077] It should be noted that the welding point arrangement is divided into double-row straight insertion, four-sided lead-out, and area array; the fixed support structure is divided into rigid support and elastic support according to the support stiffness; according to the combination type of welding point arrangement and fixed support structure, the stress coefficient is selected from the preset coefficient range, where the stress coefficient is taken as the upper limit when the area array is combined with the rigid support, and the stress coefficient is taken as the lower limit when the double-row straight insertion is combined with the elastic support.

[0078] In one alternative approach, the step of calculating the required adhesive bonding area and adhesive type using an adhesive bond strength model includes: Construct the colloid bonding strength model, and establish a mapping relationship between colloid shear strength, colloid bonding area and colloid type in the colloid bonding strength model. Based on the mapping relationship, calculate the colloid bonding area and colloid type by back-calculating the bonding force required to supplement the difference between the maximum stress and the vibration tensile force.

[0079] The mapping relationship refers to the quantitative correspondence between colloidal shear strength, colloidal bonding area, and colloidal type. For example, the mapping relationship established in the colloidal bonding strength model is as follows: epoxy resin corresponds to a shear strength of 15 MPa, silicone corresponds to a shear strength of 2 MPa, acrylic corresponds to a shear strength of 8 MPa, and the total adhesive force is equal to the shear strength multiplied by the colloidal bonding area.

[0080] Here, adhesive force refers to the bonding force generated between the adhesive on the bottom surface of the component and the surface of the substrate, resisting tensile loads; for example, using epoxy resin adhesive on a 3.4mm... 2 The adhesive force that can be generated at the bonding area is 15MPa × 3.4mm. 2 That is, 51N.

[0081] In the above-mentioned optional methods, a mapping relationship between the colloidal shear strength, colloidal bonding area and colloidal type is further established in the colloidal bonding strength model. Based on the adhesive force requirement, the colloidal bonding area and colloidal type are calculated in reverse, making the determination of colloidal reinforcement parameters more quantitative and accurate, and improving the design accuracy of colloidal bonding schemes.

[0082] In this embodiment, it should be noted that: Before electrical assembly, the actual vibration and tensile forces that the components are subjected to are assessed. Perform calculations. Vibration tension. The calculation is based on the component mass m and the vibration acceleration G, and the calculation formula is: ,in This refers to the tensile strength coefficient. The tensile strength coefficient is determined based on the component layout and substrate mounting structure, and its value ranges from 1.0 to 1.3. For example... Figure 2 As shown, the actual vibration tensile force borne by the component is calculated using mass m and vibration acceleration G. , Figure 2 The components and The relationship between them.

[0083] Based on the actual welding fracture tensile force of the standard unit Calculate the actual tensile strength at weld fracture Actual welding fracture tensile force of standard unit The actual tensile strength at weld fracture was obtained by conducting welding fracture tests on standard units. The calculation formula is: ,in This refers to the original cross-sectional area of ​​a standard unit weld joint. For example... Figure 3 As shown, the actual welding fracture tensile force of the standard unit is... Calculate the actual tensile strength at weld fracture , Figure 3 It shows Acting on standard units, Relationship with standard cells and substrates.

[0084] The actual tensile strength at weld fracture Confirmed as the actual welded tensile strength of the standard unit ,Right now Based on this, calculate the maximum stress that the components can actually withstand during welding. The calculation formula is: ,in This represents the original cross-sectional area of ​​the component solder joint. It is derived from the actual substrate pads corresponding to the components. This is the stress coefficient. The stress coefficient is determined based on the component layout and substrate mounting structure, and its value ranges from 0.9 to 1.0. For example... Figure 4 As shown, the actual weld tensile strength of the standard unit is confirmed. And calculate the maximum stress that the components can actually withstand during welding. , Figure 4 It shows , The correspondence between standard cells and substrates.

[0085] Complete vibration tension With maximum stress After calculation, the two are compared and analyzed. For example... Figure 5 As shown, the actual vibration and tensile force borne by the component is... The maximum stress that can actually be withstood when welding to components To make a comparison, Figure 5 It shows and A bidirectional comparison relationship applied to standard cells, components, and substrates, respectively.

[0086] There are two scenarios in the comparison results.

[0087] The first scenario: When the component actually bears the vibration and tensile force Less than the maximum stress that the component can actually withstand during welding. At this point, it is determined that the welded components can withstand the vibration intensity, and the corresponding process design for the components is completed. For example... Figure 6 As shown, when the welding device can withstand the vibration intensity, the component is connected to the substrate through the solder joint to form a complete interconnection structure, thus completing the corresponding process design of the component.

[0088] The second scenario: when the component actually bears the vibration tension. Greater than or equal to the maximum stress that the component can actually withstand during welding. If it is determined that the welded component cannot withstand the vibration intensity, the weld area is adjusted, and adhesive reinforcement is applied. The adhesive bonding strength model is used to determine the adhesive bonding requirements, and then the corresponding process design for the component is completed. For example... Figure 7 As shown, when the welding device cannot withstand the vibration intensity, the component is connected to the substrate through colloid and solder joint. The colloid is applied between the component and the substrate, the solder joint provides electrical connection and partial mechanical connection, and the colloid provides supplementary mechanical reinforcement, thus completing the corresponding process design of the component.

[0089] Compared with existing reinforcement methods based on experience, the technical solution of this embodiment uses a colloidal bonding strength model to back-calculate the colloidal bonding area and colloidal type. This eliminates the reliance on operator experience in determining the colloidal reinforcement parameters, instead using a quantitative calculation based on the difference between the maximum stress and the vibration tensile force. This increases the colloidal bonding area from the empirically estimated approximately 5mm². 2 Up to 10mm 2 The range was narrowed down to the precise value of 3.33 mm obtained through reverse calculation. 2 This reduces waste of colloidal materials and avoids the risk of reinforcement failure due to insufficient adhesive, thus improving the consistency and reliability of the colloidal reinforcement process.

[0090] like Figure 8 As shown, the overall implementation process of this embodiment includes the following steps in sequence: calculating the actual vibration tensile force borne by the component through mass and vibration acceleration; calculating the actual tensile strength of the weld fracture based on the actual weld fracture tensile force of the standard unit; confirming the actual weld tensile strength of the standard unit and calculating the maximum stress that the component can actually withstand during welding; comparing the actual vibration tensile force borne by the component with the maximum stress that the component can actually withstand during welding; completing the corresponding process design of the component when the welded component can withstand the vibration intensity; and adjusting the weld area, reinforcing with colloid, and forming colloid bonding operation requirements based on the colloid bonding strength model, and then completing the corresponding process design of the component.

[0091] The technical solution of this embodiment differs from the prior art in that: In existing traditional methods, vibration resistance defects in component interconnection processes are usually only exposed and discovered after electrical assembly and during user use of the product. Remediation is difficult and the defects cannot be eliminated at the root. In contrast, this embodiment completes the calculation and comparison of vibration tension and maximum stress before electrical assembly, moving the reliability assessment to the design stage.

[0092] In existing traditional methods, the judgment of vibration resistance is usually based on experience, which lacks methods and data comparison, leading to blind spots in reinforcement, increasing process costs and complicating process steps. However, this embodiment achieves accurate determination of reinforcement requirements through quantitative calculation and comparison.

[0093] In existing traditional methods, interconnect process design often lags behind layout and structural design. However, this embodiment integrates process reliability into the design process from the outset, and performs it simultaneously with layout and structural design.

[0094] In existing traditional methods, the vibration resistance of different components under different vibration conditions cannot be identified after the design is completed. However, this embodiment can identify the differences in vibration resistance during the design stage by calculating and comparing the vibration tensile force and maximum stress of each component.

[0095] It should be noted that when the combination of weld point area adjustment and adhesive reinforcement is used simultaneously, the weld point area adjustment undertakes the main function of load-bearing enhancement, while the adhesive reinforcement undertakes the auxiliary functions of load-bearing and stress dispersion. The load-bearing capacity of the combination exceeds the sum of the load-bearing capacities of either the weld point area adjustment alone or the adhesive reinforcement alone, thus achieving a synergistic improvement in load-bearing capacity. Under the premise of meeting the same vibration reliability requirements, the increase in weld point area required by the combination is less than the increase required by the single weld point area adjustment method.

[0096] Figure 9 A schematic diagram of an embodiment of a vibration reliability design system 200 for component interconnection processes provided by the present invention is shown. Figure 9 As shown, the vibration reliability design system 200 for this component interconnection process includes: The acquisition module 201 is used to acquire the mass parameters of the component and the vibration acceleration that the component needs to withstand, and to determine the tensile force coefficient based on the layout of the component and the substrate fixing structure mode, and to calculate the vibration tensile force that the component bears under actual vibration conditions. Processing module 202 is used to obtain the actual welding fracture tensile force of the standard unit, calculate the actual welding fracture tensile strength by combining it with the original cross-sectional area of ​​the weld point of the standard unit, and confirm the actual welding fracture tensile strength as the actual welding tensile strength of the standard unit. The calculation module 203 is used to determine the stress coefficient based on the layout of the component and the substrate fixing structure mode, and calculate the maximum stress that the interconnect structure of the component can withstand by combining the actual welding tensile strength of the standard unit and the original cross-sectional area of ​​the solder joint determined by the substrate pad corresponding to the component. The comparison module 204 is used to compare the vibration tensile force with the maximum stress. If the vibration tensile force is less than the maximum stress, the current interconnect process design is adopted. The adjustment module 205 is used to adjust the weld area and / or apply adhesive reinforcement if the vibration tensile force is not less than the maximum stress, and to determine the adhesive bonding operation requirements based on the adhesive bonding strength model, so as to obtain an interconnection process design that meets the vibration reliability requirements; wherein, the adhesive bonding strength model is a mathematical mapping relationship between the adhesive shear strength and the adhesive bonding area and adhesive type established through experiments.

[0097] In one alternative embodiment, the acquisition module 201 is specifically used for: The mass parameters of the component are obtained, and the required vibration acceleration is determined according to the application scenario of the component. The tensile force coefficient is determined in combination with the layout of the component and the substrate fixing structure mode. The vibration tension borne by the component under the actual vibration condition is calculated by multiplying the mass parameter, the vibration acceleration, and the tensile coefficient.

[0098] In an alternative embodiment, the processing module 202 is specifically used for: The actual welding fracture tensile force of the standard unit was obtained by conducting a welding fracture test on the standard unit. The actual tensile strength of the weld fracture is obtained based on the ratio of the actual weld fracture tensile force of the standard unit to the original cross-sectional area of ​​the weld joint of the standard unit, and the actual tensile strength of the weld fracture is used as the actual weld tensile strength of the standard unit.

[0099] In an alternative embodiment, the computing module 203 is specifically used for: Based on the layout and the substrate fixing structure, the stress coefficient is analyzed and determined, and based on the size of the substrate pads interconnecting the components, the original cross-sectional area of ​​all solder joints in the interconnection structure of the components is determined. The maximum stress that the interconnect structure of the component can withstand is calculated by multiplying the stress coefficient, the actual welding tensile strength of the standard unit, and the original cross-sectional area of ​​all solder joints.

[0100] In an alternative embodiment, the comparison module 204 is specifically used for: The vibration tensile force is compared with the maximum stress. If the vibration tensile force is less than the maximum stress, the current interconnect process design, which consists of the pad size and soldering parameters of the component, is confirmed to meet the vibration reliability requirements, and the current interconnect process design is adopted.

[0101] In an alternative embodiment, the adjustment module 205 is specifically used for: If the vibration tensile force is determined to be not less than the maximum stress, the solder joint area is increased to increase the maximum stress to exceed the vibration tensile force, and / or, an adhesive is applied between the soldered component and the substrate for reinforcement, and the required adhesive bonding area and adhesive type are calculated using an adhesive bonding strength model to form adhesive bonding operation requirements that include adhesive bonding area and adhesive type. Finally, the interconnect process design that meets the vibration reliability requirements is obtained by combining the adjusted solder joint area and / or the adhesive bonding operation requirements.

[0102] In one alternative embodiment, the acquisition module 201 is specifically used for: Based on the layout of the components on the substrate in the layout and the distribution of the fixed support points of the substrate in the substrate fixing structure mode, the stress state of the components under vibration conditions is evaluated, and a value is selected from a preset coefficient range as the tensile force coefficient.

[0103] In an alternative embodiment, the computing module 203 is specifically used for: Based on the solder joint arrangement of components in the layout and the fixed support structure of the substrate in the substrate fixing structure mode, the coupling effect of the solder joint arrangement and the fixed support structure on stress distribution is analyzed, and a value is selected from a preset coefficient range as the stress coefficient based on the coupling effect.

[0104] In an alternative embodiment, the adjustment module 205 is specifically used for: Construct the colloid bonding strength model, and establish a mapping relationship between colloid shear strength, colloid bonding area and colloid type in the colloid bonding strength model. Based on the mapping relationship, calculate the colloid bonding area and colloid type by back-calculating the bonding force required to supplement the difference between the maximum stress and the vibration tensile force.

[0105] It should be noted that the beneficial effects of the vibration reliability design system 200 for component interconnection processes provided in the above embodiments are the same as those of the vibration reliability design method for component interconnection processes described above, and will not be repeated here. Furthermore, the system provided in the above embodiments is only illustrated by the division of the above functional modules. In practical applications, the above functions can be assigned to different functional modules as needed, that is, the system can be divided into different functional modules according to the actual situation to complete all or part of the functions described above. In addition, the system and method embodiments provided in the above embodiments belong to the same concept, and their specific implementation process is detailed in the method embodiments, and will not be repeated here.

[0106] The vibration reliability design system 200 for the component interconnection process of the present invention can be a computer program (including program code) running on a computer device. For example, the vibration reliability design system 200 for the component interconnection process of the present invention is an application software that can be used to execute the corresponding steps in the vibration reliability design method for the component interconnection process of the present invention.

[0107] In some embodiments, the vibration reliability design system 200 for the component interconnect process of the present invention can be implemented in a combination of hardware and software. As an example, the vibration reliability design system 200 for the component interconnect process of the present invention can be a processor in the form of a hardware decoding processor, which is programmed to execute the vibration reliability design method for the component interconnect process of the present invention. For example, the processor in the form of a hardware decoding processor can be one or more application specific integrated circuits (ASICs), DSPs, programmable logic devices (PLDs), complex programmable logic devices (CPLDs), field-programmable gate arrays (FPGAs), or other electronic components.

[0108] The modules described in the embodiments of this invention can be implemented in software or hardware. The names of the modules are not, in some cases, limiting the scope of the module itself.

[0109] It should be understood that the flowcharts and block diagrams in the accompanying drawings illustrate the architecture, functionality, and operation of possible implementations of methods and computer program products according to various embodiments of the present invention. In this regard, each block in a flowchart or block diagram may represent a module, segment, or portion of code containing one or more executable instructions for implementing the specified logical function. It should also be noted that in some alternative implementations, the functions indicated in the blocks may occur in a different order than those indicated in the drawings. For example, two consecutively indicated blocks may actually be executed substantially in parallel, and they may sometimes be executed in reverse order, depending on the functions involved. It should also be noted that each block in the block diagrams and / or flowcharts, and combinations of blocks in the block diagrams and / or flowcharts, may be implemented using a dedicated hardware-based system that performs the specified function or operation, or using a combination of dedicated hardware and computer instructions.

[0110] The above description is merely a preferred embodiment of the present invention and an explanation of the technical principles employed. Those skilled in the art should understand that the scope of disclosure in this invention is not limited to technical solutions formed by specific combinations of the above-described technical features, but should also cover other technical solutions formed by arbitrary combinations of the above-described technical features or their equivalents without departing from the above-disclosed concept. For example, technical solutions formed by substituting the above features with (but not limited to) technical features with similar functions disclosed in this invention.

[0111] It should be noted that the terms "first," "second," etc., used in the specification and claims of this application are used to distinguish similar objects and represent a limitation on a specific order or sequence. Where appropriate, the order of use for similar objects can be interchanged so that the embodiments of this application described herein can be implemented in an order other than that shown or described.

[0112] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.

Claims

1. A vibration reliability design method for component interconnection processes, characterized in that, include: The process involves obtaining the mass parameters of a component and the required vibration acceleration of that component, and determining a tensile force coefficient to correct the vibration tensile force calculation results based on the component's layout and substrate fixing structure. The process then calculates the vibration tensile force borne by the component under actual vibration conditions. This includes: obtaining the mass parameters of the component, determining the required vibration acceleration based on the component's application scenario, and determining the tensile force coefficient in conjunction with the component's layout and substrate fixing structure; multiplying the mass parameters, vibration acceleration, and tensile force coefficient to calculate the vibration tensile force borne by the component under the actual vibration conditions. The substrate fixing structure refers to the method and distribution of the fixing points for mechanically fixing the substrate to the chassis or support frame. Obtain the actual welding fracture tensile force of the standard unit, combine it with the original cross-sectional area of ​​the weld point of the standard unit, calculate the actual welding fracture tensile strength, and confirm the actual welding fracture tensile strength as the actual welding tensile strength of the standard unit. Based on the component layout and substrate fixing structure pattern, a stress coefficient is determined to correct the maximum stress calculation result. Combining the actual welding tensile strength of the standard unit and the original cross-sectional area of ​​the solder joint determined by the substrate pads corresponding to the component, the maximum stress that the interconnect structure of the component can withstand is calculated. According to the layout and substrate fixing structure pattern, the stress coefficient is analyzed and determined. Based on the size of the substrate pads interconnecting with the component, the original cross-sectional area of ​​all solder joints in the interconnect structure of the component is determined. Multiplying the stress coefficient, the actual welding tensile strength of the standard unit, and the original cross-sectional area of ​​all solder joints, the maximum stress that the interconnect structure of the component can withstand is calculated. The interconnect structure refers to the electrical and mechanical connection system composed of components, substrate pads, and the solder joints between them. The vibration tensile force is compared with the maximum stress. If the vibration tensile force is less than the maximum stress, the current interconnect process design is adopted. If the vibration tensile force is not less than the maximum stress, the weld area is adjusted and / or adhesive reinforcement is applied, and the adhesive bonding operation requirements are determined according to the adhesive bonding strength model to obtain an interconnection process design that meets the vibration reliability requirements; wherein, the adhesive bonding strength model is: a mathematical mapping relationship between the adhesive shear strength and the adhesive bonding area and adhesive type established through experimentation.

2. The vibration reliability design method for component interconnection processes according to claim 1, characterized in that, The steps of obtaining the actual weld fracture tensile force of the standard unit, calculating the actual weld fracture tensile strength based on the original cross-sectional area of ​​the weld joint of the standard unit, and confirming the actual weld fracture tensile strength as the actual weld tensile strength of the standard unit include: The actual welding fracture tensile force of the standard unit was obtained by conducting a welding fracture test on the standard unit. The actual tensile strength of the weld fracture is obtained based on the ratio of the actual weld fracture tensile force of the standard unit to the original cross-sectional area of ​​the weld joint of the standard unit, and the actual tensile strength of the weld fracture is used as the actual weld tensile strength of the standard unit.

3. The vibration reliability design method for component interconnection processes according to claim 1, characterized in that, The vibration tensile force is compared with the maximum stress. If the vibration tensile force is less than the maximum stress, then the current interconnect process design steps are adopted, including: The vibration tensile force is compared with the maximum stress. If the vibration tensile force is less than the maximum stress, the current interconnect process design, which consists of the pad size and soldering parameters of the component, is confirmed to meet the vibration reliability requirements, and the current interconnect process design is adopted.

4. The vibration reliability design method for component interconnection processes according to claim 3, characterized in that, If the vibration tensile force is not less than the maximum stress, then the solder joint area is adjusted and / or adhesive reinforcement is applied, and the adhesive bonding operation requirements are determined according to the adhesive bonding strength model, resulting in the steps of interconnect process design that meets vibration reliability requirements, including: If the vibration tensile force is determined to be not less than the maximum stress, the solder joint area is increased to increase the maximum stress to exceed the vibration tensile force, and / or, an adhesive is applied between the soldered component and the substrate for reinforcement, and the required adhesive bonding area and adhesive type are calculated using an adhesive bonding strength model to form adhesive bonding operation requirements that include adhesive bonding area and adhesive type. Finally, the interconnect process design that meets the vibration reliability requirements is obtained by combining the adjusted solder joint area and / or the adhesive bonding operation requirements.

5. The vibration reliability design method for component interconnection processes according to claim 1, characterized in that, The step of determining the tensile force coefficient by combining the layout of the components and the substrate fixing structure includes: Based on the layout of the components on the substrate in the layout and the distribution of the fixed support points of the substrate in the substrate fixing structure mode, the stress state of the components under vibration conditions is evaluated, and a value is selected from a preset coefficient range as the tensile force coefficient.

6. The vibration reliability design method for component interconnection processes according to claim 1, characterized in that, The step of analyzing and determining the stress coefficient based on the layout and the substrate fixing structure includes: Based on the solder joint arrangement of components in the layout and the fixed support structure of the substrate in the substrate fixing structure mode, the coupling effect of the solder joint arrangement and the fixed support structure on stress distribution is analyzed, and a value is selected from a preset coefficient range as the stress coefficient based on the coupling effect.

7. The vibration reliability design method for component interconnection processes according to claim 4, characterized in that, The steps for calculating the required adhesive bonding area and adhesive type using an adhesive bond strength model include: Construct the colloid bonding strength model, and establish a mapping relationship between colloid shear strength, colloid bonding area and colloid type in the colloid bonding strength model. Based on the mapping relationship, calculate the colloid bonding area and colloid type by back-calculating the bonding force required to supplement the difference between the maximum stress and the vibration tensile force.

8. A vibration reliability design system for component interconnection processes, characterized in that, The vibration reliability design method using the component interconnection process as described in any one of claims 1 to 7, the system comprising: The acquisition module is used to acquire the mass parameters of the component and the vibration acceleration that the component needs to withstand, and to determine the tensile coefficient based on the layout of the component and the substrate fixing structure mode, and to calculate the vibration tensile force that the component bears under actual vibration conditions. The processing module is used to obtain the actual welding fracture tensile force of the standard unit, combine it with the original cross-sectional area of ​​the weld point of the standard unit, calculate the actual tensile strength of the welding fracture, and confirm the actual tensile strength of the welding fracture as the actual welding tensile strength of the standard unit. The calculation module is used to determine the stress coefficient based on the layout of the components and the substrate fixing structure mode, and calculate the maximum stress that the interconnect structure of the components can withstand by combining the actual welding tensile strength of the standard unit and the original cross-sectional area of ​​the solder joint determined by the substrate pads corresponding to the components. A comparison module is used to compare the vibration tension with the maximum stress. If the vibration tension is less than the maximum stress, the current interconnect process design is adopted. An adjustment module is used to adjust the weld area and / or apply adhesive reinforcement if the vibration tensile force is not less than the maximum stress, and to determine the adhesive bonding operation requirements based on the adhesive bonding strength model, thereby obtaining an interconnection process design that meets the vibration reliability requirements; wherein, the adhesive bonding strength model is a mathematical mapping relationship between the adhesive shear strength and the adhesive bonding area and adhesive type established through experimentation.

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