A brain-computer interface encapsulation part, encapsulation mold and encapsulation method

By using coated parts and molds to form an integrated flexible covering on the coil and communication antenna in the brain-computer interface system, the problem of deformation of the coil and communication antenna during assembly is solved, improving structural stability and production efficiency.

CN122634868APending Publication Date: 2026-08-25SHENZHEN WE LINKING MEDICAL TECHNOLOGY CO LTD
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Patent Information

Application Number
CN202610742265.1
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2026-05-27
Publication Date
2026-08-25

AI Technical Summary

Technical Problem

In brain-computer interface systems, coils and communication antennas are prone to deformation during assembly, leading to assembly difficulties and affecting product yield and production efficiency.

Method used

By using coated parts and coated molds, an integrated flexible coating is formed on the coil and communication antenna, achieving a seamless connection between the coil, communication antenna and flexible coating. The fixed mold and moving mold of the coated mold are used to conveniently form an integrated flexible coating on the coil and communication antenna.

Benefits of technology

It effectively constrains the deformation degrees of freedom of coils and communication antennas, improves structural stability and connection strength, avoids deformation during assembly, and improves product yield and production efficiency.

✦ Generated by Eureka AI based on patent content.

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Abstract

The application discloses a brain-computer interface encapsulating part, an encapsulating die and an encapsulating method, and belongs to the technical field of medical devices. The brain-computer interface encapsulating part comprises a coil, a communication antenna and a flexible encapsulating body, the coil and the communication antenna are wrapped inside the flexible encapsulating body, and the coil, the communication antenna and the flexible encapsulating body are integrally connected. The encapsulating die comprises a fixed die and a movable die matched with the fixed die, the movable die can freely move when closely abutting against the fixed die or completely moving away from the fixed die, the fixed die comprises a fixed die cavity, the movable die comprises a movable die cavity, the fixed die cavity, the movable die cavity and corresponding die surfaces form a forming chamber, the movable die is provided with a glue inlet, and the glue inlet is communicated with the forming chamber; the forming chamber is used for accommodating the coil and the communication antenna, and a flexible encapsulating body is formed around the coil and the communication antenna, the application can avoid deformation of the coil and the communication antenna in the assembling and connecting process, and reduce the assembling difficulty.
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Description

Technical Field

[0001] This invention relates to the field of medical device technology, and in particular to a brain-computer interface overmolded component, overmolding mold, and overmolding method. Background Technology

[0002] A brain-computer interface system is an implantable product used to collect signals from the cerebral cortex. By establishing an information channel between the brain and the machine, it enables the collaborative interaction between biological intelligence and machine intelligence. Users can directly express their thoughts or control external devices through their brains, completing the output of information from the brain to the device. The device can also input information to the brain through stimulation in the form of electricity, magnetism, light, sound, etc.

[0003] The brain-computer interface system includes an implant, which includes structures such as coils, communication antennas, and feedthroughs. The coils and communication antennas are connected to the feedthroughs for assembly. Because the coils and communication antennas are relatively soft, they are prone to deformation during the assembly and connection process with the feedthroughs, making assembly difficult and affecting product yield and production efficiency.

[0004] Therefore, there is an urgent need for a coating component, coating mold, and coating method for brain-computer interfaces to solve the problems existing in the prior art. Summary of the Invention

[0005] The purpose of this invention is to provide a coated component, a coated mold, and a coated method for a brain-computer interface, which avoids deformation of the coil and communication antenna, thereby reducing assembly difficulty and improving product yield and production efficiency.

[0006] To achieve this objective, the present invention adopts the following technical solution: A brain-computer interface encapsulation component includes a coil, a communication antenna, and a flexible encapsulation body. The coil and the communication antenna are encapsulated inside the flexible encapsulation body, and the coil, the communication antenna, and the flexible encapsulation body are integrally connected.

[0007] In some embodiments, the coil is generally in the form of a vortex ring structure, including a first lead body and a first end. The first lead body is formed by winding the first lead multiple times, and after the winding is completed, the two ends of the first lead body extend out to form two first ends. And / or, the communication antenna is in the shape of a helical spring, including a second lead body and a second end, wherein the second lead body is formed by helically winding the second lead, and one end of the second lead body extends to form the second end after winding.

[0008] In some embodiments, the communication antenna and the coil are arranged side by side, with the center line of the coil and the center line of the communication antenna spaced apart and arranged at an angle; the flexible covering includes an integrally connected first part and a second part, the first part corresponding to the first lead body covering the coil, and the second part corresponding to the second lead body covering the communication antenna and part of the first end, the first part and the second part being arranged side by side and transitionally connected.

[0009] In some embodiments, the first part is generally annular, including a first side and a second side disposed opposite to each other. The first part has a plurality of through holes evenly distributed through the first side and the second side. The first side is provided with a plurality of first protrusions evenly distributed in a ring, and the second side is provided with a plurality of second protrusions evenly distributed in a ring. The inner ring of the first part is provided with a plurality of evenly distributed third protrusions facing inward. And / or, the second part is cylindrical in shape, and one side of the second part extends and transitions at a certain angle to one side of the first part.

[0010] In some embodiments, a first insulating tube is respectively sleeved on the two first ends, the first ends passing through the first insulating tube and partially exposed outside the first insulating tube, and a second insulating tube is sleeved on the second ends, the second ends passing through the second insulating tube and partially exposed outside the second insulating tube; The flexible covering includes a third part and a fourth part connected to the second part on the side opposite to the first part, the third part at least partially covering the first insulating tube, and the fourth part at least partially covering the second insulating tube; And / or, the flexible covering is made of one of silicone, silicon-derived materials, thermoplastic polyurethane, liquid ionic elastomer, thermoplastic elastomer and polyvinylidene fluoride.

[0011] An overmolding mold is used to form an overmolded component of a brain-computer interface as described in any of the preceding claims. The overmolding mold includes a fixed mold and a movable mold adapted to the fixed mold. The movable mold is capable of moving freely between the fixed mold and the fixed mold, or completely away from the fixed mold. The fixed mold includes a fixed mold cavity, and the movable mold includes a movable mold cavity. The fixed mold cavity, the movable mold cavity, and corresponding mold surfaces enclose a molding chamber. The movable mold is provided with an inlet, which communicates with the molding chamber. The molding chamber is used to accommodate the coil and the communication antenna, and a flexible covering is formed around the coil and the communication antenna.

[0012] In some embodiments, the mold cavity includes a first mold groove and a second mold groove that are connected to each other. The first mold groove is used to accommodate and limit at least a portion of the coil; the second mold groove is used to accommodate and limit at least a portion of the communication antenna.

[0013] In some embodiments, at least three fixed mold bosses are evenly distributed along the circumferential direction of the first groove of the fixed mold, the first lead body is accommodated in the gap between the fixed mold bosses and the groove wall, and the fixed mold bosses form through holes on the overmolded part. The moving mold cavity includes a moving mold first groove, and a fixed mold first groove and the moving mold first groove are correspondingly arranged. The bottom of the moving mold first groove is provided with a plurality of moving mold first forming grooves evenly distributed along the circumference. The moving mold first forming grooves form a plurality of first protrusions on the overmolded part. The bottom of the fixed mold first groove is provided with a plurality of fixed mold first forming grooves evenly distributed along the circumference. The fixed mold first forming grooves form a plurality of second protrusions on the overmolded part.

[0014] In some embodiments, the fixed mold cavity further includes a first lead wire groove and a second lead wire groove, the first lead wire groove and the second lead wire groove are arranged in parallel, the fixed mold first groove and the fixed mold second groove are arranged sequentially, the first lead wire groove and the second lead wire groove are located on the side of the fixed mold second groove away from the fixed mold first groove, and an empty space is provided on the side of the first lead wire groove and the second lead wire groove that do not communicate with the fixed mold second groove; And / or, the fixed mold is further provided with a fixed mold overflow groove, which is connected to the first groove of the fixed mold.

[0015] In some embodiments, the first groove of the moving mold is provided with a protrusion, the protrusion abutting against the bottom of the groove in the center of the first groove of the fixed mold, and the protrusion corresponding to the hollow hole formed in the overmolded part; And / or, the protrusion is provided with a plurality of moving mold second forming grooves on its periphery so that the inner ring surface of the hollow hole is correspondingly formed with a plurality of the third protrusions; And / or, the top of the protrusion is provided with a limiting groove, and the bottom of the first groove of the fixed mold is provided with a limiting block, and the limiting groove and the limiting block cooperate to achieve circumferential limiting.

[0016] In some embodiments, a first insert is further included, one end of the fixed mold second groove may be provided with a first positioning groove, the first positioning groove is connected to the fixed mold second groove, and the first insert is movably embedded in the first positioning groove and passes through the second lead body; And / or, it also includes a second insert, wherein the other end of the fixed mold second groove may be provided with a second positioning groove, the second positioning groove is connected to the fixed mold second groove, and the second insert is movably embedded in the second positioning groove and abuts against the first insulating tube; And / or, the first insert and the second insert may be detachably connected to the moving mold, respectively; And / or, it also includes a connector for detachably connecting the fixed mold and the moving mold; And / or, it also includes a guide member, the guide member comprising a plurality of positioning pins and a plurality of positioning holes, the positioning pins and the positioning holes corresponding one to one, one of the positioning pins and the positioning holes being located in the fixed mold and the other in the moving mold.

[0017] A method for overmolding, employing an overmolding mold as described in any of the preceding claims, the overmolding method comprising: The coil is placed in a first preset position to limit its movement; The communication antenna is placed in a second preset position to limit its position. The communication antenna is further constrained using the first insert; The fixed mold and the moving mold are closed and fixed, and the coil and the communication antenna are located in the molding cavity formed by the fixed mold and the moving mold; A flexible fluid is injected into the molding chamber, and a flexible covering is integrally molded on the coil and the communication antenna to obtain a coated part.

[0018] The beneficial effects of this invention are: This invention provides a brain-computer interface (BCI) encapsulation component. By forming an integrally molded flexible encapsulation on the coil and communication antenna, the coil, communication antenna, and flexible encapsulation in the encapsulation component are integrated into a single design. This allows the coil and communication antenna to be seamlessly connected through the flexible encapsulation. The flexible encapsulation can effectively constrain the deformation freedom of the coil and communication antenna, improve structural stability, connection strength, and resistance to deformation, and avoid additional deformation caused by the encapsulation component and feedthrough or other structures during assembly and connection. This reduces assembly difficulty and improves product yield and production efficiency.

[0019] The present invention provides a coating mold and coating method, which, through the cooperation of a moving mold and a fixed mold, can conveniently assemble individual coils and communication antennas without damaging the original structure of the coils and communication antennas, and can conveniently form an integrated flexible coating on the assembled coils and communication antennas, that is, to form a coated part. Attached Figure Description

[0020] Figure 1 This is a perspective view of the encapsulated component for the coil and communication antenna in a specific embodiment of the present invention; Figure 2 This is a schematic diagram showing the relative positions of the coil and the communication antenna in a specific embodiment of the present invention; Figure 3 This is a schematic diagram of the structure of the encapsulated component formed by the coil and communication antenna from one perspective in a specific embodiment of the present invention; Figure 4 This is a schematic diagram of the structure of the encapsulated component formed by the coil and communication antenna from another perspective in a specific embodiment of the present invention; Figure 5 This is an overall schematic diagram of the overmolding mold after mold closing in a specific embodiment of the present invention; Figure 6 This is a schematic diagram of the fixed mold structure in a specific embodiment of the present invention; Figure 7 This is a schematic diagram of the moving mold in a specific embodiment of the present invention; Figure 8 This is a flowchart of a method for coating a coated part according to a specific embodiment of the present invention.

[0021] Figure label: 10. Rubber-coated parts; 11. Coil; 111. First lead body; 112. First end; 113. First insulating tube; 12. Communication antenna; 121. Second lead body; 122. Second end; 123. Second insulating tube; 13. Flexible covering body; 131. First part; 1311. Through hole; 1312. First protrusion; 1313. Second protrusion; 1314. Third protrusion; 1315. Fourth protrusion; 1316. Hollow hole; 132. Part Two; 133. Part Three; 134. Part Four; 50. Overmolding mold; 51. Fixed mold; 511. First groove of fixed mold; 5111. Boss of fixed mold; 5112. First forming groove of fixed mold; 5113. Limiting block; 512. Second groove in fixed mold; 513. First lead wire groove; 514. Second lead wire groove; 515. Glue overflow groove in fixed mold; 516. First positioning groove; 517. Second positioning groove; 518. Clearance space; 52. Moving mold; 521. First groove of moving mold; 5211. First forming groove of moving mold; 5212. Protrusion; 52121. Second forming groove of moving mold; 52122. Limiting groove; 5213. Third forming groove of moving mold; 522. Glue inlet; 53. First insert; 531. First locating pin; 54. Second insert; 541. Second locating pin; 55. Connector; 56. Guide; 561. Positioning pin; 562. Positioning hole. Detailed Implementation

[0022] To make the technical problems solved by the present invention, the technical solutions adopted, and the technical effects achieved clearer, the technical solutions of the embodiments of the present invention will be further described in detail below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0023] In the description of this invention, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0024] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0025] In some embodiments, such as Figures 1-4 As shown, this application provides a coated component 10 for a brain-computer interface, which includes a coil 11, a communication antenna 12, and a flexible covering 13. The coil 11 and the communication antenna 12 are wrapped inside the flexible covering 13, and the coil 11, the communication antenna 12, and the flexible covering 13 are integrally connected. By forming an integrally molded flexible covering 13 on the coil 11 and the communication antenna 12, the coil 11, the communication antenna 12, and the flexible covering 13 in the coated component 10 are integrated into a single design, allowing the coil 11 and the communication antenna 12 to be seamlessly connected through the flexible covering 13. The flexible covering 13 can effectively constrain the deformation freedom of the coil 11 and the communication antenna 12, improve structural stability, connection strength, and resistance to deformation, and avoid additional deformation caused by the coated component 10 and feedthrough or other structures during assembly and connection, thereby reducing assembly difficulty and improving product yield and production efficiency.

[0026] In some embodiments, combined Figure 2 As shown, the coil 11 has an overall vortex ring structure and is used for energy transmission and interaction with other components. Optionally, the coil 11 includes a first lead body 111 and a first end 112. The coil 11 is formed by winding the first lead multiple times, and after winding, the first lead body 111 extends out at both ends to form two first ends 112. Further, a first insulating tube 113 is correspondingly sleeved around each first end 112, meaning the first end 112 passes through the corresponding first insulating tube 113 and is partially exposed outside the first insulating tube 113. It is understood that the two first ends 112 are used to connect with feedthroughs or other structures. By sleeved with the first insulating tube 113, contact between the first lead of the coil 11 and external conductive structures can be avoided, preventing short circuits and improving safety and reliability. Optionally, the first lead wire may be made of one or more of platinum-iridium alloy wire, silver wire, gold wire, etc., with a wire diameter ranging from 0.3mm to 0.8mm. The inner diameter of the first lead wire body 111 ranges from 10mm to 20mm, and the outer diameter ranges from 27mm to 50mm.

[0027] In some embodiments, combined Figure 2 As shown, the communication antenna 12 is generally in the shape of a helical spring, used for data transmission and interaction with other components. For example, the communication antenna 12 is a Bluetooth antenna. Optionally, the communication antenna 12 includes a second lead body 121 and a second end 122. The communication antenna 12 is formed by helically winding the second lead, and one end of the second lead body 121 extends out to form the second end 122. Further, a second insulating tube 123 is correspondingly sleeved on the outside of the second end 122, meaning the second end 122 passes through the corresponding second insulating tube 123 and is partially exposed outside the second insulating tube 123. It is understood that the second end 122 is used to connect with a feedthrough or other structure. By sleeved with the second insulating tube 123, contact between the second lead of the communication antenna 12 and external conductive structures can be avoided, preventing short circuits and improving safety and reliability. Optionally, the communication antenna 12 is made of platinum-iridium alloy wire, with a total length ranging from 45mm to 85mm and a wire diameter ranging from 0.15mm to 0.25mm.

[0028] Optionally, in some embodiments, combined with Figures 1-4 As shown, the communication antenna 12 and the coil 11 are arranged side by side, with the center lines of the coil 11 and the communication antenna 12 spaced apart and arranged at an angle. The center line of the coil 11 is arranged along a first direction, the coil 11 and the communication antenna 12 are arranged along a second direction, and the center line of the communication antenna 12 is arranged along a third direction. Optionally, the first direction, the second direction and the third direction are mutually perpendicular.

[0029] Furthermore, in some embodiments, combined with Figures 1-4 As shown, the flexible covering 13 includes an integrally connected first part 131 and second part 132. The first part 131 corresponds to the first lead body 111 of the covering coil 11, and the second part 132 corresponds to the second lead body 121 and part of the first end 112 of the covering communication antenna 12. The first part 131 and the second part 132 are arranged side by side and are connected in a transitional manner. That is, the first part 131 and the second part 132 extend and transition at a certain angle to form a whole.

[0030] Optionally, in some embodiments, combined with Figures 1-4 As shown, the first part 131 is generally circular in shape, and includes a first side and a second side arranged opposite to each other along the first direction (i.e., the vertical direction).

[0031] Optionally, the first part 131 has a plurality of through holes 1311 that are evenly distributed through the first side and the second side. The through holes 1311 are used to form a mutually interlocking structure when the overmolded part 10 is connected to other components (such as an outer covering layer, which covers the overmolded part 10). This provides space and possibility for improving the bonding force between the overmolded part 10 and other components in subsequent assembly molding (such as injection molding of the implant body to form an outer covering layer).

[0032] Optionally, a plurality of first protrusions 1312 are evenly distributed in a ring on the first side. These first protrusions 1312 serve to fix and support the entire overmolded component 10, preventing accidental axial movement or displacement that could lead to uneven or insufficient overmolding. Simultaneously, by increasing the contact area and forming an interlocking structure (with the outer coating layer), they improve the bonding strength between the overmolded component 10 and other components in subsequent assembly and molding (e.g., injection molding of an implant). For example, each first protrusion 1312 is shaped like a raised strip, and there are 16 of them, with two raised strips forming a group. Eight through holes 1311 are distributed between two first protrusions 1312 in a group.

[0033] Optionally, a plurality of second protrusions 1313 are provided on the second side in a ring-shaped evenly distributed manner. It can be understood that the cooperation of the plurality of first protrusions 1312 and the plurality of second protrusions 1313 on the opposite side can effectively support and limit the accidental displacement of the overmolded part 10 (for example, corresponding to the upper and lower mold surfaces of the injection mold in the subsequent overmolding process of the implant, respectively, fixing and limiting the entire overmolded part 10, ensuring that the coil 11 and communication antenna 12 are in the preset position and that the overmolding is uniform and without excessive glue in the final product, thus improving the quality of the finished product; at the same time, by forming protrusions on the opposite side, the contact area is increased and a mutually interlocking structure is formed with the outer covering layer, which is used to improve the bonding force between the overmolded part 10 and other components in subsequent overmolding processes (such as injection molding of the implant). For example, the shape of a single second protrusion 1313 is a boss, evenly distributed circumferentially, and the number is four.

[0034] Optionally, the inner ring of the first part 131 is provided with a plurality of third protrusions 1314 facing inward. The plurality of third protrusions 1314 are evenly distributed to facilitate the fitting and fixing of the rubber-coated part 10 with the corresponding structure in other components, prevent the rubber-coated part 10 from moving accidentally, and achieve circumferential limiting of it. For example, each third protrusion 1314 is an arc-shaped protrusion, and the number is 4.

[0035] Optionally, the first side surface is further provided with a plurality of fourth protrusions 1315, which are evenly distributed in a ring on the first side surface. The plurality of fourth protrusions 1315 and the plurality of second protrusions 1313 are arranged in a one-to-one correspondence with the first side surface and the second side surface. For example, a single fourth protrusion 1315 is a boss that is completely identical to a single second protrusion 1313, and the plurality of fourth protrusions 1315 are distributed at intervals, with each fourth protrusion 1315 located between two (a group of) first protrusions 1312; the number is four, and they are evenly distributed in the circumferential direction.

[0036] It is important to emphasize that the several fourth protrusions 1315, several first protrusions 1312, and several second protrusions 1313 can further cooperate to fix and support the entire overmolded part 10, preventing accidental axial movement or displacement of the overmolded part 10, which would lead to uneven or insufficient overmolding (especially the completely consistent and corresponding second protrusions 1313 and fourth protrusions 1315, which can ensure that the distance between the first and second sides of the overmolded part 10 and other components, such as the upper and lower mold surfaces of the whole machine injection mold, is consistent, ensuring that the overmolded part 10 can be in the center position of the whole machine injection mold). At the same time, by forming protrusions on the opposite sides, the contact area is increased and a mutually interlocking structure is formed with the outer covering layer, which is used to improve the bonding force between the overmolded part 10 and other components (such as feeders, etc.) in subsequent combined overmolding molding (such as overmolding injection molding of implants, etc.).

[0037] Optionally, in some embodiments, the second part 132 is cylindrical in shape, and one side of the second part 132 extends and transitions at a certain angle with one side of the annular part 131, so as to facilitate the formation of the entire encapsulated part 10 and even the brain-computer interface implant including the encapsulated part 10 to become a more portable, more convenient for contact and fixation with the skull and more in line with the human physiological structure miniaturized device.

[0038] Furthermore, combined Figures 1-4 As shown, in some embodiments, the flexible covering 13 further includes a third portion 133 and a fourth portion 134 connected to the side of the second portion 132 opposite to the first portion 131, the third portion 133 at least partially covering the first insulating tube 113, and the fourth portion 134 at least partially covering the second insulating tube 123.

[0039] Optionally, the flexible coating 13 may be made from one of silicone, silicon-derived materials, thermoplastic polyurethane, liquid ionic elastomer, thermoplastic elastomer and polyvinylidene fluoride, preferably a flexible fluid, such as liquid silicone.

[0040] In some embodiments, combined with Figures 5-7 As shown, a rubber-coating mold 50 is provided for molding the aforementioned rubber-coated part 10. The rubber-coating mold 50 includes a fixed mold 51 and a movable mold 52 adapted to the fixed mold 51. The fixed mold 51 is a rectangular metal plate, serving as the base of the rubber-coating mold 50, used to fix the individual coil 11 and communication antenna 12 in a preset relative position. The movable mold 52 is a rectangular metal plate corresponding to the fixed mold 51, and the movable mold 52 can move freely between being closely against the fixed mold 51 and being completely away from the fixed mold 51. Through the cooperation of the movable mold 52 and the fixed mold 51, the individual coil 11 and communication antenna 12 can be conveniently assembled without damaging the original structure of the coil 11 and communication antenna 12, and an integrated flexible covering 13 can be conveniently formed on the assembled coil 11 and communication antenna 12, thus molding the rubber-coated part 10.

[0041] Optionally, combined Figure 5 As shown, the fixed mold 51 and the moving mold 52 are connected along the first direction (i.e., the vertical direction), with the fixed mold 51 located below the moving mold 52.

[0042] For example, the height of the fixed mold 51 along the first direction is 10mm-13mm, the height of the moving mold 52 along the first direction is 10mm-13mm, the total height of the overmolding mold 50 after mold closing is 20mm-26mm, the length of the fixed mold 51 and the moving mold 52 along the second direction is 60mm-80mm, and the width along the third direction is 60mm-80mm.

[0043] Optionally, the fixed mold 51 includes a fixed mold cavity, i.e., a lower mold cavity, and the moving mold 52 includes a moving mold cavity, i.e., an upper mold cavity. The lower mold cavity, the upper mold cavity, and the corresponding mold surface surround to form a molding chamber. The molding chamber is used to accommodate the aforementioned coil 11 and communication antenna 12, and a flexible covering body 13 is formed around the coil 11 and communication antenna 12.

[0044] In some embodiments, the lower cavity of the fixed mold 51 includes a first fixed mold groove 511 and a second fixed mold groove 512 that are connected to each other. The first fixed mold groove 511 is used to accommodate and limit at least a portion of the coil 11. For example, the first fixed mold groove 511 is located in the middle of the fixed mold 51 and accommodates and limits the first lead body 111 of the coil 11. The second fixed mold groove 512 is used to accommodate and limit at least a portion of the communication antenna 12. For example, the second fixed mold groove 512 is located on one side of the first fixed mold groove 511 and accommodates and limits the second lead body 121.

[0045] It is worth emphasizing that the design of the first groove 511 and the second groove 512 of the fixed mold being connected can realize the integrated connection of the coil 11 and the communication antenna 12, while also dispersing the local stress of the flexible covering body 13, improving the structural stability of the finished product 10, and greatly improving the flexibility of subsequent product modifications.

[0046] In some embodiments, optionally, at least three mold bosses 5111 are evenly distributed circumferentially along the groove wall of the first mold groove 511. The first lead body 111 of the coil 11 is accommodated in the gap between the mold bosses 5111 and the groove wall of the first mold groove 511. The at least three mold bosses 5111 are used to radially limit the coil 11 and correspondingly form through holes 1311 in the first portion 131 that penetrate the first and second side surfaces. For example, as shown... Figure 7 As shown, there are 8 fixed mold bosses 5111.

[0047] It is important to emphasize that the fixed mold boss 5111 is not only used to radially limit the coil 11, but more importantly, it ensures that the aforementioned through hole 1311 is formed in the first part 131. The through hole 1311 provides space and possibility for improving the bonding force between the encapsulated part 10 and other components in subsequent assembly. For example, the encapsulated part 10 is further combined with the feedthrough and other components to form a brain-computer interface implant. The brain-computer interface implant formed by the combination needs to be encapsulated again outside the encapsulated part 10 of this application to form an outer covering layer covering the entire brain-computer interface implant. The existence of the through hole 1311 provided in this application allows flexible fluid to flow into the through hole 1311. At the same time, the flexible covering 13 (e.g., several through holes 1311, several first protrusions 1312, several second protrusions 1313, several third protrusions 1314 and several fourth protrusions 1315) form an interlocking structure with the outer covering layer to further improve the bonding force between the front and rear flexible coverings 13 and the outer covering layer.

[0048] In some embodiments, optionally, a plurality of first molding grooves 5112 are evenly distributed circumferentially near the bottom of the first molding groove 511 of the fixed mold, so as to form a second protrusion 1313 at the first molding groove 5112 of the fixed mold; by evenly distributing and correspondingly forming a plurality of second protrusions 1313 on the second side, the second protrusions 1313 are used to fix the entire overmolded part 10 and prevent the overmolded part 10 from accidentally moving or shifting axially. For example, the obtained coated part 10 is further combined with the feedthrough and other components to form a brain-computer interface implant. The brain-computer interface implant formed by the combination needs to be injection molded again on the coated part 10 of this application to form an outer covering layer covering the entire brain-computer interface implant. The several second protrusions 1313 provided in this application can fix the entire coated part 10 when it is in tangential contact with one side of the injection mold of the whole machine, so as to avoid uneven coating or insufficient glue caused by the coated part 10 moving upward during the injection process. At the same time, it can also further form an interlocking structure between the flexible covering body 13 and the outer covering layer to further improve the bonding force between the flexible covering body 13 and the outer covering layer.

[0049] In some embodiments, the bottom of the fixed mold second groove 512 is generally arc-shaped, used to accommodate and limit the second lead body 121 of the communication antenna 12, a portion of the first insulating tube 113 of the coil 11 and the first end 112 passing through the first insulating tube 113.

[0050] In some embodiments, the lower cavity of the fixed mold 51 includes a first lead groove 513, which communicates with the second groove 512 of the fixed mold, for accommodating a portion of the first insulating tube 113 of the coil 11 and a first end 112 passing through the first insulating tube 113, forming a third portion 133 covering a portion of the first insulating tube 113.

[0051] In some embodiments, the lower cavity of the fixed mold 51 includes a second lead groove 514, which communicates with the second groove 512 of the fixed mold and is used to accommodate the second insulating tube 123 and the second end 122 of the communication antenna 12 passing through the second insulating tube 123, forming a fourth portion 134 covering the second insulating tube 123.

[0052] It is particularly emphasized that the first lead groove 513 and the second lead groove 514 are arranged in parallel, and the first mold groove 511 and the second mold groove 512 are arranged in sequence. The first lead groove 513 and the second lead groove 514 are located on the side of the second mold groove 512 away from the first mold groove 511, so that the first mold groove 511, the second mold groove 512 and the parallel first lead groove 513 and the second lead groove 514 are arranged in sequence. The side of the first lead groove 513 and the second lead groove 514 that is not connected to the second mold groove 512 is provided with a clearance space 518. The clearance space 518 is used to accommodate the first insulating tube 113 that is not covered by the flexible covering body 13, the first end 112 passing through the first insulating tube 113, the second insulating tube 123, and the second end 122 passing through the second insulating tube 123.

[0053] In some embodiments, the fixed mold 51 is further provided with fixed mold overflow grooves 515. A plurality of fixed mold overflow grooves 515 are disposed on the periphery of the fixed mold first groove 511 and communicate with the fixed mold first groove 511. By providing fixed mold overflow grooves 515, it is possible to ensure that the molding cavity is fully filled while effectively reducing air bubbles in the flexible fluid (such as liquid silicone), thereby improving process robustness, production efficiency and product yield. For example, there are 3 fixed mold overflow grooves 515.

[0054] Understandably, by setting the lower cavity of the aforementioned structure, processing and scrap costs can be reduced, while facilitating the precise positioning of the individual coil 11 and communication antenna 12 before encapsulation, so as to form the aforementioned flexible covering body 13 with the upper cavity that is compatible with the moving mold 52, and finally obtain the encapsulated part 10.

[0055] In some embodiments, the upper cavity of the moving mold 52 includes a moving mold first groove 521, which corresponds to the fixed mold first groove 511 to form a first portion 131. The moving mold first groove 521 is provided with a plurality of moving mold first forming grooves 5211, so that the flexible covering 13 forms a plurality of first protrusions 1312 corresponding to the moving mold first forming grooves 5211. The plurality of first protrusions 1312 are evenly distributed on the second side surface of the flexible covering 13 to prevent accidental axial movement or displacement of the overmolded part 10, which could lead to uneven or insufficient overmolding. They also further increase the contact area between the flexible covering 13 and the outer covering layer, forming an interlocking structure and further improving the bonding force between the flexible covering 13 and the outer covering layer.

[0056] In some embodiments, a protrusion 5212 is provided on the bottom of the first groove 521 of the moving mold. The protrusion 5212 can abut against the bottom of the groove in the center of the first groove 511 of the fixed mold. A hollow hole 1316 is formed in the center of the corresponding part of the protrusion 5212, so that the first part 131 is generally annular. Further, a plurality of second forming grooves 52121 of the moving mold are recessed on the periphery of the protrusion 5212, so that a plurality of third protrusions 1314 are formed on the inner ring surface of the first part 131. The plurality of third protrusions 1314 are evenly distributed on the inner ring surface to prevent the overmolded part 10 from accidentally rotating or shifting in the circumference, resulting in uneven overmolding. At the same time, it can further increase the contact area between the flexible overmolded body 13 and the outer overmolded layer and form an interlocking structure, further improving the bonding force between the flexible overmolded body 13 and the outer overmolded layer.

[0057] Optionally, the top of the protrusion 5212 is provided with a limiting groove 52122, and the bottom of the groove of the first groove 511 of the fixed mold is provided with a limiting block 5113. The limiting block 5113 and the limiting groove 52122 cooperate to achieve circumferential limiting, so as to assist in the alignment and limiting between the moving mold 52 and the fixed mold 51.

[0058] In some embodiments, a third forming groove 5213 is provided in the first groove 521 of the moving mold, so that a plurality of fourth protrusions 1315 are formed on the third forming groove 5213 of the moving mold corresponding to the flexible covering body 13. The plurality of fourth protrusions 1315 are evenly distributed on the second side surface of the flexible covering body 13 to prevent the overmolded part 10 from accidentally moving or shifting, resulting in uneven or insufficient overmolding. At the same time, it can further increase the contact area between the flexible covering body 13 and the outer covering layer and form an interlocking structure, further improving the bonding force between the flexible covering body 13 and the outer covering layer.

[0059] In some embodiments, the moving mold 52 is provided with a glue inlet 522, which is connected to the upper cavity and the lower cavity. After the flexible fluid is injected into the upper cavity and the lower cavity through the glue inlet 522, it forms an integrally formed flexible covering body 13 on the coil 11 and the communication antenna 12.

[0060] In some embodiments, the overmolding mold 50 further includes a first insert 53. One end of the fixed mold second groove 512 may extend to provide a first positioning groove 516, which communicates with the fixed mold second groove 512. The first insert 53 can be embedded in the first positioning groove 516 and passes through the second lead body 121 of the communication antenna 12 to limit the communication antenna 12, prevent the communication antenna 12 from moving radially and axially accidentally, and prevent the communication antenna 12 from deforming during the glue injection process. For example, the first insert 53 is generally in the shape of a three-step rod. The thickest part is for easy handling and extends out of the overmolding mold 50. The middle part is for easy embedding in the first positioning groove 516. The thinnest end has an insertion end, which is convenient to pass through the first positioning groove 516 into the second lead body 121 of the communication antenna 12 to limit its radial and axial movement. The specific outer diameter of the insertion end is set according to the inner diameter of the communication antenna 12.

[0061] In some embodiments, the overmolding mold 50 further includes a second insert 54. A second positioning groove 517 extends from the other end of the fixed mold second groove 512, communicating with the fixed mold second groove 512. The second insert 54 is embedded in the second positioning groove 517 and abuts against a portion of the first end 112 to maintain the overall consistency of the flexible covering 13, facilitate boundary sealing, and distribute injection pressure. Optionally, the specific structure of the second insert 54 is the same as that of the first insert 53, with the thinnest end of the second insert 54 abutting against a portion of the first end 112 accommodated in the fixed mold second groove 512.

[0062] Specifically, to create sufficient space to accommodate the communication antenna 12 and the first insert 53 and the second insert 54, the moving mold 52 is provided with corresponding moving mold second grooves, moving mold first positioning grooves, and moving mold second positioning grooves on the fixed mold 51, corresponding to the fixed mold second groove 512, first positioning groove 516, and second positioning groove 517. These are not repeatedly marked in the accompanying drawings. When understanding the inventive concept of this application, unless otherwise specified, if it can be seen from the accompanying drawings that the moving mold 52 and the fixed mold 51 both have the same structure, it can be flexibly understood as an accommodating cavity formed by the moving mold 52 and the fixed mold 51.

[0063] Furthermore, the first insert 53 and the second insert 54 can be detachably connected to the moving mold 52 to achieve positioning. Specifically, the side wall of the first positioning groove 516 on the moving mold 52 is provided with a first positioning hole, and the periphery of the first insert 53 is provided with a first positioning pin 531, which is inserted into the first positioning hole to achieve positioning of the first insert 53 and the moving mold 52. The side wall of the second positioning groove 517 on the moving mold 52 is provided with a second positioning hole, and the periphery of the second insert 54 is provided with a second positioning pin 541, which is inserted into the second positioning hole to achieve positioning of the second insert 54 and the moving mold 52. Optionally, the first positioning pin 531 and the first insert 53 are an integral structure or a separate structure, and the second positioning pin 541 and the second insert 54 are an integral structure or a separate structure.

[0064] It is particularly important to emphasize that after the fixed mold 51 and the moving mold 52 are closed, the lower cavity of the fixed mold 51 (including the fixed mold first groove 511, fixed mold boss 5111, fixed mold first forming groove 5112, fixed mold second groove 512, first lead wire groove 513 and second lead wire groove 514) and the upper cavity of the moving mold 52 (including the moving mold first groove 521, moving mold second groove, moving mold first forming groove 5211, boss 5212, moving mold second forming groove 52121 and moving mold third forming groove 5213, etc.) and the corresponding mold surface are enclosed to form a forming cavity.

[0065] In some embodiments, the overmolding mold 50 further includes a connector 55. After the fixed mold 51 and the moving mold 52 are closed, the connector 55 is used to detachably connect the fixed mold 51 and the moving mold 52. For example, the connector 55 consists of a plurality of bolts and corresponding threaded holes. One of the bolts and the corresponding threaded holes is evenly distributed on the moving mold 52, and the other is correspondingly distributed on the fixed mold 51. The fixed mold 51 and the moving mold 52 are flexibly and detachably connected by bolts.

[0066] In some embodiments, the overmolding mold 50 further includes a guide member 56 for guiding and positioning. Optionally, the guide member 56 includes a plurality of positioning pins 561 and positioning holes 562. One of the moving mold 52 and the fixed mold 51 is provided with a plurality of positioning pins 561, and the other is provided with a plurality of positioning holes 562. The positioning pins 561 and the positioning holes 562 correspond one-to-one, and the positioning pins 561 can pass through the positioning holes 562.

[0067] For example, at least two positioning pins 561 are provided, symmetrically arranged on the fixed mold 51, and positioning holes 562 are provided on the moving mold 52. The position and number of positioning holes 562 correspond one-to-one with the positioning pins 561 of the fixed mold 51. The positioning holes 562 and the positioning pins 561 form a clearance fit to ensure the guiding accuracy of mold closing.

[0068] In some embodiments, such as Figure 8As shown, this application also provides a coating method, using a coating mold 50 as described above for coating the part 10, the coating method including: S100: Place a single coil 11 in a first preset position to limit the movement of the coil 11; Specifically, the first lead wire is wound in multiple turns using a coil winding fixture. After the winding is completed, a first lead wire body 111 and a first end 112 extending from both ends of the first lead wire body 111 are obtained. A first insulating tube 113 is correspondingly sleeved on the outside of each first end 112. The first end 112 passes through the first insulating tube 113 and is partially exposed outside the first insulating tube 113.

[0069] For example, the first lead body 111 is placed in the first groove 511 of the fixed mold. A plurality of fixed mold bosses 5111, evenly distributed along the circumferential direction of the groove wall, abut against the inner side of the first lead body 111, and the groove wall abuts against the outer side of the coil 11 for positioning. That is, the first lead body 111 is accommodated in the gap between the fixed mold bosses 5111 and the groove wall, preventing the coil 11 from moving on the fixed mold 51. Part of the two first ends 112 are accommodated in the second groove 512 of the fixed mold, extending from the second groove 512 to the first lead groove 513. The first ends 112 accommodated in the first lead groove 513 are covered with a first insulating tube 113, which is positioned within the first lead groove 513. Further, the first ends 112 pass through the first insulating tube 113 and are partially exposed outside the first insulating tube 113, extending into the clearance space 518.

[0070] S200: Place the communication antenna 12 in the second preset position and limit the movement of the communication antenna 12; Specifically, the second lead wire is spirally wound using a communication antenna winding fixture. After the winding is completed, a second lead wire body 121 and a second end 122 extending from one end of the first lead wire body 111 are obtained. A second insulating tube 123 is correspondingly sleeved on the outside of the second end 122. The second end 122 passes through the second insulating tube 123 and is partially exposed outside the second insulating tube 123.

[0071] For example, the second lead body 121 is accommodated at one end of the fixed mold second groove 512 away from the accommodating portion, the shape of the fixed mold second groove 512 is adapted to the second lead body 121, and the groove wall of the fixed mold second groove 512 limits the second lead body 121 to prevent it from moving within the fixed mold 51. Part of the second end 122 is accommodated in the second lead groove 514, and the second end 122 accommodated in the second lead groove 514 is covered with a second insulating tube 123, which limits the second lead groove 514. Further, the second end 122 passes through the second insulating tube 123 and is partially exposed outside the second insulating tube 123, extending into the clearance space 518.

[0072] S300, The first insert 53 is used to further limit the position of the communication antenna 12; Specifically, the first insert 53 is movably embedded in the first positioning groove 516 and passes through the second lead body 121, further achieving radial positioning while preventing the communication antenna 12 from deforming in subsequent processes. Furthermore, the first insert 53 can be detachably connected to the moving mold 52.

[0073] For example, the first insert 53 is in the shape of a three-step rod. The thickest part is for easy operation and gripping, the middle part is for easy embedding in the first positioning groove 516, and the thinnest end is provided with an insertion end, which is convenient to pass through the first positioning groove 516 into the second lead body 121 of the communication antenna 12 to achieve radial and axial limiting. The specific outer diameter of the insertion end is set according to the inner diameter of the communication antenna 12.

[0074] S400. Close and fix the fixed mold 51 and the moving mold 52. Specifically, when the coil 11, communication antenna 12, and insert are all placed inside the fixed mold 51, the moving mold 52 is closed and fixed, and the coil 11 and communication antenna 12 are located in the molding cavity formed by the fixed mold 51 and the moving mold 52. The limiting groove 52122 at the top of the protrusion 5212 engages with the limiting block 5113 at the bottom of the first groove 511 of the fixed mold, thereby achieving circumferential limiting of the moving mold 52 and the fixed mold 51, and is fixed by the connecting piece 55.

[0075] Optionally, when the fixed mold 51 and the moving mold 52 are closed, the fixed mold 51 and the moving mold 52 are guided and positioned by the guide member 56 to ensure the accuracy of the installation position. For example, the guide member 56 includes a plurality of positioning pins 561 and positioning holes 562. One of the moving mold 52 and the fixed mold 51 is provided with a plurality of positioning pins 561, and the other is provided with a plurality of positioning holes 562. The positioning pins 561 and the positioning holes 562 correspond one-to-one, and the positioning pins 561 can pass through the positioning holes 562.

[0076] Optionally, the fixed mold 51 and the moving mold 52 can be detachably connected via connector 55.

[0077] S500: Inject flexible fluid into the molding chamber to integrally mold a flexible covering 13 on the coil 11 and the communication antenna 12 to obtain the coated part 10. Specifically, flexible fluid is injected into the molding cavity formed by the closing of the fixed mold 51 and the moving mold 52 through the injection port 522 on the moving mold 52. This allows the flexible fluid to fill the molding cavity formed by the corresponding and adapted fixed mold first groove 511, fixed mold second groove 512, first lead wire groove 513, second lead wire groove 514, moving mold first groove 521, moving mold second groove, and corresponding mold surfaces in the fixed mold 51 and the moving mold 52.

[0078] Optionally, the flexible fluid is liquid silicone. The liquid silicone is mixed in a certain proportion, centrifuged and degassed, and then enters the molding cavity through the glue inlet 522. After heating and cooling to solidify, the flexible covering 13 is integrally formed on the coil 11 and the communication antenna 12, thus obtaining the overall coated part 10.

[0079] By employing the aforementioned encapsulation method, the coil 11 and communication antenna 12 are positioned and physically protected, thereby integrally forming a flexible covering 13 on the coil 11 and communication antenna 12, resulting in the encapsulated part 10. The overall operation is simple and reliable, and can greatly prevent deformation of the coil 11 and communication antenna 12 during assembly and connection.

[0080] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions of other embodiments. Different components and technologies in different embodiments can be freely combined and used with each other.

[0081] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the implementation of the present invention. Those skilled in the art can make other variations or modifications based on the above description. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the scope of protection of the claims of the present invention.

Claims

1. A brain-computer interface encapsulation component, comprising a coil (11), a communication antenna (12), and a flexible encapsulation body (13), wherein the coil (11) and the communication antenna (12) are encapsulated inside the flexible encapsulation body (13), and the coil (11), the communication antenna (12), and the flexible encapsulation body (13) are integrally connected.

2. The encapsulated component of the brain-computer interface according to claim 1, characterized in that, The coil (11) has a vortex ring structure and includes a first lead body (111) and a first end (112). The first lead body (111) is formed by winding the first lead multiple times. After winding, the two ends of the first lead body (111) extend out to form two first ends (112). And / or, the communication antenna (12) is in the shape of a helical spring, including a second lead body (121) and a second end (122). The second lead body (121) is formed by spirally winding a second lead. After the winding is completed, one end of the second lead body (121) extends to form the second end (122).

3. The encapsulated component of the brain-computer interface according to claim 2, characterized in that, The communication antenna (12) and the coil (11) are arranged side by side, with the center line of the coil (11) and the center line of the communication antenna (12) spaced apart and arranged at an angle; the flexible covering body (13) includes an integrally connected first part (131) and a second part (132), the first part (131) corresponds to the first lead body (111) covering the coil (11), and the second part (132) corresponds to the second lead body (121) covering the communication antenna (12) and part of the first end (112), the first part (131) and the second part (132) are arranged side by side and transitionally connected.

4. The encapsulated component of the brain-computer interface according to claim 3, characterized in that, The first part (131) is generally annular, including a first side and a second side disposed opposite to each other. The first part (131) has a plurality of through holes (1311) that penetrate the first side and the second side. The first side is provided with a plurality of first protrusions (1312) that are evenly distributed in a ring. The second side is provided with a plurality of second protrusions (1313) that are evenly distributed in a ring. The inner ring of the first part (131) is provided with a plurality of evenly distributed third protrusions (1314) that protrude inward. And / or, the second part (132) is cylindrical in shape, and one side of the second part (132) extends and transitions at a certain angle to one side of the first part (131).

5. The encapsulated component of the brain-computer interface according to claim 4, characterized in that, Two first end portions (112) are respectively fitted with first insulating tubes (113), the first end portions (112) pass through the first insulating tubes (113) and are partially exposed outside the first insulating tubes (113), the second end portions (122) are fitted with second insulating tubes (123), the second end portions (122) pass through the second insulating tubes (123) and are partially exposed outside the second insulating tubes (123); The flexible covering (13) includes a third part (133) and a fourth part (134) connected to the second part (132) on the side opposite to the first part (131), the third part (133) at least partially covering the first insulating tube (113), and the fourth part (134) at least partially covering the second insulating tube (123); And / or, the flexible covering (13) is prepared from one of silicone, silicon-derived materials, thermoplastic polyurethane, liquid ionic elastomer, thermoplastic elastomer and polyvinylidene fluoride.

6. A rubber-coating mold for molding a rubber-coated part of a brain-computer interface as described in any one of claims 1-5, the rubber-coating mold comprising a fixed mold (51) and a movable mold (52) adapted to the fixed mold (51), the movable mold (52) being able to move freely close to the fixed mold (51) or completely away from the fixed mold (51), the fixed mold (51) comprising a fixed mold cavity, the movable mold (52) comprising a movable mold cavity, the fixed mold cavity and the movable mold cavity and corresponding mold surfaces surrounding to form a molding chamber, the movable mold (52) being provided with a glue inlet (522), the glue inlet (522) communicating with the molding chamber; the molding chamber being used to accommodate the coil (11) and the communication antenna (12), and correspondingly covering the coil (11) and the communication antenna (12) to form a flexible covering body (13).

7. The overmolding mold according to claim 6, characterized in that, The mold cavity includes a first mold groove (511) and a second mold groove (512) that are connected to each other. The first mold groove (511) is used to accommodate and limit at least part of the coil (11); the second mold groove (512) is used to accommodate and limit at least part of the communication antenna (12).

8. The overmolding mold according to claim 7, characterized in that, The first groove of the fixed mold (511) has at least three fixed mold bosses (5111) evenly distributed around the groove wall. The first lead wire body (111) is housed in the gap between the fixed mold bosses (5111) and the groove wall. The fixed mold bosses (5111) form through holes (1311) on the overmolded part. The moving mold cavity includes a moving mold first groove (521), and the fixed mold first groove (511) and the moving mold first groove (521) are correspondingly arranged. The bottom of the moving mold first groove (521) is provided with a plurality of moving mold first forming grooves (5211) evenly distributed along the circumference. The moving mold first forming grooves (5211) are corresponding to the formation of a plurality of first protrusions (1312) on the overmolded part. The bottom of the fixed mold first groove (511) is provided with a plurality of fixed mold first forming grooves (5112) evenly distributed along the circumference. The fixed mold first forming grooves (5112) are corresponding to the formation of a plurality of second protrusions (1313) on the overmolded part.

9. The overmolding mold according to claim 8, characterized in that, The fixed mold cavity further includes a first lead wire groove (513) and a second lead wire groove (514). The first lead wire groove (513) and the second lead wire groove (514) are arranged in parallel. The fixed mold first groove (511) and the fixed mold second groove (512) are arranged in sequence. The first lead wire groove (513) and the second lead wire groove (514) are located on the side of the fixed mold second groove (512) away from the fixed mold first groove (511). The side of the first lead wire groove (513) and the second lead wire groove (514) that is not connected to the fixed mold second groove (512) is provided with a clearance space (518). And / or, the fixed mold (51) is further provided with a fixed mold overflow groove (515), which is connected to the first groove (511) of the fixed mold.

10. The overmolding mold according to claim 9, characterized in that, The moving mold first groove (521) is provided with a protrusion (5212), the protrusion (5212) can abut against the bottom of the groove in the center of the fixed mold first groove (511), and the protrusion (5212) corresponds to forming a hollow hole (1316) in the overmolded part; And / or, the protrusion (5212) is provided with a plurality of moving mold second forming grooves (52121) on its periphery so that the inner ring face of the hollow hole (1316) forms a plurality of third protrusions (1314); And / or, the top of the protrusion (5212) is provided with a limiting groove (52122), and the bottom of the first groove (511) of the fixed mold is provided with a limiting block (5113). The limiting groove (52122) and the limiting block (5113) cooperate to achieve circumferential limiting.

11. The overmolding mold according to claim 10, characterized in that, It also includes a first insert (53), one end of the fixed mold second groove (512) can be extended to provide a first positioning groove (516), the first positioning groove (516) communicates with the fixed mold second groove (512), the first insert (53) is movably embedded in the first positioning groove (516) and passes through the second lead body (121); And / or, it also includes a second insert (54), the other end of the fixed mold second groove (512) may be provided with a second positioning groove (517), the second positioning groove (517) communicates with the fixed mold second groove (512), the second insert (54) is movably embedded in the second positioning groove (517) and abuts against the first insulating tube (113); And / or, the first insert (53) and the second insert (54) may be detachably connected to the moving mold (52), respectively; And / or, also includes a connector (55) for detachably connecting the fixed mold (51) and the moving mold (52); And / or, it also includes a guide (56), the guide (56) including a plurality of positioning pins (561) and a plurality of positioning holes (562), the positioning pins (561) and the positioning holes (562) corresponding one to one, one of the positioning pins (561) and the positioning holes (562) being provided in the fixed mold (51) and the other being provided in the moving mold (52).

12. A method for overmolding, using an overmolding mold as described in any one of claims 6-11, the overmolding method comprising: The coil (11) is placed in the first preset position to limit the coil (11); The communication antenna (12) is placed in the second preset position to limit the position of the communication antenna (12); The communication antenna (12) is further limited by the first insert (53); The fixed mold (51) and the moving mold (52) are closed and fixed, and the coil (11) and the communication antenna (12) are located in the molding cavity formed by the fixed mold (51) and the moving mold (52); A flexible fluid is injected into the molding chamber, and a flexible covering (13) is integrally formed on the coil (11) and the communication antenna (12) to obtain a coated part.