A power supply chip and a power conversion device

Abstract

The application provides a power supply chip and a power conversion device. The power supply chip comprises a packaging substrate, the packaging substrate is provided with a first sub-chip and a second sub-chip, and a transformer and an isolator for isolating a power supply module. The first sub-chip comprises a non-isolated power supply module. The second sub-chip comprises a first isolated power supply secondary side module of the isolated power supply module. The first sub-chip further comprises an isolated power supply primary side module of the isolated power supply module; or the packaging substrate is further provided with a third sub-chip, and the third sub-chip comprises an isolated power supply primary side module of the isolated power supply module. In the power supply chip, the non-isolated power supply module and the isolated power supply module can be integrated in the sub-chip, and the non-isolated power supply module can convert the input voltage of the power supply chip into a first voltage signal, and the first voltage signal is within the input voltage range of the isolated power supply module, thereby widening the input voltage range of the power supply chip without significantly increasing the board area and chip power consumption.

Description

Technical Field

[0001] This application relates to the field of power electronics technology, and in particular to a power supply chip and a power conversion device. Background Technology

[0002] In the field of power electronics, switching power supply systems are increasingly widely used. The circuit board of a switching power supply system typically includes semiconductor switching devices (such as MOSFETs, transistors, and SCRs), rectifiers, and switching transformers. To enable the semiconductor switching devices to turn on, turn off, and maintain conduction, the circuit board of a switching power supply system may also include isolation power chips, driver chips, and other circuits driven by the driver chip that contain various semiconductor switching devices. The isolation power chip supplies power to the driver chip.

[0003] However, existing isolated power supply chips require a certain input voltage range to output their rated voltage, which limits their use in scenarios with large input voltage variations. Therefore, expanding the input voltage range of power supply chips without significantly increasing board area or chip power consumption has become an urgent technical problem to be solved. Summary of the Invention

[0004] This application provides a power chip and a power conversion device to broaden the input voltage range of the power chip without significantly increasing the board area and chip power consumption.

[0005] In a first aspect, this application provides a power supply chip. The power supply chip includes a non-isolated power module and an isolated power module. The non-isolated power module converts an input voltage signal of the power supply chip into a first voltage signal and inputs the first voltage signal to the isolated power module. The voltage amplitude of the first voltage signal is within the input voltage range of the isolated power module. The isolated power module converts the first voltage signal into an output voltage signal. The power supply chip also includes a packaging substrate, a first sub-chip, and a second sub-chip, which are located on the packaging substrate. Specifically, in the configuration of the non-isolated power module and the isolated power module, the non-isolated power module is located within the first sub-chip. The isolated power module includes an isolated power primary-side module, a transformer, a first isolated power secondary-side module, and an isolator. The transformer and isolator are located on the packaging substrate, and the first isolated power secondary-side module is located within the second sub-chip. The isolated power primary-side module may be located within the first sub-chip, or the power supply chip may further include a third sub-chip located on the packaging substrate, in which the isolated power primary-side module may be located within the third sub-chip.

[0006] The power chip of this application includes a non-isolated power module and an isolated power module. The non-isolated power module and the isolated power module can be integrated into a sub-chip, so that the non-isolated power module does not significantly increase the board area and chip power consumption. In addition, even if the input voltage of the power chip is not within the input voltage range of the isolated power module, the input voltage can be converted to a voltage that meets the input voltage range through pre-regulation of the non-isolated power module, thereby widening the input voltage range of the power chip.

[0007] The aforementioned non-isolated power supply module may specifically include a non-isolated DC-DC circuit and a first driving circuit. The first driving circuit outputs a first driving signal to the non-isolated DC-DC circuit based on a first voltage signal. The non-isolated DC-DC circuit is a buck-boost circuit, which includes an inductor; the inductor is located on the packaging substrate, or the inductor is located within a first sub-chip. In this technical solution, the first driving circuit can feed back the first voltage signal and participate in the calculation to generate a control signal, which can control the on and off of the four switching transistors, thereby regulating the stability of the first voltage signal. This non-isolated DC-DC circuit has advantages such as simple structure, low manufacturing cost, high conversion efficiency, small size, and wide output voltage adjustment range.

[0008] Additionally, the power chip may include a first voltage-regulating capacitor, one end of which is connected to the output terminal of the non-isolated power module, and the other end of which is grounded. The first voltage-regulating capacitor stores and releases electrical energy in the circuit. When the first voltage signal decreases, it releases the stored energy to prevent the voltage input to the isolated power module from becoming too low, thereby maintaining the stability of the first voltage signal.

[0009] The aforementioned power chip may further include a first output voltage regulator capacitor, one end of which is connected to the output terminal of the first isolated power supply secondary module, and the other end of which is grounded. The first output voltage regulator capacitor can store and release electrical energy in the circuit. When the voltage signal output by the first isolated power supply secondary module decreases, it releases the stored electrical energy to prevent the voltage signal from becoming too low, thereby maintaining the stability of the voltage signal.

[0010] The aforementioned primary-side module of the isolated power supply may specifically include an isolated DC-DC circuit and a second drive circuit. The isolated DC-DC circuit converts a first voltage signal into a second voltage signal and inputs the second voltage signal to a transformer. The transformer couples the second voltage signal into a third voltage signal and inputs the third voltage signal to the secondary-side module of the first isolated power supply. The secondary-side power supply of the first isolated power supply converts the third voltage signal into a first output voltage signal, and an isolator inputs the first output voltage signal to the isolated DC-DC circuit. The second drive circuit outputs a second drive signal to the isolated DC-DC circuit based on the voltage signal output by the isolator. In this technical solution, the second drive circuit can feed back the first output voltage signal and participate in the calculation to generate a control signal, which can control the on / off state of the switching transistor in the isolated DC-DC circuit, thereby regulating the stability of the first output voltage signal.

[0011] Furthermore, the power supply chip can be applied to multi-output applications. For example, an isolated power supply module may include at least two electrically isolated outputs. In one technical solution, the power supply chip may also include a fourth sub-chip located on the packaging substrate. The isolated power supply module also includes a second isolated power supply secondary module, which is located within the fourth sub-chip. A transformer is also used to couple a second voltage signal into a fourth voltage signal and input the fourth voltage signal to the second isolated power supply secondary module. The second isolated power supply secondary module is used to convert the fourth voltage signal into a second output voltage signal. The first and second isolated power supply secondary modules are respectively located within different sub-chips, which achieves both electrical isolation and reduces the total board area occupied by the isolated power supply secondary modules.

[0012] The aforementioned power chip may further include a second output voltage regulator capacitor. One end of the second output voltage regulator capacitor is connected to the output terminal of the second isolated power supply secondary module, and the other end of the second output voltage regulator capacitor is grounded. The second output voltage regulator capacitor can store and release electrical energy in the circuit. When the second output voltage signal decreases, it can release the stored electrical energy to prevent the second output voltage signal from becoming too low, thereby maintaining the stability of the second output voltage signal.

[0013] In the aforementioned power supply chip, the relative positions of the transformer and each sub-chip on the packaging substrate are not limited. When the power supply chip includes a first sub-chip, a second sub-chip, and a fourth sub-chip, the first and second sub-chips can be arranged side-by-side on one side of the transformer, and the fourth sub-chip can be located on the side of the transformer away from the first sub-chip. When the power supply chip includes a first sub-chip, a second sub-chip, a third sub-chip, and a fourth sub-chip, the first and fourth sub-chips are arranged side-by-side on one side of the transformer, and the second and third sub-chips are arranged side-by-side on the side of the transformer away from the first sub-chip. The first sub-chip can be arranged opposite the second sub-chip, and the third sub-chip can be arranged opposite the fourth sub-chip.

[0014] In the isolated power supply module of this application, the topology of the isolated DC-DC circuit is not specifically limited, for example, it can be a full-bridge circuit or a full-bridge LLC circuit.

[0015] In this application, the circuitry of the first sub-chip and the packaging substrate can be electrically connected via bonding wires or pins. The first sub-chip and the third sub-chip can also be electrically connected via bonding wires or pins. Therefore, the non-isolated power module and the isolated power module are disposed within the sub-chip and can be electrically connected to the circuitry via bonding wires or pins, which simplifies the wiring design of the non-isolated power module and the isolated power module, and also improves the overall power consumption of the power chip.

[0016] In addition, the power supply chip may also include an input voltage regulator capacitor. One end of the input voltage regulator capacitor is connected to the input terminal of the non-isolated power supply module, and the other end is grounded. The input voltage regulator capacitor can store and release electrical energy in the circuit. When the input voltage signal decreases, the stored electrical energy can be released to prevent the input voltage signal from becoming too low, thereby maintaining the stability of the input voltage signal.

[0017] Secondly, this application also provides a power conversion device. The power conversion device includes a circuit board, power devices, and a power chip as described in the first aspect. The power devices and the power chip are disposed on the circuit board, and the power chip is used to supply power to the power devices. This power conversion device can achieve a wide input voltage range without significantly increasing its size. Attached Figure Description

[0018] Figure 1 This is a schematic diagram illustrating the application of the power chip provided in the embodiments of this application;

[0019] Figure 2 A schematic diagram of a power chip provided in an embodiment of this application;

[0020] Figure 3 A circuit diagram of a power chip provided in an embodiment of this application;

[0021] Figure 4 Another schematic diagram of the power chip provided in the embodiments of this application;

[0022] Figure 5 Another circuit diagram of the power chip provided in the embodiments of this application;

[0023] Figure 6 Another schematic diagram of the power chip provided in the embodiments of this application;

[0024] Figure 7 Another schematic diagram of the power chip provided in the embodiments of this application;

[0025] Figure 8Another circuit diagram of the power chip provided in the embodiments of this application;

[0026] Figure 9 Another circuit diagram of the power chip provided in the embodiments of this application;

[0027] Figure 10 Another schematic diagram of the power chip provided in the embodiments of this application;

[0028] Figure 11 Another schematic diagram of the power chip provided in the embodiments of this application;

[0029] Figure 12 Another schematic diagram of the power chip provided in the embodiments of this application;

[0030] Figure 13 Another schematic diagram of the power chip provided in an embodiment of this application.

[0031] Figure label:

[0032] 10-Power Chip

[0033] 20-Driver Chip

[0034] 30-Power Devices

[0035] 11-Non-isolated power supply module

[0036] 12-Isolation Power Supply Module

[0037] 13-Packaging substrate

[0038] 14-First Sub-chip

[0039] 15-Second Sub-chip

[0040] 16-Third Sub-chip

[0041] 17-Fourth Sub-chip

[0042] 111 - Non-isolated DC-DC circuit

[0043] 112-First driving circuit

[0044] 121-Isolation Power Supply Primary Side Module

[0045] 122-Transformer

[0046] 123-First Isolation Power Supply Secondary Module

[0047] 124-Isolator

[0048] 125-Isolated DC-DC Circuit

[0049] 126-Second Drive Circuit

[0050] 127-Second Isolation Power Supply Secondary Module Detailed Implementation

[0051] To make the objectives, technical solutions, and advantages of this application clearer, the application will now be described in further detail with reference to the accompanying drawings.

[0052] To facilitate understanding of the power chip and power conversion device provided in the embodiments of this application, their application scenarios are described below. Figure 1 This is a schematic diagram illustrating the application of the power supply chip provided in an embodiment of this application. For example... Figure 1 As shown, the power chip 10 can be applied to power supply systems such as uninterruptible power supply (UPS) systems, photovoltaic systems, power station systems, and vehicle batteries. Specifically, the power chip 10 can be applied to the switching power supply system of the power supply system. The power conversion device can be an isolated power supply, which is a power supply design that electrically isolates the input and output circuits through components such as transformers and optocouplers. This can be used to prevent direct current flow, ensuring the safety and anti-interference capability of the isolated power supply. The isolated power supply may include a circuit board, on which the power chip 10 is mounted. In addition, the circuit board may also be equipped with semiconductor switching devices, switching transformers, and rectifiers, which can realize the functions of turning on, turning off, and maintaining conduction of semiconductor switching devices. The circuit board also includes a driver chip 20 and a power device 30. The power chip 10 supplies power to the driver chip 20 so that the driver chip 20 can drive the power device 30 to perform power conversion.

[0053] Existing isolated power supply chips employ isolated power supply circuits to regulate the input voltage of the power supply chip to the rated voltage required by the driver chip. However, because this isolated power supply circuit needs to meet a certain input voltage range when outputting the rated voltage, this requirement limits the use of the power supply chip in scenarios with large input voltage variations.

[0054] In view of this, this application provides a power chip and a power conversion device to broaden the input voltage range of the power chip without significantly increasing the board area and chip power consumption. The power chip of this application integrates multiple sub-chips, and non-isolated power modules and isolated power modules can be integrated within the sub-chips. The non-isolated power module can pre-adjust the input voltage of the power chip to meet the input voltage range of the isolated power module, thus eliminating the need for the isolated power module to consider input voltage variations. This allows the power chip to be applied to scenarios with different input voltages (e.g., UPS, photovoltaic, power station applications) and scenarios with large input voltage variations (e.g., automotive batteries).

[0055] It should be noted that the terminology used in the following embodiments is for the purpose of describing specific embodiments only and is not intended to be a limitation of this application. As used in the specification and appended claims of this application, the singular expressions “a,” “an,” “the,” “the,” “the,” and “this” are intended to also include expressions such as “one or more,” unless the context clearly indicates otherwise.

[0056] References to "one embodiment" or "some embodiments" as described in this specification mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized.

[0057] The structure of the power chip will be explained in detail below. Figure 2 This is a schematic diagram of a power chip provided in an embodiment of this application. Figure 3 This is a circuit diagram of a power supply chip provided in an embodiment of this application. Figure 2 and Figure 3 As shown, in terms of module structure, the power chip 10 includes a non-isolated power module 11 and an isolated power module 12. The non-isolated power module 11 converts the input voltage signal Vin of the power chip 10 into a first voltage signal V1, and inputs the first voltage signal V1 to the isolated power module 12. The voltage amplitude of the first voltage signal V1 is within the input voltage range of the isolated power module 12. The isolated power module 12 converts the first voltage signal V1 into an output voltage signal Vout. In this embodiment, even if the input voltage of the power chip 10 is not within the input voltage range of the isolated power module 12, the pre-adjustment by the non-isolated power module 11 can convert the input voltage to a voltage that meets the input voltage range, thereby widening the input voltage range of the power chip 10.

[0058] Specifically, in terms of mechanical structure, the power chip 10 may include a packaging substrate 13, a first sub-chip 14, and a second sub-chip 15, with the first sub-chip 14 and the second sub-chip 15 located on the packaging substrate 13. The isolated power module 12 includes an isolated power primary-side module 121, a transformer 122, a first isolated power secondary-side module 123, and an isolator 124. The non-isolated power module 11 is integrated within the first sub-chip 14, the first isolated power secondary-side module 123 is integrated within the second sub-chip 15, and the transformer 122 and the isolator 124 are integrated on the packaging substrate 13. In this embodiment, the first sub-chip 14 and the second sub-chip 15 may be arranged side-by-side on the same side of the transformer 122. Alternatively, the first sub-chip 14 and the second sub-chip 15 may be arranged opposite each other on opposite sides of the transformer 122. Alternatively, the first sub-chip 14 and the second sub-chip 15 may be arranged on adjacent sides of the transformer 122.

[0059] like Figure 2 As shown, in some embodiments, the isolated power supply primary-side module 121 can be integrated into the first sub-chip 14, thereby integrating the non-isolated power supply module 11 and the isolated power supply primary-side module 121 into the first sub-chip 14. The non-isolated power supply module 11 can be electrically connected to the isolated power supply primary-side module 121 through bonding wires or the packaging substrate 13 of the first sub-chip 14. Figure 4 Another schematic diagram of the power chip provided in an embodiment of this application. (See diagram below.) Figure 4As shown, in some other embodiments, the non-isolated power module 11, the isolated power primary-side module 121, and the first isolated power secondary-side module 123 are integrated into different sub-chips. Specifically, the power chip 10 may also include a third sub-chip 16 located on the packaging substrate 13, with the isolated power primary-side module 121 located within the third sub-chip 16. In the above embodiments, both the non-isolated power module 11 and the isolated power module 12 can be integrated into the sub-chip, so that the addition of the non-isolated power module 11 does not significantly increase the board area and power consumption of the power chip 10. The board area of ​​the power chip 10 refers to the space occupied by the power chip 10 on the circuit board of the isolated power supply. The first sub-chip 14 and the third sub-chip 16 can also be electrically connected via bonding wires or pins. Therefore, by placing the non-isolated power module 11 and the isolated power module 12 within the sub-chip and electrically connecting them to the circuit via bonding wires or pins, the routing design of the non-isolated power module 11 and the isolated power module 12 can be simplified, and the overall power consumption of the power chip 10 can be improved. The first sub-chip 14, the second sub-chip 15, and the third sub-chip 16 can be arranged side-by-side on the same side of the transformer 122. Alternatively, two of the sub-chips 14, 15, and 16 can be arranged on one side of the transformer 122, and the third sub-chip can be arranged on the other side. For example, the first sub-chip 14 and the second sub-chip 15 can be arranged opposite each other on opposite sides of the transformer 122, and the third sub-chip 16 can be arranged side-by-side with any one of the first or second sub-chips 14 on the same side of the transformer 122.

[0060] When the power chip 10 is operating, the non-isolated power module 11 converts the input voltage signal Vin into a first voltage signal V1 and inputs the first voltage signal V1 to the primary-side isolated power module 121, wherein the voltage amplitude of the first voltage signal V1 is within the input voltage range of the primary-side isolated power module 121. The primary-side isolated power module 121 converts the first voltage signal V1 into a second voltage signal and inputs the second voltage signal to the transformer 122. The transformer 122 couples the second voltage signal into a third voltage signal and inputs the third voltage signal to the secondary-side isolated power module 123. The secondary-side isolated power module converts the third voltage signal into a first output voltage signal Vout1 of the power chip 10 and inputs the first output voltage signal Vout1 to the primary-side isolated power module 121 via the isolator 124. The isolator 124 can be a transformer, a capacitor isolator, or an optocoupler isolator; no specific limitation is made here.

[0061] Figure 5 Another circuit diagram of the power chip provided in an embodiment of this application is shown. Figure 5As shown, the aforementioned non-isolated power module 11 may specifically include a non-isolated DC-DC circuit 111 and a first drive circuit 112. The first drive circuit 112 is used to output a first drive signal to the non-isolated DC-DC circuit 111 based on a first voltage signal V1. The non-isolated DC-DC circuit 111 is a buck-boost circuit, such as a four-switch buck-boost (FSBB) circuit. This buck-boost circuit includes an inductor L1. In some embodiments, such as... Figure 2 and Figure 4 As shown, inductor L1 can be integrated together with transformer 122 on package substrate 13. Figure 6 This is another schematic diagram of the power chip provided in an embodiment of this application. Figure 7 Another schematic diagram of the power chip provided in an embodiment of this application. (See diagram below.) Figure 6 and Figure 7 As shown, in some other embodiments, inductor L1 can be integrated with other components of the non-isolated power module 11 within the first sub-chip 14. In the above embodiments, the first drive circuit 112 can feed back the first voltage signal V1 and participate in the calculation to generate a control signal, which can control the on and off of the four switching transistors, thereby regulating the stability of the first voltage signal V1. This non-isolated DC-DC circuit 111 has advantages such as simple structure, low manufacturing cost, high conversion efficiency, small size, and wide output voltage adjustment range.

[0062] In the above embodiments, the non-isolated DC-DC circuit 111 has a simple structure and low manufacturing cost. It does not require complex transformers and other isolation components, resulting in lower manufacturing costs and a smaller board area. The board area of ​​the non-isolated DC-DC circuit 111 refers to the space occupied by the non-isolated DC-DC circuit 111 on the packaging substrate 13. This non-isolated DC-DC circuit 111 exhibits less energy loss and higher conversion efficiency during power conversion. Furthermore, the non-isolated DC-DC circuit 111 achieves a wide range of output voltage regulation by changing the duty cycle of the switching transistor, thereby enabling the power chip 10 to be used in different input voltage scenarios.

[0063] The aforementioned primary-side module 121 of the isolated power supply may specifically include an isolated DC-DC circuit 125 and a second drive circuit 126. The isolated DC-DC circuit 125 is used to convert a first voltage signal V1 into a second voltage signal and input the second voltage signal to a transformer 122. The transformer 122 is used to couple the second voltage signal into a third voltage signal and input the third voltage signal to the secondary-side module 123 of the first isolated power supply. The secondary-side power supply of the first isolated power supply is used to convert the third voltage signal into a first output voltage signal Vout1, and the isolator 124 is used to input the first output voltage signal Vout1 to the isolated DC-DC circuit 125. The second drive circuit 126 is used to output a second drive signal to the isolated DC-DC circuit 125 based on the voltage signal output by the isolator 124. In this technical solution, the second drive circuit 126 can feed back the first output voltage signal Vout1 and participate in the calculation to generate a control signal, which can control the switching transistor of the isolated DC-DC circuit 125 to turn on and off, thereby regulating the stability of the first output voltage signal Vout1.

[0064] In the isolated power supply module 12 of this application, the topology of the isolated DC-DC circuit 125 can be a full-bridge LLC circuit, a full-bridge circuit, an LC self-resonant circuit, a half-bridge LLC circuit, a half-bridge circuit, or a flyback circuit, etc., and this application does not impose specific limitations. Figure 5 As shown, in one embodiment, the isolated DC-DC circuit 125 can be a full-bridge LLC circuit. Figure 8 Another circuit diagram of the power chip provided in an embodiment of this application is shown. Figure 8 As shown, in another embodiment, the isolated DC-DC circuit 125 can be a full-bridge circuit. When the power chip 10 is working, in the isolated power module 12, the first voltage signal V1 is converted into an AC voltage signal by the full-bridge LLC circuit or full-bridge circuit of the primary-side isolated power module 121, and then transmitted to the secondary-side first isolated power module 123 via transformer 122. After being rectified by rectifier diodes, it is converted into a DC first output voltage. The second drive circuit 126 can control the switching transistors of the full-bridge LLC circuit or full-bridge circuit, so that the output voltage of the isolated power module 12 meets the drive voltage of the drive chip.

[0065] like Figure 3 , Figure 5 and Figure 8As shown, the power chip 10 may further include a first voltage-regulating capacitor C1. One end of the first voltage-regulating capacitor C1 is connected to the output terminal of the non-isolated power module 11, and the other end of the first voltage-regulating capacitor C1 is grounded. The first voltage-regulating capacitor C1 can store and release electrical energy in the circuit. When the first voltage signal V1 decreases, it can release the stored electrical energy to prevent the voltage of the input isolated power module 12 from being too low, thereby maintaining the stability of the first voltage signal V1. In addition, the power chip 10 may further include a first output voltage-regulating capacitor Cout1. One end of the first output voltage-regulating capacitor Cout1 is connected to the output terminal of the first isolated power secondary module 123, and the other end of the first output voltage-regulating capacitor Cout1 is grounded. The first output voltage-regulating capacitor Cout1 can store and release electrical energy in the circuit. When the voltage signal output by the first isolated power secondary module 123 decreases, it can release the stored electrical energy to prevent the voltage signal from being too low, thereby maintaining the stability of the voltage signal. The first voltage-regulating capacitor C1 is located within the power chip 10. Of course, in some other embodiments, the first voltage regulator capacitor C1 may also be located outside the power chip 10 and disposed on the circuit board of the isolated power supply, and the first voltage regulator capacitor C1 and the output terminal of the non-isolated power supply module 11 may be electrically connected through the pins of the power chip 10.

[0066] In addition, the power chip 10 may also include an input voltage regulator capacitor Cin, one end of which is connected to the input terminal of the non-isolated power module 11, and the other end of which is grounded. The input voltage regulator capacitor Cin can store and release electrical energy in the circuit. When the input voltage signal Vin decreases, the stored electrical energy can be released to prevent the input voltage signal Vin from becoming too low, thereby maintaining the stability of the input voltage signal Vin.

[0067] Furthermore, the power chip 10 can be applied to multi-output applications. For example, the isolated power module 12 may include at least two electrically isolated outputs. Figure 9 This is another circuit diagram of the power chip provided in an embodiment of this application. Figure 10 Another schematic diagram of the power chip provided in an embodiment of this application. (See diagram below.) Figure 9 and Figure 10As shown, in one embodiment, the power chip 10 may further include a fourth sub-chip 17 located on the packaging substrate 13. The isolated power module 12 also includes a second isolated power secondary module 127, which is located within the fourth sub-chip 17. The transformer 122 is further used to couple a second voltage signal into a fourth voltage signal and input the fourth voltage signal to the second isolated power secondary module 127. The second isolated power secondary module 127 is used to convert the fourth voltage signal into a second output voltage signal Vout2. The first isolated power secondary module 123 and the second isolated power secondary module 127 are respectively disposed in different sub-chips, which can achieve electrical isolation and reduce the total board area occupied by the isolated power secondary modules.

[0068] like Figure 9 As shown, the power chip 10 may further include a second output voltage regulator capacitor Cout2. One end of the second output voltage regulator capacitor Cout2 is connected to the output terminal of the second isolation power supply secondary module 127, and the other end of the second output voltage regulator capacitor Cout2 is grounded. The second output voltage regulator capacitor Cout2 can store and release electrical energy in the circuit. When the second output voltage signal Vout2 decreases, it can release the stored electrical energy to prevent the second output voltage signal Vout2 from becoming too low, thereby maintaining the stability of the second output voltage signal Vout2.

[0069] Figure 11 Another schematic diagram of the power chip provided in an embodiment of this application. (See diagram below.) Figure 10 and Figure 11 As shown, inductor L1 can be integrated together with transformer 122 on package substrate 13. Figure 12 This is another schematic diagram of the power chip provided in an embodiment of this application. Figure 13 Another schematic diagram of the power chip provided in an embodiment of this application. (See diagram below.) Figure 12 and Figure 13 As shown, inductor L1 can be integrated with other devices in the non-isolated power module 11 within the first sub-chip 14.

[0070] Two of the three sub-chips—first sub-chip 14, second sub-chip 15, and fourth sub-chip 17—are located on one side of transformer 122, and the other sub-chip is located on the other side of transformer 122. For example, as... Figure 10 and Figure 12 As shown, the first sub-chip 14 and the second sub-chip 15 can be arranged side by side on one side of the transformer 122, and the fourth sub-chip 17 can be arranged on the side of the transformer 122 away from the first sub-chip 14. That is, the fourth sub-chip 17 can be arranged opposite to the first sub-chip 14 on both sides of the transformer 122, and the fourth sub-chip 17 can be arranged opposite to the second sub-chip 15 on both sides of the transformer 122.

[0071] Two of the following sub-chips—first sub-chip 14, second sub-chip 15, third sub-chip 16, and fourth sub-chip 17—are located on one side of transformer 122, and the other two sub-chips are located on the other side of transformer 122. For example... Figure 11 and Figure 13 As shown, the first sub-chip 14 and the fourth sub-chip 17 are arranged side by side on one side of the transformer 122, and the second sub-chip 15 and the third sub-chip 16 are arranged side by side on the other side of the transformer 122. The first sub-chip 14 and the third sub-chip 16 are arranged opposite each other on both sides of the transformer 122, and the second sub-chip 15 and the fourth sub-chip 17 are arranged opposite each other on both sides of the transformer 122.

[0072] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A power supply chip, characterized in that, The power chip includes a non-isolated power module and an isolated power module. The non-isolated power module converts the input voltage signal of the power chip into a first voltage signal and inputs the first voltage signal to the isolated power module. The voltage amplitude of the first voltage signal is within the input voltage range of the isolated power module. The isolated power module converts the first voltage signal into an output voltage signal. The power chip further includes a packaging substrate, and a first sub-chip and a second sub-chip located on the packaging substrate; the non-isolated power module is located within the first sub-chip; the isolated power module includes an isolated power primary-side module, a transformer, a first isolated power secondary-side module, and an isolator, the transformer and the isolator being located on the packaging substrate, and the first isolated power secondary-side module being located within the second sub-chip; the isolated power primary-side module is located within the first sub-chip, or the power chip further includes a third sub-chip located on the packaging substrate, and the isolated power primary-side module being located within the third sub-chip.

2. The power chip as described in claim 1, characterized in that, The non-isolated power module includes a non-isolated DC-DC circuit and a first driving circuit. The first driving circuit is used to output a first driving signal to the non-isolated DC-DC circuit based on the first voltage signal. The non-isolated DC-DC circuit is a buck-boost circuit, which includes an inductor; the inductor is located on the packaging substrate, or the inductor is located within the first sub-chip.

3. The power chip as described in claim 1 or 2, characterized in that, The power chip also includes a first voltage regulator capacitor, one end of which is connected to the output terminal of the non-isolated power module, and the other end of which is grounded; the first voltage regulator capacitor is used to stabilize the first voltage signal.

4. The power chip as described in any one of claims 1 to 3, characterized in that, The power chip also includes a first output voltage regulator capacitor, one end of which is connected to the output terminal of the first isolated power supply secondary module, and the other end of which is grounded; the first output voltage regulator capacitor is used to stabilize the voltage signal output by the first isolated power supply secondary module.

5. The power chip as described in any one of claims 1 to 4, characterized in that, The primary-side module of the isolated power supply includes an isolated DC-DC circuit and a second drive circuit. The isolated DC-DC circuit is used to convert the first voltage signal into a second voltage signal and input the second voltage signal to the transformer. The transformer is used to couple the second voltage signal into a third voltage signal and input the third voltage signal to the secondary side module of the first isolated power supply; the secondary side power supply of the first isolated power supply is used to convert the third voltage signal into a first output voltage signal, and the isolator is used to input the first output voltage signal to the isolated DC-DC circuit; the second drive circuit is used to output a second drive signal to the isolated DC-DC circuit based on the voltage signal output by the isolator.

6. The power chip as described in claim 5, characterized in that, The power chip further includes a fourth sub-chip located on the packaging substrate, and the isolated power module further includes a second isolated power secondary module located within the fourth sub-chip; the transformer is also used to couple the second voltage signal into a fourth voltage signal and input the fourth voltage signal to the second isolated power secondary module; the second isolated power secondary module is used to convert the fourth voltage signal into a second output voltage signal.

7. The power chip as described in claim 6, characterized in that, The power chip also includes a second output voltage regulator capacitor. One end of the second output voltage regulator capacitor is connected to the output terminal of the second isolation power supply secondary module, and the other end of the second output voltage regulator capacitor is grounded. The second output voltage regulator capacitor is used to stabilize the second output voltage signal.

8. The power chip as described in claim 5 or 6, characterized in that, The first sub-chip and the second sub-chip are arranged side by side on one side of the transformer, and the fourth sub-chip is located on the side of the transformer away from the second sub-chip; or, The first sub-chip and the fourth sub-chip are arranged side by side on one side of the transformer, and the second sub-chip and the third sub-chip are arranged side by side on the side of the transformer away from the first sub-chip.

9. The power chip as described in any one of claims 5 to 8, characterized in that, The isolated DC-DC circuit is a full-bridge circuit or a full-bridge LLC circuit.

10. The power chip according to any one of claims 1 to 9, characterized in that, The first sub-chip is electrically connected to the circuit of the packaging substrate via bonding wires or pins; and / or, the first sub-chip is electrically connected to the third sub-chip via bonding wires or pins.

11. The power chip according to any one of claims 1 to 10, characterized in that, The power chip also includes an input voltage regulator capacitor, one end of which is connected to the input terminal of the non-isolated power module, and the other end of which is grounded; the input voltage regulator capacitor is used to stabilize the input voltage signal.

12. A power conversion device, characterized in that, The device includes a circuit board, a power device, and a power chip as described in any one of claims 1 to 11, wherein the power device and the power chip are disposed on the circuit board, and the power chip is used to supply power to the power device.

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